An electronic device

Abstract

This disclosure provides an electronic device, including a mid-frame structure, a flexible display module, a heat dissipation assembly, and a heat transfer plate. The mid-frame structure includes a first frame and a second frame, with a pivot mechanism between the first and second frames. The first and second frames are rotatable around the pivot mechanism. A control module is disposed within either the first or second frame, and the first and second frames form an accommodating space. The flexible display module is located within the accommodating space. The heat dissipation assembly includes a first heat sink and a second heat sink, with the first heat sink located between the flexible display module and the first frame, and the second heat sink located between the flexible display module and the second frame. The heat transfer plate is located on the side of the pivot mechanism facing the flexible display module. The edge of the first heat sink overlaps with the side of the heat transfer plate opposite to the flexible display module, and the edge of the second heat sink overlaps with the side of the heat transfer plate opposite to the flexible display module. Embodiments of this disclosure can achieve uniform heat dissipation throughout the device, reducing the overall temperature rise.

Description

Technical Field

[0001] This disclosure relates to the field of electronic equipment technology, and more particularly to an electronic device. Background Technology

[0002] Currently, electronic devices include a flexible display module, a first frame, a second frame, and a hinge mechanism. The flexible display panel covers the first frame, the second frame, and the hinge mechanism, and the first and second frames are rotatably connected via the hinge mechanism. In related technologies, a control motherboard is disposed within either the first or second frame. Because the first and second frames are disconnected, the heat generated by the control motherboard cannot be evenly distributed throughout the device. This results in uneven heat dissipation pressure in the first and second frames. For example, if the control motherboard is located in the first frame, the heat dissipation pressure in the first frame is higher, and heat cannot be effectively conducted within the electronic device, leading to severe overheating on the first frame side of the electronic device and a poor user experience. Summary of the Invention

[0003] This disclosure provides an electronic device to solve or alleviate one or more technical problems in the prior art.

[0004] As a first aspect of this disclosure, this disclosure provides an electronic device, including:

[0005] The middle frame structure includes a first frame and a second frame, with a pivot mechanism between the first frame and the second frame. The first frame and the second frame can rotate around the pivot mechanism to switch between an unfolded state and a folded state. A control module is provided inside the first frame or the second frame. The first frame and the second frame together define an accommodating space.

[0006] The flexible display module is located in the accommodating space;

[0007] The heat dissipation assembly includes a first heat sink and a second heat sink, wherein the first heat sink is located between the flexible display module and the first frame, and the second heat sink is located between the flexible display module and the second frame;

[0008] A heat transfer plate is located on the side of the rotating shaft mechanism facing the flexible display module. The edge of the first heat sink overlaps with the side of the heat transfer plate opposite to the flexible display module, and the edge of the second heat sink overlaps with the side of the heat transfer plate opposite to the flexible display module.

[0009] In some possible implementations, the first heat sink is attached to the first frame via thermally conductive adhesive; and / or, the second heat sink is attached to the second frame via thermally conductive adhesive.

[0010] In some possible implementations, the first heat sink is made of graphite or metal; and / or, the second heat sink is made of graphite or metal.

[0011] In some possible implementations, the heat transfer plate includes a first overlapping portion and a second overlapping portion. The first overlapping portion is disposed on the side of the heat transfer plate opposite to the flexible display module and is used to overlap with the first heat sink. The second overlapping portion is disposed on the side of the heat transfer plate opposite to the flexible display module and is used to overlap with the second heat sink. The first overlapping portion is provided with a thermally conductive layer. And / or, the second overlapping portion is provided with a thermally conductive layer.

[0012] In some possible implementations, the width direction of the first overlapping portion, the width direction of the second overlapping portion, and the width direction of the heat transfer plate are the spacing directions of the first heat sink and the second heat sink; wherein: the width of the first overlapping portion is greater than 0.5 mm; and / or, the width of the second overlapping portion is greater than 0.5 mm; and / or, the width of the heat transfer plate is 10 mm to 15 mm.

