Temperature-actuated valve and method of use thereof

Abstract

A temperature-actuated valve is disclosed herein, comprising a fixed member and a movable member, wherein the fixed member is configured to receive the movable member. A first flow path is defined between an outer surface of the fixed member and an inner surface of a housing, and a second flow path is defined by and within the movable member. The temperature-actuated valve further comprises at least one temperature-actuated member having a first end resting on a base of the fixed member and a second end resting on a base of the movable member. The temperature-actuated valve further comprises a biasing member having a first end connected to the base of the fixed member and a second end connected to the base of the movable member, the at least one temperature-actuated member being configured to compress at a first temperature and expand at a second temperature.

Description

Technical Field

[0001] The present disclosure relates to electronic device manufacturing and, more particularly, to one or more embodiments of temperature-actuated valves and methods of using the same. Background Art

[0002] A large semiconductor fabrication plant can use up to 100 megawatt-hours of electricity per hour; the annual electricity consumption of such a plant is equivalent to that of approximately 50,000 homes. In some markets, electricity can account for 30% of a semiconductor fabrication plant's operating costs. This consumption can exceed that of many oil refineries and auto plants. While the amount of electricity consumed by semiconductor chips has decreased significantly over the past few years, improvements in the energy used during the manufacturing process have lagged behind.

[0003] Semiconductor manufacturers continue to look for ways to reduce overall fab energy consumption, including reducing the energy consumption of the process equipment used to perform various unit operations. For example, modulating coolant flow is an opportunity to reduce the energy footprint of process equipment. New components that use no or minimal electricity are in demand. Summary of the Invention

[0004] According to one or more embodiments, a temperature-actuated valve is disclosed herein, comprising: a fixed member and a movable member, wherein the fixed member is configured to receive the movable member; a first flow path, the first flow path being defined between an outer surface of the fixed member and an inner surface of the housing; a second flow path, the second flow path being defined by and within the movable member; at least one temperature-actuated member comprising a first end resting on a base of the fixed member and a second end resting on a base of the movable member, wherein the at least one temperature-actuated member comprises a shape memory alloy; and a biasing member comprising a first end connected to a base of the fixed member and a second end connected to a base of the movable member, the at least one temperature-actuated member being configured to compress at a first temperature to reduce an opening to the second flow path, and to expand at a second temperature to increase an opening to the second flow path.

[0005] In some embodiments, an electronic device manufacturing system is disclosed, comprising:

[0006] A fluid circuit, the fluid circuit including a fluid having a variable temperature, the fluid circuit further including a temperature-actuated valve, the temperature-actuated valve including: a fixed member and a movable member, wherein the fixed member is configured to receive the movable member; a first flow path, the first flow path being defined between an outer surface of the fixed member and an inner surface of the housing; a second flow path, the second flow path being defined by and within the movable member; at least one temperature-actuated member including a first end resting on a base of the fixed member and a second end resting on a base of the movable member, wherein the at least one temperature-actuated member includes a shape memory alloy; and a biasing member including a first end connected to a base of the fixed member and a second end connected to a base of the movable member, the at least one temperature-actuated member being configured to compress at a first temperature to reduce an opening to a second flow path, and to expand at a second temperature to increase an opening to the second flow path.

[0007] In one or more embodiments, disclosed herein is a method for reducing fluid consumption in an electronic device manufacturing system, the method comprising: flowing a fluid through a temperature-actuated valve located in a fluid line of the electronic device manufacturing system, the temperature-actuated valve comprising: a fixed member and a movable member, wherein the fixed member is configured to receive the movable member; a first flow path, the first flow path being defined between an outer surface of the fixed member and an inner surface of a housing; a second flow path, the second flow path being defined by and within the movable member; at least one temperature-actuated member comprising a first end resting on a base of the fixed member and a second end resting on a base of the movable member, wherein the at least one temperature-actuated member comprises a shape memory alloy; and a biasing member comprising a first end connected to the base of the fixed member and a second end connected to the base of the movable member; and opening and closing the temperature-actuated valve based on a temperature of the fluid, wherein the at least one temperature-actuated member is configured to compress when the fluid is at a first temperature, thereby causing the valve to reduce an opening to a second flow path, and to expand when the fluid is at a second temperature, thereby causing the valve to at least partially open to increase an opening to the second flow path. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The drawings described below are for illustration purposes and are not necessarily drawn to scale. The drawings are not intended to limit the scope of the present disclosure in any way.

[0009] Figure 1 A processing chamber suitable for use with a temperature-actuated valve is shown in accordance with some embodiments.

[0010] Figure 2A A temperature-actuated valve according to various embodiments of the present disclosure is shown.

[0011] Figure 2B Shown is a cross section of a temperature-actuated valve according to various embodiments of the present disclosure.

[0012] Figure 2C Shown are internal components of a temperature-actuated valve according to various embodiments of the present disclosure.

[0013] Figure 2D Movable members according to various embodiments of the present disclosure are shown along with temperature-actuated members and other internal components of a temperature-actuated valve.

[0014] Figure 2E A movable member is shown along with other internal components of a temperature-actuated valve according to various embodiments of the present disclosure.

[0015] Figure 2F A cross section of a stationary member is shown along with a temperature-actuated member and a biasing member of a temperature-actuated valve according to various embodiments of the present disclosure.

