Semiconductor device cooling apparatus

Abstract

The present disclosure provides a semiconductor device cooling device for cooling a semiconductor device, the semiconductor device cooling device comprising a cooling part and a driving part, the cooling part being provided with a first cooling medium channel; the driving part being capable of lifting between a first position and a second position, in the first position, the driving part cooperates with the cooling part to support the semiconductor device to be cooled together with the cooling part, in the second position, the driving part ejects the semiconductor device to separate the semiconductor device from the cooling part, in the present disclosure, on the one hand, the cooling mode of liquid cooling effectively improves the refrigeration efficiency of the semiconductor device, on the other hand, the driving part driven to the second position has sufficient grabbing space and good force point between the lower surface of the semiconductor device placed on the surface of the driving part and the upper surface of the cooling part, thereby realizing the stable grabbing of the semiconductor device.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor technology, and more particularly to a semiconductor device cooling device. Background Technology

[0002] In the manufacturing process of semiconductor devices, cooling is required. Existing semiconductor device cooling methods generally involve setting the flow rate of nitrogen gas into the semiconductor device's bearing area during the cooling process stage and adjusting the cooling fan speed to a high level. Under the premise of ensuring that the oxygen content meets the standard, the semiconductor device is continuously cooled to a specified temperature. This cooling method lacks quantitative consideration of the required cooling time and has poor cooling efficiency. Summary of the Invention

[0003] The following is an overview of the subject matter described in detail in this disclosure. This overview is not intended to limit the scope of the claims.

[0004] This disclosure provides a semiconductor device cooling apparatus for cooling a semiconductor device, the semiconductor device cooling apparatus comprising:

[0005] A cooling section is provided therein, and a first cooling medium channel is provided therein;

[0006] The driving unit is capable of moving up and down between a first position and a second position. In the first position, the driving unit cooperates with the cooling unit to support the semiconductor device to be cooled together with the cooling unit. In the second position, the driving unit pushes the semiconductor device out so that the semiconductor device is separated from the cooling unit.

[0007] According to some embodiments of this disclosure, the cooling section is provided with a receiving hole. In the first position, the driving section is located inside the receiving hole, and in the second position, at least a portion of the structure of the driving section is higher than the receiving hole.

[0008] According to some embodiments of this disclosure, the cooling section has a disc-shaped structure, the receiving hole is located in the middle of the cooling section, and the first cooling medium channel is arranged around the receiving hole.

[0009] According to some embodiments of this disclosure, the first cooling medium channel includes at least two cooling channels, the cooling channels are annular and connected by radial connecting channels, wherein at least one of the cooling channels is provided with a cooling medium inlet and at least one of the cooling channels is provided with a cooling medium outlet.

[0010] According to some embodiments of this disclosure, the semiconductor device cooling device includes at least one cooling structure group, each of the cooling structure groups including a plurality of cooling sections arranged at intervals from bottom to top, and each cooling section corresponding to a driving section.

[0011] According to some embodiments of this disclosure, the semiconductor device cooling device further includes a support, wherein a cooling medium inlet main and a cooling medium outlet main are provided in the support extending vertically;

[0012] Each of the cooling units is provided with a cooling medium input branch and a cooling medium output branch. One end of the cooling medium input branch is connected to the cooling medium input main line, and the other end is connected to the first cooling medium channel. One end of the cooling medium output branch is connected to the cooling medium input main line, and the other end is connected to the first cooling medium channel.

[0013] According to some embodiments of this disclosure, the semiconductor device cooling device further includes:

[0014] A cooling medium inlet branch pipe, the inner cavity of which forms the cooling medium inlet branch, one end of which is connected to the bracket, and the other end of which is connected to the cooling section;

[0015] A cooling medium output branch pipe, the inner cavity of which forms the cooling medium output branch, one end of which is connected to the bracket, and the other end of which is connected to the cooling section.

[0016] According to some embodiments of this disclosure, a pressure detection device and a pressure regulating device are provided on the cooling medium input bus.

[0017] According to some embodiments of this disclosure, the semiconductor device cooling device further includes a lifting mechanism, which includes a main lifting arm extending vertically and lifting support arms respectively provided corresponding to each of the driving units. One end of each lifting support arm is connected to the main lifting arm, and the other end is connected to the corresponding driving unit.

[0018] According to some embodiments of this disclosure, the drive unit is provided with a vacuum channel, one end of which penetrates the upper surface of the drive unit, and the other end of which is connected to a vacuum pumping device.

[0019] According to some embodiments of this disclosure, the drive unit has a disc-shaped structure and is provided with a plurality of through holes that extend along its axis. The plurality of through holes are arranged around the axis of the drive unit, and the through holes constitute the vacuum channel.

[0020] According to some embodiments of this disclosure, the semiconductor device cooling device includes a plurality of driving units, and the vacuum channel of each driving unit is connected to the vacuum main circuit through a vacuum branch circuit, and the vacuum main circuit is connected to the vacuum device.

[0021] According to some embodiments of this disclosure, the surface smoothness of the upper surface of the cooling section is 1500 mesh to 2500 mesh; and / or,

[0022] The surface smoothness of the upper surface of the drive unit is 1500 mesh to 2500 mesh.

[0023] According to some embodiments of this disclosure, a second cooling medium channel is provided in the drive unit, and at the first position, the second cooling medium channel is connected to the first cooling medium channel.

