Wood chip mulching machine and wood chip mulching method

By using infrared sensing devices for positioning and control, precise positioning and one-time bonding of wood chips and hot melt adhesive film are achieved, solving the problems of low efficiency and easy damage of traditional manual lamination, and realizing highly efficient automation of wood chip lamination.

CN117817783BActive Publication Date: 2025-12-09GLOBAL CARD SYSTEMS CO LTD
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Patent Information

Application Number
CN202311699920.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-12-11
Publication Date
2025-12-09
Estimated Expiration
2043-12-11

AI Technical Summary

Technical Problem

Traditional manual lamination methods are inefficient and unsuitable for mass production of wooden cards. Existing card packaging machines cannot be effectively applied to wood chip lamination, resulting in excessively long usage times and easy damage to the pasting devices.

Method used

Infrared sensors are used to position the wood chips. The first and third infrared sensors detect the position of the wood chips and control the actions of the conveying mechanism and the pasting device to achieve precise positioning and one-time pasting of the wood chips and hot melt adhesive film, thereby reducing the usage time of the pasting device.

Benefits of technology

This technology enables highly efficient automation of the wood chip lamination process, reduces the usage time of the laminating device, and lowers the risk of equipment damage.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application provides a kind of wood chip coating machine and wood chip coating method, wood chip coating machine includes feeding mechanism, feeding mechanism includes first discharging device, first discharging device is located the upper side of second discharging device, first conveying mechanism is set to the intermediate of first discharging device and second discharging device;Paste mechanism, paste mechanism is set to the downstream side of feeding mechanism, paste mechanism includes paste site, paste device and first infrared sensing device, paste site is set to the lower side of paste device and first infrared sensing device.Cutting device, cutting device is set to the downstream side of paste mechanism;Second conveying mechanism, second conveying mechanism is set to the downstream side of cutting device;The upper side of first conveying mechanism is provided with second infrared sensing device and third infrared sensing device;In the wood chip transmission direction, the distance of third infrared sensing device and first infrared sensing device in the wood chip transmission direction is preset distance.The present application can reduce the use time of paste device.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of card making film covering, in particular to a wood chip film covering machine and a wood chip film covering method. BACKGROUND

[0002] In the process of making wooden cards, multiple wood chips are stacked to form a wooden card. When the wood chips are stacked, a hot melt adhesive film needs to be covered on the surface of the wood chips, which can play a bonding role. The wood chips are bonded by the hot melt adhesive film, so that the wood chips can be firmly bonded. The traditional way of covering hot melt adhesive film on wooden cards is to cover it manually, which is low in efficiency and not suitable for mass production of wooden cards.

[0003] A one-time forming card packaging machine includes a main frame, a distributor, a high-speed chain card pusher, a low-speed chain card pusher, a packaging film support frame, a card feeder synchronous belt, a roller, an encapsulation roller and an ultrasonic mold, a vacuum synchronous belt, and an acceleration flat belt connected in sequence and fixed on the main frame. In addition, it includes an upper packaging film and a lower packaging film. The upper packaging film and the lower packaging film are placed on the packaging film support frame and combined together by the roller. The upper and lower synchronous belts on the card feeder send the clamped cards between the combined upper and lower packaging films. The cards are sent between the ultrasonic mold and the encapsulation roller under the joint clamping of the upper and lower packaging films and the roller. Under the joint action of the ultrasonic mold and the encapsulation roller, the horizontal weld and the horizontal weld pattern on the packaging film around the card are welded.

[0004] However, the one-time forming card packaging machine welds the packaging film around the card by the encapsulation roller, so the ultrasonic mold needs to be moved to weld the packaging film around the card. The hot melt adhesive film on the wood chip only needs to be fixed on the wood chip, and during welding, the ultrasonic mold does not need to be used for a long time. The above-mentioned one-time forming card packaging machine is not suitable for wood chip film covering processing. If the above-mentioned one-time forming card packaging machine is applied to wood chip film covering processing, the use time of the bonding device increases, which makes the bonding device prone to damage. SUMMARY

[0005] The first object of the present application is to provide a wood chip film covering machine that reduces the use time of the bonding device.

[0006] The second object of the present application is to provide a wood chip film covering method using the above-mentioned wood chip film covering machine.

