Wafer automatic scanning and cutting apparatus

Abstract

The application relates to the technical field of semiconductor substrate material manufacturing, and particularly discloses a wafer automatic scanning and cutting device which comprises a workbench, a rotating disc mechanism, a moving positioning mechanism and a material taking mechanism, the workbench is provided with a rotating disc mounting groove, the rotating disc mechanism is mounted in the rotating disc mounting groove, the rotating disc mechanism comprises a rotating disc motor and a rotating disc body connected with an output shaft of the rotating disc motor, the upper surface of the rotating disc body is provided with at least two suction disc mounting grooves, each suction disc mounting groove is provided with a suction disc assembly for fixing a wafer to be cut, the moving positioning mechanism comprises a positioning support assembly, a diamond cutting head and a laser scanning assembly, the positioning support assembly is movably arranged on the workbench, and the diamond cutting head and the laser scanning assembly are movably arranged on the positioning support assembly, and the material taking mechanism is mounted on the workbench and used for grabbing the cut wafer. The wafer cutting efficiency is improved, and the labor intensity of workers is reduced.

Description

Technical Field

[0001] This invention relates to the field of semiconductor substrate material manufacturing technology, and in particular to an automated wafer scanning and dicing device. Background Technology

[0002] Indium phosphide (IP) substrates (wafers) have applications in the manufacture of high-frequency, high-power devices, fiber optic communications, wireless transmission, radio astronomy, and other radio frequency (RF) devices. RF devices manufactured using IPP substrates have demonstrated excellent performance in applications such as satellites and radar. They are highly competitive in the RF front-end of radar and communication systems and in analog / mixed-signal wide-bandwidth circuits, making them suitable for applications such as high-speed data processing and high-precision wide-bandwidth A / D conversion. Furthermore, IPP-based RF devices, such as low-noise amplifiers, modules, and receivers, are widely used in satellite communications, millimeter-wave radar, and active and passive millimeter-wave imaging equipment. At bandwidth levels above 100 GHz, IPP-based RF devices have significant advantages in backhaul networks and point-to-point communication networks for wireless transmission. In the future, IPP substrates are expected to become the mainstream substrate material for RF devices in 6G and even 7G wireless transmission networks. However, the dicing process is time-consuming and labor-intensive.

[0003] In existing technologies, indium phosphide substrates are manually cut into circles. Employees first use a diamond cutter to bend the irregular wafers into squares, then use the diamond cutter to straighten the edges of each wafer along the joint surface (forming an octagon) and place it in a chuck for cutting into circles before proceeding to the next wafer. This manual operation is difficult, labor-intensive, and inefficient, failing to meet the demands for high efficiency. Summary of the Invention

[0004] The technical problem to be solved by this invention is: how to improve the efficiency of wafer cutting and reduce the labor intensity of workers.

[0005] To address the aforementioned technical problems, the present invention provides an automated wafer scanning and dicing device, comprising:

[0006] The workbench is provided with a turntable mounting slot;

[0007] A turntable mechanism is installed in the turntable mounting slot. The turntable mechanism includes a turntable motor and a turntable body connected to the output shaft of the turntable motor. At least two suction cup mounting slots are provided on the upper surface of the turntable body. Each suction cup mounting slot is provided with a suction cup assembly for fixing the wafer to be cut.

[0008] A mobile positioning mechanism, comprising a positioning support assembly, a diamond cutting head, and a laser scanning assembly, wherein the positioning support assembly is movably mounted on the worktable, and the diamond cutting head and the laser scanning assembly are respectively movably mounted on the positioning support assembly; and

[0009] A material handling mechanism is installed on the worktable and is used to pick up the cut wafers.

[0010] More preferably, the suction cup assembly includes a first suction cup for adsorbing and fixing the wafer to be cut and a suction cup rotation motor for driving the first suction cup to rotate, wherein the suction cup rotation motor and the first suction cup are both disposed in the suction cup mounting slot.

[0011] More preferably, the suction cup assembly further includes:

[0012] A vacuum source, wherein the vacuum source is disposed within the worktable;

[0013] A vacuum integrated tube, wherein the vacuum integrated tube is disposed inside the turntable body, and one end of the vacuum integrated tube is connected to the vacuum source; and

[0014] A vacuum branch pipe is disposed on the first suction cup, and the vacuum branch pipe is rotatably connected to the vacuum integrated pipe through a rotary joint.