[0024] According to some embodiments of this disclosure, a switch structure is provided between the first cooling medium channel and the second cooling medium channel. When the driving part is in the first position, the switch structure controls the second cooling medium channel to remain in a connected state. When the driving part is in the second position, the switch structure controls the second cooling medium channel to be in a closed state.

[0025] The semiconductor device cooling apparatus provided in this embodiment uses a cooling medium in a first cooling medium channel to cool the cooling section and the semiconductor device placed on the upper surface of the cooling section. Liquid cooling accelerates the cooling process of the semiconductor device, shortening the total time of the semiconductor device cooling process, thereby reducing the total time and production efficiency of the semiconductor device manufacturing process. Furthermore, after the semiconductor device completes the cooling process, the driving section is controlled to move its overall position upwards until it reaches a second position. At this point, there is sufficient gripping space between the lower surface of the semiconductor device and the upper surface of the cooling section. The gripping force can be set on the lower surface of the semiconductor device, thus ensuring stable gripping of the semiconductor device after cooling without increasing the gripping force. This avoids damage to the semiconductor device during gripping, thereby improving the yield rate of the semiconductor device.

[0026] After reading and understanding the accompanying diagrams and detailed descriptions, the other aspects can be understood. Attached Figure Description

[0027] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of these embodiments. In these drawings, similar reference numerals are used to denote similar elements. The drawings described below are some embodiments of the present disclosure, but not all embodiments. Other drawings will be readily available to those skilled in the art based on these drawings without inventive effort.

[0028] Figure 1 This is a schematic diagram of the structure of a semiconductor device cooling device in related technologies;

[0029] Figure 2 This is a three-dimensional structure of a semiconductor device cooling device when the driving part is in a first position, according to an exemplary embodiment.

[0030] Figure 3 This is a front view of a semiconductor device cooling device with the drive unit in a second position, according to an exemplary embodiment.

[0031] Figure 4 This is a three-dimensional structural diagram of the internal structure of a semiconductor device cooling device according to an exemplary embodiment.

[0032] Figure 5 This is a perspective view of the relative structure of the drive section and the cooling section of a semiconductor device cooling apparatus in a second position, according to an exemplary embodiment.

[0033] Figure 6 This is a perspective view of the relative angles between the drive section and the cooling section of a semiconductor device cooling apparatus in a second position, according to an exemplary embodiment.

[0034] Figure 7 This is a perspective view of the relative structure of a first cooling medium channel and a second cooling medium channel of a semiconductor device cooling apparatus in a second position, according to an exemplary embodiment.

[0035] Figure 8 yes Figure 3 Enlarged view of point A in the middle.

[0036] Figure label:

[0037] 1. Semiconductor device; 2. Cooling section; 3. Drive section; 4. First cooling medium channel; 401. Cooling channel; 5. Receiving hole; 6. Cooling structure assembly; 7. Bracket; 701. Base; 702. Support section; 8. Cooling medium inlet main line; 9. Cooling medium outlet main line; 10. Cooling medium inlet branch pipe; 11. Cooling medium outlet branch pipe; 12. First connector; 13. Second connector; 14. First quick connector; 15. Second quick connector; 16. Third quick connector; 17. Fourth quick connector; 18. Pressure detection device; 19. Pressure regulating device; 20. Lifting mechanism; 2001. Main lifting arm; 2002. Lifting support arm; 2002a. Lifting arm Plate; 2002b, Lifting block; 21, Drive device; 2101, Linear stepper motor; 2102, Slide rail; 2103, Slide table; 22, Vacuum pumping device; 23, Through hole; 24, Vacuum pumping branch; 25, Vacuum pumping main line; 26, Lifting hole; 27, Second cooling medium channel; 28, First transmission path; 2801, First transmission branch; 2802, Second transmission branch; 29, Second transmission path; 2901, Third transmission branch; 2902, Fourth transmission branch; 30, First sealing ring; 31, First sealing groove; 32, Second sealing ring; 33, Second sealing groove; 34, Switch structure; 3401, First switch structure; 3402, Second switch structure.

[0038] 35. Cooling base; 7'. Support; 36. Cooling aisle; 3601. Cooling medium inlet; 3602. Cooling medium outlet. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions in the disclosed embodiments will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort are within the scope of protection of this disclosure. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this disclosure can be arbitrarily combined with each other.

[0040] Semiconductor devices are typically cooled using air cooling. However, this method lacks precise control over cooling time and has poor cooling efficiency. Therefore, water cooling can be used to cool semiconductor devices. For example, in related technologies, semiconductor device cooling devices include... Figure 1As shown, it includes a cooling base 35 and a support 7' for supporting the cooling base 35. A cooling channel 36 is provided within the cooling base 35, including a cooling medium inlet 3601 and a cooling medium outlet 3602. The semiconductor device to be cooled is placed on the surface of the cooling base 35. The cooling medium enters the cooling channel 36 through the cooling medium inlet 3601 and exits the cooling channel 36 through the cooling medium outlet 3602. During the cooling medium transfer process, the cooling base 35 and the semiconductor device placed on the surface of the cooling base 35, i.e., the wafer, are cooled. During cooling, since the wafer is placed on the surface of the cooling base 35 from beginning to end, the lower surface of the wafer is in close contact with the upper surface of the cooling base 35, and only the upper surface and sides of the wafer are exposed. This results in the wafer not having a good gripping point when being gripped after cooling. Therefore, the stability of gripping the wafer can only be ensured by increasing the gripping force. Even so, the wafer is still very easy to slip and be damaged during the gripping process. Moreover, due to the increased gripping force, the gripping device is very likely to leave scratches on the wafer surface, which will also cause wafer damage and seriously reduce the wafer yield.

