Method and system for measuring panel unevenness

Abstract

The application discloses a kind of plate unevenness measurement method and system, method includes: the measured plate is placed on platform, select multiple first measurement points on measured plate, target mirror is placed in each first measurement point of measured plate in turn, when target mirror is placed in any first measurement point of measured plate, the spatial position of target mirror is obtained using laser tracking device, according to the spatial position corresponding to each first measurement point, the distance of each first measurement point to reference plane is obtained, to obtain the unevenness of measured plate.The plate unevenness measurement method and system of the application select measurement point on measured plate, measure the spatial position of each measurement point using laser tracking device, to obtain the unevenness of plate according to the spatial position of each measurement point obtained, compared with the method of traditional manual using measuring tool measurement, can improve measurement accuracy.

Description

Technical Field

[0001] This invention relates to the field of engineering measurement technology, and in particular to a method and system for measuring plate unevenness. Background Technology

[0002] The unevenness of a board refers to the ratio of the maximum wave height *d* between the board surface and the platform, measured when the board is placed freely on a platform, to the wavelength. The traditional method for measuring board unevenness involves placing the board freely on the platform, using a lightweight, flat ruler that will not bend under its own weight, and measuring the maximum distance *d* between the board surface and the ruler using a feeler gauge, micrometer, or scale. The board length *L*, width *W*, or chord length *l* are then measured using various tools, and the unevenness is calculated. This method has the following drawbacks: due to the use of traditional measuring tools and the difficulty in accurately measuring manually (e.g., accurately measuring the chord length *l*), the measurement results are not highly accurate.

[0003] Therefore, how to improve the measurement accuracy of plate unevenness has become a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0004] The purpose of this invention is to provide a method and system for measuring plate unevenness, which can improve measurement accuracy.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A method for measuring the flatness of a board includes:

[0007] Place the test board on the platform and select multiple first measurement points on the test board;

[0008] The target mirror is placed sequentially at each of the first measurement points of the test plate. When the target mirror is placed at any of the first measurement points of the test plate, the spatial position of the target mirror is obtained using a laser tracking device.

[0009] Based on the spatial position of each of the first measurement points, the distance from each of the first measurement points to the reference plane is obtained to obtain the unevenness of the plate under test. The reference plane represents the plane corresponding to the platform.

[0010] Optionally, obtaining the reference plane includes:

[0011] Multiple second measurement points are selected on the platform, and the target mirror is placed sequentially at each of the second measurement points on the platform. When the target mirror is placed at any of the second measurement points on the platform, the spatial position of the target mirror is obtained using a laser tracking device.

[0012] The reference plane is obtained based on the spatial position corresponding to each of the second measurement points.

[0013] Optionally, the selected plurality of second measurement points are evenly distributed on the platform.

[0014] Optionally, selecting multiple first measurement points on the test plate includes: sequentially selecting multiple first measurement points on the test plate along the length direction of the test plate;

[0015] Based on the spatial position corresponding to each of the first measurement points, the distance from each of the first measurement points to the reference plane is obtained, and the unevenness of the measured plate is obtained, including:

[0016] Based on the spatial position corresponding to each of the first measurement points, the distance from each of the first measurement points to the reference plane is obtained. The maximum distance and minimum distance from each of the first measurement points to the reference plane are found. The first maximum distance is obtained based on the difference between the maximum distance and the minimum distance.

[0017] The longitudinal unevenness of the test plate is obtained based on the first maximum distance and the length of the test plate.

[0018] Or / and, selecting multiple first measurement points on the test plate includes: sequentially selecting multiple first measurement points on the test plate along the width direction of the test plate;

[0019] Based on the spatial position corresponding to each of the first measurement points, the distance from each of the first measurement points to the reference plane is obtained, and the unevenness of the measured plate is obtained, including:

[0020] Based on the spatial position of each first measurement point, the distance from each first measurement point to the reference plane is obtained. The maximum and minimum distances from each first measurement point to the reference plane are found. The second maximum distance is obtained based on the difference between the maximum and minimum distances.

[0021] The lateral unevenness of the test plate is obtained based on the second maximum distance and the width of the test plate.

