Semiconductor film forming apparatus

Abstract

The application relates to a semiconductor film forming device and a semiconductor production process, comprising a sputtering support shell, a sliding rod is slidably arranged in the sputtering support shell, an end of the sliding rod is fixed with a bearing assembly, a tray assembly for placing a substrate is detachably arranged on the bearing assembly, and a limiting assembly for limiting the position of the substrate is arranged on the bearing assembly. In use, the tray assembly is detachably arranged on the bearing assembly, so that the tray assembly can be removed and cleaned after each processing, the flatness of the upper surface of the tray assembly is guaranteed, the limiting assembly for limiting the position of the substrate is arranged on the bearing assembly, the film forming position of the substrate is limited by the limiting assembly, the accuracy during film forming of the substrate is guaranteed, and therefore the application can solve the phenomenon that the upper surface of the tray is not flat, and the accuracy of substrate processing is guaranteed.

Description

TECHNICAL FIELD

[0001] The present application relates to a semiconductor production process, in particular to a semiconductor film forming device. BACKGROUND

[0002] In the process of semiconductor manufacturing, film forming is a common process for forming a thin film on the surface of a semiconductor material to change its properties or protect its surface. Common semiconductor film forming methods include physical vapor deposition, which uses physical methods to deposit thin film materials in solid or gaseous form on the surface of a semiconductor, such as sputtering.

[0003] For example, in the patent document with application number 201610407581.X, a semiconductor device film forming method, an aluminum nitride film forming method, and an electronic device are disclosed, and specifically a sputtering device for film forming is disclosed, which specifically includes placing a tray with a substrate on a load base by using a mechanical arm to achieve the placement of the tray.

[0004] When the sputtering device is started, the level of the substrate is an important guarantee for controlling the uniformity of film forming. If the tray is placed on the load base by using a mechanical arm, and if there is a small amount of impurities on the load base, it will cause the tray to be placed unevenly, thereby affecting the sputtering effect of the substrate. SUMMARY

[0005] The purpose of the present application is to provide a semiconductor film forming device.

[0006] The technical problem solved by the present application is to solve the problem that the sputtering effect of the substrate is affected due to the presence of small uneven protrusions on the upper surface of the substrate during film forming in the prior art.

[0007] The present application can be achieved by the following technical scheme: a semiconductor film forming device, comprising a sputtering support shell, a sliding rod is slidably arranged inside the sputtering support shell, a load assembly is fixed at the end of the sliding rod, a tray assembly for placing a substrate is detachably arranged on the load assembly, and a limiting assembly for limiting the position of the substrate is arranged on the load assembly.

[0008] Further technical improvements of the present application are that the load assembly comprises a load substrate, a sliding support substrate for sliding connection with the tray assembly is fixed on the load substrate, and the size of the sliding support substrate is smaller than that of the load substrate.

[0009] Further technical improvements of the present application are that the tray assembly comprises a sliding bottom plate for sliding connection with the sliding support substrate, a support tray for placing the substrate is fixed on the sliding bottom plate, and a plurality of groups of hard suction cups are uniformly arranged on the support tray.

[0010] Further technical improvements of the present application are that the limiting assembly comprises a leveling support plate for limiting the substrate, the leveling support plate is installed on the connecting telescopic rod, and the connecting telescopic rod and the bearing substrate are fixedly connected.

[0011] Further technical improvements of the present application are that the leveling support plate is provided with an installation sliding groove at the bottom, and the sliding bottom plate is provided with an installation protrusion for limiting the installation sliding groove.

[0012] Further technical improvements of the present application are that the leveling support plate is provided with a horizontal measuring instrument for detecting the plane of the upper surface of the substrate.

[0013] Further technical improvements of the present application are that the leveling support plate is provided with a cleaning blow gun at the bottom, the bearing substrate is provided with a blow gun placing table for placing the cleaning blow gun, and the bottom surface of the leveling support plate is higher than the upper surface of the support tray when the leveling support plate is at the highest end.

