Film laminating device

Abstract

This application provides a film-applying apparatus, comprising: a worktable with a working area formed thereon, and a support platform for carrying wafers and capable of being raised and lowered within the working area; a winding and unwinding unit, a first winding and rewinding unit, a second winding and rewinding unit, and a pressing unit located between the winding and unwinding unit and the first winding and rewinding unit and above the working area, all disposed on the worktable; the winding and unwinding unit, the first winding and rewinding unit, and the pressing unit are all capable of horizontally moving on the worktable to enter or leave the working area; a film-peeling module and a film-rewinding module, both movable to move closer to or away from the worktable surface, are respectively disposed on opposite sides of the winding and unwinding unit and the first winding and rewinding unit. The film-applying apparatus provided by this application can reduce the waste of adhesive tape while shortening the preparation time between two film-applying cycles, thereby improving operational efficiency, and can also adapt to wafers of different thicknesses, exhibiting strong adaptability.

Description

Technical Field

[0001] This application belongs to the field of semiconductor equipment technology, and more specifically, relates to a film application device. Background Technology

[0002] In the wafer manufacturing process, a protective film needs to be applied to the front side of the product before grinding. In related technologies, film application equipment generally includes a film unwinding device, a film rewinding device, and a film cutting device. Typically, only one of the film unwinding and rewinding devices is movable. This results in some wasted film rolls when the film rewinding device resets after film application. Furthermore, for wafers with different thicknesses, thickness errors can easily occur during film application, leading to poor application results and affecting the yield rate. Summary of the Invention

[0003] The purpose of this application is to provide a film application device to solve the technical problems of film roll waste and difficulty in adapting to wafers of different thicknesses and sizes in the prior art.

[0004] To achieve the above objectives, the technical solution adopted in this application embodiment is to provide a film application device, which includes:

[0005] A worktable is provided, on which a working area for applying film to the wafer is formed, and a support platform for supporting the wafer and capable of being raised and lowered is provided in the working area.

[0006] The workbench is provided with a winding and unwinding unit, a first winding and rewinding unit, a second winding and rewinding unit, and a pressing unit located between the winding and unwinding unit and the first winding and rewinding unit and above the working area;

[0007] The unwinding unit, the first winding unit, and the pressing unit are all capable of moving horizontally on the workbench to enter or leave the work area; on opposite sides of the unwinding unit and the first winding unit, there are respectively a film peeling module and a film taking module that are both capable of moving to approach or move away from the workbench surface.

[0008] The unwinding unit is used to release the adhesive film, the peeling end of the peeling module is used to peel off the adhesive layer and protective film on the adhesive film, the second winding unit is used to wind up the protective film, the pressing unit is used to press the adhesive layer onto the wafer to be tested, and the first winding unit is used to wind up the excess adhesive layer after pressing.

[0009] Optionally, the film peeling module includes a film peeling plate and several rollers disposed on the side of the film peeling plate away from the working area and respectively located on the upper and lower sides of the film peeling plate; one of the rollers is connected to a tension monitoring device.

[0010] Optionally, the unwinding unit further includes an unwinding bracket that is horizontally slidably disposed on the worktable and an unwinding roller module that is fixedly disposed on the unwinding bracket, and the film peeling module is vertically slidably disposed on the unwinding bracket.

[0011] Optionally, the first take-up unit further includes a take-up bracket that is horizontally slidably disposed on the worktable and a rotating frame that is rotatably disposed on the take-up bracket, wherein a take-up roller module and the take-up module that are eccentrically disposed with respect to the rotating shaft are disposed on the rotating frame.

[0012] Optionally, a lifting mechanism is connected between the take-up bracket and the rotating frame and located on one side of the rotating shaft. The lifting mechanism is used to push the rotating frame to rotate so that the take-up module moves closer to or away from the worktable.

[0013] Optionally, a braking mechanism is provided in either or both of the unwinding unit and the first winding unit. The braking mechanism includes a brake roller and a brake plate capable of pressing against the brake roller, and the adhesive film and / or the adhesive layer passes between the brake roller and the brake plate.

[0014] Optionally, in the direction of the adhesive layer winding, the braking mechanism is disposed before the film peeling module, and / or the braking mechanism is disposed after the film taking-up module.

[0015] Optionally, in the direction of the adhesive layer winding, the braking mechanism is disposed before the film peeling module, and / or the braking mechanism is disposed after the film taking-up module.

