Wafer horizontal cleaning device

Abstract

The embodiment of the application provides a wafer horizontal cleaning device, which comprises a clamping disc, a power assembly and a back spraying assembly. The clamping disc is used for horizontally clamping a wafer, and a cleaning hole is arranged in a central region of the clamping disc. The power assembly is arranged below the clamping disc, an end of an output shaft of the power assembly penetrates the cleaning hole, the output shaft is a hollow pipe and is in communication with the cleaning hole. The back spraying assembly is arranged in the output shaft, the back spraying assembly sprays cleaning liquid towards a back central region of the wafer, a first gap is formed between an outer circumferential surface of the back spraying assembly and an inner wall surface of the output shaft, the first gap is in communication with the cleaning hole, and waste liquid is discharged through the first gap. According to the wafer horizontal cleaning device, the waste liquid can be discharged through the first gap in time, the waste liquid can be effectively prevented from corroding other structural members, and the waste liquid can be prevented from being accumulated to cause liquid beads to be condensed on the back of the wafer, thereby affecting the process effect.

Description

Technical Field

[0001] This application relates to the field of wafer processing technology, and more particularly to a wafer horizontal cleaning apparatus. Background Technology

[0002] Currently, in advanced wafer wet processing technologies (such as single-wafer cleaning), horizontal and double-sided wafer cleaning processes are increasingly prevalent. These cleaning processes typically utilize horizontal wafer cleaning equipment, which operates by rotating the wafer using a power unit (such as a motor). During rotation, chemicals are sprayed onto the front side of the wafer to clean it. For back-side cleaning, chemicals are sprayed from the back of the wafer. To increase machine throughput and accelerate the wafer drying process, a high-purity nitrogen purging function is usually provided.

[0003] The delivery of the back-side cleaning solution is accomplished by the back spray assembly. Because the back spray assembly needs to deliver the cleaning solution, it is typically in a fixed, non-rotating state. Due to the unique mechanical structure of the back spray assembly (the motor needs to drive the wafer to rotate at high speed while the back spray assembly itself must remain stationary), wafer back-side cleaning is usually achieved by a hollow-shaft motor driving the wafer clamping disk to rotate. Simultaneously, a fixed back spray assembly (also known as a spray pipe) is embedded inside the hollow shaft of the hollow-shaft motor to complete the cleaning process on the back of the wafer.

[0004] For back-side cleaning of wafers, the siphon effect during the rotation of the power assembly (external gas flows into the chamber from the dynamic-static isolation area) poses a risk of introducing external contaminants into the wafer chamber. Furthermore, some highly penetrating chemicals (such as ozone water) can seep into the gaps of the wafer's power assembly, especially the shaft gaps of the drive motor, causing chemical corrosion to the power assembly. In addition, if the drainage capacity of the wafer horizontal cleaning unit is insufficient, the siphon effect can cause liquid droplets to condense near the back side of the wafer, resulting in a damp back side and affecting process performance. Summary of the Invention

[0005] In view of this, this application provides a wafer horizontal cleaning device, in which a back spray assembly is disposed inside the output shaft of a power assembly, and a first gap is provided between the inner wall of the output shaft and the back spray assembly. Therefore, after cleaning liquid is sprayed onto the back of the wafer for cleaning, the cleaning waste liquid can be easily discharged through the first gap in a timely manner, effectively preventing the waste liquid from flowing into the gaps of other structures and causing corrosion of other structural components, and preventing the accumulation of waste liquid from causing liquid droplets to condense on the back of the wafer, which would affect the process effect.

[0006] According to an embodiment of this application, a wafer horizontal cleaning apparatus is provided, including a clamping disk, a power assembly, and a back spray assembly. The clamping disk is used to horizontally clamp the wafer, and a cleaning hole is formed in its central region. The power assembly is located below the clamping disk, and the end of the output shaft of the power assembly passes through the cleaning hole. The output shaft is a hollow tube and communicates with the cleaning hole. The back spray assembly is disposed inside the output shaft. The back spray assembly sprays cleaning liquid toward the central region of the back side of the wafer. A first gap exists between the outer peripheral surface of the back spray assembly and the inner wall surface of the output shaft. The first gap communicates with the cleaning hole to discharge cleaning waste liquid through the first gap. The output shaft is made of a corrosion-resistant material.

[0007] Optionally, the wafer horizontal cleaning device further includes a drain assembly, the top of which is connected to the bottom of the power assembly. The drain assembly has a drain channel that communicates with the first gap to guide the waste liquid from the first gap to the drain channel and discharge it.

