A sorting and feeding system and method supporting multi-specification silicon wafers

Abstract

The application relates to the technical field of silicon wafer feeding and discharging, and discloses a sorting feeding and discharging system and method supporting multiple specifications of silicon wafers, which comprises a base, a four-side wafer storage device, a lifting wafer guiding device, a detection device and an adjustable transmission device. The four-side wafer storage device is arranged, space is saved, the waiting time of a mechanical arm during feeding is saved, and the feeding efficiency of the silicon wafers is improved. The connecting plate is arranged, the feeding efficiency is improved. The first threaded rod and the first sliding groove are arranged, feeding of the silicon wafers of different specifications is facilitated. The lifting wafer guiding device is arranged, the silicon wafers on the wafer loading table are conveniently discharged, the silicon wafers on the wafer loading table are quickly transferred into the third transmission belt, the second threaded rod and the lifting rod are arranged, the silicon wafers are conveniently discharged, the second sliding groove and the second sliding block are arranged, the second transmission belt is kept in a taut state, the silicon wafers are conveniently transmitted, and the adjustable transmission device is arranged, the silicon wafers of different specifications are conveniently discharged and sorted.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of silicon wafer feeding and discharging, in particular to a sorting feeding and discharging system and method supporting multiple specifications of silicon wafers. BACKGROUND

[0002] In the prior art, the feeding and discharging process of silicon wafers adopts a combination of mechanical hand taking and belt conveying, specifically: the silicon wafers to be processed are pre-stored in a flower basket, placed on a belt by a mechanical hand, and when a certain number of silicon wafers are stored on the belt, they are taken and placed on a tray for coating by a suction cup mechanical hand. After coating is completed, the tray is placed back on the belt by the suction cup mechanical hand, and finally transferred to the flower basket. The tray, i.e. the silicon wafer carrier, is used for the bearing and transmission of silicon wafers in a vacuum device. The tray in the prior art is provided with grooves for bearing silicon wafers, and the number of silicon wafers that can be accommodated is determined by the number of grooves. The grooves are arranged equidistantly on the tray to make the silicon wafers equidistantly distributed.

[0003] However, this way occupies a large space and has low feeding efficiency, and is not conducive to the feeding and discharging sorting of multiple specifications of silicon wafers, so there is an urgent need to invent a sorting feeding and discharging system and method supporting multiple specifications of silicon wafers to solve the above problems. SUMMARY

[0004] (I) Technical problems to be solved

[0005] In view of the deficiencies of the prior art, the present application provides a sorting feeding and discharging system and method supporting multiple specifications of silicon wafers.

[0006] (II) Technical solutions

[0007] In order to achieve the above-mentioned purpose of solving the problems of large space occupation, low feeding efficiency, and being not conducive to the feeding and discharging sorting of multiple specifications of silicon wafers in the prior art, the present application provides the following technical solutions: a sorting feeding and discharging system supporting multiple specifications of silicon wafers, comprising a base, a four-sided wafer storage device, a lifting guide device, a detection device, and an adjustable transmission device. The base is rectangular, and a silicon wafer material frame is provided at the upper right end of the base. The four-sided wafer storage device is to the left of the silicon wafer material frame. The lifting guide device is to the left of the four-sided wafer storage device. The adjustable transmission device is to the left of the lifting guide device. The detection device is installed close to one side of the lifting guide device, and is fixedly installed on the upper side of the base.

[0008] Preferably, the four-sided film storage device is provided with a first motor fixedly installed in the base, a first shaft is arranged above the first motor, one end of the first shaft is movably connected with the first motor, the other end of the first shaft is fixedly connected with a rotating disc, a pedestal is movably connected below the rotating disc, the pedestal is arranged above the base, a first connecting rod is fixedly installed above the rotating disc, a connecting plate is fixedly installed above the first connecting rod, eight baffle plates are movably installed on the connecting plate, first threaded rods are movably installed on the upper portions of the baffle plates, and first knobs are fixedly installed at the two ends of the first threaded rods.