[0016] Figure 3A A temperature-actuated valve is shown with a temperature-actuated member in an extended configuration in accordance with various embodiments of the present disclosure.

[0017] Figure 3B A temperature-actuated valve having a temperature-actuated member in a compressed configuration is shown in accordance with various embodiments of the present disclosure.

[0018] Figure 4A Flow paths through an "open" temperature-actuated valve are shown in accordance with an embodiment of the present disclosure.

[0019] Figure 4B Flow paths through a "closed" temperature-actuated valve are shown in accordance with an embodiment of the present disclosure.

[0020] Figure 5A A temperature-actuated valve installed in a fluid line is shown according to an embodiment of the present invention.

[0021] Figure 5B A cross section of a temperature-actuated valve installed in a fluid line is shown according to an embodiment of the present invention.

[0022] Figure 6 A flow chart illustrating a method of reducing fluid consumption in an electronic device manufacturing system according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0023] Reference will now be made in detail to exemplary embodiments of the present disclosure, which are illustrated in the accompanying drawings. Wherever possible, the same reference numerals will be used throughout the drawings to refer to the same or similar parts in the several views. Unless otherwise specifically stated, the features of the various embodiments described herein may be combined with each other.

[0024] Semiconductor manufacturers are interested in reducing energy consumption during operation of manufacturing equipment and lowering the total cost of ownership of such manufacturing equipment. Processing chambers typically include components that are cooled during processing. Cooling of the components can be performed by delivering a coolant through one or more channels within the components of the processing chamber. Typically, active valves (such as pneumatic valves and / or electric valves) are used to modulate the flow of the coolant. Such active valves consume electricity. Embodiments described herein encompass temperature-actuated valves that do not require any active components (e.g., no electricity or power consumption) for actuation. Use of such temperature-actuated valves can reduce the energy consumption of semiconductor manufacturing equipment. Temperature-actuated valves can open and close (e.g., increase the size of one or more flow channels and / or decrease the size of one or more flow channels) based on the temperature of the fluid passing through the temperature-actuated valve. Thus, when the temperature of the coolant or other liquid increases, the increased temperature can cause the valve to automatically open, and the size of the flow channels can be increased to increase the flow of the coolant. Conversely, when the temperature of the coolant or other liquid decreases, the decreased temperature can cause the valve to automatically close, and the size of the flow channels can be decreased to reduce the flow of the coolant. Such flow rate actuation can be performed automatically without the use of additional sensors, active or powered components, and / or control systems to control coolant flow. Thus, the use of temperature-actuated valves can reduce overall energy consumption of equipment (e.g., semiconductor processing equipment).

[0025] According to one or more embodiments herein, a temperature-actuated valve (e.g., a sliding valve) assembly is disclosed, for example, located in the return line of a coolant flow circuit of a semiconductor manufacturing facility. The valve described in the embodiments herein utilizes a temperature-responsive shape memory alloy spring that actuates when the coolant temperature exceeds an actuation temperature. The temperature-actuated valve may include one or more shape memory alloy springs, one or more biasing springs, and associated mechanical structures supporting the springs. When the temperature drops below the return actuation temperature, the valve may return to its original position via the biasing spring.

[0026] A temperature actuated valve can be a passive system that actuates based on the temperature of the entering and / or leaving coolant, without relying on external sensors or actuators. In an embodiment, a temperature-responsive shape memory alloy spring operates the valve when the coolant temperature exceeds the actuation temperature. When the temperature drops beyond the return actuation temperature, the valve can return to its original position with the help of a biasing spring. In some embodiments, the amount of expansion and / or contraction of the shape memory alloy spring depends on the temperature of the liquid (e.g., coolant). In such an embodiment, the temperature actuated valve can have many intermediate positions associated with different flow path opening sizes, rather than just an open position and a closed position. Thus, the size of the flow path provided by the valve can be automatically adjusted passively based on the temperature of the liquid.

[0027] Because, in embodiments, the temperature-actuated valve operates based on the return temperature of the coolant (i.e., the temperature of the coolant after it has been used for cooling), in embodiments, the temperature-actuated valve is independent of the operating schedule of the corresponding semiconductor manufacturing equipment. The temperature-actuated valve with a shape memory alloy spring can function without using a control system or adjusting the temperature-actuated valve and / or control system. The temperature-actuated valve described in the embodiments herein is a robust design with valve actuation and reset points pre-designed for the system. In some embodiments, adjustment of the actuation and reset temperatures can be implemented during the valve's setup in the field by manipulating the preload tension in the biasing spring.

[0028] In some embodiments, the temperature-actuated valve can be sized based on a maximum cooling specification and the coolant flow can be modulated. The ability to modulate coolant flow based on cooling specifications provides an opportunity to conserve energy and thereby reduce tool operating costs.

[0029] Figure 1 A processing chamber 100 suitable for use with a temperature-actuated valve according to one or more embodiments described herein is shown. The processing chamber can be any type of chamber, such as an etch chamber, a deposition chamber, a transfer chamber, etc. In some embodiments, the processing chamber 100 includes a grounded chamber body 105 defining an interior volume 101 that can include a processing volume 103. In one or more embodiments, the processing volume 103 can be defined as an area disposed between a substrate support 121 configured to receive and hold a substrate 110 during processing and a showerhead 135 disposed within the interior volume 101. A vacuum pump 155 can be coupled to the interior volume 101 via an exhaust valve 151 to facilitate evacuation of the interior volume 101.