[0015] More preferably, the suction cup assembly further includes an outer ring and a first cylinder. The outer ring is disposed on the outer periphery of the first suction cup and is placed in the suction cup mounting groove. The first cylinder is disposed at the bottom of the outer ring and can drive the outer ring to achieve lifting and lowering.

[0016] More preferably, the height of the plane containing the upper surface of the turntable body is greater than the height of the plane containing the upper surface of the worktable, and the height of the plane containing the upper surface of the outer ring is equal to or lower than the height of the plane containing the upper surface of the first suction cup.

[0017] More preferably, the positioning bracket assembly includes:

[0018] The workbench has two uprights, each located on one side of the worktable. The worktable has a first sliding groove, and the bottom of each upright has a limiting slider that mates with the first sliding groove.

[0019] A horizontal frame is provided between two vertical frames. A second sliding groove is provided on the vertical frames. The end of the horizontal frame is slidably disposed in the second sliding groove. A third sliding groove and a fourth sliding groove are provided on the horizontal frame. The diamond cutting head is slidably disposed in the third sliding groove, and the laser scanning assembly is slidably disposed in the fourth sliding groove.

[0020] More preferably, the positioning bracket assembly further includes a first linear screw motor, a second linear screw motor, and a third linear screw motor. The first linear screw motor is disposed inside the worktable corresponding to the first slide groove. The limiting slider is controlled by the first linear screw motor. The second linear screw motor is disposed on the top of the upright frame. The cross frame is controlled by the second linear screw motor to achieve lifting. There are two sets of third linear screw motors, which are disposed inside the cross frame corresponding to the third slide groove and the fourth slide groove, respectively. The diamond cutting head and the laser scanning assembly are independently controlled by the two sets of third linear screw motors.

[0021] More preferably, the material handling mechanism includes a mounting base on the workbench, a bending support arm rotatably mounted on the mounting base, a support arm rotation motor for driving the bending support arm to rotate at the bottom of the mounting base, a second suction cup for adsorbing the cut material at one end of the bending support arm away from the mounting base, the second suction cup being connected to the vacuum source, and a detection sensor being provided on the lower surface of the second suction cup.

[0022] More preferably, the end of the bending support arm away from the mounting base is further provided with a second cylinder, and the second suction cup is mounted on the piston end of the second cylinder.

[0023] More preferably, the material handling mechanism further includes:

[0024] The third cylinder is disposed on the outer wall of the second cylinder;

[0025] A telescopic arm, wherein the telescopic arm is disposed at the piston end of the third cylinder, and a fourth cylinder is disposed at the end of the telescopic arm away from the third cylinder; and

[0026] A clamping block, which is crescent-shaped, is mounted on the piston end of the fourth cylinder.

[0027] The advantages of the automatic wafer scanning and cutting equipment provided by this invention compared with the prior art are as follows:

[0028] This invention facilitates the installation of the turntable mechanism by providing a turntable mounting slot on the worktable. Since the turntable body is equipped with multiple suction cup components, when the turntable motor drives the turntable body to rotate within the mounting slot, the suction cup components can adsorb and transfer the marked irregular wafers to the cutting area. The wafer is then scanned across its entire surface by a laser scanning component. After scanning, the required wafer position and diameter are confirmed. The positioning bracket component drives the diamond cutting head to the corresponding cutting position, and the diamond cutting head descends to contact the wafer. The suction cup components rotate the wafer to facilitate rounding. After rounding, the material handling mechanism picks up the cut wafer. This invention, by modifying manual rounding, integrates automatic positioning and rounding, and automatic material handling, significantly improving wafer rounding efficiency and reducing worker workload. Attached Figure Description

[0029] Figure 1 This is a perspective view of an automatic wafer scanning and cutting device according to the present invention.

[0030] Figure 2 This is a top view of an automated wafer scanning and cutting device according to the present invention.

[0031] Figure 3 This is a schematic diagram of the turntable mechanism described in this invention.

[0032] Figure 4 This is a schematic diagram of the suction cup assembly described in this invention.

[0033] Figure 5 This is an exploded view of the suction cup assembly described in this invention.

