Heating unit, heating device and muffle for glass substrate production

Abstract

The disclosure provides a heating unit, a heating device and a muffle for glass substrate production. The heating unit is used for being arranged at one side of an overflow brick to heat the overflow brick, and the heating unit comprises a heating cavity, the heating cavity is a long strip shape extending along the length direction of the overflow groove of the overflow brick; two inner support plates are arranged in the heating cavity along the length direction of the heating cavity to divide the heating cavity into a silicon-carbon rod mounting cavity, a silicon-carbon rod wiring cavity and a silicon-carbon rod mounting cavity arranged in sequence along the length direction; two silicon-carbon rods are respectively detachably mounted in the two silicon-carbon rod mounting cavities; and a compensation heater is used for heat compensation of the silicon-carbon rod wiring cavity. The disclosure can meet the heating of the muffle while avoiding the risk brought by the use of an ultra-long silicon-carbon rod, and greatly reduces the production and equipment costs.

Description

Technical Field

[0001] This disclosure relates to the field of glass substrate manufacturing technology, and more particularly to heating units, heating devices, and muffle furnaces including the heating devices for glass substrate manufacturing. Background Technology

[0002] Optoelectronic display glass substrates are generally produced using the overflow downdraw method. First, the glass mixture is fed into a furnace for high-temperature melting. After being stirred and clarified through a platinum channel, it flows into a forming furnace and overflows to form a glass ribbon. The muffle furnace is the key equipment in the overflow downdraw method; overflow bricks placed inside the furnace ensure that the molten glass overflows evenly into a ribbon shape.

[0003] To stabilize the temperature of the overflow brick, muffle furnaces typically contain several long silicon carbide (SiC) rods, including two large ones with a power output exceeding 20,000 watts. Because the silicon carbide material of these rods is brittle and they can reach lengths of 3-5 meters, they are prone to cracking and damage during heating, especially under high-power heating. Damage to these rods leads to significant heat loss within the furnace, necessitating immediate replacement. However, replacing SiC rods at high temperatures is difficult, and the success rate is affected by the rod's length. Furthermore, as glass substrate production lines advance through generations, the length of the SiC rods increases, leading to higher costs. Doubling the length of the SiC rod more than doubles the cost. Currently, most long SiC rods used in China are imported, making them susceptible to damage during transportation, resulting in extremely high operating costs.

[0004] Currently, the solutions to the aforementioned problems with long silicon carbide heating rods in this field are basically focused on how to better replace the silicon carbide rods. For example, CN218905208U discloses a tool for replacing heating rods in a muffle furnace, which is used to replace silicon carbide rods that are up to 5 meters long. However, this does not fundamentally solve the problem. Summary of the Invention

[0005] One of the technical problems this disclosure aims to solve is to fundamentally address the various issues arising from the use of long silicon carbide rods in muffle furnaces.

[0006] To address the aforementioned technical problems, a first aspect of this disclosure provides a heating unit for glass substrate production, configured to be disposed on one side of an overflow brick to heat the overflow brick. The heating unit includes:

[0007] The heating chamber is a long strip extending along the length of the overflow channel of the overflow brick;

[0008] Two inner support plates are spaced apart in the heating cavity along the length of the heating cavity to divide the heating cavity into a silicon carbide rod mounting cavity, a silicon carbide rod wiring cavity and a silicon carbide rod mounting cavity arranged sequentially along its length.

[0009] Two silicon carbide rods, each detachably installed in one of two silicon carbide rod mounting cavities; and

[0010] The compensating heater is used to compensate for the heat in the silicon carbide rod wiring cavity.

[0011] In some embodiments, the heating unit further includes two outer support plates for defining the two ends of the heating cavity, and the silicon carbide rod mounting cavity is a chamber between the corresponding inner support plate and the outer support plate.

[0012] In some embodiments, the two outer support plates are respectively configured to be detachable.

[0013] In some embodiments, the inner support plate is provided with an inner mounting hole for the silicon carbide rod to be inserted and installed, and the outer support plate is provided with an outer mounting hole for the silicon carbide rod to be inserted and installed.

