AlcrCuFeNi high-entropy alloy particle reinforced copper matrix composite

Abstract

The application provides an AlCrCuFeNi high-entropy alloy particle reinforced copper-based composite material, and a preparation method of the material. 15.38 Cr 15.38 Cu 15.38 Fe 15.38 Ni 38.48 ; the high-entropy alloy particles and copper powder are ball-milled to obtain a mixture; wherein the mass percentage of the high-entropy alloy particles is 10-50 wt.%; and the mixture is subjected to spark plasma sintering to obtain the AlCrCuFeNi high-entropy alloy particle reinforced copper-based composite material, and the sintering temperature is 573K-733K. The technical scheme of the application can improve the strength of the composite material while maintaining high electrical conductivity, and the finally obtained composite material exhibits excellent mechanical and electrical properties, and has a wide application prospect.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of new materials, and particularly relates to an AlCrCuFeNi high-entropy alloy particle reinforced copper-based composite material. BACKGROUND

[0002] High-strength high-conductivity materials have excellent physical, mechanical, electrical and thermal conduction properties, and are key materials required in many fields such as aerospace, national defense and military industry, electrical communication and rail transportation. With the rapid development of modern science and technology, the manufacturing of precision instruments is developing towards small size, high precision and high sensitivity, which puts forward real requirements for the higher comprehensive performance of high-strength high-conductivity materials. CuCo2Be alloy is a representative material of conductive copper alloy, has high strength, electrical conductivity greater than 50% IACS, and good thermal conduction performance, and is therefore often applied to the manufacturing of mold parts requiring rapid cooling, but the Co and Be elements have the problem of high cost. In addition, the toxicity of beryllium and its compounds limits the production and consumption of beryllium-containing copper alloys, and non-toxic and environmentally friendly alternative materials need to be developed.

[0003] Alloying and forming metal matrix composites are common research methods for strengthening the metal matrix to obtain high-strength and high-conductivity materials. The strengthening methods of copper alloy mainly include solid solution strengthening, aging strengthening, precipitation strengthening, fine-grain strengthening and deformation strengthening. The selection of solid solution elements is a key influencing factor for the development of solid solution strengthening type alloys, such as the addition of Ag, Mg, Cd, Cr, Zr and other elements, which can play a good strengthening effect without losing the electrical conductivity of the matrix as much as possible. Unfortunately, there is a limit to the strengthening effect of the addition of alloying elements on the copper matrix, and all these strengthening methods will produce impurity scattering, which inevitably reduces the electrical conductivity. The choice of strengthening method has a great influence on the characteristics of the composite material, and the single strengthening effect is limited. The copper matrix can be effectively enhanced under the synergistic action of multiple strengthening methods, and shows good comprehensive performance. At present, Cu-Mg alloy has become a potential alternative material for beryllium copper alloy. In a typical solid solution strengthened Cu-Mg alloy, the increase of the content of Mg solid solution element leads to the formation of lamellar aggregates due to eutectic transformation in the alloy, and the second phase Cu2Mg is precipitated during the cooling process, resulting in precipitation strengthening. The alloy is effectively enhanced and shows ultra-high strength of more than 1000 MPa, but the electrical conductivity is seriously lost. Under the synergistic action of nano-twinning strengthening and nano-precipitation strengthening, the strength of Cu-Ag alloy is as high as 870 MPa, and the electrical conductivity reaches 78% IACS, which has excellent comprehensive performance, but the production cost is high and there are limitations in preparation, which is difficult to be practically applied in industrial production.

[0004] Furthermore, the electrical conductivity and mechanical properties of materials are often inversely proportional. The addition of reinforcing phases has a smaller impact on the conductivity of the copper matrix compared to solid solution atoms. Common reinforcing phase types include Al₂O₃, TiB₂, carbon fibers, carbon nanotubes, and graphene. Although traditional ceramic particle-reinforced copper matrix composites have effectively improved the matrix strength, the low conductivity of the reinforcing material itself and the poor interfacial wettability significantly impair the matrix conductivity. Graphene and carbon nanotubes have been widely studied as novel reinforcing materials, achieving new breakthroughs in the field of high strength and high conductivity. However, excessive addition of graphene / carbon nanotubes can greatly impair conductivity, making it difficult to meet the requirements for high strength. In addition, metallic glasses have also been used as reinforcing phases, achieving a good balance between conductivity and mechanical strength. However, their application is limited due to the low crystallization temperature and metastable properties of metallic glasses.

