Heat dissipation control method and device, electronic equipment and computer readable storage medium

Abstract

The application provides a heat dissipation control method and device, electronic equipment and a computer readable storage medium. The method comprises: obtaining a temperature increment K corresponding to a target device at a current time and a temperature change trend value P corresponding to the target device at the current time; the P is equal to the difference between the temperature increment K corresponding to the current time and the temperature increment corresponding to a previous time; determining a heat dissipation level of the current time according to the K and the P of the current time; and performing heat dissipation on the target device according to a heat dissipation strategy corresponding to the heat dissipation level of the current time; wherein the heat dissipation ability of the heat dissipation strategies corresponding to different heat dissipation levels is different. The application can more accurately provide heat dissipation services for the target device, and to a certain extent, achieve the effect of fine heat dissipation control on the target device.

Description

Technical Field

[0001] This application relates to the field of thermal management technology, and more specifically, to a heat dissipation control method, apparatus, electronic device, and computer-readable storage medium. Background Technology

[0002] The use or operation of devices (such as chips) can cause the chip temperature to rise, which in turn affects the device's operation and lifespan, and also impacts user experience. For example, excessively high chip temperatures can lead to unstable transistor operation, causing calculation errors or system crashes; it also accelerates transistor aging and degradation, shortening the device's lifespan. For users, excessively high chip temperatures can cause discomfort, affecting operation and use; it can also harm the user's skin and eyes, and even pose safety hazards such as burns or fires.

[0003] To prevent the aforementioned problems caused by overheating, heat sinks are typically installed outside the device. These heat sinks activate when the device temperature exceeds a safe temperature threshold, dissipating heat. However, this method provides only a rudimentary cooling solution and cannot meet the increasingly sophisticated thermal management requirements of electronic devices. Summary of the Invention

[0004] The purpose of this application is to provide a heat dissipation control method, device, electronic device, and computer-readable storage medium to provide more precise heat dissipation services.

[0005] This application provides a heat dissipation control method, including: obtaining the temperature increment K of a target device at the current moment, and the temperature change trend value P of the target device at the current moment; wherein P is equal to the difference between the temperature increment K at the current moment and the temperature increment at the previous moment; determining the heat dissipation level at the current moment based on K and P; and dissipating heat on the target device according to the heat dissipation strategy corresponding to the heat dissipation level at the current moment; wherein: the heat dissipation capacity of the heat dissipation strategy corresponding to different heat dissipation levels is different.

[0006] In the above implementation scheme, heat dissipation strategies with different heat dissipation capabilities are pre-configured for different heat dissipation levels. The current heat dissipation level is determined based on the current temperature increment K of the target device and the current temperature change trend value P. Then, the heat dissipation strategy corresponding to the current heat dissipation level is used to dissipate heat from the target device. In this way, the heat dissipation strategy used matches the current temperature increment and temperature change trend value, allowing for on-demand heat dissipation based on the actual situation of the target device at that moment. This provides more precise heat dissipation services to the target device and, to a certain extent, achieves refined heat dissipation control of the target device.

[0007] Meanwhile, since the solution in this application embodiment determines the heat dissipation strategy based on the temperature increment and temperature change trend value corresponding to the current moment, and the temperature increment is the difference between the current moment and the previous moment, its value reflects the rate of temperature change (heating up or cooling down) of the target device, while the temperature change trend value P corresponding to the current moment is the difference between the temperature increment K corresponding to the current moment and the temperature increment corresponding to the previous moment, its value reflects the trend of the rate of temperature change (heating up or cooling down) of the target device. Therefore, the heat dissipation strategy determined by combining the temperature increment K and the temperature change trend value P corresponding to the target device at the current moment matches the rate of temperature change and the trend of the rate of temperature change of the target device. Compared with the solution that is determined directly based on the temperature value, the heat dissipation strategy determined by combining the temperature increment K and the temperature change trend value P corresponding to the target device at the current moment can better meet the actual needs of the target device, thereby providing more accurate heat dissipation services for the target device. For example, in practical applications, the target device may currently have a high temperature, but it has already left a high-heat-generating scenario (e.g., the target device was previously operating at full load and has now switched to a low-load operating state). In this case, even without thermal management, the temperature of the target device will gradually decrease. In this situation, intensive cooling is unnecessary to avoid sudden heating and cooling affecting the operation of the target device, causing additional power consumption, or imposing unnecessary restrictions on the target device. Conversely, the target device may currently have a low temperature, but it has entered a high-heat-generating scenario (e.g., the target device is operating at full load). Although the current temperature is low, it will continue to rise significantly in the future. In this case, if a cooling strategy with low heat dissipation capacity is adopted based on the current temperature, it will not effectively prevent the temperature rise of the target device. Conversely, the solution adopted in this application, when faced with the above situation, determines the heat dissipation strategy regardless of the current temperature value. Instead, it selects a heat dissipation strategy that matches the rate of temperature change and the trend of temperature change of the target device. For example, if the target device's current temperature is high, but it has moved out of the high-heat-generating scenario, a weaker heat dissipation strategy can be selected to prevent sudden heating and cooling, avoid additional power consumption, and prevent unnecessary restrictions on the target device. Conversely, if the target device's current temperature is low, but it has entered the high-heat-generating scenario, a heat dissipation strategy with higher heat dissipation capacity will be selected to effectively curb the rapid temperature increase. Therefore, determining the heat dissipation strategy based on the current temperature increment and temperature change trend can provide more precise heat dissipation services to the target device and meet more refined thermal management needs.

[0008] Further, determining the heat dissipation level at the current moment based on K and P at the current moment includes: if K is greater than 0 and P is greater than or equal to 0 at the current moment, then the heat dissipation level at the current moment is determined to be a first heat dissipation level; if K is greater than 0 and P is less than 0 at the current moment, then the heat dissipation level at the current moment is determined to be a second heat dissipation level; if K is less than 0 and P is greater than or equal to 0 at the current moment, then the heat dissipation level at the current moment is determined to be a third heat dissipation level; if both K and P are less than 0 at the current moment, then the heat dissipation level at the current moment is determined to be a fourth heat dissipation level; wherein the heat dissipation capacity of the heat dissipation strategies corresponding to the first heat dissipation level, the second heat dissipation level, the third heat dissipation level, and the fourth heat dissipation level decreases sequentially.

[0009] In the above implementation, different heat dissipation levels are determined based on whether K is greater than 0 and whether P is greater than or equal to 0. It can be understood that K greater than 0 indicates that the target device is in a heating state, and the larger the K value, the faster the heating. Conversely, K less than 0 indicates that the target device is in a cooling state, and the smaller the K value, the faster the cooling. Correspondingly, if K > 0 and P > 0 or equal to 0, it indicates that the temperature rises faster and faster, requiring greater heat dissipation capacity to curb this rising trend. Conversely, if K > 0 but P < 0, it indicates that although the temperature is still rising, the rising trend is slowing down. In this case, although greater heat dissipation capacity is still needed to meet the cooling requirements of the target device, it is no longer necessary to curb the rising trend. Therefore, the required heat dissipation capacity is less than in the case where K > 0 and P > 0 or equal to 0. If K < 0 but P > 0 or equal to 0, it indicates that the device is already in the cooling stage, but the cooling trend is not optimistic, and the cooling rate is constantly decreasing. Therefore, some heat dissipation capacity is still needed to improve the cooling trend. If K < 0 and P < 0, it indicates that the device is already in the cooling stage, and the cooling trend is accelerating. In this case, some heat dissipation capacity can be used for cooling. Therefore, in the above implementation, by setting K > 0 and P > 0 to correspond to the first heat dissipation level, K > 0 but P < 0 to correspond to the second heat dissipation level, K < 0 but P > 0 to correspond to the third heat dissipation level, and K < 0 and P < 0 to correspond to the fourth heat dissipation level, and the heat dissipation capacity of the heat dissipation strategies corresponding to the first, second, third and fourth heat dissipation levels decreases in sequence, this can meet the actual use needs of the target device, thereby making the heat dissipation control of the target device more in line with actual needs and meeting the needs of refined thermal management of the target device.

