Bending hardboard manufacturing method and bending hardboard

Abstract

The application discloses a kind of hard plate bending manufacturing method, first manufacturing inner layer circuit pattern, then the first substrate and second substrate are pressed, then outer layer circuit pattern is manufactured, finally, the second bending area of second substrate is removed by depth control and is formed groove by filing, so that the first bending area of first substrate can be easily bent, that is, the hard plate bending can be easily bent, compared with the hard and soft combination board, the manufacturing method is simple and convenient, can shorten the production cycle of product, reduce the production cost of product.In addition, the hard plate bending manufactured by the manufacturing method of the embodiment of the application is integrally formed between the first bending area and the first assembly area, so that it is not easy to be pulled out of service or loose during use, and the structure is stable.In addition, the application also discloses a hard plate bending made by the above-mentioned hard plate bending manufacturing method.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, and in particular to a method for manufacturing a bent rigid board and the bent rigid board itself. Background Technology

[0002] Circuit boards are the most commonly used electronic components in circuit structures. Different electrical appliances typically require circuit boards of different shapes, and some even require circuit boards in a bent state. To meet the bending requirements, most existing technologies use rigid-flex boards. Rigid-flex boards usually consist of a flexible board and rigid boards on both sides of the flexible board. The rigid boards on both sides are connected by the flexible board to achieve bending.

[0003] However, the production of rigid-flex PCBs requires separate processing of the flexible and rigid boards before they are joined together through lamination, drilling, and outer layer circuitry. This complex manufacturing process is challenging, involving multiple processing and assembly steps, resulting in a lower yield rate and higher manpower and material resources. Consequently, they are more expensive and have a longer production cycle. Furthermore, during installation and use, the connection between the rigid and flexible boards is prone to tearing or loosening, making repairs difficult. Summary of the Invention

[0004] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a method for manufacturing bent rigid plates, which results in a more stable structure, shortens the product production cycle, and reduces product production costs.

[0005] The present invention also proposes a bent rigid plate manufactured using the above-described method for manufacturing bent rigid plates.

[0006] According to an embodiment of the present invention, a method for manufacturing a bent rigid board includes the following steps: S1: Cutting materials to obtain a first substrate and a second substrate. The first substrate has a first upper surface and a first lower surface, and the first substrate also has a first bending region and a first assembly region located on the left and right sides of the first bending region. The second substrate has a second upper surface and a second lower surface, and the second substrate also has a second bending region and a second assembly region located on the left and right sides of the second bending region; S2: First drilling: Processing first through holes in the two first assembly regions respectively, the first through holes penetrating the first substrate; S3: First copper plating: Plating copper plating on the first through holes; S4: Sealing the first through holes; S5: Inner layer circuit fabrication: Fabricating inner layer circuit patterns on the first upper surface and the second lower surface, the circuit pattern portion on the first upper surface... Located in the first bending area; S6: Pressing: Pressing the first substrate and the second substrate together to connect the first upper surface and the second lower surface; S7: Second drilling: Processing second through holes in the two first assembly areas or the two second assembly areas respectively, the second through holes penetrating the first substrate and the second substrate, the second through holes being spaced apart from the first through holes; S8: Second copper plating: Plating copper plating on the second through holes; S9: Outer layer circuit fabrication: Fabricating outer layer circuit patterns on the first lower surface and the second upper surface; S10: Screen printing solder resist ink: Screen printing solder resist ink on the first lower surface and the second upper surface; S11: Peripheral forming; S12: Depth-controlled milling: Milling the second bending area along the direction from the second upper surface to the first lower surface to form a groove.

[0007] The method for manufacturing a bent rigid plate according to an embodiment of the present invention has at least the following beneficial effects:

[0008] By employing the bending rigid board manufacturing method of this invention, the inner layer circuit pattern is first fabricated, then the first substrate and the second substrate are laminated, followed by the fabrication of the outer layer circuit pattern. Finally, the second bending area of ​​the second substrate is milled to form a groove using a depth-controlled milling machine, allowing the first bending area of ​​the first substrate to be easily bent. This results in a bending rigid board that can be easily bent. Compared to rigid-flex boards, this manufacturing method is simpler and more convenient, shortening the product production cycle and reducing production costs. Furthermore, the bending rigid board manufactured using the method of this invention has a more stable structure because the first bending area and the first assembly area are an integral structure, making it less prone to tearing failure or loosening during use.

