Liquid evaporation can apparatus and liquid chemical source delivery system

Abstract

The present application relates to the technical fields of semiconductor processing, and more particularly to a liquid evaporation tank device and a liquid chemical source delivery system. The present application provides a liquid source evaporation tank device, which comprises an evaporation tank body, a liquid supplementing assembly and an ultrasonic generator. The evaporation tank body stores liquid chemical source inside. The liquid supplementing assembly is arranged at the bottom of the evaporation tank body and is used for supplementing liquid into the evaporation tank body. The ultrasonic generator is arranged at the bottom of the evaporation tank body and is used for ultrasonic vibration of the liquid chemical source. The frequency and power of the ultrasonic generator are adjustable. The present application provides a liquid evaporation tank device and a liquid chemical source delivery system, which can improve the growth film thickness and stability in a single process cycle, shorten the time length of Dosing, help to stabilize the working conditions of Dosing, improve the stability of the deposition process, and improve the performance and capacity of the equipment.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor processing, and more particularly to a liquid evaporation tank device and a liquid chemical source delivery system. BACKGROUND

[0002] With the development of microelectronic and deep sub-micron chip technology, the size of devices and materials is required to be reduced, and the aspect ratio in the device is continuously increased, so that the thickness of the used material is reduced to the order of several nanometers. ALD (Atomic layer deposition) is a method of depositing materials on the surface of a substrate in the form of a single atomic layer, which has excellent control ability on the composition and thickness of the thin film compared to other deposition methods. The prepared thin film has good conformality, high purity and uniformity, and therefore is favored in the field of semiconductor material preparation.

[0003] Compared with a CVD (Chemical Vapor Deposition) thin film deposition system, the thin film growth rate of an ALD thin film deposition system is very slow due to its principle characteristics. Therefore, in the case of ensuring that the performance parameters of the thin film meet the required specifications, the GPC (growth rate per cycle) and its long-term stability become key performance parameters of the ALD thin film deposition system.

[0004] The stability of the GPC is closely related to the stability of the step of delivering the liquid chemical source to the cavity (Dosing). The stability of the Dosing is closely related to the stability of the liquid level in the liquid source evaporation tank and the stability of the liquid temperature. The stability of the liquid level and the stability of the liquid temperature are greatly affected by the liquid replenishment operation.

[0005] The liquid replenishment operation in the prior art is usually performed when the equipment is dry cleaned or idle. However, the frequency of liquid replenishment is limited, and the liquid level will have obvious repetitive changes. In addition, it takes a long time to stabilize the liquid temperature, and there is a significant first pair effect. The first pair effect is usually caused by the stability problem of the chemical source delivery and evaporation system. In a continuous deposition process, the film thickness of the first deposition is usually different from that of the subsequent deposition. For ALD, the main reason for the instability of the temperature and the chemical source gas partial pressure in the evaporation tank is that the effective delivery amount of the chemical source changes, thereby affecting the film thickness of the deposition.

[0006] The high or low GPC has a significant impact on the productivity of the customer and the competitiveness of the equipment. In order to improve the GPC, it is necessary to increase the partial pressure of the liquid source vapor in the mixed gas or the dosing time. However, it is usually only possible to provide the temperature of the liquid source and adjust the liquid level of the liquid source and adjust the flow rate of the carrier gas, and it is difficult to find a very balanced window.

[0007] At the same time, the speed or length of the dosing has an important influence on the productivity. In order to improve the speed of dosing under certain pipeline system conditions, it is necessary to increase the flow rate of the carrier gas. However, this may result in a decrease in the partial pressure of the liquid source vapor, thereby failing to improve the GPC. The ideal ALD system should be able to achieve fast dosing while maintaining high GPC and stability. According to the prior art, in the dosing stage, the carrier gas not only needs to mix with the existing mixed gas in the evaporation tank to ensure that the precursor is smoothly transported into the reaction chamber, but also needs to disturb the gas / liquid interface of the liquid source or temporarily change the surface tension of the interface by means of the incident speed of the carrier gas. This means that in the cycle steps other than dosing, the evaporation speed of the liquid source completely depends on the temperature and the surface area of the liquid / gas interface. As the cycle time requirements of dosing and other steps continue to shorten, the evaporation speed of the liquid source may not meet the demand. Therefore, how to effectively use the cycle time other than dosing to accelerate the evaporation rate of the liquid source is particularly important. SUMMARY

[0008] The purpose of the present application is to provide a liquid evaporation tank device and a liquid chemical source delivery system, which solves the problem that the evaporation speed of the liquid source in the existing ALD thin film deposition system cannot meet the requirements.