[0014] Further technical improvements of the present application are that the sliding support substrate is provided with a sliding connection groove symmetrically at the side edge, the sliding bottom plate is fixedly provided with a sliding connection block at the bottom through a sliding connection rod, and the sliding connection block and the sliding connection groove are slidingly connected.

[0015] Compared with the prior art, the present application has the following beneficial effects:

[0016] 1、The tray assembly can be removed and cleaned after each processing by detachably installing the tray assembly on the bearing assembly, which ensures the flatness of the upper surface of the tray assembly, and the limiting assembly for limiting the position of the substrate is arranged on the bearing assembly, which limits the film forming position of the substrate by the limiting assembly and ensures the accuracy of the substrate film forming, so that the present application can solve the phenomenon that the upper surface of the tray is not stable and ensure the accuracy of the substrate processing.

[0017] 2、The bearing assembly comprises a bearing substrate and a sliding support substrate, and the tray assembly comprises a sliding bottom plate and a support tray, so that the sliding connection of the sliding support substrate and the sliding bottom plate can quickly realize the disassembly and assembly of the tray assembly, and in order to ensure the position of the tray assembly, the installation sliding groove and the installation protrusion are used to ensure the position of the tray assembly in the present application, that is, the height of the leveling support plate is controlled, so that the installation protrusion enters the inside of the installation sliding groove, thereby limiting the position of the tray assembly, avoiding the problem that the movement of the tray position causes the deviation of the substrate processing accuracy during sputtering.

[0018] 3、The application makes the cleaning blow gun exist, so that when the leveling support plate moves to the highest end, due to the bottom surface height of the leveling support plate being higher than the height of the upper surface of the support tray, a cleaning gap is formed between the leveling support plate and the support tray, so that the gas is blown to the upper surface of the support tray at a certain pressure by starting the cleaning blow gun, and the floating objects that may fall on the upper surface of the replaced support tray are blown away, thereby ensuring the planeness and smoothness of the upper surface of the support tray.

[0019] 4、The application realizes the detection of the flatness of the substrate by simultaneously monitoring the horizontal measuring instrument and the hard suction cup opening, that is, first, the horizontal measuring instrument is used to detect whether the upper surface of the substrate is flat, and then the suction detection of the hard suction cup opening is used to detect whether the lower surface of the substrate is smooth, so that only when the upper and lower surfaces of the substrate are smooth at the same time, the substrate is ensured to be flat, thereby ensuring the precision of the substrate film formation. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to facilitate the understanding of those skilled in the art, the application will be further described below with reference to the accompanying drawings.

[0021] Figure 1 The schematic view of the relative position of the bearing assembly and the tray assembly of the application;

[0022] Figure 2 The schematic view of the leveling support plate position of the application Figure 1 The partial enlarged view of A in the application;

[0023] Figure 3 The schematic view of the leveling support plate position of the application

[0024] Figure 4 The schematic view of the leveling support plate position of the application Figure 3 The partial enlarged view of B in the application;

[0025] Figure 5 The schematic view of the leveling support plate position of the application Figure 1 The partial enlarged view of C in the application.

[0026] In the figure: 1, target material; 2, magnetron; 3, sputtering support shell; 4, substrate; 5, tray assembly; 51, sliding bottom plate; 52, mounting protrusion; 53, replacement sliding groove; 54, leveling support plate; 55, mounting sliding groove; 56, horizontal measuring instrument; 57, hard suction cup opening; 58, support tray; 6, blow gun placing table; 7, bearing assembly; 71, bearing substrate; 72, connecting arc rod; 73, sliding support substrate; 74, connecting telescopic rod; 75, sliding connecting rod; 76, sliding connecting block; 77, sliding connecting groove; 8, sliding rod; 9, cleaning gap; 10, cleaning blow gun. DETAILED DESCRIPTION

[0027] In order to further illustrate the technical means adopted by the present application to achieve the predetermined inventive objectives and the effects thereof, specific embodiments, structures, features and effects according to the present application will be described in detail below in conjunction with the drawings and preferred embodiments.

