A system and method for rapid de-bonding of waste photovoltaic laminates using a wet process
By precisely drilling holes in the photovoltaic laminate and utilizing the composite physical field in the unsealing mechanism, the problem of slow wet unsealing process was solved, achieving rapid unsealing and efficient recycling.
Patent Information
- Application Number
- CN202311810552.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-26
- Publication Date
- 2025-11-04
- Estimated Expiration
- 2043-12-26
AI Technical Summary
The existing wet desealing process for waste photovoltaic lamination is too slow, taking several days.
A drilling mechanism is used to identify the thickness of photovoltaic laminates and perform precise drilling. Combined with the combined physical field effects of debonding solvent, heating, ultrasound and electrostatic field in the desealing mechanism, rapid desealing is achieved.
The unsealing process can be completed within 1 hour, maintaining structural integrity and enabling the recovery of intact glass panels and battery chips, significantly improving processing efficiency.
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Figure CN117863273B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of photovoltaic recycling and processing, and in particular to a wet method for rapidly desealing waste photovoltaic laminates. Background Technology
[0002] Solar cells generate electricity on a simple principle, producing no mechanical movement, consuming no fuel, and emitting no substances, including greenhouse gases, during the process. They are also noiseless and pollution-free. Compared to traditional energy sources, solar energy can be considered the cleanest and most sustainable energy type. Therefore, solar cells have been widely promoted and used since their inception. It is estimated that by 2050, the amount of waste solar cells will reach 60-78 million tons. my country anticipates that the amount of waste photovoltaic laminates will reach 8 million tons per year, containing large amounts of waste glass, silicon wafers, PET, and small amounts of metal components. The recycling of decommissioned photovoltaic laminates is crucial for the closed-loop development of the photovoltaic industry and is one of the major needs of the country's dual-carbon development strategy.
[0003] For example, patent CN116535734A provides a method for decomposing ethylene-vinyl acetate copolymer (EVA) using a combination of active oxygen and ultrasound. This method utilizes the combined action of active oxygen and ultrasound to decompose the EVA. Ultrasound accelerates the diffusion rate of active oxygen in the solution, allowing it to more quickly find EVA molecules and destroy their molecular structures such as -CH2- and -CO□CH2-, thereby disrupting the EVA cross-linked network structure and causing it to lose its inherent properties, thus achieving the decomposition effect. Furthermore, this method reduces the VA content in the EVA molecules, enabling material regeneration through thermal remelting, facilitating subsequent recycling processes.
[0004] However, it has the following problems: the kinetic process of conventional wet unsealing is too slow, requiring 72 hours or even longer. Summary of the Invention
[0005] In view of this, it is necessary to provide a method for rapidly desealing waste photovoltaic laminates using a wet process to solve the problem of slow existing desealing processes.
[0006] This invention provides a wet-process rapid desealing system for waste photovoltaic lamination, comprising:
[0007] A drilling mechanism includes a base, an identification module, and a drilling module. The identification module is fixed above the base and is used to identify the backsheet thickness and chip thickness of the photovoltaic laminate on the base. The drilling module is located above the base and can move relative to the base. It drills holes in the photovoltaic laminate on the base according to the identification results.
[0008] The unsealing mechanism includes a box containing a debonding solvent, a heating module, an ultrasonic module, and an electrostatic module. The heating module is fixed to the bottom of the box and is used to heat the debonding solvent. The ultrasonic module is arranged around the box and is used to emit ultrasonic waves into the box. The electrostatic module is fixed to the outside of the box to place the box in an electrostatic field.
[0009] A transport mechanism for transporting the perforated photovoltaic laminate from the base to the unsealing mechanism.
[0010] Optionally, the recognition module includes a bracket, a crossbeam, a recognition camera, and a recognition processor. The bracket is vertically fixed on the base, the crossbeam is arranged horizontally, the recognition camera is fixed on the crossbeam and faces the base, and the recognition processor is electrically connected to the recognition camera and the punching module. It can receive the content captured by the recognition camera, perform recognition, generate a punching command based on the recognition result, and send it to the punching module.