[0007] In order to achieve the above-mentioned first purpose, the wood chip coating machine provided by the present application comprises a feeding mechanism, the feeding mechanism comprising a first feeding device, a second feeding device and a first conveying mechanism, the first feeding device being located above the second feeding device, and the first conveying mechanism being arranged between the first feeding device and the second feeding device; further comprising: a pasting mechanism arranged on the downstream side of the feeding mechanism, the pasting mechanism comprising a pasting position, a pasting device and a first infrared sensing device, the pasting position being arranged below the first pasting device and the second pasting device, and the first infrared sensing device and the pasting device being arranged on the same plane perpendicular to the wood chip conveying direction; a cutting device arranged on the downstream side of the pasting mechanism; a second conveying mechanism arranged on the downstream side of the cutting device; a second infrared sensing device and a third infrared sensing device are arranged above the first conveying mechanism, and the second infrared sensing device is arranged on the downstream side of the third infrared sensing device; and the distance between the third infrared sensing device and the first infrared sensing device in the wood chip conveying direction is the length of a single wood chip unit to be coated.

[0008] As can be seen from the above scheme, the preset distance is the length of a single wood chip unit to be coated, the first infrared sensing device and the third infrared sensing device are used for positioning, the end of the first wood chip is positioned in the middle of the pasting mechanism by the first infrared sensing device, and the first section of the second wood chip is positioned in the middle of the pasting mechanism by the third infrared sensing device, at this time the first wood chip and the second wood chip are connected end to end, at this time the surfaces of the first wood chip and the second wood chip are covered with hot melt adhesive film, and the pasting device is moved downward for welding, since the first wood chip and the second wood chip are connected end to end, the first wood chip and the second wood chip are fixed. The pasting device only needs to be moved downward once, so as to fix the upper hot melt adhesive film and the lower hot melt adhesive film of the first wood chip and the second wood chip, thereby reducing the use time of the pasting device.

[0009] In a further scheme, a second infrared sensing device is further arranged above the first conveying mechanism, and the second infrared sensing device is arranged on the downstream side of the third infrared sensing device.

[0010] As can be seen from the above scheme, when the pasting mechanism pastes the first wood chip and the second wood chip, the second conveying mechanism starts to move, and the second infrared sensing device identifies whether the second wood chip has moved, if the second wood chip has moved, the first conveying mechanism can start to move.

[0011] In a further scheme, a plurality of first guide rollers are arranged on the downstream side of the first feeding device, and the plurality of first guide rollers are arranged from the first feeding device to the pasting position; a plurality of second guide rollers are arranged on the downstream side of the second feeding device, and the plurality of second guide rollers are arranged from the second feeding device to the pasting position.

[0012] Therefore, the first guide roller and the second guide roller can extend the hot melt adhesive film of the first dispensing device and the second dispensing device to the sticking mechanism.

[0013] In a further aspect, the sticking mechanism further comprises a third conveying device, the third conveying device comprising a first pressing roller, a second pressing roller and a third pressing roller, the first pressing roller being arranged between the sticking position and the first conveying mechanism; the second pressing roller and the third pressing roller being arranged between the cutting device and the sticking position.

[0014] Therefore, the first pressing roller can make the wood pieces combined between the two plastic films, and the second pressing roller and the third pressing roller can fix the wood pieces after sticking, so as to facilitate cutting in the subsequent cutting.

[0015] In a further aspect, the first pressing roller further comprises a swing bracket, the third guide roller being arranged below the swing bracket, the swing bracket being provided with a first movable roller, and the swing bracket rotating along the central axis of the first pressing roller.

[0016] Therefore, the swing bracket can rotate along the central axis of the first pressing roller, and whether to press can be selected.

[0017] In a further aspect, the second pressing roller and the third pressing roller are connected through a conveying device, and the second pressing roller is electrically connected with the main control device.

[0018] Therefore, the second pressing roller and the third pressing roller are controlled by the main control device to move the wood pieces.

[0019] In a further aspect, the cutting device comprises a first track and a cutting knife, the cutting knife moving along the length direction of the first track.

[0020] Therefore, the cutting device moves along the first track, so that the cutting device cuts between two wood pieces at a time.