[0010] Furthermore, determining the heat dissipation level at the current moment based on K and P at the current moment also includes: if K at the current moment is 0, then determining the heat dissipation level at the current moment as the heat dissipation level corresponding to the previous moment.

[0011] In the above implementation, when K is 0, it indicates that there is no difference in temperature between the current moment and the previous moment. In this case, by continuing to use the heat dissipation level corresponding to the previous moment for heat dissipation control, unnecessary power consumption from switching heat dissipation strategies can be avoided.

[0012] Further, heat dissipation is performed according to the heat dissipation strategy corresponding to the heat dissipation level at the current moment, including: obtaining the target device operating parameter value and the heat sink operating parameter value corresponding to the heat dissipation level at the current moment; operating the target device according to the target device operating parameter value, and operating the target heat sink according to the heat sink operating parameter value; the target heat sink is a pre-configured heat sink for dissipating heat for the target device.

[0013] In the above implementation method, on the one hand, the target device is operated according to the target device's operating parameter values, thereby controlling the target device's own heat generation by controlling the operation of the target device. On the other hand, the heat dissipation intensity of the target device is controlled by controlling the operation of the target heat sink. By combining the two aspects to jointly control the heat dissipation of the target device, a better heat dissipation control effect can be achieved.

[0014] Further, obtaining the target device operating parameter value and heat sink operating parameter value corresponding to the current heat dissipation level includes: obtaining the rated operating parameter value of the target device and the maximum operating parameter value of the target heat sink; obtaining a first adjustment value of the operating parameter of the target device corresponding to the current heat dissipation level and a second adjustment value of the operating parameter of the target heat sink; determining the target device operating parameter value corresponding to the current heat dissipation level based on the rated operating parameter value of the target device and the first adjustment value; and determining the heat sink operating parameter value corresponding to the current heat dissipation level based on the maximum operating parameter value of the target heat sink and the second adjustment value.

[0015] In the above implementation, the rated operating parameter values ​​of the target device and the maximum operating parameter values ​​of the target heat sink are obtained. A first adjustment value for the operating parameters of the target device corresponding to the current heat dissipation level, and a second adjustment value for the operating parameters of the target heat sink, are also obtained. The rated operating parameter values ​​of the target device are adjusted based on the first adjustment value to obtain the operating parameter values ​​of the target device, and the maximum operating parameter values ​​of the target heat sink are adjusted based on the second adjustment value to obtain the operating parameter values ​​of the heat sink. In this way, by simply configuring the adjustment values ​​corresponding to different heat dissipation levels, the operating parameter values ​​of the target device and the heat sink corresponding to the current heat dissipation level can be determined, thus enabling the determination of the heat dissipation requirements of the target device in different scenarios.

[0016] Further, obtaining the first adjustment value of the operating parameters of the target device corresponding to the current heat dissipation level includes: obtaining the basic value of the operating parameters of the target device corresponding to the current heat dissipation level; obtaining the first adjustable range of the operating parameter value of the target device corresponding to the current heat dissipation level; calculating the fluctuation value of the operating parameter value of the target device according to the first preset coefficient and the first adjustable range; and determining the first adjustment value according to the basic value of the operating parameter of the target device and the fluctuation value of the operating parameter value of the target device.

[0017] In the above implementation, the fluctuation value of the target device's operating parameters is calculated using a first preset coefficient and a first adjustable range corresponding to the current heat dissipation level. Then, a first adjustment value is determined based on this fluctuation value and the base value of the target device's operating parameters corresponding to the current heat dissipation level. This determined adjustment value takes into account the adjustable range allowed by the current heat dissipation level, preventing the determined target device operating parameter value from deviating from the actual heat dissipation capacity required by the current heat dissipation level, thus improving the reliability of the solution.

[0018] Furthermore, the first preset coefficient is calculated based on K and P at the current time, and the first preset coefficient is greater than or equal to 0 and less than or equal to 1.

[0019] In the above implementation, a first preset coefficient is determined based on K and P at the current moment. This first preset coefficient is adapted to the temperature increment and temperature change trend value corresponding to the current moment. As a result, the first adjustment value determined based on the first preset coefficient is also adapted to the temperature increment and temperature change trend value corresponding to the current moment, thereby further improving the precision of heat dissipation control of the target device.

[0020] Further, obtaining the second adjustment value of the operating parameters of the target radiator corresponding to the current heat dissipation level includes: obtaining the base value of the radiator operating parameters corresponding to the current heat dissipation level; obtaining the second adjustable range of the radiator operating parameter values ​​corresponding to the current heat dissipation level; calculating the fluctuation value of the radiator operating parameter values ​​based on the second preset coefficient and the second adjustable range; and determining the second adjustment value based on the base value of the radiator operating parameters and the fluctuation value of the radiator operating parameter values.

[0021] In the above implementation, the fluctuation value of the radiator operating parameters is calculated using a second preset coefficient and a second adjustable range corresponding to the current heat dissipation level. Then, a second adjustment value is determined based on this fluctuation value and the base value of the radiator operating parameters corresponding to the current heat dissipation level. This determined adjustment value takes into account the adjustable range allowed by the current heat dissipation level, preventing the determined radiator operating parameter values ​​from deviating from the actual heat dissipation capacity required by the current heat dissipation level, thus improving the reliability of the solution.

[0022] Furthermore, the second preset coefficient is calculated based on K and P at the current time, and the second preset coefficient is greater than or equal to 0 and less than or equal to 1.

[0023] In the above implementation, a second preset coefficient is determined based on K and P at the current moment. This determined second preset coefficient is adapted to the temperature increment and temperature change trend value corresponding to the current moment. As a result, the second adjustment value determined based on the second preset coefficient is also adapted to the temperature increment and temperature change trend value corresponding to the current moment, thereby further improving the precision of heat dissipation control of the target device.

[0024] Furthermore, the target device operating parameter values ​​include: the target device's operating voltage value, and / or, the target device's operating frequency value.

[0025] In the above implementation, by controlling the operating voltage and / or operating frequency of the target device, the power consumption of the target device can be effectively controlled, thereby achieving control over the heat generation capacity of the target device.

[0026] Furthermore, before obtaining the temperature increment K of the target device at the current moment and the temperature change trend value P of the target device at the current moment, the method further includes: determining that the dynamic temperature control function is enabled; wherein: the dynamic temperature control function is enabled when the temperature of the target device reaches a preset trigger temperature point; the trigger temperature point is located within the normal operating temperature range of the target device.

[0027] In the above implementation, by setting the trigger temperature point within the normal operating temperature range of the target device, the heat dissipation control method provided in this application can be used to manage the thermal performance of the target device even when its temperature is still within the normal operating temperature range. This effectively prevents the target device's temperature from deviating from its normal operating temperature range, reducing the risk of malfunction or damage due to temperature issues and improving the user experience.

[0028] This application embodiment also provides a heat dissipation control device, including: an acquisition module, configured to acquire the temperature increment K of a target device at the current moment, and the temperature change trend value P of the target device at the current moment; wherein P is equal to the difference between the temperature increment K at the current moment and the temperature increment at the previous moment; a level confirmation module, configured to determine the heat dissipation level at the current moment based on the K and P at the current moment; and a control module, configured to perform heat dissipation according to the heat dissipation strategy corresponding to the heat dissipation level at the current moment; wherein: the heat dissipation capacity of the heat dissipation strategy corresponding to different heat dissipation levels is different.

[0029] This application also provides an electronic device, including a processor and a memory connected in communication; the processor is used to execute one or more programs stored in the memory to implement any of the above-described heat dissipation control methods.

[0030] Furthermore, the target device is the processor.

[0031] Furthermore, the electronic device also includes a heat sink, which is communicatively connected to the processor.

[0032] This application also provides a computer-readable storage medium storing one or more programs that can be executed by one or more processors to implement any of the above-described heat dissipation control methods. Attached Figure Description

[0033] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 A schematic flowchart illustrating a heat dissipation control method applied to a processing node, provided in an embodiment of this application;

[0035] Figure 2 This is a schematic diagram illustrating the temperature change when K is greater than 0 and P is greater than or equal to 0, as provided in an embodiment of this application.

