Rotary table structure and visual inspection method for avoiding scratches on silicon wafer

Abstract

This invention discloses a rotating stage structure and visual inspection method for avoiding manual inspection of scratched silicon wafers. The structure includes a support stage and a silicon wafer. A rotating rod is located at the top of the support stage, passing through and rotatably connected to it. A support member is movably connected to the top of the support stage. A fixing ring is located on the outer side of the rotating rod. An adsorption member for adsorbing the silicon wafer is located at the top of the fixing ring. A rotating disk is located at the bottom of the fixing ring. A transmission plate drives the rotating ring to rotate via multiple fixedly connected springs, allowing personnel to rotate and observe the silicon wafer. A support plate is fixedly connected to the bottom of the rotating ring. A rotating wheel rotatably connected to the bottom of the support plate contacts an arc-shaped protrusion at the top of the support stage, causing one side of the rotating ring to rise and fall, causing the silicon wafer to oscillate around the suction cup. This changes the observation angle, increases the observation range of manual visual inspection, and avoids missed inspections.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer inspection, and in particular to a rotary table structure and visual inspection method for avoiding manual inspection that may scratch silicon wafers. Background Technology

[0002] The product has some defects left in the previous processing stage, mainly mechanical scratches, chemical contamination, stains that have not been cleaned, color difference, chipping and cracks. These defects need to be found and picked out by manual visual inspection to prevent them from flowing out. During the manual visual inspection, it is necessary to inspect from multiple angles under fixed lighting. Using only a vacuum pen will cause the personnel to hold it for too long, resulting in bumps and scratches, vacuum pressure fluctuations, resulting in chipping and breakage, and improper inspection gestures by personnel, leading to missed abnormalities. At this time, a reliable carrier is needed to store the product to avoid the above situations.

[0003] Therefore, Chinese invention patent CN202122397169.3 discloses a rotating stage for visual inspection of silicon wafers, including a base and a support stage mounted on the base. The support stage is rotatable relative to the base. At least three fixtures for supporting silicon wafers are evenly distributed on the support stage. Each fixture includes a support frame perpendicular to the support stage, and multiple layers of support segments for supporting silicon wafers are spaced apart along its extension direction on the support frame. This invention can inspect defects on the top surface of the silicon wafer edge, allowing defects at all 360° positions of the silicon wafer to be inspected.

[0004] The above method involves observing and inspecting the silicon wafer by rotating the stage, with manual scanning and observation in conjunction with the wafer's rotation. However, the wafer's rotation is only planar, resulting in minimal angular changes during observation under fixed lighting, which can easily lead to omissions. Furthermore, the wafer is rotated using clamping devices, which can cause the contact point between the clamping devices and the wafer to be overlooked during inspection, resulting in further omissions.

[0005] Therefore, it is necessary to provide a rotary table structure and visual inspection method to avoid scratching silicon wafers during manual inspection and solve the above-mentioned technical problems. Summary of the Invention

[0006] The purpose of this invention is to provide a rotary table structure and visual inspection method for avoiding manual inspection of scratched silicon wafers. This addresses the issues in the prior art where silicon wafers are observed and inspected by rotating the stage, requiring manual scanning and observation in conjunction with wafer rotation. However, the rotation of the silicon wafer is only planar, resulting in minimal angular changes during observation under fixed lighting, which can easily lead to omissions. Furthermore, when the silicon wafer rotates, it is rotated by a clamping device, causing the contact position between the clamping device and the silicon wafer to be overlooked during inspection, resulting in omissions.

[0007] Based on the above ideas, the present invention provides the following technical solution: a rotary table structure to avoid manual inspection of scratched silicon wafers, including a support table and a silicon wafer. The top of the support table is provided with a rotating rod, which passes through the support table and is rotatably connected to it. A support member is movably connected to the top of the support table. A fixing ring is provided on the outside of the rotating rod. An adsorption member for adsorbing the silicon wafer is provided on the top of the fixing ring. A rotating disk is provided at the bottom of the fixing ring. A first connecting ring is connected to the outside of the rotating rod through a one-way damping bearing. The first connecting ring is fixedly connected to the rotating disk. An adjustment member for raising and lowering the fixing ring is provided on the top of the rotating disk.