[0030] In embodiments, the substrate 110 may be loaded through the opening 115 in the chamber body 105 via a substrate transfer robot (not shown) and provided to the substrate support 121. In one or more embodiments, the substrate support 121 may include one or more mechanisms to secure the substrate 110 on top of the substrate support 121 (e.g., an electrostatic chuck 120). The substrate 110 may be any type of substrate conventionally employed in plasma processing techniques, and the inventive methods disclosed herein are not limited in this respect.

[0031] In some embodiments, the processing chamber 100 can include a plasma power supply 130 (e.g., a radio frequency source) coupled to an upper electrode (e.g., a conductive portion of the chamber top wall 181, a showerhead 135, etc.) via a matching network 131 to provide power inductively or capacitively to form a plasma in the processing volume 101 of the processing chamber 100.

[0032] A plasma power supply 130 is coupled to the plasma generating element via a matching network 131 to provide a high-frequency power source to inductively or capacitively excite the plasma. To facilitate control of the processing chamber 100, a controller 170 may be coupled to the processing chamber. The controller 170 may be any form of a general-purpose computer processor that can be used in an industrial environment to control various chambers and subprocessors. The computer-readable medium 173 of the memory or CPU 172 may be one or more readily available memories, such as random access memory (RAM), read-only memory (ROM), a floppy disk, a hard disk, or any other form of local or remote digital storage. Support circuits 174 are coupled to the CPU 172 to support the processor in a conventional manner. These circuits include cache memory, power supplies, clock circuits, input / output circuitry and subsystems, and the like.

[0033] In some embodiments, the processing chamber 100 can include a showerhead 135 configured to provide one or more process gases, which are supplied from a gas supply 145 to the interior volume 101 via a mass flow controller 149. In one or more embodiments, the showerhead 135 can be a temperature-controlled showerhead having one or more heating zones (a central or inner heating zone 164 and an edge or outer heating zone 165 shown), each of which is independently controllable. Although two zones are shown, the showerhead 135 can have any number of zones, such as one zone, or three or more zones.

[0034] In some embodiments, each of the one or more heating zones can include a heater 153 having one or more resistive heating elements 178, 179 coupled to a heater element 190. The heater element 190 can be coupled to a heater driver 190B and controlled by a temperature controller 175. The heating elements 178, 179 can be independently driven based on one or more temperature sensors 166 and 167 (e.g., an optical probe in each of the heating zones 164, 165). For example, the heater driver 190B can be a solid-state relay or a semiconductor controlled rectifier (SCR). In some embodiments, the heater controller 191 provides PWM functionality similar to the coolant pulse wave modulation (PWM) controller 180 to interface the temperature controller 175 with either or both of the heating elements 178, 179 and the coolant circuit 171.

[0035] In lieu of, or in conjunction with, one or more heating zones, in some embodiments, the processing chamber 100 can include a coolant system 169 having one or more coolant loops 171 to facilitate controlling the temperature of, for example, the showerhead 135 and / or a substrate support (e.g., an electrostatic chuck). In some embodiments, the coolant system 169 includes a chiller 177 to provide cooling to the showerhead 135 via the coolant loop 171 thermally coupling the showerhead 135 to the chiller 177. In operation, a coolant (e.g., 50% ethylene glycol, water, etc.) is passed through one or more coolant channels embedded in both the inner heating zone 164 and the outer heating zone 165 of the showerhead 135 (e.g., entering near the first zone and exiting near the other zone). In one embodiment, the flow rate of the coolant through the one or more coolant loops 171 and the one or more coolant channels is controlled by a pulse wave modulation controller 180 via one or more temperature-actuated valves (one valve 123 is shown) in accordance with embodiments herein. Alternatively or additionally, in embodiments, a temperature actuated valve is used to control the flow rate of coolant through one or more coolant circuits.The temperature actuated valve may be a passively actuated valve that does not rely on a sensor, controller or power source.

[0036] According to various embodiments, the temperature actuated valve can be located, for example, in the coolant circuit 171. Although described with respect to the coolant circuit 171, it should be understood that the temperature actuated valve according to the embodiments herein can also be installed in any fluid line and / or pipe through which a variable temperature fluid flows. The fluid can be a heat transfer fluid, for example, a liquid or gas suitable for adding or removing heat from a medium or component. The temperature actuated valve is temperature driven and can function with any chemically compatible fluid or temperature change (such as an ambient temperature change) within the electronic device manufacturing system. The temperature actuated valve is suitable for use in fluid lines where it is beneficial to change the fluid flow rate based on the temperature of the fluid. Suitable fluids include, but are not limited to, liquid water, purified liquid water, water vapor, glycol, ethylene glycol, propylene glycol, liquid nitrogen, nitrogen, air, argon, liquid helium, helium, or compatible mixtures of any two or more of the foregoing.