[0009] According to some embodiments of the present invention, both the first substrate and the second substrate are modified FR4 copper-clad laminates, wherein the modified FR4 copper-clad laminate includes a modified FR4 substrate and copper layers located on the upper and lower surfaces of the modified FR4 substrate.

[0010] According to some embodiments of the present invention, step S9 further includes: providing an anti-corrosion dry film in the first bending area of ​​the first lower surface, wherein the left and right ends of the anti-corrosion dry film extend to the first assembly area corresponding to the shielding portion.

[0011] According to some embodiments of the present invention, two isolation grooves are formed on the first lower surface, the depth of the isolation grooves being greater than or equal to the thickness of the copper layer on the first lower surface; one of the isolation grooves is located between one of the first assembly areas and the first bending area, and the other isolation groove is located between the other first assembly area and the first bending area.

[0012] According to some embodiments of the present invention, step S5 further includes: providing an anti-corrosion dry film on the first lower surface and the second upper surface.

[0013] According to some embodiments of the present invention, in step S6, an adhesive layer is provided between the first upper surface and the second lower surface, and the adhesive layer is a semi-cured sheet.

[0014] According to some embodiments of the present invention, the prepreg has a glass fiber cloth layer and a resin layer located on the upper and lower sides of the glass fiber cloth layer. In step S12, the second bending area of ​​the second substrate and part of the resin layer located on the upper side of the glass fiber cloth layer are removed from the second upper surface to the first lower surface.

[0015] According to some embodiments of the present invention, the first bending area includes a bending portion and connecting portions located on both sides of the bending portion. The connecting portions are connected to the corresponding first assembly area. The width of the bending portion in the front-to-back direction is smaller than the width of the connecting portion in the front-to-back direction. The front and rear sidewalls of the first substrate are each provided with two arc-shaped grooves, and each arc-shaped groove is located between the bending portion and the corresponding connecting portion.

[0016] According to some embodiments of the present invention, in step S4, resin is first inserted into the first through hole, and then the resin located outside the first through hole is removed by polishing with ceramic and non-woven fabric.

[0017] The bent rigid plate according to an embodiment of the present invention is manufactured by the bent rigid plate manufacturing method of any of the above embodiments.

[0018] The bending rigid plate according to embodiments of the present invention has at least the following beneficial effects:

[0019] Compared to rigid-flex PVC boards, the bending rigid board manufacturing method described in any of the above embodiments is simpler and more convenient, shortening the product production cycle and reducing production costs. Furthermore, since the first bending area and the first assembly area of ​​the bending rigid board in this embodiment are an integral structure, it is less prone to tearing or loosening during use, resulting in a more stable structure.

[0020] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0021] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0022] Figure 1 This is a schematic diagram of the first lower surface of the first substrate according to an embodiment of the present invention;

[0023] Figure 2 This is a front view of the bending hard plate before the depth control mill in an embodiment of the present invention;

[0024] Figure 3 This is a front view of the bent rigid plate after depth control milling according to an embodiment of the present invention.

[0025] Figure label:

[0026] First substrate 100, modified FR4 substrate 101, copper layer 102, first bending area 110, bending portion 111, connecting portion 112, first assembly area 120, first through hole 130, isolation groove 140, arc groove 150;

[0027] Second substrate 200, second bending area 210, second assembly area 220, second through hole 230, groove 240;

[0028] Adhesive layer 300. Detailed Implementation

[0029] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0030] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0031] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0032] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0033] Reference Figures 1 to 3 One embodiment of the present invention provides a method for manufacturing a bent rigid plate, the method comprising the following steps:

[0034] S1: Cutting materials to obtain a first substrate 100 and a second substrate 200. The first substrate 100 has a first upper surface and a first lower surface. The first substrate 100 also has a first bending region 110 and a first assembly region 120 located on the left and right sides of the first bending region 110. The second substrate 200 has a second upper surface and a second lower surface. The second substrate 200 also has a second bending region 210 and a second assembly region 220 located on the left and right sides of the second bending region 210.