[0014] In some embodiments, both the inner support plate and the outer support plate are thermal insulation boards.

[0015] In some embodiments, the bottom of the heating chamber has an opening located inside the silicon carbide rod wiring chamber, through which the compensation heater is detachably mounted to the heating chamber.

[0016] In some embodiments, the side of the heating chamber near the overflow brick is defined by a heat-conducting plate, and the remaining sides of the heating chamber, except for the side where the heat-conducting plate is located, are defined by a heat-insulating plate.

[0017] In some embodiments, the opening is an elongated opening extending along the length of the heating chamber. The compensation heater includes an elongated mounting bracket adapted to the opening and a first heating rod and a second heating rod perpendicularly inserted on the mounting bracket. Both the first heating rod and the second heating rod are inverted U-shaped, and the first heating rod is spaced apart from the periphery of the second heating rod so that the two are coplanar. The compensation heater is detachably mounted at the opening via the mounting bracket.

[0018] In some embodiments, the lateral length of the first heating rod and the second heating rod is greater than the length of the silicon carbide rod wiring cavity.

[0019] In some embodiments, the distance between the first heating rod and the second heating rod is 10-30 mm.

[0020] In some embodiments, the compensating heater also includes a handle disposed at the bottom of the mounting bracket.

[0021] In some embodiments, the power of the compensation heater is 10000-20000W.

[0022] A second aspect of this disclosure provides a heating device for glass substrate production, used to heat an overflow brick. The heating device includes two heating units as described above, with the two heating units respectively disposed on both sides of the overflow brick.

[0023] In some embodiments, the heating device further includes a connecting plate located on top of the overflow brick, with two heating units connected to each side of the connecting plate.

[0024] A third aspect of this disclosure provides a muffle furnace, including an overflow brick and the aforementioned heating device for glass substrate production.

[0025] This disclosure, by employing the aforementioned technical solution, divides the heating chamber into three sections: a silicon carbide rod connection chamber in the middle, and two silicon carbide rod mounting chambers located on either side of the connection chamber. A shorter silicon carbide rod is installed in each of the two mounting chambers. These two shorter rods are then joined together to form a conventionally used long silicon carbide rod. A compensating heater compensates for the heat loss at the connection point (the connection chamber), resulting in a stable heating process. The shorter silicon carbide rods significantly reduce costs and are less prone to damage during heating. Furthermore, the combination of silicon carbide rods and the compensating heater increases the flexibility of muffle furnace temperature adjustment. Therefore, this disclosure, while satisfying muffle furnace heating requirements, avoids the risks associated with using long silicon carbide rods, significantly reducing production and equipment costs. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of one embodiment of the muffle furnace disclosed in this disclosure, wherein only a portion of the structure is shown on the right side;

[0028] Figure 2 yes Figure 1 Schematic diagram of the heating device in the middle;

[0029] Figure 3 This is a schematic diagram of the structure of the compensation heater disclosed in this embodiment;

[0030] Figure 4 yes Figure 3 The diagram shows the positional relationship between the compensation heater and the silicon carbide rod wiring cavity.

[0031] Explanation of reference numerals in the attached figures:

[0032] 10. Heating unit; 11. Heating chamber; 111. Silicon carbide rod mounting chamber; 112. Silicon carbide rod wiring chamber; 113. Opening; 12. Heat-conducting plate; 13. Inner support plate; 131. Inner mounting hole; 14. Silicon carbide rod; 15. Compensating heater; 151. Mounting bracket; 1511. Metal plate; 1512. Mounting hole; 1513. Mounting shell; 152. First heating rod; 153. Second heating rod; 154. Handle; 16. Outer support plate; 161. Outer mounting hole; 17. Top plate; 18. Bottom plate; 20. Connecting plate; 30. Overflow brick; 31. Overflow groove; 32. Glass strip. Detailed Implementation

[0033] The embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and examples. The detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of this disclosure by way of example, but should not be used to limit the scope of this disclosure. This disclosure can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0034] These embodiments are provided to make the disclosure thorough and complete, and to fully express the scope of the disclosure to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values ​​set forth in these embodiments should be interpreted as exemplary only and not as limiting.