[0016] Optionally, linear slides are provided on both sides of the worktable along its length, and the first winding unit and the pressing unit are both located on the linear slides.

[0017] Optionally, an antistatic device may also be provided on the unwinding unit and / or the first winding unit.

[0018] The film application device provided in this application embodiment has at least the following beneficial effects:

[0019] Both the unwinding unit and the first take-up unit can move horizontally on the worktable to enter or leave the work area. Thus, after the laminating unit and the external dicing unit have completed the wafer lamination and dicing, the adhesive tape required for the next lamination cycle can be pulled out simultaneously during the resetting process of the first take-up unit. This reduces the waste of adhesive tape and shortens the preparation time between two lamination cycles, thereby improving work efficiency. At the same time, the carrier platform can adjust its height relative to the worktable according to the actual thickness of the wafer, so that the surface of the wafer can be flush with the work area regardless of whether the wafer thickness changes. This allows the laminating mechanism and the first take-up unit to achieve good lamination results on the wafer without changing the work height. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a perspective view of the film-applying device in some embodiments of this application;

[0022] Figure 2 This is a perspective view of the film-applying device in some embodiments of this application;

[0023] Figure 3 This is a front view of a portion of the film-applying device structure in some embodiments of this application;

[0024] Figure 4 This is a schematic diagram of the adhesive film installation stage of the film-applying device in some embodiments of this application;

[0025] Figure 5 This is a schematic diagram of the film-applying device bonding stage in some embodiments of this application;

[0026] Figure 6 This is a schematic diagram of the film cutting stage of the film-applying device in some embodiments of this application;

[0027] Figure 7 This is a schematic diagram of the residual film recovery stage of the film application device in some embodiments of this application;

[0028] Figure 8 This is a schematic diagram of the film-pulling stage of the film-applying device in some embodiments of this application. Detailed Implementation

[0029] To make the technical problems, technical solutions and beneficial effects to be solved by this application clearer, the following describes this application in further detail with reference to the accompanying drawings and embodiments.

[0030] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0031] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly on the other component or indirectly on that other component.

[0032] When a component is said to be "connected to" another component, it can be directly connected to the other component or indirectly connected to that other component.

[0033] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature.

[0035] In the description of this application, "multiple" means two or more, unless otherwise expressly and specifically defined.

[0036] Please also refer to Figures 1 to 8 The film-applying device provided in the embodiments of this application will now be described.

[0037] It should be noted that the film-applying device described in this application is used to apply film layers to wafers. During the wafer film-applying process, the protective film M1 and the adhesive layer M2 on the adhesive film M are first separated. The protective film M1 of the adhesive film M is wound up and recycled. The adhesive layer M2 is cut after being applied to the wafer. The remaining waste adhesive layer M2 after cutting is also recycled.

[0038] refer to Figures 1 to 3 The film application device described in this application includes a worktable, a support platform 810 disposed in the worktable, and a winding unit 100, a first winding unit 200, a second winding unit 300 and a pressing unit 400 disposed on the worktable.

[0039] The worktable has a working area A for applying film to wafers. An opening is provided on the worktable within working area A for a support stage 810 to move up and down through. The support stage 810 is shaped to fit the opening and is slidably mounted on the worktable so that it can be raised and lowered to be flush with the surface of working area A. The opening can be circular or other shapes.

[0040] It is understood that the upper surface of the support stage 810 can accommodate at least one wafer, or an even number of wafers such as two or four. In the configuration that can accommodate an even number of wafers, the even number of wafers are placed side by side in the width direction of the working area A. In a further embodiment, the support stage 810 can be heated, so that during the wafer lamination process, heating can soften the adhesive on the film layer covering the wafer surface, allowing the film layer to adhere better to the wafer surface.

[0041] refer to Figures 1 to 2 In a further embodiment, the support platform 810 can be driven by a single lifting device 820 or by multiple lifting devices 820. In the configuration where multiple lifting devices 820 are driven together, each lifting device 820 can be driven independently to achieve horizontal leveling of the support platform 810. This ensures that the surface of the wafer is kept at the same level as other areas of the work area A each time the wafer is laminated, thus avoiding defects such as wrinkles after the adhesive layer M2 is laminated due to inconsistent levelness.

[0042] The unwinding unit 100 is used to release the adhesive film M, the second winding unit 300 is used to recover the protective film M1, the pressing unit 400 is used to press the adhesive layer M2 tightly onto the wafer, and the first winding unit 200 is used to recover the remaining waste adhesive layer M2 after cutting.