[0022] Optionally, selecting multiple first measurement points on the test plate includes: arbitrarily selecting multiple preset intervals on the test plate, and selecting multiple first measurement points within any of the preset intervals, wherein the preset intervals have a preset length;

[0023] Based on the spatial position corresponding to each of the first measurement points, the distance from each of the first measurement points to the reference plane is obtained, and the unevenness of the measured plate is obtained, including:

[0024] For any of the preset intervals, based on the spatial positions corresponding to each of the first measurement points within the preset interval, the distance from each of the first measurement points to the reference plane is obtained. The maximum and minimum distances from each of the first measurement points to the reference plane are then identified. Based on the difference between the maximum and minimum distances and the length of the preset interval, the local unevenness corresponding to the preset interval is obtained.

[0025] Find the maximum value among the local unevenness corresponding to each preset interval, and take the maximum value as the local unevenness of the test plate.

[0026] Optionally, based on the spatial position corresponding to each of the first measurement points, the distance from each of the first measurement points to the reference plane is obtained, in order to obtain the unevenness of the plate under test, including:

[0027] Based on the spatial position of each first measurement point, the distance from each first measurement point to the reference plane is obtained. The maximum and minimum distances from each first measurement point to the reference plane are found. The third maximum distance is obtained based on the difference between the maximum and minimum distances.

[0028] The overall unevenness of the tested plate is obtained based on the third maximum distance.

[0029] Optionally, at least three transverse measurement lines are drawn on the test plate, the at least three transverse measurement lines are evenly distributed, and the first measurement point is selected on the transverse measurement lines;

[0030] Or / and, draw at least three longitudinal measurement lines on the test plate, the at least three longitudinal measurement lines being evenly distributed, and select the first measurement point on the longitudinal measurement lines.

[0031] A plate unevenness measurement system includes a platform, a target mirror, a laser tracking device, and a control device, wherein the platform is used to place the plate to be measured;

[0032] The laser tracking device is used to obtain the spatial position of the target mirror when the target mirror is placed at any first measurement point of the test plate, wherein multiple first measurement points are selected on the test plate, and the target mirror is placed sequentially at each of the first measurement points of the test plate.

[0033] The control device is connected to the laser tracking device and is used to obtain the distance from each of the first measurement points to the reference plane according to the spatial position of each of the first measurement points, so as to obtain the unevenness of the plate under test. The reference plane represents the plane corresponding to the platform.

[0034] Optionally, placing the target mirror sequentially at each of the first measurement points on the test plate includes: controlling the target mirror to move so that the target mirror is sequentially placed at each of the first measurement points on the test plate.

[0035] As can be seen from the above technical solution, the plate unevenness measurement method provided by the present invention first places the plate to be tested on a platform, selects multiple first measurement points on the plate, and sequentially places a target mirror at each of the first measurement points on the plate. When the target mirror is placed at any of the first measurement points on the plate, a laser tracking device is used to obtain the spatial position of the target mirror. Based on the spatial position corresponding to each first measurement point, the distance from each first measurement point to the reference plane is obtained, thereby obtaining the unevenness of the plate. The plate unevenness measurement method of the present invention selects measurement points on the plate and uses a laser tracking device to measure the spatial position of each measurement point, so as to obtain the unevenness of the plate based on the obtained spatial position of each measurement point. Compared with the traditional method of manual measurement using measuring tools, it can improve the measurement accuracy.

[0036] The plate unevenness measurement system provided by the present invention can achieve the above-mentioned beneficial effects. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0038] Figure 1 A flowchart of a plate unevenness measurement method provided in an embodiment of the present invention;

[0039] Figure 2-1 This is a top view of the test plate in the first embodiment;

[0040] Figure 2-2 for Figure 2-1 A schematic diagram of the longitudinal unevenness of the plate under test is shown.

[0041] Figure 3-1 This is a top view of the test plate in the second embodiment;

[0042] Figure 3-2 for Figure 3-1 A schematic diagram of the lateral unevenness of the plate under test;

[0043] Figure 4-1 This is a top view of the test plate in the third embodiment;

[0044] Figure 4-2 for Figure 4-1A schematic diagram of the local unevenness of the plate under test;

[0045] Figure 5 This is a schematic diagram of the test board placed on the platform according to a specific embodiment of the present invention;

[0046] Figure 6 This is a schematic diagram of a plate unevenness measurement method according to an embodiment of the present invention;

[0047] Figure 7 A flowchart of a plate unevenness measurement method provided in another embodiment of the present invention;

[0048] Figure 8 This is a schematic diagram illustrating the use of a laser tracking device and a target mirror to measure the platform in a plate unevenness measurement method according to an embodiment of the present invention.

[0049] The reference numerals in the accompanying drawings include:

[0050] 10-Test plate, 11-Platform, 12-Target mirror, 13-Laser tracking device, 14-Longitudinal measurement line, 15-Transverse measurement line. Detailed Implementation

[0051] To enable those skilled in the art to better understand the technical solutions of this invention, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this invention.