[0034] Figure 6 This is the present invention. Figure 4 A sectional view of section AA in the middle.

[0035] Figure 7 This is a schematic diagram of the mobile positioning mechanism described in this invention.

[0036] Figure 8 This is a schematic diagram of the material handling mechanism described in this invention.

[0037] In the picture:

[0038] 10. Workbench; 11. Turntable mounting slot; 12. First slide rail;

[0039] 20. Turntable mechanism; 21. Turntable motor; 22. Turntable body; 221. Suction cup mounting slot; 23. Suction cup assembly; 231. First suction cup; 232. Outer ring; 233. Vacuum integrated tube; 234. Suction cup rotation motor; 235. Vacuum branch tube; 236. Rotary joint; 237. First cylinder;

[0040] 30. Moving positioning mechanism; 31. Upright frame; 32. Limiting slider; 33. Second slide rail; 34. Horizontal frame; 35. Third slide rail; 36. Fourth slide rail; 37. Second linear screw motor; 38. Diamond cutting head; 39. Laser scanning assembly;

[0041] 40. Material handling mechanism; 41. Mounting base; 42. Bending support arm; 43. Support arm rotation motor; 44. Second cylinder; 45. Second suction cup; 46. Third cylinder; 47. Telescopic arm; 48. Fourth cylinder; 49. Clamping block. Detailed Implementation

[0042] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.

[0043] In the description of this invention, it should be understood that the terms "front," "rear," "left," "right," "upper," "lower," "top," "bottom," "inner," "outer," "between," "near," "farthest," and "height" used to indicate orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0044] The terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, unless otherwise explicitly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly, for example, referring to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections via an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meaning of these terms in this invention based on the specific circumstances.

[0045] like Figures 1-2 As shown, this embodiment provides an automatic wafer scanning and cutting device, including a worktable 10, a turntable mechanism 20, a moving positioning mechanism 30, and a material handling mechanism 40. The worktable 10 has a turntable mounting slot 11, and the turntable mechanism 20 is installed in the turntable mounting slot 11 to transfer the wafer to be cut to the cutting area. The moving positioning mechanism 30 is mounted on the worktable 10 to position and cut the wafer into a circle. The material handling mechanism 40 is mounted on the worktable 10 to pick up the cut wafer. This invention significantly improves the efficiency of wafer cutting by modifying the manual rounding process and reduces the labor intensity of workers.

[0046] In the specific implementation method, please refer to Figure 3 The turntable mechanism 20 includes a turntable motor 21 and a turntable body 22 connected to the output shaft of the turntable motor 21. The turntable motor 21 drives the turntable body 22 to rotate. The upper surface of the turntable body 22 is provided with at least two suction cup mounting slots 221. Each suction cup mounting slot 221 is provided with a suction cup assembly 23 for fixing the wafer to be cut. In this way, after the suction cup assembly 23 adsorbs the marked irregular wafer, it rotates to the cutting area under the action of the turntable motor 21 to cut the wafer into a circle. In this embodiment, the setting of at least two suction cup mounting slots 221 is beneficial for the feeding device (such as a robot) to pre-feed the wafer, which can realize uninterrupted cutting operation, shorten the feeding response time, and improve the cutting efficiency.

[0047] In some implementation methods, please refer to Figure 7 To understand this, the mobile positioning mechanism 30 includes a positioning bracket assembly, a diamond cutting head 38, and a laser scanning assembly 39. The positioning bracket assembly is movably mounted on the worktable 10, and the diamond cutting head 38 and the laser scanning assembly 39 are respectively movably mounted on the positioning bracket assembly. Thus, when the wafer to be cut is transferred to the cutting area with the turntable body 22, the wafer is scanned across its entire surface by the laser scanning assembly 39. After the scan is completed and the required wafer position and diameter are confirmed, the positioning bracket assembly drives the diamond cutting head 38 to the corresponding cutting position. The diamond cutting head 38 descends and contacts the wafer, and the suction cup assembly 23 drives the wafer to rotate to achieve circular cutting.

