Method for integrally bonding a glass element to a support element and optical device

Abstract

The present invention relates to a method (100) for integrally bonding a glass element to a support element, the method (100) comprising the step (105) of inserting at least one contact element into a contact recess in the surface of the support element. Additionally, the method (100) comprises the step (110) of placing the glass element on a portion of the contact element that protrudes beyond the surface, and the step (115) of locally heating the contact element in order to connect the glass element to the support element via the contact element. The method (100) further comprises the step (210) of coating at least a portion of the contact recess (310) with a separation layer (315) prior to the insertion step (105).

Description

[0001] The present solution relates to a method for integrally bonding a glass element to a carrier element and to an optical device.

[0002] DE 10 2016 213 561 A1 describes a method in which materials with similar coefficients of thermal expansion are joined by bonding, soldering or fusion welding.

[0003] JP2005300976A discloses a method for connecting an optical component to a carrier element. The disadvantage is that the process stability of this method cannot be guaranteed for certain material combinations.

[0004] WO2006 / 034775A1 discloses a composite structure made of a zero - expansion material and a method for producing such a structure, the disadvantage of which is the use of an adhesive layer. This can lead to component failure due to aging. Summary of the Invention

[0005] Taking this into account, the present solution provides a method for integrally bonding a glass element to a carrier element and an optical device according to the independent claims. Advantageous embodiments result from the corresponding dependent claims and the following description.

[0006] For objects such as positioning devices or high - precision length or angle measuring devices, a flat glass surface needs to be firmly connected to a ceramic carrier. At the same time, these components may be subjected to temperature fluctuations during their handling, production and transportation. By the solution proposed here, a firm and adhesive - free connection between the glass and the ceramic can be achieved, which can have a flat surface even during operation at room temperature or another predefined operating temperature after heating related to handling or transportation.

[0007] A method for integrally bonding a glass element to a carrier element is proposed, wherein the method has a step of inserting at least one contact element into a contact recess in the surface of the carrier element. Additionally, the method includes a step of placing the glass element on a portion of the contact element that protrudes above the surface and a step of locally heating the contact element to connect the glass element to the carrier element via the contact element. For example, the glass element can be titanium-doped fused silica, which can have, for example, a TiO2 content of about 20 wt% or less. Additionally, the average linear thermal expansion coefficient (CTE) of the glass element can be, for example, 0 ± 30 ppb / °C from 5 °C to 35 °C, with a confidence level of 95% (ppb, parts per billion). For example, this is the case for ultra-low expansion glass. The carrier element can be, for example, a ceramic carrier made of silicon carbide (SiC) or a metal carrier. Other materials for the carrier element can be, for example, single-crystalline or polycrystalline solids such as silicon (Si), germanium, sapphire, diamond, or fused silica, or a mixture of silicon and silicon carbide (Si / SiC), in particular reaction-sintered, silicon-filtered silicon carbide material, or boron carbide B4C or silicon-filtered boron carbide (SiB4C) or AlN or Al2O3. When connecting the glass element to the carrier element, for example, by gluing or welding, any organic adhesive can introduce its typical shrinkage and thermal expansion properties into the rigid and low-expansion structures of silicon carbide and glass. In particular, the direct fusion welding of glass (e.g., ultra-low expansion glass) with a very low thermal expansion coefficient and Si / SiC ceramics can be problematic or even impossible due to the formation of carbon monoxide and additionally or alternatively carbon dioxide. Therefore, the insertion step proposed in this method first introduces the contact element into the contact recess in the carrier element, which can be designed, for example, from glass and can accordingly also be referred to as a glass dowel. For example, the contact element can be made of the same material as the glass element or a material with a lower melting temperature than the glass element. For example, the contact element can also be designed as a glass solder body, i.e., a shaped piece of glass solder, advantageously a low-melting-point soldering glass, where a stable glass solder can be advantageously used. In contrast to crystalline glass solder, a stable glass solder can behave like conventional glass. When the solder joint is reheated, its softening can exhibit the same temperature dependence as the previous soldering process. Advantageously, the contact element can have a lower softening temperature than the glass element. In the method proposed herein, such contact elements or similar contact elements are used to establish a connection between the carrier element and the glass element. For this purpose, the glass element is placed on a portion of one or more contact elements (if there are several) that protrude above the surface of the carrier element, with an air gap remaining between the surface of the carrier element and the glass element. In the local heating step, the glass element can thus be connected to the carrier element by material bonding via the contact element alone or, if several contact elements are provided, via the plurality of contact elements.Advantageously, this allows for example to produce a firm, material-bonded and at the same time adhesive-free connection between glass and ceramic. In the local heating step, the molten material from the contact element can wet the glass element to produce a connection in the sense of a soldering process. It is also possible that the molten material of the contact element bonds to the locally molten material of the glass element in order to establish a connection in the sense of a fusion welding process. If a plurality of contact elements are provided, the local heating step can be carried out successively for each of the contact elements. Alternatively, for example, a plurality of laser beams can be used to locally heat a plurality of contact elements simultaneously. During the local heating step, the carrier element and the glass element can have room temperature except for the local heating location. Alternatively, in the local heating step, the carrier element and the glass element can have a pre-determined temperature except for the local heating location, which can correspond to the expected operating temperature of the final arrangement.