[0008] Optionally, the back spray assembly includes a spray body, a nozzle at a first end of the spray body for spraying cleaning fluid onto the back side of the wafer, and an inlet channel inside the second end of the spray body for installing an inlet pipe for conveying cleaning fluid in the inlet channel; the spray body also includes a delivery pipe inside the spray body, with both ends of the delivery pipe connected to the nozzle and the inlet pipe respectively, and the radial dimension of the inlet channel being larger than the radial dimension of the delivery pipe.

[0009] Optionally, the length of the injector is greater than the length of the output shaft, the second outer diameter of the second end of the injector is smaller than the first outer diameter of the first end, and the second end of the injector extends into the drainage channel.

[0010] Optionally, the drainage assembly includes a partition wall disposed within the drainage channel. The inner wall of the partition wall and the outer wall of the second end form a first drainage pipe communicating with the first gap, and the outer wall of the partition wall and the inner wall of the drainage assembly form a second drainage pipe.

[0011] Optionally, there is an inclined surface between the first outer diameter and the second outer diameter, and the lower end of the output shaft has a guide member, which is provided with an inclined guide portion. The inclined guide portion is inclined toward the second end to guide the cleaning waste liquid through the first gap to the first drain pipe.

[0012] Optionally, the inclined guide is positioned to match the second drain pipe, so that waste liquid that is not discharged in time from the first drain pipe can enter the second drain pipe through the gap between the inclined guide and the partition wall.

[0013] Optionally, a stepped surface is provided between the first outer diameter and the second outer diameter, and a guide is provided at the lower end of the output shaft. The guide is provided with a longitudinal guide portion that extends into the second drain pipe to guide the cleaning waste liquid through the first gap to the first drain pipe and / or the second drain pipe.

[0014] Optionally, the wafer horizontal cleaning device further includes an adapter disposed on the outer peripheral surface of the output shaft. The top of the adapter abuts against the back of the clamping disk, and the bottom of the adapter is connected to the top of the power assembly. The outer peripheral surface of the adapter is provided with a plurality of air sealing grooves, which are arranged sequentially along the axial direction of the adapter and are parallel to each other.

[0015] Optionally, the wafer horizontal cleaning apparatus further includes a gas seal located between the clamping disk and the power assembly, and the gas seal is fitted over the adapter and has a clearance fit with the adapter. The gas seal is capable of delivering gas toward the adapter and the power assembly.

[0016] Optionally, the air seal includes: an air inlet connected to an external air source; an airflow channel disposed inside the air seal and connected to the air inlet; a first vent extending horizontally and connected to the airflow channel, the first vent being opposite to the annular groove of the adapter; and a second vent extending vertically and connected to the airflow channel, the second vent being opposite to the power assembly.

[0017] Optionally, the wafer horizontal cleaning device further includes an inner protective member covering the power assembly. The inner protective member has a first opening in the middle to allow the output shaft and at least part of the adapter to pass through. The inner wall of the first opening has a second annular groove.

[0018] Optionally, the wafer horizontal cleaning apparatus further includes a main body having a mounting cavity; a fan filter assembly disposed outside the main body to allow gas exchange between the mounting cavity and the outside; and a cleaning assembly disposed within the mounting cavity, the cleaning assembly having nozzles to spray the cleaning fluid onto the front side of the wafer.

[0019] A wafer horizontal cleaning apparatus provided according to an embodiment of this application has the following beneficial effects:

[0020] a. The back spray assembly is set inside the output shaft of the power assembly, and there is a first gap between the inner wall of the output shaft and the back spray assembly. Therefore, after the cleaning liquid is sprayed on the back of the wafer for cleaning, the cleaning waste liquid can be easily discharged through the first gap in a timely manner, effectively preventing the waste liquid from flowing into the gaps of other structures and causing corrosion of other structural components.

[0021] b. It can prevent waste liquid from accumulating and causing liquid droplets to condense on the back of the wafer, thus affecting the process effect.

[0022] c. The end of the output shaft is connected to the cleaning hole, so that the cleaning fluid can be discharged in time in the first gap. This also prevents highly permeable chemical solutions, such as ozone water, from seeping into the gap of the power component of the wafer, causing chemical corrosion to the power component.

[0023] d. The output shaft of the power unit is made of corrosion-resistant material, which can improve its service life. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings.

[0025] Figure 1 This is an overall front view of the wafer horizontal cleaning apparatus according to an embodiment of this application;

[0026] Figure 2 This is a partial front view of a wafer horizontal cleaning apparatus according to an embodiment of this application;

[0027] Figure 3 This is a front view of the output shaft, back spray assembly, adapter, and drain assembly of the power assembly of the wafer horizontal cleaning apparatus according to an embodiment of this application;

[0028] Figure 4 for Figure 2 A magnified view of point A in the image;

[0029] Figure 5 for Figure 2 A magnified view of point B in the image;

[0030] Figure 6 This is a front view of another embodiment of the guide and drainage assembly of the wafer horizontal cleaning apparatus according to an embodiment of this application;

[0031] Figure 7 This is a three-dimensional structural schematic diagram of the back spray assembly of the wafer horizontal cleaning apparatus according to an embodiment of this application;

[0032] Figure 8 This is a perspective cross-sectional view of the gas seal of a wafer horizontal cleaning apparatus according to an embodiment of this application.