[0048] In some implementations, such as Figures 4-6 As shown, the suction cup assembly 23 includes a first suction cup 231 for adsorbing and fixing the wafer to be cut, and a suction cup rotation motor 234 for driving the first suction cup 231 to rotate. The suction cup rotation motor 234 and the first suction cup 231 are both located in the suction cup mounting slot 221. The first suction cup 231 is used to adsorb and fix the wafer. When the diamond cutting head 38 descends and contacts the wafer, the suction cup rotation motor 234 drives the first suction cup 231 to rotate, thereby achieving circular cutting.

[0049] In the above embodiments, in order to avoid the wafer from contacting the worktable 10 during the round cutting process, the height of the plane on the upper surface of the turntable body 22 is further limited to be greater than the height of the plane on the upper surface of the worktable 10.

[0050] In some embodiments, the suction cup assembly 23 further includes a vacuum source disposed within the worktable 10, a vacuum integrated tube 233 disposed within the turntable body 22, and a vacuum branch tube 235. One end of the vacuum integrated tube 233 is connected to the vacuum source, and the vacuum branch tube 235 is disposed on the first suction cup 231. The vacuum branch tube 235 and the vacuum integrated tube 233 are rotatably connected through a rotary joint 236. Thus, when the suction cup rotation motor 234 drives the first suction cup 231 to rotate, the connection between the vacuum branch tube 235 and the vacuum integrated tube 233 is not affected, ensuring that the first suction cup 231 always has vacuum suction force to hold the wafer tightly during the round cutting process, and preventing it from falling off under the action of the diamond cutting head 38.

[0051] In some embodiments, since the diamond cutting head 38 forms a joint surface after cutting the wafer into a circle, the cut part will not fall off directly. Therefore, before the picking mechanism 40 picks up the wafer, the scrap should be broken off. For this purpose, the suction cup assembly 23 also includes an outer ring 232 and a first cylinder 237. The outer ring 232 is located on the outer periphery of the first suction cup 231 and is placed in the suction cup mounting slot 221. The first cylinder 237 is located at the bottom of the outer ring 232 and can drive the outer ring 232 to move up and down. When the diamond cutting head 38 cuts the wafer into a circle, the first cylinder 237 drives the outer ring 232 to rise, thereby applying an upward force to the corner part, causing the corner part to break at the joint surface. The middle part of the wafer is still firmly held by the first suction cup 231. After the corner part is broken off, the first cylinder 237 drives the outer ring 232 to descend and reset. At this time, the picking mechanism 40 can pick up the middle part of the wafer and transfer it to the next process.

[0052] In the above embodiments, in order to avoid the outer ring 232 affecting the accuracy and efficiency of the wafer cutting process, the height of the plane on the upper surface of the outer ring 232 is further limited to be equal to or lower than the height of the plane on the upper surface of the first suction cup 231.

[0053] In the specific implementation method, please refer to Figure 7To understand this, the positioning support assembly includes a vertical frame 31, a horizontal frame 34, a first linear screw motor, a second linear screw motor 37, and a third linear screw motor. There are two vertical frames 31, each located on one side of the worktable 12. The worktable 12 has a first sliding groove 12, and the bottom of each vertical frame 31 has a limiting slider 32 that cooperates with the first sliding groove 12. The horizontal frame 34 is positioned between the two vertical frames 31. A second sliding groove 33 is formed on each vertical frame 31, and the end of the horizontal frame 34 slides within the second sliding groove 33. The horizontal frame 34 also has a third sliding groove 35 and a fourth sliding groove 36. A diamond cutting head 38 slides within the third sliding groove 35, and a laser scanning assembly 39 slides within the fourth sliding groove 36. The first linear screw motor is located inside the worktable 10 corresponding to the first sliding groove 12. The limiting slider 32 is controlled by the first linear screw motor. The second linear screw motor 37 is located on the top of the vertical frame 31. The crossbeam 34 is controlled by the second linear screw motor 37 to achieve lifting and lowering. There are two sets of third linear screw motors, which are respectively set inside the crossbeam 34 and correspond to the third slide 35 and the fourth slide 36. The diamond cutting head 38 and the laser scanning assembly 39 are independently controlled by the two sets of third linear screw motors. In this way, the first linear screw motor can drive the upright 31 to move along the front and back directions of the worktable 10, while the second linear screw motor 37 can drive the crossbeam 34 to move along the up and down directions of the worktable 10. The third linear screw motors can respectively control the diamond cutting head 38 and the laser scanning assembly 39 to move along the left and right directions of the worktable 10. Through the coordinated control of the three directions, after the laser scanning assembly 39 finishes scanning and confirms the required wafer position and diameter, the positioning accuracy of the diamond cutting head 38 can be guaranteed, the wafer processing quality can be guaranteed, and the cutting efficiency can be improved.