[0035] S2: First drilling: First through holes 130 are drilled in the two first assembly areas 120 respectively, and the first through holes 130 penetrate the first substrate 100;

[0036] S3: First copper plating electroplating, copper plating electroplating is performed on the first through hole 130;

[0037] S4: Block the first through hole 130;

[0038] S5: Inner layer circuit fabrication: Fabricate inner layer circuit patterns on the first upper surface and the second lower surface, with the circuit pattern portion on the first upper surface located in the first bending area 110;

[0039] S6: Pressing: Pressing the first substrate 100 and the second substrate 200 together so that the first upper surface and the second lower surface are connected;

[0040] S7: Second drilling: Second through holes 230 are processed in the two first assembly areas 120 or the two second assembly areas 220 respectively. The second through holes 230 penetrate the first substrate 100 and the second substrate 200. The second through holes 230 and the first through holes 130 are arranged at intervals.

[0041] S8: Second copper plating electroplating: Perform copper plating electroplating on the second via 230;

[0042] S9: Outer layer circuit fabrication: Fabricate the outer layer circuit pattern on the first lower surface and the second upper surface;

[0043] S10: Screen printing solder resist ink: Screen printing solder resist ink on the first lower surface and the second upper surface;

[0044] S11: Peripheral forming;

[0045] S12: Depth control milling: Along the direction from the second upper surface to the first lower surface, mill out the second bending area 210 and form a groove 240.

[0046] By employing the bending rigid board manufacturing method of this invention, the inner layer circuit pattern is first fabricated, then the first substrate 100 and the second substrate 200 are laminated together, and then the outer layer circuit pattern is fabricated, such as... Figure 2 As shown, the second bending area 210 of the second substrate 200 is finally milled using a depth-controlled milling process to form a groove 240, as shown. Figure 3 As shown, this allows the first bending region 110 of the first substrate 100 to be easily bent, thus enabling the bending rigid plate to be easily bent. Figure 3 The direction of the middle arrow indicates the bending direction. Compared to rigid-flex PCBs, this manufacturing method is simpler and more convenient, shortening the product production cycle and reducing production costs. Furthermore, the rigid PCB manufactured using the method of this embodiment has a more stable structure because the first bending area 110 and the first assembly area 120 are an integral structure, making it less prone to tearing or loosening during use.

[0047] It is understood that in the above method, step S2 processes first through holes 130 in each of the two first assembly areas 120. The number of first through holes 130 on each first assembly area 120 can be one, two, or more, and the present invention does not specifically limit this. Similarly, step S7 processes second through holes 230 in each of the two first assembly areas 120 or the two second assembly areas 220. The number of second through holes 230 on each first assembly area 120 or each second assembly area 220 can also be one, two, or more, and the present invention does not specifically limit this.

[0048] It is understood that in the above method, step S7 processes the second through hole 230 in the two first assembly areas 120 or the two second assembly areas 220 respectively. Specifically, the second through hole 230 can be processed from the first lower surface of the first assembly area 120 or from the second upper surface of the second assembly area 220. The present invention does not make specific limitations on this. It is only necessary to make the second through hole 230 simultaneously penetrate the first assembly area 120 of the first substrate 100 and the second assembly area 220 of the second substrate 200.

[0049] It should be noted that in the above method, step S5 involves creating an inner layer circuit pattern on the first upper surface, and the circuit pattern portion on the first upper surface is located in the first bending area 110. The line width of the circuit pattern is 0.1 mm, and the line spacing is 0.12 mm.

[0050] It should be noted that in the above method, step S12, depth control milling, is produced using a CCD depth control milling machine. One piece / stack is produced by using a flat-head milling cutter to mill the second bending area 210 and form a groove 240 along the direction from the second upper surface to the first lower surface.

[0051] Reference Figures 1 to 3 In some embodiments, the first substrate 100 and the second substrate 200 are both modified FR4 copper-clad laminates, which include a modified FR4 substrate 101 and copper layers 102 located on the upper and lower surfaces of the modified FR4 substrate 101.

[0052] In the above method, the modified FR4 copper clad laminate is a high TG material, which gives the bent rigid board good temperature resistance, moisture resistance, chemical resistance, electrical resistance and other properties.

[0053] It should be noted that in some embodiments, the modified FR4 matrix 101 uses glass fiber cloth as a reinforcing material and modified FR4 epoxy resin as a resin material.