[0052] Please refer to Figure 1 , Figure 1 A flowchart of a plate unevenness measurement method provided in this embodiment is shown in the figure. The plate unevenness measurement method includes the following steps:

[0053] S11: Place the test board on the platform and select multiple first measurement points on the test board;

[0054] S12: Place the target mirror sequentially at each of the first measurement points of the test plate. When the target mirror is placed at any of the first measurement points of the test plate, use a laser tracking device to obtain the spatial position of the target mirror.

[0055] S13: Based on the spatial position corresponding to each of the first measurement points, obtain the distance from each of the first measurement points to the reference plane, so as to obtain the unevenness of the plate under test, wherein the reference plane represents the plane corresponding to the platform.

[0056] When a target mirror is placed at any first measurement point on the test plate, a laser tracking device is used to measure the spatial position of the target mirror. The measured spatial position of the target mirror reflects the spatial position of the first measurement point on the test plate. Based on the measured spatial position of the first measurement point, the distance from the first measurement point to the reference plane is obtained. Furthermore, the unevenness of the test plate can be obtained based on the distances from each first measurement point on the test plate to the reference plane. This embodiment's plate unevenness measurement method selects measurement points on the test plate and uses a laser tracking device to measure the spatial position of each measurement point. The unevenness of the plate is then obtained based on the obtained spatial positions of each measurement point, which improves measurement accuracy compared to traditional methods using manual measuring tools.

[0057] A laser is emitted towards a target mirror via a laser tracking device. The laser beam is reflected back after hitting the target mirror, and measurement data is obtained from the reflected laser signal. The target mirror and laser tracking device form a laser tracking measurement system (Laser Tracker System). This system may include a laser tracking head (tracker), controller, user computer, reflector (target mirror), and measurement accessories. It is a high-precision, large-size measuring instrument used in industrial measurement systems. It integrates various advanced technologies such as laser interferometric ranging, photoelectric detection, precision mechanics, computer and control technology, and modern numerical calculation theory to track moving targets in space and measure their three-dimensional spatial coordinates in real time. It features high precision, high efficiency, real-time tracking measurement, quick installation, and easy operation, making it suitable for the assembly and measurement of large-size workpieces.

[0058] In this embodiment, a first measurement point is selected on the test board. The distribution of the selected first measurement point on the test board is not limited. In practical applications, the point can be selected according to the area of ​​unevenness to be detected on the board and the requirements for unevenness to be detected on the board.

[0059] For example, the unevenness of the board includes the longitudinal unevenness of the board. The evaluation method for the longitudinal unevenness of the board is: the percentage of the maximum wave height along the length of the board to the length of the board is taken as the longitudinal unevenness of the board. The maximum wave height along the length of the board can be understood as the difference in the vertical direction between the highest and lowest points of the board along the length of the board. (See reference...) Figure 2-1 and Figure 2-2 As shown, Figure 2-1 This is a top view of the test plate in the first embodiment. Figure 2-2 for Figure 2-1 The diagram shows the longitudinal unevenness of the plate under test. Figure 2-2 China Figure 2-1The test plate 10 is shown in the figure with a cross-section along AA. The longitudinal unevenness of the test plate 10 can be expressed as a percentage of d1 / L, where d1 represents the maximum wave height of the test plate 10 along its length, and L represents the length of the test plate 10. To detect the longitudinal unevenness of the test plate 10, multiple first measurement points can be selected sequentially along its length on the test plate 10.

[0060] The unevenness of a board can also include its lateral unevenness. The evaluation method for lateral unevenness is as follows: the percentage of the maximum wave height along the board's width to the board's width is taken as the lateral unevenness. The maximum wave height along the board's width can be understood as the vertical difference between the highest and lowest points of the board along that width. (See reference...) Figure 3-1 and Figure 3-2 As shown, Figure 3-1 This is a top view of the test plate in the second embodiment. Figure 3-2 for Figure 3-1 The diagram shows the lateral unevenness of the plate under test. Figure 3-2 China Figure 3-1 The test plate 10 is shown in a cross section along BB. As shown in the figure, the lateral unevenness of the test plate 10 can be expressed as a percentage of d2 / W, where d2 represents the maximum wave height of the test plate 10 along its width direction, and W represents the width of the test plate 10. To detect the lateral unevenness of the test plate 10, multiple first measurement points can be selected sequentially along its width direction on the test plate 10.