[0036] Figure 3 This is a schematic diagram illustrating the temperature change when K is greater than 0 and P is less than 0, provided as an embodiment of this application.

[0037] Figure 4 This is a schematic diagram illustrating the temperature change when K is less than 0 and P is greater than or equal to 0, as provided in an embodiment of this application.

[0038] Figure 5 This is a schematic diagram illustrating temperature changes when K is less than 0 and P is less than 0, provided as an embodiment of this application.

[0039] Figure 6 This is a schematic diagram of the structure of a heat dissipation control device provided in an embodiment of this application;

[0040] Figure 7 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation

[0041] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0042] To provide more precise heat dissipation services and meet the increasingly sophisticated thermal management needs of electronic devices, this application provides a heat dissipation control method. See also... Figure 1 As shown, Figure 1 This is a flowchart illustrating the heat dissipation control method provided in the embodiments of this application, including:

[0043] S101: Obtain the temperature increment K of the target device at the current moment, and the temperature change trend value P of the target device at the current moment.

[0044] In the embodiments of this application, the target device refers to the device that requires heat dissipation control, which may include, but is not limited to, processors, memory, graphics cards, FPGAs (Field Programmable Gate Arrays), microcontrollers, etc.

[0045] In the embodiments of this application, the temperature increment K of the target device at the current moment is equal to the difference between the temperature of the target device at the current moment and the temperature of the target device at the previous moment.

[0046] In this embodiment of the application, P is equal to the difference between the temperature increment K at the current moment and the temperature increment K' at the previous moment.

[0047] In the embodiments of this application, the temperature increment K' of the target device at the previous moment is equal to the difference between the temperature of the target device at the current moment and the temperature of the target device at the moment before that.

[0048] For example, if the temperature of the target device at time t0 is k0, at time t1 it is k1, and at time t2 it is k2, and assuming the current time is t2, then the temperature increment K of the target device at the current time is equal to k2-k1, and the temperature increment K' of the target device at the previous time is equal to k1-k0. The temperature change trend value P of the target device at the current time is equal to K-K', equal to (k2-k1)-(k1-k0), and equal to k2-k0.

[0049] It is understood that, in the embodiments of this application, the temperature increment K of the target device at the current moment and the temperature increment K' of the target device at the previous moment can be obtained to obtain the temperature change trend value P of the target device at the current moment. Alternatively, the temperature k2 of the target device at the current moment and the temperature k0 of the target device at the previous moment can also be obtained to obtain the temperature change trend value P of the target device at the current moment.

[0050] In this embodiment of the application, the temperature of the target device can be obtained by setting a temperature sensor on the target device or around the target device.

[0051] The solutions provided in this application can be applied to electronic devices with thermal management requirements, including but not limited to mobile terminals, desktop computers, tablet computers, personal computers, personal digital assistants, smartwatches, netbooks, wearable electronic devices, augmented reality devices, and servers. The methods provided in this application can be embedded in the operating system of the electronic device as firmware, or stored in the memory of the electronic device as program code, and then read and executed by the processor of the electronic device.

[0052] Temperature sensors can be directly connected to the processor of an electronic device to provide the processor with the acquired temperature data. Alternatively, temperature sensors can be connected to data storage within the electronic device, such as a temperature register, thereby obtaining the temperature data of the target device by reading the values ​​in the temperature register.

[0053] S102: Determine the heat dissipation level at the current moment based on K and P at the current moment.

[0054] S103: Apply heat dissipation to the target device according to the heat dissipation strategy corresponding to the current heat dissipation level.

[0055] Different heat dissipation levels correspond to different heat dissipation strategies with varying heat dissipation capabilities.

[0056] In this embodiment of the application, different heat dissipation levels can be pre-configured according to different combinations of K and P, and corresponding heat dissipation strategies can be configured for different heat dissipation levels.

[0057] In one feasible embodiment of this application, the following heat dissipation levels can be configured:

[0058] K > 0 and P > 0 corresponds to the first heat dissipation level;

[0059] K > 0 but P < 0 corresponds to the second heat dissipation level;

[0060] K less than 0 but P greater than or equal to 0 corresponds to the third heat dissipation level;

[0061] K less than 0 and P less than 0 correspond to the fourth heat dissipation level;

[0062] Furthermore, the heat dissipation capabilities of the heat dissipation strategies corresponding to the first, second, third, and fourth heat dissipation levels decrease sequentially.

[0063] That is, if K is greater than 0 and P is greater than or equal to 0 at the current moment, the heat dissipation level at the current moment is determined to be the first heat dissipation level; if K is greater than 0 and P is less than 0 at the current moment, the heat dissipation level at the current moment is determined to be the second heat dissipation level; if K is less than 0 and P is greater than or equal to 0 at the current moment, the heat dissipation level at the current moment is determined to be the third heat dissipation level; if both K and P are less than 0 at the current moment, the heat dissipation level at the current moment is determined to be the fourth heat dissipation level.

[0064] It can be understood that K > 0 indicates the target device is in a heating state, and the larger the K value, the faster the heating. Conversely, K < 0 indicates the target device is in a cooling state, and the smaller the K value, the faster the cooling. P is the difference between the current temperature increment K and the previous temperature increment K', reflecting the trend of the rate of temperature change (heating or cooling) of the target device. Therefore, K > 0 and P > 0 indicates that the heating is accelerating, such as... Figure 2 As shown, a large heat dissipation capacity is needed to curb the temperature rise; conversely, if K is greater than 0 but P is less than 0, it indicates that although the temperature is still rising, the rising trend is slowing down. Figure 3 As shown, although a significant heat dissipation capacity is still required to meet the cooling needs of the target device, there is no longer a need to curb the heating trend. Therefore, the heat dissipation capacity requirement can be less than when K is greater than 0 and P is greater than or equal to 0. However, when K is less than 0 but P is greater than or equal to 0, it indicates that the device is already in the cooling phase, but the cooling trend is not optimistic, and the cooling rate is continuously decreasing. Figure 4 As shown, a certain amount of heat dissipation capacity is still needed to improve the cooling trend; and for the case where K is less than 0 and P is less than 0, it indicates that the cooling phase has already begun, and the cooling trend is accelerating. Figure 5As shown, a certain amount of heat dissipation capacity can then be used to reduce the temperature. Therefore, setting the heat dissipation capacity of the heat dissipation strategies corresponding to the first, second, third, and fourth heat dissipation levels in sequence reduces the heat dissipation capacity, which can meet the actual usage needs of the target device. This makes the heat dissipation control of the target device more closely aligned with actual requirements and satisfies the need for refined thermal management of the target device.

[0065] In the above optional implementation, it can also be set that if K is 0 at the current time, the heat dissipation level at the current time is determined to be the heat dissipation level corresponding to the previous time, thereby avoiding unnecessary power consumption of switching heat dissipation strategies.

[0066] Of course, in the above optional implementation, it can also be set that if K is 0 at the current time, the heat dissipation level is further determined based on the K' value at the previous time and the P value at the current time. For example, if K is equal to 0 at the current time and P is greater than or equal to 0, but K' is greater than 0 at the previous time, then the heat dissipation level at the current time is determined to be the first heat dissipation level; if K is equal to 0 at the current time and P is greater than or equal to 0, but K' is greater than 0 at the previous time, then the heat dissipation level at the current time is determined to be the first heat dissipation level.

[0067] In some alternative embodiments of this application, the case where K is 0 may not be considered separately, but may be combined with the scenarios where K is greater than or less than 0 for determining the heat dissipation level. For example, K greater than or equal to 0 and P greater than or equal to 0 may correspond to the first heat dissipation level; K greater than or equal to 0 but P less than 0 may correspond to the second heat dissipation level; K less than 0 but P greater than or equal to 0 may correspond to the third heat dissipation level; and K less than 0 and P less than 0 may correspond to the fourth heat dissipation level; and the heat dissipation capacity of the heat dissipation strategies corresponding to the first, second, third, and fourth heat dissipation levels decreases sequentially.