[0054] It should be noted that in some embodiments, the thickness of both the first substrate 100 and the second substrate 200 is 0.3 mm.

[0055] It should be noted that in the above method, the first substrate 100 and the second substrate 200 obtained by cutting in step S1 have the same size, which facilitates subsequent circuit pattern making and peripheral molding operations.

[0056] In some embodiments, step S9 further includes: providing an anti-corrosion dry film in the first bending area 110 of the first lower surface, wherein the left and right ends of the anti-corrosion dry film extend to the first assembly area 120 corresponding to the shielding portion.

[0057] In the above method, when making the outer layer circuit, a resist dry film is provided in the first bending area 110 of the first lower surface and extends to the first assembly area 120 of the shielding portion. This allows the copper layer 102 of the portion shielded by the resist dry film to be retained after the circuit pattern is made. Thus, this portion can serve as a connecting drag portion, which facilitates the bending of the rigid board and allows the deformation to recover after the external force is removed.

[0058] Furthermore, it is understood that, since an anti-etching dry film is provided in the first bending area 110 of the first lower surface during the fabrication of the outer layer circuit, the outer layer circuit pattern on the first lower surface is located on the first assembly area 120 and the second assembly area 220. Since the inner layer circuit pattern is fabricated on the first upper surface in step S5, and the circuit pattern part of the first upper surface is located in the first bending area 110, and the first via 130 is processed in the two first assembly areas 120 of the first substrate 100 in step S2, and the first via 130 is metallized by the copper plating in step S3, the networks in the two first assembly areas 120 on the first lower surface can be connected into the same network through the first via 130.

[0059] It should be noted that, in some embodiments, an anti-corrosion dry film is provided in the first bending area 110 of the first lower surface, and the left and right ends of the anti-corrosion dry film extend to the first assembly area 120 corresponding to the shielding portion. Specifically, the left and right ends of the anti-corrosion dry film extend at least 5 mm to the corresponding first assembly area 120.

[0060] Reference Figures 1 to 3 In some embodiments, two isolation grooves 140 are provided on the first lower surface, and the depth of the isolation grooves 140 is greater than or equal to the thickness of the copper layer 102 on the first lower surface; one isolation groove 140 is located between one of the first assembly areas 120 and the first bending area 110, and the other isolation groove 140 is located between the other first assembly area 120 and the first bending area 110.

[0061] In the above method, by providing an isolation groove 140 between each of the two first assembly areas 120 and the first bending area 110, and the depth of the isolation groove 140 being greater than or equal to the thickness of the copper layer 102 on the first lower surface, the first bending area 110 can be separated from the two first assembly areas 120, thereby avoiding the impact on the function of electronic components on the first assembly area 120 when bending the rigid board.

[0062] It should be noted that in some embodiments, the width of the isolation groove 140 is 1 mm.

[0063] In some embodiments, step S5 further includes: forming an anti-corrosion dry film on the first lower surface and the second upper surface.

[0064] In the above method, when fabricating the inner layer circuit, a resist dry film is provided on the first lower surface of the first substrate 100 and the second upper surface of the second substrate 200, thereby protecting the first lower surface and the second upper surface.

[0065] Reference Figures 1 to 3 In some embodiments, in step S6, an adhesive layer 300 is provided between the first upper surface and the second lower surface, and the adhesive layer 300 is a semi-cured sheet.

[0066] In the above method, a prepreg is used to laminate the first upper surface of the first substrate 100 and the second lower surface of the second substrate 200 together, which can enhance the connection strength between the first substrate 100 and the second substrate 200.

[0067] It should be noted that the prepreg is mainly composed of resin and reinforcing materials. The reinforcing materials are divided into several types, such as glass fiber cloth, paper base, and composite materials. During lamination, the epoxy resin of the prepreg melts, flows, and solidifies, thereby pressing the first substrate 100 and the second substrate 200 together to form a reliable insulating layer.

[0068] Reference Figure 2 and Figure 3 In some embodiments, the prepreg has a fiberglass cloth layer and resin layers located on the upper and lower sides of the fiberglass cloth layer. In step S12, the second bending area 210 and part of the resin layer located on the upper side of the fiberglass cloth layer are removed from the second upper surface to the first lower surface.