[0005] Significant progress has been made in the development of non-toxic and environmentally friendly alternative materials containing beryllium copper alloys, but the following defects and shortcomings still exist:

[0006] (1) CuNi2SiCr alloy has become an ideal substitute for beryllium bronze, exhibiting excellent mechanical properties. However, its electrical conductivity is reduced by nearly 15% compared to CuCo2Be alloy, and there is still room for improvement, which limits the application prospects of this alloy. Titanium bronze achieves composite precipitation strengthening after heat treatment and deformation treatment. Its comprehensive performance can reach the performance level of beryllium cobalt copper alloy specified by American PDS13411 AL and ASTM B441. However, the production process of this alloy is strict, the actual production is difficult, and it is highly sensitive to the service temperature, making it difficult to use in the aging state.

[0007] (2) Existing ultra-high strength elastic copper alloys in use both domestically and internationally have excellent comprehensive properties, but they still cannot be used as a complete substitute for beryllium copper alloys. For example, Cu-Ni-Si alloys have excellent electrical conductivity, but their strength still needs to be improved. The electrical conductivity of ultra-high strength Cu-Ti, Cu-Ni-Sn alloys is generally lower than 20% IACS. Summary of the Invention

[0008] To address the above technical problems, this invention discloses an AlCrCuFeNi high-entropy alloy particle-reinforced copper-based composite material. This composite material has both high strength and excellent electrical conductivity, and has potential applications in the field of conductive elasticity. It is expected to be used in the manufacture of lead frames, electrical switches, mold bearings and other elastic elements.

[0009] The technical solution adopted by this invention is as follows:

[0010] The preparation method of AlCrCuFeNi high-entropy alloy particle-reinforced copper matrix composite material includes the following steps:

[0011] Step S1: Prepare AlCrCuFeNi high-entropy alloy particles. According to the atomic ratio, the composition of the AlCrCuFeNi high-entropy alloy is Al... 15.38 Cr 15.38 Cu 15.38 Fe 15.38 Ni 38.48 The AlCrCuFeNi high-entropy alloy particles can be prepared using the existing high-pressure gas atomization method.

[0012] Step S2: The AlCrCuFeNi high-entropy alloy particles are ball-milled and mixed with copper powder to achieve grain refinement and obtain a mixture; wherein the mass percentage of AlCrCuFeNi high-entropy alloy particles is 10-50 wt.%.

[0013] Step S3 involves subjecting the mixture to discharge plasma sintering to obtain an AlCrCuFeNi high-entropy alloy particle-reinforced copper-based composite material. The sintering pressure is 500-700 MPa, and the sintering temperature is 573 K-733 K. Discharge plasma sintering is characterized by low-temperature and rapid sintering, which can achieve densification of the composite material and prevent grain coarsening.

[0014] As a further improvement of the present invention, in step S2, the mass percentage of the AlCrCuFeNi high-entropy alloy particles in the mixture is 20-40 wt.%. This technical solution exhibits higher strength and electrical conductivity.

[0015] As a further improvement of the present invention, in step S2, the mass percentage of the AlCrCuFeNi high-entropy alloy particles in the mixture is 20-30 wt.%. Further, the mass percentage of the AlCrCuFeNi high-entropy alloy particles is 20 wt.%.

[0016] As a further improvement of the present invention, in the ball milling of step S2, the ball milling speed is 275-475 rpm, the ball-to-material ratio is 8-16:1, and the ball milling time is 2-3 hours.

[0017] As a further improvement of the present invention, in step S3, the sintering temperature is 653K-733K. Further, the sintering temperature is 653K-693K. Further, the sintering temperature is 693K. The sintering temperature has a significant impact on the strength and conductivity of the composite material. Using 653K-733K achieves both high strength and high conductivity.

[0018] As a further improvement of the present invention, in step S1, the AlCrCuFeNi high-entropy alloy particles are prepared by the following steps: Al, Cr, Cu, Fe, and Ni metal ingots are prepared according to the nominal proportions and obtained by suspension melting under vacuum conditions to obtain AlCrCuFeNi alloy ingots, followed by high-temperature atomization into powder. Further, the atomization temperature is 1773K; the atomization pressure is 4.5MPa.