[0041] Based on this, this disclosure provides a semiconductor device cooling apparatus. The cooling medium in the first cooling medium channel cools the cooling section and the semiconductor device placed on the upper surface of the cooling section. Liquid cooling accelerates the cooling process of the semiconductor device, shortening the total time of the semiconductor device cooling process, thereby reducing the total time and production efficiency of the semiconductor device manufacturing process. Furthermore, after the semiconductor device completes the cooling process, a driving unit moves the semiconductor device upwards to a second position. Sufficient gripping space and a good point of contact exist between the lower surface of the semiconductor device and the upper surface of the cooling section. This ensures stable gripping of the semiconductor device after cooling without requiring increased gripping force, preventing damage during gripping and improving the yield rate of the semiconductor device.

[0042] This disclosure provides an exemplary embodiment of a semiconductor device cooling apparatus for cooling a semiconductor device, such as a wafer, silicon wafer, etc. Figure 5 As shown, combined with Figure 8 The semiconductor device cooling device includes a cooling section 2 and a driving section 3. The cooling section 2 is provided with a first cooling medium channel 4. The driving section 3 can move up and down between a first position and a second position. In the first position, the driving section 3 cooperates with the cooling section 2 to support the semiconductor device 1 to be cooled together with the cooling section 2. In the second position, the driving section 3 pushes the semiconductor device 1 out so that the semiconductor device 1 is separated from the cooling section 2.

[0043] In this embodiment, when cooling the semiconductor device 1 is required, the semiconductor device 1 is placed on the surface of the driving part 3. The driving part 3 can be located in either a first position or a second position, but the center of the semiconductor device 1 must be located within the vertical projection area of ​​the driving part 3 to ensure the stability of the driving part 3's support for the semiconductor device 1, whether the driving part 3 is in the first or second position. After the semiconductor device 1 is placed, if the driving part 3 is in the first position, subsequent cooling can be performed directly on the semiconductor device 1, with the cooling part 2 and the driving part 3 jointly supporting it. If the driving part 3 is in any position between the first and second positions, or if the driving part 3 is in the second position, the driving part 3 needs to be controlled to move its overall position downwards until it is in the first position before subsequent cooling can be performed on the semiconductor device 1. The cooling process includes injecting a cooling medium into the first cooling medium channel 4, thereby cooling the surface of the cooling part 2 and the semiconductor device 1 on the surface of the cooling part 2. The cooling medium in the first cooling medium channel cools the cooling section 2 and the semiconductor device 1 placed on the upper surface of the cooling section 2. Liquid cooling accelerates the cooling process of the semiconductor device 1, shortening the total cooling time and thus reducing the overall production time and efficiency of the semiconductor device 1 manufacturing process. Furthermore, after the semiconductor device 1 completes cooling, the drive section 3 is controlled to move upwards until it reaches a second position. At this position, there is sufficient gripping space between the lower surface of the semiconductor device 1 and the upper surface of the cooling section 2. The gripping force can be set on the lower surface of the semiconductor device 1, thus ensuring stable gripping of the semiconductor device 1 after cooling without increasing the gripping force. This prevents damage to the semiconductor device 1 during gripping and improves the yield rate of the semiconductor device 1.

[0044] For example, the cooling medium may include one or more of water, ethylene glycol, or methanol.

[0045] In the manufacturing process of semiconductor device 1, the materials used for each heating device are mostly ceramic or aluminum-magnesium alloy to ensure that semiconductor device 1 can always be in close contact with the surface of the heating device during the heat deformation process. For example, the cooling part 2 can be made of the same material as the heating device, such as ceramic or aluminum-magnesium alloy, so that the hardness and deformation of the cooling part 2 are similar to those of the heating device, thereby ensuring that semiconductor device 1 can be in close contact with the surface of the cooling part 2 during the cooling shrinkage process.

[0046] In one embodiment, such as Figure 5As shown, the cooling section 2 is provided with a receiving hole 5. In a first position, the driving section 3 is located inside the receiving hole 5. In a second position, at least a portion of the structure of the driving section 3 is higher than the receiving hole 5 to ensure that there is sufficient gripping space between the lower surface of the driving section 3 and the upper surface of the cooling section 2.

[0047] In this embodiment, the cooling part 2 can be sleeved on the outside of the driving part 3 through the receiving hole 5, and the receiving hole 5 can be used to position and limit the driving part 3. The driving part 3 moves up and down along the receiving hole 5. The cross-sectional area of ​​the receiving hole 5 can be larger than the cross-sectional area of ​​the driving part 3 to avoid friction between the driving part 3 and the cooling part 2 during the lifting process, thereby preventing the driving part 3 from jamming during the lifting process, the semiconductor device 1 from shaking due to jamming, and the semiconductor device 1 from falling and being damaged.

[0048] For example, such as Figure 5 As shown, the cross-sectional shape of the receiving hole 5 can be cylindrical, rectangular or other shapes, and this embodiment does not limit this.

