Electronic device dehumidification apparatus and method

Abstract

The application provides an electronic device dehumidification device and method. The electronic device dehumidification device comprises a cavity, a mechanical pump, a carrier and a blower. The cavity is provided with a first through hole connected with the mechanical pump and a second through hole connected with the blower. The mechanical pump adjusts the pressure in the cavity through the first through hole, and the blower inputs dehumidification gas into the cavity through the second through hole. The carrier is arranged in the cavity and comprises at least a material loading area for placing a device to be dehumidified and a heating area for heating the device to be dehumidified. The surface of the material loading area is provided with a plurality of air holes. The air holes are in communication with the air guide pipe extending out of the cavity through the second through hole and the blower.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of dehumidification equipment, in particular to a dehumidification device and method for electronic devices. BACKGROUND

[0002] At present, the main semiconductor device packaging methods include airtight packaging and non-airtight packaging. The airtight packaging includes ceramic packaging and metal shell packaging. The non-airtight packaging mainly includes plastic packaging.

[0003] The plastic packaging device has obvious advantages in weight, size, performance and cost compared with the ceramic packaging and metal packaging device, and is widely used in various fields.

[0004] However, due to the characteristics of the plastic packaging device, the plastic packaging material is easy to absorb moisture. In a harsh environment (such as high temperature and humidity, low air pressure, and large temperature difference in the field of aerospace), the water absorption of the plastic packaging material itself, and the difference in the thermal expansion coefficient between different materials such as leads, frames and printed boards, etc. are also easy to cause the plastic packaging body to crack, internal delamination and other defects, thereby affecting the use of the plastic packaging device in the high reliability environment. At present, special treatment is carried out on the plastic packaging device in production, packaging, welding and other aspects to protect the device.

[0005] At present, after the device is produced, the moisture is removed, and the device is stored in a sealed bag. At the same time, a humidity card is placed in the sealed bag to prompt the customer to confirm whether the device is damp before welding. Generally, the plastic packaging device needs to be dehumidified before reflow soldering and mounting. Continuous baking is mainly carried out in an oven to realize the diffusion of moisture in the device to the outside, so as to remove the water vapor content in the device. The device can be reliable and stable during the device mounting and welding process. However, the baking process takes a long time, which limits the rapid removal of moisture in the device and the realization of rapid and specialized production.

[0006] In addition, after the device is soldered on the printed board, a large number of devices are mounted on the surface of the board. Generally, the device is delivered for use after production. If the device is not properly stored during this process, some plastic packaging devices will also absorb moisture. When the product is subjected to high and low temperature test with the whole machine, the internal moisture will be quickly released, which is easy to cause the internal delamination of the plastic integrated circuit device. When the delamination is located in the internal bonding area, the bonding point is easy to be detached or not in good contact, resulting in device connection failure and product failure. SUMMARY

[0007] Therefore, the purpose of the present application is to provide a dehumidification device and method for electronic devices, which can quickly remove moisture from the electronic devices, improve production efficiency and save time without introducing other risks.

[0008] To achieve the above objectives, a first aspect of this application provides an electronic device dehumidification apparatus, comprising:

[0009] The device comprises a cavity, a mechanical pump, a platform, and a blower. The cavity has a first through-hole connected to the mechanical pump and a second through-hole connected to the blower. The mechanical pump regulates the pressure within the cavity through the first through-hole, and the blower supplies dehumidifying gas into the cavity through the second through-hole. The platform is disposed within the cavity and includes at least a material-carrying area for placing the device to be dehumidified and a heating area for heating the device. The surface of the material-carrying area has multiple air holes, which communicate with the blower via air ducts extending from the cavity through the second through-hole.

[0010] Optionally, the electronic device dehumidification device according to the present invention further includes: a temperature sensor disposed within the cavity for monitoring the temperature within the cavity.

[0011] Optionally, the electronic device dehumidification device according to the present invention further includes: a baffle disposed opposite to the stage via at least one support column; the temperature sensor is disposed on the baffle.

[0012] Optionally, in the electronic device dehumidification apparatus according to the present invention, the heating zone includes a temperature controller and a heater, the temperature controller being used to control the heating temperature of the heater in order to regulate the temperature within the cavity.