[0033] Explanation of reference numerals in the attached figures:

[0034] 100 wafer horizontal cleaning unit; 200 wafers;

[0035] Main body 1; Air outlet 11; Fan filter assembly 2; Cleaning assembly 3;

[0036] Clamping plate 10; substrate 101; clamping member 102; cleaning hole 103;

[0037] Power assembly 20; output shaft 201; guide 202; tilting guide 2021; horizontal guide 2022; longitudinal guide 2023;

[0038] Back spray assembly 30; first end 301; second end 302; spray body 303; nozzle 304; liquid inlet channel 305; inlet pipe 306; inclined surface 307; stepped surface 308; long groove 309;

[0039] First gap 40;

[0040] Drainage assembly 50; drainage channel 501; partition wall 502; first drainage pipe 503; second drainage pipe 504;

[0041] Adapter 60; Air seal groove 601;

[0042] Air seal 70; air inlet 701; airflow channel 702; first vent 703; second vent 704;

[0043] Inner protective component 80; First opening 801; Second annular groove 802;

[0044] Outer protective component 90; receiving cavity 901; movable base plate 902; outer protective shell 903; movable cylinder 904. Detailed Implementation

[0045] To enable those skilled in the art to better understand the technical solutions in the embodiments of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art should fall within the protection scope of the embodiments of this application.

[0046] The following is in conjunction with the instruction manual appendix. Figures 1-8 The wafer horizontal cleaning apparatus 100 of the present application embodiments is described in detail below.

[0047] like Figures 1-2As shown, the wafer horizontal cleaning apparatus 100 includes a clamping disk 10, a power unit 20, and a back spray assembly 30. The clamping disk 10 serves as a structure for fixing the wafer 200, used for horizontally clamping the wafer 200. It has a substrate 101 and clamping members 102, which can fix the wafer 200 onto the clamping disk 10. The wafer 200 can be picked up and placed down by the clamping and opening actions of the clamping members 102. The power unit 20 is connected to the clamping disk 10, thereby driving the clamping disk 10 to rotate, and thus driving the wafer 200 to rotate. The power unit 20 can also be configured differently for different process conditions. The back spray assembly 30 can spray cleaning fluid onto the back of the wafer 200. Combined with the rotation of the wafer 200, the cleaning fluid can be centrifugally sprayed onto the surface of the wafer 200.

[0048] Specifically, such as Figure 1 and Figure 2 As shown, the clamping disk 10 can clamp the wafer 200 to keep it in a horizontal position. A cleaning hole 103 is provided in the central area of ​​the clamping disk 10, which facilitates the back spray assembly 30 to spray cleaning fluid onto the back side of the wafer 200. It should be noted that since the wafer horizontal cleaning apparatus 100 of this embodiment is basically placed on a horizontal plane during use, the description is based on the horizontal plane. Therefore, the vertical direction of the wafer horizontal cleaning apparatus 100 of this embodiment is fixed. Thus, when the wafer 200 is placed horizontally, its upward-facing side is defined as the front side, and its downward-facing side is defined as the back side. Furthermore, the central area can be understood as the center position of the wafer 200 and the clamping disk 10.

[0049] like Figure 1 and Figure 2 As shown, the power assembly 20 is located below the clamping disk 10, and the end of the output shaft 201 of the power assembly 20 passes through the cleaning hole 103. Therefore, it can be understood that the output shaft 201 of the power assembly 20 is arranged vertically, and the output end of the output shaft 201 faces upward to connect with the clamping disk 10, thereby driving the clamping disk 10 to rotate. The output shaft 201 is a hollow tube and communicates with the cleaning hole 103, thus forming a channel between the interior of the output shaft 201 and the cleaning hole 103, allowing cleaning waste liquid from cleaning the back side of the wafer 200 to be discharged through the cleaning hole 103.

[0050] like Figure 2As shown, the back spray assembly 30 is disposed inside the output shaft 201, and the back spray assembly 30 sprays cleaning fluid toward the central area of ​​the back side of the wafer 200. This achieves cleaning of the back side of the wafer 200. At the same time, there is a first gap 40 between the outer peripheral surface of the back spray assembly 30 and the inner wall surface of the output shaft 201. The first gap 40 communicates with the cleaning hole 103 to discharge cleaning waste fluid through the first gap 40.