[0049] For example, such as Figure 5 As shown, when the driving part 3 is in the second position, the entire structure of the driving part 3 can be higher than the receiving hole 5. The lower surface of the driving part 3 can be flush with the surface of the cooling part 2 or higher than the surface of the cooling part 2, so as to ensure that there is more gripping space between the lower surface of the semiconductor device 1 and the upper surface of the cooling part 2.

[0050] In other embodiments, the cooling section 2 may have multiple receiving holes 5, which are evenly arranged around the axis of the driving section 3. The driving section 3 is located inside the receiving holes 5, and the semiconductor device 1 is driven to rise and fall by the multiple driving sections 3. In this way, the multiple driving sections 3 provide multiple fulcrums for the cooling section 2, which can ensure the stability of the semiconductor device 1 when it rises and falls.

[0051] In one embodiment, such as Figure 5 As shown, the cooling section 2 has a disc-shaped structure, the receiving hole 5 is located in the middle of the cooling section 2, and the first cooling medium channel 4 is arranged around the receiving hole 5.

[0052] In this embodiment, the center of the semiconductor device 1 needs to be located within the projection area of ​​the driving part 3 in the vertical direction. When the receiving hole 5 is located in the middle of the cooling part 2, that is, the driving part 3 and the semiconductor device 1 placed on the surface of the driving part 3 are located in the middle of the cooling part 2, the disk-shaped cooling part 2 can provide a larger support area for the semiconductor device 1 when the driving part 3 is in the first position, ensuring the stability of the semiconductor device 1 under the support of the driving part 3 and the cooling part 2. In addition, the first cooling medium channel 4 arranged around the receiving hole 5 can provide cooling to the surface of the cooling part 2 and the driving part 3 at the same time, and then the driving part 3 provides cooling to the semiconductor device 1 placed on it. With this arrangement, the cooling part 2 provides cooling to the outer annular area of ​​the semiconductor device 1, and the driving part 3 provides cooling to the central area of ​​the semiconductor device 1, thereby ensuring that the cooling efficiency of the semiconductor device 1 is improved.

[0053] In one embodiment, such as Figure 7 As shown, the first cooling medium channel 4 includes at least two cooling channels 401, which are annular and connected by radial connecting channels. At least one cooling channel 401 is provided with a cooling medium inlet and at least one cooling channel 401 is provided with a cooling medium outlet.

[0054] In this embodiment, all cooling channels 401 can be arranged in a ring-like manner within the cooling section 2. The cooling medium is introduced into one of the cooling channels 401 through the cooling medium inlet and then transmitted to the adjacent cooling channel 401 through the radial connecting channel. After all cooling channels 401 are filled with cooling medium, the cooling medium is discharged through the cooling medium outlet. With this arrangement, each cooling channel 401 provides cooling to each annular area of ​​the cooling section 2, which can fully utilize the cooling capacity of the refrigerant in the first cooling medium channel 4 and improve the cooling efficiency of the semiconductor device 1.

[0055] In other embodiments, the cooling channel 401 may be fan-shaped. This embodiment does not impose specific limitations on this. When the cooling channel 401 is fan-shaped, the central angle of the fan-shaped cooling channel 401 is greater than 180° to ensure the total cooling area of ​​the first cooling medium channel 4. The cooling medium inlet is connected to one end of one of the cooling channels 401, and the other end of the cooling channel 401 is connected to one end of the adjacent cooling channel 401 through a radial connecting channel. Similarly, the cooling medium outlet is connected to one end of one of the cooling channels 401, and the other end of the cooling channel 401 is connected to the other end of the adjacent cooling channel 401. The cooling medium inlet and the cooling medium outlet are not simultaneously connected to both ends of the same cooling channel 401.

[0056] In this embodiment, similarly, each annular region of the cooling section 2 is cooled by the fan-shaped cooling channels 401, which can also make full use of the cold energy in the first cooling medium channel 4 and improve the cooling efficiency of the semiconductor device 1.

[0057] This disclosure includes an exemplary embodiment, such as... Figure 2 As shown, the cooling device for the semiconductor device 1 includes at least one cooling structure group 6, each cooling structure group 6 includes a plurality of cooling sections 2 arranged at intervals from bottom to top, and each cooling section 2 is provided with a corresponding driving section 3.

[0058] In this embodiment, multiple cooling units 2 can simultaneously cool multiple semiconductor devices 1, increasing the number of semiconductor devices 1 processed in the same cooling batch, shortening the total time of the cooling process of semiconductor devices 1, thereby shortening the total time of the semiconductor device 1 manufacturing process and improving the production efficiency of semiconductor devices 1.

[0059] Figure 4 for Figure 1 A three-dimensional structural diagram omitting the support section, part of the cooling section, part of the drive section, the vacuum pumping device, vacuum pumping branch, vacuum pumping main circuit, part of the first cooling medium channel, and part of the second cooling medium channel described below.

[0060] This disclosure includes an exemplary embodiment, such as... Figure 3 As shown, the cooling device for semiconductor device 1 also includes a support 7, which is combined with... Figure 4 The bracket 7 is provided with a cooling medium input main 8 and a cooling medium output main 9 extending vertically; each cooling section 2 is provided with a cooling medium input branch and a cooling medium output branch. One end of the cooling medium input branch is connected to the cooling medium input main 8 and the other end is connected to the first cooling medium channel 4. One end of the cooling medium output branch is connected to the cooling medium input main 8 and the other end is connected to the first cooling medium channel 4.