[0043] Specifically, refer to Figures 1 to 3 The following details the unwinding unit 100, the first winding unit 200, the second winding unit 300, and the pressing unit 400.

[0044] The unwinding unit 100 includes an unwinding bracket 120 and an unwinding roller module 130, a film peeling module 110 and a plurality of first guide rollers 141 disposed on the unwinding roller module 130 and the film peeling module 110, as well as a pressing roller 142, a film peeling power roller 143 and a second guide roller 144 disposed after the film peeling module 110.

[0045] The protective film roll is placed on the unwinding roller module 130, and the protective film M1 strip passes through each of the first guide rollers 141 and the peeling module 110 in sequence. At the peeling module 110, the protective film M1 strip and the adhesive layer M2 strip on the protective film M1 strip are torn apart at a large angle. After being torn apart, the protective film M1 strip passes through the pressing roller 142, the peeling power roller 143 and the second guide roller 144 in sequence, and is finally wound and recycled by the second winding unit 300. During this process, the unwinding roller module 130 is used to release the adhesive film M tape, and each first guide roller 141 guides and conveys the adhesive film M tape so that the adhesive film M tape can be smoothly wound to the peeling module 110 for peeling. The peeling power roller 143 is used to wind the protective film M1 tape, and the pressing roller 142 is used to pull the protective film M1 tape so that the protective film M1 tape can be smoothly wound by the peeling power roller 143 to smoothly separate from the adhesive layer M2 tape. The second guide roller 144 also guides the protective film M1 tape.

[0046] The lamination unit 400 is slidably mounted on the worktable. It can slide in the work area A to laminate the adhesive layer M2 tape onto the wafer in work area A. After the adhesive layer M2 tape is laminated, an external dicing unit cuts and separates the wafer from the adhesive layer M2 tape. After the wafer and adhesive layer M2 tape are cut, the wafer is transferred away from work area A by the transfer unit, leaving work area A with the remaining adhesive layer M2 tape.

[0047] The first take-up unit 200 includes a take-up bracket 220 and a take-up module 210, a take-up power roller 250, and a take-up roller module 240 disposed on the take-up bracket 220. The take-up roller module 240 is used to take up the remaining adhesive layer M2 tape after the film has been applied and cut. The adhesive layer M2 tape passes through the take-up module 210 and the take-up power roller 250 in sequence and is then wound onto the take-up roller module 240. It can be understood that the take-up roller module 240 is configured as a gravity roller. Specifically, a slide rail assembly is vertically arranged on the take-up bracket 220, and the take-up roller module 240 is disposed on the slide rail assembly. The take-up roller on the module abuts against the take-up power roller 250, which drives the module to rotate in order to achieve the winding and recovery of the remaining adhesive layer M2 tape.

[0048] The second winding unit 300 is used to wind and recycle the protective film M1 tape.

[0049] Furthermore, both the unwinding unit 100 and the first winding unit 200 are horizontally movable on the worktable and are driven by a linear drive mechanism, which includes, but is not limited to, a lead screw mechanism and a linear slide 600 mechanism. In addition, the unwinding unit 100 and the first winding unit 200 are independently movable, so that the unwinding unit 100 and the first winding unit 200 can move independently to enter or leave the work area A.

[0050] In some specific embodiments, linear slides 600 are provided on both sides of the worktable along its length.

[0051] For the unwinding unit 100, the unwinding unit 100 is slidably disposed on the linear slide table 600, and a first drive source is disposed on the worktable. The first drive source can be a linear motor. The movable end of the first drive source is connected to the unwinding bracket 120. Meanwhile, the bottom of the unwinding bracket 120 is slidably disposed on the linear slide table 600.

[0052] For the first take-up unit 200, its bottom sides are slidably disposed on two linear slides 600 respectively, and the first take-up unit 200 is driven by one of the linear slides 600 to move horizontally in a straight line.

[0053] For the pressing unit 400, its bottom sides are also slidably disposed on two linear slides 600 respectively, and the pressing unit 400 is driven by one of the linear slides 600 to move horizontally in a straight line.

[0054] By setting linear slides 600 on both sides of the worktable and driving the first winding unit 200 and the pressing unit 400 by different linear slides 600, the film application device of this application has a compact structure and each unit occupies less space.