[0013] Optionally, in the electronic device dehumidification device according to the present invention, a plurality of the air holes are arranged in an array.

[0014] Optionally, in the electronic device dehumidification device according to the present invention, a portion of the sidewall of the cavity is provided with a transparent material.

[0015] Optionally, in the electronic device dehumidification apparatus according to the present invention, the dehumidifying gas includes a first dehumidifying gas and a second dehumidifying gas; the first dehumidifying gas is air, and the second dehumidifying gas is nitrogen.

[0016] Optionally, the electronic device dehumidification apparatus according to the present invention further includes: a pressure detector for detecting the pressure inside the cavity.

[0017] Optionally, in the electronic device dehumidification device according to the present invention, the cavity includes a cover plate and a cavity body, wherein the cover plate is detachably connected to the cavity body.

[0018] According to a second aspect of this application, an electronic device dehumidification method is provided, which is suitable for execution by the electronic device dehumidification apparatus described in the first aspect as above, comprising: S100, placing the device to be dehumidified in a material carrier area;

[0019] S200: The temperature inside the cavity is heated to a first preset temperature value through the heating zone;

[0020] S300, A first dehumidifying gas for a first preset time is introduced into the material loading area by a blower;

[0021] S400: Use a mechanical pump to adjust the air pressure in the cavity to a first preset air pressure value;

[0022] S500: The temperature inside the cavity is heated to a second preset temperature value through the heating zone, and after maintaining the temperature for a second preset time, the heating is stopped;

[0023] S600. When the temperature inside the cavity naturally cools down to the third preset temperature value, the second dehumidifying gas is introduced into the material loading area by a blower.

[0024] S700. When the air pressure in the cavity recovers to a value greater than the second preset air pressure and less than the ambient atmospheric pressure, the blower is turned off and maintained for a fourth preset time.

[0025] S800, Repeat steps S300 to S700 until the repetition threshold is reached.

[0026] As can be seen from the above, the electronic device dehumidification device provided in this application controls the pressure in the cavity through a mechanical pump, allowing the moisture on the surface of the electronic device to diffuse outward. By introducing dehumidifying gas, a porous material loading area, and a heating area, the overflowed moisture is evaporated, achieving rapid dehumidification of the electronic device. This improves production efficiency and saves time while ensuring that no other risks are introduced into the product. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the structure of the electronic device dehumidification device according to an embodiment of this application;

[0029] Figure 2 This is a schematic diagram of the cavity structure according to an embodiment of this application;

[0030] Figure 3 This is a schematic diagram of the platform structure according to an embodiment of this application;

[0031] Figure 4 This is a schematic flowchart of an electronic device dehumidification method according to an embodiment of this application. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0033] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0034] Currently, products for removing moisture from electronic devices mainly utilize high-temperature drying ovens for baking. By controlling the temperature (120℃) and time (generally exceeding 24 hours), the purpose of removing moisture is achieved. If the temperature is lower, the moisture removal time will be much longer than 24 hours.

[0035] For electronic devices, various components are surface-mounted, and the high-temperature resistance of some materials varies. If the temperature is too high, it may cause other materials to soften or even melt and deform, resulting in other risks and functional abnormalities. At the same time, the ordinary baking time is long, which affects the production and delivery schedule and causes inefficiency.

[0036] To address the problems existing in the prior art, the present invention is proposed. One embodiment of the present invention provides a dehumidification device for electronic devices.

[0037] The electronic devices in this embodiment can be integrated circuit boards, semiconductor devices, etc. A board is a type of printed circuit board (PCB). It is manufactured with a slot that can be inserted into the slot of the computer's main circuit board (motherboard) to control the operation of hardware, such as monitors, capture cards, and other devices. After installing the driver, the corresponding hardware functions can be realized.

[0038] Figure 1 This is a schematic diagram of the structure of the electronic device dehumidification device according to an embodiment of this application.

[0039] like Figure 1As shown, the electronic device dehumidification device includes a cavity 100, a mechanical pump 200, a platform 300, and a blower 400.

[0040] In some embodiments, Figure 2 This is a schematic diagram of the structure of the cavity 100 in an embodiment of this application.