[0037] The temperature change of the coolant flowing through the coolant line 171 will correspondingly heat and / or cool one or more temperature-actuated components in the valve, thereby causing the valve to be actuated or deactivated in conjunction with one or more biasing components. The actuation and deactivation of the temperature-actuated valve according to the embodiments herein will occur without the use of a sensor or controller. The physical properties of the coolant and the alloy of the temperature-actuated valve initiate the actuation (or deactivation) of the valve. During processing conditions that require cooling (or require increased cooling), the temperature of the coolant rises as the coolant absorbs heat energy, causing one or more temperature-actuated components in the valve to expand and open or increase the flow through the valve. However, when the processing conditions do not require cooling (or require less cooling), the temperature of the coolant drops, which causes the temperature-actuated components to contract (or compress) and close the valve (or reduce the size of the opening through which the coolant flows) to reduce the coolant flow. In some embodiments, the temperature-actuated valve operates in an open (i.e., fully open) or closed (i.e., fully closed) configuration. In one or more embodiments, the valve can be configured to be partially open, for example, to control the flow rate. Thus, in some embodiments, the opening size may vary based on the temperature of the coolant.

[0038] Figure 2A and 2BAn embodiment of a temperature-actuated valve 200 is shown. The internal components of the valve 200 are located within a housing 202. The housing 202 may include a connecting member 207 configured to attach to two portions of a fluid line and / or pipe. That is, the temperature-actuated valve 200 can be installed in-line with the pipe and / or fluid line. In some embodiments, the inner surface of the housing 202 has a cylindrical shape and / or a shape that conforms to the inner surface of the fluid line and / or pipe. A fixing member 204 may be received within the inner surface of the housing 202. In some embodiments, at least a portion of the outer surface of the fixing member 204 is spaced apart from at least a portion of the inner surface of the housing 202 to define a first flow path therethrough. The first flow path (e.g., an outer annular flow path) may be defined within the space between the outer surface of the fixing member 204 and the inner surface of the housing 202. In some embodiments, the outer annular flow path has an opening of the same diameter at a certain flow path, regardless of whether the valve 200 is in the open or closed position. For example, the outer annular flow path can have a fixed open position. In some embodiments, the resulting flow through the outer annular flow path can be choked (e.g., a first flow rate), thereby providing a certain back pressure. The second flow path of the temperature-actuated valve 200 can be an inner annular flow path disposed within the movable member 206, which is located within the fixed member 204. When the inner annular flow path is open, the fluid can flow through both the outer annular flow path and the inner annular flow path, and the back pressure can be reduced, thereby resulting in a high flow rate (e.g., a second flow rate that is higher than the first flow rate).

[0039] like Figures 2A-2C As shown, the temperature actuated valve 200 can include a movable member 206 received in a fixed member 204 (e.g., a routing valve shaft (router spool)). The fixed member 204 and the movable member 206 can each have a cylindrical shape so that the movable member 206 is configured to slide movably in the fixed member 204. The second flow path can be limited by the movable member 206 and is limited in the movable member 206. For example, the fixed member 204 can include one or more flow elements 203. The one or more flow elements 203 can be an opening, an orifice (orifice), a hole (hole), a perforation (perforation), a concave hole (divot), a protrusion, a fin, a shutter, a rough element, a roughened surface, or any two or more combinations of the foregoing items. Similarly, the movable member 206 can include one or more flow elements 205. The one or more flow elements 205 may be openings, orifices, holes, perforations, divots, protrusions, fins, louvers, roughening elements, roughened surfaces, or a combination of any two or more of the foregoing. Figures 3A-5B Described in more detail, the one or more flow elements 203 of the fixed member 204 are configured to at least partially align with the one or more flow elements 205 of the movable member 206 to allow fluid flowing through the first flow path to enter the interior of the movable member 206 to form a second flow path.

[0040] The temperature-actuated valve 200 may further include at least one temperature-actuated member 216, 217, 218. Each temperature-actuated member 216, 217, 218 may independently be in the form of a spring, a coil spring, a bellows spring, a disc spring (Belleville spring), a leaf spring, or a spring cylinder. In some embodiments, each temperature-actuated member 216, 217, 218 is a coil spring. During operation, the temperature-actuated members 216, 217, 218 may be wetted and in direct contact with the fluid flowing therethrough.

[0041] In one or more embodiments, at least one temperature-actuated member 216, 217, 218 may be formed from a shape memory alloy. In some embodiments, shape memory alloys include, but are not limited to, nickel, titanium, iron, copper, and combinations thereof. Suitable shape memory alloys include, but are not limited to, benevolent alloys, nickel-titanium alloys, nickel-titanium-cobalt alloys, nickel-titanium-copper alloys, or combinations thereof. The shape memory alloy is configured to cause the temperature-actuated members 216, 217, 218 to at least partially expand at a first temperature and at least partially contract at a second temperature. As used herein, the term "expansion" refers to an increase in the stiffness of the shape memory alloy material. The terms "contraction" or "compression" refer to a decrease in the stiffness of the shape memory alloy material. In one or more embodiments, the first temperature is approximately 40°C to approximately 90°C, or any individual value or sub-range within this range. In one or more embodiments, the second temperature is approximately 12°C to approximately 40°C, or any individual value or sub-range within this range. The temperature-actuated members 216, 217, 218 may each be supported by a corresponding guide member 220, 221, 222. The guide members 220, 221, 222 are configured to move linearly with the movable member 206. As the temperature-actuated members 216, 217, 218 expand and contract, the guide members 220, 221, 222 ensure linear (and not lateral) movement of the members 216, 217, 218.