[0061] In this embodiment, the cooling medium input main line 8 provides cooling medium to each cooling medium input branch line, and the cooling medium branch line provides cooling medium to the first cooling medium channel 4. After the first cooling medium channel 4 completes cooling for the cooling unit 2, the cooling medium is output from the first cooling medium channel 4 to the cooling medium output branch line, and then collected into the cooling medium output main line 9 before being discharged for further cooling. This arrangement simplifies the piping layout of the device as much as possible and ensures that the flow resistance and temperature are similar in each of the first cooling medium channels 4. The cooling medium input main line 8 and the cooling medium output main line 9 are supported by the bracket 7. The cooling medium input main line 8 and the cooling medium output main line 9 are placed inside the bracket 7, which can effectively protect the cooling medium input main line 8 and the cooling medium output main line 9 and prevent them from colliding with the automated device during the process.

[0062] For example, the temperature of the cooling medium is 60–75°C.

[0063] For example, the cooling medium input main 8 can supply cooling medium to multiple cooling structure groups 6 at the same time. This configuration can increase the number of semiconductor devices 1 cooled while reducing the usage of the cooling medium input main 8 and the cooling medium output main 9, and further simplify the overall piping layout of the device.

[0064] In one embodiment, such as Figure 3 As shown, the bracket 7 includes a base 701 and a support 702 mounted on the base 701. The support 702 has a cavity (not shown in the figure) inside, where the cooling medium input main 8 and the cooling medium output main 9 can be located. In this configuration, the support 702 simultaneously provides support and protection for the cooling medium input main 8 and the cooling medium output main 9. The cooling medium input main 8 is provided with a first connector 12, and the cooling medium output main 9 is provided with a second connector 13. Both the first connector 12 and the second connector 13 are located outside the support 702. The first connector 12 can be detachably connected to the cooling medium input main 8 via a first quick connector 14, and the second connector 13 can be detachably connected to the cooling medium output main 9 via a second quick connector 15, facilitating timely replacement when the cooling medium input main 8 and the cooling medium output main 9 are damaged.

[0065] This disclosure includes an exemplary embodiment, such as... Figure 3 and Figure 4As shown, the cooling device for semiconductor device 1 also includes a cooling medium inlet branch pipe 10 and a cooling medium outlet branch pipe 11. The inner cavity of the cooling medium inlet branch pipe 10 forms a cooling medium inlet branch. One end of the cooling medium inlet branch pipe 10 is connected to the support 7, and the other end of the cooling medium inlet branch pipe 10 is connected to the cooling section 2. The inner cavity of the cooling medium outlet branch pipe 11 forms a cooling medium outlet branch. One end of the cooling medium outlet branch pipe 11 is connected to the support 7, and the other end of the cooling medium outlet branch pipe 11 is connected to the cooling section 2.

[0066] In this embodiment, the cooling medium input branch pipe 10 and the cooling medium output branch pipe 11 are mounted between the support 7 and the cooling section 2. The support 7 provides longitudinal support for the cooling medium input branch pipe 10 and the cooling medium output branch pipe 11. Furthermore, the cooling medium input branch pipe 10 and the cooling medium output branch pipe 11 provide longitudinal support for the cooling section 2. Without the aid of external structures, the cooling section 2 is stably supported, thereby providing stable support for the semiconductor device 1 placed on the cooling section 2, while reducing the overall manufacturing cost of the device.

[0067] For example, the cooling medium inlet branch pipe 10 and the cooling medium outlet branch pipe 11 can be one of steel pipe, plastic or other rigid pipe fittings to ensure that the cooling medium inlet branch pipe 10 and the cooling medium outlet branch pipe 11 can provide stable support for the cooling section 2.

[0068] In one embodiment, such as Figure 3 and Figure 4 As shown, the cooling medium inlet branch pipe 10 can be detachably connected to the cooling medium inlet main 8 via the third quick connector 16, and the cooling medium outlet branch pipe 11 can be detachably connected to the cooling medium outlet main 9 via the fourth quick connector 17. This arrangement facilitates timely replacement of the cooling medium inlet branch pipe 10 and the cooling medium outlet branch pipe 11 when they are damaged.

[0069] In one embodiment, such as Figure 3 and Figure 8 As shown, a pressure detection device 18 and a pressure regulating device 19 are installed on the cooling medium input main line 8. The operator can detect the hydraulic pressure of the cooling medium in the cooling medium input main line 8 based on the data displayed by the pressure detection device 18, and adjust the total amount of cooling medium in the cooling medium input main line 8 through the pressure regulating device 19 to achieve the purpose of regulating the hydraulic pressure.

[0070] For example, the hydraulic pressure of the cooling medium in the cooling medium input main 8 is 2.5 to 5.0 Psi.

[0071] This disclosure includes an exemplary embodiment, such as... Figure 3As shown, the cooling device for semiconductor device 1 also includes a lifting mechanism 20. The lifting mechanism 20 includes a main lifting arm 2001 extending vertically and lifting support arms 2002 respectively provided with each driving unit 3. The main lifting arm 2001 is driven by the driving device 21. One end of each lifting support arm 2002 is connected to the main lifting arm 2001, and the other end is connected to the corresponding driving unit 3.