[0013] In some possible implementations, the heat transfer plate is provided with a first clearance groove on the side facing the first heat sink, the first clearance groove being used to avoid the first heat sink; and / or, the heat transfer plate is provided with a second clearance groove on the side facing the second heat sink, the second clearance groove being used to avoid the second heat sink.

[0014] In some possible implementations, the rotating shaft mechanism includes a bearing seat, a first rotating shaft, a second rotating shaft, and a support plate. The first and second rotating shafts are rotatably connected to the bearing seat at intervals. The first frame is rotatably connected to the first rotating shaft, and the second frame is rotatably connected to the second rotating shaft. The support plate is located on the bearing seat and has a mounting groove. The heat transfer plate is located in the mounting groove.

[0015] In some possible implementations, the electronic device further includes an elastic element connected to the heat transfer plate. During the transition of the mid-frame structure from the unfolded state to the folded state, the heat transfer plate gradually presses against the elastic element. In the unfolded state, the elastic element drives the heat transfer plate to press against the edges of the first heat sink and the second heat sink.

[0016] In some possible implementations, the two ends of the elastic element are connected to the heat transfer plate and the bearing seat, respectively. The heat transfer plate has a protruding support column on the side opposite to the flexible display module, and the elastic element is mounted on the support column.

[0017] In some possible implementations, the extension height of the elastic element is 0.5mm-1.0mm.

[0018] The technical solution of this disclosure embodiment can achieve the following beneficial effects: This electronic device can achieve uniform heat dissipation of the whole machine and reduce the temperature rise of the whole machine.

[0019] The above overview is for illustrative purposes only and is not intended to be limiting in any way. Further aspects, embodiments, and features of this disclosure will become readily apparent from the accompanying drawings and the following detailed description, in addition to the illustrative aspects, embodiments, and features described above. Attached Figure Description

[0020] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments according to this disclosure and should not be construed as limiting the scope of this disclosure.

[0021] Figure 1 This is an exploded structural diagram of an electronic device according to an embodiment of the present disclosure;

[0022] Figure 2 This is a schematic plan view of an electronic device according to another embodiment of the present disclosure;

[0023] Figure 3 This is a plan view of an electronic device (with the heat transfer plate removed) according to another embodiment of the present disclosure;

[0024] Figure 4 This is a schematic diagram of the unfolded state of an electronic device according to an embodiment of this disclosure;

[0025] Figure 5 This is an enlarged schematic diagram of a portion of the structure of an electronic device according to an embodiment of the present disclosure;

[0026] Figure 6 This is a schematic diagram of the folded state of an electronic device according to an embodiment of this disclosure;

[0027] Figure 7 This is an enlarged schematic diagram of a portion of the structure of an electronic device according to an embodiment of the present disclosure.

[0028] Explanation of reference numerals in the attached figures:

[0029] 10. Mid-frame structure; 20. Flexible display module; 30. Heat dissipation assembly; 40. Heat transfer plate; 50. Rotating shaft mechanism; 60. Elastic element; 11. First frame; 12. Second frame; 13. Accommodation space; 31. First heat sink; 32. Second heat sink; 41. First overlapping part; 42. Second overlapping part; 43. First clearance groove; 44. Second clearance groove; 45. Support column; 51. Shaft seat; 52. First rotating shaft; 53. Second rotating shaft; 54. Support plate. Detailed Implementation

[0030] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this disclosure. Therefore, the drawings and description are to be considered exemplary in nature and not restrictive.

[0031] Currently, mobile phones, computers, and other electronic devices have become indispensable tools in our daily lives and work. The design, screen size, camera resolution, and hardware performance of these devices are constantly evolving, with screen sizes becoming increasingly larger. With the development of flexible display technology, the display methods of electronic devices are undergoing tremendous changes, making foldable electronic devices a hot topic for manufacturers. Foldable electronic devices can significantly improve information interaction efficiency with a single fold, and they can flexibly switch modes according to different usage scenarios, while also boasting a high screen-to-body ratio and high clarity. For example, a foldable phone, when folded, is only the size of a traditional phone, making it easy to carry; however, when unfolded, it can have the display size of a tablet, thus expanding its usage scenarios.