[0042] Each temperature actuated member 216, 217, 218 may include a first end 219 that rests on the base 211 of the fixed member 204, and a second end that rests on the base 223 of the movable member 206. Figure 2B 、 2D, 2E, and 2F, each guide member 220, 221, 222 can be received within the opening and secured to the base 223. In some embodiments, each guide member 220, 221, 222 is secured to the base 223 by any suitable means, including but not limited to screws, bolts, rivets, machined notches, welding, soldering, glue, etc. When the temperature-actuated members 216, 217, 218 expand, the temperature-actuated members 216, 217, 218 push the base 223, causing the movable member 206 to move in the direction of the force, thereby aligning the flow elements 203, 205.

[0043] In some embodiments, the temperature actuated valve 200 further includes at least one biasing member 214. The at least one biasing member can have the form of a spring, a coil spring, a bellows spring, a disc spring, a leaf spring or a spring barrel. In some embodiments, the biasing member 214 is a coil spring. In some embodiments, the temperature actuated members 216, 217, 218 work against the biasing member 214 (e.g., a biasing spring), thereby providing a load or tension between these elements. The biasing member 214 can be configured to return the movable member 206 and one or more temperature actuated members 216, 217, 218 to the first position (e.g., closed position) when the temperature of the liquid is lower than a temperature threshold. For example, when the fluid flowing through the temperature actuated valve 200 reaches or drops to a temperature lower than a certain threshold, the shape memory alloy of the extended temperature actuated members 216, 217, 218 contracts, and the biasing member 214 returns the temperature actuated member to the first position.

[0044] According to one or more embodiments, the biasing member 214 can include attachment members 210 and 212 at opposite ends thereof. The attachment member 210 can be, for example, a hook, a wire, a coil, etc., and is configured to pass through the opening 213 of the post 208, which is configured to pass through the base 223. In some embodiments, the post 208 can have a threaded portion configured to attach to a nut 240 to secure the post 208 and the biasing member 214 to the movable member 206. The attachment member 212 (e.g., a hook, a wire, a coil, etc.) can be configured to pass through the opening 215 of the post 209, which is configured to pass through the base 211. In some embodiments, the post 209 can have a threaded portion configured to attach to a nut 241 to secure the post 209 and the biasing member 214 to the fixed member 204. In one or more embodiments, by selecting an appropriate shape memory alloy material and the stiffness of the biasing member 214 material, the temperature at which the valve 200 opens and closes can be controlled.

[0045] In some embodiments, the temperature actuated valve 200 further includes an adjustment member attached to the biasing member 214. The adjustment member can be operable to adjust the tension in the biasing member 214. In some embodiments, the nut 241 can be the adjustment member. The nut 241 can be tightened to increase the tension in the biasing member 214, or loosened to reduce the tension in the biasing member 214. The pretension adjustment nut can be designed with an operating design table that has some markings around the edge so that the user knows where to set the nut (i.e., as a continuous dial, or a step-change dial). For the step-change dial, the nut can be a latch or detent design so that the user can jump from one setting to another.

[0046] According to one or more embodiments, the components of the temperature-actuated valve 200, particularly the wetted components, comprise non-corrosive metals, polymers, ceramics, combinations thereof, or any other suitable solid material. In some embodiments, the fixed member 203, the movable member 206, the housing 202, and the biasing member 214 (e.g., including components 208, 209, 210, 212, 213, 217, 221) each independently comprise stainless steel, plastic, copper, brass, bronze, aluminum, nickel-cobalt alloy, iron, or a combination of any two or more of the foregoing. In some embodiments, the fixed member 203, the movable member 206, and the housing 202 are formed from 316 stainless steel alloy. In some embodiments, the biasing member 214 is formed from a stainless steel alloy other than 316 stainless steel alloy, plastic, copper, brass, bronze, aluminum, nickel-cobalt alloy, iron, or a combination of any two or more of the foregoing.

[0047] Figure 3A and 3B A temperature-actuated valve 300 is shown with the temperature-actuated valve 300 in an expansion position ( Figure 3A ) and the contracted position ( Figure 3B) temperature-actuated members 316, 318. For example, when the fluid flowing through the valve 300 reaches a first temperature, the shape memory alloy of the temperature-actuated members 316, 318 expands, stretching the temperature-actuated members and thereby opening the valve 300. As the temperature-actuated members 316, 318 expand, they apply a force to the movable member 306. The movable member 306 moves linearly within the fixed member 304 to align the opening 305 of the movable member 306 with the opening 303 of the fixed member 304. Once the openings 303, 305 are aligned, the fluid flowing between the inner surface of the housing 302 and the fixed member 304 along the outer surface of the fixed member 304 flows through the openings 303, 305 and through the interior of the movable member 306. The movable member 306 can be concentrically enclosed within the interior of the fixed member 304, thereby forming an annular flow path. Once the valve 300 is open, fluid flowing therethrough is able to enter the larger volume of the interior of the movable member 306, thereby increasing the flow rate.