[0019] This invention also discloses an AlCrCuFeNi high-entropy alloy particle-reinforced copper matrix composite material, which is prepared by the preparation method of AlCrCuFeNi high-entropy alloy particle-reinforced copper matrix composite material as described above. The resulting composite material has both high strength and excellent electrical conductivity.

[0020] This invention also discloses the application of the AlCrCuFeNi high-entropy alloy particle-reinforced copper-based composite material described above, for use in conductive elastic components.

[0021] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0022] First, the technical solution of this invention uses Al as its component. 15.38 Cr 15.38 Cu 15.38 Fe 15.38 Ni 38.48 High-entropy alloys are ball-milled with copper powder to refine and homogenize the grains, and then ultrafine-grained copper matrix is ​​prepared by spark plasma sintering (SPS). By combining grain refinement reinforcement and second-phase reinforcement, the limitations of single reinforcement methods are overcome, and better interfacial bonding between the two phases of the composite material can be achieved. The problem of interfacial wettability between the reinforcement and the matrix is ​​solved. While improving the strength of the composite material, high electrical conductivity is maintained. The final composite material exhibits excellent mechanical and electrical properties and has broad application prospects.

[0023] Second, the Al selected in the technical solution of this invention 15.38 Cr 15.38 Cu 15.38 Fe 15.38 Ni 38.48 High-entropy alloy powders have low production costs and economic advantages. This system's alloy and metal matrix contain the same element, Cu, which promotes inter-phase diffusion at the interface and overcomes the poor wettability of traditional ceramic particle-reinforced phases. The selected Al... 15.38 Cr 15.38 Cu 15.38 Fe 15.38 Ni 38.48Compared to other AlCrCuFeNi high-entropy alloy compositions, this high-entropy alloy system exhibits better thermal stability. Simultaneously, the dual-phase fcc+bcc structure ensures an excellent balance between strength and ductility, significantly reinforcing the copper matrix. Attached Figure Description

[0024] Figure 1 These are microscopic analysis images of the Ni2.5 high-entropy alloy powder prepared in Example 1 of this invention; where a) and b) are SEM images at different magnifications, c) is the EDS result of the boxed area in b) image, and d) is the XRD pattern.

[0025] Figure 2 This is the compressive stress-strain curve of the Ni2.5 high-entropy alloy powder prepared in Example 1 of this invention.

[0026] Figure 3 These are SEM images of 20wt.% Ni2.5 / Cu composite materials obtained at different sintering temperatures according to embodiments of the present invention; wherein, a) 493K, b) 533K, c) 573K, d) 613K, e) 653K, f) 693K, g) 733K, h) 773K.

[0027] Figure 4 These are the compressive stress-strain curves of the 20wt.% Ni2.5 / Cu composite material obtained at different sintering temperatures according to embodiments of the present invention.

[0028] Figure 5 The compressive yield strength and electrical conductivity of 20wt.% Ni2.5 / Cu composite materials obtained at different sintering temperatures according to embodiments of the present invention are measured.

[0029] Figure 6 These are SEM images and EDS results of Ni2.5 / Cu composite materials obtained with different Ni2.5 mass fractions according to embodiments of the present invention; wherein a) is 10 wt.%, b) is 20 wt.%, c) is 30 wt.%, d) is 40 wt.%, e) is 50 wt.%, and f) is the EDS results of Spot A and Spot B in a).

[0030] Figure 7These are statistical diagrams and grain distribution diagrams of the copper matrix of Ni2.5 / Cu composite material samples obtained with different Ni2.5 mass fractions (10wt.%, 30wt.%, and 50wt.%) according to embodiments of the present invention. Among them, a), b), and c) are statistical diagrams of the copper matrix of Ni2.5 / Cu composite material samples with 10wt.%, 30wt.%, and 50wt.%, respectively, and b), d), and f) are grain distribution diagrams of the copper matrix of Ni2.5 / Cu composite material samples with 10wt.%, 30wt.%, and 50wt.%, respectively.

[0031] Figure 8 These are the compressive stress-strain curves of Ni2.5 / Cu composite materials with different mass fractions according to embodiments of the present invention.

[0032] Figure 9 These are the conductivity variation curves of Ni2.5 / Cu composite materials with different mass fractions according to embodiments of the present invention.