[0032] In related technologies, foldable electronic devices have a three-section structure, consisting of left and right frames and a hinge mechanism. The left and right frames are rotatably connected by the hinge mechanism, and the left and right frames respectively form a space for accommodating the flexible display module. A control motherboard is installed in either the left or right frame. Because the left and right frames are disconnected in the middle, the heat generated by the control motherboard cannot be evenly distributed to the whole device. This results in uneven heat dissipation pressure on the left or right frame, causing one side of the device to overheat severely. For example, if the control motherboard is located in the left frame, the heat of the left frame cannot be effectively conducted within the electronic device, causing the left frame to overheat severely, thus affecting the user experience.

[0033] To address the problem of uneven heat dissipation on one side of the frame in foldable electronic devices, which leads to severe temperature rise on one side of the device and affects user experience, this disclosure provides an electronic device. The technical solution of this disclosure is described in detail below through embodiments.

[0034] Figure 1This is an exploded structural diagram of an electronic device according to an embodiment of this disclosure. (Refer to...) Figure 1 As shown, this disclosure provides an electronic device, which may include a mid-frame structure 10, a flexible display module 20, a heat dissipation component 30, and a heat transfer plate 40.

[0035] Reference Figure 1 As shown, specifically, the mid-frame structure 10 includes a first frame 11 and a second frame 12, with a pivot mechanism 50 disposed between the first frame 11 and the second frame 12. The first frame 11 and the second frame 12 can rotate around the pivot mechanism 50 to switch between an unfolded state and a folded state. A control module is disposed within the first frame 11 or the second frame 12, and the first frame 11 and the second frame 12 together define an accommodating space 13. The flexible display module 20 is located in the accommodating space 13. The heat dissipation assembly 30 includes a first heat sink 31 and a second heat sink 32, with the first heat sink 31 located between the flexible display module 20 and the first frame 11, and the second heat sink 32 located between the flexible display module 20 and the second frame 12. The heat transfer plate 40 is located on the side of the rotating shaft mechanism 50 facing the flexible display module 20. The edge of the first heat sink 31 overlaps with the side of the heat transfer plate 40 away from the flexible display module 20, and the edge of the second heat sink 32 overlaps with the side of the heat transfer plate 40 away from the flexible display module 20.

[0036] In related technologies, electronic devices are divided into three parts: a first frame, a second frame, and a hinge mechanism. The first frame and the second frame are rotatably connected by the hinge mechanism. A control motherboard is housed within either the first or second frame. For example, if the control motherboard is located in the first frame and acts as the primary heat source, while the second frame on the other side only has a few circuit boards as heat sources, the heat generated by the control motherboard causes the first frame to generate more heat than the second frame. This uneven heat dissipation pressure between the first and second frames, coupled with the fact that the heat dissipation components are disconnected at the hinge mechanism, prevents effective heat conduction within the first frame. Consequently, the heat generated by the control motherboard cannot be evenly distributed to the second frame, resulting in severe overheating on one side of the electronic device. This leads to reduced lifespan on that side and significantly impacts the user experience. In the electronic device of this embodiment, the edge of the first heat sink 31 overlaps with the side of the heat transfer plate 40 away from the flexible display module 20, and the edge of the second heat sink 32 overlaps with the side of the heat transfer plate 40 away from the flexible display module 20. When the control module is located inside the first frame 11, the heat generated by the control module can be transferred from the first frame 11 to the second frame 12, reducing the surface temperature of the side of the electronic device where the control module is located. This effectively solves the problem of uneven heat dissipation in the electronic device causing the surface temperature of one side of the electronic device to be too high, thereby reducing the service life of the electronic device. It achieves uniform heat dissipation of the entire electronic device, reduces the overall temperature rise, avoids the life loss of one side of the electronic device due to uneven heat dissipation, and improves the user experience.