[0035] It should be noted that, in the description of this disclosure, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0036] Furthermore, the terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. "Vertical" is not strictly vertical, but within the permissible margin of error. "Parallel" is not strictly parallel, but within the permissible margin of error. Terms such as "including" or "contains" mean that the element preceding the word encompasses the element listed after the word, and do not exclude the possibility of encompassing other elements as well.

[0037] It should also be noted that, in the description of this disclosure, unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure depending on the specific circumstances. When a particular device is described as being located between a first device and a second device, an intermediary device may or may not be present between the particular device and the first or second device.

[0038] All terms used in this disclosure have the same meaning as understood by one of ordinary skill in the art to which this disclosure pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as idealized or highly formalized, unless expressly defined herein.

[0039] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.

[0040] The first aspect of this disclosure provides a heating unit for glass substrate production, which is disposed on one side of an overflow brick 30 to heat the overflow brick 30. See also Figure 1 and Figure 2 The heating unit 10 includes:

[0041] Heating chamber 11, which is an elongated strip extending along the length of overflow groove 31 of overflow brick 30;

[0042] Two inner support plates 13 are spaced apart in the heating cavity 11 along its length direction to divide the heating cavity 11 into a silicon carbide rod mounting cavity 111, a silicon carbide rod wiring cavity 112 (for wiring the inner end of the silicon carbide rod), and a silicon carbide rod mounting cavity 111 arranged sequentially along its length direction.

[0043] Two silicon carbide rods 14 are detachably installed in two silicon carbide rod mounting cavities 111; and

[0044] Compensation heater 15 is used to compensate for the heat of silicon carbide rod wiring cavity 112.

[0045] It should be noted that the use of the compensation heater 15 to compensate for the heat of the silicon carbide rod wiring cavity 112 should be understood as follows: since the silicon carbide rod wiring cavity 112 is set in the heating cavity 11, the silicon carbide rod wiring cavity 112 is not heated and the temperature is low, which cannot meet the process of the heating cavity 11 requiring high temperature heating throughout. Therefore, the compensation heater 15 is set to compensate for the heat of the silicon carbide rod wiring cavity 112.

[0046] It should be noted that in the heating device of a traditional muffle furnace, a long silicon carbide rod about 3 to 5 meters long and about 60 mm in diameter is placed in the heating chamber 11 (i.e., the silicon carbide rod is a whole rod extending along the entire heating chamber 11) as the main heating device. It is the core device for maintaining the temperature stability of the overflow brick process, and its power is about 25,000 to 30,000 W.

[0047] Compared to traditional heating devices, this disclosure, by employing the aforementioned technical solution, divides the heating chamber 11 into three sections: a silicon carbide rod wiring cavity 112 in the middle, and two silicon carbide rod mounting cavities 111 located on either side of the silicon carbide rod wiring cavity 112. A shorter silicon carbide rod 14 is installed in each of the two silicon carbide rod mounting cavities 111. Two shorter silicon carbide rods 14 are then joined together to form a conventionally used long silicon carbide rod. A compensation heater 15 compensates for the reduced heat at the junction of the silicon carbide rods (i.e., the silicon carbide rod wiring cavity 112), thus forming a stable heating process. The cost of the short silicon carbide rods is significantly reduced, and they are less prone to damage during heating. Furthermore, the combined use of the silicon carbide rods 14 and the compensation heater 15 increases the flexibility of muffle furnace temperature adjustment. Therefore, this disclosure, while satisfying muffle furnace heating requirements, avoids the risks associated with using long silicon carbide rods, significantly reducing production and equipment costs.

[0048] In this disclosure, such as Figure 1 and Figure 2 As shown, the heating unit 10 also includes two outer support plates 16 for defining the two ends of the heating cavity 11, the silicon carbide rod mounting cavity 111 is the cavity between the corresponding inner support plate 13 and the outer support plate 16, and the silicon carbide rod wiring cavity 112 is the cavity between the two inner support plates 13.