[0055] Furthermore, the aforementioned film peeling module 110 and film take-up module 210 are movably configured, both of which can move closer to or further away from the worktable surface. The movable configuration of the film peeling module 110 and film take-up module 210 can be either vertical linear movement or oscillation around a pivot axis, and is not limited to these specific methods. By movably configuring the film peeling module 110 and film take-up module 210, the vertical distance between the film peeling module 110 and film take-up module 210 and the worktable surface can be increased when the unwinding unit 100 and / or the first take-up unit 200 moves. This avoids motion interference between the film peeling module 110 and film take-up module 210 and the worktable surface, ultimately increasing the travel distance of the unwinding unit 100 and the first take-up unit 200 on the worktable surface, thereby improving operational efficiency.

[0056] Specifically, refer to Figures 4 to 8 The following details the operation process of the film-applying device according to an embodiment of this application.

[0057] refer to Figure 4The protective film M1 is installed in the following stage. In this step, the protective film roll is manually placed on the unwinding roller module 130, and the protective film M1 is pulled out and passed through the first guide rollers 141 and the peeling module 110 in sequence. At the peeling module 110, the protective film M1 and the adhesive layer M2 are torn off. The torn adhesive layer M2 passes through the take-up module 210 and the gap between the take-up power roller 250 and the take-up roller module 240 and is held by the take-up power roller 250 and the take-up roller module 240 for subsequent winding and recycling. The torn protective film M1 passes through the pressing roller 142, the peeling power roller 143 and the second guide roller 144 in sequence and is then wound around the second take-up unit 300.

[0058] Preparation for film application stage. The support platform 810 carries the wafer and moves it according to the wafer thickness until the wafer surface is flush with the other surfaces of the work area A. The first take-up unit 200 and the pressing unit 400 move to their initial positions away from the unwinding unit 100, and the pressing unit 400 is close to the first take-up unit 200. At the same time, the take-up module 210 presses the adhesive layer M2 tape against the surface of the work area A. The unwinding unit 100 also moves horizontally to its initial position away from the pressing unit 400. At the same time, the peeling module 110 also moves to its initial position away from the worktable surface. The distance between the front end of the peeling module 110 (i.e., where the protective film M1 tape separates from the adhesive layer M2 tape) and the pressing unit 400 is greater than the maximum length of the work area A, and the adhesive layer M2 tape forms a certain angle with the surface of the work area A.

[0059] refer to Figure 5 In the bonding stage, the pressing unit 400 moves towards the side closer to the unwinding unit 100. During this movement, it presses the adhesive layer M2 tape tightly against the wafer surface. Simultaneously, the stripping module 110 also descends towards the worktable to ensure that the protective film M1 tape on the unwinding unit 100 maintains consistent tension during the bonding process. This continues until the stripping module 110 descends to a position flush with the worktable. Once the pressing unit 400 has completely covered the work area A, the bonding operation is complete.

[0060] refer to Figure 6 The film cutting stage. After the bonding operation is completed, the external cutting unit cuts the adhesive layer M2 tape bonded to the wafer surface, so as to separate the adhesive layer M2 bonded to the wafer surface from the adhesive layer M2 tape located above the work area A that is not bonded to the wafer surface.

[0061] refer to Figure 7The remaining film recycling stage. The position of the unwinding unit 100 remains unchanged, and the first winding unit 200 moves toward the unwinding unit 100 to wind up the remaining adhesive layer M2 on the working area A. When the first winding unit 200 moves to the edge of the working area A near the winding unit, the remaining film recycling operation is completed.

[0062] refer to Figure 8 In the film pulling stage, the take-up module 210 moves away from the worktable, and the take-up roller module 240 and the take-up power roller 250 remain stationary to hold the adhesive layer M2 tape in place. Then, the first take-up unit 200 moves away from the unwinding unit 100 to reset. During this process, the unwinding roller module 130 releases the protective film M1 tape, and at the same time, the peeling module 110 also moves away from the worktable to avoid the adhesive layer M2 from contacting the worktable during the pulling process.

[0063] By configuring the film application device of this application in this way, on the one hand, the unwinding unit 100 and the first winding unit 200 are both movable, as are the peeling module 110 and the winding module 210 thereon. This allows the first winding unit 200 to simultaneously pull out the adhesive layer M2 tape required for the next work cycle while resetting, without contacting the worktable surface. This avoids the waste of adhesive layer M2 tape caused by the first winding unit 200 resetting, thereby increasing the number of wafers bonded per roll of protective film M1 tape. On the other hand, even if the wafer thickness changes, the support platform 810 can be raised and lowered in a timely manner according to the wafer thickness so that the wafer surface can remain flush with other surfaces of the work area A. This ensures that during the aforementioned film preparation stage, bonding stage, residual film recycling stage, and film pulling stage, whether it is the movement of the first winding unit 200 or the movement of the pressing unit 400, the adhesive tape can fully contact the work area A during the movement process, thereby improving the film application yield and film collection efficiency.