[0009] Another purpose of the present application is to provide a liquid evaporation tank device and a liquid chemical source delivery system, which solves the problem that the temperature, liquid level and carrier gas flow rate of the liquid source in the existing ALD thin film deposition system are difficult to coordinate and adjust, resulting in poor process stability.

[0010] In order to achieve the above-mentioned purposes, the present application provides a liquid source evaporation tank device, comprising an evaporation tank body, a liquid supplementing assembly and an ultrasonic generator:

[0011] The evaporation tank body stores a liquid chemical source inside;

[0012] The liquid supplementing assembly is arranged at the bottom of the evaporation tank body and is used for supplementing liquid into the evaporation tank body;

[0013] The ultrasonic generator is arranged at the bottom of the evaporation tank body and is used for ultrasonic vibration of the liquid chemical source, and the frequency and power of the ultrasonic generator are adjustable.

[0014] In some embodiments, the liquid source evaporation tank device further comprises a diffuser,

[0015] The diffuser is arranged at the carrier gas inlet of the evaporation tank body to diffuse the input carrier gas.

[0016] In some embodiments, the bottom of the diffuser is arranged within a liquid level range of 30% to 80% in the evaporation tank body.

[0017] The diffuser is provided with a plurality of gas outlets at different phase angle positions.

[0018] In some embodiments, the liquid supplement assembly comprises a liquid supplement pipeline and a heating device.

[0019] The liquid supplement pipeline is connected to the bottom of the evaporation tank body in an on-off manner to supplement liquid into the evaporation tank.

[0020] The heating device is arranged below the liquid supplement pipeline to heat the liquid in the liquid supplement pipeline and the bottom plate of the evaporation tank.

[0021] The single-time liquid supplement amount in the evaporation tank is less than 0.01% of the total volume of the evaporation tank.

[0022] In some embodiments, the volume of the liquid supplement pipeline is less than 0.05% of the total volume of the evaporation tank.

[0023] In some embodiments, the heating device is connected to the bottom plate of the evaporation tank, and the thickness of the bottom plate is at least greater than 5 mm.

[0024] In some embodiments, the evaporation tank body is internally provided with a liquid storage space, and the bottom of the liquid storage space is conical.

[0025] In some embodiments, the liquid supplement pipeline is spirally arranged on the bottom plate of the evaporation tank.

[0026] To achieve the above-mentioned purpose, the present application provides a liquid chemical source delivery system, which comprises a liquid source evaporation tank device and a heater.

[0027] The carrier gas inlet of the liquid source evaporation tank device is connected to the heater in an on-off manner.

[0028] The heater heats the carrier gas to a specified temperature.

[0029] In some embodiments, the liquid source evaporation tank device is provided with a temperature sensor.

[0030] The temperature sensor is arranged in the liquid storage space in the evaporation tank body to detect the temperature of the liquid chemical source in the liquid storage space.

[0031] The temperature of the carrier gas and the temperature of the liquid chemical source constitute an interlocking relationship.

[0032] When the carrier gas temperature is lower than the liquid chemical source temperature, the carrier gas inlet corresponding transmission pipeline is closed, and the carrier gas cannot enter the evaporation tank.

[0033] In some embodiments, the liquid chemical source delivery system further comprises a throttle:

[0034] The mixed gas outlet of the liquid source evaporation tank device is connected to the throttle in an on-off manner.

[0035] The throttle adjusts the working pressure in the liquid source evaporation tank.

[0036] The present application provides a liquid evaporation tank device and a liquid chemical source delivery system, which uses an ultrasonic generator to accurately control the evaporation process of the liquid chemical source, and uses a diffuser to realize rapid mixing of the carrier gas and the mixed gas, ensuring the speed of Dosing and the partial pressure of the liquid source vapor. Through the high-frequency small-dose liquid supplementing mode and the effective preheating means, the liquid level and the liquid temperature stability in the liquid source evaporation tank are improved. This design helps to stabilize the working conditions of Dosing, improves the stability of the deposition process, and further improves the growth film thickness and its stability in a single process cycle. At the same time, the length of Dosing is shortened, and the performance and productivity of the equipment are further improved. BRIEF DESCRIPTION OF DRAWINGS

[0037] The above and other features, properties, and advantages of the present application will become more apparent by the following description with reference to the accompanying drawings and embodiments, in which the same reference numerals are used throughout to designate the same features, wherein:

[0038] Figure 1 The overall structure of the liquid source evaporation tank device according to an embodiment of the present application is disclosed;

[0039] Figure 2 The installation schematic diagram of the ultrasonic generator according to an embodiment of the present application is disclosed;

[0040] Figure 3 The tank bottom structure schematic diagram of the liquid source evaporation tank device according to an embodiment of the present application is disclosed;

[0041] Figure 4 The installation schematic diagram of the evaporation tank heat insulation sleeve according to an embodiment of the present application is disclosed;

[0042] Figure 5 The internal schematic diagram of the liquid source evaporation tank device according to an embodiment of the present application is disclosed;

[0043] Figure 6 The liquid level schematic diagram of the liquid source evaporation tank device according to an embodiment of the present application is disclosed;

[0044] Figure 7a The overall structure of the diffuser according to an embodiment of the present application is disclosed;

[0045] Figure 7b The internal structure of the diffuser according to an embodiment of the present application is disclosed;

[0046] Figure 8 The schematic diagram of the mixing of the carrier gas and the in-pipe mixed gas according to an embodiment of the present application is disclosed;

[0047] Figure 9 The connection principle diagram of the liquid chemical source delivery system according to an embodiment of the present application is disclosed.

[0048] The meanings of the reference numerals in the drawings are as follows:

[0049] 10 Evaporating tank body

[0050] 11 Carrier gas inlet

[0051] 12 Mixed gas outlet

[0052] 13 Bottom liquid supplementing interface

[0053] 14 Supporting leg

[0054] 15 Placing hole

[0055] 16 First manual valve

[0056] 17 Second manual valve

[0057] 18 Third manual valve

[0058] 19 Heat insulation sleeve

[0059] 21 Heating disc

[0060] 22 Liquid supplementing pipeline

[0061] 31 Temperature sensor / liquid level sensor

[0062] 32 Ultrasonic generator

[0063] 33 Diffuser

[0064] 331 Diffusion hole

[0065] 41 Liquid storage space

[0066] 42 Bottom of the liquid storage space

[0067] 43 Bottom liquid supplementing inlet

[0068] 44 Liquid chemical source

[0069] 511 heater;

[0070] 512 first pneumatic diaphragm valve;

[0071] 513 first mass flow meter;

[0072] 514 second pneumatic diaphragm valve;

[0073] 515 first filter;

[0074] 516 first pressure regulating valve;

[0075] 517 first manual diaphragm valve;

[0076] 521 flow restrictor;

[0077] 522 third pneumatic diaphragm valve;

[0078] 523 fourth pneumatic diaphragm valve;

[0079] 524 fifth pneumatic diaphragm valve;

[0080] 525 sixth pneumatic diaphragm valve;

[0081] 531 seventh pneumatic diaphragm valve;

[0082] 532 eighth pneumatic diaphragm valve;

[0083] 533 ninth pneumatic diaphragm valve;

[0084] 534 tenth pneumatic diaphragm valve;

[0085] 535 second mass flow meter;

[0086] 536 second filter;

[0087] 537 second pressure regulating valve;

[0088] 538 second manual diaphragm valve;

[0089] 539 third manual diaphragm valve;

[0090] 541 eleventh pneumatic diaphragm valve;

[0091] 542 twelfth pneumatic diaphragm valve;

[0092] 551 first pneumatic ALD valve;

[0093] 552 second pneumatic ALD valve;

[0094] 553 third pneumatic ALD valve. DETAILED DESCRIPTION

[0095] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and should not be used to limit the present application.

[0096] Figure 1 The overall structural diagram of the liquid source evaporation can equipment according to an embodiment of the present application is disclosed, as shown in Figure 1 The liquid source evaporation can equipment according to the present application comprises an evaporation can body 10, a liquid supplementing assembly and an ultrasonic generator 32:

[0097] The evaporation can body stores liquid chemical source inside;

[0098] The liquid supplementing assembly is arranged at the bottom of the evaporation can body 10 and is used to supplement liquid into the evaporation can body 10;

[0099] The ultrasonic generator 32 is arranged at the bottom of the evaporation can body 10 and is used to perform ultrasonic vibration on the liquid chemical source to enhance the evaporation process. The frequency and power of the ultrasonic generator can be adjusted.

[0100] The liquid source evaporation can equipment can be arranged in a thin film deposition device and is used to provide liquid chemical source into a reaction chamber.

[0101] The upper part of the evaporation can body 10 can be provided with a carrier gas inlet 11 and a mixed gas outlet 12.