[0008] Advantageously, a plurality of such contact elements can be provided, particularly advantageously at least three such contact elements, which are arranged spaced apart from one another. Particularly advantageously, more than ten contact elements are provided.

[0009] According to one embodiment, the method can have a step of forming a contact recess before the insertion step. For example, the contact recess can be inserted in the form of a pit, for example through an orifice, in a molding step. Alternatively, the carrier element, for example designed from ceramic, can be formed during the manufacturing process with a corresponding recess. The advantage of the forming step is that the contact recess can be optimally matched to the contact element to be inserted in the subsequent insertion step.

[0010] The method includes a step of coating at least a part of the contact recess with a separation layer before the insertion step. For example, the entire surface of the contact recess into which the contact element is inserted in the insertion step can be coated with the separation layer. The separation layer, which can also be referred to as a barrier layer, can be designed, for example, to have silicon (Si) or germanium (Ge) or refractory metals and additionally or alternatively oxides of the above-mentioned fabrics and additionally or alternatively refractory metal silicides in order to advantageously keep the carrier element designed, for example, from silicon carbide, chemically separated from the contact element. The separation layer can be provided to improve adhesion and additionally or alternatively prevent chemical reactions of the glass solder with the carrier element, which can, for example, lead to foaming of the glass solder when the glass solder melts.

[0011] According to another embodiment, the method may have a step of heating the contact element to connect the contact element to the carrier element, wherein the heating step may be performed after the insertion step. For example, the contact element may be used in a manner similar to glass solder, and the contact element may form a material connection with the carrier element when the temperature rises. For example, the contact element may be heated above the melting temperature of the contact element, which may also be referred to as the glass temperature, transition temperature, or softening temperature, where the softened glass may wet the carrier element or cover the barrier layer of the carrier element. Advantageously, the carrier element and the contact element or all of the provided plurality of contact elements may be heated together. The heating step may be performed, for example, as a furnace process using a conventional melting furnace (such as an industrial heating furnace using air or inert gas) or a vacuum heating furnace, or by a laser beam. The carrier element equipped with the provided contact elements or several carrier elements equipped with contact elements may be inserted into the furnace together. Alternatively, the step of heating the contact element to connect the contact element to the carrier element may be performed by local heating, where the carrier element is additionally maintained at room temperature. Advantageously, the heating step described in this part may create a time-saving and cost-effective connection between the carrier element and the contact element. Advantageously, the carrier element with the connected contact element may be cooled to room temperature after this step. Then, the step of reducing the thickness of this part and additionally or alternatively placing the glass element at room temperature may be performed.