[0064] refer to Figures 1 to 3 In some embodiments, the film peeling module 110 includes a film peeling plate 111 and a plurality of rollers disposed on the side of the film peeling plate 111 away from the working area A and respectively located on the upper and lower sides of the film peeling plate 111; the rollers are also part of the first guide rollers 141 described in the foregoing embodiments.

[0065] refer to Figures 1 to 3 In a specific embodiment, the peeling plate 111 extends toward one side of the first take-up unit 200. The width of the peeling plate 111 is adapted to or slightly smaller than the width of the working area A, and a guide slope is provided on its top surface toward the first take-up unit 200. The aforementioned protective film M1 strip is separated into an adhesive layer M2 strip and a protective film M1 strip at the edge of the guide slope on the peeling plate 111.

[0066] It is understood that the aforementioned film peeling module 110 can be movably configured, which could mean that the film peeling plate 111 is movably configured, or that the entire film peeling module 110 is movably configured. The movability can be achieved by swinging or linear movement, etc. For example, in the case where the entire film peeling module 110 is movably configured, the film peeling module 110 includes a peeling bracket 113 and a linear drive device (e.g., a linear motor or cylinder). The peeling bracket 113 is vertically slidably configured on the unwinding bracket 120 and is driven by the linear drive device. The film peeling plate 111 and part of the first guide roller 141 are configured on the peeling bracket 113.

[0067] Furthermore, one of the first guide rollers 141 is connected to a tension monitoring device 112. Taking this as an example, the tension monitoring device 112 includes a force-measuring bracket, a slide rail assembly, and a force sensor. The slide rail assembly connects the force-measuring bracket and the peeling bracket 113, and the force sensor is also connected to the force-measuring bracket and the peeling bracket 113. The first guide roller 141 is rotatably mounted on the force-measuring bracket. During the film application process, changes in the tension of the protective film M1 strip can pull the force-measuring bracket to slide on the slide rail assembly, causing the force sensor to detect the change. This, in turn, causes the first take-up unit 200 or the unwinding roller module 130 to adjust its movement / unwinding speed according to the tension change, so that the tension of the protective film M1 strip remains within the target range.

[0068] refer to Figures 1 to 3 In some embodiments, the first take-up unit 200 further includes a take-up bracket 220 horizontally slidably disposed on the worktable and a rotating frame 230 rotatably disposed on the take-up bracket 220. A take-up roller module 240 and a take-up film module 210 eccentrically disposed with respect to the rotating shaft are disposed on the rotating frame 230. By setting the rotating frame 230 and simultaneously placing the take-up roller module 240 and the take-up film module 210 on the rotating frame 230, when the first take-up unit 200 needs to be reset after the previous wafer lamination operation is completed and the remaining film is recovered, the rotating frame 230 can be rotated as a whole to move the take-up film module 210 to the side away from the worktable surface. This avoids the waste caused by the take-up film module 210 being too close to the worktable surface during the reset process of the first take-up unit 200, which would result in the pulled-out bonding layer M2 contacting the worktable surface too early.

[0069] Understandably, the rotating frame 230 can be driven by a rotating motor or pushed by a cylinder to achieve the swing.

[0070] Specifically, in some embodiments, a lifting mechanism 260 is connected between the take-up bracket 220 and the rotating frame 230, located on one side of the rotating shaft. The lifting mechanism 260 is used to push the rotating frame 230 to rotate so that the take-up module 210 moves closer to or away from the worktable. The lifting mechanism 260 can be a linear motor or a cylinder.

[0071] refer to Figures 1 to 3 In some embodiments, a braking mechanism is provided in either or both of the unwinding unit 100 and the first winding unit 200. The braking mechanism includes a brake roller 520 and a brake plate 510 that can abut against the brake roller 520. The adhesive film M and / or adhesive layer M2 are disposed between the brake roller 520 and the brake plate 510.

[0072] In a specific embodiment, both the unwinding unit 100 and the first winding unit 200 are equipped with braking mechanisms.