[0051] In other words, in conjunction with the instruction manual appendix Figure 4 It can be understood that the output shaft 201 of the power assembly 20 is hollow, and the back spray assembly 30 is disposed in the hollow part of the output shaft 201. This allows cleaning fluid to be sprayed onto the back side of the wafer 200 through the cleaning hole 103. Simultaneously, a first gap 40 exists between the back spray assembly 30 and the inner wall of the output shaft 201, meaning there is a certain space between them. This allows cleaning waste fluid from cleaning the wafer 200 to flow into the first gap 40 through the cleaning hole 103, further facilitating the discharge of waste fluid.

[0052] Compared to the tight connection between the back spray assembly 30 and the output shaft 201, the first gap 40 in this embodiment of the invention allows the waste liquid to flow quickly to the lower part, thereby moving it away from the lower surface of the wafer 200 and avoiding the problem of the back side of the wafer 200 not drying due to the siphon effect. This effectively prevents the accumulation of waste liquid and also prevents the waste liquid from contacting the power assembly 20 or other structural components through the gap, thus avoiding damage to these components.

[0053] In some embodiments of the present invention, the output shaft 201 is made of a corrosion-resistant material. Therefore, the waste liquid comes into contact with the inner wall of the output shaft 201, preventing corrosion damage and extending its service life. This also ensures the operational stability of the wafer horizontal cleaning device 100. The corrosion-resistant material can be a corrosion-resistant resin material.

[0054] According to an embodiment of this application, a wafer horizontal cleaning apparatus 100 is provided, in which a back spray assembly 30 is disposed inside the output shaft 201 of a power assembly 20, and a first gap 40 is formed between the inner wall of the output shaft 201 and the back spray assembly 30. Therefore, after cleaning fluid is sprayed onto the back side of the wafer 200 for cleaning, the cleaning waste fluid can be easily discharged through the first gap 40 in a timely manner, effectively preventing waste fluid from flowing into the gaps of other structures and causing corrosion of other structural components. It also prevents waste fluid accumulation from causing liquid droplets to condense on the back side of the wafer 200, affecting the process effect. The end of the output shaft 201 is connected to a cleaning hole 103, allowing the cleaning fluid to be discharged in a timely manner through the first gap 40. This also prevents highly permeable chemical solutions, such as ozone water, from seeping into the gaps of the power assembly 20 of the wafer 200, causing chemical corrosion of the power assembly 20. Furthermore, the output shaft 201 of the power assembly 20 is made of a corrosion-resistant material, which can improve its service life.

[0055] In some embodiments of the present invention, such as Figure 2 and Figure 3 As shown, the wafer horizontal cleaning apparatus 100 also includes a drain assembly 50, the top of which is connected to the bottom of the power assembly 20. Therefore, it can be understood that the drain assembly 50 is located below the power assembly 20. The drain assembly 50 has a drain channel 501, which communicates with the first gap 40 to guide waste liquid from the first gap 40 to the drain channel 501 and discharge it.

[0056] Therefore, in terms of the overall structural layout, the arrangement from top to bottom is as follows: clamping plate 10, power assembly 20 and drain assembly 50. Thus, it can be understood that the waste liquid can be discharged downward through the first gap 40 and enter the drain assembly 50, and finally discharged from the wafer horizontal cleaning device 100 in a timely manner to avoid the problem of waste liquid accumulation and corrosion of other structural components.

[0057] like Figure 3 and Figure 7 As shown, the back spray assembly 30 includes a spray body 303. The spray body 303 serves as the main structure of the back spray assembly 30 and is located inside the output shaft 201. The overall structure of the spray body 303 is a long cylinder, which allows it to be easily installed and removed from the inside of the output shaft 201.

[0058] Among them, such as Figure 3 and Figure 7 As shown, the first end 301 of the spray body 303 is provided with a nozzle 304 to spray cleaning fluid onto the back side of the wafer 200. The second end 302 of the spray body 303 has an inlet channel 305 inside, in which an inlet pipe for conveying cleaning fluid is installed. It should be noted that the spray body 303 is a long cylindrical structure placed vertically; therefore, the upward-facing end of the spray body 303 is defined as the first end 301, and the downward-facing end is defined as the second end 302. Thus, the first end 301, i.e., the upper end, of the spray body 303 is provided with a nozzle 304, which can spray cleaning fluid onto the back side of the wafer 200. The second end 302, i.e., the lower end, of the spray body 303 is the inlet channel 305, which facilitates the delivery of cleaning fluid inside the spray body 303.