[0102] The carrier gas can be introduced into the evaporation can body 10 through the carrier gas inlet 11. The carrier gas is used to carry the liquid chemical source inside the evaporation can body 10. The carrier gas carrying the liquid chemical source can be output through the mixed gas outlet 12 and finally delivered into the reaction chamber of the thin film deposition device. In the reaction chamber, deposition reaction, such as ALD reaction, can be performed.

[0103] The liquid source evaporation can equipment according to the present application realizes direct recipe associated control of the ultrasonic generator by introducing ultrasonic enhanced vaporization technology through the ultrasonic generator 32.

[0104] The ultrasonic generator 32 can be always on or selectively turned on in specific steps other than Dosing. According to actual requirements, the working rhythm of the ultrasonic generator and the coupling mode of the deposition process are designed, so as to realize accurate control of the ultrasonic generator in the manufacturing process.

[0105] Figure 2 The mounting schematic diagram of the ultrasonic generator according to an embodiment of the present application is disclosed, as shown in Figure 1 and Figure 2As shown, the bottom of the evaporation tank body 10 is provided with a placing hole 15 for placing an ultrasonic generator 32.

[0106] The action effects of ultrasonic waves mainly include mechanical effect, thermal effect and cavitation effect. Ultrasonic waves can change the physical performance parameters such as surface tension of liquid. In the ALD liquid source ultrasonic enhanced evaporation process by the ultrasonic generator 32, the cavitation phenomenon needs to be reasonably controlled to prevent bubbles from suddenly exploding to produce liquid, and then to cause the liquid to be transported to the cavity and produce abnormal particles. Therefore, for the ALD process, controlling the cavitation effect is one of the key factors to ensure the deposition of high-quality thin films.

[0107] Cavitation refers to the existence of bubbles in liquid. When the bubbles in the liquid reach a certain number and size, they will affect the flow performance and heat transfer performance of the liquid, and even cause the failure and damage of the equipment. The cavitation threshold refers to the minimum pressure value at which water cavitation occurs under certain conditions.

[0108] The cavitation threshold is related to the working frequency, medium gas content, sound wave action time, environmental static pressure, medium viscosity and liquid temperature. The higher the frequency, the smaller the gas content, the shorter the sound wave action time, the greater the environmental static pressure, the higher the medium viscosity, and the lower the liquid temperature, the higher the cavitation threshold.

[0109] The bubbles will vibrate under the action of the sound field, but may not break. Only when the frequency of the sound wave is lower than the resonance frequency of the bubble, the bubble can be broken. When the frequency of the sound wave is higher than the resonance frequency of the bubble, the bubble only vibrates complexly, and generally does not break.

[0110] The ultrasonic frequency is divided into three frequency bands: low frequency (20KHz-50KHz), high frequency (50KHz-200KHz) and ultrahigh frequency (above 700KHz-1MHz). According to different chemical source characteristics and working conditions, the ultrasonic generator 32 can select a suitable working frequency ultrasonic source and modulate its power to find a suitable evaporation control window while suppressing cavitation.

[0111] Figure 3 A schematic diagram of the tank bottom structure of the liquid source evaporation tank equipment according to an embodiment of the present application is disclosed, Figure 4 A schematic diagram of the installation of the evaporation tank heat insulation sleeve according to an embodiment of the present application is disclosed, as shown in Figure 3 And Figure 4 As shown, the liquid supplementing assembly includes a liquid supplementing pipeline 22 and a heating device:

[0112] The liquid supplementing pipeline 22 is connected to the bottom of the evaporation tank body 10 in an on-off manner, and is used for supplementing liquid in the evaporation tank;

[0113] The heating device, which is a heating plate 21, is arranged below the liquid supplement pipeline 22 and used to heat the liquid in the liquid supplement pipeline 22 and the bottom plate of the evaporation tank body 10.

[0114] The liquid supplement assembly in the embodiment adopts a bottom liquid supplement structure design scheme and mainly considers how to improve the maintenance efficiency of the chemical source delivery system. In the case of needing to recover the chemical source, the bottom liquid supplement can improve the recovery ratio of the chemical source. In the case of needing to discharge the chemical source in the tank, the emptying speed and the effectiveness of the purging can be accelerated, thereby shortening the single maintenance time of the MTTR.

[0115] In the embodiment, the heating plate 21 is connected with the bottom plate of the evaporation tank body 10, and the bottom plate of the evaporation tank body 10 is specially thickened to increase the heat capacity of the evaporation tank body 10 and improve the stability of the temperature.