[0009] Preferably, the lifting guide film device is provided with a second motor, a second shaft is installed above the second motor, the lower end of the second shaft is movably connected with the second motor, two first transmission belts are movably connected with the upper end of the second shaft, two third shafts are movably connected with the two first transmission belts, fixed rings are arranged above the two third shafts, the fixed rings are movably connected with second threaded rods, the upper ends of the third shafts are fixedly connected with the lower ends of the second threaded rods, lifting rods are threadedly connected above the second threaded rods, a third connecting rod is arranged on the left side of the second threaded rod, and a second connecting rod is arranged on the left side of the third connecting rod.

[0010] Preferably, the adjustable transmission device is provided with a fixed seat, an adjusting shaft is movably installed in the fixed seat, a fixed plate is fixedly installed above the fixed seat, a third rotating shaft is movably installed on the fixed plate, the third rotating shaft is arranged on the upper portion and the lower portion of the fixed plate, a third transmission belt is movably installed on the third rotating shaft, and a fifth shaft is fixedly installed in the middle portion of the fixed plate.

[0011] Preferably, the connecting plate is a square ring, the four corners of the connecting plate are circular arcs, two first sliding grooves are symmetrically arranged on the upper portions of the four sides of the connecting plate, first sliding blocks are fixedly installed below the baffle plates, the first sliding blocks are movably installed in the first sliding grooves, two baffle plates are movably installed on each side of the connecting plate, a slide film table is arranged on one side of the two baffle plates on each side, the middle portion of the first threaded rod is provided with threads, and the threads are mirror-symmetrically distributed with the center of the first threaded rod as the point, the first threaded rod is arranged above the slide film table, and the baffle plate and the first threaded rod are connected through threads.

[0012] Preferably, the second motor, the second shaft, the first transmission belt and the third shaft are arranged inside the base, first rotating shafts are movably installed between the upper and lower ends of the two lifting rods, the first rotating shafts are movably installed between the upper ends of the two second connecting rods, a second rotating shaft is movably installed between the two third connecting rods, and a second transmission belt is movably connected between the three first rotating shafts and the second rotating shaft.

[0013] Preferably, second sliding grooves are arranged on the sides close to each other of the two third connecting rods, fourth shafts are fixedly installed at the two ends of the first rotating shafts, the fourth shafts are movably installed at the two ends of the second rotating shaft, second sliding blocks are movably installed on the fourth shafts at the two ends of the second rotating shaft, and the second sliding blocks are arranged in the second sliding grooves.

[0014] Preferably, the adjustable transmission device is provided with a connecting rod connected with the fifth shaft, the fifth shaft is movably connected with the connecting rod, the fifth shaft is movably arranged on two sides of the connecting rod, the connecting rod is fixedly connected with the adjusting rod, the adjusting rod is fixedly arranged with a guide groove on the upper end and the lower end of the side close to the fixed plate, and the third transmission belt is located in the guide groove.

[0015] Preferably, the lower end of the connecting rod is fixedly arranged with a moving rod, the lower part of the moving rod is fixedly arranged with a threaded frame close to the side of the fixed plate, and the threaded frame is provided with a thread on the side close to the moving rod.

[0016] Preferably, the adjusting shaft is fixedly arranged with a second knob at one end, the second knob is located outside the fixed seat, the adjusting shaft is provided with a rotating thread, the thread is movably connected with the rotating thread, and the thread is engaged with the rotating thread.

[0017] (Three) beneficial effects

[0018] Compared with the prior art, the application provides a sorting up-down feeding system and method supporting multiple specifications of silicon wafers, which has the following beneficial effects:

[0019] 1. The sorting up-down feeding system supporting multiple specifications of silicon wafers, by setting the four-sided wafer storage device, the silicon wafers in the wafer material frame are clamped and placed on the four-sided wafer storage device, and the mechanical arm aligns the silicon wafers in the wafer material frame with the wafer table and inserts them, when the wafer table on one side of the connecting plate is full of silicon wafers, the first motor is started to rotate the connecting plate, the wafer table full of silicon wafers is turned to the lifting guide device, and the empty wafer table is turned to the mechanical hand for feeding, thereby saving space, saving the waiting time of the mechanical arm during feeding, and improving the feeding efficiency of the silicon wafers.

[0020] 2. The sorting up-down feeding system supporting multiple specifications of silicon wafers, by setting the connecting plate, when the wafer table on one side of the connecting plate is full of silicon wafers, the rotation of the connecting plate will drive the rotation of the fence, and the rotation of the fence will drive the rotation of the wafer table, so that the wafer table full of silicon wafers is turned to the lifting guide device, and the empty wafer table is turned to the mechanical hand, and the mechanical hand can continuously load the silicon wafers in the wafer material frame onto the empty wafer table, thereby improving the efficiency of feeding.