[0008] The support platform has a rotating ring at its top. Multiple clamping elements for holding the silicon wafer are arranged in a ring around the top of the rotating ring. Each clamping element has a transmission plate. A second connecting ring is connected to the outer side of the rotating rod via a one-way damping bearing. The second connecting ring is fixedly connected to the transmission plate. Multiple springs are fixedly connected between the transmission plate and the rotating ring. A contact element is provided between the clamping element and the support platform. When the transmission plate drives the rotating ring to rotate via the springs, it contacts the top of the support platform through the contact element, causing the rotating ring to change angle around the support element.

[0009] As a further aspect of the present invention: the support member includes a suction cup disposed on the top of the support member, a movable ball fixedly connected to the bottom of the suction cup, a groove being provided on the top of the rotating rod, and the movable ball being partially disposed inside the groove provided on the top of the rotating rod.

[0010] As a further aspect of the present invention: the adjusting component includes a plurality of first threaded rods fixedly connected to the bottom of the fixed ring, each of the plurality of first threaded rods being threadedly connected to a first threaded cylinder on its outer side, each of the plurality of first threaded cylinders being rotatably connected to a rotating disk, a second gear being fixedly connected to the outer side of the first threaded cylinder, and an internal gear ring being rotatably connected to the top of the rotating disk, the internal gear ring being meshed with the plurality of second gears.

[0011] As a further aspect of the present invention: a first gear is rotatably connected to the top of the rotating disk, and a first motor is installed at the bottom of the rotating disk, with the output shaft of the first motor fixedly connected to the first gear.

[0012] As a further aspect of the present invention: the adsorption component includes a plurality of negative pressure suction cups fixedly connected to the top of the fixing ring, and a plurality of vacuum pumps are fixedly connected to the outside of the fixing ring, with the suction ends of the plurality of vacuum pumps respectively fixedly connected to the plurality of negative pressure suction cups.

[0013] As a further embodiment of the present invention: the clamping member includes a fixing plate fixedly connected to the top of the rotating ring, a second threaded cylinder rotatably connected inside the fixing plate, a second threaded rod threadedly connected inside the second threaded cylinder, a telescopic rod fixedly connected between the second threaded rod and the fixing plate, a bevel gear fixedly connected to the end of the second threaded cylinder away from the second threaded rod, a bevel gear disk rotatably connected to the outside of the rotating ring, and multiple bevel gears meshing with the bevel gear disk.

[0014] As a further aspect of the present invention: the clamping member further includes a placement plate fixedly connected to the L-shaped fixing plate, and a contact roller is rotatably connected to the top of the L-shaped fixing plate.

[0015] As a further aspect of the present invention: the contact element includes a support plate fixedly connected to the bottom of the rotating ring, a rotating wheel rotatably connected to the bottom of the support plate, and a plurality of arc-shaped protrusions fixedly connected to the top of the support platform.

[0016] As a further aspect of the present invention: a second motor is fixedly connected to the bottom of the support platform, and the output shaft of the second motor is fixedly connected to the rotating rod.

[0017] A method for visually inspecting silicon wafers includes the following steps:

[0018] S1. The silicon wafer is placed on the top of the suction cup using a vacuum suction pen, so that the bottom edge of the silicon wafer is placed on the placement plate. By rotating the bevel gear disk, multiple bevel gears are driven to rotate, which in turn pushes the contact roller to contact the edge of the silicon wafer through the second threaded rod.

[0019] S2. Then, by starting the second motor, the second motor drives the rotating rod to rotate in the forward direction, which in turn drives the transmission plate to rotate through the second connecting ring. This causes multiple springs to pull the rotating ring to rotate, and the rotating wheel contacts the arc-shaped protrusion, causing one side of the rotating ring to rise, thereby changing the angle of observation of the silicon wafer.

[0020] S3. Finally, by activating the adjustment mechanism, the adsorption component is made to adsorb onto the bottom of the silicon wafer. At this time, the clamping component is released from the silicon wafer. Then, the rotating rod is rotated in the opposite direction, causing the fixed ring adsorption component to drive the silicon wafer to rotate. Personnel can then observe the edge of the silicon wafer.

[0021] Compared with the prior art, the beneficial effects of the present invention are:

[0022] 1. By starting the second motor, the output shaft of the second motor drives the rotating rod to rotate forward. At this time, the second connecting ring drives the transmission plate to rotate under the action of the one-way damping bearing. The transmission plate drives the rotating ring to rotate through multiple fixedly connected springs, so that the personnel can rotate and observe the silicon wafer. A support plate is fixedly connected to the bottom of the rotating ring. The rotating wheel connected to the bottom of the support plate contacts the arc-shaped protrusion on the top of the support platform, thereby raising one side of the rotating ring, achieving a rise and fall change, causing the silicon wafer to fluctuate around the suction cup, thereby changing the observation angle, improving the observation range of manual visual inspection, and avoiding missed inspections.