[0012] According to another embodiment, in the heating step, the portion of the contact element protruding above the surface may be widened into a retaining ring and additionally or alternatively formed into a circular cap protruding in the normal direction of the glass plate. For example, after the insertion step, three-quarters of the contact element may be inserted into the carrier element, while one-quarter may protrude beyond the surface of the carrier element. In the heating step, the contact element may be particularly heated at the portion protruding above the surface, whereby this portion may expand to form a retaining ring and thus may have a radius larger than the radius of the contact recess. Advantageously, this may create a material connection between the surface of the carrier element and the contact element. Additionally or alternatively, this portion may form a circular cap during heating. Advantageously, the radius expansion of the contact element beyond the edge of the contact recess may be avoided or limited, and if necessary, the connection between the carrier element and the glass element may be locally limited to a minimum.

[0013] According to another embodiment, the method may include a step of reducing the thickness of the portion before the installation step. For example, the portion of the contact element protruding above the surface of the carrier element may be at least partially melted by a previous heating step, as a result of which the contact surface of the portion may have irregularities. Thus, the contact surface of the portion may be flattened in the reducing step. Advantageously, such irregular portions may be flattened, for example, by grinding during the reducing step. It is possible, for example advantageously, to achieve a protrusion of one or more contact elements on the surface of the carrier element between 10 μm and 200 μm. This allows a gap of a defined thickness to be created between the carrier element and the glass element. Residual deformations in the region of the surface of the contact element up to a few micrometers (for example, up to 0.1 μm) can be removed by, for example, grinding and polishing processes. Advantageously, the contact element may be processed in the reducing step in such a way that the glass element can be placed on a flat surface in a subsequent placement step. Additionally, if a plurality of contact elements are provided, these contact elements may be flattened in such a way that their flat surfaces lie in a common plane. This allows the glass element to be placed flat on the contact element or, if a plurality of contact elements are provided, flat on the plurality of contact elements. This allows the connection process to be optimized and additionally or alternatively the strength of the subsequent connection between the carrier element and the glass element to be optimized. The flatness of both of the flattened surfaces of each contact element and the deviation from the common plane may advantageously be less than 1 μm.

[0014] According to another embodiment, the contact element may be inserted in the insertion step using a reactive soldering process. For example, reactive soldering may be performed as an alternative to an additional heating step in order to advantageously save time and cost.

[0015] According to another embodiment, the contact element can be heated using a laser beam in the local heating step. For example, a spot heat connection process such as spot laser welding can be used in the local heating step, where the glass dowel (contact element) can be locally irradiated with a laser beam, for example through a glass element, in order to melt the contact element and connect it to the glass element. Advantageously, the contact element can be heated above its melting temperature, where the softened glass of the glass dowel can wet the glass element. During the connection of the glass element to the contact element, it can be advantageous to use a laser beam to keep the temperature of the carrier element at room temperature in order to avoid bending during subsequent cooling to room temperature. For example, the connection between the glass element and the contact element can be achieved by short pulses. This has the advantage that heating is only carried out very locally, and heating of the entire component as in soldering or welding or adhesive tempering can be avoided. Therefore, the use of laser welding is particularly advantageous because this method enables a locally sufficient temperature increase for the welding process to be achieved by short laser pulses while keeping the temperature of the carrier element almost constant. Alternatively, for example, a laser can be used to initiate a reactive bonding process.

[0016] According to another embodiment, in the insertion step, the shape of the contact element can be cylindrical or spherical or partially spherical or oval or annular. For example, the contact element can be formed as a glass cylinder, which can be inserted into the contact recess of the carrier element and firmly connected to the carrier element. Advantageously, such cylinders or one of the above-mentioned molds can be produced and stored cost-effectively.

[0017] According to another embodiment, the glass element and the carrier element can be connected in the local heating step to produce an optical device. For example, the optical device can be used as part of a positioning device, such as an encoder for an xy workbench (xy platform) or an angle encoder for a goniometer, where the material connection between the carrier element and the glass element can advantageously extend the range of use of the optical device and increase its load-bearing capacity.