[0061] Optionally, to detect the longitudinal unevenness of the test plate 10, multiple first measurement points can be sequentially selected along the length of the test plate 10. Correspondingly, obtaining the distance from each first measurement point to the reference plane based on its spatial position, to determine the unevenness of the test plate 10, may include: obtaining the distance from each first measurement point to the reference plane based on its spatial position; finding the maximum and minimum distances from each first measurement point to the reference plane; obtaining a first maximum distance based on the difference between the maximum and minimum distances; and obtaining the longitudinal unevenness of the test plate 10 based on the first maximum distance and the length of the test plate 10. Selecting each first measurement point along the length of the test plate 10, querying the distance from each measurement point to the reference plane, finding the maximum and minimum distances, obtaining the first maximum distance based on the difference between the maximum and minimum distances, and the percentage of the first maximum distance to the length of the test plate 10 is the longitudinal unevenness of the test plate 10. Optionally, a measurement line, i.e. a longitudinal measurement line, can be drawn along the length of the plate being measured 10, and measurement points can be selected sequentially on the longitudinal measurement line.

[0062] Optionally, to detect the lateral unevenness of the test plate 10, multiple first measurement points can be sequentially selected along the width direction of the test plate 10. Correspondingly, obtaining the distance from each first measurement point to a reference plane based on its spatial position, to determine the unevenness of the test plate 10, may include: obtaining the distance from each first measurement point to the reference plane based on its spatial position; finding the maximum and minimum distances from each first measurement point to the reference plane; obtaining a second maximum distance based on the difference between the maximum and minimum distances; and obtaining the lateral unevenness of the test plate 10 based on the second maximum distance and the width of the test plate 10. Selecting each first measurement point along the width direction of the test plate 10, querying the distance from each measurement point to the reference plane, finding the maximum and minimum distances, obtaining the second maximum distance based on the difference between the maximum and minimum distances, and the percentage of the second maximum distance to the width of the test plate 10 is the lateral unevenness of the test plate 10. Optionally, a measurement line, i.e. a transverse measurement line, can be drawn on the test plate 10 along its width direction, and measurement points can be selected sequentially on the transverse measurement line.

[0063] The unevenness of a slab also includes local unevenness. The evaluation method for local unevenness is as follows: the percentage of the maximum wave height within any given interval length on the slab to that interval length is taken as the local unevenness. The interval length can also be called the chord length of the slab. (See reference...) Figure 4-1 and Figure 4-2 As shown, Figure 4-1 This is a top view of the test plate in the third embodiment. Figure 4-2 for Figure 4-1 The diagram shows a local unevenness of the plate under test. Figure 4-2 China Figure 4-1 The test plate 10 is shown in cross-section along CC. As shown, the local unevenness of the test plate 10 can be expressed as a percentage of d3 / l, where d3 represents the maximum local wave height of the test plate 10, and l represents the local chord length of the test plate 10. To detect the local unevenness of the test plate 10, intervals can be selected on the test plate 10, and multiple first measurement points can be selected within the corresponding intervals. An example can be found by referring to... Figure 5 , Figure 5The diagram illustrates a specific example of a test plate placed on a platform. The unevenness of a localized area on the surface of the test plate 10 can be measured. The chord length l can be measured along the length of the test plate 10, and measurement points can be selected within this localized area. Furthermore, by identifying the maximum and minimum distances from each of the first measurement points to the reference plane, the highest and lowest points among these first measurement points can be found, for example, the highest and lowest points in the vertical direction. The local unevenness is obtained based on the difference between the highest and lowest points in the vertical direction and the interval length, such as the chord length. The local unevenness can be expressed as a percentage of the ratio of the difference between the highest and lowest points in the vertical direction to the interval length.

[0064] Optionally, the local unevenness of the test plate 10 can also be obtained by the following method: Multiple preset intervals can be arbitrarily selected on the test plate 10, and multiple first measurement points can be selected within any preset interval. The preset interval has a preset length. Correspondingly, based on the spatial position corresponding to each first measurement point, the distance from each first measurement point to the reference plane is obtained. Obtaining the unevenness of the test plate 10 includes: for any preset interval, based on the spatial position corresponding to each first measurement point within the preset interval, the distance from each first measurement point to the reference plane is obtained; the maximum and minimum distances from each first measurement point to the reference plane are found; based on the difference between the maximum and minimum distances and the length of the preset interval, the local unevenness corresponding to the preset interval is obtained; the maximum value is found among the local unevennesses corresponding to each preset interval, and the maximum value is taken as the local unevenness of the test plate 10. For the local unevenness corresponding to each preset interval, the maximum value is found, and the maximum value is taken as the final local unevenness of the test plate 10. In practical applications, a preset interval can be selected on the test plate 10 according to the measurement requirements of the local unevenness of the plate. For example, the preset interval can be along the length or width direction of the test plate 10. The selected first measurement points within the preset interval can be distributed as evenly as possible.