[0048] When the fluid flowing through the valve 300 reaches the second temperature, the shape memory alloy of the temperature-actuated members 316, 318 contracts ( Figure 3B ), compressing the temperature-actuated member, thereby closing valve 300. As temperature-actuated members 316, 318 compress, biasing member 314 continues to return to its original shape, thereby pulling movable member 306 back toward its closed position. Movable member 306 moves linearly within fixed member 304. Once movable member 306 reengages attachment member 310 of biasing member 314, movable member 306 dislocates opening 305 from opening 303 and closes opening 305 from opening 303. Once openings 303, 305 are closed, fluid flow through the interior of movable member 306 ceases. In some embodiments, fluid begins to flow through the exterior surface of fixed member 304, thereby reducing the flow rate.

[0049] Although described as a binary (i.e., open / closed) configuration, in some embodiments, the shape memory alloy expands and contracts as the fluid temperature changes. Thus, the temperature-actuated members 316, 318 can expand or contract to partially align the openings 303, 305, thereby providing a flow rate between when the valve 300 is fully open or fully closed. In some embodiments, the shape memory alloy expands and contracts linearly or nonlinearly as the temperature changes.

[0050] Figure 4A and 4B Shown according to one or more embodiments described herein, when in open ( Figure 4A ) and close( Figure 4B) configuration, a fluid flow path through temperature-actuated valve 400. When temperature-actuated valve 400 is in the open position, fluid flow path 401 is formed within the interior of valve 400, between the outer surface of stationary member 404 and the inner surface of housing 402. Temperature-actuated members 416, 418, attached to base 411, are configured to at least partially expand when the fluid flowing in fluid flow path 401 is at a first temperature. The first temperature can be between approximately 40°C and approximately 90°C, or any individual value or sub-range within this range. The expansion of temperature-actuated members 416, 418 causes movable member 406 to move linearly within stationary member 404, thereby aligning the opening of stationary member 404 with the opening of movable member 406. Fluid flow path 401 then splits, continuing 446 past the outer surface of stationary member 404, with fluid also flowing through the openings of members 404, 406 and into the interior volume of movable member 406, thereby creating flow path 448.

[0051] When the temperature-actuated valve 400 is in the closed position ( Figure 4B ), a fluid flow path 401 is formed within the interior of the valve 400, between the outer surface of the fixed member 404 and the inner surface of the housing 402. Temperature-actuated members 416, 418, attached to the base 411, are configured to at least partially contract when the fluid flowing in the fluid flow path 401 is at a second temperature. The second temperature can be between approximately 12°C and approximately 40°C, or any individual value or sub-range within this range. The contraction of the temperature-actuated members 416, 418 causes the movable member 406 to move linearly within the fixed member 404, thereby closing the opening of the fixed member 404 from the opening of the movable member 406. The fluid flow path 401 then continues 446 past the outer surface of the fixed member 404 without flowing through the flow path 448. In some embodiments, the shape memory alloy material of the temperature-actuated members 416, 418 predictably expands and contracts with changes in temperature. Thus, valve 400 may be configured to be partially open or partially closed, thereby providing further functionality in controlling the flow rate of fluid flowing therethrough.

[0052] According to one or more further embodiments, disclosed herein is a method having Figure 5A and 5BAn electronic device manufacturing system is shown having a fluid line 570 with a temperature-actuated valve 500 as described in one or more embodiments described herein. In embodiments, the fluid flowing through the fluid line 570 has a variable temperature sufficient to cause the shape memory alloy of one or more temperature-actuated members 516, 518 to expand and contract, thereby at least partially opening and at least partially closing the valve 500. For example, the temperature of the fluid flowing through the line 570 can be from about 10°C to about 120°C, or any individual value or subrange within this range. In one or more embodiments, the fluid is a coolant. Suitable liquids include, but are not limited to, liquid water, purified liquid water, water vapor, glycol, ethylene glycol, propylene glycol, liquid nitrogen, nitrogen gas, air, argon, liquid helium, helium gas, or compatible mixtures of any two or more of the foregoing.

[0053] The temperature-actuated valve 500 can be easily installed within the fluid line 570 of an electronic device manufacturing system using, for example, threaded connectors and tubing. Figure 5A and 5B An in-line threaded connector is shown, but it will be understood that any suitable valve end connector may be used, including but not limited to pipe threads, socket welds, butt welds, welds, glue sockets, flanges, tri-clamps, compression, push-ins, barbed hoses, unions / true unions, manifold mounts, and combinations thereof.

[0054] Electronic device manufacturing systems operating with temperature-actuated valves 200, 300, 400, 500 according to various embodiments herein can reduce fluid consumption (particularly, fluids with variable temperatures used to heat or cool devices, chemicals, and / or processes). In some embodiments, installing a temperature-actuated valve 200, 300, 400, 500 in a variable temperature fluid line (e.g., a coolant line) of an electronic device manufacturing system can reduce fluid consumption by approximately 10% to approximately 50%, or any individual value or sub-range within these ranges. In some embodiments, installing a temperature-actuated valve 200, 300, 400, 500 in a variable temperature fluid line (e.g., a coolant line) of an electronic device manufacturing system can reduce energy demand by approximately 1% to approximately 99%, or any individual value or sub-range within these ranges.

[0055] In some embodiments, electronic device manufacturing systems operated using temperature-actuated valves 200, 300, 400, 500 according to various embodiments herein can reduce the amount of water consumed by the system, thereby reducing environmental and health impacts. Companies and governments are continually seeking ways to reduce the environmental health and safety costs of semiconductor equipment to make such equipment and related processes sustainable in the long term. In addition to reducing the amount of water consumed by such systems, the power and energy required to circulate water to support the equipment and processes is also reduced.