[0018] According to another embodiment, the method may include the steps of providing a carrier element in the form of a ceramic element, and additionally or alternatively providing a glass element in the form of an ultra-low expansion glass, and additionally or alternatively providing a contact element in the form of a borosilicate glass element. For example, the carrier element may be designed from silicon carbide (SiC) or silicon carbide nitride (Si / SiC), whereby the carrier element may advantageously have a particularly high hardness and high temperature resistance. As a so-called ultra-low expansion glass, the glass element may advantageously have a very low coefficient of thermal expansion and may accordingly be used in various devices, such as a carrier for a large telescope mirror in a reflecting telescope. Borosilicate glass may be used, for example, as a contact element for connecting the carrier element to the glass element. Similar to a glass solder, borosilicate glass may form a material connection with both the carrier element and the glass element, for example. The contact element may have a higher coefficient of thermal expansion than the carrier element, which may result in mechanical stress in the case of temperature changes, for example, when the contact element cools after having been connected to the carrier element, which may cause the contact element to tear off from the carrier element, for example. Contact elements with small dimensions may be used to minimize the mechanical stress to a non-significant level. For example, the maximum linear dimension of each contact element may be less than 1 mm. To ensure the required strength of the connection between the glass element and the carrier element, a corresponding number of contact elements may be provided. Advantageously, the contact element may have a lower coefficient of thermal expansion than the carrier element. Then, especially when providing cylindrical contact elements and cylindrical recesses in the carrier element, in addition to the material connection, a clamping effect of the contact element in the carrier element may be achieved. Alternatively, the contact element may have a coefficient of thermal expansion similar to that of the carrier element, whereby when the temperature changes, for example, during a soldering process or during heating of the contact element to connect the contact element to the carrier element, the contact element may undergo stress changes similar to those of the carrier element. The contact element and the carrier element may remain free of mechanical stress when cooled together to room temperature, for example, 20 °C. Advantageously, when using borosilicate glass, a separation layer may be omitted for both the carrier element and the contact element. For the purposes of this paragraph, the coefficient of thermal expansion may be taken as the average between the softening temperature of the contact element and room temperature.

[0019] According to another embodiment, in the insertion step, a plurality of contact elements may be inserted into a plurality of contact recesses in the surface of the carrier element. In this case, the plurality of contact recesses may be arranged in a line. For example, the plurality of contact recesses may be arranged in the form of a line seam along a closed curve, such as a circle, or along a rectangular shape. Advantageously, the stability of the connection may be increased by using a plurality of contact elements.

[0020] According to another embodiment, pressure can be applied to the glass element at least temporarily during the local heating step in order to press the glass element against the contact element. For example, mechanical pressure can be applied locally or over the entire surface of the glass element. Advantageously, this can accelerate the connection of the glass element to the contact element. It can also ensure that the glass element contacts the contact element. This ensures that the material melted on the contact element during the local heating step can wet the glass element. After wetting the glass element with the locally melted material of the contact element, the contact pressure can be reduced or removed to avoid mechanical tension.

[0021] Additionally, an optical device having a carrier element and a glass element is proposed, the carrier element having a contact recess, wherein the carrier element and the glass element are connected to each other by a contact element inserted into the contact recess. The optical device can be produced, for example, using a variation of the method described above. Advantageously, such optical devices can be used in light engines or sensor modules such as optical encoders or other high-precision optical modules. There, such component units may be required to ensure the desired characteristics without bending or thermal drift.

[0022] According to one embodiment, the optical device can have an optical sensor device for detecting length and additionally or alternatively for detecting geometric position. For example, the glass element for this purpose can have geometric measurement embodiments such as position marks or scale marks. Advantageously, the optical device can thus be used as a sensing system or as part of such a system, for example as part of an encoder in an xy platform or as an angular encoder of a goniometer.