[0059] Furthermore, such as Figure 3As shown, the spray body 303 has an internal inlet pipe 306. Both ends of the inlet pipe 306 are connected to the nozzle 304 and the inlet channel 305, respectively. Specifically, both ends of the inlet pipe 306 are connected to the inlet pipes within the nozzle 304 and the inlet channel 305. This allows the cleaning fluid introduced into the spray body 303 through the inlet channel 305 to be transported to the nozzle 304 via the inlet pipe 306, achieving the cleaning function. Furthermore, the radial dimension of the inlet channel 305 is larger than the radial dimension of the inlet pipe 306, allowing for the installation of multiple inlet pipes within the inlet channel 305 to transport different types of chemical liquids.

[0060] In some embodiments of the present invention, such as Figure 7 As shown, the outer peripheral surface of the ejector 303 is provided with an elongated groove 309 along the length direction of the ejector 303. Therefore, when the ejector 303 is placed inside the output shaft 201, the elongated groove 309 increases the width of the first gap 40 formed with the inner wall of the output shaft 201, thus allowing more waste liquid to flow and facilitating faster downward discharge of the waste liquid to the drainage assembly 50. In other words, by increasing the width of the first gap 40 for draining waste liquid, it is prevented that waste liquid accumulates below the wafer 200, thus preventing the back side of the wafer 200 from being difficult to dry.

[0061] In some embodiments of the present invention, the spray body 303 has multiple infusion pipes 306 inside, and the first end 301 of the spray body 303 is provided with multiple nozzles 304, with each of the multiple infusion pipes 306 connected to one of the multiple nozzles 304. This increases the flow rate of the sprayed cleaning fluid, facilitating faster cleaning of the back side of the wafer 200.

[0062] like Figure 2 As shown, the length of the ejector 303 is greater than the length of the output shaft 201, and the second outer diameter of the second end 302 of the ejector 303 is smaller than the first outer diameter of the first end 301. The second end 302 of the ejector 303 extends into the drain channel 501. That is, the second end 302 of the ejector 303 protrudes from the bottom of the power assembly 20 and extends into the drain assembly 50 below the power assembly 20. It can also be understood that since the length of the ejector 303 is greater than the length of the output shaft 201, it can be ensured that the waste liquid is completely discharged along the first gap 40 into the drain assembly 50 within the length of the motor, without leaking into the interior of the power assembly 20.

[0063] In some embodiments of the present invention, such as Figure 5 and Figure 6 As shown. The drainage assembly 50 includes a partition wall 502, which is disposed in the drainage channel 501. The inner wall of the partition wall 502 and the outer wall of the second end 302 form a first drainage pipe 503 that communicates with the first gap 40. The outer wall of the partition wall 502 and the inner wall of the drainage assembly 50 form a second drainage pipe 504.

[0064] Specifically, the partition wall 502 divides the drainage channel 501 into two pipelines: a first drainage pipeline 503 and a second drainage pipeline 504. The first drainage pipeline 503 connects to the first gap 40, allowing waste liquid to be discharged through it. The second drainage pipeline 504 serves as a backup emergency pipeline. When the discharge rate of waste liquid from the first drainage pipeline 503 is low, waste liquid may accumulate at the first drainage pipeline 503. If a large amount of waste liquid accumulates, it can be discharged through the second drainage pipeline 504.

[0065] In some embodiments of the present invention, such as Figure 5 As shown, there is an inclined surface 307 between the first outer diameter and the second outer diameter. As mentioned above, the first outer diameter of the injector 303 is larger than the second outer diameter. Furthermore, the inclined surface 307 is formed at the transition between the two, which, together with the guide 202 at the lower end of the output shaft 201, can better guide the waste liquid from the first gap 40 to the first drain pipe 503.

[0066] The guide member 202 is equipped with an inclined guide part 2021, which is inclined toward the second end 302. This allows the waste liquid to be guided to the first drain pipe 503 when it flows to the inclined guide member 202.

[0067] like Figure 5 As shown, the inclined guide 2021 is positioned to match the second drain pipe 504, so that waste liquid that is not discharged in time from the first drain pipe 503 can enter the second drain pipe 504 through the gap between the inclined guide 2021 and the partition wall 502.

[0068] Specifically, if the cleaning waste liquid in the first drain pipe 503 is not discharged in time, the waste liquid will accumulate and overflow into the second drain pipe 504 through the guidance of the inclined guide 2021 and the partition wall 502, thereby preventing the accumulation of waste liquid.

[0069] In some embodiments of the present invention, such as Figure 5 As shown, the guide 202 is also equipped with a horizontal guide 2022. The second drain pipe 504 corresponds to the position of the inclined guide 2021, and the pipe wall of the drain assembly 50 corresponds to the position of the horizontal guide 2022. Therefore, after the waste liquid accumulates in the first drain pipe 503, the waste liquid will overflow upwards. The inclined guide 202 can guide the waste liquid to the second drain pipe 504, preventing the waste liquid from overflowing to other locations and causing corrosion and damage to other structures.