[0041] refer to Figure 2 The cavity 100 includes a cover plate 110 and a cavity 120, which are detachably connected. When the cover plate 110 is connected to the cavity 120, the cavity 100 forms a sealed environment.

[0042] In some embodiments, a portion 130 of the sidewall of the cavity 100 is provided with a transparent material to facilitate observation of the dehumidification status of the device to be dehumidified within the cavity 100. Preferably, the transparent material can be glass; in other words, a glass window (i.e., the aforementioned portion 130) is formed on the sidewall of the cavity 100.

[0043] It is worth noting that, Figure 2 The cavity 100 shown is a circular cavity, but it is not limited to this. For example, it can also be a rectangular cavity, a square cavity, etc. This application does not limit the shape of the cavity 100.

[0044] The cavity 120 of the cavity 100 is provided with a first through hole for connecting to the mechanical pump 200 and a second through hole for connecting to the blower 400.

[0045] The first through hole is connected to the first air guide pipe, and the other end of the first air guide pipe is connected to the mechanical pump 200.

[0046] The mechanical pump 200 can extract gas from the cavity 100 through the first through hole in order to adjust the pressure inside the cavity 100.

[0047] In a specific example, a mechanical pump, also known as a mechanical vacuum pump, is a machine that creates a vacuum. It can expel or absorb air from a closed or semi-closed space to achieve a relative vacuum in a localized area. Common types of vacuum pumps include reciprocating vacuum pumps, water ring pumps, molecular pumps, rotary vane vacuum pumps, piston vacuum pumps, rocking piston vacuum pumps, diaphragm vacuum pumps, and linear vacuum pumps, among many others.

[0048] A mechanical pump consists of two main parts: a motor and a pump body. A standard mechanical pump uses a motor to drive the pump shaft via a belt; a direct-drive mechanical pump has the motor directly connected to the pump shaft without intermediate transmission links. Mechanical pumps utilize the principle of gas expansion, compression, and discharge to extract gas from a container. They are called mechanical pumps because they use mechanical methods to periodically change the volume of the suction chamber inside the pump, causing the gas in the container to continuously expand into the suction chamber through the pump's inlet, and then be compressed and discharged through the outlet. The methods for changing the volume of the suction chamber include reciprocating piston pumps, fixed vane pumps, and rotary vane pumps, respectively called reciprocating mechanical pumps, fixed vane mechanical pumps, and rotary vane mechanical pumps. Since rotary vane mechanical pumps are more commonly used in practical applications, their working principle will be explained using this example.

[0049] The rotary vane mechanical pump mainly consists of a cylindrical hollow stator, an eccentric rotor, vanes, springs, a top cover, and an exhaust valve. The top of the eccentric rotor always remains in contact with the inner cavity of the pump stator, sliding along the inner wall of the stator as it rotates. Two slots are cut into the rotor, each housing a vane, with a spring between them. As the vanes rotate with the rotor, the spring tension and centrifugal force keep them pressed tightly against the inner wall of the stator. The entire cavity is housed within an oil tank.

[0050] Two vanes divide the crescent-shaped space formed by the rotor, stator cavity, and stator cover into three parts: A, B, and C, respectively called the intake chamber, compression chamber, and exhaust chamber. When the rotor rotates in the first direction, the volume of space A, which communicates with the intake port, continuously increases, and the pressure in space A continuously decreases. When the pressure in space A is lower than the pressure inside the pumped container, according to the principle of gas pressure balance, the gas being pumped is continuously drawn into the intake chamber A. At this time, the volume of the compression chamber B gradually decreases, and the gas pressure continuously increases. Simultaneously, the volume of the exhaust chamber C, which communicates with the exhaust port, further decreases, and the pressure in the exhaust chamber C further increases. When the gas pressure is greater than the exhaust pressure, the compressed gas pushes open the exhaust valve, passes through the oil layer in the tank, and is discharged into the atmosphere. During the continuous operation of the pump, the processes of intake, compression, and exhaust are continuously performed, thereby achieving the purpose of continuous pumping. Obviously, the faster the rotor speed, the greater the pumping speed. Mechanical pumps typically operate at speeds between 450 and 1400 rpm. Because of these high speeds, sealing becomes extremely difficult. The exhaust valve is immersed in oil to prevent airflow into the pump. To ensure a leak-proof connection between the intake and exhaust chambers, in addition to ensuring tight contact, a special mechanical pump oil with low vapor pressure and a certain viscosity is used. The oil enters the pump chamber through gaps in the pump body, oil holes, and the exhaust valve, covering all moving surfaces within the pump chamber and creating a seal between the intake and exhaust chambers. Furthermore, the mechanical pump oil also lubricates the pump and helps open the exhaust valve when the gas pressure is low. Simultaneously, the mechanical pump oil fills any harmful spaces to eliminate their influence on the ultimate vacuum.