[0023] Exemplary embodiments of the method proposed herein are shown in the drawings and are explained in more detail in the following description. The following drawings are shown:

[0024] Figure 1 An exemplary embodiment of a method for integrally bonding a glass element to a carrier element is shown;

[0025] Figure 2 An exemplary embodiment of a method for integrally bonding a glass element to a carrier element is shown;

[0026] Figure 3 A schematic view of an exemplary embodiment of a carrier element with an inserted contact element is shown;

[0027] Figure 4 shows a schematic view of an exemplary embodiment of a carrier element with an inserted contact element;

[0028] Figure 5 A schematic view of an exemplary embodiment of a carrier element with an inserted contact element is shown;

[0029] Figure 6Schematic diagram showing an exemplary embodiment of a carrier element with an attached glass element;

[0030] Figure 7 Schematic diagram showing an exemplary embodiment of a carrier element with an attached glass element;

[0031] Figure 8 Schematic diagram showing an exemplary embodiment of an optical device; and

[0032] Figure 9 Schematic top view showing an exemplary embodiment of a carrier element with an arrangement of a plurality of contact recesses.

[0033] In the following description of advantageous exemplary embodiments of the present invention, the same or similar reference numerals are used for elements shown in the various figures and having similar effects, and the repeated description of these elements is omitted.

[0034] Figure 1 Flowchart showing an exemplary embodiment of a method 100 for integrally bonding a glass element to a carrier element. By way of example only, the carrier element is a ceramic carrier made of silicon-filtered silicon carbide (Si / SiC), and the glass element is a glass plate made of so-called ultra-low expansion glass. For example, Si / SiC can have a thermal expansion coefficient of only 4 ppm / K between room temperature and 1000 °C. Method 100 includes a step 105 of inserting at least one contact element into a contact recess in the surface of the carrier element. In this exemplary embodiment, the contact element is inserted only using a reactive brazing process. In a variant of the exemplary embodiment, a furnace process can be used. Furthermore, method 100 includes a step 110 of placing the glass element on a portion of the contact element that protrudes above the surface of the carrier element, where, by way of example only, the glass plate is aligned parallel to the surface of the carrier element and is in mechanical contact with the contact element. Thereby, an air gap is created between the surface of the carrier element and the glass element. In the subsequent local heating step 115, the contact element is heated in order to connect the glass element to the carrier element via the contact element. In this exemplary embodiment, the mechanical connection between the glass element and the contact element is achieved only by spot welding with a laser beam, which indirectly establishes the connection between the glass element and the carrier element. The laser beam used here is set only to a short pulse, for example with a duration of 10 nanoseconds, in order to locally heat the contact element and the glass element. The use of short pulses enables very local heating only, rather than heating the entire component as in conventional brazing or welding or adhesive tempering. In this exemplary embodiment, the glass element and the carrier element are connected in the local heating step in order to produce an optical device.

[0035] Figure 2A flowchart showing an exemplary embodiment of a method 100 for integrally bonding a glass element to a carrier element is presented. The method 100 shown herein is the same as or similar to the method described in the previous figures, except that the method 100 shown herein includes additional optional steps.

[0036] In one exemplary embodiment, method 100 has a step 200 of providing a carrier element in the form of a ceramic element, a glass element in the form of an ultra-low expansion glass, and a contact element in the form of a borosilicate glass element. The contact element is made of borosilicate glass, and the carrier element is made of Si / SiC ceramic. In this exemplary embodiment, the borosilicate glass has a different coefficient of thermal expansion from the Si / SiC carrier element between the fusion welding temperature and room temperature. For example, the coefficient of thermal expansion of the borosilicate glass is 3.25 ppm / K between room temperature and 300 °C, and the coefficient of thermal expansion of Si / SiC is 4.0 ppm / K. In this exemplary embodiment, the contact element has a relatively small size such that the thermal expansion difference does not cause the contact element to detach from the carrier element during cooling.

[0037] In one exemplary embodiment, after the providing step 200, there is a step 205 of forming a contact recess. The contact recess is inserted into the carrier element, for example, only through an orifice and is sized to match the contact element.