[0056] Figure 6 A block diagram of a method 600 for reducing fluid consumption in an electronic device manufacturing system is shown. At block 602, the method includes flowing a fluid through a temperature-actuated valve in accordance with one or more embodiments described herein. In some embodiments, the fluid is a coolant. Suitable fluids include, but are not limited to, liquid water, purified liquid water, water vapor, glycol, ethylene glycol, propylene glycol, liquid nitrogen, nitrogen gas, air, argon, liquid helium, helium gas, or compatible mixtures of any two or more of the foregoing.

[0057] At block 604, method 600 includes opening and closing a temperature-actuated valve based on the temperature of the fluid. Depending on the embodiment, when the temperature of the fluid is at a first temperature, at least one temperature-actuated member in the temperature-actuated valve compresses, thereby causing the at least one temperature-actuated member to contract. The contraction of the at least one temperature-actuated member at least partially closes the opening of the movable member from the opening of the fixed member, thereby reducing the flow rate of the fluid. In some embodiments, the first temperature is about 12°C to about 40°C, or any individual value or sub-range within this range. When the temperature of the fluid is at a second temperature, the at least one temperature-actuated member expands, thereby causing the at least one temperature-actuated member to expand. The expansion of the at least one temperature-actuated member at least partially aligns the opening of the movable member with the opening of the fixed member, thereby increasing the flow rate of the fluid. In some embodiments, the second temperature is about 40°C to about 90°C, or any individual value or sub-range within this range.

[0058] In some embodiments, at block 606, method 600 includes reducing fluid consumption in an electronic device manufacturing system. In one or more embodiments, installing a temperature-actuated valve 200, 300, 400, 500 in a variable temperature fluid line (e.g., a coolant line) in an electronic device manufacturing system can reduce fluid consumption by approximately 10% to approximately 50%, or any individual value or sub-range within this range. In some embodiments, installing a temperature-actuated valve 200, 300, 400, 500 in a variable temperature fluid line (e.g., a coolant line) in an electronic device manufacturing system can reduce energy demand by approximately 1% to approximately 99%, or any individual value or sub-range within this range. In some embodiments, method 600 includes flowing a liquid having a first temperature, closing the temperature-actuated valve, flowing a liquid having a second temperature, and opening the temperature-actuated valve.

[0059] References throughout this specification to phrases such as "one embodiment," "certain embodiments," "one or more embodiments," or "an embodiment" mean that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearance of phrases such as "in one or more embodiments," "certain embodiments," "in one embodiment," or "in an embodiment" in various places throughout this specification are not necessarily referring to the same embodiment of the present invention. Furthermore, particular features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments.

[0060] As used herein, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a robotic arm" includes a single robotic arm as well as a plurality of robotic arms.

[0061] As used herein, the term "about" with respect to a measured amount refers to the normal variation in the measured amount that would be expected by a person of ordinary skill in making the measurements and exercising a level of care commensurate with the precision of the measurement target and the measuring equipment. In certain embodiments, the term "about" includes ±10% of the recited number, such that "about 10" would include 9 to 11.

[0062] The term "at least about" in relation to a measured amount refers to the normal variation in the measured amount that would be expected by a person of ordinary skill in the art when making the measurement and exercising a level of care commensurate with the precision of the measurement target and the measuring equipment, as well as any amount above the measured amount. In certain embodiments, the term "at least about" includes the recited number minus 10% and any higher amount, such that "at least about 10" would include 9 and any number greater than 9. This term may also be expressed as "about 10 or more." Similarly, the term "less than about" generally includes the recited number plus 10% and any lower amount, such that "less than about 10" would include 11 and any number less than 11. This term may also be expressed as "about 10 or less."

[0063] Unless otherwise stated, all parts and percentages are by weight. Weight percentages (wt. %), if not otherwise stated, are based on the total composition excluding any volatile matter, ie, on a dry solids basis.

[0064] The foregoing description discloses exemplary embodiments of the present disclosure. Modifications to the above-disclosed components, devices, and methods that fall within the scope of the present disclosure will be readily apparent to those of ordinary skill. Therefore, while the present disclosure has been disclosed in conjunction with exemplary embodiments, it should be understood that other embodiments may also fall within the scope of the present disclosure as defined by the following claims.

Claims

1. A temperature-actuated valve comprising: a fixed member and a movable member disposed within the housing, wherein the fixed member is configured to receive the movable member; a first annular flow path defined between an outer surface of the stationary member and an inner surface of the housing, wherein the first annular flow path has a fixed open position; a second flow path defined by and within the movable member; at least one temperature-actuated member comprising a first end that rests on the base of the stationary member and a second end that rests on the base of the movable member, wherein the at least one temperature-actuated member comprises a shape memory alloy; and a biasing member comprising a first end connected to the base of the fixed member and a second end connected to the base of the movable member, The at least one temperature-actuated member is configured to compress at a first temperature to reduce an opening to the second flow path and to expand at a second temperature to increase the opening to the second flow path.

2. The temperature-actuated valve of claim 1 , further comprising: An adjustment member is attached to the biasing member, wherein the adjustment member is operable to adjust the tension in the biasing member.