[0037] The electronic device of this disclosure includes a heat dissipation assembly 30 comprising a first heat sink 31 and a second heat sink 32. The first heat sink 31 is located between the flexible display module 20 and the first frame 11, and the second heat sink 32 is located between the flexible display module 20 and the second frame 12. A heat transfer plate 40 is located on the side of the rotating shaft mechanism 50 facing the flexible display module 20. The edge of the first heat sink 31 overlaps with the side of the heat transfer plate 40 opposite to the flexible display module 20, and the edge of the second heat sink 32 overlaps with the side of the heat transfer plate 40 opposite to the flexible display module 20. By overlapping the edges of the first heat sink 31 and the second heat sink 32 with the side of the heat transfer plate 40 away from the flexible display module 20, the heat generated by the frame on the side where the control module is located is transferred to the other frame through the heat transfer plate 40. This reduces the temperature rise of the frame on the side where the control module is located, avoids uneven heat dissipation between the first frame 11 and the second frame 12 of the electronic device, which could cause the surface temperature on one side of the electronic device to be too high and thus affect the service life of the electronic device. This achieves uniform heat dissipation for the entire electronic device, avoids local overheating of the electronic device, reduces the overall temperature rise, and improves the user experience.

[0038] In one embodiment, by overlapping the edge of the first heat sink 31 and the edge of the second heat sink 32 with the side of the heat transfer plate 40 away from the flexible display module 20, the connection between the first heat sink 31 and the second heat sink 32 of the folding electronic device is achieved through the pivot mechanism and the heat transfer plate 40. This allows the heat generated by the frame on the side where the control module is located to be transferred to the other frame through the heat transfer plate 40, enabling the first frame 11 and the second frame 12 to dissipate heat simultaneously, reducing the overall temperature rise. Tests show that this reduces the overall temperature rise of the electronic device by 3°C-5°C.

[0039] In one embodiment, the flexible display module 20 is a flexible folding screen. The flexible display module 20 can be, but is not limited to, various flexible displays with corresponding functions, such as conventional flexible displays and flexible touch displays. The first frame 11 and the second frame 12 are both the mid-frame of the electronic device. Exemplarily, the flexible display module 20 can be attached to the first frame 11 and the second frame 12 by easy-pull adhesive strips or mesh adhesive.

[0040] When the electronic device is in a flattened state, the first frame 11 and the second frame 12 can abut against each other, and the hinge mechanism 50 can be disposed within the first frame 11 and the second frame 12. When the electronic device is in a folded state, the flexible display modules 20 corresponding to the first frame 11 and the second frame 12 are folded and arranged opposite each other, and the hinge mechanism 50 can be partially exposed. For example, when the electronic device is in a flattened state, the first frame 11 and the second frame 12 abut against both sides of the hinge structure 50; when the electronic device is in a folded state, the hinge mechanism 50 is used to connect the partially exposed parts of the first frame 11 and the second frame 12. For example, in the folded state, the first frame 11 and the second frame 12 are parallel and closed close together, with a certain distance between them. It should be noted that the middle frame structure can also be equipped with other structures; for example, the electronic device can also include a camera, which can be mounted on the first frame 11 or the second frame 12.

[0041] It should be noted that the electronic device can have two or more frames. When there are two or more frames, adjacent frames can rotate around parallel pivot mechanisms to form a multi-layered frame, resulting in a larger display area when the electronic device is unfolded. In this embodiment, an electronic device with two frames (first frame 11 and second frame 12) is used as an example for illustration.

[0042] In one embodiment, the control module can be a circuit board and a control chip, both of which generate a significant amount of heat. The control module can be placed inside the first frame 11, where the heat generated is greater than that of the second frame 12. In this embodiment, the heat generated by the control module can be transferred from the first frame 11 to the second frame 12. Alternatively, the control module can be placed inside the second frame 12, where the heat generated is greater than that of the first frame 11. In this embodiment, the heat generated by the control module can be transferred from the second frame 12 to the first frame 11.

[0043] For example, the heat transfer plate 40 can be made of a material with good thermal conductivity. For example, the material of the heat transfer plate 40 can be aluminum, aluminum alloy, copper or copper alloy, etc., which can make the heat transfer plate 40 have good thermal conductivity and heat dissipation performance.

[0044] In one embodiment, the first heat sink 31 is attached to the first frame 11 using thermally conductive adhesive. Exemplarily, the thermally conductive adhesive can be thermally conductive insulating tape. For example, the thermally conductive adhesive can be insulating double-sided tape. The thermally conductive adhesive not only attaches the first heat sink 31 to the first frame 11 but also transfers heat generated by the control module away from the first frame 11; that is, the thermally conductive adhesive allows the first heat sink 31 to better dissipate heat from the control module.