[0038] In one exemplary embodiment, the contact recess is subsequently coated with a separation layer in a coating process step 210. In this exemplary embodiment, the separation layer, which can also be referred to as a barrier layer, is designed to have silicon in order to chemically separate the carrier element from the contact element. In another exemplary embodiment, the separation layer can, for example, additionally or alternatively have germanium (Ge) or a refractory metal or an oxide of said fabric and additionally or alternatively have a refractory metal silicide. In this exemplary embodiment, after the coating step 210, there is a step 105 of inserting the contact element into the coated contact recess of the carrier element. In one exemplary embodiment, in the forming step, a plurality of contact recesses can also be formed in the surface of the carrier element, and in the inserting step, a plurality of contact elements can be inserted into the plurality of contact recesses. In this case, the plurality of contact recesses can be arranged in a line. For example, the plurality of contact recesses can be arranged along a closed curve (such as a circle) or in the form of a line seam along a rectangular shape.

[0039] In an exemplary embodiment, after the insertion step 105, there is a step 215 of heating the contact element to connect the contact element to the carrier element. For example, the contact element and the optional carrier element are heated to a connection temperature that enables a material-locking connection between the contact element and the carrier element. By way of example only, the heating step 215 is carried out as a furnace process using a conventional melting furnace. In another exemplary embodiment, a vacuum furnace or heating by a laser beam can be used. In this exemplary embodiment, the portion of the contact element protruding above the surface of the carrier element expands into a retaining ring by heating, where this portion is only melted, for example. Subsequently, in this exemplary embodiment, the component is cooled in order to permanently connect the contact element to the carrier element. Since the borosilicate glass element and the Si / SiC ceramic element in this exemplary embodiment have different coefficients of thermal expansion, the heating step 215 (including only cooling to room temperature, for example 20 °C) can still be carried out with a relatively low mechanical stress by using small-sized contact elements. In another exemplary embodiment, mechanical stress or inhomogeneities can be caused by welding. For example, during welding, the entire component can be heated to the welding temperature. When cooled to room temperature, the joint position can be fixed at the solidification temperature of the solder, such that if the coefficients of expansion of the welded parts are different, thermal-induced stresses are generated by cooling, which can lead to bending of the surface. This effect is equivalent to bonding, where the solidification temperature of the solder can correspond to the glass transition temperature of the adhesive.

[0040] In an exemplary embodiment, in the method 100 shown herein, after the heating step 215, there is a reducing step 220. For example, only the thickness of the portion of the cooled contact element protruding above the surface of the carrier element is ground and polished, thereby producing a flat surface of the contact element. This removes any residual deformation of the surface of the contact element. In an exemplary embodiment having a plurality of contact elements, the surfaces of several existing contact elements can also be levelled into a common plane. A flatness of less than 1 μm is achieved only by way of example. In the next step 110, the glass element is placed on this flat surface facing away from the carrier element.

[0041] This is followed by a step 115 of locally heating to connect the glass element to the carrier element via the contact element. Thus, in this exemplary embodiment, the step 115 of locally heating is performed using a laser beam. Here, the laser beam is guided, for example, only above the surface of the contact element in order to firmly connect the contact element to the glass element. At the same time, in this step 115 of local heating, pressure is applied to the glass element in order to press the glass element against the contact element. The pressure can be applied, for example, over the entire surface by placing another glass element on the glass element, or only locally in the area of the contact element. In this exemplary embodiment, the glass element has a lower coefficient of thermal expansion than the carrier element, but due to the punctiform connection between the glass element and the carrier element, this does not result in any mechanical stress, which is produced only by local heating.

[0042] Figure 3 A schematic view of an exemplary embodiment of a carrier element 300 with an inserted contact element 305 is shown. By way of example only, the carrier element is an element made of Si / SiC ceramic, and the contact element 305 is a cylindrical element made of borosilicate glass (also known as glass solder). In another exemplary embodiment, the shape of the contact element can also be spherical or partially spherical or elliptical or annular. In this exemplary embodiment, the cylindrical contact element 305 is adapted to the shape of the contact recess 310 into which the contact element 305 is inserted. In this exemplary embodiment, the contact recess 310 is coated with a separation layer 315 in order to chemically separate the contact element 305 from the carrier element 300. In this exemplary embodiment, the carrier element 300 also has a further contact recess 320, which is coated with a further separation layer 325 and into which a further contact element 330 is inserted. The further contact element 330 is designed to be equivalent to the contact element 305.