[0021] In a further aspect, the main control device is further electrically connected with the first infrared sensing device, the second infrared sensing device, the third infrared sensing device, the first conveying mechanism and the second conveying mechanism respectively.

[0022] Therefore, the main control device can receive signals of the first infrared sensing device, the second infrared sensing device and the third infrared sensing device, and control the movement of the first conveying mechanism and the second conveying mechanism through the signals of the first infrared sensing device, the second infrared sensing device and the third infrared sensing device.

[0023] To achieve the above-mentioned second purpose, the wood chip coating method provided by the present application applies the wood chip coating machine, and the method comprises the following steps: the main control device controls the first conveying mechanism and the second conveying mechanism to move along the wood chip transmission direction; the main control device controls the first infrared sensing device, the second infrared sensing device and the third infrared sensing device to emit infrared light; the main control device judges whether the first infrared sensing device receives the first wavelength segment reflected light, and if yes, controls the second conveying mechanism to stop moving; the main control device judges whether the third infrared sensing device receives the second wavelength segment reflected light, and if yes, controls the first conveying mechanism to stop moving; the main control device controls the pasting device to perform the pasting action; after the pasting device completes the pasting action, the main control device controls the second conveying mechanism to move; and the main control device judges whether the second infrared sensing device receives the third wavelength segment reflected light, and if yes, controls the first conveying mechanism to move.

[0024] As can be seen from the above scheme, the first infrared sensing device detects the reflected light of the pasting position. When the first wood chip moves to the pasting position, the first infrared sensing device detects the reflected light reflected by the wood chip. The first wavelength segment reflected light is the reflected light of the two layers of hot melt adhesive film, the second wavelength segment reflected light is the reflected light of the surface of the first conveying mechanism, and the third wavelength segment reflected light is the reflected light of the surface of the first conveying mechanism, that is, when the first wood chip moves to a position where the first infrared sensing device cannot detect, at this time, the first infrared sensing device receives the reflected light of the two layers of hot melt adhesive film, at this time, the second conveying mechanism can be controlled to stop moving. Since the distance between the third infrared sensing device and the first infrared sensing device in the wood chip transmission direction is the length of a single wood chip unit to be coated, when the third infrared sensing device detects the second wavelength segment reflected light, that is, the second wood chip just moves to a position where the third infrared sensing device cannot detect, at this time, the first wood chip and the second wood chip are connected end to end, at this time, the surfaces of the first wood chip and the second wood chip are covered with hot melt adhesive film, and the pasting device is moved downward to weld. Since the first wood chip and the second wood chip are connected end to end, the first wood chip and the second wood chip are fixed. And the pasting device only needs to move downward once, so that the upper hot melt adhesive film and the lower hot melt adhesive film of the first wood chip and the second wood chip are fixed, thereby reducing the use time of the pasting device.

[0025] In a further scheme, when the main control device controls the second conveying mechanism to stop moving, the second compression roller is also controlled to stop rotating.

[0026] As can be seen, the main control device controls the second compression roller to stop rotating so that the wood chip does not continue to move. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 is a structural diagram of an embodiment of the wood chip coating machine of the present application.

[0028] Figure 2 is a structural diagram of another view of an embodiment of the wood chip coating machine of the present application.

[0029] Figure 3 is a structure diagram of a third conveying device and a sticking position and a cutting device of an embodiment of the wood chip film coating machine of the present application. Figure 2 is an enlarged view of A in FIG. 6.

[0030] Figure 4 is a structure diagram of a third conveying device and a sticking position and a cutting device of an embodiment of the wood chip film coating machine of the present application.

[0031] Figure 5 is a structure diagram of a second pressing roller and a third pressing roller of an embodiment of the wood chip film coating machine of the present application.

[0032] Figure 6 is a flow chart of an embodiment of the wood chip film coating method of the present application.

[0033] The present application is further described below in conjunction with the accompanying drawings and embodiments. DETAILED DESCRIPTION

[0034] Embodiment of the wood chip film coating machine:

[0035] Referring to Figure 1 , Figure 2 and Figure 3 , the wood chip film coating machine comprises a feeding mechanism, the feeding mechanism comprises a first feeding device 12, a second feeding device 11 and a first conveying mechanism 13, the first feeding device 12 is located above the second feeding device 11, and the first conveying mechanism 13 is arranged between the first feeding device 12 and the second feeding device 11. The first feeding device 12 is provided with a hot melt adhesive film, and the second feeding device 11 is provided with a hot melt adhesive film.