[0033] Figure 10 The curves showing the change in electrical conductivity of Ni1 / Cu composite materials with different mass fractions in Comparative Example 5 of this invention are shown.

[0034] Figure 11 The curves showing the change in electrical conductivity of Ni1 / Cu composite materials with different mass fractions in Comparative Example 5 of this invention are shown. Detailed Implementation

[0035] The preferred embodiments of the present invention will be described in further detail below.

[0036] Example 1

[0037] A copper-based composite material reinforced with AlCrCuFeNi high-entropy alloy particles was prepared using the following steps:

[0038] Step S1: Prepare AlCrCuFeNi high-entropy alloy particles.

[0039] According to the atomic ratio, the composition of the AlCrCuFeNi high-entropy alloy is Al 15.38 Cr 15.38 Cu 15.38 Fe 15.38 Ni 38.48(Atomic ratio, abbreviated as Ni2.5, the same below), the powder was prepared by high-pressure gas atomization. Pure metal ingots of Al, Cr, Cu, Fe, and Ni with a purity of 99.99 wt.% (mass ratio) were prepared and, according to the nominal proportions, Ni2.5 alloy ingots were obtained by suspension melting under vacuum conditions. Then, the ingots were atomized into powder at a high temperature of 1773 K and a dynamic pressure of 4.5 MPa. The resulting powder had a regular shape, complete morphology, and was mainly spherical. The particle size of the powder after sieving was small (<25 μm). This alloy consists of simple fcc and bcc structures, with fcc being the main crystal structure of the atomized Ni2.5 alloy powder, such as... Figure 1 As shown. Figure 2 Demonstrating pure AI 15.38 Cr 15.38 Cu 15.38 Fe 15.38 Ni 38.48 The compressive stress-strain curves of the high-entropy alloy specimens show that the alloy exhibits an ultimate compressive strength exceeding 2000 MPa and excellent plasticity, demonstrating outstanding mechanical properties.

[0040] Step S2: The obtained high-entropy alloy powder and copper powder are mixed uniformly in a certain proportion by mechanical ball milling. In this embodiment, the Ni2.5 content is 20wt.%, the Cu content is 80wt.%, the ball milling speed is 275-475rpm, the ball-to-material ratio is 8:1-16:1, and the ball milling time is 2-3h. During this process, the grains of the matrix are refined.

[0041] Step S3: Perform discharge plasma sintering. Discharge plasma sintering is characterized by low-temperature and rapid sintering, which can achieve densification of composite materials and prevent grain coarsening. The sintering process is carried out under high pressure, with the sintering pressure set at 600 MPa, and a bulk composite material sample is obtained at a sintering temperature of 573 K.

[0042] Example 2

[0043] Based on Example 1, the difference in this example is that the sintering temperature is 613K, otherwise it is the same as Example 1.

[0044] Example 3

[0045] Based on Example 1, the difference in this example is that the sintering temperature is 653K, while the rest is the same as in Example 1.

[0046] Example 4

[0047] Based on Example 1, the difference in this example is that the sintering temperature is 693K, while the rest is the same as in Example 1.

[0048] Example 5

[0049] Based on Example 1, the difference in this example is that the sintering temperature is 733K, while the rest is the same as in Example 1.

[0050] Comparative Example 1

[0051] Based on Example 1, the difference in this comparative example is that the sintering temperature is 493K, while the rest is the same as in Example 1.

[0052] Comparative Example 2

[0053] Based on Example 1, the difference in this comparative example is that the sintering temperature is 533K, while the rest is the same as in Example 1.

[0054] Comparative Example 3

[0055] Based on Example 1, the difference in this comparative example is that the sintering temperature is 773K, while the rest is the same as in Example 1.

[0056] The SEM images of the Ni2.5 / Cu composite material samples obtained at different sintering temperatures in Examples 1 to 5 and Comparative Examples 1 to 3 are shown below. Figure 3 As shown in Table 1, the density and relative density values ​​of the samples are as follows.