[0051] The mechanical pump discussed above has only one rotor and is called a single-stage rotary vane vacuum pump, which can achieve a limiting pressure of 1 Pa. To increase the limiting pressure, a two-stage pump structure is usually used, that is, two single-stage pumps are connected in series, which can make the limiting pressure reach the Pa level.

[0052] A second air guide pipe is installed inside the second through hole. One end of the second air guide pipe is connected to the platform 300 inside the cavity 100, and the other end extends out of the cavity 100 through the second through hole and is connected to the blower 400 located outside the cavity 100, so that the blower 400 can input dehumidifying gas into the cavity 100 through the second through hole.

[0053] In a specific example, the blower 400 includes an air inlet box, a blower housing, a bearing housing, and a rotor.

[0054] The air inlet box of the blower is made of steel plate. Its function is to turn the medium at the inlet of the blower to reduce resistance loss. One end of the air inlet box is connected to the outer casing of the blower through an expansion joint, and the other end is connected to the air duct.

[0055] The blower casing is designed with a horizontal split structure, with the impeller and bearings located inside the blower casing. The blower casing supports the impeller.

[0056] The rotor of the blower is supported by bearings in a bearing housing, which contains three rows of bearings.

[0057] The rotor is the main component of the blower, and it includes the main shaft, impeller, hydraulic cylinder, control head, etc.

[0058] 1. Spindle

[0059] The main shaft's function is to transmit the motor's power to the impeller to do work on the medium. The main shaft passes through the bearing housing and is supported by three bearing discs. One end of the main shaft is the impeller, and the other end is connected to the hollow shaft via a coupling.

[0060] 2. Impeller

[0061] The impeller is a welded structure, resulting in a lightweight design and a small moment of inertia. The impeller is mounted on the main shaft, secured by a key and locked in place by a lock nut.

[0062] The blower 400 delivers dehumidifying gas to the material loading area 310 through the second air duct, thereby achieving the purpose of air circulation or heating.

[0063] In some embodiments, the dehumidifying gas includes a first dehumidifying gas and a second dehumidifying gas, wherein the first dehumidifying gas is air and the second dehumidifying gas is nitrogen. The principle of nitrogen dehumidification is to utilize the low temperature and low humidity characteristics of nitrogen to remove moisture from the air through condensation or adsorption. Nitrogen itself has very low humidity; when air with high humidity comes into contact with nitrogen, the moisture in the air is adsorbed or condensed into the nitrogen, thus achieving dehumidification. The effectiveness of nitrogen dehumidification is related to factors such as temperature, humidity, and air pressure, and it is generally suitable for environments with a relative humidity above 50%. Because the effectiveness of nitrogen dehumidification is related to factors such as humidity and temperature, the applicable range of dehumidification equipment is also limited. It is generally suitable for occasions requiring high dryness, such as electronic components, pharmaceuticals, cosmetics, and instruments. For environments with high humidity, nitrogen dehumidification is a low-cost and efficient dehumidification method.

[0064] In some embodiments, the stage 300 is disposed within the cavity 100.

[0065] Figure 3 This is a schematic diagram of the structure of the platform 300 in an embodiment of this application.

[0066] like Figure 3 As shown, the stage 300 includes at least a material loading area 310 for placing the device to be dehumidified and a heating area 320 for heating the device to be dehumidified (the heating area 320 is disposed in the stage and is not shown in the figure).