[0116] Further, the thickness of the bottom plate is at least greater than 5 mm.

[0117] In the embodiment, the liquid supplement pipeline 22 is spirally arranged on the bottom plate of the evaporation tank body 10.

[0118] On the bottom plate of the evaporation tank body 10, a spiral groove is opened, and a 1 / 8-inch liquid supplement pipeline 22 is welded in the groove.

[0119] The heating plate 21 at the bottom of the evaporation tank performs integrated heating treatment on the bottom of the evaporation tank and the spiral liquid supplement pipeline 22 to ensure that the liquid supplement part is fully preheated.

[0120] To ensure the stability and uniformity of the liquid supplement, the evaporation tank needs to be preheated before the liquid supplement. By using the relatively high temperature of the tank bottom, it can be avoided that the liquid supplement causes obvious disturbance to the existing liquid when entering the tank body. The temperature distribution of the evaporation tank should be kept highest at the bottom and gradually decreased to the top, so as to ensure that the temperature in the liquid supplement pipeline 22 is appropriately higher than that of the liquid in the tank body. Such a temperature gradient can further ensure the stability and uniformity of the liquid supplement.

[0121] As shown in Figure 3 , the evaporation tank body 10 is provided with three symmetrically distributed supporting legs 14 at the bottom for supporting the entire liquid source evaporation tank equipment.

[0122] As shown in Figure 3 and Figure 4 , a bottom liquid supplement interface 13 is connected at one end of the liquid supplement pipeline 22 to receive the supplement solution for the liquid chemical source provided from the outside.

[0123] A first manual valve 16 is arranged at the carrier gas inlet 11 to open or close the carrier gas input.

[0124] A second manual valve 17 is arranged at the mixed gas outlet 12 for opening or closing the mixed gas output;

[0125] A third manual valve 18 is arranged at the bottom liquid supplementing interface 13 for opening or closing the liquid supplementing input.

[0126] Figure 5 An internal schematic diagram of a liquid source evaporation tank device according to an embodiment of the present application is disclosed, as shown in Figure 5 As shown, the evaporation tank body 10 is internally provided with a liquid storage space 41, and the bottom 42 of the liquid storage space is conical. The conical shape of the tank bottom ensures that the liquid supplementing part can be diffused to the periphery of the tank bottom in an axisymmetric manner, so as to be preferentially heated.

[0127] The bottom liquid supplementing interface 43 is connected to the liquid supplementing pipeline 22. The temperature at the bottom is relatively high, so the liquid with a high temperature has a tendency to float upward. Through the bottom liquid supplementing mode, the newly supplemented liquid can be fully heated and mixed with the existing liquid. In this way, it can be ensured that the liquid supplementing part actually entering the internal part of the tank body will not obviously disturb the temperature of the existing liquid.

[0128] The liquid supplementing assembly does not have specific requirements for the liquid supplementing time, and can realize all-weather liquid supplementing.

[0129] In the embodiment, the volume of the preheating section of the liquid supplementing pipeline 22 is controlled to be within 2-5 milliliters, which is lower than one ten-thousandth of the total volume of the evaporation tank. The single liquid supplementing amount is also strictly controlled to be lower than one ten-thousandth of the total volume. Based on these parameters, in combination with the actual consumption amount of the chemical source, a high-frequency low-liquid-amount liquid supplementing scheme is formulated.

[0130] The temperature of the preheated liquid in the bottom spiral liquid supplementing pipeline 22 is slightly higher than the temperature of the existing liquid in the tank body. At the same time, in order to ensure that no cold liquid enters the internal part of the tank body during the liquid supplementing process, the single liquid supplementing amount is controlled. By delivering the preheated liquid to the internal part of the tank body in multiple times, the actual liquid supplementing amount in each time is strictly controlled to be within one ten-thousandth of the existing liquid. This control mode almost has no effect on the state of the gas-liquid interface.

[0131] In the embodiment, the length of the liquid supplementing pipeline 22 is greater than 500 mm, and the liquid supplementing pipeline 22 uses a 1 / 8-inch stainless steel pipe.

[0132] The chemical source consumption of a single process cycle is stable and measurable. In order to maximize the stability of the dosing, the present application adopts an effective preheating and high-frequency small-dose liquid supplementing method. After the single liquid supplementing dose is defined, in combination with the actual chemical source consumption amount, the number of times of liquid supplementing in a complete process can be calculated. Such an operation mode can ensure the accuracy and stability of the process, thereby improving the product quality and production efficiency.