[0036] A plurality of first guide rollers 14 are arranged on the downstream side of the first feeding device 12, and the plurality of first guide rollers 14 are arranged from the first feeding device 12 to the sticking position 24. A plurality of second guide rollers 15 are arranged on the second side of the second feeding device 11, and the plurality of second guide rollers are arranged from the second feeding device 11 to the sticking position 24. The hot melt adhesive film of the first feeding device 12 extends along the first guide rollers 14 to the sticking position, and the hot melt adhesive film of the second feeding device 11 extends to the sticking position 24.

[0037] The wood chip film coating machine further comprises a sticking mechanism 2, which is arranged on the downstream side of the feeding mechanism, and the sticking mechanism 2 comprises a sticking position 24, a sticking device and a first infrared sensing device 26. Specifically, the sticking device comprises a first sticking device 222 and a second sticking device 221, the first sticking device 222 comprises a first ultrasonic welding head 2222, and the second sticking device 221 comprises a second ultrasonic welding head 2211.

[0038] The sticking position 24 is arranged below the sticking device and the first infrared sensing device 26 along the wood piece conveying direction, and the first infrared sensing device 26 and the sticking device are arranged on the same plane perpendicular to the wood piece conveying direction. Specifically, the first infrared sensing device 26 is arranged between the first sticking device 222 and the second sticking device 221, and the first infrared sensing device 26, the first sticking device 22 and the second sticking device 221 are arranged on the same plane perpendicular to the wood piece conveying direction.

[0039] Referring to Figure 4 and Figure 5 , the sticking mechanism further comprises a second conveying device 23, the second conveying device 23 comprising a first pressing roller 232, a second pressing roller 251 and a third pressing roller 252, the first pressing roller 232 being arranged between the sticking position 24 and the first conveying mechanism 13. The first pressing roller 232 is further provided with a swing bracket 2324, and a third guide roller 2321 is arranged below the swing bracket 2324. A first movable roller 2323 is arranged on the swing bracket, and the swing bracket 2324 rotates along the central axis 2322 of the first pressing roller 232.

[0040] The hot melt adhesive film of the first dispensing device 12 and the hot melt adhesive film of the second dispensing device 11 pass through the third guide roller 2321 and the central axis 2322, and the wood piece is combined with the hot melt adhesive film of the first dispensing device 12 and the hot melt adhesive film of the second dispensing device 11 between the third guide roller 2321 and the central axis 2322, and is pressed by the first movable roller 2323 and conveyed to the sticking position 24. The sticking device above the sticking position sticks the wood piece.

[0041] The second pressing roller 251 and the third pressing roller 252 are arranged between the cutting device 3 and the sticking position 24. The second pressing roller 251 is provided with a movable roller 2511 and a movable roller 2522, and the wood piece with the hot melt adhesive film is passed between the movable roller 2511 and the movable roller 2522. Similarly, the third pressing roller 252 is provided with two movable rollers, and the wood piece with the hot melt adhesive film is passed between the two movable rollers of the third pressing roller 252. The second pressing roller 251 and the third pressing roller 252 are connected by a conveying device 254, and when the second pressing roller 251 rolls, the third pressing roller 252 is driven to roll.

[0042] The wood piece film coating machine further comprises a cutting device 3 arranged on the downstream side of the sticking mechanism 2; the cutting device 3 comprises a first track 32 and a cutting knife 31, and the cutting knife 31 moves along the first track 32. The hot melt adhesive film between the wood pieces is cut by the cutting device 3.

[0043] The wood piece film coating machine further comprises a second conveying mechanism 41 arranged on the downstream side of the cutting device 41.

[0044] The first conveying mechanism 13 is provided with a second infrared sensing device 16 and a third infrared sensing device 17 above, and the second infrared sensing device 16 is arranged at the downstream side of the third infrared sensing device 17. In the wood chip transmission direction, the distance between the third infrared sensing device 17 and the wood chip transmission direction of the first infrared sensing device 26 is the length of a single wood chip unit to be covered with film, that is, when the first infrared sensing device 26 just detects the wood chip, at this time, the third infrared sensing device 17 just detects the wood chip to leave.