[0011] Optionally, the punching module includes a translation component and a punching component. The translation component is fixed on the bracket, and the movable end of the translation component is fixed to the punching component, which can drive the punching component to translate relative to the base.
[0012] Optionally, the translation component includes a pair of fixed beams, a pair of first sliders, a connecting beam, and a second slider. The pair of fixed beams are arranged parallel to each other and both ends are fixed to the bracket. The fixed beams are provided with sliding tracks for the first sliders to slide on. The pair of first sliders are slidably connected to the pair of fixed beams respectively. Both ends of the connecting beam are fixed to the first sliders respectively. The connecting beam is provided with tracks for the second sliders to slide on. The second sliders are slidably connected to the connecting beams. The perforated component is fixed to the second slider.
[0013] Optionally, the heating module includes a resistance wire and a power supply. The resistance wire is arranged in a serpentine pattern at the bottom of the housing, and the power supply is electrically connected to the resistance wire.
[0014] Optionally, the electrostatic module includes a strut, a pair of electrode plates, and a power supply. The strut spans the housing, and the electrode plates are fixed on the strut and located on both sides of the housing, and are electrically connected to the power supply.
[0015] Optionally, it also includes a pressure-blocking component, which includes a telescopic cylinder and a pressure plate. The telescopic cylinder is fixed on the cross-stand, and the movable end of the telescopic cylinder is fixed to the pressure plate. When the movable end of the telescopic cylinder is extended to its maximum state, the pressure plate is immersed in the liquid inside the box.
[0016] This invention also provides a method for rapid desealing of waste photovoltaic laminations using a wet process, based on the aforementioned system for rapid desealing of waste photovoltaic laminations using a wet process, comprising the following steps:
[0017] S1. Identify the photovoltaic laminate and determine the drilling depth, drilling diameter, and drilling density;
[0018] S2. Drill holes in the photovoltaic laminate according to the determined drilling depth, drilling diameter and drilling density;
[0019] S3. Soak the perforated photovoltaic laminate in a debonding solvent;
[0020] S4. Heat the soaking solution and apply an electrostatic field and ultrasound to accelerate the unsealing process;
[0021] S5. After completion, remove the laminate for dismantling.
[0022] Optionally, step S1 includes:
[0023] S11, Take a picture of the photovoltaic laminate.
[0024] S12, Determine the dimensions of the photovoltaic laminate, backsheet thickness, and cell thickness based on the photograph.
[0025] S13 determines the drilling depth, drilling diameter, and drilling density based on the size, backplane thickness, and chip thickness.
[0026] Optionally, in step S23, the pore density is 25-50 pores / cm². 2 The pore size is 100-500um.
[0027] The beneficial effects of this invention are as follows:
[0028] This invention includes a drilling mechanism and a desealing mechanism. The drilling mechanism can identify the backsheet thickness and chip thickness of the photovoltaic laminate on the substrate and drill holes in the photovoltaic laminate according to the identification results. The desealing mechanism immerses the drilled photovoltaic laminate and utilizes the energy conditions of a composite physical field to promote the decrosslinking and decoupling reactions during the desealing process, achieving a reaction rate amplification effect of tens of times. This method can deseal the laminate within 1 hour without damaging the integrity of the structure, and can recover the complete glass plate, backsheet, and battery chip. Compared with existing technologies, it can significantly accelerate the desealing process and improve processing efficiency. Attached Figure Description
[0029] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0030] Figure 1 This is a schematic diagram of the drilling mechanism in the wet-method rapid unsealing waste photovoltaic lamination system of the present invention;
[0031] Figure 2 This is a cross-sectional schematic diagram of the drilling mechanism in the wet rapid unsealing waste photovoltaic lamination system of the present invention;
[0032] Figure 3 This is a schematic diagram of the unsealing mechanism in the wet rapid unsealing waste photovoltaic lamination system of the present invention;
[0033] Figure 4 This is a schematic diagram of the unsealing mechanism in the wet rapid unsealing waste photovoltaic lamination system of the present invention from another angle;
[0034] Wherein: 1-Drilling mechanism, 11-Base, 12-Identification module, 121-Bracket, 122-Crossbeam, 123-Identification camera, 13-Drilling module, 131-Transfer component, 131a-Fixed beam, 131b-First slider, 131c-Connecting beam, 131d-Second slider, 132-Drilling component, 2-Unsealing mechanism, 21-Box body, 22-Heating module, 221-Resistance wire, 23-Ultrasonic module, 24-Electrostatic module, 241-Straddle frame, 242-Electrode sheet, 25-Pressure component, 251-Telescopic cylinder, 252-Pressure plate. Detailed Implementation
[0035] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, which form part of this application and are used together with the embodiments of the present invention to illustrate the principles of the present invention, but are not intended to limit the scope of the present invention.