[0065] In some embodiments, selecting multiple first measurement points on the test plate 10 includes: sequentially selecting multiple first measurement points along a measurement line on the test plate 10. Further, obtaining the distance from each first measurement point to a reference plane based on the spatial position of each first measurement point to obtain the unevenness of the test plate 10 may include: for each first measurement point on the measurement line, selecting first measurement points on the measurement line within a range defined by a preset length starting from the selected first measurement point; obtaining the distance from each first measurement point to the reference plane based on the spatial position of the selected first measurement points; finding the maximum and minimum distances from each first measurement point to the reference plane; and obtaining the local unevenness of the test plate within the range defined by the preset length starting from the selected first measurement point based on the difference between the maximum and minimum distances and the preset length. For example, suppose 15 first measurement points are selected along a measurement line on the test plate 10, with equal spacing of 'a' and a preset length of 'b' = 3a. Then, starting from the first first measurement point along the measurement line, select the first to fourth first measurement points. Based on the spatial positions of these measurement points, obtain the local unevenness within that range. Specifically, based on the spatial positions of these four first measurement points, obtain the maximum and minimum distances to the reference plane. The percentage of the difference between the maximum and minimum distances to a preset length b is taken as the local unevenness within that range. Similarly, starting from the second first measurement point, select the second to fifth first measurement points along the measurement line. Based on the spatial positions of these measurement points, obtain the local unevenness within that range. This process continues, using each subsequent first measurement point as a starting point to measure the local unevenness within the corresponding range. In this way, 12 local unevenness data points can be obtained along the measurement line. Alternatively, the maximum value of the 12 local unevenness data points can be taken as the local unevenness measurement result. In practical applications, the multiple first measurement points selected sequentially along the measurement line on the tested plate 10 can be equally spaced or unequally spaced. The preset length can be set according to the local unevenness measurement requirements of the plate. For example, in a specific instance, the preset length is 300 millimeters.

[0066] The unevenness of the board also includes overall unevenness, which can be evaluated and obtained by the following method: Based on the spatial position corresponding to each of the first measurement points, obtain the distance from each of the first measurement points to the reference plane; find the maximum and minimum distances from each of the first measurement points to the reference plane; obtain a third maximum distance based on the difference between the maximum and minimum distances; and obtain the overall unevenness of the board 10 under test based on the third maximum distance. The third maximum distance can be used as the overall unevenness of the board 10 under test. Optionally, the highest and lowest points among the first measurement points can be found, for example, the highest and lowest points in the vertical direction, and the difference between the highest and lowest points in the vertical direction can be used as the overall unevenness of the board 10 under test.

[0067] In some embodiments, at least three transverse measurement lines are drawn on the test plate 10, and first measurement points are selected on these transverse measurement lines. When at least three transverse measurement lines are drawn on the test plate 10, the transverse measurement lines are evenly distributed. Alternatively, at least three longitudinal measurement lines are drawn on the test plate 10, and first measurement points are selected on these longitudinal measurement lines. When at least three longitudinal measurement lines are drawn on the test plate 10, the longitudinal measurement lines are evenly distributed, such that the selected plurality of first measurement points on the test plate 10 are distributed as evenly as possible. The number of transverse and longitudinal measurement lines can be determined according to the dimensions of the test plate 10. Transverse measurement lines can be measurement lines drawn along the width direction of the test plate 10, and longitudinal measurement lines can be measurement lines drawn along the length direction of the test plate 10. For example, see [reference needed]. Figure 6 , Figure 6 This is a schematic diagram of a plate unevenness measurement method according to an embodiment. As shown in the figure, the plate to be tested 10 is placed on the platform 11, and five longitudinal measurement lines 14 and eight transverse measurement lines 15 are drawn on the plate to be tested 10. The five longitudinal measurement lines 14 are evenly distributed in the width direction, and the eight transverse measurement lines 15 are evenly distributed in the length direction.