[0021] 3. The sorting and feeding system for multiple specifications of silicon wafers, by setting the first threaded rod and the first sliding groove, the middle part of the first threaded rod is provided with threads which are mirror-symmetrically distributed with the first threaded rod center as the point, and the upper part of the fence is connected with the first threaded rod through threads, so that when the first threaded rod rotates, the fences on both sides of the first threaded rod will move closer or farther away from each other, and when the two fences move closer or farther away from each other, the first sliding block fixedly installed below the fence moves in the first sliding groove on the connecting plate, so as to keep the stability of the fence on the connecting plate and fix the position of the fence with the first threaded rod, and when the fence moves, the slide on the fence will move, and rotating the first knob can make the slide move to the appropriate position, which is convenient for feeding different specifications of silicon wafers.

[0022] 4. The sorting and feeding system for multiple specifications of silicon wafers, by setting the lifting guide piece device, the silicon wafers are taken out one by one, and when the second motor is started, the lifting rod will move upwards, so that the first shaft between the lifting rods moves upwards, and when the first shaft between the lifting rods moves upwards, the second transmission belt on the first shaft will move upwards, so that all the silicon wafers on the slide will be transferred onto the second transmission belt one by one, which is beneficial to the unloading of the silicon wafers on the slide and quickly transferring the silicon wafers on the slide into the third transmission belt.

[0023] 5. The sorting and feeding system for multiple specifications of silicon wafers, by setting the second threaded rod and the lifting rod, the second threaded rod is connected with the lifting rod through threads, so that the rotation of the second threaded rod will drive the lifting rod to move upwards, and when the lifting rod moves upwards, the first shaft between the lifting rods will move upwards, and when the first shaft between the lifting rods moves upwards, the second transmission belt on the first shaft will move upwards, so that the silicon wafers from low to high positions on the slide will be transferred onto the second transmission belt one by one, which is convenient for unloading the silicon wafers.

[0024] 6. The sorting and feeding system for multiple specifications of silicon wafers, by setting the second sliding groove and the second sliding block, the second sliding groove is set in the third connecting rod and between the third connecting rods, and the second sliding block is installed in the second sliding groove, and the second shaft and the fourth shaft between the second sliding blocks will compress the second transmission belt under the action of their own gravity, so that when the distance between the first shaft between the lifting rods and the first shaft between the second connecting rods changes, the second shaft can change the distance between the first shaft between the second connecting rod and the second shaft and the distance between the first shaft below the second shaft and the lifting rod, which is convenient for keeping the second transmission belt in a tight state and is beneficial to the transmission of silicon wafers.

[0025] 7、The support multi-specification wafer sorting and feeding system, through setting adjustable transmission device, rotating the second knob, the second knob rotation will drive the adjustment shaft rotation, the adjustment shaft rotation, the rotation of the tooth pattern on the adjustment shaft will also rotate, the tooth pattern rotates will drive the tooth pattern movement, the tooth pattern movement will drive the tooth pattern frame movement, the tooth pattern frame movement will drive the moving rod movement, the moving rod movement will drive the connecting rod movement, the connecting rod movement will drive the adjustment rod movement, the adjustment rod movement will drive the guide belt groove movement, the guide belt groove movement will drive the third transmission belt movement, rotating the second knob can make the third transmission belt move to the appropriate position, facilitate the different specifications of wafer feeding and sorting. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 It is the main structure schematic diagram of the application;

[0027] Figure 2 It is four side wafer storage device structure schematic diagram of the application;

[0028] Figure 3 It is the connecting plate structure schematic diagram of the application;

[0029] Figure 4 It is the column plate structure schematic diagram of the application;

[0030] Figure 5 It is the lifting guide wafer device structure schematic diagram of the application;

[0031] Figure 6 It is the first rotating shaft structure schematic diagram of the application;

[0032] Figure 7 It is the third connecting rod structure schematic diagram of the application;

[0033] Figure 8 It is the second rotating shaft structure schematic diagram of the application;

[0034] Figure 9 It is the adjustable transmission device structure schematic diagram of the application;

[0035] Figure 10 It is the adjustment rod structure schematic diagram of the application;

[0036] Figure 11 It is the tooth pattern frame structure schematic diagram of the application;

[0037] Figure 12 It is the adjustment shaft structure schematic diagram of the application.

