A design method of a spectrometer based on optical path decoupling and a spectrometer

Abstract

The present invention discloses a spectrometer design method based on optical path decoupling, including: spectrometer construction; optical system construction; electronic system construction; coupling and adjustment; also discloses a spectrometer, including an optical system, and a frame structure arranged on the optical system, on which the electronic system is detachably mounted, and the electronic system is coupled with the optical system; a gasket is arranged between the frame structure and the electronic system, the gasket adjusts the thickness according to the design, fixes the connection spacing between the optical system and the electronic system, and ensures that the focal plane of the optical system coincides with the photosensitive plane of the electronic system. The present invention decouples the optical system and the electronic system of the spectrometer and designs them independently, assembles them in a photoelectric coupling manner, enables the optical system and the electronic system to be independently developed, debugged and produced, and couples and adjusts the debugged optical system and the electronic system, simplifies the development steps, and improves production efficiency.

Description

Technical Field

[0001] The present invention relates to the field of spectrum detection equipment, and in particular to a design method of a spectrometer based on optical path decoupling and a spectrometer. Background Art

[0002] A spectrometer is an instrument that decomposes complex light into spectral lines. It is composed of optical components and electrical components to convert optical signals into electrical signals for output. Spectrometers are widely used in the detection of air pollution, water pollution, food hygiene, metal industry, etc. Among them, hyperspectrometers are often used for high-precision measurement occasions, such as mineral detection, dyeing detection, food hygiene, etc. Miniaturized short-wave infrared hyperspectrometer is a type of hyperspectrometer. During its production and adjustment, it involves the optical system adjustment of optical lenses, gratings, and optomechanical structures, as well as the coupling adjustment between the optical system and the electronic system.

[0003] At present, the optical system and electronic system of the existing miniaturized short-wave infrared hyperspectrometer are mainly assembled and adjusted by first assembling the focal plane detector. Specifically, the detector and its bracket are first fixed to the optical system structure, and the relative positions of the detector, the detector bracket, and the optical system are adjusted to ensure that the detector photosensitive surface coincides with the focal plane of the optical system. Subsequently, the detector is soldered, the heat sink, the circuit board, and the electronic frame are installed, and finally the miniaturized short-wave infrared hyperspectrometer is assembled and adjusted. The miniaturized short-wave infrared hyperspectrometer using this structure has the following problems:

[0004] 1) Since the detector needs to be assembled and adjusted separately first, the detector is not soldered on the circuit board at this time and cannot output images. Temporary electronic tooling and structural tooling are needed to lead the detector pins to the circuit board to complete the assembly and adjustment. The detector is a key component of the hyperspectrometer. The tooling processing quality, the plug-in and pull-out process, and the movement of the detector position during assembly and adjustment can easily cause damage to the detector.

[0005] 2. The assembly sequence of existing miniaturized short-wave infrared hyperspectrometers is electronic system debugging, optical system and detector assembly, and electronic soldering assembly. Among them, the development process of the optical system and the electronic system is carried out in an interlaced manner, requiring the cooperation of the development personnel of each party, which is inefficient and not suitable for the separate production of the optical system and the electronic system.

[0006] In summary, the structural design of the existing miniaturized short-wave infrared hyperspectrometer is a mixture of optical system and electronic system, which is not conducive to the independent development and production of the optical system and the electronic system. In addition, other test equipment is needed for the assembly and adjustment of the optical system and the electronic system. Summary of the invention

[0007] The purpose of the present invention is to provide a design method of a spectrometer based on optical path decoupling and a spectrometer, so as to solve the technical problems in the prior art that the optical system and the electronic system are not independent and cannot be independently developed and produced, and other test equipment needs to be coordinated during installation and adjustment.