[0023] 2. By starting the vacuum pump, a negative pressure is generated in the suction cup to adsorb and fix the silicon wafer. Then, by rotating the bevel gear disk, the contact roller in the clamping device releases the clamping contact with the silicon wafer. Then, by starting the second motor, the second motor drives the rotating rod to rotate in the opposite direction. Since the second connecting ring and the rotating rod do not rotate due to the action of the one-way damping bearing, the one-way bearing between the first connecting ring and the rotating rod generates a damping effect, which in turn drives the rotating disk to rotate. The rotating disk drives the fixing ring to rotate through the first threaded cylinder and the first threaded rod, which in turn causes the silicon wafer on the fixing ring to rotate. Visual inspectors can visually inspect the edges of the silicon wafer to avoid blind spots during clamping. Attached Figure Description

[0024] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0025] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0026] Figure 2 This is a schematic diagram of the fixing ring structure of the present invention;

[0027] Figure 3 This is a schematic diagram of the adjusting component structure of the present invention;

[0028] Figure 4 This is a schematic diagram of the contact structure of the present invention;

[0029] Figure 5 This is a schematic diagram of the clamping component of the present invention;

[0030] Figure 6 This is the present invention. Figure 4 A magnified structural diagram at point A.

[0031] In the diagram: 1. Support platform; 2. Rotating rod; 3. Support component; 301. Suction cup; 302. Movable ball; 4. Fixed ring; 401. Negative pressure suction cup; 402. Vacuum pump; 5. Rotating disk; 501. Internal gear ring; 502. First threaded cylinder; 503. First threaded rod; 504. First connecting ring; 505. First gear; 506. Second gear; 6. Rotating ring; 7. Clamping component; 701. Bevel gear; 702. Fixed plate; 703. Telescopic rod; 704. L-shaped fixed plate; 705. Contact roller; 706. Placement plate; 708. Second threaded cylinder; 709. Second threaded rod; 8. Transmission plate; 801. Second connecting ring; 802. Spring; 803. Support plate; 804. Rotating wheel; 805. Arc-shaped protrusion; 9. Bevel gear disk; 10. Silicon wafer. Detailed Implementation

[0032] like Figures 1 to 6 As shown, the rotary table structure for avoiding scratches on silicon wafers during manual inspection includes the following embodiments:

[0033] Example 1: A rotating stage structure to avoid manual inspection of scratched silicon wafers includes a support platform 1 and a silicon wafer 10. The top of the support platform 1 is provided with a rotating rod 2, which passes through the support platform 1 and is rotatably connected to it. The top of the support platform 1 is movably connected to a support member 3, which includes a suction cup 301 set on the top of the support member 3. A movable ball 302 is fixedly connected to the bottom of the suction cup 301. The top of the rotating rod 2 is provided with a groove, and the movable ball 302 is partially set inside the groove on the top of the rotating rod 2. In actual use, the operator uses a vacuum suction pen to place the silicon wafer 10 on the suction cup 301 at the top of the rotating rod 2. The suction cup 301 adsorbs the bottom of the silicon wafer 10, and the silicon wafer 10 is observed by illuminating it with a fixed lamp.

[0034] In practical applications, silicon wafer 10 is often placed on a platform and observed by rotation. Manual visual inspection requires examination at multiple angles under fixed lighting, involving both manual scanning and observation in conjunction with wafer 10 rotation. However, the wafer rotation is only planar, resulting in minimal angular changes during observation under fixed lighting, making it prone to omissions. Therefore, this solution employs a rotating ring 6 at the top of the support platform 1, with multiple rings arranged around the top of the rotating ring 6 around the silicon wafer 10. The clamping member 7 is used to hold the silicon wafer 10. The clamping member 7 is equipped with a transmission plate 8. The outer side of the rotating rod 2 is connected to a second connecting ring 801 through a one-way damping bearing. The second connecting ring 801 is fixedly connected to the transmission plate 8. Multiple springs 802 are fixedly connected between the transmission plate 8 and the rotating ring 6. A contact member is provided between the clamping member 7 and the support platform 1. When the transmission plate 8 drives the rotating ring 6 to rotate through the springs 802, it contacts the top of the support platform 1 through the contact member, so that the rotating ring 6 changes angle around the support member 3.

