A magnetron sputtering coating device
CN117737669BActive Publication Date: 2026-04-28CHINA BANKNOTE PRINTING & MINTING +1
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- CHINA BANKNOTE PRINTING & MINTING
- Filing Date
- 2023-11-28
- Publication Date
- 2026-04-28
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Figure CN117737669B_ABST
Abstract
The present application relates to banknote printing plate surface plating wear-resistant coating technical field, provide a kind of magnetron sputtering coating equipment, at least include: the body, the body has for plating film plating film cavity;High-energy pulse magnetron sputtering target, setting in plating film cavity;Intermediate frequency magnetron sputtering target, setting in plating film cavity.The magnetron sputtering coating equipment, plating film, using the characteristics of high-energy pulse magnetron sputtering target with superhigh peak pulse current, so that sputtering metal particles have higher sputtering energy bombardment to be plated film workpiece, can remove the oxide or organic impurities on the surface of to be plated film workpiece;Moreover, it is helpful to the thermal motion diffusion of sputtering metal particles in to be plated film workpiece substrate, to form a layer of primer layer with to be plated film workpiece substrate binding force more firm;Then, through intermediate frequency magnetron sputtering target on primer layer deposition functional coating, functional coating because with primer layer metal element identical, thereby solve the problem of sputtering coating and to be plated film workpiece bottom base binding force low.
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Citation Information
Patent Citations
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