[0043] Figure 4A and Figure 4B A schematic view of an exemplary embodiment of a carrier element 300 with an inserted contact element 305 is shown. The carrier element 300 and the contact element 305 shown here correspond to or are similar to the carrier element and the contact element described in the previous Figure 3 . The different possible shapes of the contact element are shown in Figure 4A and Figure 4B . In Figure 4A and Figure 4B both, the carrier element 300 in this exemplary embodiment includes, in addition to the contact element 305 arranged in the contact recess 310, a further contact element 330 arranged in a further contact recess 320. The contact element 305 and the further contact element 330 are shown in the figures here after the heating step. InFigure 4A In this case, due to the heating in this exemplary embodiment, the portion 405 of the contact element 305 that protrudes above the surface 400 of the carrier element 300 is widened into a retaining ring and is connected to the surface 400 by material bonding. Correspondingly, another portion 410 of the additional contact element 330 is also widened and is connected to the surface 400 by material bonding. On the other hand, in Figure 4B this case, both the portion 405 of the contact element 305 and the another portion 410 of the additional contact element 330 are formed into circular caps. In other words, in the exemplary embodiment shown here, the two dowels are fused and firmly connected to the carrier element 300.

[0044] Figure 5 A schematic view of an exemplary embodiment of a carrier element 300 with an inserted contact element 305 is shown. The carrier element 300 and the contact element 305 shown here correspond to or are similar to the carrier element and the contact element described in the previous Figure 3 and FIG. 4, where in this exemplary embodiment, the carrier element 305 has an additional contact element 330 in addition to the contact element 305. In the illustration shown here, the contact element 305 and the additional contact element 330 after the reduction step as described above are shown. Therefore, the portion 405 of the contact element 305 and the another portion 410 of the additional contact element 330 are flattened in order to optimize the receiving portion for the glass element. Figure 2

[0045] Figure 6 Figure 3 A schematic view of an exemplary embodiment of a carrier element 300 with an attached glass element 600 is shown. The carrier element 300 shown here corresponds to or is similar to the carrier element described in the previous Figure 5 , FIG. 4 and this case. The contact elements 305, 330 are arranged in the carrier element 300, and these contact elements are melted in the previous heating step and flattened in the reduction step. In the illustration shown here, the glass element 600 is placed on the portions 405, 410 of the contact elements 305, 330 that protrude above the surface 400 of the carrier element 300. The glass element 600 (which may also be referred to as a glass sheet or a glass plate) is only an example of a so-called ultra-low expansion glass, which has a different expansion coefficient from that of the carrier element 300. The glass element is aligned parallel to the surface 400 of the carrier element 300. The thickness of the portions 405, 410 results in an air gap 605 between the carrier element 300 and the glass element 600.

[0046] Figure 7 ​Schematic diagram showing an exemplary embodiment of a carrier element 300 with an attached glass element 600. The carrier element 300 and the glass element 600 shown here correspond to or are similar to the carrier element and the glass element described previously in Figure 6 The carrier element 300, the contact elements 305, 330, and the glass element 600 are shown during a local heating step. The portions 405, 410 serve as bonding surfaces for attaching the glass element 600. A laser beam 700 is guided through the glass element 600 onto another contact element 330 to locally heat the other contact element. Accordingly, the contact element 305 is heated with another laser beam or subsequently with the realigned laser beam 700. By heating the contact elements 305, 330 connected to the carrier element 300, the glass element 600 can be indirectly connected to the carrier element 300, with an air gap 605 remaining between the carrier element 300 and the glass element 600. According to the exemplary embodiment, during local heating, the glass element 600 is pressed onto the contact elements 305, 330.

[0047] Figure 8 Schematic top view showing an exemplary embodiment of an optical device 800. In this exemplary embodiment, the optical device 800 includes a carrier element 300, which is the same as or similar to the carrier element described previously in Figure 3 , FIG. 4, Figure 5 , Figure 6 and Figure 7 . The carrier element 300 of the device 800 is materially connected to the glass element 600 by the method described in the previous Figure 1 and Figure 2 . In this exemplary embodiment, a sensor device 805 is arranged on the glass element 600, which is merely an example of a position marker for determining a geometric position. By way of example only, the optical device 800 is an xy encoder.