[0038] In the figure: 100, base; 101, silicon wafer material frame 200, four sides of the storage device; 201, the first motor; 202, the first shaft; 203, pedestal; 204, turntable; 205, the first connecting rod; 206, connecting plate; 207, fence; 208, slide; 209, the first knob; 210, the first threaded rod; 211, the first sliding groove; 212, the first sliding block; 300, lifting guide piece device; 301, the second motor; 302, the second shaft; 303, the first transmission belt; 304, the third shaft; 305, fixed ring; 306, the second threaded rod; 307, the first rotating shaft; 308, lifting rod; 309, the second transmission belt; 310, the second connecting rod; 311, the second rotating shaft; 312, the third connecting rod; 313, the fourth shaft; 314, the second sliding groove; 315, the second sliding block; 400, detection equipment; 500, adjustable transmission device; 501, fixed seat; 502, the second knob; 503, fixed plate; 504, the third rotating shaft; 505, the third transmission belt; 506, adjustment shaft; 507, the fifth shaft; 508, connecting rod; 509, adjustment rod; 510, moving rod; 511, guide belt groove; 512, toothed frame; 513, tooth; 514, rotating tooth. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0040] Please refer to Figures 1-12 A sorting and feeding system supporting multi-specification silicon wafers includes a base 100, a four-sided storage device 200, a lifting guide piece device 300, a detection equipment 400 and an adjustable transmission device 500. The base 100 is rectangular, and a silicon wafer material frame 101 is arranged at the upper right end of the base 100. The four-sided storage device 200 is arranged to the left of the silicon wafer material frame 101. The lifting guide piece device 300 is arranged to the left of the four-sided storage device 200. The adjustable transmission device 500 is arranged to the left of the lifting guide piece device 300. The detection equipment 400 is arranged close to one side of the lifting guide piece device 300, and is fixedly installed above the base 100.

[0041] The four-side film storing device 200 is provided with a first motor 201 fixedly installed in the base 100, a first shaft 202 provided above the first motor 201, one end of the first shaft 202 movably connected with the first motor 201, the other end of the first shaft 202 fixedly connected with a rotating disc 204, a pedestal 203 movably connected below the rotating disc 204, the pedestal 203 located above the base 100, a first connecting rod 205 fixedly installed above the rotating disc 204, a connecting plate 206 fixedly installed above the first connecting rod 205, eight baffle plates 207 movably installed on the connecting plate 206, a first threaded rod 210 movably installed on the upper part of each baffle plate 207, and a first knob 209 fixedly installed at both ends of the first threaded rod 210.

[0042] The lifting guide piece device 300 is provided with a second motor 301, a second shaft 302 installed above the second motor 301, one end of the second shaft 302 movably connected with the second motor 301, the other end of the second shaft 302 movably connected with two first transmission belts 303, the two first transmission belts 303 movably connected with two third shafts 304, a fixed ring 305 provided above each third shaft 304, the fixed ring 305 located above the base 100, a second threaded rod 306 movably connected with the fixed ring 305, the upper end of the third shaft 304 fixedly connected with the lower end of the second threaded rod 306, a lifting rod 308 threadedly connected above the second threaded rod 306, a third connecting rod 312 provided on the left side of the second threaded rod 306, and a second connecting rod 310 provided on the left side of the third connecting rod 312.

[0043] The adjustable transmission device 500 is provided with a fixed seat table 501, an adjusting shaft 506 movably installed in the fixed seat table 501, a fixed plate 503 fixedly installed above the fixed seat table 501, a third rotating shaft 504 movably installed on the fixed plate 503, the third rotating shaft 504 located on the upper part and the lower part of the fixed plate 503, a third transmission belt 505 movably installed on the third rotating shaft 504, and a fifth shaft 507 fixedly installed in the middle of the fixed plate 503.