[0068] In some optional embodiments of this application, more heat dissipation levels than the aforementioned four can be set. For example, if K at the current moment is greater than or equal to A (A is a preset constant value greater than 0) and P is greater than or equal to 0, then the heat dissipation level at the current moment is determined to be the first heat dissipation level; if K at the current moment is greater than or equal to A and P is less than 0, then the heat dissipation level at the current moment is determined to be the second heat dissipation level; if K at the current moment is less than A and greater than or equal to 0, and P is greater than or equal to 0, then the heat dissipation level at the current moment is determined to be the third heat dissipation level; if K at the current moment is less than A and greater than or equal to A, and P is less than 0, then the heat dissipation level at the current moment is determined to be the fourth heat dissipation level; if K at the current moment is less than 0 and P is greater than or equal to 0, then the heat dissipation level at the current moment is determined to be the fifth heat dissipation level; if both K and P at the current moment are less than 0, then the heat dissipation level at the current moment is determined to be the sixth heat dissipation level. The heat dissipation capacity of the heat dissipation strategies corresponding to the first, second, third, fourth, fifth, and sixth heat dissipation levels decreases sequentially. The specific value of A can be set by the engineer according to actual needs. It is understandable that the above example is only one feasible way to divide the sixth heat dissipation into more than four possible methods. In addition, other methods can be used for division, such as setting a constant value less than 0 as the division point, or not using 0 as the division point, etc.

[0069] In some embodiments of this application, the heat dissipation strategy corresponding to different heat dissipation levels may include the target device operating parameter values ​​and the heat sink operating parameter values ​​corresponding to the heat dissipation level. Therefore, when heat dissipating according to the heat dissipation strategy corresponding to the current heat dissipation level, the target device operating parameter values ​​and the heat sink operating parameter values ​​corresponding to the current heat dissipation level can be obtained. The target device can then be operated according to the target device operating parameter values, and the target heat sink can be operated according to the heat sink operating parameter values, thereby achieving heat dissipation control that matches the current heat dissipation level. The target heat sink is a pre-configured heat sink for dissipating heat from the target device.

[0070] In this embodiment, the heat sink may include, but is not limited to, air-cooled heat sinks and water-cooled heat sinks. For air-cooled heat sinks, the corresponding operating parameters may include, but are not limited to, fan speed. For water-cooled heat sinks, the corresponding operating parameters may include, but are not limited to, coolant flow rate.

[0071] In some optional embodiments of this application, the target device operating parameter values ​​and heat sink operating parameter values ​​corresponding to different heat dissipation levels can be preset, so that the corresponding target device operating parameter values ​​and heat sink operating parameter values ​​can be read directly based on the heat dissipation level at the current moment.

[0072] In some alternative embodiments of this application, the method for obtaining the target device operating parameter value and the heat sink operating parameter value corresponding to the current heat dissipation level can also be:

[0073] The system acquires the rated operating parameter values ​​of the target device and the maximum operating parameter values ​​of the target heat sink, as well as the first adjustment value of the operating parameter values ​​of the target device and the second adjustment value of the operating parameter values ​​of the target heat sink corresponding to the current heat dissipation level. Based on the rated operating parameter values ​​and the first adjustment value of the target device, the system determines the operating parameter values ​​of the target device corresponding to the current heat dissipation level; based on the maximum operating parameter values ​​and the second adjustment value of the target heat sink, the system determines the operating parameter values ​​of the heat sink corresponding to the current heat dissipation level.

[0074] For example, the rated operating parameter value of the target device can be subtracted from the first adjustment value to obtain the target device operating parameter value corresponding to the current heat dissipation level; or, the first adjustment value can be an adjustment ratio, thereby multiplying the rated operating parameter value of the target device by the first adjustment value to obtain the target device operating parameter value corresponding to the current heat dissipation level. Similarly, the maximum operating parameter value of the target heat sink can be subtracted from the second adjustment value to obtain the heat sink operating parameter value corresponding to the current heat dissipation level; or, the second adjustment value can be an adjustment ratio, thereby multiplying the maximum operating parameter value of the target heat sink by the second adjustment value to obtain the heat sink operating parameter value corresponding to the current heat dissipation level.

[0075] In one optional embodiment of this application, the first adjustment value of the operating parameters of the target device corresponding to different heat dissipation levels can be preset, so that after determining the heat dissipation level at the current moment, the first adjustment value of the operating parameters of the target device corresponding to the heat dissipation level at the current moment can be directly obtained.

[0076] In another optional embodiment of this application, the process of obtaining the first adjustment value of the operating parameters of the target device corresponding to the current heat dissipation level may be: obtaining the basic value of the operating parameters of the target device corresponding to the current heat dissipation level; obtaining the first adjustable range of the operating parameter value of the target device corresponding to the current heat dissipation level; calculating the fluctuation value of the operating parameter value of the target device according to the first preset coefficient and the first adjustable range; and determining the first adjustment value according to the basic value of the operating parameter of the target device and the fluctuation value of the operating parameter value of the target device.

[0077] In this optional embodiment, the basic values ​​of the target device operating parameters corresponding to different heat dissipation levels can be preset. Optionally, the basic values ​​of the target device operating parameters corresponding to different heat dissipation levels can be different, the same, or partially the same. When the basic values ​​of the target device operating parameters corresponding to different heat dissipation levels are different, it can be set that the higher the heat dissipation level (the first heat dissipation level is higher than the second heat dissipation level, which is higher than the third heat dissipation level, which is higher than the fourth heat dissipation level, and so on), the larger the basic values ​​of the target device operating parameters.

[0078] Similarly, in this optional embodiment, the first adjustable range corresponding to different heat dissipation levels can also be preset. Optionally, the first adjustable range corresponding to different heat dissipation levels can be different, the same, or partially the same.

[0079] In this optional embodiment, the first preset coefficient is a value that is greater than or equal to 0 and less than or equal to 1.

[0080] In one example of this optional implementation, the first preset coefficient corresponding to different heat dissipation levels can also be preset. Optionally, the first preset coefficients corresponding to different heat dissipation levels can be different, the same, or partially the same.

[0081] Furthermore, in another example of this optional implementation, the first preset coefficient can also be calculated based on K and P at the current time. For example, it can be set that when K is greater than 0 and P is greater than or equal to 0, the first preset coefficient is equal to... When K is greater than 0 and P is less than 0, the first preset coefficient is equal to When K is less than 0 and P is greater than or equal to 0, the first preset coefficient is equal to When K is less than 0 and P is less than 0, the first preset coefficient is equal to Here, w1 and w2 are weighting coefficients, and w1 and w2 satisfy the constraint w1 + w2 = 1. For example, the first preset coefficient can be set to equal... Wherein, || represents the absolute value symbol. It is understood that the above two examples are merely two possible methods for calculating the first preset coefficient based on K and P at the current time, provided in the embodiments of this application, and are not intended to limit the embodiments of this application. Other calculation formulas can also be used in the embodiments of this application to calculate the first preset coefficient based on K and P at the current time, as long as the first preset coefficient is greater than or equal to 0 and less than or equal to 1.

[0082] In the above optional embodiments, when calculating the fluctuation value of the target device operating parameter value based on the first preset coefficient and the first adjustable range, the difference between the upper limit and the lower limit of the first adjustable range can be calculated first, and then the product of the first preset coefficient and the difference can be calculated to obtain the fluctuation value of the target device operating parameter value.

[0083] In the above optional embodiments, when determining the first adjustment value based on the base value and the fluctuation value of the target device operating parameter, the first adjustment value can be obtained by calculating the difference between the base value and the fluctuation value of the target device operating parameter. In this case, the base value and the first adjustable range are specific target device operating parameter values ​​and their adjustable ranges. For example, assuming the target device operating parameter is voltage, the base value is a pre-configured voltage value, and the first adjustable range is a voltage value range.