[0028] Please refer to Figures 1-5 As shown in the figure, the semiconductor film forming equipment comprises a sputtering support shell 3, wherein the interior of the sputtering support shell 3 is subjected to action by a magnetron 2 on a target material 1 to achieve sputtering and perform film forming on a substrate 4.

[0029] Specifically, a sliding rod 8 is longitudinally slidably arranged at the bottom of the sputtering support shell 3, and a bearing assembly 7 is fixedly installed at the end of the sliding rod 8, wherein the bearing assembly 7 is installed with a tray assembly 5, and the tray assembly 5 is used to place the substrate 4. In the present application, the tray assembly 5 is detachable relative to the bearing assembly 7, and the tray assembly 5 is replaced with the production batch of the substrate 4, so that the detached tray assembly 5 can be conveniently cleaned, and the adhesion of impurities on the tray assembly 5 is avoided to affect the level of the substrate 4.

[0030] Meanwhile, the present application also comprises a blowing gun assembly, which can blow off the particles that may be left on the surface of the tray assembly 5, so as to avoid affecting the balance of the working surface of the substrate 4.

[0031] In the present application, a limiting assembly is also included for limiting the position of the substrate 4 to avoid movement of the substrate 4, and a corresponding measuring assembly is arranged on the limiting assembly for measuring whether the receiving surface of the substrate 4 is horizontal.

[0032] Specifically, the bearing assembly 7 comprises a bearing substrate 71, and a sliding support substrate 73 is fixed on the bearing substrate 71, wherein the bearing substrate 71 is fixedly installed at the end of the sliding rod 8, and in use, the height of the bearing substrate 71 is controlled by moving the sliding rod 8. Meanwhile, in the present application, the sliding support substrate 73 and the tray assembly 5 are slidably connected to realize the detachment of the tray assembly 5.

[0033] The tray assembly 5 comprises a sliding bottom plate 51, wherein the sliding bottom plate 51 is slidably connected with the sliding support substrate 73, and a support tray 58 is fixed above the sliding bottom plate 51 for placing the substrate 4. Meanwhile, the sliding connection between the sliding bottom plate 51 and the sliding support substrate 73 is used to realize the separation of the tray assembly 5 and the bearing assembly 7.

[0034] That is, the sliding bottom plate 51 is fixedly installed at the bottom of the sliding connecting rod 75, and the sliding support base plate 73 is symmetrically provided with a sliding connecting groove 77 at the side edge, wherein the sliding connecting groove 77 and the sliding connecting block 76 are slidably connected, so as to realize the transverse sliding of the sliding bottom plate 51 and the sliding support base plate 73, and the separation of the sliding bottom plate 51 and the sliding support base plate 73.

[0035] The limiting assembly includes symmetrically arranged leveling support plates 54, wherein the leveling support plates 54 are connected to the ends of the connecting telescopic rods 74 through the connecting arc rods 72, and the connecting telescopic rods 74 and the bearing base plate 71 are fixedly connected through the support, so that the height of the connecting arc rod 72 can be controlled by the connecting telescopic rod 74 in use, thereby controlling the height of the leveling support plate 54. When the leveling support plate 54 is at the highest end, the leveling support plate 54 and the sliding support base plate 73 form a replacement sliding groove 53, which is used to realize the replacement of the tray assembly 5. The base plate 4 is placed between the adjacent leveling support plates 54, and the leveling support plates 54 are used to limit the base plate 4. After the limiting is completed, the leveling support plates 54 are longitudinally moved to the lowest end, wherein the lowest end of the leveling support plate 54 is connected with the tray assembly 5, which is used to limit the tray assembly 5 and prevent the tray assembly 5 from moving transversely, so as to realize the position stability of the tray assembly 5, thereby ensuring the stability of the base plate 4 during film formation. Therefore, the installation sliding groove 55 is formed at the bottom of the leveling support plate 54, and the installation protrusion 52 is fixedly arranged on the sliding bottom plate 51, wherein the installation protrusion 52 and the installation sliding groove 55 are connected, so as to realize the limiting of the sliding bottom plate 51 and the placement limiting of the leveling support plate 54.