[0067] The surface of the material-carrying area 310 is provided with multiple air holes. The blower 400 is connected to the material-carrying area 310 through the second air duct mentioned above, so as to blow dehumidifying gas through the air holes onto the surface of the device to be dehumidified.

[0068] In some embodiments, the surface of the material loading area 310 is arranged in an array of air holes.

[0069] The heating zone 320 includes a temperature controller and a heater. The temperature controller is used to control the heating temperature of the heater in order to regulate the temperature inside the cavity and achieve temperature control inside the cavity 100.

[0070] In some embodiments, the electronic device dehumidification device further includes a baffle 500 disposed opposite to the stage 300 via at least one support column (see reference). Figure 3 ).

[0071] A temperature sensor 510 is installed on the baffle 500 to monitor the temperature inside the cavity 100.

[0072] In a specific example, a temperature transducer is a sensor that senses temperature and converts it into a usable output signal. Temperature sensors are the core component of temperature measuring instruments and come in a wide variety. They can be broadly classified into two categories based on the measurement method: contact and non-contact. Based on the characteristics of the sensor materials and electronic components, they are further divided into resistance temperature detectors (RTDs) and thermocouples.

[0073] This embodiment uses a non-contact sensor. The sensitive element of a non-contact sensor does not come into contact with the object being measured; it is also known as a non-contact temperature measuring instrument. This type of instrument can be used to measure the surface temperature of moving objects, small targets, and objects with small heat capacity or rapidly changing (transient) temperatures. It can also be used to measure the temperature distribution of a temperature field.

[0074] The most commonly used non-contact temperature measuring instruments are based on the fundamental law of blackbody radiation and are called radiation thermometers. Radiation thermometry includes the luminance method (see optical pyrometer), the radiation method (see radiation pyrometer), and the colorimetric method (see colorimetric thermometer). Each radiation thermometry method can only measure the corresponding photometric temperature, radiation temperature, or colorimetric temperature. Only the temperature measured for a blackbody (an object that absorbs all radiation and does not reflect light) is the true temperature. To determine the true temperature of an object, corrections must be made for the material's surface emissivity. However, the surface emissivity of a material depends not only on temperature and wavelength but also on surface condition, coating, and microstructure, making it difficult to measure accurately. In automated production, radiation thermometry is often used to measure or control the surface temperature of certain objects, such as the rolling temperature of steel strips, the temperature of rolls, the temperature of forgings, and the temperature of various molten metals in furnaces or crucibles in metallurgy. In these specific cases, measuring the surface emissivity of an object is quite difficult. For automatic measurement and control of solid surface temperature, an additional reflector can be used to form a blackbody cavity together with the surface being measured. Additional radiation can increase the effective radiation and effective emissivity of the measured surface. By using the effective emissivity to correct the measured temperature with an instrument, the true temperature of the measured surface can be obtained. The most typical additional reflector is a hemispherical reflector. Diffuse radiation from the measured surface near the center of the sphere is reflected back to the surface by the hemispherical mirror, forming additional radiation and thus increasing the effective emissivity. In the formula, ε is the emissivity of the material surface, and ρ is the reflectivity of the reflector. For the radiation measurement of the true temperature of gaseous and liquid media, a method can be used to insert a heat-resistant material tube to a certain depth to form a blackbody cavity. The effective emissivity of the cylindrical cavity after reaching thermal equilibrium with the medium is calculated. In automatic measurement and control, this value can be used to correct the measured cavity bottom temperature (i.e., the medium temperature) to obtain the true temperature of the medium.

[0075] Advantages of non-contact temperature measurement: The upper limit of measurement is not limited by the temperature resistance of the sensing element, so there is no limit to the highest measurable temperature in principle. For high temperatures above 1800℃, non-contact temperature measurement methods are mainly used. With the development of infrared technology, radiation thermometry has gradually expanded from visible light to infrared light, and it has been used for temperatures below 700℃ up to room temperature, with very high resolution.

[0076] In some embodiments, the electronic device dehumidification device further includes a pressure detector 600 for detecting the pressure within the cavity 100.