[0035] Please refer to Figure 1 - Figure 6 As shown, the clamping member 7 includes a fixed plate 702 fixedly connected to the top of the rotating ring 6. A second threaded cylinder 708 is rotatably connected inside the fixed plate 702. A second threaded rod 709 is threadedly connected inside the second threaded cylinder 708. A telescopic rod 703 is fixedly connected between the second threaded rod 709 and the fixed plate 702. A bevel gear 701 is fixedly connected to the end of the second threaded cylinder 708 away from the second threaded rod 709. A bevel gear disk 9 is rotatably connected to the outside of the rotating ring 6. Multiple bevel gears 701 are meshed with the bevel gear disk 9.

[0036] The clamping member 7 also includes a placement plate 706 fixedly connected to the L-shaped fixing plate 704, and a contact roller 705 is rotatably connected to the top of the L-shaped fixing plate 704.

[0037] The contact element includes a support plate 803 fixedly connected to the bottom of the rotating ring 6, a rotating wheel 804 rotatably connected to the bottom of the support plate 803, and multiple arc-shaped protrusions 805 fixedly connected to the top of the support platform 1.

[0038] A second motor is fixedly connected to the bottom of the support platform 1, and the output shaft of the second motor is fixedly connected to the rotating rod 2.

[0039] In specific implementation, when the silicon wafer 10 is placed on top of the suction cup 301 and its edge rests on the placement plate 706, rotating the bevel gear disk 9 causes multiple meshing bevel gears 701 to rotate. The bevel gears 701 drive the fixedly connected second threaded cylinder 708 to rotate. The second threaded rod 709 is threadedly connected to the second threaded cylinder 708 and fixedly connected to the L-shaped fixing plate 704. Under the rotation limit of the telescopic rod 703, the second threaded rod 709 pushes the L-shaped fixing plate 704 to move, and then the contact roller 705 rotatably connected on the L-shaped fixing plate 704 contacts the edge of the silicon wafer 10, thereby fixing and clamping the silicon wafer 10. At this time, the second threaded rod 709 is then activated. The output shaft of the second motor drives the rotating rod 2 to rotate forward. At this time, the second connecting ring 801 drives the transmission plate 8 to rotate under the action of the one-way damping bearing. The transmission plate 8 drives the rotating ring 6 to rotate through multiple fixedly connected springs 802, so that the personnel can rotate and observe the silicon wafer 10. A support plate 803 is fixedly connected to the bottom of the rotating ring 6. The rotating wheel 804 connected to the bottom of the support plate 803 contacts the arc-shaped protrusion 805 on the top of the support platform 1, thereby raising one side of the rotating ring 6 to achieve a change of rising and falling, so that the silicon wafer 10 fluctuates around the suction cup 301, thereby changing the observation angle, improving the observation range of manual visual inspection, and avoiding missed inspections.

[0040] Example 2: The difference from Example 1 is that: a fixing ring 4 is provided on the outside of the rotating rod 2, an adsorption element for adsorbing the silicon wafer 10 is provided on the top of the fixing ring 4, a rotating disk 5 is provided at the bottom of the fixing ring 4, a first connecting ring 504 is connected to the outside of the rotating rod 2 through a one-way damping bearing, the first connecting ring 504 is fixedly connected to the rotating disk 5, and an adjustment element for raising and lowering the fixing ring 4 is provided on the top of the rotating disk 5.

[0041] Please refer to Figure 1 - Figure 3 The adjusting component includes multiple first threaded rods 503 fixedly connected to the bottom of the fixed ring 4. Each of the multiple first threaded rods 503 is threadedly connected to a first threaded cylinder 502. Each of the multiple first threaded cylinders 502 is rotatably connected to the rotating disk 5. A second gear 506 is fixedly connected to the outside of the first threaded cylinder 502. An internal gear ring 501 is rotatably connected to the top of the rotating disk 5. The internal gear ring 501 meshes with the multiple second gears 506.

[0042] The top of the rotating disk 5 is rotatably connected to the first gear 505, and the bottom of the rotating disk 5 is equipped with the first motor, the output shaft of the first motor being fixedly connected to the first gear 505.

[0043] The adsorption component includes multiple negative pressure suction cups 401 fixedly connected to the top of the fixing ring 4. Multiple vacuum pumps 402 are fixedly connected to the outside of the fixing ring 4, and the suction ends of the multiple vacuum pumps 402 are respectively fixedly connected to the multiple negative pressure suction cups 401.