[0049] To facilitate the replacement of the silicon carbide rod, in some embodiments, the two outer support plates 16 are respectively configured to be detachable (e.g., connected by bolts). The specific method for replacing the silicon carbide rod and the detachable configuration of the outer support plates 16 can be referenced from conventional heating devices for muffle furnaces; the improvements in this disclosure do not lie in this, and therefore will not be described in detail. Additionally, it is conceivable that the inner support plate 13 can be either fixed or detachable.

[0050] In this disclosure, the silicon carbide rod 14 can be mounted within the silicon carbide rod mounting cavity 111 in any suitable manner. However, to simplify the structure and reduce costs, such as Figure 1 and Figure 2 As shown, an inner mounting hole 131 for the silicon carbide rod 14 to pass through and be installed can be provided on the inner support plate 13, and an outer mounting hole 161 for the silicon carbide rod 14 to pass through and be installed on the outer support plate 16. That is, the two ends of the silicon carbide rod 14 can be supported on the inner mounting hole 131 and the outer mounting hole 161 respectively, thereby realizing the installation of the silicon carbide rod 14 in the silicon carbide rod installation cavity 111. When it is necessary to replace the silicon carbide rod 14, the outer support plate 16 can be removed, the old silicon carbide rod can be pulled out, and then the new silicon carbide rod can be inserted and its inner end (i.e., the end closer to the inner support plate) can be supported on the inner mounting hole 131. Then the outer support plate 16 can be installed, and the outer end of the new silicon carbide rod (i.e., the end closer to the outer support plate) can be supported on the outer mounting hole 161.

[0051] In this disclosure, to ensure effective heat transfer from the heating chamber 11 to the overflow brick 30 and improve heat utilization, the side of the heating chamber 11 closest to the overflow brick 30 is defined by a heat-conducting plate 12, so that heat from the heating chamber 11 can be transferred to the overflow brick 30 through the heat-conducting plate 12. The remaining sides of the heating chamber 11, except for the side where the heat-conducting plate 12 is located, are defined by heat-insulating plates. The inner support plate 13 and the outer support plate 16 are also heat-insulating plates. For example... Figure 2 As shown, the heating unit 10 includes a top plate 17, a bottom plate 18, a heat-conducting plate 12 (i.e., an inner plate), and an outer plate (the outer plate is omitted in the heating unit on the right side of the figure) for defining the heating cavity 11. The top plate 17, the bottom plate 18, and the outer plate are all heat-insulating plates, that is, they are made of heat-insulating materials, such as heat-insulating bricks or refractory materials such as ceramics. The heat-conducting plate 12 can be made of silicon carbide.

[0052] In this disclosure, the compensating heater 15 can be any heater capable of providing heat, and the compensating heater 15 can be installed in any suitable manner.

[0053] In some embodiments, see Figure 1 and Figure 2 The heating chamber 11 has an opening 113 at its bottom, located inside the silicon carbide rod wiring cavity 112 (i.e., near the heat-conducting plate 12). The compensation heater 15 is detachably installed in the heating chamber 11 through the opening 113. By placing the compensation heater 15 inside the silicon carbide rod wiring cavity 112, the heat from the compensation heater 15 is directly conducted to the overflow brick through the heat-conducting plate 12, while ensuring internal heat insulation of the silicon carbide rod wiring cavity 112, so that the wiring unit (e.g., wiring terminal) used for the silicon carbide rod 14 is not damaged.

[0054] In some embodiments, such as Figure 2 and Figure 3As shown, the opening 113 is an elongated opening extending along the length of the heating chamber 11. The compensation heater 15 includes an elongated mounting bracket 151 adapted to the opening 113 and a first heating rod 152 and a second heating rod 153 perpendicularly inserted on the mounting bracket 151. Both the first heating rod 152 and the second heating rod 153 are inverted U-shaped, and the first heating rod 152 is spaced apart from the periphery of the second heating rod 153 so that the two are coplanar. The compensation heater 15 is detachably mounted at the opening 113 through the mounting bracket 151.