[0068] In this embodiment, for each transverse / longitudinal measurement line, the transverse unevenness / longitudinal unevenness corresponding to the transverse / longitudinal measurement line can be obtained based on the first measurement point on the transverse / longitudinal measurement line, and the local unevenness corresponding to the transverse / longitudinal measurement line can also be obtained. Based on the large number of first measurement points determined by the transverse and longitudinal measurement lines on the test plate 10, the overall unevenness of the test plate 10 can be obtained.

[0069] Traditional manual measurement methods using measuring tools involve placing a flat, lightweight ruler (not bent by its own weight) on the board and measuring the maximum distance *d* between the board surface and the ruler using a feeler gauge, micrometer, or scale. This method has several drawbacks: limited data sampling; manual measurements are limited to the edges of the board, and the center of large boards, being too far from the edges, cannot be measured, leading to incomplete measurement and evaluation of board unevenness. In contrast, the board unevenness measurement method in this embodiment uses a laser tracking device and a target mirror. Measurement points can be arbitrarily selected on the board as needed. Furthermore, the selected measurement points on the board 10 are more comprehensive, resulting in more complete measurement data and a more comprehensive evaluation of board unevenness.

[0070] The reference plane represents the plane corresponding to the platform. In this embodiment, the distance of each first measurement point of the test board 10 relative to the platform is characterized based on the reference plane. In this embodiment, the method for setting the reference plane is not limited. In some implementations, the reference plane can be obtained by the following method: selecting multiple second measurement points on the platform 11, sequentially placing the target mirror 12 at each of the second measurement points on the platform 11, and using a laser tracking device 13 to obtain the spatial position of the target mirror 12 when it is placed at any of the second measurement points on the platform 11; obtaining the reference plane based on the spatial position corresponding to each of the second measurement points. (See reference...) Figure 7 , Figure 7 The flowchart of a plate unevenness measurement method provided in another embodiment allows for obtaining a reference plane corresponding to the platform before measuring the plate 10 under test.

[0071] In this embodiment, the number of second measurement points set on platform 11 is not limited. In practical applications, the number of second measurement points can be determined according to the size of platform 11. Preferably, the multiple second measurement points selected on platform 11 are evenly distributed on platform 11, that is, the second measurement points are set at relatively uniform positions on the surface of platform 11 for point measurement. This helps to improve the accuracy of obtaining the reference plane and improves the measurement precision. Based on the spatial position data corresponding to each measured second measurement point, data analysis can be performed to fit an optimal plane as the reference plane. For example, refer to... Figure 8 , Figure 8 The figure shows a schematic diagram of a plate unevenness measurement method using a laser tracking device and a target mirror to measure a platform. As shown, multiple second measurement points are selected on the platform 11, and the multiple second measurement points are distributed in an array and are uniformly positioned on the platform 11.

[0072] This embodiment also provides a plate unevenness measurement system, which can be used in conjunction with a reference. Figure 6The plate unevenness measurement system includes a platform 11, a target mirror 12, a laser tracking device 13 and a control device, wherein the platform 11 is used to place the plate 10 to be measured;

[0073] The laser tracking device 13 is used to obtain the spatial position of the target mirror 12 when the target mirror 12 is placed at any first measurement point of the test plate 10, wherein multiple first measurement points are selected on the test plate 10, and the target mirror 12 is placed sequentially at each of the first measurement points of the test plate 10.

[0074] The control device is connected to the laser tracking device 13 and is used to obtain the distance from each of the first measurement points to the reference plane according to the spatial position of each of the first measurement points, so as to obtain the unevenness of the plate under test 10. The reference plane represents the plane corresponding to the platform 11.

[0075] The plate unevenness measurement system of this embodiment selects measurement points on the plate to be tested and uses a laser tracking device to measure the spatial position of each measurement point. The unevenness of the plate is obtained based on the obtained spatial position of each measurement point, which can improve the measurement accuracy compared with the traditional method of measuring manually with measuring tools.

[0076] Placing the target mirror 12 sequentially at each of the first measurement points of the test plate 10 includes: controlling the target mirror 12 to move so that the target mirror 12 is sequentially placed at each of the first measurement points of the test plate 10.

[0077] In specific examples, the measurement process may include the following:

[0078] 1) After setting up the laser tracking device 13, power it on for laser preheating. Once it stabilizes, perform laser self-calibration. After calibration and inspection, enter measurement mode, such as... Figure 8 As shown, the target mirror 12 is placed on the flat base of the platform 11. Points are marked at relatively uniform positions on the surface of the platform 11 to measure the coordinate values. After the measurement is completed, the data is analyzed using instrument measurement and analysis software to fit an optimal plane.