[0057] Table 1. Density and relative density of Ni2.5 / Cu-based composite materials at different sintering temperatures

[0058]

[0059] from Figure 3 As can be seen, the composite material sample exhibits two phases with different contrasts in backscattered light mode. The darker, granular phase is the Ni2.5 reinforcing phase, and the lighter phase is the copper matrix phase. At sintering temperatures of 493 K and 533 K, the excessively low sintering temperatures resulted in incomplete sintering of the composite material, with a relative density below 98.7%. The microstructure of the sample revealed numerous porosity defects at the interface between the two phases, and these interface defects often fatally impair the overall performance of the composite material. When the sintering temperature was not lower than 573 K, the relative density of the composite material sample exceeded 99.0%, and no weak bonding surfaces were observed at the interface, indicating good bonding between the reinforcing particles and the copper matrix. The density of the composite material sample showed an increasing trend with increasing sintering temperature.

[0060] The compressive stress-strain curves of 20wt.% Ni2.5 / Cu composite materials prepared under different sintering temperatures are shown below. Figure 4 As shown, the variation law of compressive yield strength and electrical conductivity of the sample is as follows: Figure 5As shown, when the sintering temperature is 493K or 533K, the sintering quality is affected by the excessively low sintering temperature, and the strength, plasticity, and electrical conductivity of the composite material samples are all lower than those prepared at 573K. When the sintering temperature is 573K or 613K, the mechanical properties of the samples are comparable, and the electrical conductivity remains at around 46% IACS, without decreasing with increasing sintering temperature. However, as the sintering temperature continues to increase, the compressive strength of the samples improves, and the electrical conductivity shows a regular decrease, but at the sintering temperature of 733K, the electrical conductivity is still above 40% IACS. When the sintering temperature is 773K, the compressive yield strength reaches over 750MPa, and the electrical conductivity is around 37% IACS.

[0061] It is evident that excessively low sintering temperatures result in incomplete sintering of the composite material, leading to low strength and electrical conductivity in the composite sample. Conversely, excessively high sintering temperatures cause severe interdiffusion between the reinforcing phase and the matrix, increasing the composite strength but significantly reducing the electrical conductivity of the copper matrix. Therefore, a sintering temperature of 573K-733K is chosen. This temperature range comprehensively considers both the relative density and overall performance of the composite material, balancing the requirements for strength and electrical conductivity.

[0062] Example 6

[0063] Based on Example 4, the difference in this example is that in step S2, the mass percentage of AlCrCuFeNi high-entropy alloy particles is 10 wt.%; otherwise, it is the same as in Example 4.

[0064] Example 7

[0065] Based on Example 4, the difference in this example is that in step S2, the mass percentage of AlCrCuFeNi high-entropy alloy particles is 30 wt.%; otherwise, it is the same as in Example 4.

[0066] Example 8

[0067] Based on Example 4, the difference in this example is that in step S2, the mass percentage of AlCrCuFeNi high-entropy alloy particles is 40 wt.%; otherwise, it is the same as in Example 4.

[0068] Comparative Example 4

[0069] Based on Example 4, the difference in this comparative example is that in step S2, the mass percentage of AlCrCuFeNi high-entropy alloy particles is 50 wt.%; otherwise, it is the same as in Example 4.

[0070] Micrographs of copper-based composite materials reinforced with Ni2.5 high-entropy alloy particles at different mass fractions (10 wt.%, 20 wt.%, 30 wt.%, 40 wt.%, 50 wt.%) in Examples 4, 6-8, and Comparative Example 4 are shown below.Figure 6 As shown, with the increase of Ni2.5 addition, the amount of dark gray phase also increases. EDS results also indicate that the dark phase is the Ni2.5 reinforcing phase, and the light gray phase is the copper matrix. The composite material is sintered densely with no obvious pores.

[0071] Grain distribution diagrams and grain size statistics of Ni2.5 high-entropy alloy particle-reinforced copper matrix composites with different mass fractions (10 wt.%, 20 wt.%, 30 wt.%, 40 wt.%, 50 wt.%) are shown below. Figure 7 As shown, the grain size distribution is in the nanometer range, and the matrix grain size continuously decreases with the increase of the second phase addition. According to the Hall-Page equation, the strength gain effect brought by grain boundary strengthening in the composite material also increases accordingly. The compressive stress-strain curves of copper matrix composites reinforced with Ni2.5 high-entropy alloy particles of different mass fractions are shown in the figure. Figure 8 As shown in the figure, the strength of the composite material increases continuously with the increase of the second phase content. The electrical conductivity of the composite material is as follows: Figure 9 As shown, the electrical conductivity of the composite material decreases continuously with the increase of the second phase content. When 20 wt.% of Ni2.5 high-entropy alloy phase is added, the ultimate compressive strength of the composite material reaches 920±13 MPa, the yield strength is 722±9 MPa, and a high electrical conductivity of 44.3±1% IACS is maintained. When 30 wt.% of Ni2.5 high-entropy alloy phase is added, the ultimate compressive strength of the composite material exceeds 1000 MPa, the plasticity exceeds 12%, and the electrical conductivity exceeds 30% IACS, exhibiting excellent comprehensive performance.