[0044] The connecting plate 206 is a square ring, the four corners of the connecting plate 206 are circular arcs, two first sliding grooves 211 symmetrically formed on the upper part of each side of the connecting plate 206, a first sliding block 212 fixedly installed below each baffle plate 207 and movably installed in the first sliding groove 211, two baffle plates 207 movably installed on each side of the connecting plate 206, a slide film table 208 provided on one side of the two baffle plates 207 on each side, a thread provided on the middle part of the first threaded rod 210 and mirror-symmetrically distributed with the center of the first threaded rod 210 as a point, the first threaded rod 210 located above the slide film table 208, and the baffle plate 207 threadedly connected with the first threaded rod 210.

[0045] The second motor 301, the second shaft 302, the first transmission belt 303 and the third shaft 304 are located inside the base 100, the first rotating shafts 307 are movably installed between the two lifting rods 308 at the upper and lower ends, the first rotating shaft 307 is movably installed between the two second connecting rods 310 at the upper end, the second rotating shaft 311 is movably installed between the two third connecting rods 312, and the second transmission belt 309 is movably connected between the three first rotating shafts 307 and the second rotating shaft 311.

[0046] The two third connecting rods 312 are provided with the second sliding grooves 314 on the side close to each other, the fourth shafts 313 are fixedly installed at the two ends of the first rotating shaft 307, the fourth shafts 313 are movably installed at the two ends of the second rotating shaft 311, the second sliding blocks 315 are movably installed on the fourth shafts 313 at the two ends of the second rotating shaft 311, and the second sliding blocks 315 are located in the second sliding grooves 314.

[0047] The adjustable transmission device 500 is provided with the connecting rod 508 connected with the fifth shaft 507, the connecting rod 508 is movably connected with the fifth shaft 507, the adjusting rods 509 are movably installed at the two sides of the fifth shaft 507, the connecting rod 508 is fixedly connected with the adjusting rods 509, the guide belt grooves 511 are fixedly installed on the upper and lower ends of the side close to the fixed plate 503 of the adjusting rod 509, and the third transmission belt 505 is located in the guide belt grooves 511.

[0048] The moving rod 510 is fixedly installed at the lower end of the connecting rod 508, the toothed frame 512 is fixedly installed on the side close to the fixed plate 503 of the lower part of the moving rod 510, and the toothed strips 513 are arranged on the two sides close to each other of the upper and lower edges of the toothed frame 512 away from the moving rod 510.

[0049] The second knob 502 is fixedly installed at one end of the adjusting shaft 506, the second knob 502 is located outside the fixed seat 501, the rotating toothed strips 514 are arranged on the adjusting shaft 506, the toothed strips 513 are movably connected with the rotating toothed strips 514, and the toothed strips 513 are engaged with the rotating toothed strips 514.

[0050] In use, first according to the size of the wafer specification sorting of the material loading and unloading adjust the distance between the slide table 208 and the distance between the third transmission belt 505. In the process, turn the first knob 209, the first knob 209 will bring the first screw rod 210 between the first knob 209 rotation, the first screw rod 210 middle part is provided with thread and thread with the first screw rod 210 center as the point mirror symmetry distribution, the upper part of the fence 207 and the first screw rod 210 through the threaded connection, then when the first screw rod 210 rotates, the fence 207 on both sides of the first screw rod 210 will be close to each other or away from each other, when the two fence 207 close to each other or away from each other, the first slide block 212 below the fence 207 fixedly installed in the first slide groove 211 on the connecting plate 206 moves, then keep the stability of the fence 207 on the connecting plate 206 and cooperate with the first screw rod 210 to fix the position of the fence 207, the fence 207 moves, then the fence 207 on the slide table 208 moves, turn the first knob 209 to make the slide table 208 move to the appropriate position; turn the second knob 502, then the second knob 502 will bring the adjustment shaft 506 rotation, the adjustment shaft 506 rotates, the rotation tooth 514 on the adjustment shaft 506 also rotates, the rotation tooth 514 rotates will bring the tooth 513 moves, the tooth 513 moves will bring the tooth frame 512 moves, the tooth frame 512 moves will bring the moving rod 510 moves, the moving rod 510 moves will bring the connecting rod 508 moves, the connecting rod 508 moves will bring the adjustment rod 509 moves, the adjustment rod 509 moves will bring the guide belt groove 511 moves, the guide belt groove 511 moves will bring the third transmission belt 505 moves, turn the second knob 502 to make the third transmission belt 505 move to the appropriate position.