3. The temperature-actuated valve of claim 1 , wherein the stationary member, the movable member, the housing, and the biasing member each independently comprise stainless steel, plastic, copper, brass, bronze, aluminum, nickel-cobalt alloy, iron, or a combination of any two or more of the foregoing.

4. The temperature-actuated valve of claim 1, wherein the shape memory alloy comprises at least one of a coil spring, a bellows spring, a disc spring, a leaf spring, or a spring barrel.

5. The temperature-actuated valve of claim 1 , further comprising: At least one guide member has a first end that rests on the base of the fixed member and a second end that rests on the base of the movable member, wherein the at least one guide member passes through the at least one temperature-actuated member.

6. The temperature-actuated valve of claim 1 , wherein at least one of the temperature-actuated member or the movable member comprises a plurality of flow elements, wherein the plurality of flow elements comprises one or more of openings, protrusions, fins, louvers, rough elements, or combinations thereof.

7. The temperature-actuated valve of claim 6, wherein the opening comprises a hole.

8. The temperature-actuated valve of claim 1, wherein at least one of the at least one temperature-actuated member or the biasing member is in the form of a coil spring, a bellows spring, a disc spring, a leaf spring, or a spring cartridge.

9. The temperature-actuated valve of claim 1 , further comprising: A plurality of temperature-actuated members and a plurality of corresponding guide members, each guide member having a first end resting on the base of the fixed member and a second end resting on the base of the movable member, wherein each of the plurality of guide members passes through a corresponding temperature-actuated member.

10. An electronic device manufacturing system comprising: A fluid circuit comprising a fluid having a variable temperature and further comprising a temperature-actuated valve comprising: a fixed member and a movable member disposed within the housing, wherein the fixed member is configured to receive the movable member; a first annular flow path defined between an outer surface of the stationary member and an inner surface of the housing, wherein the first annular flow path has a fixed open position; a second flow path defined by and within the movable member; at least one temperature-actuated member comprising a first end that rests on the base of the stationary member and a second end that rests on the base of the movable member, wherein the at least one temperature-actuated member comprises a shape memory alloy; and a biasing member comprising a first end connected to the base of the fixed member and a second end connected to the base of the movable member, The at least one temperature-actuated member is configured to compress at a first temperature to reduce an opening to the second flow path and to expand at a second temperature to increase the opening to the second flow path.

11. The electronic device manufacturing system of claim 10, wherein the fluid is a coolant.

12. The electronic device manufacturing system according to claim 10, further comprising: An adjustment member is attached to the biasing member, wherein the adjustment member is operable to adjust the tension in the biasing member.

13. The electronic device manufacturing system of claim 10, wherein the fixed member, the movable member, the housing, and the biasing member each independently comprise stainless steel, plastic, copper, brass, bronze, aluminum, nickel-cobalt alloy, iron, or a combination of any two or more of the foregoing. 14 . The electronic device manufacturing system of claim 10 , wherein the shape memory alloy comprises at least one of nickel titanium alloy, nickel titanium cobalt alloy, nickel titanium copper alloy, or a combination thereof.

15. The electronic device manufacturing system according to claim 10, further comprising: At least one guide member has a first end that rests on the base of the fixed member and a second end that rests on the base of the movable member, wherein the at least one guide member passes through the at least one temperature-actuated member.

16. The electronic device manufacturing system of claim 10, wherein at least one of the temperature-actuated member or the movable member comprises a plurality of flow elements, wherein the plurality of flow elements comprises one or more of openings, protrusions, fins, louvers, roughness elements, or combinations thereof.

17. The electronic device manufacturing system of claim 10, wherein at least one of the at least one temperature-actuated member or the biasing member is in the form of a coil spring, a bellows spring, a disc spring, a leaf spring, or a spring barrel.

18. An electronic device manufacturing system as described in claim 10, wherein the temperature-actuated valve includes a plurality of temperature-actuated members and a plurality of corresponding guide members, each guide member having a first end resting on the base of the fixed member and a second end resting on the base of the movable member, wherein each of the plurality of guide members passes through the corresponding temperature-actuated member.

19. A method of reducing fluid consumption in an electronic device manufacturing system, the method comprising: A fluid is caused to flow through a temperature-actuated valve located in a fluid line of the electronic device manufacturing system, the temperature-actuated valve comprising: a fixed member and a movable member disposed within the housing, wherein the fixed member is configured to receive the movable member; a first annular flow path defined between an outer surface of the stationary member and an inner surface of the housing, wherein the first annular flow path has a fixed open position; a second flow path defined by and within the movable member; at least one temperature-actuated member comprising a first end that rests on the base of the stationary member and a second end that rests on the base of the movable member, wherein the at least one temperature-actuated member comprises a shape memory alloy; and a biasing member including a first end connected to the base of the fixed member and a second end connected to the base of the movable member; and The temperature-actuated valve opens and closes based on a temperature of the fluid, wherein the at least one temperature-actuated member is configured to compress when the fluid is at a first temperature, thereby causing the temperature-actuated valve to reduce an opening to the second flow path, and to expand when the fluid is at a second temperature, thereby causing the temperature-actuated valve to at least partially open to increase an opening to the second flow path.

20. The method of claim 19, wherein the shape memory alloy comprises at least one of nickel titanium alloy, nickel titanium cobalt alloy, nickel titanium copper alloy, or combinations thereof.

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