[0084] In the above optional embodiments, when determining the first adjustment value based on the base value and the fluctuation value of the target device operating parameter, the first adjustment value can also be obtained by calculating the product between the base value and the fluctuation value of the target device operating parameter. In this case, the base value and the first adjustable range of the target device operating parameter are specific proportional values ​​and adjustable ranges of proportional values. For example, assuming the target device operating parameter is voltage, the base value of the target device operating parameter can be a pre-configured proportional value, such as 80%, and the first adjustable range is a range of proportional values, such as 100% to 80%.

[0085] In this embodiment, the target device operating parameter values ​​may include, but are not limited to, the target device's operating voltage value and / or the target device's operating frequency value. In this embodiment, for each target device operating parameter value, the target device operating parameter value corresponding to the current heat dissipation level can be obtained independently using the above method, which will not be elaborated further here.

[0086] Similarly, in an optional embodiment of this application, a second adjustment value of the operating parameters of the target heat sink corresponding to different heat dissipation levels can be preset, so that after determining the heat dissipation level at the current moment, the second adjustment value of the operating parameters of the target heat sink corresponding to the heat dissipation level at the current moment can be directly obtained.

[0087] In an optional embodiment of this application, the process of obtaining the second adjustment value of the operating parameters of the target radiator corresponding to the current heat dissipation level may be as follows: obtaining the basic value of the radiator operating parameters corresponding to the current heat dissipation level; obtaining the second adjustable range of the radiator operating parameter value corresponding to the current heat dissipation level; calculating the fluctuation value of the radiator operating parameter value according to the second preset coefficient and the second adjustable range; and determining the second adjustment value according to the basic value of the radiator operating parameters and the fluctuation value of the radiator operating parameter value.

[0088] In this optional embodiment, the base values ​​of the radiator operating parameters corresponding to different heat dissipation levels can be preset. Optionally, the base values ​​of the radiator operating parameters corresponding to different heat dissipation levels can be different, the same, or partially the same. When the base values ​​of the radiator operating parameters corresponding to different heat dissipation levels are different, it can be set that the base values ​​of the radiator operating parameters corresponding to higher heat dissipation levels are larger.

[0089] Similarly, in this optional embodiment, the second adjustable range corresponding to different heat dissipation levels can also be preset. Optionally, the second adjustable range corresponding to different heat dissipation levels can be different, the same, or partially the same.

[0090] In this optional embodiment, the second preset coefficient is a value greater than or equal to 0 and less than or equal to 1.

[0091] In one example of this optional implementation, the second preset coefficient corresponding to different heat dissipation levels can also be preset. Optionally, the second preset coefficients corresponding to different heat dissipation levels can be different, the same, or partially the same.

[0092] Furthermore, in another example of this optional implementation, the second preset coefficient can also be calculated based on K and P at the current time. For example, it can be set that when K is greater than 0 and P is greater than or equal to 0, the second preset coefficient is equal to... When K is greater than 0 and P is less than 0, the second preset coefficient is equal to When K is less than 0 and P is greater than or equal to 0, the second preset coefficient is equal to When K is less than 0 and P is less than 0, the second preset coefficient is equal to Here, w1 and w2 are weighting coefficients, and w1 and w2 satisfy the constraint w1 + w2 = 1. For example, a second preset coefficient can be set to equal... Wherein, || represents the absolute value symbol. It is understood that the above two examples are merely two possible methods for calculating the second preset coefficient based on K and P at the current time, provided in the embodiments of this application, and are not intended to limit the embodiments of this application. Other calculation formulas can also be used in the embodiments of this application to calculate the second preset coefficient based on K and P at the current time, as long as the second preset coefficient is greater than or equal to 0 and less than or equal to 1.

[0093] In the above optional embodiments, when calculating the fluctuation value of the radiator operating parameter value based on the second preset coefficient and the second adjustable range, the difference between the upper limit and the lower limit of the second adjustable range can be calculated first, and then the product of the second preset coefficient and the difference can be calculated to obtain the fluctuation value of the radiator operating parameter value.

[0094] In the above optional embodiments, when determining the second adjustment value based on the base value and the fluctuation value of the radiator operating parameters, the second adjustment value can be obtained by calculating the difference between the base value and the fluctuation value of the radiator operating parameters. In this case, the base value and the second adjustable range of the radiator operating parameters are specific radiator operating parameter values ​​and adjustable ranges of those values. For example, assuming the radiator operating parameter is fan speed, the base value is a pre-configured fan speed value, and the second adjustable range is a range of fan speed values.

[0095] In the above optional embodiments, when determining the second adjustment value based on the base value and the fluctuation value of the radiator operating parameters, the second adjustment value can also be obtained by calculating the product between the base value and the fluctuation value of the radiator operating parameters. In this case, the base value and the second adjustable range of the radiator operating parameters are specific proportional values ​​and adjustable ranges of proportional values. For example, assuming the radiator operating parameter is voltage, the base value of the radiator operating parameters can be a pre-configured proportional value, such as 40%, and the second adjustable range is a range of proportional values, such as 40% to 20%.

[0096] In this embodiment, the operating parameters of the heat sink may include, but are not limited to, fan speed.

[0097] In some embodiments of this application, in addition to controlling the target device operating parameter values ​​and the heat sink operating parameter values ​​simultaneously for each heat dissipation level, it is also possible to configure the control of the target device operating parameter values ​​and the heat sink operating parameter values ​​only for a portion of the heat dissipation levels, and to control only the heat sink operating parameter values ​​for another portion of the heat dissipation levels, in order to avoid limiting the operation of the target device. For example, the control of the target device operating parameter values ​​and the heat sink operating parameter values ​​can be performed simultaneously only for the highest n (n is a preset integer greater than or equal to 1) heat dissipation levels, while only the heat sink operating parameter values ​​are controlled for other heat dissipation levels.

[0098] For example, consider the embodiment described above which has four heat dissipation levels:

[0099] When it is determined that the current heat dissipation level is the first heat dissipation level or the second heat dissipation level, the target device operating parameter value and the heat sink operating parameter value corresponding to the current heat dissipation level are obtained, and the target device is operated according to the target device operating parameter value, and the target heat sink is operated according to the heat sink operating parameter value.

[0100] Once the current heat dissipation level is determined to be either the third or fourth level, the corresponding heat sink operating parameter values ​​are obtained, and the target heat sink is operated according to these parameters. At this point, since the operating parameters of the target device are no longer controlled, the device can freely use the appropriate operating parameters based on business needs, or it can always operate using the rated operating parameters, thus providing a better user experience.

[0101] In this embodiment, the heat dissipation strategy corresponding to different heat dissipation levels may further include the operating parameter values ​​of other components corresponding to that heat dissipation level, such as the operating parameters of at least one of the components including WiFi module, Bluetooth module, display module, USB module, PCIe device, audio module, and network communication module. By controlling the operating parameters of these components, the heat generated by these components is reduced, thereby reducing the heat in the environment where the target device is located, and achieving the effect of accelerating the cooling of the target device. The specific calculation method for the operating parameter values ​​of other components can refer to the aforementioned calculation method for the operating parameter values ​​of the target device and the heat sink, and will not be elaborated here. For example, unused peripheral modules can be turned off to reduce the heat in the environment where the target device is located.

[0102] In some embodiments of this application, the above-described solution provided in this application can also be embedded as a dynamic temperature control function or written into an electronic device. When the electronic device enables the dynamic temperature control function, the electronic device can execute the solution of this application.

[0103] For example, a function activation interface can be configured in an electronic device, through which the user can actively control whether the dynamic temperature control function needs to be activated.

[0104] As another example, a trigger temperature point can be configured for the dynamic temperature control function, and the dynamic temperature control function can be automatically activated when the temperature of the target device reaches the preset trigger temperature point.

[0105] Optionally, the trigger temperature can be configured as a temperature within the normal operating temperature range of the target device. This allows the heat dissipation control method provided in this embodiment to intervene and perform thermal management of the target device while its temperature remains within the normal operating temperature range. This effectively prevents the target device's temperature from deviating from its normal operating temperature range, reducing the risk of malfunction or damage due to temperature issues and improving the user experience. The specific value of the trigger temperature can be set based on laboratory tests or temperature data recorded from extensive actual use of the target device.