[0008] In order to solve the above technical problems, the present invention specifically provides the following technical solutions:

[0009] A design method of a spectrometer based on optical path decoupling, comprising:

[0010] S1. Spectrometer construction: constructing an optical system, an electronic system, and a spacer for determining the installation distance between the optical system and the electronic system. The optical system and the electronic system are decoupled and coupled by disassembling and assembling;

[0011] S2. Optical system construction: The optical system construction includes a frame structure and an optical component connected and installed with the frame structure, and the constructed optical system enables the optical component to form a focal plane near the frame structure;

[0012] S3. Construction of an electronic system: The electronic system comprises a detector assembly and a circuit assembly, wherein the detector assembly is electrically connected to the circuit assembly, and the detector assembly forms a photosensitive plane on its surface;

[0013] S4. Coupling and adjustment: the optical system and the electronic system are connected and installed via the gasket, and the distance between the focal plane and the photosensitive plane is changed by adjusting the thickness of the gasket so that the focal plane coincides with the photosensitive plane, that is, the optical system and the electronic system are coupled.

[0014] As a preferred solution of the present invention, in step S2 and step S3, the optical system construction and the electronic system construction are performed independently of each other.

[0015] As a preferred solution of the present invention, in step S3, the detector assembly is fixed on the circuit assembly.

[0016] As a preferred solution of the present invention, in step S4, the method for adjusting the thickness of the gasket includes:

[0017] a. Installing a deformable rubber ring between the frame structure and the detector assembly, and adjusting the distance between the frame structure and the detector assembly so that the spatial resolution and spectral resolution detected by the electronic system through the detector assembly are optimal;

[0018] b. Measuring the distance between the frame structure and the detector assembly by a feeler gauge, determining the processing thickness of the gasket, and processing the gasket;

[0019] c. Replace the rubber ring with the processed gasket and install it between the frame structure and the detector assembly, test the imaging effect, determine the degree of fine-tuning of the gasket thickness according to the imaging effect, and perform multiple tests and adjustments;

[0020] d. After the gasket has been adjusted and processed for multiple times, the imaging effect of the electronic system reaches the best. At this time, the focal plane of the optical system coincides with the photosensitive plane of the electronic system, and the coupling adjustment of the optical system and the electronic system is completed.

[0021] In order to solve the above technical problems, the present invention further provides the following technical solutions:

[0022] A spectrometer manufactured by the above design method comprises an optical system and a frame structure arranged on the optical system, an electronic system is detachably mounted on the frame structure, and the electronic system is coupled to the optical system;

[0023] A gasket is provided between the frame structure and the electronic system. The thickness of the gasket is adjusted according to the design to fix the connection distance between the optical system and the electronic system, thereby ensuring that the focal plane of the optical system coincides with the photosensitive plane of the electronic system.

[0024] As a preferred solution of the present invention, the electronic system comprises: a detector component and a circuit component;

[0025] The detector assembly is installed in a planar manner against the circuit assembly, and the detector assembly is electrically connected to the circuit assembly;

[0026] The detector assembly is mounted on the frame structure via the gasket.

[0027] As a preferred solution of the present invention, the detector assembly comprises: a mounting plate and a photosensitive detector;

[0028] The photosensitive detector is embedded and fixed on the mounting plate through a hole provided on the mounting plate, and the photosensitive plane of the photosensitive detector coincides with the focal plane of the optical system;

[0029] After the photosensitive detector is fixed to the mounting plate, the photosensitive detector is welded to the circuit assembly;

[0030] The spacer is mounted on the mounting plate, and the mounting plate is detachably connected to the frame structure to decouple or couple the optical system and the electronics system.

[0031] As a preferred solution of the present invention, the circuit assembly includes: a signal processing module, a plurality of peripheral auxiliary modules;

[0032] The signal processing module is electrically connected to the plurality of peripheral auxiliary modules, and the photosensitive detector is electrically connected to the signal processing module;

[0033] The signal processing module receives and processes the light signal detected by the photosensitive detector, and one of the peripheral auxiliary modules transmits the electrical signal processed and formed by the signal processing module to an external display for imaging.

[0034] As a preferred solution of the present invention, the signal processing module and the plurality of peripheral auxiliary modules each include a board frame and a circuit board disposed inside the board frame;

[0035] The photosensitive detector is welded to the circuit board of the signal processing module.