[0072] In this embodiment, the main lifting arm 2001 and all the lifting support arms 2002 can be an integral structure. By driving the main lifting arm 2001 and the lifting support arms 2002 connected to the main driving arm through the driving device 21, the synchronous lifting of all the driving parts 3 and the semiconductor devices 1 placed on them in the same cooling structure group 6 can be realized, which improves the lifting efficiency of the semiconductor devices 1 during the batch cooling process. In addition, in the case of synchronous lifting, there will be no uneven spacing between the lower surface of the semiconductor device 1 and the upper surface of the cooling part 2, avoiding the problem of gripping failure of the gripping device.

[0073] In one embodiment, such as Figure 4 As shown, the lifting arm 2002 may include a lifting plate 2002a placed horizontally on the plate surface and a lifting block 2002b fixedly installed at one end of the lifting platform. The upper surface of the lifting block 2002b abuts against the lower surface of the driving part 3. The projection area of ​​the lifting block 2002b in the vertical direction is located in the projection area of ​​the receiving hole 5. The main lifting arm 2001 is driven by the driving device 21, and the lifting block 2002b at one end of the lifting plate realizes the pushing out or lowering of the driving part 3.

[0074] In one embodiment, such as Figure 3 As shown, the drive device 21 may include a linear stepper motor 2101, a slide rail 2102, and a slide table 2103. The main lifting arm 2001 can be detachably mounted on the slide table. In use, the linear stepper motor 2101 drives the slide table 2103 and the main lifting arm 2001 to move vertically along the slide rail. The lifting support arm 2002, which is connected to the main lifting arm 2001 at one end, moves vertically in sync. The drive unit 3 located at the other end of the lifting support arm 2002 and the semiconductor device 1 placed above the drive unit 3 move up and down synchronously with the lifting support arm 2002, so that a sufficient gripping space is formed between the lower surface of the semiconductor device 1 and the upper surface of the cooling unit 2.

[0075] In one embodiment, such as Figure 3 As shown, a vacuum channel is provided on the drive unit 3. One end of the vacuum channel passes through the upper surface of the drive unit 3, and the other end of the vacuum channel is connected to the vacuum device 22.

[0076] In this embodiment, when the driving part 3 is in the first position, the driving part 3 and the cooling part 2 jointly support the semiconductor device 1. That is, the upper surface of the driving part 3 is in contact with the lower surface of the semiconductor device 1, and the vacuum channel is vacuumed to form a negative pressure between the semiconductor device 1 and the driving part 3. This ensures that the semiconductor device 1 is tightly attached to the surfaces of the driving part 3 and the cooling part 2, and avoids the problem of warping and deformation of the semiconductor device 1 during the cooling process.

[0077] In one embodiment, such as Figure 5 As shown, the drive unit 3 has a disc-shaped structure and multiple through holes 23 extending along its axis. The multiple through holes 23 are arranged around the axis of the drive unit 3, and the through holes 23 form a vacuum channel. With this configuration, when the drive unit 3 is in the first position and the vacuum device 22 is activated, a negative pressure is formed inside the multiple through holes 23, and the semiconductor device 1 above the drive unit 3 is simultaneously adsorbed and positioned. This not only ensures the positioning effect of the semiconductor device 1, but also more comprehensively avoids the problem of warping and deformation of the semiconductor device 1 during the cooling process.

[0078] In one embodiment, such as Figure 4 As shown, the platform is provided with multiple lifting holes 26 corresponding to multiple through holes 23. The vacuum branch 24 is provided through the lifting holes 26. In this way, it can be ensured that there are no obstacles between the lower surface of the drive unit 3 and the lifting platform, thereby ensuring that when the drive unit 3 is in the first position, the top surface of the drive unit 3 is flush with the top surface of the cooling unit 2, so as to jointly support the semiconductor device 1.

[0079] For example, after the through hole 23 is evacuated, the air pressure inside the through hole 23 can be -15 to 25 kPa. That is, the air pressure inside the through hole 23 can be 15 to 25 kPa lower than the atmospheric pressure. Under the above air pressure, the purpose of placing the semiconductor device 1 stably can be met, and the semiconductor device 1 will not be squeezed and deformed due to excessive negative pressure.

[0080] One embodiment, such as Figure 3 As shown, the cooling device for semiconductor device 1 includes multiple drive units 3. The vacuum channel of each drive unit 3 is connected to the vacuum main line 25 through the vacuum branch line 24. The vacuum main line 25 is connected to the vacuum device 22. With this configuration, the through holes 23 of all drive units 3 can be vacuumed at the same time, and the gas pressure in each through hole 23 can be kept similar, so as to ensure that all semiconductor devices 1 are placed on the upper surface of the drive unit 3 and the cooling unit 2 in a stable state.

[0081] In one embodiment, the surface smoothness of the upper surface of the cooling part 2 is 1500 mesh to 2500 mesh, and the surface smoothness of the upper surface of the driving part 3 is 1500 mesh to 2500 mesh.

[0082] In this embodiment, after CMP (Chemical Mechanical Polishing) treatment, the surface smoothness of the semiconductor device 1 is between 1500 and 2500 mesh. Since the upper surfaces of the driving part 3 and the cooling part 2 need to contact the lower surface of the semiconductor device 1, setting the upper surfaces of the cooling part 2 and the driving part 3 to 1500 to 2500 mesh makes the surface smoothness of the cooling part 2 and the driving part 3 as close as possible to the surface smoothness of the semiconductor device 1. This can effectively prevent scratches caused by relative displacement between the semiconductor device 1 and the cooling part 2 and the driving part 3 during the cooling and shrinking process.