[0079] 2) Place the test board 10 on the platform 11, such as... Figure 6As shown, first determine the number of transverse measurement lines 15 and longitudinal measurement lines 14 based on the geometric dimensions of the test plate 10, ensuring they are distributed as evenly as possible. Place the planar base at the starting point of the measurement lines on the test plate 10. The measurement analysis software can be set to various measurement modes, such as manual single-point measurement, stable point measurement, or fixed-distance measurement. Place the target mirror 12 on the planar base, move the base to begin measurement along the transverse measurement line 15 or longitudinal measurement line 14, and group and name the coordinates of the points marked on the transverse measurement line 15 and longitudinal measurement line 14 for subsequent data processing. After the measurement is completed, stop the measurement and proceed with data processing.

[0080] 3) For each transverse measurement line 15 / longitudinal measurement line 14, based on the measurement point data on this transverse measurement line 15 / longitudinal measurement line 14, the corresponding transverse unevenness / longitudinal unevenness can be obtained, as well as the corresponding local unevenness. Based on the measurement point data on each transverse measurement line 15 and longitudinal measurement line 14 on the tested plate 10, the overall unevenness of the tested plate 10 can be obtained. All the above data analysis is automatically generated by the software, and an unevenness report and coordinate point data diagram can be exported.

[0081] This embodiment divides the plate into multiple regions by marking transverse and longitudinal measurement lines on the plate. Then, the three-dimensional coordinates of the target mirror on each measurement line are obtained by a laser tracking device. The plate unevenness parameters are output in the form of a three-dimensional dot plot by computer-aided software. This method has the advantages of high measurement efficiency and high accuracy, and the unevenness output results are intuitive and easy to see.

[0082] The plate unevenness measurement method and system of this embodiment can be applied to measure the unevenness of various aluminum plates.

[0083] Compared with the prior art, this application has at least the following beneficial technical effects:

[0084] This application utilizes laser tracking measurement technology for data collection, which offers advantages over traditional measurement and analysis methods, including speed, accuracy, high precision, and ease of operation. It significantly improves the speed and accuracy of plate unevenness measurement, resulting in a substantial increase in analysis speed. By employing laser tracking measurement technology, this application achieves a technological upgrade, revolutionizing the traditional method of measuring plate unevenness using steel tape measures and feeler gauges. It overcomes the limitation of traditional techniques in measuring unevenness in the middle of the plate, significantly improving the detection method and greatly enhancing the quality of plate unevenness detection.

[0085] The plate unevenness measurement method and system provided by this invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this invention. It should be noted that those skilled in the art can make several improvements and modifications to this invention without departing from the principles of this invention, and these improvements and modifications also fall within the protection scope of the claims of this invention.

Claims

1. A method for measuring the flatness of a plate, characterized in that, include: Place the test board on the platform and select multiple first measurement points on the test board; The target mirror is placed sequentially at each of the first measurement points of the test plate. When the target mirror is placed at any of the first measurement points of the test plate, the spatial position of the target mirror is obtained using a laser tracking device. Based on the spatial position of each of the first measurement points, the distance from each of the first measurement points to the reference plane is obtained, so as to obtain the unevenness of the plate under test. The reference plane represents the plane corresponding to the platform. Selecting multiple first measurement points on the test plate includes: sequentially selecting multiple first measurement points on the test plate along the length direction of the test plate; Based on the spatial position corresponding to each of the first measurement points, the distance from each of the first measurement points to the reference plane is obtained, so as to obtain the unevenness of the plate under test, including: Based on the spatial position corresponding to each of the first measurement points, the distance from each of the first measurement points to the reference plane is obtained. The maximum distance and minimum distance from each of the first measurement points to the reference plane are found. The first maximum distance is obtained based on the difference between the maximum distance and the minimum distance. The longitudinal unevenness of the test plate is obtained based on the first maximum distance and the length of the test plate. Or / and, selecting multiple first measurement points on the test plate includes: sequentially selecting multiple first measurement points on the test plate along the width direction of the test plate; Based on the spatial position corresponding to each of the first measurement points, the distance from each of the first measurement points to the reference plane is obtained, so as to obtain the unevenness of the plate under test, including: Based on the spatial position of each first measurement point, the distance from each first measurement point to the reference plane is obtained. The maximum and minimum distances from each first measurement point to the reference plane are found. The second maximum distance is obtained based on the difference between the maximum and minimum distances. The lateral unevenness of the test plate is obtained based on the second maximum distance and the width of the test plate.