[0036] like Figures 1-4As shown, an embodiment of the present invention provides a wet-process rapid desealing system for waste photovoltaic laminates, comprising: a drilling mechanism 1, a conveying mechanism, and a desealing mechanism 2. The drilling mechanism 1 includes a base 11, an identification module 12, and a drilling module 13. The identification module 12 is fixed above the base 11 and is used to identify the backsheet thickness and chip thickness of the photovoltaic laminate on the base 11. The drilling module 13 is located above the base 11 and can move relative to the base 11, and drills the photovoltaic laminate on the base 11 according to the identification result. The photovoltaic laminate with completed drilling is transported from the base 11 to the unsealing mechanism 2. The unsealing mechanism 2 includes a box 21 containing a debonding solvent, a heating module 22, an ultrasonic module 23, and an electrostatic module 24. The heating module 22 is fixed to the bottom of the box 21 and is used to heat the debonding solvent. The ultrasonic module 23 is arranged around the box 21 and is used to emit ultrasonic waves into the box 21. The electrostatic module 24 is fixed to the outside of the box 21 so that the box 21 is in an electrostatic field.
[0037] This invention includes a drilling mechanism 1 and an unsealing mechanism 2. The drilling mechanism 1 can identify the backsheet thickness and chip thickness of the photovoltaic laminate on the base 11, and drill holes in the photovoltaic laminate according to the identification results. The unsealing mechanism 2 immerses the drilled photovoltaic laminate, utilizing the energy conditions of a composite physical field to promote the de-crosslinking and decoupling reactions during the unsealing process, achieving a reaction rate amplification effect of tens of times. This method can unseal the laminate within 1 hour without damaging the integrity of the structure, and can recover the complete glass plate, backsheet, and battery chip. Compared with existing technologies, it can significantly accelerate the unsealing process and improve processing efficiency.
[0038] Specifically, the drilling mechanism 1 includes a base 11, an identification module 12, and a drilling module 13. The identification module 12 is fixed above the base 11 and is used to identify the backsheet thickness and chip thickness of the photovoltaic laminate on the base 11. The drilling module 13 is located above the base 11 and can move relative to the base 11, and drills holes in the photovoltaic laminate on the base 11 according to the identification results.
[0039] Furthermore, the base 11 is flat, and its upper surface is used to support the photovoltaic laminate to be drilled.
[0040] Furthermore, the recognition module 12 includes a bracket 121, a crossbeam 122, a recognition camera 123, and a recognition processor. The bracket 121 is vertically fixed on the base 11, the crossbeam 122 is arranged horizontally, the recognition camera 123 is fixed on the crossbeam 122 and faces the base 11, and the recognition processor is electrically connected to the recognition camera 123 and the punching module 13. It can receive the content captured by the recognition camera 123 for recognition, generate a punching command based on the recognition result, and send it to the punching module 13.
[0041] Furthermore, in order to better photograph and identify the photovoltaic laminate on the base 11, the identification camera 123 is positioned at the center of the base 11.
[0042] Furthermore, the punching module 13 includes a translation component 131 and a punching component 132. The translation component 131 is fixed on the bracket 121, and the movable end of the translation component 131 is fixed to the punching component 132, which can drive the punching component 132 to translate relative to the base 11 so that the movement range of the punching component 132 can cover the base 11.