[0045] In one embodiment, the second heat sink 32 is attached to the second frame 12 using thermally conductive adhesive. Exemplarily, the thermally conductive adhesive can be thermally conductive insulating tape. For example, the thermally conductive adhesive can be insulating double-sided tape. The thermally conductive adhesive can attach the second heat sink 32 to the second frame 12 and also transfer the heat generated by the control module away from the first frame 12; that is, the thermally conductive adhesive allows the second heat sink 32 to dissipate heat more effectively.

[0046] In one embodiment, the first heat sink 31 is attached to the first frame 11 with thermally conductive adhesive, and the second heat sink 32 is attached to the second frame 12 with thermally conductive adhesive. In this embodiment, both the first heat sink 31 and the second heat sink 32 are attached to the first frame 11 and the second frame 12 respectively with thermally conductive adhesive. The thermally conductive adhesive allows the heat from the electronic device to be dissipated more effectively through the first heat sink 31 and the second heat sink 32.

[0047] In one embodiment, the first heat sink 31 is made of graphite or metal. For example, the first heat sink 31 can be made of copper or other metals with good heat dissipation properties. Alternatively, the first heat sink 31 can be made of graphene. The graphene heat dissipation layer can be formed on the first heat sink 31 through methods such as spraying and screen printing. Graphene has good thermal conductivity and can quickly conduct heat to the surrounding area, thereby improving the heat dissipation effect and preventing heat concentration from affecting the lifespan of electronic devices. It should be noted that the first heat sink 31 can also be other superconducting thermal products. The specific material of the first heat sink 31 is not limited here and can be set according to actual usage requirements.

[0048] In one embodiment, the second heat sink 32 is made of graphite or a metal. For example, the second heat sink 32 can be made of copper or other metals with good heat dissipation properties. Alternatively, the second heat sink 32 can be made of graphene. The graphene heat dissipation layer can be formed by spraying or screen printing. Graphene has good thermal conductivity and can quickly conduct heat to the surrounding area, thereby improving the heat dissipation effect and preventing heat concentration from affecting the lifespan of electronic devices. It should be noted that the second heat sink 32 can also be other superconducting thermal products. The specific material of the second heat sink 32 is not limited here and can be set according to actual usage requirements.

[0049] In one embodiment, the first heat sink 31 is made of graphite or metal, and the second heat sink 32 is made of graphite or metal. For example, both the first heat sink 31 and the second heat sink 32 can be made of graphite or copper sheets, thus ensuring that the first heat sink 31 and the second heat sink 32 can effectively distribute heat from the electronic device.

[0050] Figure 2 This is a schematic plan view of an electronic device according to another embodiment of the present disclosure; Figure 3 This is a plan view of an electronic device (with the heat transfer plate removed) according to another embodiment of the present disclosure; Figure 4 This is a schematic diagram of the unfolded state of an electronic device according to an embodiment of this disclosure; Figure 5 This is an enlarged schematic diagram of a portion of the structure of an electronic device according to an embodiment of the present disclosure; Figure 6 This is a schematic diagram of the folded state of an electronic device according to an embodiment of this disclosure; Figure 7 This is an enlarged schematic diagram of a portion of the structure of an electronic device according to an embodiment of this disclosure. (Refer to...) Figure 4 and Figure 5 As shown, in one embodiment, the heat transfer plate 40 includes a first overlapping portion 41 and a second overlapping portion 42. The first overlapping portion 41 is disposed on the side of the heat transfer plate 40 away from the flexible display module 20 and is used to overlap with the first heat sink 31. The second overlapping portion 42 is disposed on the side of the heat transfer plate 40 away from the flexible display module 20 and is used to overlap with the second heat sink 32.