[0045] The wood chip film covering machine further comprises a master control device (not shown in the figure), and the master control device is further electrically connected with the first infrared sensing device 26, the second infrared sensing device 16, the third infrared sensing device 17, the first conveying mechanism 13, the second conveying mechanism 41 and the second compression roller 251 respectively.

[0046] The first wood chip end is positioned in the middle of the pasting mechanism by the first infrared sensing device 26, and the first section of the second wood chip is positioned in the middle of the pasting mechanism by the third infrared sensing device 17, at this time, the first wood chip and the second wood chip are connected head to tail, at this time, the surfaces of the first wood chip and the second wood chip are covered with hot melt adhesive film, and the pasting device is moved downward for welding, since the first wood chip and the second wood chip are connected head to tail, the first wood chip and the second wood chip are fixed. The pasting device only needs to move downward once, so as to fix the upper hot melt adhesive film and the lower hot melt adhesive film of the first wood chip and the second wood chip, and the use time of the pasting device is reduced.

[0047] The wood chip film covering method embodiment:

[0048] The wood chip film covering method of the embodiment applies the wood chip film covering machine of the wood chip film covering machine embodiment. Referring to Figure 6 , Figure 6 is the flow chart of the wood chip film covering method embodiment of the present application. After the wood chip film covering machine is powered on, the master control device first executes step S11, and the master control device controls the work of each device. The master control device sends a command to the motor controlling each device, and each device is controlled to work by the motor of each device.

[0049] Specifically, the master control device controls the first conveying mechanism 13 and the second conveying mechanism 41 to move in the wood chip transmission direction, and the master control device controls the first infrared sensing device 26, the second infrared sensing device 16 and the third infrared sensing device 17 to emit infrared light. The infrared light can be reflected, so that the first infrared sensing device 26, the second infrared sensing device 16 and the third infrared sensing device 17 can receive the reflected light.

[0050] After each device works, when the first wood piece has reached the sticking position 24, that is, the first infrared sensing device 26 receives the reflected light reflected by the wood piece, step S12 is performed, the master control device judges whether the first infrared sensing device 26 receives the reflected light of the first wavelength segment, if yes, step S13 is performed, the master control device controls the second conveying mechanism 41 to stop moving. When the master control device controls the second conveying mechanism 41 to stop moving, the second compression roller 252 is also controlled to stop rotating.

[0051] The reflected light of the first wavelength segment is the reflected light of the two-layer hot-melt adhesive film, when the first wood piece moves to a position where the first infrared sensing device cannot detect, at this time, the first infrared sensing device receives the reflected light of the two-layer hot-melt adhesive film, at this time, the second conveying mechanism 41 can be controlled to stop moving.

[0052] After the second conveying mechanism 41 stops moving, step S14 is performed, the master control device judges whether the third infrared sensing device 17 receives the reflected light of the second wavelength segment, if yes, step S15 is performed, the master control device controls the first conveying mechanism 13 to stop moving. The reflected light of the second wavelength segment is the reflected light of the surface of the first conveying mechanism.

[0053] Since the distance between the third infrared sensing device 17 and the first infrared sensing device 26 in the wood piece conveying direction is the length of the wood piece, when the third infrared sensing device 17 detects the reflected light of the second wavelength segment, that is, the second wood piece just moves to a position where the third infrared sensing device cannot detect, at this time, the first wood piece and the second wood piece are connected head to tail.

[0054] After the master control device controls the first conveying mechanism 13 to stop moving, step S16 is performed, the master control device controls the sticking device to perform the sticking action.

[0055] After the sticking device completes the sticking action, step S17 is performed, the master control device controls the second conveying mechanism 41 to move. When the master control device controls the second conveying mechanism 41 to move, the second compression roller 252 is also controlled to move.