[0051] The silicon wafer is firstly placed in the silicon wafer material frame 101, and the silicon wafer in the silicon wafer material frame 101 is clamped and placed on the four-side silicon wafer storage device 200 by the mechanical arm, and the silicon wafer is taken out one by one by the lifting silicon wafer guiding device 300. In this process, the mechanical arm aligns the silicon wafer in the silicon wafer material frame 101 with the silicon wafer loading table 208 and inserts it, and when the silicon wafer loading table 208 on one side of the connecting plate 206 on the fence plate 207 is full of silicon wafers, the first motor 201 is started, the first motor 201 drives the first shaft 202 to rotate, the first shaft 202 drives the rotating disc 204 to rotate, the rotating disc 204 drives the first connecting rod 205 to rotate, the first connecting rod 205 drives the connecting plate 206 to rotate, the connecting plate 206 drives the fence plate 207 to rotate, the fence plate 207 drives the silicon wafer loading table 208 to rotate, and the silicon wafer loading table 208 full of silicon wafers is turned to the lifting silicon wafer guiding device 300 and the empty silicon wafer loading table 208 is turned to the mechanical arm, and then the mechanical arm continuously loads the silicon wafer in the silicon wafer material frame 101 to the empty silicon wafer loading table 208.When the silicon wafer is transferred to the lifting wafer guiding device 300, the lifting rods 308 are in the lowest position, the second rotating shafts 311 between the third connecting rods 312 are also in the lowest position, the second motor 301 is started, the second motor 301 drives the second shaft 302 to rotate, the second shaft 302 drives the first transmission belt 303 to rotate, the first transmission belt 303 drives the third shaft 304 to rotate, the third shaft 304 drives the second threaded rod 306 to rotate, the second threaded rod 306 is connected with the lifting rods 308 through threads, and the second threaded rod 306 drives the lifting rods 308 to move up and down, the lifting rods 308 drive the first rotating shafts 307 between the lifting rods 308 to move up and down, the first rotating shafts 307 drive the second transmission belts 309 on the first rotating shafts 307 to move up and down, and the second transmission belts 309 are moved to below the silicon wafer at the lowest position of the wafer stage 208 and the silicon wafer is brought onto the second transmission belts 309, then the second motor 301 is started, the second motor 301 drives the second shaft 302 to rotate, the second shaft 302 drives the first transmission belt 303 to rotate, the first transmission belt 303 drives the third shaft 304 to rotate, the third shaft 304 drives the second threaded rod 306 to rotate, the second threaded rod 306 is connected with the lifting rods 308 through threads, and the second threaded rod 306 drives the lifting rods 308 to move upwards, the lifting rods 308 drive the first rotating shafts 307 between the lifting rods 308 to move upwards, the first rotating shafts 307 drive the second transmission belts 309 on the first rotating shafts 307 to move upwards, and all the silicon wafers on the wafer stage 208 are transferred onto the second transmission belts 309 one by one, when the silicon wafers on the wafer stage 208 close to the lifting wafer guiding device 300 are all taken off, the lifting rods 308 are in the highest position, the second rotating shafts 311 between the third connecting rods 312 are also in the highest position, the second motor 301 is started, the second motor 301 drives the second shaft 302 to rotate, the second shaft 302 drives the first transmission belt 303 to rotate, the first transmission belt 303 drives the third shaft 304 to rotate, the third shaft 304 drives the second threaded rod 306 to rotate, the second threaded rod 306 is connected with the lifting rods 308 through threads, and the second threaded rod 306 drives the lifting rods 308 to move downwards, the lifting rods 308 drive the first rotating shafts 307 between the lifting rods 308 to move downwards, the first rotating shafts 307 drive the second transmission belts 309 on the first rotating shafts 307 to move downwards, and the lifting rods 308 are moved to the lowest position, the second rotating shafts 311 between the third connecting rods 312 are also moved to the lowest position.

[0052] When the lifting rods 308 move up and down, the distance between the first rotating shafts 307 between the lifting rods 308 and the first rotating shafts 307 between the second connecting rods 310 changes. By setting the third connecting rods 312 and opening the second sliding grooves 314 between the third connecting rods 312, the second sliding blocks 315 are installed in the second sliding grooves 314. The second rotating shafts 311 and the fourth shafts 313 between the second sliding blocks 315 are pressed against the second transmission belts 309 under the action of their own gravity. When the distance between the first rotating shafts 307 between the lifting rods 308 and the first rotating shafts 307 between the second connecting rods 310 changes, the second rotating shafts 311 can change the distance between the first rotating shafts 307 between the second rotating shafts 311 and the second connecting rods 310 and the distance between the first rotating shafts 307 below the second rotating shafts 311 and the lifting rods 308, so as to keep the second transmission belts 309 in a tight state, facilitating the transmission of the silicon wafers.