[0036] The measuring assembly includes a horizontal measuring instrument 56, wherein the horizontal measuring instrument 56 is fixedly installed on the leveling support plate 54 and symmetrically arranged, which is used to measure the level of the base plate 4, so as to monitor the placement state of the base plate 4 and prevent the base plate 4 from being in an inclined state, thereby causing uneven film formation.

[0037] Meanwhile, a plurality of groups of hard suction cups 57 are uniformly fixed on the support tray 58, and the suction state of the hard suction cups 57 is monitored, so as to monitor whether the base plate 4 is fully adsorbed. When the suction force of the hard suction cup 57 is unstable, it indicates that the base plate 4 is in an inclined state, causing some hard suction cups 57 to be in an invalid state.

[0038] Therefore, in the present application, a warning module is further included. The warning module acquires the suction force data of the hard chuck 57, arranges the suction force data into a chart, acquires the maximum value and the minimum value, judges the numerical difference between the maximum value and the minimum value, compares the numerical difference with a theoretical value, and if the numerical difference exceeds the theoretical difference, it indicates that the suction force of the hard chuck 57 is unstable, and that the substrate 4 is in an inclined state. Meanwhile, the warning module also monitors the horizontal measuring instrument 56, judges whether the upper surface of the substrate 4 is monitored when the horizontal measuring instrument 56 is at the theoretical position, and whether the monitored upper surface of the substrate 4 is horizontal. If not, it indicates that the substrate 4 is in an inclined state.

[0039] When the substrate 4 is in a non-horizontal state, the non-horizontal position of the substrate 4 is positioned and warned, and the position is sent to the processing terminal, and a warning signal is sent through the warning module, so as to facilitate the operator to process the warning signal and track and adjust the state of the substrate 4.

[0040] The blow gun assembly includes a blow gun placing table 6. In the present application, the width of the bearing substrate 71 is greater than the width of the sliding support substrate 73, and the cleaning blow gun 10 is fixed at the bottom of the leveling support plate 54. When the leveling support plate 54 moves longitudinally, the cleaning blow gun 10 can be placed on the position of the bearing substrate 71. Therefore, the blow gun placing table 6 is opened on the bearing substrate 71. When the substrate 4 is not placed, at the same time, when the leveling support plate 54 is at the highest position, the height of the lowest end of the leveling support plate 54 is higher than the height of the support tray 58, that is, a cleaning gap 9 is formed between the leveling support plate 54 and the support tray 58. At this time, the direction of the gas blown out by the cleaning blow gun 10 is the same as the direction of the cleaning gap 9, which is convenient for cleaning the impurities that may fall on the support tray 58.

