Mounting structure of remote plasma source and semiconductor processing equipment

CN117995636BActive Publication Date: 2026-05-12BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Filing Date
2022-10-27
Publication Date
2026-05-12

AI Technical Summary

Technical Problem

Existing remote plasma sources are prone to tilting during the lifting and lowering process, resulting in inaccurate connection between the output end and the gas path and low operating efficiency.

Method used

The transmission structure employs a linkage between the active and driven components, enabling the synchronous lifting and lowering of the first and second adjusting components through the linkage component, thus avoiding tilting and improving adjustment efficiency.

Benefits of technology

It enables smooth raising and lowering of the remote plasma source, improving the connection accuracy and adjustment efficiency between the output end and the gas path.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN117995636B_ABST
    Figure CN117995636B_ABST
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Abstract

The application provides a mounting structure of a remote plasma source and a semiconductor process equipment, and the mounting structure comprises a mounting support and a lifting mechanism fixedly connected with the mounting support, wherein the first adjusting part and the second adjusting part are located below the remote plasma source and are fixedly connected with the remote plasma source; the first transmission structure is connected with the first adjusting part, and the first transmission structure is connected with the second transmission structure through the linkage assembly; the second transmission structure is connected with the second adjusting part; the first transmission structure is used for driving the first adjusting part to lift under the driving action of the power source; and under the linkage action of the linkage assembly, the second transmission structure drives the second adjusting part to lift synchronously with the first adjusting part. The mounting structure of the remote plasma source and the semiconductor process equipment provided by the application can smoothly drive the remote plasma source to lift and avoid the inclination of the remote plasma source in the movement process.
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