[0044] In practical use: After performing multi-angle visual inspection of the silicon wafer 10 using the method described in Example 1, there are blind spots in the clamping position of the silicon wafer 10, which are often easily overlooked during the inspection process. After the multi-angle inspection of the silicon wafer 10 is completed, the first motor is started. The output shaft of the first motor drives the first gear 505 to rotate. The first gear 505 drives the meshing internal gear ring 501 to rotate. The internal gear ring 501 drives multiple second gears 506 to rotate. When the second gears 506 rotate, they drive the connected first threaded rod 503 to rotate. Since the first threaded rod 503 is fixedly connected to the fixing ring 4, it pushes the fixing ring 4 to rise, causing the multiple negative pressure suction cups 401 set on the top of the fixing ring 4 to contact the bottom of the silicon wafer 10. Then, the vacuum pump 402 is started. The negative pressure suction cup 401 generates negative pressure to adsorb and fix the silicon wafer 10. Then, by rotating the bevel gear disk 9, the contact roller 705 in the clamping member 7 releases the clamping contact of the silicon wafer 10. Then, by starting the second motor, the second motor drives the rotating rod 2 to rotate in the opposite direction. Since the second connecting ring 801 and the rotating rod 2 will not rotate due to the action of the one-way damping bearing, the one-way bearing between the first connecting ring 504 and the rotating rod 2 will generate a damping effect. Then, the rotating rod 2 drives the rotating disk 5 to rotate. The rotating disk 5 drives the fixing ring 4 to rotate through the first threaded cylinder 502 and the first threaded rod 503. This causes the silicon wafer 10 on the fixing ring 4 to rotate. The inspector can visually inspect the edge of the silicon wafer 10 to avoid blind spots during clamping.

[0045] A method for visually inspecting silicon wafers includes the following steps:

[0046] S1. The silicon wafer 10 is placed on the top of the suction cup 301 by a vacuum suction pen, so that the bottom edge of the silicon wafer is placed on the placement plate 706. By rotating the bevel gear disk 9, multiple bevel gears 701 are driven to rotate, and then the contact roller 705 is pushed to contact the edge of the silicon wafer 10 through the second threaded rod 709.

[0047] S2. Then, by starting the second motor, the second motor drives the rotating rod 2 to rotate in the forward direction. The second connecting ring 801 drives the transmission plate 8 to rotate, causing multiple springs 802 to pull the rotating ring 6 to rotate. The rotating wheel 804 contacts the arc-shaped protrusion 805, causing one side of the rotating ring 6 to rise, thereby changing the angle of the observed silicon wafer 10.

[0048] S3. Finally, by starting the adjustment component, the adsorption component is made to adsorb onto the bottom of the silicon wafer 10. At this time, the clamping component 7 is released from the silicon wafer 10. Then, the rotating rod 2 is rotated in the opposite direction, so that the fixed ring 4 adsorption component drives the silicon wafer 10 to rotate. Personnel can then observe the edge of the silicon wafer 10.

Claims

1. A visual inspection method that avoids manually inspecting scratched silicon wafers, characterized by: Using a rotary table structure, the rotary table structure including a support stage (1) and a silicon wafer (10), the following steps are included: S1. The silicon wafer (10) is placed on the top of the suction cup (301) by a vacuum suction pen, so that the bottom edge of the silicon wafer is placed on the placement plate (706). By rotating the bevel gear disk (9), multiple bevel gears (701) are driven to rotate, and then the contact roller (705) is pushed to contact the edge of the silicon wafer (10) through the second threaded rod (709). S2. Then, by starting the second motor, the second motor drives the rotating rod (2) to rotate in the forward direction. The second connecting ring (801) drives the transmission plate (8) to rotate, so that multiple springs (802) pull the rotating ring (6) to rotate. The rotating wheel (804) contacts the arc-shaped protrusion (805), so that one side of the rotating ring (6) is raised, thereby changing the angle of observation of the silicon wafer (10). S3. Finally, by starting the adjustment component, the adsorption component is adsorbed onto the bottom of the silicon wafer (10). At this time, the clamping component (7) is released from the silicon wafer (10). Then, the rotating rod (2) is rotated in the opposite direction, so that the fixed ring (4) adsorption component drives the silicon wafer (10) to rotate. Personnel observe the edge of the silicon wafer (10). The top of the support platform (1) is provided with a rotating rod (2), which passes through the support platform (1) and is rotatably connected to the support platform (1). The top of the support platform (1) is movably connected with a support member (3). A fixing ring (4) is provided on the outside of the rotating rod (2). The top of the fixing ring (4) is provided with an adsorption member for adsorbing the silicon wafer (10). A rotating disk (5) is provided at the bottom of the fixing ring (4). The outside of the rotating rod (2) is connected to a first connecting ring (504) through a one-way damping bearing. The first connecting ring (504) is fixedly connected to the rotating disk (5). The top of the rotating disk (5) is provided with an adjustment member for raising and lowering the fixing ring (4). The top of the support platform (1) is provided with a rotating ring (6). The top of the rotating ring (6) is provided with a plurality of clamping members (7) for clamping the silicon wafer (10) around the silicon wafer (10). The clamping member (7) is provided with a transmission plate (8). The outer side of the rotating rod (2) is connected to a second connecting ring (801) through a one-way damping bearing. The second connecting ring (801) is fixedly connected to the transmission plate (8). A plurality of springs (802) are fixedly connected between the transmission plate (8) and the rotating ring (6). A contact member is provided between the clamping member (7) and the support platform (1). When the transmission plate (8) drives the rotating ring (6) to rotate through the springs (802), it contacts the top of the support platform (1) through the contact member, so that the rotating ring (6) changes angle around the support member (3).