[0083] In one embodiment, such as Figure 7 As shown, a second cooling medium channel 27 is provided inside the drive unit 3. In the first position, the second cooling medium channel 27 is connected to the first cooling medium channel 4.

[0084] In this embodiment, the cooling medium in the first cooling medium channel 4 is transferred to the second cooling medium channel 27 in the drive unit 3. The second cooling medium channel 27 cools the drive unit 3 and a portion of the semiconductor device 1 located above the drive unit 3, while the area outside this portion is cooled by the first cooling medium channel 4 in the cooling unit 2. The first cooling medium channel 4 and the second cooling medium channel 27 cooperate to achieve cooling of the entire area of ​​the semiconductor device 1. In this way, the cooling efficiency of the semiconductor device 1 can be improved, and the uniformity of cooling of the semiconductor device 1 can be guaranteed.

[0085] In one embodiment, such as Figure 7As shown, the cooling medium is introduced into one of the cooling channels 401 through the cooling medium inlet. This cooling channel 401 is connected to the second cooling medium channel 27 via a first transmission passage 28. The first transmission passage 28 includes a first transmission branch 2801 located within the drive unit 3 and a second transmission branch 2802 located within the cooling unit 2. When the drive unit 3 is in the first position, the first transmission branch 2801 and the second transmission branch 2802 are sealed together. When the drive unit 3 is in any position between the first and second positions, the first transmission branch 2801 and the second transmission branch 2802 are separated. The cooling medium is discharged from the cooling medium outlet through another cooling channel 401, which is connected to the second cooling medium channel 27 via a second transmission passage 29. The second transmission passage 29 includes a third transmission branch 2901 located within the drive unit 3 and a fourth transmission branch 2902 located within the cooling unit 2. When the drive unit 3 is in the first position, the third transmission branch 2901 and the fourth transmission branch 2902 are sealed together. When the drive unit 3 is in any position between the first and second positions, the third transmission branch 2901 and the fourth transmission branch 2902 are separated. This arrangement allows the drive unit 3 to be cooled via the second cooling medium channel 27 while simultaneously achieving normal lifting and lowering of the drive unit 3.

[0086] In one embodiment, such as Figure 5 As stated, in combination Figure 6 and Figure 7 The inner wall of the receiving hole 5 is provided with a first sealing ring 30 for sealing the first transmission branch 2801 and the second transmission branch 2802. The first sealing ring 30 and the cooling part 2 can be an integral structure. The outer wall of the driving part 3 can be provided with a first sealing groove 31 that cooperates with the first sealing ring 30. The inner wall of the receiving hole 5 is also provided with a second sealing ring 32 for sealing the third transmission branch 2901 and the fourth transmission branch 2902. The second sealing ring 32 and the cooling part 2 can be an integral structure. The outer wall of the driving part 3 can be provided with a second sealing groove 33 that cooperates with the second sealing ring 32. Through the mutual cooperation of the first sealing groove 31 and the first sealing ring 30, and the mutual cooperation of the second sealing groove 33 and the second sealing ring 32, it is ensured that when the driving part 3 is in the first position, there will be no problem of cooling medium leakage between the first transmission branch 2801 and the second transmission branch 2802, and between the third transmission branch 2901 and the fourth transmission branch 2902.

[0087] For example, the cross-sectional shape of the first sealing ring 30 can be circular or other shapes, and this embodiment does not limit this.

[0088] In one embodiment, such as Figure 7As shown, a switch structure 34 is provided between the first cooling medium channel 4 and the second cooling medium channel 27. When the drive unit 3 is in the first position, the switch structure 34 controls the second cooling medium channel 27 to remain in a connected state. When the drive unit 3 is in the second position, the switch structure 34 controls the second cooling medium channel 27 to be in a closed state.

[0089] In this embodiment, the switch structure 34 is configured to ensure that when the semiconductor device 1 needs to be cooled, the second cooling medium channel 27 is filled with cooling medium. When the semiconductor device 1 has been cooled, and the drive unit 3 is located in the second position or any position between the first and second positions, there is no cooling medium in the second cooling medium channel 27. This ensures that when the semiconductor device 1 is gripped, there will be no problem of residual medium overflowing from the second cooling medium channel 27.

[0090] In one embodiment, such as Figure 7 As shown, the switch structure 34 includes a first switch structure 3401 and a second switch structure 3402. The first switch structure 3401 is located on the first transmission path 28, and the second switch structure 3402 is located on the second transmission path 29. The first switch structure 3401 and the second switch structure 3402 cooperate with each other so that when the drive unit 3 is in the first position, the second cooling medium channel 27 remains in a connected state, and when the drive unit 3 is in the second position, the second cooling medium channel 27 is in a closed state.

[0091] In one embodiment, the first switch structure 3401 and the second switch structure 3402 may be disposed in the inner cavity of the cooling section 2.

[0092] For example, the first switch structure 3401 and the second switch structure 3402 can be solenoid valves, and the first switch structure 3401 and the second switch structure 3402 can be connected to a control device (not shown in the figure) by electrical connection or wireless connection.