[0053] When the silicon wafers are conveyed from the second transmission belts 309 to above the first rotating shafts 307 between the second connecting rods 310, they will enter the third transmission belts 505. When the third rotating shafts 504 rotate, the third transmission belts 505 will rotate and carry the silicon wafers into the detection equipment 400 for detection, and then the silicon wafers are sorted according to the detection results and transmitted to different positions.

[0054] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A sorting and loading system for silicon wafers of various specifications, comprising a base (100), a four-sided wafer storage device (200), a lifting and guiding device (300), a detection device (400), and an adjustable transmission device (500), characterized in that: The base (100) is rectangular. A silicon wafer material frame (101) is provided at the rightmost end of the base (100). To the left of the silicon wafer material frame (101) is a four-sided wafer storage device (200). To the left of the four-sided wafer storage device (200) is a lifting wafer guide device (300). To the left of the lifting wafer guide device (300) is an adjustable transmission device (500). A testing device (400) is installed on the side of the adjustable transmission device (500) near the lifting wafer guide device (300). The testing device (400) is fixedly installed above the base (100). The four-sided chip storage device (200) is equipped with a first motor (201), which is fixedly installed in the base (100). A first shaft (202) is provided above the first motor (201). One end of the first shaft (202) is movably connected to the first motor (201), and the other end of the first shaft (202) is fixedly connected to a turntable (204). A platform (203) is movably connected below the turntable (204). The platform (203) is located above the base (100). A first connecting rod (205) is fixedly installed above the turntable (204). A connecting plate (206) is fixedly installed above the first connecting rod (205). Eight railings (207) are movably installed on the connecting plate (206). A first threaded rod (210) is movably installed on the upper part of the railing (207). A first knob (209) is fixedly installed at both ends of the first threaded rod (210). The lifting guide plate device (300) is equipped with a second motor (301), a second shaft (302) is installed above the second motor (301), the lower end of the second shaft (302) is movably connected to the second motor (301), two first transmission belts (303) are movably connected to the upper end of the second shaft (302), and a third shaft (304) is movably connected to each of the two first transmission belts (303). A fixing ring (305) is provided above each of the two third shafts (304), the fixing ring (305) is located above the base (100), and a second threaded rod (306) is movably connected to the fixing ring (305). The upper end of the third shaft (304) is fixedly connected to the lower end of the second threaded rod (306), and a lifting rod (308) is threadedly connected above the second threaded rod (306). A third connecting rod (312) is provided on the left side of the second threaded rod (306), and a second connecting rod (310) is provided on the left side of the third connecting rod (312). The adjustable transmission device (500) is provided with a fixed base (501), an adjusting shaft (506) is movably installed in the fixed base (501), a fixed plate (503) is fixedly installed above the fixed base (501), a third rotating shaft (504) is movably installed on the fixed plate (503), the third rotating shaft (504) is located at the upper and lower parts of the fixed plate (503), a third transmission belt (505) is movably installed on the third rotating shaft (504), and a fifth shaft (507) is fixedly installed in the middle of the fixed plate (503).

2. The sorting and loading system for supporting multi-specification silicon wafers according to claim 1, characterized in that: The connecting plate (206) is a square ring with rounded corners. The upper four sides of the connecting plate (206) are symmetrically provided with two first sliding grooves (211). A first slider (212) is fixedly installed below the guardrail (207). The first slider (212) is movably installed in the first sliding groove (211). Two guardrails (207) are movably installed on each side of the connecting plate (206). A slide stage (208) is provided on one side of each of the two guardrails (207). The middle part of the first threaded rod (210) is provided with threads, and the threads are symmetrically distributed with the center of the first threaded rod (210) as the point. The first threaded rod (210) is located above the slide stage (208). The guardrail (207) and the first threaded rod (210) are connected by threads.