2. The visual inspection method for avoiding manual inspection scratches on silicon wafers according to claim 1, characterized in that: The support member (3) includes a suction cup (301) disposed on the top of the support member (3), a movable ball (302) is fixedly connected to the bottom of the suction cup (301), and a groove is provided on the top of the rotating rod (2), and the movable ball (302) is partially disposed inside the groove on the top of the rotating rod (2).

3. The visual inspection method for avoiding manual inspection scratches on silicon wafers according to claim 1, characterized in that: The adjusting component includes multiple first threaded rods (503) fixedly connected to the bottom of the fixed ring (4), each of the multiple first threaded rods (503) being threadedly connected to a first threaded cylinder (502), each of the multiple first threaded cylinders (502) being rotatably connected to the rotating disk (5), each of the first threaded cylinders (502) being fixedly connected to a second gear (506), and each of the rotating disks (5) being rotatably connected to an internal gear ring (501), the internal gear ring (501) being meshed with the multiple second gears (506).

4. The visual inspection method for avoiding manual inspection scratches on silicon wafers according to claim 3, characterized in that: The top of the rotating disk (5) is rotatably connected to a first gear (505), and the bottom of the rotating disk (5) is equipped with a first motor, the output shaft of the first motor being fixedly connected to the first gear (505).

5. The visual inspection method for avoiding manual inspection scratches on silicon wafers according to claim 1, characterized in that: The adsorption component includes multiple negative pressure suction cups (401) fixedly connected to the top of the fixing ring (4). Multiple vacuum pumps (402) are fixedly connected to the outside of the fixing ring (4). The suction ends of the multiple vacuum pumps (402) are respectively fixedly connected to the multiple negative pressure suction cups (401).

6. The visual inspection method for avoiding manual inspection scratches on silicon wafers according to claim 1, characterized in that: The clamping member (7) includes a fixing plate (702) fixedly connected to the top of the rotating ring (6). A second threaded cylinder (708) is rotatably connected inside the fixing plate (702). A second threaded rod (709) is threadedly connected inside the second threaded cylinder (708). A telescopic rod (703) is fixedly connected between the second threaded rod (709) and the fixing plate (702). A bevel gear (701) is fixedly connected to the end of the second threaded cylinder (708) away from the second threaded rod (709). A bevel gear disk (9) is rotatably connected to the outside of the rotating ring (6). Multiple bevel gears (701) are meshed with the bevel gear disk (9).

7. The visual inspection method for avoiding manual inspection of scratched silicon wafers according to claim 6, characterized in that: The clamping member (7) also includes a placement plate (706) fixedly connected to the L-shaped fixing plate (704), and a contact roller (705) is rotatably connected to the top of the L-shaped fixing plate (704).

8. The visual inspection method for avoiding manual inspection scratches on silicon wafers according to claim 1, characterized in that: The contact element includes a support plate (803) fixedly connected to the bottom of the rotating ring (6), a rotating wheel (804) rotatably connected to the bottom of the support plate (803), and a plurality of arc-shaped protrusions (805) fixedly connected to the top of the support platform (1).

9. The visual inspection method for avoiding manual inspection scratches on silicon wafers according to claim 1, characterized in that: The support platform (1) is fixedly connected to a second motor at its bottom, and the output shaft of the second motor is fixedly connected to the rotating rod (2).

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