[0070] In some embodiments of the present invention, such as Figure 6As shown, there is a stepped surface 308 between the first outer diameter and the second outer diameter. As mentioned above, the first outer diameter of the injector 303 is larger than the second outer diameter. Furthermore, the transition between the two forms a stepped surface 308, which, together with the guide 202 at the lower end of the output shaft 201, can better guide the waste liquid from the first gap 40 to the first drain pipe 503 / or the second drain pipe 504.

[0071] The guide member 202 is equipped with a longitudinal guide section 2023, which extends into the second drain pipe 504. This allows the waste liquid to be guided to the first drain pipe 503 for discharge when it flows to the longitudinal guide section 2023, or to the second drain pipe 504 for discharge, or to be guided to both the first drain pipe 503 and the second drain pipe 504 for discharge at the same time, thereby improving the waste liquid discharge efficiency.

[0072] In some embodiments of the present invention, such as Figure 6 As shown, the guide 202 is also equipped with a horizontal guide 2022. The pipe wall of the drainage assembly 50 corresponds to the position of the horizontal guide 2022. Therefore, after the waste liquid accumulates in the first drainage pipe 503, the waste liquid will overflow upwards. By tilting the guide 202, the waste liquid can be guided to the second drainage pipe 504, preventing the waste liquid from overflowing to other locations and causing corrosion and damage to other structures.

[0073] In some embodiments of the present invention, such as Figure 6 As shown, the wafer horizontal cleaning device 100 can also be provided with a drain port at the lower part of the first drain pipe 503 and connected to a VAC vacuum pump to improve the discharge efficiency of waste liquid.

[0074] In some embodiments of the present invention, such as Figure 3 and Figure 4 As shown, the wafer horizontal cleaning apparatus 100 also includes an adapter 60. The adapter 60 is sleeved on the outer peripheral surface of the output shaft 201, with its top abutting against the back of the clamping disk 10 and its bottom connected to the top of the power assembly 20. Therefore, it can be understood that the adapter 60 is sleeved on the outer peripheral surface of the output shaft 201 and located between the clamping disk 10 and the power assembly 20. The inner wall of the adapter 60 is tightly connected to the outer wall of the output shaft 201, thereby preventing waste liquid from seeping through the gap 40 into the adapter 60 when passing through the first gap 40, thus preventing corrosion and damage to the adapter 60.

[0075] like Figure 3 and Figure 4 As shown, the outer peripheral surface of the adapter 60 is provided with multiple air-sealing grooves 601, which are arranged sequentially along the axial direction of the adapter 60 and are parallel to each other. Therefore, it can be used to... Figure 4 and Figure 5 It is understood that multiple grooves are formed on the outer peripheral surface of the adapter 60, thereby creating a labyrinth structure. When the output shaft 201 rotates, it drives the adapter 60 to rotate synchronously, thus preventing external dust from entering. The adapter 60 can be made of metal to ensure its strength and service life.

[0076] In some embodiments of the present invention, such as Figure 4 and Figure 8 As shown, the wafer horizontal cleaning apparatus 100 also includes a gas seal 70, which is located between the clamping plate 10 and the power assembly 20, and is fitted over the adapter 60. The gas seal 70 and the adapter 60 are in clearance fit, meaning there is a certain gap between the inner wall of the gas seal 70 and the outer wall of the adapter 60. Therefore, the gas seal 70 can deliver gas towards the adapter 60 and the power assembly 20, forming a gas seal structure at the gap between them, effectively preventing particulate matter from entering the gap.

[0077] Furthermore, such as Figure 8 As shown, the air seal 70 includes an air inlet 701, an airflow channel 702, a first vent 703, and a second vent 704.

[0078] Specifically, such as Figure 8 As shown, the air inlet 701 can communicate with an external air source, and the airflow channel 702 is disposed inside the air seal 70 and communicates with the air inlet 701. The first vent 703 extends horizontally and communicates with the airflow channel 702, and the first vent 703 is opposite to the annular groove of the adapter 60. The second vent 704 extends vertically and communicates with the airflow channel 702, and the second vent 704 is opposite to the power assembly 20.

[0079] Therefore, the air inlet 701 can deliver external gas into the interior of the air seal 70, and the airflow channel 702 inside the air seal 70 can deliver the gas to the first vent 703 and the second vent 704. This gas is then delivered to the gap between the air seal 70 and the adapter 60. The first vent 703 is a horizontal vent, so the delivered airflow will form a gas seal at the external air seal groove 601 of the adapter 60. Furthermore, when the power assembly 20 rotates, a better sealing effect is achieved. The air seal also isolates the unit from external airflow, preventing the introduction of external gas and avoiding the negative effects of the siphon effect.