[0106] In some embodiments of this application, a first high-temperature warning temperature point can be set. When the temperature of the target device is detected to be higher than the first high-temperature warning temperature point, the electronic device can be turned off to prevent the target device from burning out due to excessive temperature.

[0107] In some embodiments of this application, a second high-temperature warning temperature point can be set, which is higher than the trigger temperature point but lower than the first high-temperature warning temperature point. When the temperature of the target device is detected to be higher than the second high-temperature warning temperature point but has not yet reached the first high-temperature warning temperature point, the electronic device can be controlled to enter a sleep state to prevent the target device from burning out due to excessive temperature.

[0108] Optionally, the hibernation state can be terminated by an external event, such as by using a mouse or keyboard to wake up the electronic device. In this case, to reduce the risk of damage to the target device, the target device can be controlled to operate at the lowest possible operating parameter values, while the target heatsink can be controlled to operate at the highest possible operating parameter values. This continues until the temperature of the target device drops below the second high-temperature warning temperature (which will be higher than the trigger temperature), at which point the dynamic temperature control function is activated.

[0109] In some embodiments of this application, the dynamic temperature control function may be automatically enabled by default after the electronic device is started.

[0110] The heat dissipation control method provided in this application pre-configures heat dissipation strategies with different heat dissipation capabilities for different heat dissipation levels. It determines the current heat dissipation level based on the current temperature increment K of the target device and the current temperature change trend value P of the target device. Then, it employs the heat dissipation strategy corresponding to the current heat dissipation level to dissipate heat from the target device. In this way, the heat dissipation strategy used matches the current temperature increment and temperature change trend value, allowing for on-demand heat dissipation based on the actual situation of the target device at that moment. This provides more precise heat dissipation services to the target device and, to a certain extent, achieves refined heat dissipation control of the target device.

[0111] Meanwhile, since the solution in this application embodiment is based on the temperature increment and temperature change trend value corresponding to the current moment to determine the heat dissipation strategy, the temperature increment is the difference between the current moment and the previous moment, and its value reflects the rate of temperature change (heating up or cooling down) of the target device, and the temperature change trend value P corresponding to the current moment is the difference between the temperature increment K corresponding to the current moment and the temperature increment K' corresponding to the previous moment, and its value reflects the rate of temperature change (heating up or cooling down) of the target device. Therefore, the heat dissipation strategy determined by combining the temperature increment K of the target device at the current moment with the temperature change trend P of the target device at the current moment matches the current temperature change rate and the trend of the temperature change rate of the target device. Compared with the scheme that determines the heat dissipation strategy directly based on the temperature value, the heat dissipation strategy determined by combining the temperature increment K of the target device at the current moment with the temperature change trend P of the target device reflects both the current temperature change and the subsequent temperature change trend. Predicting the temperature change and then selecting an appropriate heat dissipation strategy can better meet the actual needs of the target device, and the heat dissipation process is more refined and gentle, thus providing more accurate heat dissipation services for the target device.

[0112] To facilitate understanding of the solutions in the embodiments of this application, the following example illustrates the specific temperature control process when the target device is a CPU, the target heat sink is a cooling fan, four heat dissipation levels are set, and the operating parameters of the target device include the CPU's operating voltage V and operating frequency F, and the operating parameters of the target heat sink include the fan speed N.

[0113] The four heat dissipation levels are as follows:

[0114] K > 0 and P > 0 corresponds to the first heat dissipation level;

[0115] K > 0 but P < 0 corresponds to the second heat dissipation level;

[0116] K less than 0 but P greater than or equal to 0 corresponds to the third heat dissipation level;

[0117] K less than 0 and P less than 0 correspond to the fourth heat dissipation level;

[0118] When K equals 0, the heat dissipation level corresponding to the previous moment is maintained.

[0119] In the first heat dissipation level:

[0120] The formula for calculating the CPU's operating voltage V is:

[0121] The formula for calculating the CPU's operating frequency F is:

[0122] The formula for calculating fan speed N is:

[0123] The corresponding adjustments to the above operating parameters are to reduce the CPU operating voltage, reduce the CPU operating frequency, and increase the cooling fan speed.

[0124] Under the second heat dissipation level:

[0125] The formula for calculating the CPU's operating voltage V is:

[0126] The formula for calculating the CPU's operating frequency F is:

[0127] The formula for calculating fan speed N is:

[0128] The corresponding adjustments to the above operating parameters are to reduce the CPU operating voltage, reduce the CPU operating frequency, and increase the cooling fan speed.

[0129] At the third heat dissipation level:

[0130] The formula for calculating the CPU's operating voltage V is:

[0131] The formula for calculating the CPU's operating frequency F is:

[0132] The formula for calculating fan speed N is:

[0133] The corresponding adjustments to the above operating parameters are to increase the CPU operating voltage, increase the CPU operating frequency, and decrease the cooling fan speed.

[0134] At the fourth heat dissipation level:

[0135] The formula for calculating the CPU's operating voltage V is:

[0136] The formula for calculating the CPU's operating frequency F is:

[0137] The formula for calculating fan speed N is:

[0138] The corresponding adjustments to the above operating parameters are to increase the CPU operating voltage, increase the CPU operating frequency, and decrease the cooling fan speed.

[0139] In the above formulas, V0 is the rated operating voltage, F0 is the rated operating frequency, N0 is the maximum fan speed, w1 and w2 are weighting coefficients, and w1 and w2 satisfy the constraint condition w1+w2=1.

[0140] In this example solution, a first high-temperature warning temperature point T1, a second high-temperature warning temperature point T2, and a trigger temperature point T3 can be set, where T1, T2, and T3 can be set according to the actual usage scenario. For example, T1 = 80℃, T2 = 70℃, and T3 = 40℃ can be set, but this is not a limitation.

[0141] During chip operation:

[0142] S1. Real-time acquisition of historical and current CPU temperature values. Temperature values ​​can be acquired by reading the CPU's internal temperature register or by reading the value from an external temperature sensor. The specific method depends on the actual usage scenario and is not limited here.

[0143] S2. Determine if the current temperature of the CPU is greater than or equal to T1. If the condition is met, then execute S3.

[0144] S3. Turn off electronic devices to prevent the CPU from burning out due to overheating.

[0145] S4. Determine if the current temperature of the CPU is greater than or equal to T2. If the condition is met, then execute S5.

[0146] S5. Electronic devices enter hibernation mode to prevent the CPU from overheating and burning out. Hibernation can be terminated by external events, such as mouse or keyboard operations; the specific method can be adjusted according to the actual usage scenario.

[0147] S6. Determine if the current temperature value is greater than or equal to T3. If the condition is met, proceed to S7; otherwise, return to S1.

[0148] S7. K and P at the current moment. The calculation operation is performed by the CPU, and the calculation result is stored in memory for subsequent calculation steps.

[0149] S8. Determine if K is equal to 0. If the condition is true, execute S9; otherwise, execute S10.

[0150] S9, does not change the heat dissipation level.

[0151] S10. Determine if K is greater than 0. If the condition is true, execute S11; otherwise, execute S12.

[0152] S11. Determine whether P is greater than or equal to 0. If the condition is true, execute S13; otherwise, execute S14.

[0153] S12. Determine whether P is greater than or equal to 0. If the condition is true, execute S15; otherwise, execute S16.

[0154] S13. Determine the equipment's heat dissipation level as the first heat dissipation level.

[0155] S14. Determine the equipment's heat dissipation level as the second heat dissipation level.

[0156] S15. Determine the equipment's heat dissipation level as the third heat dissipation level.

[0157] S16. Determine the equipment's heat dissipation level as the fourth heat dissipation level.

[0158] After determining the heat dissipation level, the operating parameters can be calculated using the formulas shown above. For ease of understanding, Table 1 below lists the adjustment range of the operating parameters for the electronic device under different heat dissipation levels in this example solution. It is understood that the adjustment range of the operating parameters can be adjusted according to actual usage; the following are merely examples and are not intended to limit the embodiments of this application.