[0036] As a preferred solution of the present invention, multiple peripheral auxiliary modules are installed in sequence by stacking multiple plate frames, and the plate frame of the peripheral auxiliary module close to the signal processing module is installed on the plate frame of the signal processing module to form a stacked structure.

[0037] Compared with the prior art, the present invention has the following beneficial effects:

[0038] The present invention decouples the optical system and the electronic system of the spectrometer and designs them independently, assembles them in a photoelectric coupling manner, enables the optical system and the electronic system to be independently developed, debugged and produced, and couples the debugged and produced optical system and the electronic system to be assembled, thereby simplifying the development steps and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the implementation methods or the description of the prior art. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0040] Figure 1 A schematic flow chart of a design method of a spectrometer based on optical path decoupling provided by an embodiment of the present invention;

[0041] Figure 2 A schematic diagram of the structure of a spectrometer based on optical path decoupling provided by an embodiment of the present invention;

[0042] Figure 3A schematic diagram of the structure of the plate-frame portion of a spectrometer based on optical path decoupling provided in an embodiment of the present invention.

[0043] The numbers in the figure represent the following:

[0044] 1-optical system; 2-frame structure; 3-electronic system; 4-gasket;

[0045] 31-detector assembly; 32-circuit assembly; 311-mounting board; 312-photosensitive detector; 321-signal processing module; 322-peripheral auxiliary module; 323-board frame; 324-circuit board. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] like Figure 1 As shown, the present invention provides a design method of a spectrometer based on optical path decoupling, comprising:

[0048] S1. Spectrometer construction: construct the optical system, the electronic system and the gasket to determine the installation distance between the optical system and the electronic system. The optical system and the electronic system are decoupled and coupled by disassembly and assembly;

[0049] S2. Optical system construction: The optical system construction includes a frame structure and optical components connected and installed with the frame structure. The constructed optical system enables the optical components to form a focal plane near the frame structure.

[0050] S3. Electronic system construction: The electronic system construction includes a detector assembly and a circuit assembly, the detector assembly is electrically connected to the circuit assembly, and the detector assembly forms a photosensitive plane on its surface;

[0051] S4. Coupling and adjustment: The optical system and the electronic system are connected and installed through gaskets, and by adjusting the thickness of the gaskets, the distance between the focal plane and the photosensitive plane is changed so that the focal plane and the photosensitive plane coincide with each other, that is, the optical system and the electronic system are coupled.

[0052] The design method of this embodiment is mainly to divide the spectrometer into two detachable structures, namely the optical system and the electronic system, so as to decouple the optical path part of the optical system from the circuit part of the electrical system, thereby enabling the optical system and the electronic system to be independently manufactured without interfering with each other; and to adjust the thickness of the gasket through processing to adjust the connection and installation spacing of the optical system and the electronic system, so that the focal plane of the optical system coincides with the photosensitive plane of the electronic system, thereby completing the assembly and adjustment of the optical system and the electronic system.

[0053] Compared with the existing design method, the present design method can connect the optical system and the electronic system in a coupled manner, so that the optical system and the electronic system can be manufactured independently, and when the optical system and the electronic system are assembled and adjusted, no additional equipment is required for debugging. The focal plane imaging spectrum of the optical system can be directly received through the photosensitive plane of the electronic system, which makes production more convenient and efficient.

[0054] In step S2 and step S3, the optical system construction and the electronic system construction are performed independently of each other.

[0055] The components that make up the optical system, the components that make up the electronic system, and the gaskets can be produced and assembled on different production lines. After the optical system and the electronic system are assembled, they are uniformly transported to the assembly and adjustment plant for assembly of the optical system and the electronic system.

[0056] Among them, the thickness of the gasket is adjusted and determined in the pre-production stage, and the specifications of the components that make up the optical system and the components that make up the electronic system are also adjusted and determined in the pre-production stage.

[0057] Wherein, in step S3, the detector assembly is fixed on the circuit assembly.

[0058] The detector assembly is fixed on the circuit assembly, so that the circuit assembly can be directly connected to the detector assembly for debugging, without the need to use additional test equipment to connect the detector assembly for testing, and the operation is more convenient.