[0080] In some embodiments of the present invention, such as Figure 1 and Figure 2As shown, the wafer horizontal cleaning apparatus 100 also includes an inner protective member 80, which covers the power assembly 20. The inner protective member 80 has a first opening 801 in the middle so that the output shaft 201 and at least part of the adapter 60 can pass through. The inner wall of the first opening 801 has a second annular groove 802.

[0081] Specifically, the top of the inner protective component 80 is an outer cover structure, thus it can cover the output shaft 201 and the adapter 60. Its top has a first opening 801, allowing the output shaft 201 to pass through. This allows the power assembly 20 to drive the clamping disk 10 while simultaneously protecting the power assembly 20 and other structures, preventing external dust and waste liquid from contacting them, thus improving overall service life and process stability. Since the front-side spraying assembly sprays cleaning fluid towards the center of the front side of the wafer 200, and the centrifugal motion generated by the rotation of the wafer 200 causes the cleaning fluid to cover the entire surface of the wafer 200, and due to the centrifugal motion, the cleaning fluid may splash outwards, potentially onto the power assembly 20 and other structures. The inner protective cover thus protects the power assembly 20.

[0082] See Figure 4 An external air source (not shown) is connected to the air inlet 701 to introduce gas into the interior of the gas seal 70. The gas is discharged through the airflow channel 702 from the first vent 703 and the second vent 704 to the gap between the gas seal 70 and the adapter 60, and then discharged through the gap between the inner protective member 80 and the clamping plate 10. This forms a gas seal structure between the rotating member and the fixed member, preventing external waste liquid from entering the interior of the power assembly 20. At the same time, it also prevents particulate matter from the power assembly 20 from flowing into the chamber where the wafer 200 is located and affecting the cleaning effect of the wafer 200.

[0083] In some embodiments of the present invention, such as Figure 1 and Figure 2 As shown, the wafer horizontal cleaning apparatus 100 also includes an outer protective component 90, which covers the outside of the inner protective component. The outer protective component 90 has a receiving cavity 901, in which the clamping disk 10, the power component 20 and the back spray component 30 are all located. The outer protective component 90 can move between a first position and a second position in the vertical direction.

[0084] In other words, the outer protective cover has a larger coverage area than the inner protective cover. As mentioned above, in order to prevent the cleaning fluid from splashing everywhere, the outer protective cover can be used to block the splashed waste liquid or cleaning fluid.

[0085] Furthermore, such as Figure 2As shown, the outer protective assembly 90 includes a movable base plate 902, an outer protective shell 903, and a movable cylinder 904. The movable base plate 902 is located below the power assembly 20. The outer protective shell 903 is disposed on the movable base plate 902, and a receiving cavity 901 is formed within the outer protective shell 903. The power assembly 20, the inner protective member 80, the output shaft 201, and other structures are all located within the receiving cavity 901. A second opening is provided at the top of the outer protective shell 903, and the diameter of the second opening is larger than the diameter of the clamping plate 10. The movable cylinder 904 is disposed between the movable base plate 902 and the outer base to allow the outer protective assembly 90 to move between a first position and a second position.

[0086] When the outer protective component 90 is in the first position, the second opening is on the same horizontal plane as the clamping plate 10. When the outer protective component 90 is in the second position, the plane where the second opening is located is lower than the plane where the clamping plate 10 is located.

[0087] Specifically, when the outer protective shell 903 is in the first position, it can prevent the cleaning fluid sprayed onto the front side of the wafer 200 from splashing out, thus limiting the splash range of the cleaning fluid. After cleaning, to facilitate the rapid spin-drying process of the wafer 200, the position of the outer protective shell 903 can be adjusted to allow more gas to be blown onto the back side of the wafer 200, achieving rapid spin-drying of the wafer 200.

[0088] This invention is not limited thereto; in some embodiments of this invention, such as Figure 1 As shown, the wafer horizontal cleaning device 100 also includes a main body 1, a fan filter group 2, and a cleaning assembly 3.

[0089] Specifically, the main body 1 has a mounting cavity. The main body 1 provides a stable mounting base for the internal structure, thereby protecting the internal structure. The fan filter assembly 2 is disposed outside the main body 1 to allow gas exchange between the mounting cavity and the outside.

[0090] The fan filter unit 2, abbreviated as FFU (Fan Filter Unit), is used to maintain a clean microenvironment within the mounting cavity, preventing the introduction of external contaminants. An air outlet 11 is provided on the main body 1 to allow the air blown out by the fan filter unit 2 to be discharged through the outlet 11. The cleaning assembly 3 is disposed within the mounting cavity and has nozzles to spray cleaning fluid onto the front side of the wafer 200. The cleaning assembly 3 for front cleaning has rotation and lifting capabilities, while the back cleaning assembly 30 is generally a stationary rod due to the limitations imposed by the wafer 200 power assembly 20.