[0133] Assuming the total volume of the liquid storage space 41 in the liquid source evaporation tank device is 1600 milliliters, the optimal working liquid level, i.e. the standard working liquid level, should be maintained at 50% of the total volume. To ensure normal operation of the device, the current liquid level of the liquid chemical source in the liquid storage space 41 should first be detected by the liquid level detector 31. When the current liquid level of the liquid chemical source is lower than 800 milliliters, the liquid storage space 41 should be supplemented with solution in time.

[0134] In the initial state, the capacity of the liquid chemical source in the liquid storage space 41 is 800 milliliters. To ensure the stability of the liquid supplementing process, the amount of solution supplemented each time should be controlled between 0.8 and 0.5 milliliters, i.e. less than 1 / 1000 of the total volume of the liquid storage space 41. During the entire deposition process, it is expected that the liquid should be supplemented 30 to 50 times.

[0135] Considering that the time for each ALD cycle is 1 second, the entire deposition process is expected to take 2500 seconds. If the liquid supplementing assembly is used to supplement the liquid in batches, each batch of 50 times, the liquid storage space 41 is supplemented with a small amount of solution, and the preheating effect of the liquid supplementing is more sufficient and stable. For a single supplement of 0.5 milliliters of cold liquid, the heat required for preheating is not large, and therefore does not significantly disturb the temperature state of the liquid chemical source in the liquid storage space 41.

[0136] The liquid source evaporation tank device of the present application uses a high-frequency and small-dose liquid supplementing method, so that the evaporation conditions in the liquid storage space 41 of the liquid source evaporation tank device are kept stable, and there is no special requirement for the liquid supplementing time, and even all-weather liquid supplementing can be achieved.

[0137] As shown in Figure 4 and Figure 5 , the evaporation tank body 10 is provided with an external heat insulation sleeve 19 for maintaining the stability of the temperature in the tank and reducing heat loss.

[0138] As shown in Figure 5 , the liquid source evaporation tank device can further include a temperature sensor / liquid level sensor 31. The temperature sensor is arranged in the liquid storage space 41 in the evaporation tank body 10, and is used to detect the temperature of the liquid chemical source in the liquid storage space.

[0139] The liquid level sensor is arranged in the liquid storage space 41 in the evaporation tank body 10, and is used to detect the liquid level of the liquid chemical source in the liquid storage space. When the liquid level of the liquid chemical source in the liquid storage space 41 of the liquid source evaporation tank device is lower than the standard liquid level, the liquid storage space 41 can be supplemented with solution through the liquid supplementing assembly.

[0140] Figure 6 A liquid level diagram of the liquid source evaporation tank device according to an embodiment of the present application is disclosed, as shown in Figure 6 , the liquid source evaporation tank device further includes a diffuser 33,

[0141] The diffuser 33 is arranged at the carrier gas inlet of the vaporization tank body and diffuses the input carrier gas.

[0142] Generally, the bottom of the diffuser 33 is arranged within the liquid level range of 30% to 80% of the liquid chemical source 44 in the vaporization tank body 31.

[0143] Preferably, the bottom of the diffuser 33 is arranged at the liquid level close to 50% of the liquid chemical source 44 in the vaporization tank body 31.

[0144] Figure 7a The overall structure of the diffuser according to an embodiment of the present application is disclosed, Figure 7b The internal structure of the diffuser according to an embodiment of the present application is disclosed, as shown in Figure 7a and Figure 7b As shown, the diffuser 33 is provided with gas holes 331 at different phase angles. These gas holes can effectively disperse the gas uniformly in all directions, thereby improving the diffusion efficiency of the gas.

[0145] Figure 8 The schematic diagram of the mixing of the carrier gas and the mixed gas in the pipe according to an embodiment of the present application is disclosed, as shown in Figure 8 The diffuser 33 diffuses the input carrier gas to ensure that the high-purity carrier gas is fully and quickly mixed with the existing mixed gas in the vaporization tank during the dosing stage, and the mixed gas will flow out through the mixed gas outlet 12, thereby ensuring the speed of the dosing and the partial pressure of the liquid source vapor.

[0146] Figure 9 The connection principle diagram of the liquid chemical source delivery system according to an embodiment of the present application is disclosed, as shown in Figure 9 As shown, the liquid chemical source delivery system proposed by the present application comprises a liquid source vaporization tank device and a plurality of transmission pipelines, a heater 511, and a throttling device 521.