2. The method for measuring plate unevenness according to claim 1, characterized in that, Obtaining the reference plane includes: Multiple second measurement points are selected on the platform, and the target mirror is placed sequentially at each of the second measurement points on the platform. When the target mirror is placed at any of the second measurement points on the platform, the spatial position of the target mirror is obtained using a laser tracking device. The reference plane is obtained based on the spatial position corresponding to each of the second measurement points.

3. The method for measuring plate unevenness according to claim 2, characterized in that, The selected plurality of second measurement points are evenly distributed on the platform.

4. The method for measuring plate unevenness according to claim 1, characterized in that, Selecting multiple first measurement points on the test board includes: arbitrarily selecting multiple preset intervals on the test board, and selecting multiple first measurement points within any of the preset intervals, wherein the preset interval has a preset length; Based on the spatial position corresponding to each of the first measurement points, the distance from each of the first measurement points to the reference plane is obtained, so as to obtain the unevenness of the plate under test, including: For any of the preset intervals, based on the spatial positions corresponding to each of the first measurement points within the preset interval, the distance from each of the first measurement points to the reference plane is obtained. The maximum and minimum distances from each of the first measurement points to the reference plane are then identified. Based on the difference between the maximum and minimum distances and the length of the preset interval, the local unevenness corresponding to the preset interval is obtained. Find the maximum value among the local unevenness corresponding to each preset interval, and take the maximum value as the local unevenness of the test plate.

5. The method for measuring plate unevenness according to claim 1, characterized in that, Based on the spatial position corresponding to each of the first measurement points, the distance from each of the first measurement points to the reference plane is obtained, so as to obtain the unevenness of the plate under test, including: Based on the spatial position of each first measurement point, the distance from each first measurement point to the reference plane is obtained. The maximum and minimum distances from each first measurement point to the reference plane are found. The third maximum distance is obtained based on the difference between the maximum and minimum distances. The overall unevenness of the tested plate is obtained based on the third maximum distance.

6. The method for measuring plate unevenness according to claim 1, characterized in that, At least three horizontal measurement lines are drawn on the test plate, the at least three horizontal measurement lines are evenly distributed, and the first measurement point is selected on the horizontal measurement lines; Or / and, draw at least three longitudinal measurement lines on the test plate, the at least three longitudinal measurement lines being evenly distributed, and select the first measurement point on the longitudinal measurement lines.

7. A plate unevenness measurement system, characterized in that, It includes a platform, a target mirror, a laser tracking device, and a control device, wherein the platform is used to place the test plate; The laser tracking device is used to obtain the spatial position of the target mirror when the target mirror is placed at any first measurement point of the test plate, wherein multiple first measurement points are selected on the test plate, and the target mirror is placed sequentially at each of the first measurement points of the test plate. The control device is connected to the laser tracking device and is used to obtain the distance from each of the first measurement points to the reference plane according to the spatial position of each of the first measurement points, so as to obtain the unevenness of the plate under test. The reference plane represents the plane corresponding to the platform. Selecting multiple first measurement points on the test plate includes: sequentially selecting multiple first measurement points on the test plate along the length direction of the test plate; Based on the spatial position corresponding to each of the first measurement points, the distance from each of the first measurement points to the reference plane is obtained, so as to obtain the unevenness of the plate under test, including: Based on the spatial position corresponding to each of the first measurement points, the distance from each of the first measurement points to the reference plane is obtained. The maximum distance and minimum distance from each of the first measurement points to the reference plane are found. The first maximum distance is obtained based on the difference between the maximum distance and the minimum distance. The longitudinal unevenness of the test plate is obtained based on the first maximum distance and the length of the test plate. Or / and, selecting multiple first measurement points on the test plate includes: sequentially selecting multiple first measurement points on the test plate along the width direction of the test plate; Based on the spatial position corresponding to each of the first measurement points, the distance from each of the first measurement points to the reference plane is obtained, so as to obtain the unevenness of the plate under test, including: Based on the spatial position of each first measurement point, the distance from each first measurement point to the reference plane is obtained. The maximum and minimum distances from each first measurement point to the reference plane are found. The second maximum distance is obtained based on the difference between the maximum and minimum distances. The lateral unevenness of the test plate is obtained based on the second maximum distance and the width of the test plate.

8. The plate unevenness measurement system according to claim 7, characterized in that, Placing the target mirror sequentially at each of the first measurement points on the test plate includes: controlling the target mirror to move so that the target mirror is sequentially placed at each of the first measurement points on the test plate.

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