[0055] With the above configuration, the compensating heater 15 is flat, which not only facilitates insertion into the heating chamber 11 but also reduces the space occupied by the heating chamber 11. The first heating rod 152 and the second heating rod 153 can be externally connected to a wiring unit (i.e., connected to the wiring unit through their lower ends). The wiring unit does not extend into the heating chamber 11, thus preventing the wiring unit from burning out. The double-layer structure of the first heating rod 152 and the second heating rod 153 maximizes the heating power while saving space, making it highly feasible.

[0056] In some embodiments, the power of the compensating heater 15 is 10,000-20,000 W. The first heating rod 152 and the second heating rod 153 are silicon carbide rods. The diameter of the first heating rod 152 and the second heating rod 153 is approximately 20-30 mm. The distance between the first heating rod 152 and the second heating rod 153 is 10-30 mm, which provides both a safe distance and concentrated heat.

[0057] In some embodiments, such as Figure 3 As shown, the mounting bracket 151 includes a long strip metal plate 1511 and a long strip mounting shell 1513 disposed on the metal plate 1511. Mounting holes 1512 are respectively provided at both ends of the metal plate 1511. The mounting bracket 151 is fixed to the bottom plate 18 of the heating chamber 11 via the two mounting holes 1512. The mounting shell 1513 may be hollow and may be made of ceramic or insulating brick.

[0058] In some embodiments, such as Figure 3 As shown, the compensation heater 15 also includes a handle 154, which is disposed at the bottom of the mounting bracket 151 for installing or removing the compensation heater.

[0059] In some embodiments, such as Figure 4 As shown, the lateral length of the first heating rod 152 and the second heating rod 153 (i.e., the extension length along the length direction of the heating cavity 11) is greater than the length of the silicon carbide rod wiring cavity 112. In other words, the positions of the first heating rod 152 and the second heating rod 153 coincide with the position of the silicon carbide rod 14.

[0060] In this disclosure, the first heating rod 152 and the second heating rod 153 can be fixed in position relative to the mounting bracket 151, or they can be adjusted up and down relative to the mounting bracket 151. In order to achieve the up and down adjustment of the first heating rod 152 and the second heating rod 153, the first heating rod 152 and the second heating rod 153 can be fixed to the mounting bracket 151 with putty that has solidified at high temperature, or other fasteners can be used.

[0061] The second aspect of this disclosure provides a heating device for glass substrate production, used to heat an overflow brick 30. The heating device includes two heating units 10, which are respectively disposed on both sides of the overflow brick 30.

[0062] See Figure 1 and Figure 2 The heating device disclosed herein may further include a connecting plate 20, which is located on top of the overflow brick 30, and its two sides are respectively connected to two heating units 10. The connecting plate 20 is an insulation plate.

[0063] A third aspect of this disclosure provides a muffle furnace, including an overflow brick 30 and the aforementioned heating device.

[0064] like Figure 1 As shown, the top of the overflow brick 30 is the overflow groove 31, and the thickness of the overflow brick 30 decreases from top to bottom. During the heating process, heat is indirectly conducted to the overflow brick 30 through the heat-conducting plate 12. The molten glass flows from the platinum channel (not shown in the figure) into the overflow groove 31 and flows out from both sides of the overflow brick 30, converging into a glass ribbon 32.

[0065] The muffle furnace disclosed herein significantly shortens the length of the silicon carbide rod, greatly improving the success rate during replacement. The shorter silicon carbide rod also has a longer service life and is less prone to damage. When one silicon carbide rod is replaced due to reaching its service life, the other silicon carbide rod continues to operate, thus only temporarily losing heat from one rod and allowing for faster replacement. Compared to existing technologies that require replacing entire silicon carbide rods (3-5 meters long), causing overall heat loss in the heating chamber, this significantly reduces the impact on the overflow brick 30's process condition. Furthermore, the solution disclosed herein is lower in risk and higher in efficiency, with obvious benefits, especially in 8.5-generation glass substrate production lines, where the muffle furnace provided by this disclosure fundamentally solves the equipment challenges.

[0066] The embodiments of this disclosure have now been described in detail. To avoid obscuring the concept of this disclosure, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein based on the above description.