[0077] The electronic device dehumidification device provided in this application controls the pressure in the cavity through a mechanical pump, allowing moisture on the surface of the electronic device to diffuse outward. By introducing dehumidifying gas, a porous material loading area, and a heating area, the overflowed moisture is evaporated, achieving rapid dehumidification of the electronic device. This improves production efficiency and saves time while ensuring that no other risks are introduced into the product.

[0078] Based on the same technical concept, corresponding to any of the above embodiments, this application also provides a method for dehumidifying electronic devices.

[0079] refer to Figure 4 , Figure 4 This is a schematic flowchart of an electronic device dehumidification method according to an embodiment of this application. The electronic device dehumidification method includes:

[0080] S100. Place the device to be dehumidified in the material loading area 310. Specifically, open the cover plate 110 of the cavity 100 and place the device to be dehumidified in the material loading area 310 of the stage 300, ensuring that the air blown out of the air hole can reach the dehumidified device.

[0081] S200: The temperature inside the cavity 100 is heated to a first preset temperature value through the heating zone 320. The first preset temperature is preferably between 60℃ and 120℃ (the specific temperature can be set according to the product characteristics of the device to be dehumidified). The temperature value inside the cavity 100 can be obtained by the temperature sensor 510 installed on the baffle 500.

[0082] S300: A first dehumidifying gas for a first preset time is input into the material loading area 310 via a blower 400. Referring to the above, the first dehumidifying gas can be air, and the first preset time is preferably 30 minutes.

[0083] S400: Use mechanical pump 200 to adjust the air pressure in cavity 100 to the first preset air pressure value. Turn on mechanical pump 200 and control the vacuuming rate by adjusting the control valve to avoid rapid vacuuming that could damage the device to be dehumidified, and ensure that the gas inside the device to be dehumidified is slowly released to the outside.

[0084] It is worth noting that the vacuuming speed can be set according to the number and volume of the devices to be dehumidified, and this application does not limit it in this regard.

[0085] In some embodiments, the first preset air pressure value is 1*10 -2 Pa, that is, when the air pressure inside the cavity 100 is lower than 1*10 -2 When Pa, shut off mechanical pump 200.

[0086] The air pressure value inside the cavity 100 can be obtained by the air pressure detector 600.

[0087] S500: The temperature inside the cavity 100 is heated to a second preset temperature value through the heating zone 320, and after being maintained for a second preset time, the heating is stopped.

[0088] The second preset temperature value is the maximum temperature that the device to be dehumidified can withstand or 120°C. The minimum of the two values ​​is taken as the second preset temperature value, and the second preset time is 10 minutes.

[0089] Preferably, when the air pressure monitor 600 in step S400 detects that the air pressure inside the cavity 100 is lower than 1*10 -2 When Pa, set a temperature curve and slowly heat up the device to be dehumidified (the temperature is controlled by a temperature controller) to ensure that the temperature rise of the dehumidifying device does not exceed the second preset temperature value mentioned above, and the heating time is controlled within 20 minutes.

[0090] Once the temperature inside the cavity 100 reaches the second preset temperature value, the temperature inside the cavity 100 is maintained at the second preset temperature value by the temperature controller for a second preset time, and then the heater is turned off.

[0091] S600 When the temperature inside the waiting chamber 100 naturally cools down to the third preset temperature value, the second dehumidifying gas is input into the material loading area 310 through the blower 400.

[0092] In step 600, after the heater is turned off, the temperature inside the cavity 100 will cool down naturally, and the third preset temperature value is generally the room temperature value.

[0093] The second dehumidifying gas is nitrogen. After the temperature inside the cavity 100 cools naturally to room temperature, nitrogen is introduced into the cavity 100 through the blower 400. Specifically, nitrogen is slowly introduced into the material loading area 310 at a small flow rate to ensure a stable gas flow rate, and the temperature change inside the cavity 100 is observed to avoid rapid temperature changes.

[0094] S700 When the air pressure in the cavity 100 returns to a value greater than the second preset air pressure value and less than the ambient atmospheric pressure, the blower 400 is turned off and maintained for a fourth preset time.

[0095] The second preset air pressure value is 10Pa, and the fourth preset time is 10 minutes.