[0147] The carrier gas inlet 11 of the liquid source vaporization tank device is connected to the heater 511 in an on-off manner;

[0148] The heater 511 heats the carrier gas to a specified temperature.

[0149] The heater 511 can be a heat exchanger, a heating jacket, or other heating devices, depending on the actual application requirements. In order to ensure that the high-purity carrier gas is fully preheated before entering the vaporization tank, a high-efficiency heat exchanger can be used to directly heat the gas, or a heating jacket can be used to heat the pipeline. In order to prevent the liquid source vapor from condensing, the temperature of the carrier gas inlet needs to be higher than the temperature of the liquid source by more than 10 degrees.

[0150] The heat exchanger can accurately heat the carrier gas to a specified temperature, so that the gas reaches the required temperature range. By adjusting the duty cycle, the power output can be controlled to meet the needs of different process flows.

[0151] The liquid source evaporation tank device is provided with a temperature sensor (not shown) in the liquid storage space 41 in the tank body: Figure 9

[0152] The temperature sensor is arranged in the liquid storage space 41 in the tank body, and is used to detect the temperature of the liquid chemical source in the liquid storage space;

[0153] The temperature of the carrier gas and the temperature of the liquid chemical source constitute an interlocking relationship;

[0154] When the temperature of the carrier gas is lower than the temperature of the liquid chemical source, the transmission pipeline corresponding to the carrier gas inlet 11 is closed, and the carrier gas cannot enter the evaporation tank.

[0155] The mixed gas outlet 12 of the liquid source evaporation tank device is connected to the throttle 521 in an on-off manner;

[0156] The throttle 521 adjusts the working pressure in the liquid source evaporation tank.

[0157] As shown in Figure 9 The carrier gas inlet 11 of the liquid source evaporation tank device is connected to the first pneumatic ALD valve 551, the heater 511, the first pneumatic diaphragm valve 512, the first mass flowmeter 513, the second pneumatic diaphragm valve 514, the first filter 515, the first pressure regulating valve 516, and the first manual diaphragm valve 517 in sequence, and finally connected to the carrier gas;

[0158] The mixed gas outlet 12 of the liquid source evaporation tank device is connected to the third pneumatic ALD valve 553, the third pneumatic diaphragm valve 522, the throttle 521, and the fourth pneumatic diaphragm valve 523 in sequence. The other end of the fourth pneumatic diaphragm valve 523 is connected to the fifth pneumatic diaphragm valve 524 and the sixth pneumatic diaphragm valve 525. The other end of the fifth pneumatic diaphragm valve 524 flows to the reactor, and the other end of the sixth pneumatic diaphragm valve 525 flows to the front-stage exhaust system.

[0159] A second pneumatic ALD valve 552 is arranged between the first pneumatic ALD valve 551 and the third pneumatic ALD valve 553.

[0160] The liquid source is connected to the bottom liquid supplementing interface 13 in sequence through the second manual diaphragm valve 538, the eighth pneumatic diaphragm valve 532, and the seventh pneumatic diaphragm valve 531. A small-dose and high-frequency liquid supplementing mode is adopted to maximize the stability of the liquid level and ensure the balance of the liquid during the deposition process. At the same time, the liquid supplementing time can be accurately controlled according to the manufacturing process to ensure the stability and consistency of the production process. ​

[0161] The purge gas is connected to the third manual diaphragm valve 539, the second pressure regulating valve 537, the second filter 536, the tenth pneumatic diaphragm valve 534, the second mass flow meter 535, the ninth pneumatic diaphragm valve 533, and then the seventh pneumatic diaphragm valve 531 in sequence, and is connected to the bottom liquid supplementing interface 13;

[0162] The seventh pneumatic diaphragm valve 531, the eighth pneumatic diaphragm valve 532, and the ninth pneumatic diaphragm valve 533 are connected to the eleventh pneumatic diaphragm valve 541 and the twelfth pneumatic diaphragm valve 542 in sequence, and flow to the front-stage exhaust system.

[0163] The present application provides a liquid evaporation tank device and a liquid chemical source delivery system, which adopts an ultrasonic generator to accurately control the evaporation process of a liquid chemical source, and adopts a diffuser to realize rapid mixing of a carrier gas and a mixed gas, so as to ensure the speed of dosing and the partial pressure of the liquid source vapor. Through a high-frequency small-dose liquid supplementing mode and an effective preheating means, the liquid level and the liquid temperature stability in the liquid source evaporation tank are improved. This design helps to stabilize the working conditions of dosing, improve the stability of the deposition process, and further improve the growth film thickness and its stability in a single process cycle. At the same time, the length of time of dosing is shortened, and the performance and productivity of the equipment are further improved.