[0069] In the above method, the prepreg uses glass fiber cloth as a reinforcing material. During the controlled-depth milling process in step S12, the second bending area 210 of the second substrate 200 and part of the resin layer located on the upper side of the glass fiber cloth layer are milled from the second upper surface to the first lower surface. This ensures the integrity of the glass fiber cloth layer and thus achieves the purpose of protecting the circuit.

[0070] It is understood that in step S12, in addition to removing the second bending area 210 and part of the resin layer located on the upper side of the glass fiber cloth layer, it is also possible to remove only the second bending area 210 of the second substrate 200. The present invention does not specifically limit this, as long as the integrity of the glass fiber cloth layer of the prepreg is ensured.

[0071] It should be noted that in some embodiments, the thickness of the glass fiber cloth layer accounts for half of the thickness of the entire prepreg, while the thickness of the resin layer located on both the upper and lower sides of the glass fiber cloth layer accounts for one-quarter of the thickness of the entire prepreg. Therefore, in order to ensure the integrity of the glass fiber cloth layer, in step S12, the maximum depth of the depth control mill can only reach one-quarter of the thickness of the upper part of the adhesive layer 300.

[0072] It is understandable that the prepreg can specifically be 7628H prepreg.

[0073] Reference Figure 1 In some embodiments, the first bending area 110 includes a bending portion 111 and connecting portions 112 located on both sides of the bending portion 111. The connecting portions 112 are connected to the corresponding first assembly area 120. The width of the bending portion 111 in the front-to-back direction is smaller than the width of the connecting portion 112 in the front-to-back direction. The front and rear side walls of the first substrate 100 are each provided with two arc-shaped grooves 150, and each arc-shaped groove 150 is located between the bending portion 111 and the corresponding connecting portion 112.

[0074] In the above structure, by dividing the first bending area 110 into a bending portion 111 and connecting portions 112 located on both sides of the bending portion 111, and setting the width of the bending portion 111 in the front-back direction to be smaller than the width of the connecting portion 112 in the front-back direction, bending the rigid plate becomes more convenient and less strenuous. By providing an arc-shaped groove 150 arranged in the front-back direction between the bending portion 111 and the corresponding connecting portion 112, bending of the rigid plate can be further facilitated, and the risk of breakage between the first bending area 110 and the first assembly area 120 during bending can be reduced.

[0075] Understandably, in some embodiments, the inner diameter of the arc groove is 1 mm.

[0076] Understandably, due to the presence of the arc groove 150, the inner and outer circuits are also designed to be arc-shaped at the position of the arc groove 150. This allows the force experienced during bending to be distributed to the inner wall of the arc, reducing the risk of the circuit breaking due to concentrated force at a single point.

[0077] In some embodiments, in step S4, resin is first inserted into the first through hole 130, and then the resin located outside the first through hole 130 is removed by polishing with ceramic and non-woven fabric.

[0078] In the above method, resin is used to plug the holes, and then the resin located outside the first through hole 130 is removed by ceramic and non-woven fabric. This facilitates the subsequent steps and reduces the risk of ink flowing from the first upper surface to the first lower surface or from the first lower surface to the first upper surface during screen printing.

[0079] An embodiment of the present invention also provides a bent rigid plate, which is manufactured using the bent rigid plate manufacturing method of any of the above embodiments.

[0080] In the above structure, the bent rigid board is manufactured using the bent rigid board manufacturing method of any of the above embodiments. First, the inner layer circuit pattern is fabricated, then the first substrate 100 and the second substrate 200 are laminated, and then the outer layer circuit pattern is fabricated, such as... Figure 2 As shown, the second bending area 210 of the second substrate 200 is finally milled using a depth-controlled milling process to form a groove 240, as shown. Figure 3 As shown, the first bending region 110 of the first substrate 100 can be easily bent, making the rigid bending board easy to bend. Compared with rigid-flex boards, this manufacturing method is simple and convenient, shortening the product production cycle and reducing the product production cost. Furthermore, since the first bending region 110 and the first assembly region 120 of the rigid bending board in this embodiment of the invention are an integral structure, it is not easily damaged by pulling or loosening during use, resulting in a more stable structure.