[0059] Wherein, in step S4, the method for adjusting the thickness of the gasket includes:

[0060] a. Install a deformable rubber ring between the frame structure and the detector assembly, and adjust the distance between the frame structure and the detector assembly so that the spatial resolution and spectral resolution detected by the electronic system through the detector assembly are optimal;

[0061] b. Use a feeler gauge to measure the distance between the frame structure and the detector assembly, determine the processing thickness of the gasket, and process the gasket;

[0062] c. Replace the rubber ring with the processed gasket and install it between the frame structure and the detector assembly, test the imaging effect, determine the degree of fine-tuning of the gasket thickness based on the imaging effect, and perform multiple tests and adjustments;

[0063] d. After the gasket has been adjusted and processed for many times, the imaging effect of the electronic system reaches the best. At this time, the focal plane of the optical system coincides with the photosensitive plane of the electronic system, and the coupling adjustment of the optical system and the electronic system is completed.

[0064] Specifically, the optimal spatial resolution and spectral resolution are achieved as follows:

[0065] The target is imaged through a collimator, the MTF (optical transfer function) of the target image is calculated, and the MTF is maximized by adjusting the distance to achieve the optimal spatial resolution;

[0066] By imaging the laser light source, performing Gaussian fitting on the measured laser spectrum, and adjusting the distance to minimize the FWHM (full width at half maximum) of the fitted Gaussian function, the optimal spectral resolution is achieved.

[0067] like Figure 2 As shown, the above design method is adopted below to provide a spectrometer, including an optical system 1, and a frame structure 2 arranged on the optical system 1, an electronic system 3 is detachably mounted on the frame structure 2, and the electronic system 3 is coupled to the optical system 1;

[0068] A gasket 4 is provided between the frame structure 2 and the electronic system 3 . The thickness of the gasket 4 is adjusted according to the design to fix the connection distance between the optical system 1 and the electronic system 3 , thereby ensuring that the focal plane of the optical system 1 coincides with the photosensitive plane of the electronic system 3 .

[0069] The spectrometer of this embodiment mainly separates the optical system 1 and the electronic system 3, and connects and installs them through the frame structure 2 and the gasket 4, so that the optical system 1 and the electronic system 3 can be decoupled and coupled. Therefore, during production, the optical system 1 and the electronic system 3 can be produced independently, and can be coupled and assembled after the production is completed, making the production and assembly process of the spectrometer more convenient and more efficient.

[0070] Among them, a gasket 4 is arranged between the frame structure 2 and the electronic system 3. During pre-production, the thickness of the gasket 4 is adjusted according to the design so that the distance between the optical system 1 and the electronic system 3 after installation is fixed, so that the focal plane of the optical system 1 always coincides with the photosensitive plane of the electronic system 3.

[0071] The thickness of the gasket 4 of each set of spectrometers needs to be determined according to the assembly spacing between the optical system 1 and the electronic system 3 .

[0072] Compared with the existing spectrometers, the spectrometer of this embodiment adopts a photoelectrically separated optical system 1 and an electronic system 3, wherein the optical system 1 and the electronic system 3 are decoupled by design, can be independently produced and debugged, and can be coupled and adjusted after production is completed, which makes the process from production to adjustment more convenient and improves production efficiency.

[0073] like Figure 2 As shown, the electronics system 3 includes: a detector component 31 and a circuit component 32;

[0074] The detector assembly 31 and the circuit assembly 32 are installed in a planar manner, and the detector assembly 31 and the circuit assembly 32 are electrically connected;

[0075] The detector assembly 31 is mounted on the frame structure 2 via the gasket 4 .

[0076] The detector component 31 is used to receive the spectrum formed by the optical system 1 on its photosensitive plane, and the circuit component 32 is used to process the received spectrum signal into an electrical signal and transmit the electrical signal to an external display connected to the spectrometer through a video transmission line.