[0164] As shown in the present application and claims, unless the context clearly indicates otherwise, the words "one", "an", "a", and / or "the" do not specify a singular form, but can also include a plural form. Generally, the terms "comprise" and "include" only indicate the inclusion of the steps and elements explicitly identified, and these steps and elements do not constitute an exclusive list, and the method or device can also include other steps or elements.

[0165] In the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounting", "connection", and "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0166] In addition, in the following description, "up", "down", "left", "right", "top", "bottom", "horizontal", "vertical" should be understood as the orientation shown in the section and the related drawings. The relative terms are only for the convenience of description, and they do not represent that the devices described should be manufactured or operated in a particular orientation, and therefore should not be understood as a limitation on the present application.

[0167] The above embodiments are provided to those skilled in the art to implement or use the present application, and the skilled in the art can make various modifications or changes to the above embodiments without departing from the inventive idea of the present application, and thus the protection scope of the present application is not limited by the above embodiments, but should be the maximum scope of the innovative features mentioned in the claims.

Claims

1. A liquid source vaporization tank apparatus, comprising: The liquid source evaporation can equipment is used for an ALD thin film deposition system, and comprises an evaporation can body, a liquid supplementing assembly, and an ultrasonic generator: The evaporation can body stores a liquid chemical source inside; The liquid supplementing assembly is arranged at the bottom of the evaporation can body and is used for supplementing liquid into the evaporation can body; The ultrasonic generator is arranged at the bottom of the evaporation can body and is used for ultrasonic vibration of the liquid chemical source, and the frequency and power of the ultrasonic generator are adjustable; The liquid supplementing assembly comprises a liquid supplementing pipeline and a heating device: The liquid supplementing pipeline is connected to the bottom of the evaporation can body in an on-off manner and is used for supplementing liquid into the evaporation can body; The heating device is arranged below the liquid supplementing pipeline and is used for heating liquid in the liquid supplementing pipeline and the bottom plate of the evaporation can body; The single liquid supplementing amount in the evaporation can is less than 0.001% of the total volume of the evaporation can.

2. The liquid source vaporisation tank apparatus of claim 1, wherein, Further comprising a diffuser, The diffuser is arranged at the carrier gas inlet of the evaporation can body and is used for diffusing input carrier gas.

3. The liquid source vaporisation tank apparatus of claim 2, wherein, The bottom of the diffuser is arranged within a liquid level range of 30% to 80% in the evaporation can body; The diffuser is provided with a plurality of gas outlet holes at different phase angle positions.

4. The liquid source vaporisation tank apparatus of claim 1, wherein, The volume of the liquid supplementing pipeline is less than 0.005% of the total volume of the evaporation can.

5. The liquid source vaporization tank apparatus of claim 1, wherein, The heating device is connected to the bottom plate of the evaporation can body, and the thickness of the bottom plate is at least greater than 5 mm.

6. The liquid source vaporization tank apparatus of claim 1, wherein, The evaporation can body is internally provided with a liquid storage space, and the bottom of the liquid storage space is conical.

7. The liquid source vaporization tank apparatus of claim 1, wherein, The liquid supplementing pipeline is spirally arranged on the bottom plate of the evaporation can body.

8. A liquid chemical source delivery system characterized by, The liquid source evaporation can equipment comprises the liquid source evaporation can equipment and a heater as claimed in any one of claims 1 to 7: The carrier gas inlet of the liquid source evaporation can equipment is connected to the heater in an on-off manner; The heater heats the carrier gas to a specified temperature.

9. The liquid chemical source delivery system of claim 8, wherein, The liquid source evaporation can equipment is provided with a temperature sensor: The temperature sensor is arranged in the liquid storage space in the evaporation can body and is used for detecting the temperature of the liquid chemical source in the liquid storage space; The temperature of the carrier gas and the temperature of the liquid chemical source constitute an interlocking relationship; When the temperature of the carrier gas is lower than the temperature of the liquid chemical source, the transmission pipeline corresponding to the carrier gas inlet is closed, and the carrier gas cannot enter the evaporation can.

10. The liquid chemical source delivery system of claim 8, wherein, Further comprising a flow restrictor: The mixed gas outlet of the liquid source evaporation can equipment is connected to the flow restrictor in an on-off manner; The flow restrictor adjusts the working pressure in the liquid source evaporation can.

Images