[0054] In specific implementation methods, such as Figure 8 As shown, the material handling mechanism 40 includes a mounting base 41 on the worktable 10. A bending support arm 42 is rotatably mounted on the mounting base 41. A support arm rotation motor 43 is provided at the bottom of the mounting base 41 to drive the bending support arm 42 to rotate. A second suction cup 45 for adsorbing the cut wafer is provided at the end of the bending support arm 42 away from the mounting base 41. The second suction cup 45 is connected to a vacuum source. A detection sensor is provided on the lower surface of the second suction cup 45. The support arm rotation motor 43 adjusts the rotation angle of the bending support arm 42 according to the data fed back by the detection sensor, thereby ensuring that the second suction cup 45 can be completely adsorbed on the wafer surface. When the first suction cup 231 is disconnected from the vacuum source, the second suction cup 45 can adsorb the wafer and transfer it to the next process.

[0055] In the above embodiment, in order to achieve the lifting and lowering of the second suction cup 45 to achieve the adsorption of the wafer, a second cylinder 44 is provided at the end of the bent support arm 42 away from the mounting base 41. The second suction cup 45 is installed at the piston end of the second cylinder 44. The second cylinder 44 can drive the height position of the second suction cup 45. With the data fed back by the detection sensor, the contact adsorption between the second suction cup 45 and the wafer can be precisely controlled.

[0056] In some embodiments, the material handling mechanism 40 further includes two symmetrically arranged third cylinders 46, telescopic arms 47, and clamping blocks 49. The third cylinders 46 are located on the outer wall of the second cylinders 44; the telescopic arms 47 are located at the piston end of the third cylinders 46, and a fourth cylinder 48 is located at the end of the telescopic arms 47 away from the third cylinders 46; the clamping blocks 49 are installed at the piston end of the fourth cylinders 48. Thus, in this embodiment, the opening size and position of the clamping blocks 49 can be controlled by the third cylinders 46 and the fourth cylinders 48, thereby cooperating with the second suction cup 45 to synchronously grip the wafer, ensuring the integrity of the wafer during the transfer process and avoiding accidental drop and damage.

[0057] In other embodiments, in order to make the clamping block 49 fit the wafer better, the clamping block 49 is crescent-shaped and the concave surfaces of the two clamping blocks 49 are arranged opposite each other, so that the clamping block 49 can fit in close contact with the circumference of the wafer and improve the stability of clamping.

[0058] In summary, this invention provides an automatic wafer scanning and cutting device. The device features a turntable mounting slot 11 on the worktable 10, facilitating the installation of the turntable mechanism 20. Since the turntable body 22 is equipped with multiple suction cup components 23, when the turntable motor 21 drives the turntable body 22 to rotate within the turntable mounting slot 11, the suction cup components 23 can adsorb and transfer the marked irregular wafers to below the diamond cutting head 38 and the laser scanning component 39. The laser scanning component 39 begins scanning the entire wafer surface. After scanning, the required wafer position and diameter are confirmed. The positioning bracket component drives the diamond cutting head 38 to the corresponding cutting position, causing the diamond cutting head 38 to descend and contact the wafer. The suction cup components 23 rotate the wafer to facilitate rounding. After rounding, the material handling mechanism 40 picks up the cut wafer. This invention, by modifying manual rounding, integrates automatic positioning and rounding, and automatic material handling, significantly improving wafer rounding efficiency and reducing worker labor intensity.

[0059] The above description is merely a preferred embodiment of the present invention. It should be noted that those skilled in the art can make various improvements and substitutions without departing from the technical principles of the present invention, and these improvements and substitutions should also be considered within the scope of protection of the present invention. The basic principles, main features, and advantages of the present invention have been shown and described above. It is obvious to those skilled in the art that the present invention is not limited to the details of the above preferred embodiments. The embodiments should be considered exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the foregoing description. Therefore, it is intended that all changes falling within the meaning and scope of the equivalents of the claims be included within the present invention.