[0077] like Figure 2 As shown, the detector assembly 31 includes: a mounting plate 311 and a photosensitive detector 312;

[0078] The photosensitive detector 312 is embedded and fixed on the mounting plate 311 through a hole provided on the mounting plate 311, and the photosensitive plane of the photosensitive detector 312 coincides with the focal plane of the optical system 1;

[0079] After the photosensitive detector 312 is fixed to the mounting plate 311 , the photosensitive detector 312 is welded to the circuit assembly 32 ;

[0080] The gasket 4 is mounted on the mounting plate 311 , and the mounting plate 311 is detachably connected to the frame structure 2 to decouple or couple the optical system 1 and the electronics system 3 .

[0081] The photosensitive plane of the photosensitive detector 312 coincides with the focal plane of the optical system 1 so as to accurately receive the light signal input by the optical system 1 .

[0082] The mounting plate 311 is used to fix the photosensitive detector 312 and the circuit assembly 32, and is also used to connect the mounting frame structure 2, so that the mounting plate 311 and the frame structure 2 cooperate with the gasket 4 to seal the photosensitive detector 312, thereby avoiding external light interference.

[0083] like Figure 2 As shown, the circuit component 32 includes: a signal processing module 321, a plurality of peripheral auxiliary modules 322;

[0084] The signal processing module 321 is electrically connected to the plurality of peripheral auxiliary modules 322 , and the photosensitive detector 312 is electrically connected to the signal processing module 321 ;

[0085] The signal processing module 321 receives and processes the light signal detected by the photosensitive detector 312 , and a peripheral auxiliary module 322 transmits the electrical signal processed and formed by the signal processing module 321 to an external display for imaging.

[0086] The plurality of peripheral auxiliary modules 322 include but are not limited to a power supply module, a signal transmission module, and an isolation module. Among them, the peripheral auxiliary module 322 used for transmitting an electrical signal to an external display is a signal transmission module.

[0087] like Figure 3 As shown, the signal processing module 321 and the plurality of peripheral auxiliary modules 322 each include a board frame 323 and a circuit board 324 disposed inside the board frame 323;

[0088] The photosensitive detector 312 is welded to the circuit board 324 of the signal processing module 321 .

[0089] The photosensitive detector 312 passes through the hole of the mounting plate 311 so that its output end is welded to the circuit board 324 of the signal processing module 321, thereby fixing the photosensitive detector 312 to the mounting plate 311 and the circuit board 324, and thus being positioned by the plate frame 323 and the mounting plate 311 to avoid displacement during installation and adjustment and affecting the accuracy of installation.

[0090] like Figure 2 and Figure 3 As shown, multiple peripheral auxiliary modules 322 are stacked in sequence through multiple board frames 323, and the board frame 323 of the peripheral auxiliary module 322 close to the signal processing module 321 is installed on the board frame 323 of the signal processing module 321 to form a stacked structure.

[0091] Multiple peripheral auxiliary modules 322 and signal processing modules 321 are connected in sequence through the plate frame 323 to form a stacked structure. Therefore, multiple peripheral auxiliary modules 322 and signal processing modules 321 can be installed in a modular manner, that is, multiple peripheral auxiliary modules 322 and signal processing modules 321 can be independently produced in separate factories and then centrally assembled in a stacked manner, thereby further improving production efficiency.

[0092] The above embodiments are only exemplary embodiments of the present application and are not intended to limit the present application. The protection scope of the present application is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present application within the essence and protection scope of the present application, and such modifications or equivalent substitutions shall also be deemed to fall within the protection scope of the present application.