[0159] Heat dissipation level CPU operating voltage CPU operating frequency Fan speed First heat dissipation level <![CDATA[V0-0.3~0.4]]> <![CDATA[20%~40%F0]]> <![CDATA[80%~100%N0]]> Second heat dissipation level <![CDATA[V0-0.2~0.3]]> <![CDATA[40%~60%F0]]> <![CDATA[60%~80%N0]]> Third heat dissipation level <![CDATA[V0-0.1~0.2]]> <![CDATA[60%~80%F0]]> <![CDATA[40%~60%N0]]> Fourth heat dissipation level <![CDATA[V0-0~0.1]]> <![CDATA[80%~100%F0]]> <![CDATA[20%~40%N0]]>

[0160] Taking K=1 and P=3 as an example, the temperature curve and its trend are shown in the attached figure. Figure 2 As shown, the temperature rises and the upward trend accelerates. Substituting the values ​​of K and P into the calculation formula corresponding to the first cooling level, where the weighting coefficients are w1 = w2 = 0.5, the calculation yields: V = V0 - 0.3625; F = 27%F0; N = 92.5%N0. Then, based on the calculated V, F, and N, the CPU's operating voltage, operating frequency, and cooling fan speed are adjusted respectively.

[0161] In the above implementation of the embodiments of this application, the first high temperature warning temperature point T1, the second high temperature warning temperature point T2 and the trigger temperature point T3 can be defined in the system firmware, as well as the calculation methods of K and P, the heat dissipation level, the calculation methods of CPU operating voltage, CPU operating frequency and fan speed under each heat dissipation level, the rated operating voltage, the rated operating frequency, the maximum fan speed value, the weighting coefficient, the adjustment method of CPU operating parameters, the adjustment method of cooling fan speed, etc., so as to meet the temperature control requirements of the CPU.

[0162] The above example solution, when the temperature reaches the critical value, adjusts the CPU's operating frequency, operating voltage, and cooling fan speed in a timely manner by combining the current K and P values. It can also be combined with turning off unused peripheral modules to achieve precise control of the CPU temperature, keeping the CPU in a good working state and protecting the CPU from burning out due to overheating without affecting the user experience.

[0163] Based on the same inventive concept, this application also provides a heat dissipation control device 600. Please refer to... Figure 6 As shown, Figure 6 It shows the use of Figure 1 The heat dissipation control device of the method shown. It should be understood that the specific functions of device 600 can be found in the description above; to avoid repetition, detailed descriptions are appropriately omitted here. Device 600 includes at least one software function module that can be stored in memory or embedded in the operating system of device 600 in the form of software or firmware. Specifically:

[0164] See Figure 6 As shown, the device 600 includes: an acquisition module 601, a level confirmation module 602, and a control module 603. Wherein:

[0165] The acquisition module 601 is used to acquire the temperature increment K of the target device at the current moment, and the temperature change trend value P of the target device at the current moment; wherein P is equal to the difference between the temperature increment K at the current moment and the temperature increment at the previous moment.

[0166] The level confirmation module 602 is used to determine the heat dissipation level at the current time based on the K and P at the current time.

[0167] The control module 603 is used to dissipate heat according to the heat dissipation strategy corresponding to the heat dissipation level at the current moment; wherein: the heat dissipation capacity of the heat dissipation strategy corresponding to different heat dissipation levels is different.

[0168] In one feasible embodiment of this application, the level confirmation module 602 is specifically used for: if K is greater than 0 and P is greater than or equal to 0 at the current time, then the heat dissipation level at the current time is determined to be the first heat dissipation level; if K is greater than 0 and P is less than 0 at the current time, then the heat dissipation level at the current time is determined to be the second heat dissipation level; if K is less than 0 and P is greater than or equal to 0 at the current time, then the heat dissipation level at the current time is determined to be the third heat dissipation level; if both K and P are less than 0 at the current time, then the heat dissipation level at the current time is determined to be the fourth heat dissipation level; wherein: the heat dissipation capacity of the heat dissipation strategies corresponding to the first heat dissipation level, the second heat dissipation level, the third heat dissipation level, and the fourth heat dissipation level decreases sequentially.

[0169] In one optional example of this feasible implementation, the level confirmation module 602 is further configured to: if the K at the current moment is 0, then determine that the heat dissipation level at the current moment is the heat dissipation level corresponding to the previous moment.

[0170] In one feasible embodiment of this application, the control module 603 is specifically used to obtain the target device operating parameter value and the heat sink operating parameter value corresponding to the heat dissipation level at the current moment, operate the target device according to the target device operating parameter value, and operate the target heat sink according to the heat sink operating parameter value; the target heat sink is a pre-configured heat sink for dissipating heat for the target device.

[0171] In one optional example of this feasible implementation, the control module 603 is specifically configured to: obtain the rated operating parameter value of the target device and the maximum operating parameter value of the target heat sink; obtain a first adjustment value of the operating parameter of the target device corresponding to the current heat dissipation level and a second adjustment value of the operating parameter of the target heat sink; determine the operating parameter value of the target device corresponding to the current heat dissipation level based on the rated operating parameter value of the target device and the first adjustment value; and determine the operating parameter value of the heat sink corresponding to the current heat dissipation level based on the maximum operating parameter value of the target heat sink and the second adjustment value.

[0172] In this optional example, the control module 603 is specifically used to: obtain the basic value of the target device operating parameter corresponding to the heat dissipation level at the current moment; obtain the first adjustable range of the target device operating parameter value corresponding to the heat dissipation level at the current moment; calculate the fluctuation value of the target device operating parameter value according to the first preset coefficient and the first adjustable range; and determine the first adjustment value according to the basic value of the target device operating parameter and the fluctuation value of the target device operating parameter value.

[0173] In this optional example, the first preset coefficient is calculated based on K and P at the current time, and the first preset coefficient is greater than or equal to 0 and less than or equal to 1.

[0174] In this optional example, the control module 603 is specifically used to: obtain the basic value of the radiator operating parameter corresponding to the current heat dissipation level; obtain the second adjustable range of the radiator operating parameter value corresponding to the current heat dissipation level; calculate the fluctuation value of the radiator operating parameter value according to the second preset coefficient and the second adjustable range; and determine the second adjustment value according to the basic value of the radiator operating parameter and the fluctuation value of the radiator operating parameter.

[0175] In this optional example, the second preset coefficient is calculated based on K and P at the current time, and the second preset coefficient is greater than or equal to 0 and less than or equal to 1.

[0176] In this feasible embodiment, the target device operating parameter values ​​include: the operating voltage value of the target device, and / or, the operating frequency value of the target device.

[0177] In this embodiment of the application, the control module 603 is further configured to determine that the dynamic temperature control function is enabled before the acquisition module 601 acquires the temperature increment K of the target device at the current moment and the temperature change trend value P of the target device at the current moment; wherein: the dynamic temperature control function is enabled when the temperature of the target device reaches a preset trigger temperature point; the trigger temperature point is located within the normal operating temperature range of the target device.

[0178] It should be understood that, for the sake of brevity, some of the content described in the method embodiments will not be repeated in this device embodiment.

[0179] Based on the same inventive concept, this application also provides an electronic device, see [link to relevant documentation]. Figure 7 As shown, it includes a processor 701 and a memory 702. Wherein:

[0180] The processor 701 is used to execute one or more programs stored in the memory 702 to implement the above-described heat dissipation control method.

[0181] It is understandable that processor 701 can be a processor core or processor chip, such as a CPU chip, GPU chip, AI chip, MCU, etc., or processor 701 can also be other circuits that can be configured and run programs, such as FPGA, microcontroller, etc. Memory 702 can be RAM (Random Access Memory), ROM (Read-Only Memory), flash memory, etc., but this is not a limitation.