[0096] When the pressure inside the cavity 100 returns to a level greater than 10 Pa and less than the ambient atmospheric pressure, the blower 400 is turned off. At this time, the cavity 100 is in a closed environment, and the blower 400 is turned off. This closed environment is maintained for 10 minutes.

[0097] S800. Repeat steps S300 to S700 until the repetition threshold is reached. The repetition threshold is preferably 5-8. Of course, if the volume of the dehumidifying device is large or the number is large, the value of the repetition threshold can be adjusted according to the actual situation.

[0098] The electronic device dehumidification method provided in this application controls the pressure inside the cavity by a mechanical pump, allowing moisture on the surface of the electronic device to diffuse outward. By introducing dehumidifying gas, a porous material loading area, and a heating area, the overflowed moisture is evaporated, achieving rapid dehumidification of the electronic device. This improves production efficiency and saves time while ensuring that no other risks are introduced into the product.

[0099] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application (including the claims) is limited to these examples; within the framework of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in the details for the sake of brevity.

[0100] Additionally, to simplify the description and discussion, and to avoid obscuring the embodiments of this application, the well-known power / ground connections to integrated circuit (IC) chips and other components may or may not be shown in the provided drawings. Furthermore, the apparatus may be shown in block diagram form to avoid obscuring the embodiments of this application, and this also takes into account the fact that the details of the implementation of these block diagram apparatuses are highly dependent on the platform on which the embodiments of this application will be implemented (i.e., these details should be fully understood by those skilled in the art). While specific details (e.g., circuits) have been set forth to describe exemplary embodiments of this application, it will be apparent to those skilled in the art that the embodiments of this application can be implemented without these specific details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0101] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description.

[0102] The embodiments of this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. A method for dehumidifying electronic devices, characterized in that, Suitable for use by an electronic dehumidification device; The electronic device dehumidification device includes: a cavity, a mechanical vacuum pump, a stage, and a blower; in, The cavity is provided with a first through hole connected to the mechanical vacuum pump and a second through hole connected to the blower. The mechanical vacuum pump adjusts the pressure inside the cavity through the first through hole, and the blower supplies dehumidifying gas into the cavity through the second through hole. The dehumidifying gas includes air and nitrogen. The stage is disposed within the cavity and includes at least a material loading area for placing the device to be dehumidified and a heating area for heating the device to be dehumidified. The surface of the material loading area is provided with a plurality of air holes, and the air holes are connected to the air guide pipe extending out of the cavity through the second through hole and the blower. The method includes: S100. Place the device to be dehumidified in the material loading area; S200: The temperature inside the cavity is heated to a first preset temperature value through the heating zone; S300, Air is introduced into the material loading area for a first preset time by means of a blower; S400: Use a mechanical vacuum pump to adjust the air pressure in the cavity to a first preset air pressure value; S500: The temperature inside the cavity is heated to a second preset temperature value through the heating zone, and after maintaining the temperature for a second preset time, the heating is stopped; S600. When the temperature inside the cavity naturally cools down to the third preset temperature value, nitrogen gas is introduced into the material loading area by a blower. S700. When the air pressure in the cavity recovers to a value greater than the second preset air pressure and less than the ambient atmospheric pressure, the blower is turned off and maintained for a fourth preset time. S800, Repeat steps S300 to S700 until the repetition threshold is reached.

2. The method according to claim 1, characterized in that, Also includes: A temperature sensor installed inside the cavity is used to monitor the temperature inside the cavity.

3. The method according to claim 2, characterized in that, Also includes: A baffle is provided opposite to the platform by at least one support column; The temperature sensor is mounted on the baffle.

4. The method according to claim 1, characterized in that, The heating zone includes a temperature controller and a heater. The temperature controller is used to control the heating temperature of the heater in order to regulate the temperature inside the cavity.

5. The method according to claim 1, characterized in that, Multiple air vent arrays are arranged.

6. The method according to claim 1, characterized in that, A portion of the cavity sidewall is covered with transparent material.

7. The method according to claim 1, characterized in that, Also includes: A pressure detector is used to detect the pressure inside the cavity.

8. The method according to claim 1, characterized in that, The cavity includes a cover plate and a cavity body, and the cover plate and the cavity body are detachably connected.

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