[0043] Furthermore, the translation component 131 includes a pair of fixed beams 131a, a pair of first sliders 131b, a connecting beam 131c, and a second slider 131d. The pair of fixed beams 131a are arranged parallel to each other and both ends are fixed to the bracket 121. The fixed beams 131a are provided with sliding tracks for the first sliders 131b to slide on. The pair of first sliders 131b are slidably connected to the pair of fixed beams 131a respectively. Both ends of the connecting beam 131c are fixed to the first sliders 131b respectively. The connecting beam 131c is provided with tracks for the second slider 131d to slide on. The second slider 131d is slidably connected to the connecting beam 131c. The perforated component 132 is fixed on the second slider 131d.
[0044] The first slider 131b can drive the punching member 132 to translate along the first direction, and the second slider 131d can drive the punching member 132 to translate along the second direction, thereby enabling the movement range of the punching member 132 to cover the base 11.
[0045] Furthermore, the punching component 132 is a common laser puncher on the market, and its punching power is adjustable. The punching component 132 is electrically connected to the recognition processor and can punch holes according to the punching instructions of the recognition processor.
[0046] Specifically, the conveying mechanism is used to transport the perforated photovoltaic laminate from the base 11 to the unsealing mechanism 2. In this embodiment, the conveying mechanism is a robotic arm, which can grasp the perforated photovoltaic laminate on the base 11 and place it into the unsealing mechanism 2.
[0047] Specifically, the unsealing mechanism 2 includes a box 21 containing a debonding solvent, a heating module 22, an ultrasonic module 23, and an electrostatic module 24. The heating module 22 is fixed to the bottom of the box 21 and is used to heat the debonding solvent. The ultrasonic module 23 is arranged around the box 21 and is used to emit ultrasonic waves into the box 21. The electrostatic module 24 is fixed to the outside of the box 21 so that the box 21 is in an electrostatic field.
[0048] Furthermore, the housing 21 is a transparent housing, which facilitates observation of the processing of the photovoltaic laminates inside.
[0049] Furthermore, the heating module 22 includes a resistance wire 221 and a power supply. The resistance wire 221 is arranged in a serpentine pattern at the bottom of the housing 21, and the power supply is electrically connected to the resistance wire 221. The resistance wire 221 can generate heat to heat the components inside the housing 21.
[0050] Furthermore, the ultrasonic module 23 includes at least one pair of ultrasonic transmitters, which are disposed opposite each other on both sides of the housing 21.
[0051] Furthermore, the ultrasonic transmitter has a frequency of 40-80 kHz and a power density of 0.5-1 W / cm². 2 .
[0052] Furthermore, the electrostatic module 24 includes a spanning frame 241, a pair of electrode plates 242, and a power supply. The spanning frame 241 spans the housing 21, and the electrode plates 242 are fixed on the spanning frame 241 and located on both sides of the housing 21, and are electrically connected to the power supply. When the electrode plates 242 are energized, they can form an electrostatic field around the housing 21, accelerating the desealing of the photovoltaic laminate.
[0053] Furthermore, it also includes a pressing component 25, which includes a telescopic cylinder 251 and a pressing plate 252. The telescopic cylinder 251 is fixed to the cross-stand 241, and the movable end of the telescopic cylinder 251 is fixed to the pressing plate 252. When the movable end of the telescopic cylinder 251 is extended to its maximum state, the pressing plate 252 is immersed in the liquid inside the housing 21. Its function is to press the floating photovoltaic laminate into the liquid, so that it is completely submerged, thereby accelerating the unsealing speed.
[0054] This invention also provides a method for rapid desealing of waste photovoltaic laminations using a wet process, which utilizes the aforementioned system for rapid desealing of waste photovoltaic laminations using a wet process and includes the following steps:
[0055] S1. Identify the photovoltaic laminate and determine the drilling depth, drilling diameter, and drilling density;
[0056] S2. Drill holes in the photovoltaic laminate according to the determined drilling depth, drilling diameter and drilling density;
[0057] S3. Soak the perforated photovoltaic laminate in a debonding solvent;
[0058] S4. Heat the soaking solution and apply an electrostatic field and ultrasound to accelerate the unsealing process;
[0059] S5. After completion, remove the laminate for dismantling.