[0051] Exemplarily, the first overlap portion 41 is provided with a thermally conductive layer. For example, the first overlap portion 41 is provided with a first thermally conductive layer, which can be a superconducting thermal material or an electroplated thermally conductive layer. The first thermally conductive layer is an electroplated thermally conductive layer, such as a gold plating or a silver plating. By providing a first thermally conductive layer in the first overlap portion 41, the embodiments of this disclosure can facilitate better heat transfer between the first overlap portion and the heat transfer plate 40, thereby achieving better heat dissipation.

[0052] Exemplarily, the second overlap portion 42 is provided with a thermally conductive layer. For example, the second overlap portion 42 is provided with a second thermally conductive layer, which can be a superconducting thermal material or an electroplated thermally conductive layer. The second thermally conductive layer 42 is an electroplated thermally conductive layer, such as a gold plating or a silver plating. By providing a second thermally conductive layer in the second overlap portion 42, this embodiment of the present disclosure facilitates better heat transfer between the second overlap portion 42 and the heat transfer plate 40, thereby achieving better heat dissipation.

[0053] For example, the first overlapping portion 41 is provided with a heat-conducting layer, and the second overlapping portion 42 is provided with a heat-conducting layer. By providing heat-conducting layers in both the first overlapping portion 41 and the second overlapping portion 42, and through the contact between the heat-conducting layers and the first and second heat sinks, heat transfer between the first overlapping portion 41 and the second overlapping portion 42 can be facilitated, thereby achieving better heat dissipation.

[0054] For example, the width of the first overlapping portion 41 is greater than 0.5 mm. That is, the dimension of the first overlapping portion 41 in the direction of the spacing between the first heat sink 31 and the second heat sink 32 is greater than 0.5 mm. For example, the width of the first overlapping portion 41 can be 0.6 mm, 0.7 mm, or 0.8 mm. The specific dimension of the width of the first overlapping portion 41 is not limited here and can be set according to actual usage requirements.

[0055] For example, the width of the second overlapping portion 42 is greater than 0.5 mm. That is, the dimension of the second overlapping portion 42 in the direction of the spacing between the first heat sink 31 and the second heat sink 32 is greater than 0.5 mm. For example, the width of the second overlapping portion 42 can be 0.6 mm, 0.7 mm, or 0.8 mm. The specific dimension of the width of the second overlapping portion 42 is not limited here and can be set according to actual usage requirements.

[0056] For example, the width of the heat transfer plate 40 is 10mm-15mm. The dimension of the heat transfer plate 40 in the direction of the spacing between the first heat sink 31 and the second heat sink 32 is 10mm-15mm. For example, the width of the heat transfer plate 40 can be 10mm, 11mm, 12mm, 13mm, 14mm, or 15mm. The specific dimension of the width of the heat transfer plate 40 is not limited here and can be set according to actual usage requirements.

[0057] For example, the width of the first overlap 41 is greater than 0.5 mm, the width of the second overlap 42 is greater than 0.5 mm, and the width of the heat transfer plate 40 is 10 mm to 15 mm.

[0058] Reference Figure 2As shown, in one embodiment, a first clearance groove 43 is provided on the side of the heat transfer plate 40 facing the first heat sink 31, and the first clearance groove 43 is used to avoid the first heat sink 31. By providing the first clearance groove 43 on the side of the heat transfer plate 40 facing the first heat sink 31, the present embodiment can avoid interference between the first heat sink 31 and the heat transfer plate 40 during the folding process of the first frame and the second frame of the electronic device, thereby avoiding affecting the folding of the electronic device.

[0059] Reference Figure 2 As shown, in one embodiment, a second clearance groove 44 is provided on the side of the heat transfer plate 40 facing the second heat sink 32, and the second clearance groove 44 is used to avoid the second heat sink 32. By providing a second clearance groove 44 on the side of the heat transfer plate 40 facing the second heat sink 32, this embodiment of the present disclosure can avoid interference between the second heat sink 32 and the heat transfer plate 40 during the folding process of the first frame and the second frame of the electronic device, thereby avoiding affecting the folding of the electronic device.