[0081] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A method for manufacturing a bent rigid sheet, characterized in that, Includes the following steps: S1: Cutting materials to obtain a first substrate (100) and a second substrate (200). The first substrate (100) has a first upper surface and a first lower surface. The first substrate (100) also has a first bending area (110) and a first assembly area (120) located on the left and right sides of the first bending area (110). The second substrate (200) has a second upper surface and a second lower surface. The second substrate (200) also has a second bending area (210) and a second assembly area (220) located on the left and right sides of the second bending area (210). S2: First drilling: First through holes (130) are drilled in the two first assembly areas (120) respectively, and the first through holes (130) penetrate the first substrate (100); S3: First copper plating process, copper plating is performed on the first through hole (130); S4: Block the first through hole (130); S5: Inner layer circuit fabrication: Inner layer circuit patterns are fabricated on the first upper surface and the second lower surface, with the circuit pattern portion on the first upper surface located in the first bending area (110). S6: Pressing: Pressing the first substrate (100) and the second substrate (200) together so that the first upper surface is connected to the second lower surface; S7: Second drilling: Second through holes (230) are processed in the two first assembly areas (120) or the two second assembly areas (220) respectively. The second through holes (230) penetrate the first substrate (100) and the second substrate (200). The second through holes (230) are arranged at intervals from the first through holes (130). S8: Second copper plating: Perform copper plating on the second through hole (230); S9: Outer layer circuit fabrication: Fabricate the outer layer circuit pattern on the first lower surface and the second upper surface; S10: Screen printing solder resist ink: Screen printing solder resist ink on the first lower surface and the second upper surface; S11: Peripheral forming; S12: Depth control gong: Along the direction from the second upper surface to the first lower surface, the second bending area (210) is gonged out and a groove (240) is formed.

2. The method for manufacturing a bent rigid plate according to claim 1, characterized in that, Both the first substrate (100) and the second substrate (200) are modified FR4 copper-clad laminates, which include a modified FR4 substrate (101) and copper layers (102) located on the upper and lower surfaces of the modified FR4 substrate (101).

3. The method for manufacturing a bent rigid plate according to claim 2, characterized in that, Step S9 further includes: providing an anti-corrosion dry film in the first bending area (110) on the first lower surface, wherein the left and right ends of the anti-corrosion dry film extend to the first assembly area (120) corresponding to the shielding portion.

4. The method for manufacturing a bent rigid plate according to claim 3, characterized in that, The first lower surface has two isolation grooves (140), and the depth of the isolation grooves (140) is greater than or equal to the thickness of the copper layer (102) on the first lower surface. One of the isolation grooves (140) is located between one of the first assembly areas (120) and the first bending area (110), and the other isolation groove (140) is located between the other first assembly area (120) and the first bending area (110).

5. The method for manufacturing a bent rigid plate according to claim 2, characterized in that, Step S5 further includes: providing an anti-corrosion dry film on the first lower surface and the second upper surface.

6. The method for manufacturing a bent rigid plate according to claim 1, characterized in that, In step S6, an adhesive layer (300) is provided between the first upper surface and the second lower surface, and the adhesive layer (300) is a semi-cured sheet.

7. The method for manufacturing a bent rigid plate according to claim 6, characterized in that, The prepreg has a fiberglass cloth layer and resin layers located on the upper and lower sides of the fiberglass cloth layer. In step S12, the second bending area (210) of the second substrate (200) and part of the resin layer located on the upper side of the glass fiber cloth layer are removed from the second upper surface to the first lower surface.

8. The method for manufacturing a bent rigid plate according to claim 1, characterized in that, The first bending area (110) includes a bending portion (111) and connecting portions (112) located on both sides of the bending portion (111). The connecting portions (112) are connected to the corresponding first assembly area (120). The width of the bending portion (111) in the front-to-back direction is smaller than the width of the connecting portion (112) in the front-to-back direction. The front and rear side walls of the first substrate (100) are each provided with two arc-shaped grooves (150). Each arc-shaped groove (150) is located between the bending portion (111) and the corresponding connecting portion (112).

9. The method for manufacturing a bent rigid plate according to claim 1, characterized in that, In step S4, resin is first inserted into the first through hole (130), and then the resin located outside the first through hole (130) is removed by polishing with ceramic and non-woven fabric.

10. A bent rigid plate, characterized in that, It is manufactured using the bending rigid plate manufacturing method as described in any one of claims 1 to 9.

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