[0182] It's understandable. Figure 7 The structure shown is for illustrative purposes only; the electronic device may also include components that are more advanced than those shown. Figure 7 The more or fewer components shown, or having the same Figure 7 Different configurations are shown. For example, it may also have a heat sink, which is communicatively connected to the processor for cooling internal components. Another example is an internal communication bus for communication between the processor 701 and the memory 702; yet another example is an external communication interface, such as a USB (Universal Serial Bus) interface or a CAN (Controller Area Network) bus interface; and yet another example is an information display component such as a display screen, but these are not limitations.

[0183] In the embodiments of this application, the target device can be a processor, or it can be another device in an electronic device besides a processor, such as a graphics card. The processor can control its operating parameters through the target device and / or a heat sink to dissipate heat from the target device.

[0184] Based on the same inventive concept, this embodiment also provides a computer-readable storage medium, such as a floppy disk, optical disk, hard disk, flash memory, USB flash drive, SD (Secure Digital Memory Card), MMC (Multimedia Card), etc., in which one or more programs implementing the above steps are stored. These one or more programs can be executed by one or more processors to implement the above heat dissipation control method. Further details will not be elaborated here.

[0185] In the embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. The apparatus embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. Furthermore, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Additionally, the displayed or discussed mutual couplings, direct couplings, or communication connections may be through some communication interfaces; indirect couplings or communication connections between devices or units may be electrical, mechanical, or other forms.

[0186] Furthermore, the units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0187] Furthermore, the functional modules in the various embodiments of this application can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.

[0188] In this document, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, without necessarily requiring or implying any such actual relationship or order between these entities or operations.

[0189] In this article, "multiple" refers to two or more.

[0190] The above description is merely an embodiment of this application and is not intended to limit the scope of protection of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A heat dissipation control method, characterized in that, The method includes: Obtain the temperature increment K of the target device at the current moment, and the temperature change trend value P of the target device at the current moment; P is equal to the temperature increment K at the current moment minus the temperature increment K' at the previous moment, reflecting the trend of the rate of temperature change of the target device; K is the difference between the temperature of the target device at the current moment and the temperature of the target device at the previous moment, and K' is the difference between the temperature of the target device at the previous moment and the temperature of the target device at the moment before that; The heat dissipation level at the current moment is determined based on K and P at the current moment; The target device is cooled according to the cooling strategy corresponding to the current cooling level; wherein: the cooling strategies corresponding to different cooling levels have different cooling capabilities.

2. The method as described in claim 1, characterized in that, Determining the heat dissipation level at the current moment based on K and P at the current moment includes: If K is greater than 0 and P is greater than or equal to 0 at the current moment, then the heat dissipation level at the current moment is determined to be the first heat dissipation level. If K is greater than 0 and P is less than 0 at the current moment, then the heat dissipation level at the current moment is determined to be the second heat dissipation level. If K is less than 0 and P is greater than or equal to 0 at the current moment, then the heat dissipation level at the current moment is determined to be the third heat dissipation level. If both K and P are less than 0 at the current moment, then the heat dissipation level at the current moment is determined to be the fourth heat dissipation level. The heat dissipation capabilities of the heat dissipation strategies corresponding to the first heat dissipation level, the second heat dissipation level, the third heat dissipation level, and the fourth heat dissipation level decrease sequentially.

3. The method as described in claim 2, characterized in that, Determining the heat dissipation level at the current moment based on K and P at the current moment also includes: If K is 0 at the current moment, then the heat dissipation level at the current moment is determined to be the heat dissipation level corresponding to the previous moment.

4. The method as described in claim 1, characterized in that, Heat dissipation is carried out according to the heat dissipation strategy corresponding to the current heat dissipation level, including: Obtain the target device operating parameter value and the heat sink operating parameter value corresponding to the current heat dissipation level; The target device is operated according to the target device operating parameter values, and the target heat sink is operated according to the heat sink operating parameter values; the target heat sink is a pre-configured heat sink for dissipating heat from the target device.

5. The method as described in claim 4, characterized in that, Obtaining the target device operating parameter values ​​and heat sink operating parameter values ​​corresponding to the current heat dissipation level includes: Obtain the rated operating parameter values ​​of the target device and the maximum operating parameter values ​​of the target heat sink; Obtain the first adjustment value of the operating parameters of the target device corresponding to the current heat dissipation level, and the second adjustment value of the operating parameters of the target heat sink; Based on the rated operating parameter value of the target device and the first adjustment value, the operating parameter value of the target device corresponding to the heat dissipation level at the current moment is determined; Based on the maximum operating parameter value of the target radiator and the second adjustment value, the operating parameter value of the radiator corresponding to the current heat dissipation level is determined.

6. The method as described in claim 5, characterized in that, Obtaining the first adjustment value of the operating parameters of the target device corresponding to the current heat dissipation level includes: Obtain the basic values ​​of the target device operating parameters corresponding to the current heat dissipation level; Obtain the first adjustable range of the target device operating parameter values ​​corresponding to the current heat dissipation level; The fluctuation value of the target device's operating parameter value is calculated based on the first preset coefficient and the first adjustable range; The first adjustment value is determined based on the base value of the target device's operating parameters and the fluctuation value of the target device's operating parameters.

7. The method as described in claim 6, characterized in that, The first preset coefficient is calculated based on K and P at the current time, and the first preset coefficient is greater than or equal to 0 and less than or equal to 1.

8. The method as described in claim 5, characterized in that, Obtaining the second adjustment value of the operating parameters of the target heat sink corresponding to the current heat dissipation level includes: Obtain the base values ​​of the radiator operating parameters corresponding to the current heat dissipation level; Obtain the second adjustable range of the radiator operating parameter values ​​corresponding to the current heat dissipation level; The fluctuation value of the radiator operating parameter value is calculated based on the second preset coefficient and the second adjustable range; The second adjustment value is determined based on the base value of the radiator operating parameters and the fluctuation value of the radiator operating parameters.

9. The method as described in claim 8, characterized in that, The second preset coefficient is calculated based on K and P at the current time, and the second preset coefficient is greater than or equal to 0 and less than or equal to 1.

10. The method according to any one of claims 4-9, characterized in that, The target device operating parameter values ​​include: the target device's operating voltage value, and / or, the target device's operating frequency value.

11. The method according to any one of claims 1-9, characterized in that, Before obtaining the temperature increment K of the target device at the current moment, and the temperature change trend value P of the target device at the current moment, the method further includes: The dynamic temperature control function is enabled; wherein: the dynamic temperature control function is enabled when the temperature of the target device reaches a preset trigger temperature point; the trigger temperature point is located within the normal operating temperature range of the target device.

12. The method as described in claim 10, characterized in that, Before obtaining the temperature increment K of the target device at the current moment, and the temperature change trend value P of the target device at the current moment, the method further includes: The dynamic temperature control function is enabled; wherein: the dynamic temperature control function is enabled when the temperature of the target device reaches a preset trigger temperature point; the trigger temperature point is located within the normal operating temperature range of the target device.

13. A heat dissipation control device, characterized in that, The device includes: The acquisition module is used to acquire the temperature increment K of the target device at the current moment, and the temperature change trend value P of the target device at the current moment; P is equal to the temperature increment K at the current moment minus the temperature increment K' at the previous moment, reflecting the trend of the rate of temperature change of the target device; K is the difference between the temperature of the target device at the current moment and the temperature of the target device at the previous moment, and K' is the difference between the temperature of the target device at the previous moment and the temperature of the target device at the moment before that; A level confirmation module is used to determine the heat dissipation level at the current moment based on K and P at the current moment; The control module is used to dissipate heat according to the heat dissipation strategy corresponding to the heat dissipation level at the current moment; wherein: the heat dissipation capacity of the heat dissipation strategy corresponding to different heat dissipation levels is different.

14. An electronic device, characterized in that, include: The processor and memory used for communication connections; The processor is used to execute one or more programs stored in the memory to implement the method as described in any one of claims 1-12.

15. The electronic device as claimed in claim 14, characterized in that, The target device is the processor.

16. The electronic device as claimed in claim 15, characterized in that, The electronic device also includes a heat sink, which is communicatively connected to the processor.

17. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores one or more programs that can be executed by one or more processors to implement the method as described in any one of claims 1-12.

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