[0060] Reference Figure 2 As shown, in one embodiment, the heat transfer plate 40 has a first clearance groove 43 on the side facing the first heat sink 31, which is used to avoid the first heat sink 31. The heat transfer plate 40 also has a second clearance groove 44 on the side facing the second heat sink 32, which is used to avoid the second heat sink 32. This embodiment of the present disclosure prevents interference between the first heat sink 31 and the second heat sink 32 and the heat transfer plate by providing the first and second clearance grooves.

[0061] Reference Figures 3 to 7 As shown, in one embodiment, the rotating shaft mechanism 50 includes a bearing seat 51, a first rotating shaft 52, a second rotating shaft 53, and a support plate 54. The first rotating shaft 52 and the second rotating shaft 53 are rotatably connected to the bearing seat 51 at intervals. The first frame 11 is rotatably connected to the first rotating shaft 52, and the second frame 12 is rotatably connected to the second rotating shaft 53. The support plate 54 is located on the bearing seat 51, and the support plate 54 has a mounting groove, in which the heat transfer plate 40 is located.

[0062] Reference Figures 4 to 7 As shown, in one embodiment, the electronic device further includes an elastic element 60 connected to a heat transfer plate 40. During the transition of the mid-frame structure from an unfolded state to a folded state, the heat transfer plate 40 gradually presses against the elastic element 60. In the unfolded state, the elastic element 60 drives the heat transfer plate 40 to press against the edges of the first heat sink 31 and the second heat sink 32. Exemplarily, the elastic element 60 is a spring.

[0063] Reference Figure 4 and Figure 5As shown, exemplarily, the control module is located within the first frame 11. When the electronic device is in the unfolded state, the heat generated by the control module is transferred through the first frame 11 to the first heat sink 31, and then through the first heat sink 31 to the heat transfer plate 40. The heat transfer plate 40 then transfers the heat to the second heat sink 32 located in the second frame 12. The second heat sink 32 is attached to the second frame 12 with thermally conductive adhesive, and the second heat sink 32 transfers heat to the second frame 12, achieving simultaneous heat dissipation for both the first frame 11 and the second frame 12. Furthermore, the heat transfer plate 40 is equipped with an elastic element 60 for lifting and lowering, which not only provides space for the flexible display module 20 but also allows the elastic force of the elastic element 60 to press the heat transfer plate 40 against the first heat sink 31 and the second heat sink 32, facilitating better heat transfer and achieving better heat dissipation.

[0064] Reference Figure 6 and Figure 7 As shown, exemplarily, when the electronic device is in a folded state, the mid-frame structure provides no support for the heat transfer plate 40. Under the elastic force of the elastic member 60, the heat transfer plate 40 moves downward, providing more space for the flexible display module 20. With the trend of increasingly smaller screen bending radii, the entire electronic device requires more vertical space to accommodate the flexible display module. This embodiment of the present disclosure uses the elastic member 60 to achieve the lifting and lowering of the heat transfer plate 40, which can meet the requirement of a small screen bending radius for electronic devices.

[0065] The heat transfer plate 40 of this embodiment is arranged to extend and retract vertically by the elastic deformation of the elastic member 60. When the electronic device is in the unfolded state, the heat transfer plate 40 supports the flexible display module under the action of the middle frame structure. When the electronic device is in the folded state, the heat transfer plate 40 sinks under the compression force of the elastic member 60, thereby providing a larger accommodating space for the flexible display module.

[0066] Reference Figure 5 and Figure 7 As shown, in one embodiment, the two ends of the elastic member 60 are connected to the heat transfer plate 40 and the bearing 51, respectively. A support column 45 protrudes from the side of the heat transfer plate 40 away from the flexible display module 20, and the elastic member 60 is mounted on the support column 45. This embodiment of the present disclosure uses the elastic member 60 to achieve the lifting and lowering of the heat transfer plate 40, providing a larger accommodating space for the entire screen of the electronic device and meeting the requirement of a small bending radius for foldable electronic devices.

[0067] In one embodiment, the extension height of the elastic member 60 is 0.5mm-1.0mm. Exemplarily, the extension height of the elastic member 60 is 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, or 1.0mm.

[0068] The electronic devices provided in this disclosure may include, but are not limited to, mobile or fixed terminals with folding functions such as mobile phones, tablets, laptops, handheld computers, walkie-talkies, netbooks, wearable devices, virtual reality devices, or vehicle-mounted devices, dashcams, and security equipment.