[0060] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in the embodiments can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An automatic wafer scanning and cutting device, characterized in that, include: The workbench is provided with a turntable mounting slot; A turntable mechanism is installed within a turntable mounting slot. The turntable mechanism includes a turntable motor and a turntable body connected to the output shaft of the turntable motor. The upper surface of the turntable body has at least two suction cup mounting slots. Each suction cup mounting slot contains a suction cup assembly for fixing a wafer to be cut. The suction cup assembly includes a first suction cup for adsorbing and fixing the wafer to be cut and a suction cup rotation motor for driving the first suction cup to rotate. Both the suction cup rotation motor and the first suction cup are located within the suction cup mounting slot. The suction cup assembly also includes a vacuum source, a vacuum integrated tube, a vacuum branch tube, an outer ring, and a first cylinder; the vacuum source is located inside the worktable; the vacuum integrated tube is located inside the turntable body, and one end of the vacuum integrated tube is connected to the vacuum source; the vacuum branch tube is located on the first suction cup, and the vacuum branch tube and the vacuum integrated tube are rotatably connected through a rotary joint; the outer ring is located on the outer periphery of the first suction cup, and the outer ring is placed in the suction cup mounting slot; the first cylinder is located at the bottom of the outer ring and can drive the outer ring to achieve lifting and lowering; A mobile positioning mechanism, comprising a positioning support assembly, a diamond cutting head, and a laser scanning assembly, wherein the positioning support assembly is movably mounted on the worktable, and the diamond cutting head and the laser scanning assembly are respectively movably mounted on the positioning support assembly; and A material handling mechanism is mounted on the worktable for gripping the cut wafers. The material handling mechanism includes a mounting base on the worktable, a bending support arm rotatably mounted on the mounting base, a support arm rotation motor for driving the bending support arm to rotate at the bottom of the mounting base, a second suction cup for adsorbing the cut wafers at the end of the bending support arm away from the mounting base, the second suction cup being connected to the vacuum source, and a detection sensor being provided on the lower surface of the second suction cup.

2. The automatic wafer scanning and cutting equipment according to claim 1, characterized in that, The height of the plane containing the upper surface of the turntable body is greater than the height of the plane containing the upper surface of the worktable, and the height of the plane containing the upper surface of the outer ring is equal to or lower than the height of the plane containing the upper surface of the first suction cup.

3. The automatic wafer scanning and cutting equipment according to claim 1, characterized in that, The positioning bracket assembly includes: The workbench has two uprights, each located on one side of the worktable. The worktable has a first sliding groove, and the bottom of each upright has a limiting slider that mates with the first sliding groove. A horizontal frame is provided between two vertical frames. A second sliding groove is provided on the vertical frames. The end of the horizontal frame is slidably disposed in the second sliding groove. A third sliding groove and a fourth sliding groove are provided on the horizontal frame. The diamond cutting head is slidably disposed in the third sliding groove, and the laser scanning assembly is slidably disposed in the fourth sliding groove.

4. The automatic wafer scanning and cutting equipment according to claim 3, characterized in that, The positioning bracket assembly further includes a first linear screw motor, a second linear screw motor, and a third linear screw motor. The first linear screw motor is located inside the worktable corresponding to the first slide groove. The limiting slider is controlled by the first linear screw motor. The second linear screw motor is located on the top of the upright frame. The cross frame is controlled by the second linear screw motor to achieve lifting. There are two sets of third linear screw motors, which are respectively located inside the cross frame corresponding to the third slide groove and the fourth slide groove. The diamond cutting head and the laser scanning assembly are independently controlled by the two sets of third linear screw motors.

5. The automatic wafer scanning and cutting equipment according to claim 1, characterized in that, The end of the bending support arm away from the mounting base is also provided with a second cylinder, and the second suction cup is installed on the piston end of the second cylinder.

6. The automatic wafer scanning and cutting equipment according to claim 5, characterized in that, The material handling mechanism also includes: The third cylinder is disposed on the outer wall of the second cylinder; A telescopic arm, wherein the telescopic arm is disposed at the piston end of the third cylinder, and a fourth cylinder is disposed at the end of the telescopic arm away from the third cylinder; and A clamping block, which is crescent-shaped, is mounted on the piston end of the fourth cylinder.

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