[0067] While specific embodiments of this disclosure have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of this disclosure. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of this disclosure. In particular, as long as there is no structural conflict, the technical features mentioned in the various embodiments can be combined in any manner.

Claims

1. A heating unit for glass substrate production, for being disposed on one side of an overflow brick (30) to heat the overflow brick (30), characterized in that, The heating unit (10) includes: Heating chamber (11), the heating chamber (11) is a long strip extending along the length direction of the overflow groove (31) of the overflow brick (30); Two inner support plates (13) are spaced apart in the heating cavity (11) along the length direction of the heating cavity (11) to divide the heating cavity (11) into a silicon carbide rod mounting cavity (111), a silicon carbide rod wiring cavity (112), and a silicon carbide rod mounting cavity (111) arranged sequentially along its length direction. Two silicon carbide rods (14), each of which is detachably mounted in one of the two silicon carbide rod mounting cavities (111); and A compensating heater (15) is used to provide heat compensation to the silicon carbide rod wiring cavity (112) to compensate for the temperature drop caused by the installation of the silicon carbide rod wiring cavity (112).

2. The heating unit for glass substrate production according to claim 1, characterized in that, The heating unit (10) also includes two outer support plates (16) for defining the two ends of the heating cavity (11), and the silicon carbide rod mounting cavity (111) is the cavity between the corresponding inner support plate (13) and the outer support plate (16).

3. The heating unit for glass substrate production according to claim 2, characterized in that, The two outer support plates (16) are respectively designed to be detachable.

4. The heating unit for glass substrate production according to claim 2, characterized in that, The inner support plate (13) is provided with an inner mounting hole (131) for the silicon carbide rod (14) to pass through and be installed, and the outer support plate (16) is provided with an outer mounting hole (161) for the silicon carbide rod (14) to pass through and be installed; and / or Both the inner support plate (13) and the outer support plate (16) are thermal insulation boards.

5. The heating unit for glass substrate production according to any one of claims 1-4, characterized in that, The heating chamber (11) has an opening (113) at its bottom, the opening (113) being located inside the silicon carbide rod wiring cavity (112), and the compensation heater (15) is detachably mounted to the heating chamber (11) through the opening (113); and / or The side of the heating chamber (11) near the overflow brick (30) is defined by a heat-conducting plate (12), and the other sides of the heating chamber (11) except for the side where the heat-conducting plate (12) is located are defined by a heat-insulating plate.

6. The heating unit for glass substrate production according to claim 5, characterized in that, The opening (113) is an elongated opening extending along the length of the heating chamber (11). The compensation heater (15) includes an elongated mounting bracket (151) adapted to the opening (113) and a first heating rod (152) and a second heating rod (153) perpendicularly inserted on the mounting bracket (151). The first heating rod (152) and the second heating rod (153) are both inverted U-shaped, and the first heating rod (152) is spaced apart from the second heating rod (153) so that they are coplanar. The compensation heater (15) is detachably installed at the opening (113) through the mounting bracket (151).

7. The heating unit for glass substrate production according to claim 6, characterized in that, The compensation heater (15) also has at least one of the following configuration methods: Method 1: The lateral length of the first heating rod (152) and the second heating rod (153) is greater than the length of the silicon carbide rod wiring cavity (112); Method 2: The distance between the first heating rod (152) and the second heating rod (153) is 10-30mm; Method 3: The compensation heater (15) further includes a handle (154), which is disposed at the bottom of the mounting bracket (151); as well as Method 4: The power of the compensation heater (15) is 10000-20000w.

8. A heating device for glass substrate production, used for heating overflow bricks (30), characterized in that, The heating device includes two heating units for glass substrate production as described in any one of claims 1-7, the two heating units (10) being respectively disposed on both sides of the overflow brick (30).

9. The heating apparatus for glass substrate production according to claim 8, characterized in that, The heating device also includes a connecting plate (20), which is located on top of the overflow brick (30), and the two sides of the connecting plate (20) are respectively connected to the two heating units (10).

10. A muffle furnace, characterized in that, Includes overflow brick (30) and heating device for glass substrate production as described in claim 8 or 9.

Images