[0069] Other configurations of the electronic devices described above can be derived from various technical solutions now and in the future known to those skilled in the art, and will not be described in detail here.

[0070] In the description of this specification, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0071] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this disclosure, "multiple" means two or more, unless otherwise explicitly specified.

[0072] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0073] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0074] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this disclosure. To simplify this disclosure, the components and arrangements of specific examples are described above. Of course, these are merely examples and are not intended to limit this disclosure. Furthermore, reference numerals and / or reference letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0075] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this disclosure, and these should all be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. An electronic device, characterized in that, include: The middle frame structure includes a first frame and a second frame, with a pivot mechanism between the first frame and the second frame. The first frame and the second frame can rotate around the pivot mechanism to switch between an unfolded state and a folded state. A control module is provided inside the first frame or the second frame. The first frame and the second frame together define an accommodating space. The flexible display module is located in the accommodating space; The heat dissipation assembly includes a first heat sink and a second heat sink, wherein the first heat sink is located between the flexible display module and the first frame, and the second heat sink is located between the flexible display module and the second frame; A heat transfer plate is located on the side of the rotating shaft mechanism facing the flexible display module. The edge of the first heat sink overlaps with the side of the heat transfer plate opposite to the flexible display module, and the edge of the second heat sink overlaps with the side of the heat transfer plate opposite to the flexible display module. The heat transfer plate is provided with a first clearance groove on the side facing the first heat sink, the first clearance groove being used to avoid the first heat sink; and / or, the heat transfer plate is provided with a second clearance groove on the side facing the second heat sink, the second clearance groove being used to avoid the second heat sink.

2. The electronic device according to claim 1, characterized in that, The first heat sink is attached to the first frame using thermally conductive adhesive; and / or, the second heat sink is attached to the second frame using thermally conductive adhesive.

3. The electronic device according to claim 1, characterized in that, The first heat sink is made of graphite or metal; and / or the second heat sink is made of graphite or metal.

4. The electronic device according to claim 1, characterized in that, The heat transfer plate includes a first overlapping portion and a second overlapping portion. The first overlapping portion is disposed on the side of the heat transfer plate opposite to the flexible display module and is used to overlap with the first heat sink. The second overlapping portion is disposed on the side of the heat transfer plate opposite to the flexible display module and is used to overlap with the second heat sink. The first overlapping portion is provided with a thermally conductive layer. And / or, the second overlapping portion is provided with a thermally conductive layer.

5. The electronic device according to claim 4, characterized in that, The width direction of the first overlapping portion, the width direction of the second overlapping portion, and the width direction of the heat transfer plate are the spacing arrangement directions of the first heat sink and the second heat sink; wherein: the width of the first overlapping portion is greater than 0.5mm; and / or, the width of the second overlapping portion is greater than 0.5mm; and / or, the width of the heat transfer plate is 10mm-15mm.

6. The electronic device according to claim 1, characterized in that, The rotating shaft mechanism includes a bearing seat, a first rotating shaft, a second rotating shaft, and a support plate. The first rotating shaft and the second rotating shaft are rotatably connected to the bearing seat at intervals. The first frame is rotatably connected to the first rotating shaft, and the second frame is rotatably connected to the second rotating shaft. The support plate is located on the bearing seat and has a mounting groove. The heat transfer plate is located in the mounting groove.

7. The electronic device according to claim 6, characterized in that, The electronic device also includes an elastic element connected to the heat transfer plate. During the process of the middle frame structure switching from the unfolded state to the folded state, the heat transfer plate gradually squeezes the elastic element. In the unfolded state, the elastic element drives the heat transfer plate to press the edges of the first heat sink and the second heat sink together.

8. The electronic device according to claim 7, characterized in that, The two ends of the elastic element are connected to the heat transfer plate and the shaft seat respectively. The heat transfer plate has a protruding support column on the side away from the flexible display module, and the elastic element is installed on the support column.

9. The electronic device according to claim 7, characterized in that, The extension height of the elastic element is 0.5mm-1.0mm.

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