[0060] The present invention utilizes a wet method for rapid desealing of waste photovoltaic laminates. Before solvent immersion, holes are drilled to facilitate solvent entry into the interior of the photovoltaic laminate, enabling rapid desealing. Compared with existing technologies, this method can significantly accelerate the desealing process and improve processing efficiency.
[0061] Furthermore, step S1 includes:
[0062] S11, Take a picture of the photovoltaic laminate.
[0063] S12, Determine the dimensions of the photovoltaic laminate, backsheet thickness, and cell thickness based on the photograph.
[0064] S13 determines the drilling depth, drilling diameter, and drilling density based on the size, backplane thickness, and chip thickness.
[0065] Photovoltaic laminates typically consist of a backsheet, a first EVA layer, solar cells, a second EVA layer, and a glass plate, from top to bottom. When drilling, the hole needs to penetrate to the second EVA layer without contacting the glass plate. The purpose is to allow the solvent to reach the second EVA layer, effectively breaking the silane coupling at the glass-adhesive interface. However, if the hole contacts the glass plate, it will cause the glass to shatter, mixing the products and increasing the complexity of subsequent separation steps. Therefore, the thickness of the backsheet and solar cells is determined by photographic identification, which in turn determines the depth of the hole.
[0066] Generally, the micropore density is 25-50 pores / cm³. 2 The aperture is 100-500um. The specific quantity and aperture are then determined based on the dimensions of the photovoltaic laminate.
[0067] The implementation process of this invention is as follows:
[0068] The photovoltaic laminate to be processed is placed on the base 11. The identification module 12 identifies the photovoltaic laminate, determines its size, backsheet thickness, and cell thickness, and determines the drilling depth, drilling diameter, and drilling density based on these parameters. The drilling module 13 moves relative to the photovoltaic laminate and begins drilling according to the determined drilling depth, drilling diameter, and drilling density. After drilling is completed, the conveying mechanism delivers the drilled photovoltaic laminate into the housing 21. The heating module 22 heats the liquid inside the housing 21 to a suitable temperature. The ultrasonic module 23 emits ultrasonic waves into the housing 21. The electrostatic module 24 creates an electrostatic field around the housing 21, accelerating the unsealing of the photovoltaic laminate. The contact end of the pressing component 25 extends, pressing the floating photovoltaic laminate into the liquid, completely submerging it and accelerating the unsealing process. After completion, the laminate is removed for dismantling.
[0069] The beneficial effects of this invention are:
[0070] This invention includes a drilling mechanism and a desealing mechanism. The drilling mechanism can identify the backsheet thickness and chip thickness of the photovoltaic laminate on the substrate and drill holes in the photovoltaic laminate according to the identification results. The desealing mechanism immerses the drilled photovoltaic laminate and utilizes the energy conditions of a composite physical field to promote the decrosslinking and decoupling reactions during the desealing process, achieving a reaction rate amplification effect of tens of times. This method can deseal the laminate within 1 hour without damaging the integrity of the structure, and can recover the complete glass plate, backsheet, and battery chip. Compared with existing technologies, it can significantly accelerate the desealing process and improve processing efficiency.
[0071] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.
[0072] In the description of this invention, "first feature" and "second feature" may include one or more of the features. In the description of this invention, "a plurality of" means two or more. In the description of this invention, "above" or "below" the second feature may include direct contact between the first and second features, or it may include contact between the first and second features not being in direct contact but through another feature between them. In the description of this invention, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicating that the first feature is at a higher horizontal level than the second feature.