[0091] The above embodiments are only used to illustrate the embodiments of this application, and are not intended to limit the embodiments of this application. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the embodiments of this application. Therefore, all equivalent technical solutions also fall within the scope of the embodiments of this application, and the patent protection scope of the embodiments of this application should be defined by the claims.

Claims

1. A wafer horizontal cleaning apparatus, characterized in that, include: A clamping disk is used to horizontally clamp wafers, and a cleaning hole is provided in the central area of ​​the disk. A power assembly is located below the clamping plate. The end of the output shaft of the power assembly passes through the cleaning hole. The output shaft is a hollow tube and communicates with the cleaning hole. A back spray assembly is disposed inside the output shaft. The back spray assembly sprays cleaning liquid toward the center area of ​​the back side of the wafer. There is a first gap between the outer peripheral surface of the back spray assembly and the inner wall surface of the output shaft. The first gap communicates with the cleaning hole so as to discharge the cleaning waste liquid through the first gap. The output shaft is made of a corrosion-resistant material. It also includes a drainage assembly, the top of which is connected to the bottom of the power assembly. The drainage assembly has a drainage channel that communicates with the first gap to guide the cleaning waste liquid from the first gap to the drainage channel and discharge it. The back spray assembly includes a spray body, a nozzle at a first end for spraying cleaning fluid onto the back of the wafer, and an inlet channel inside the second end of the spray body for installing an inlet pipe for conveying cleaning fluid. The spray body also has an inlet pipe inside, with both ends of the inlet pipe connected to the nozzle and the inlet pipe, respectively. The radial dimension of the inlet channel is larger than the radial dimension of the inlet pipe. The length of the injector is greater than the length of the output shaft, the second outer diameter of the second end of the injector is smaller than the first outer diameter of the first end, and the second end of the injector extends into the drainage channel. The drainage assembly includes a partition wall disposed within the drainage channel. The inner wall of the partition wall and the outer wall of the second end form a first drainage pipe communicating with the first gap. The outer wall of the partition wall and the inner wall of the drainage assembly form a second drainage pipe.

2. The wafer horizontal cleaning apparatus according to claim 1, characterized in that, There is an inclined surface between the first outer diameter and the second outer diameter. The lower end of the output shaft has a guide member. The guide member is equipped with an inclined guide portion. The inclined guide portion is inclined toward the second end to guide the cleaning waste liquid through the first gap to the first drain pipe.

3. The wafer horizontal cleaning apparatus according to claim 2, characterized in that, The inclined guide is positioned to match the second drain pipe, allowing waste liquid that is not discharged in time from the first drain pipe to enter the second drain pipe through the gap between the inclined guide and the partition wall.

4. The wafer horizontal cleaning apparatus according to claim 1, characterized in that, There is a stepped surface between the first outer diameter and the second outer diameter. The lower end of the output shaft has a guide member. The guide member is equipped with a longitudinal guide portion, which extends into the second drain pipe to guide the cleaning waste liquid through the first gap to the first drain pipe and / or the second drain pipe.

5. The wafer horizontal cleaning apparatus according to claim 1, characterized in that, Also includes: An adapter is fitted onto the outer circumferential surface of the output shaft. The top of the adapter abuts against the back of the clamping disc, and the bottom of the adapter is connected to the top of the power assembly. The outer circumferential surface of the adapter is provided with multiple air seal grooves, which are arranged sequentially along the axial direction of the adapter and are parallel to each other.

6. The wafer horizontal cleaning apparatus according to claim 5, characterized in that, Also includes: An air seal is located between the clamping plate and the power assembly, and the air seal is sleeved on the adapter and has a clearance fit with the adapter. The air seal is capable of delivering gas toward the adapter and the power assembly.

7. The wafer horizontal cleaning apparatus according to claim 6, characterized in that, The gas seal includes: The air intake is connected to an external air source; An airflow channel is disposed inside the air seal and communicates with the air inlet; The first vent extends horizontally and communicates with the airflow channel, and the first vent is opposite to the annular groove of the adapter. The second vent extends vertically and is connected to the airflow channel. The second vent is opposite to the power component.

8. The wafer horizontal cleaning apparatus according to claim 1, characterized in that, Also includes: An inner protective component covers the power assembly. The inner protective component has a first opening in the middle to allow the output shaft and at least part of the adapter to pass through. The inner wall of the first opening has a second annular groove.

9. The wafer horizontal cleaning apparatus according to claim 1, characterized in that, Also includes: The main body has an installation cavity inside; A fan filter assembly is disposed outside the main body to allow gas exchange between the mounting cavity and the outside. A cleaning assembly, disposed within the mounting cavity, has nozzles for spraying the cleaning solution onto the front side of the wafer.

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