[0072] Comparative Example 5

[0073] Based on Example 4, this comparative example uses an equiatomic-ratio AlCrCuFeNi high-entropy alloy (referred to as Ni1) as a comparative example to compare the effects. The compressive stress-strain curves of Ni1 / Cu composite materials with different mass fractions (10wt.%, 20wt.%, 30wt.%, 40wt.%, 50wt.%) are shown below. Figure 10 As shown, the conductivity variation curve is as follows: Figure 11 As shown, under the same conditions as Example 4, the 20wt.% Ni1 / Cu composite material sample had an ultimate compressive strength of 911±26MPa and a yield strength of 712±8MPa, but its conductivity was only 23.1±0.2% IACS. In contrast, the same mass percentage of the 20wt.% Ni2.5 / Cu composite material in the embodiment of the present invention achieved an ultimate compressive strength of 920±13MPa and a yield strength of 722±9MPa, while maintaining a high conductivity of 44.3±1% IACS. It is evident that the technical solution of the embodiment of the present invention has produced unexpected results.

[0074] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. A method for preparing AlCrCuFeNi high-entropy alloy particle-reinforced copper-based composite materials, characterized in that: Includes the following steps: Step S1: Prepare AlCrCuFeNi high-entropy alloy particles. According to the atomic ratio, the composition of the AlCrCuFeNi high-entropy alloy is Al... 15.38 Cr 15.38 Cu 15.38 Fe 15.38 Ni 38.48 ; Step S2: The AlCrCuFeNi high-entropy alloy particles are ball-milled and mixed with copper powder to achieve grain refinement and obtain a mixture; wherein the mass percentage of AlCrCuFeNi high-entropy alloy particles is 10-50 wt.%. Step S3: The mixture is subjected to discharge plasma sintering to obtain AlCrCuFeNi high-entropy alloy particle-reinforced copper-based composite material, wherein the sintering pressure is 500-700MPa and the sintering temperature is 573K-733K.

2. The preparation method of the AlCrCuFeNi high-entropy alloy particle-reinforced copper matrix composite material according to claim 1, characterized in that: In step S2, the mass percentage of the AlCrCuFeNi high-entropy alloy particles in the mixture is 20-40 wt.%.

3. The preparation method of AlCrCuFeNi high-entropy alloy particle-reinforced copper-based composite material according to claim 2, characterized in that: In step S2, the mass percentage of the AlCrCuFeNi high-entropy alloy particles in the mixture is 20-30 wt.%.

4. The preparation method of AlCrCuFeNi high-entropy alloy particle-reinforced copper-based composite material according to claim 2, characterized in that: In step S2, the ball milling speed is 275-475 rpm, the ball-to-material ratio is 8-16:1, and the ball milling time is 2-3 hours.

5. The preparation method of the AlCrCuFeNi high-entropy alloy particle-reinforced copper matrix composite material according to claim 1, characterized in that: In step S3, the sintering temperature is 653K-733K.

6. The method for preparing AlCrCuFeNi high-entropy alloy particle-reinforced copper-based composite material according to any one of claims 1 to 5, characterized in that: In step S1, the AlCrCuFeNi high-entropy alloy particles are prepared by the following steps: Al, Cr, Cu, Fe and Ni metal ingots are prepared according to the nominal ratio and obtained by suspension melting under vacuum conditions to obtain AlCrCuFeNi alloy ingots, and then atomized into powder at a temperature of 1773K and a pressure of 4.5MPa.

7. A copper-based composite material reinforced with AlCrCuFeNi high-entropy alloy particles, characterized in that: The AlCrCuFeNi high-entropy alloy particle-reinforced copper matrix composite material was prepared using the preparation method described in any one of claims 1 to 6.

8. The application of the AlCrCuFeNi high-entropy alloy particle-reinforced copper-based composite material as described in claim 7, characterized in that: Used in conductive elastic components.

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