[0056] After the second conveying mechanism moves, step S18 is performed, the master control device judges whether the second infrared sensing device 16 receives the reflected light of the third wavelength segment, if yes, step S19 is performed, the master control device controls the first conveying mechanism 13 to move. The reflected light of the third wavelength segment is the reflected light of the surface of the first conveying mechanism 13. When the second infrared sensing device 16 receives the reflected light of the third wavelength segment, it is proved that the previous wood piece has moved, the first conveying mechanism 13 can continue to move, and the wood piece film coating machine continues to work.

[0057] After the first conveying mechanism 13 moves, step S12 is continuously performed, the master control device judges whether the first infrared sensing device 26 receives the reflected light of the first wavelength segment, until the wood piece film coating machine is powered off.

[0058] Through positioning of the first infrared induction device 26 and the third infrared induction device 13, the pasting device only needs to move downward once, so that the upper hot melt adhesive film and the lower hot melt adhesive film of the first wood piece and the second wood piece are fixed, and the use time of the pasting device is reduced.

[0059] The above is only the preferred embodiment of the present application, but the design concept of the application is not limited thereto, and more other equivalent embodiments can be included without departing from the concept of the present application. Various obvious changes, re-adjustments and substitutions can be made by those skilled in the art without departing from the protection scope of the present application.

Claims

1. A wood chip coating method applied to a wood chip coating machine, the wood chip coating machine comprising a feeding mechanism, the feeding mechanism comprising a first feeding device, a second feeding device, and a first conveying mechanism, the first feeding device being located above the second feeding device, the first conveying mechanism being arranged between the first feeding device and the second feeding device; further comprising: a pasting mechanism arranged on the downstream side of the feeding mechanism, the pasting mechanism comprising a pasting site, a pasting device, and a first infrared sensing device, the pasting site being arranged below the pasting device and the first infrared sensing device, the first infrared sensing device and the pasting device being arranged on the same plane perpendicular to the wood chip transmission direction; a cutting device arranged on the downstream side of the pasting mechanism; a second conveying mechanism arranged on the downstream side of the cutting device; a third infrared sensing device arranged above the first conveying mechanism, the distance between the third infrared sensing device and the first infrared sensing device in the wood chip transmission direction being the length of a single wood chip unit to be coated; a second infrared sensing device also arranged above the first conveying mechanism, the second infrared sensing device being arranged on the downstream side of the third infrared sensing device; a plurality of first guide rollers arranged on the downstream side of the first feeding device, the first guide rollers being arranged from the first feeding device to the pasting site; a plurality of second guide rollers arranged on the downstream side of the second feeding device, the second guide rollers being arranged from the second feeding device to the pasting site; the pasting mechanism further comprising a second conveying device, the second conveying device comprising a first compression roller, a second compression roller, and a third compression roller, the first compression roller being arranged between the pasting site and the first conveying mechanism; the second compression roller and the third compression roller being arranged between the cutting device and the pasting site; a swing bracket further arranged on the outside of the first compression roller, a third guide roller being arranged below the swing bracket, a first movable roller being arranged on the swing bracket, the swing bracket being rotatable along the central axis of the first compression roller; the second compression roller and the third compression roller being connected through a transmission device, the second compression roller being electrically connected to a master control device; the cutting device comprising a first track and a cutting knife, the cutting knife being movable along the length direction of the first track; the master control device being electrically connected to the first infrared sensing device, the second infrared sensing device, the third infrared sensing device, the first conveying mechanism, and the second conveying mechanism, respectively; characterized in that the method comprises: the master control device controlling the first conveying mechanism and the second conveying mechanism to move in the wood chip transmission direction, the master control device controlling the first infrared sensing device, the second infrared sensing device, and the third infrared sensing device to emit infrared light; the master control device determining whether the first infrared sensing device receives reflected light of the first wavelength range, if yes, controlling the second conveying mechanism to stop moving; The main control device judges whether the third infrared sensing device receives the second wavelength segment reflected light, if yes, controls the first conveying mechanism to stop moving; The main control device controls the pasting device to perform a pasting action; After the pasting device completes the pasting action, the main control device controls the second conveying mechanism to move; The main control device judges whether the second infrared sensing device receives the third wavelength segment reflected light, if yes, controls the first conveying mechanism to move.

2. The wood chip coating method according to claim 1, characterized in that: When the main control device controls the second conveying mechanism to stop moving, it also controls the second compression roller to stop rotating.

Citation Information

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