[0041] In use, first, the connecting telescopic rod 74 is started to control the height of the connecting arc rod 72, so as to control the height of the leveling support plate 54, until the leveling support plate 54 reaches the highest end, the tray assembly 5 and the bearing assembly 7 are connected, specifically, the sliding bottom plate 51 is slid to the position of the sliding support base plate 73 under the sliding connection of the sliding connection block 76 and the sliding connection groove 77, at this time, the direction of the gas blown by the cleaning blow gun 10 and the direction of the cleaning gap 9 are the same, which is convenient for removing the impurities that may fall on the support tray 58, so as to ensure the smoothness of the plane on the support tray 58, then the connecting telescopic rod 74 is started to drive the connecting arc rod 72 to move downward, so that the leveling support plate 54 moves downward, so that the mounting protrusion 52 enters the inside of the mounting sliding groove 55, realizing the limiting effect of the sliding bottom plate 51, at this time, the base plate 4 is placed on the support tray 58, at this time, the base plate 4 is located between the leveling support plates 54, then the leveling support plate 54 is continuously moved downward until it moves to the set position, the smoothness of the upper surface of the base plate 4 is detected, specifically, the starting of the horizontal measuring instrument 56 detects the upper surface of the base plate 4, and the suction force of the hard suction cup port 57 is detected, to determine whether the base plate 4 is in a stable state, specifically, the early warning module arranges the suction force data into a chart by acquiring the suction force data of the hard suction cup port 57, acquires the maximum value and the minimum value, compares the numerical difference between the maximum value and the minimum value with the theoretical value, if the difference exceeds the theoretical difference value, it indicates that the suction force of the hard suction cup port 57 is unstable, which indicates that the base plate 4 is in an inclined state; at the same time, the early warning module also monitors the horizontal measuring instrument 56, to determine whether the upper surface of the base plate 4 is monitored when the horizontal measuring instrument 56 is at the theoretical position, and whether the monitored upper surface of the base plate 4 is horizontal, if not, it indicates that the base plate 4 is in an inclined state; when the base plate 4 is in a non-horizontal state, the non-horizontal position of the base plate 4 is positioned and warned, and the position is sent to the processing terminal, and a warning signal is sent through the early warning module, so as to facilitate the operator to process the warning signal and track and adjust the state of the base plate 4.

[0042] The above is only a preferred embodiment of the present application, and does not limit the present application in any form. Although the preferred embodiment of the present application has been disclosed as above, it is not intended to limit the present application, any person skilled in the art can make some changes or modifications to the above disclosed technical content without departing from the scope of the technical solution of the present application, and any brief introduction, modification, equivalent change and modification of the above embodiment based on the technical essence of the present application are still within the scope of the technical solution of the present application.

Claims

1. A semiconductor film deposition apparatus, comprising a sputtering support housing (3), wherein a sliding rod (8) is slidably disposed inside the sputtering support housing (3), characterized in that: The end of the sliding rod (8) is fixed with a bearing component (7), and a tray component (5) for placing the substrate (4) is detachably provided on the bearing component (7). A limiting component for restricting the position of the substrate (4) is provided on the bearing component (7). The carrier component (7) includes a carrier substrate (71), on which a sliding support substrate (73) for sliding connection with the tray component (5) is fixed, and the size of the sliding support substrate (73) is smaller than that of the carrier substrate (71). The tray assembly (5) includes a sliding base plate (51) for sliding connection with the sliding support base plate (73), and a support tray (58) for placing the base plate (4) is fixed on the sliding base plate (51). The support tray (58) is evenly provided with a number of sets of rigid suction cup openings (57).

2. The semiconductor film deposition apparatus according to claim 1, characterized in that, The limiting component includes a leveling support plate (54) for limiting the substrate (4), the leveling support plate (54) is mounted on the connecting telescopic rod (74), and the connecting telescopic rod (74) and the supporting substrate (71) are fixedly connected.

3. The semiconductor film deposition apparatus according to claim 2, characterized in that, The leveling support plate (54) has an installation groove (55) at the bottom, and the sliding base plate (51) has an installation protrusion (52) for cooperating with the installation groove (55) for limiting the position.

4. The semiconductor film deposition apparatus according to claim 2, characterized in that, The leveling support plate (54) is symmetrically provided with a level measuring instrument (56) for detecting the plane of the upper surface of the substrate (4).

5. The semiconductor film deposition apparatus according to claim 2, characterized in that, The bottom of the leveling support plate (54) is fixed with a cleaning blow gun (10), and the support base plate (71) is provided with a blow gun placement table (6) for placing the cleaning blow gun (10). When the leveling support plate (54) is at its highest position, the bottom surface of the leveling support plate (54) is higher than the upper surface of the support tray (58).

6. The semiconductor film deposition apparatus according to claim 1, characterized in that, The sliding support base plate (73) has symmetrical sliding connection grooves (77) on its side. The bottom of the sliding base plate (51) is fixed with a sliding connection block (76) by a sliding connection rod (75). The sliding connection block (76) and the sliding connection groove (77) are slidably connected.

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