A design method of a three-dimensional passive lumped low-pass filter based on TSV

By designing a low-pass filter based on a three-dimensional integrated spiral inductor and coaxial TSV capacitor using TSV, the problem of large area occupied by planar structures was solved, and the miniaturization and integration of the filter were realized.

CN117669451BActive Publication Date: 2026-07-03XIDIAN UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
XIDIAN UNIV
Filing Date
2023-12-04
Publication Date
2026-07-03

AI Technical Summary

Technical Problem

In existing lumped filter designs, the inductors and capacitors in planar structures occupy a large area, making it difficult to meet the requirements of modern miniaturized and integrated communication systems. Furthermore, existing TSV-based filter schemes have failed to effectively reduce the planar area.

Method used

A three-dimensional integrated spiral inductor and coaxial TSV capacitor were designed using TSV technology. By constructing the circuit structure diagram of a low-pass filter, the process parameters were determined using the calculation model of the three-dimensional integrated spiral inductor and coaxial TSV capacitor, and simulation design was performed.

Benefits of technology

The filter achieves good compatibility with integrated circuit technology, is easy to integrate in three dimensions, greatly reduces the area of ​​inductors and capacitors, and is suitable for miniaturization and integration.

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Abstract

This invention discloses a design method for a three-dimensional passive lumped low-pass filter based on TSV (Through-Spirit Transformer). The method includes: determining the electrical parameters of each filter element in the passive lumped low-pass filter based on the performance indicators and selection results of the low-pass filter, and constructing the circuit structure diagram of the low-pass filter; determining the process parameters of the TSV three-dimensional integrated inductor using a computational model of a three-dimensional integrated spiral inductor; determining the process parameters of the coaxial TSV capacitor using a computational model of a coaxial TSV capacitor; and performing simulations based on the process parameters of the TSV three-dimensional integrated inductor and the coaxial TSV capacitor to complete the design of the three-dimensional passive lumped low-pass filter. The low-pass filter designed in this invention uses TSV technology to design a three-dimensional integrated spiral inductor and a coaxial TSV capacitor, resulting in good compatibility with integrated circuit processes and ease of three-dimensional integration. Furthermore, the use of a three-dimensional spiral inductor and coaxial TSV capacitor design significantly reduces the area of ​​the inductor and capacitor, facilitating integration and miniaturization.
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