3. The sorting and loading system for supporting multi-specification silicon wafers according to claim 1, characterized in that: The second motor (301), the second shaft (302), the first transmission belt (303) and the third shaft (304) are all located inside the base (100). The upper and lower ends of the two lifting rods (308) are each equipped with a first rotating shaft (307). The upper end of the two second connecting rods (310) is movably equipped with a first rotating shaft (307). The two third connecting rods (312) are movably equipped with a second rotating shaft (311). The three first rotating shafts (307) and one second rotating shaft (311) are movably connected by a second transmission belt (309).

4. The sorting and loading system for supporting multi-specification silicon wafers according to claim 3, characterized in that: The two third connecting rods (312) are provided with a second slide groove (314) on one side close to each other. The first rotating shaft (307) is fixedly installed with a fourth shaft (313) at both ends. The second rotating shaft (311) is movably installed with a fourth shaft (313) at both ends. The second slider (315) is movably installed with the fourth shaft (313) at both ends of the second rotating shaft (311). The second slider (315) is located in the second slide groove (314).

5. A sorting and loading system for supporting multi-specification silicon wafers according to claim 1, characterized in that: The adjustable transmission device (500) is provided with a connecting rod (508) to connect the fifth shaft (507). The connecting rod (508) is movably connected to the fifth shaft (507). Adjusting rods (509) are movably installed on both sides of the fifth shaft (507). The connecting rod (508) is fixedly connected to the adjusting rod (509). The upper and lower ends of the adjusting rod (509) near the fixed plate (503) are fixedly installed with guide grooves (511). The third transmission belt (505) is located in the guide groove (511).

6. A sorting and loading system for supporting multi-specification silicon wafers according to claim 5, characterized in that: A movable rod (510) is fixedly installed at the lower end of the connecting rod (508). A toothed frame (512) is fixedly installed on the lower part of the movable rod (510) near the fixed plate (503). The upper and lower edges of the toothed frame (512) away from the movable rod (510) are provided with teeth (513) on one side close to each other.

7. A sorting and loading system for supporting multi-specification silicon wafers according to claim 6, characterized in that: A second knob (502) is fixedly installed at one end of the adjusting shaft (506). The second knob (502) is located outside the fixed base (501). The adjusting shaft (506) is provided with rotating teeth (514). Teeth (513) is movably connected to rotating teeth (514), and teeth (513) meshes with rotating teeth (514).

8. A sorting and loading method supporting multi-specification silicon wafers, wherein the sorting and loading method uses the sorting and loading system according to any one of claims 1-7, characterized in that: Includes the following steps: 1) First, adjust the distance between the wafer carriers (208) and the distance between the third transmission belts (505) according to the size of the silicon wafers to be loaded and sorted. Turn the first knob (209) to move the wafer carriers (208) to the appropriate position, and turn the second knob (502) to move the third transmission belts (505) to the appropriate position. 2) The silicon wafers in the silicon wafer material frame (101) are picked up by the robot and placed on the four-sided wafer storage device (200). The silicon wafers in the silicon wafer material frame (101) are aligned with the wafer carrier stage (208) and inserted by the robot. When the wafer carrier stage (208) on one side of the connecting plate (207) is full of silicon wafers, the first motor (201) is started to make the connecting plate (206) rotate. The wafer carrier stage (208) on the side with full silicon wafers is turned to the lifting guide device (300) and the empty wafer carrier stage (208) is turned to the robot for loading. 3) The silicon wafers are removed one by one by the lifting guide device (300). When the second motor (301) is started, it will drive the lifting rod (308) to move upward, so that the first rotating shaft (307) between the lifting rods (308) moves upward. When the first rotating shaft (307) between the lifting rods (308) moves upward, it will drive the second transmission belt (309) on the first rotating shaft (307) to move upward, so that all the silicon wafers on the wafer carrier (208) will be transferred one by one to the second transmission belt (309) for unloading. 4) When the silicon wafer is conveyed from the second transmission belt (309) to the first rotating shaft (307) between the second connecting rods (310), it will enter the third transmission belt (505). When the third rotating shaft (504) rotates, it will drive the third transmission belt (505) to rotate. When the third transmission belt (505) rotates, it will carry the silicon wafer into the detection equipment (400) for detection. Then, it will be sorted and the silicon wafer will be transferred to different positions according to the detection results.

Images