[0093] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0094] In the description of this specification, references to the terms "embodiment," "exemplary embodiment," "some implementation," "illustrated implementation," "example," etc., refer to specific features, structures, materials, or characteristics described in connection with an implementation or example that are included in at least one implementation or example of this disclosure.

[0095] In this specification, the illustrative expressions of the terms used do not necessarily refer to the same implementation or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more implementations or examples.

[0096] In the description of this disclosure, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0097] It is understood that the terms "first," "second," etc., as used in this disclosure may be used to describe various structures, but these structures are not limited by these terms. These terms are only used to distinguish one structure from another.

[0098] In one or more accompanying drawings, the same elements are represented by similar reference numerals. For clarity, many parts in the drawings are not drawn to scale. Furthermore, certain well-known parts may not be shown. For simplicity, a structure obtained after several steps may be depicted in a single drawing. Many specific details of this disclosure, such as the structure, materials, dimensions, processing methods, and techniques of the devices, are described below to provide a clearer understanding of the disclosure. However, as those skilled in the art will understand, this disclosure may be implemented without adhering to these specific details.

[0099] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this disclosure.

Claims

1. A semiconductor device cooling apparatus for cooling semiconductor devices, characterized in that, The semiconductor device cooling device includes: A cooling section is provided therein, and a first cooling medium channel is provided therein; A driving unit is capable of moving up and down between a first position and a second position. In the first position, the driving unit cooperates with the cooling unit to support the semiconductor device to be cooled together with the cooling unit. In the second position, the driving unit pushes the semiconductor device out so that the semiconductor device is separated from the cooling unit. The cooling section is provided with a receiving hole. In the first position, the driving section is located inside the receiving hole. In the second position, at least a portion of the structure of the driving section is higher than the receiving hole. The drive unit is provided with a vacuum channel, one end of which penetrates the upper surface of the drive unit, and the other end of which is connected to a vacuum device. The drive unit is provided with a second cooling medium channel, and at the first position, the second cooling medium channel is connected to the first cooling medium channel.

2. The semiconductor device cooling apparatus according to claim 1, characterized in that, The cooling section has a disc-shaped structure, the receiving hole is located in the middle of the cooling section, and the first cooling medium channel is arranged around the receiving hole.

3. The semiconductor device cooling apparatus according to claim 2, characterized in that, The first cooling medium channel includes at least two cooling channels, which are annular and connected by radial connecting channels. At least one of the cooling channels is provided with a cooling medium inlet and at least one of the cooling channels is provided with a cooling medium outlet.

4. The semiconductor device cooling apparatus according to any one of claims 1 to 3, characterized in that, The semiconductor device cooling device includes at least one cooling structure group, each of the cooling structure groups including a plurality of cooling sections arranged at intervals from bottom to top, and each cooling section corresponding to a driving section.

5. The semiconductor device cooling apparatus according to claim 4, characterized in that, The semiconductor device cooling device also includes a support, in which a cooling medium inlet main and a cooling medium outlet main are arranged in a vertically extending manner; Each of the cooling units is provided with a cooling medium input branch and a cooling medium output branch. One end of the cooling medium input branch is connected to the cooling medium input main line, and the other end is connected to the first cooling medium channel. One end of the cooling medium output branch is connected to the cooling medium input main line, and the other end is connected to the first cooling medium channel.

6. The semiconductor device cooling apparatus according to claim 5, characterized in that, The semiconductor device cooling device further includes: A cooling medium inlet branch pipe, the inner cavity of which forms the cooling medium inlet branch, one end of which is connected to the bracket, and the other end of which is connected to the cooling section; A cooling medium output branch pipe, the inner cavity of which forms the cooling medium output branch, one end of which is connected to the bracket, and the other end of which is connected to the cooling section.

7. The semiconductor device cooling apparatus according to claim 5, characterized in that, A pressure detection device and a pressure regulating device are installed on the cooling medium input line.

8. The semiconductor device cooling apparatus according to claim 4, characterized in that, The semiconductor device cooling device further includes a lifting mechanism, which includes a main lifting arm extending vertically and lifting support arms respectively provided with each of the driving units. One end of each lifting support arm is connected to the main lifting arm, and the other end is connected to the corresponding driving unit.

9. The semiconductor device cooling apparatus according to claim 1, characterized in that, The drive unit has a disc-shaped structure and is provided with multiple through holes that extend along its axis. The multiple through holes are arranged around the axis of the drive unit and form the vacuum channel.

10. The semiconductor device cooling apparatus according to claim 1, characterized in that, The semiconductor device cooling device includes a plurality of driving units, and the vacuum channel of each driving unit is connected to the vacuum main circuit through a vacuum branch circuit, and the vacuum main circuit is connected to the vacuum device.

11. The semiconductor device cooling apparatus according to any one of claims 1 to 3, characterized in that, The surface smoothness of the upper surface of the cooling section is 1500 mesh to 2500 mesh; and / or, The surface smoothness of the upper surface of the drive unit is 1500 mesh to 2500 mesh.

12. The semiconductor device cooling apparatus according to claim 1, characterized in that, A switch structure is provided between the first cooling medium channel and the second cooling medium channel. When the driving part is in the first position, the switch structure controls the second cooling medium channel to remain in a connected state. When the driving part is in the second position, the switch structure controls the second cooling medium channel to be in a closed state.

Images