Claims

1. A design method for a spectrometer based on optical path decoupling, characterized in that: include: S1. Spectrometer construction: constructing an optical system, an electronic system, and a spacer for determining the installation distance between the optical system and the electronic system. The optical system and the electronic system are decoupled and coupled by disassembling and assembling; S2. Optical system construction: The optical system construction includes a frame structure and an optical component connected and installed with the frame structure, and the constructed optical system enables the optical component to form a focal plane near the frame structure; S3. Construction of an electronic system: The electronic system comprises a detector assembly and a circuit assembly, wherein the detector assembly is electrically connected to the circuit assembly, and the detector assembly forms a photosensitive plane on its surface; S4, coupling adjustment: the optical system and the electronic system are connected and installed through the gasket, and the distance between the focal plane and the photosensitive plane is changed by adjusting the thickness of the gasket, so that the focal plane and the photosensitive plane coincide with each other, that is, the optical system and the electronic system are coupled; Wherein, in step S2 and step S3, the optical system construction and the electronic system construction are performed independently of each other; In step S4, the method for adjusting the thickness of the gasket includes: a. Installing a deformable rubber ring between the frame structure and the detector assembly, and adjusting the distance between the frame structure and the detector assembly so that the spatial resolution and spectral resolution detected by the electronic system through the detector assembly are optimal; b. Measuring the distance between the frame structure and the detector assembly by a feeler gauge, determining the processing thickness of the gasket, and processing the gasket; c. Replace the rubber ring with the processed gasket and install it between the frame structure and the detector assembly, test the imaging effect, determine the degree of fine-tuning of the gasket thickness according to the imaging effect, and perform multiple tests and adjustments; d. After the gasket has been adjusted and processed for multiple times, the imaging effect of the electronic system reaches the best. At this time, the focal plane of the optical system coincides with the photosensitive plane of the electronic system, and the coupling adjustment of the optical system and the electronic system is completed.

2. The design method of a spectrometer based on optical path decoupling according to claim 1, characterized in that: In step S3, the detector assembly is fixed on the circuit assembly.

3. A spectrometer manufactured using the design method of claim 1 or 2, characterized in that: It comprises an optical system (1), and a frame structure (2) arranged on the optical system (1), an electronic system (3) is detachably mounted on the frame structure (2), and the electronic system (3) is coupled to the optical system (1); A gasket (4) is provided between the frame structure (2) and the electronic system (3); the thickness of the gasket (4) is adjusted according to the design, and the connection distance between the optical system (1) and the electronic system (3) is fixed to ensure that the focal plane of the optical system (1) coincides with the photosensitive plane of the electronic system (3).

4. A spectrometer according to claim 3, characterized in that: The electronic system (3) comprises: a detector component (31) and a circuit component (32); The detector assembly (31) and the circuit assembly (32) are installed in a planar manner, and the detector assembly (31) and the circuit assembly (32) are electrically connected; The detector assembly (31) is mounted on the frame structure (2) via the gasket (4).

5. A spectrometer according to claim 4, characterized in that: The detector assembly (31) comprises: a mounting plate (311) and a photosensitive detector (312); The photosensitive detector (312) is embedded and fixed on the mounting plate (311) through a hole provided on the mounting plate (311), and the photosensitive plane of the photosensitive detector (312) coincides with the focal plane of the optical system (1); After the photosensitive detector (312) is fixed to the mounting plate (311), the photosensitive detector (312) is welded to the circuit component (32); The gasket (4) is mounted on the mounting plate (311), and the mounting plate (311) is detachably connected to the frame structure (2) to decouple or couple the optical system (1) and the electronics system (3).

6. A spectrometer according to claim 5, characterized in that: The circuit component (32) comprises: a signal processing module (321), and a plurality of peripheral auxiliary modules (322); The signal processing module (321) is electrically connected to the plurality of peripheral auxiliary modules (322), and the photosensitive detector (312) is electrically connected to the signal processing module (321); The signal processing module (321) receives and processes the light signal detected by the photosensitive detector (312), and one of the peripheral auxiliary modules (322) transmits the electrical signal processed and formed by the signal processing module (321) to an external display for imaging.

7. A spectrometer according to claim 6, characterized in that: The signal processing module (321) and the plurality of peripheral auxiliary modules (322) each include a board frame (323) and a circuit board (324) disposed inside the board frame (323); The photosensitive detector (312) is welded to the circuit board (324) of the signal processing module (321).

8. A spectrometer according to claim 7, characterized in that: The plurality of peripheral auxiliary modules (322) are installed in a stacked manner in sequence through the plurality of plate frames (323), and the plate frame (323) of the peripheral auxiliary module (322) close to the side of the signal processing module (321) is installed on the plate frame (323) of the signal processing module (321) to form a stacked structure.

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