[0048] Figure 9 Schematic top view showing an exemplary embodiment of a carrier element 300 of an arrangement 900 having a plurality of contact recesses 310. The carrier element 300 shown here corresponds to or is similar to the carrier element described previously in Figure 3 , FIG. 4, Figure 5 , Figure 6 , Figure 7 and Figure 8 and has a plurality of contact recesses, all of which are similar to those described previously in Figure 3 , FIG. 4, and Figure 6The contact recesses described in. In this exemplary embodiment, the arrangement 900 includes more than twenty (exemplarily twenty-six) contact recesses 310 and is only exemplarily rectangular in shape. In another exemplary embodiment, for example, twenty or more contact recesses 310 may be arranged along a plurality of rings. For example, the inner ring may have a diameter of 20 mm, the middle ring may have a diameter of 40 mm, and the outer ring may have a diameter of 60 mm.

Claims

1. A method (100) for integrally bonding a glass element (600) to a carrier element (300), characterized in that, The method (100) comprises the following steps: Inserting (105) at least one contact element (305) into a contact recess (310) in a surface (400) of the carrier element (300); Heating (215) the contact element (305) to connect the contact element (305) to the carrier element (300), and cooling the carrier element (300) and its connected contact element (305) to room temperature; Placing (110) the glass element (600) on a portion (405) of the contact element (305) protruding above the surface (400); and Locally heating (115) the contact element (305), the molten material from the contact element (305) wetting the glass element (600) or the molten material of the contact element (305) bonding to the locally molten material of the glass element (600), so as to connect the glass element (600) to the carrier element (300) via the contact element (305); wherein the method (100) further comprises a step (210) of coating at least a part of the contact recess (310) with a separation layer (315) before the inserting (105) step.

2. The method (100) according to claim 1, characterized in that, Including a step (205) of molding the contact recess (310) before the inserting (105) step.

3. The method (100) according to claim 1 or 2, characterized in that, The separation layer (315) is designed from silicon (Si) or germanium (Ge) or a refractory metal or a refractory metal silicide.

4. The method (100) according to claim 1, characterized in that, In the heating step (215), the portion (405) of the contact element (305) protruding above the surface (400) is widened into a retaining ring and / or formed into a round cap.

5. The method (100) according to claim 1 or 2, characterized in that, Including a step (220) of reducing the thickness of the portion (405) of the contact element (305) protruding above the surface (400) to flatten the contact surface of the portion (405) of the contact element (305) protruding above the surface (400) before the placing (110) step.

6. The method (100) according to claim 1 or 2, characterized in that, In the inserting (105) step, a reactive soldering process is used to insert the contact element (305).

7. The method (100) according to claim 1 or 2, characterized in that, In the local heating (115) step, a laser beam (700) is used to heat the contact element (305).

8. The method (100) according to claim 1 or 2, characterized in that, In the inserting (105) step, the contact element (305) is shaped as cylindrical or spherical or partially spherical or elliptical or annular.

9. The method (100) according to claim 1 or 2, characterized in that, In the local heating (115) step, the glass element (600) and the carrier element (300) are joined to produce an optical device (800).

10. The method (100) according to claim 1 or 2, characterized in that, Including a step (200) of providing the carrier element (300) in the form of a ceramic element and / or the glass element (600) in the form of an ultra-low expansion glass and / or the contact element (305) in the form of a borosilicate glass element.

11. The method (100) according to claim 1 or 2, characterized in that, In the inserting (105) step, a plurality of contact elements (305) are inserted into a plurality of contact recesses (310) in the surface (400) of the carrier element (300), wherein the plurality of contact recesses (310) are arranged in a line.

12. The method (100) according to claim 1 or 2, characterized in that, During the local heating (115) step, pressure is applied to the glass element (600) to press the glass element (600) against the contact element (305).

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