[0073] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0074] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims
1. A wet-process rapid desealing system for waste photovoltaic lamination, characterized in that, include: A drilling mechanism includes a base, an identification module, and a drilling module. The identification module is fixed above the base and is used to identify the backsheet thickness and chip thickness of the photovoltaic laminate on the base. The drilling module is located above the base and can move relative to the base. It drills holes in the photovoltaic laminate on the base according to the identification results. The unsealing mechanism includes a box containing a debonding solvent, a heating module, an ultrasonic module, and an electrostatic module. The heating module is fixed to the bottom of the box and is used to heat the debonding solvent. The ultrasonic module is arranged around the box and is used to emit ultrasonic waves into the box. The electrostatic module is fixed to the outside of the box to place the box in an electrostatic field. A conveying mechanism for conveying the perforated photovoltaic laminate from the base to the unsealing mechanism; The identification module includes a bracket, a crossbeam, an identification camera, and an identification processor. The bracket is vertically fixed to the base, the crossbeam is horizontally positioned, the identification camera is fixed to the crossbeam and faces the base, and the identification processor is electrically connected to the identification camera and the punching module. It can receive and identify the content captured by the identification camera, generate a punching command based on the identification result, and send it to the punching module. The electrostatic module includes a strut, a pair of electrode plates, and a power supply. The strut spans the housing, the electrode plates are fixed to the strut and located on both sides of the housing, and are electrically connected to the power supply. It also includes a pressing component, which includes a telescopic cylinder and a pressing plate. The telescopic cylinder is fixed to the strut, and the movable end of the telescopic cylinder is fixed to the pressing plate. When the movable end of the telescopic cylinder is extended to its maximum state, the pressing plate is immersed in the liquid inside the housing.
2. The wet-process rapid desealing system for waste photovoltaic lamination as described in claim 1, characterized in that, The punching module includes a translation component and a punching component. The translation component is fixed on the bracket, and the movable end of the translation component is fixed to the punching component, which can drive the punching component to translate relative to the base.
3. The wet-process rapid desealing system for waste photovoltaic lamination as described in claim 2, characterized in that, The translation component includes a pair of fixed beams, a pair of first sliders, a connecting beam, and a second slider. The pair of fixed beams are arranged parallel to each other and both ends are fixed to the bracket. The fixed beams are provided with sliding tracks for the first sliders to slide on. The pair of first sliders are slidably connected to the pair of fixed beams respectively. Both ends of the connecting beam are fixed to the first sliders respectively. The connecting beam is provided with tracks for the second sliders to slide on. The second sliders are slidably connected to the connecting beams. The perforated component is fixed to the second slider.
4. The wet-process rapid desealing system for waste photovoltaic lamination as described in claim 1, characterized in that, The heating module includes a resistance wire and a power supply. The resistance wire is arranged in a serpentine pattern at the bottom of the housing, and the power supply is electrically connected to the resistance wire.
5. A method for rapid desealing of waste photovoltaic lamination using a wet process, based on the wet rapid desealing system for waste photovoltaic lamination as described in any one of claims 1-4, characterized in that, Includes the following steps: S1. Identify the photovoltaic laminate and determine the drilling depth, drilling diameter, and drilling density; S2. Drill holes in the photovoltaic laminate according to the determined drilling depth, drilling diameter and drilling density; S3. Soak the perforated photovoltaic laminate in a debonding solvent; S4. Heat the soaking solution and apply an electrostatic field and ultrasound to accelerate the unsealing process; S5. After completion, remove the laminate for dismantling.
6. The method for rapid desealing of waste photovoltaic laminates using a wet process as described in claim 5, characterized in that, Step S1 includes: S11, Take a picture of the photovoltaic laminate. S12, Determine the dimensions of the photovoltaic laminate, backsheet thickness, and cell thickness based on the photograph. S13 determines the drilling depth, drilling diameter, and drilling density based on the size, backplane thickness, and chip thickness.
7. The method for rapid desealing of waste photovoltaic laminates using a wet process as described in claim 5, characterized in that, In step S13, the pore density is 25-50 pores / cm². 2 The pore size is 100-500um.
Citation Information
Patent Citations
Photovoltaic glass laser-drilling device and control method thereof
CN113399847A
Ultrasonic-assisted crystalline silicon cell glass separation and EVA (Ethylene Vinyl Acetate) recovery method
CN115007622A