[0073] Specifically, in the unwinding unit 100, the braking mechanism is disposed on the peeling bracket 113 and located before the peeling plate, more specifically, it is disposed before the tension monitoring device 112. The braking mechanism includes a brake cylinder and a brake plate 510. The brake cylinder is used to push the brake plate 510 to abut against one of the first guide rollers 141, so as to press the protective film M1 strip against the corresponding first guide roller 141 and stop the protective film M1 strip.

[0074] In the first take-up unit 200, the braking mechanism is mounted on the rotating frame 230 and located in the take-up module 210. The braking mechanism also includes a brake cylinder and a brake plate 510. Specifically, the take-up module 210 includes a guide roller 211, a tension cylinder, a tension roller 212, a brake roller 520, a brake cylinder, and a brake plate 510. The tension roller 212 is located behind the guide roller 211, and the brake roller 520 is located behind the guide roller 211. The adhesive layer M2 tape passes through the gap between the guide roller 211 and the tension roller 212 after passing around the guide roller 211, then around the brake roller 520, and then around the take-up power roller 250 before being wound into the take-up roller module 240.

[0075] A tension cylinder is connected to a tension roller 212, which is used to push the tension roller 212 closer to or further away from the guide roller 211 to adjust the tension of the adhesive layer M2 tape in the first take-up unit 200. A brake cylinder is connected to a brake plate 510 to push the brake plate 510 against the brake roller 520, thereby clamping and fixing the adhesive layer M2 tape.

[0076] The braking mechanism in the unwinding unit 100 is used to adjust the tension of the protective film M1 belt during the preparation stage of film application. Specifically, the brake cylinder pushes the brake plate 510 closer to the first guide roller 141 to increase the friction between the protective film M1 belt and the first guide roller 141 and the brake plate 510, thereby causing the protective film M1 belt to be in different tension states.

[0077] The braking mechanism in the first take-up unit 200 is used during the film stretching stage to clamp and pull the adhesive layer M2 tape away from the unwinding unit 100. Specifically, while the unwinding roller module 130 releases the adhesive film M tape, the braking mechanism clamps the adhesive layer M2 tape, and at the same time, the first unwinding unit 100 moves in the working area A to clamp the adhesive layer M2 tape and pull it to the initial position.

[0078] By providing a braking mechanism in either or both of the unwinding unit 100 and the first winding unit 200, the pulling or tension control of the protective film M1 tape or the adhesive layer M2 tape can be made more precise, which is beneficial to improving the film application accuracy.

[0079] refer to Figures 1 to 3 In some embodiments, the pressing unit 400 includes a pressing frame 410 slidably disposed horizontally on the worktable and a pressing roller 420 movably disposed vertically on the pressing frame 410. For example, a slide assembly may be provided on the worktable, and the pressing frame 410 is disposed on the slide assembly, the travel of which is greater than the length of the working area A. Furthermore, a pressing cylinder is also provided on the pressing frame 410 for pushing the pressing roller closer to or away from the worktable surface, so that the pressing roller can leave the worktable surface to smoothly reset during the resetting process after the pressing unit 400 completes pressing.

[0080] Furthermore, a heating module is provided in the pressure roller 420, and a temperature sensor is also provided in the pressure roller 420 accordingly. In this way, when the pressure roller 420 presses the adhesive layer M2 of the working area A onto the wafer, it can simultaneously heat the adhesive layer M2 to soften the adhesive layer on it, thereby achieving a better pressing effect.

[0081] refer to Figures 1 to 3 In some embodiments, an antistatic device 700 is provided on the unwinding unit 100 and / or the first take-up unit 200.

[0082] For example, in the unwinding unit 100, the antistatic device 700 may be disposed between the film peeling plate 111 and the pressure roller 142; while in the first take-up unit 200, the antistatic device 700 is disposed directly above the take-up module 210. The antistatic device 700 may be an antistatic ion device.

[0083] By providing an antistatic device 700 on the unwinding unit 100 and / or the first winding unit 200, the problem of work contamination caused by dust adhering to the protective film M1 tape and / or the adhesive layer M2 tape due to static electricity can be prevented. It can also prevent the problem of the layers of the protective film M1 tape sticking together due to static electricity during unwinding.

[0084] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A film-coating device for bonding a film layer to a wafer, characterized in that, include: A worktable is provided, on which a working area for applying film to the wafer is formed, and a support platform for supporting the wafer and capable of being raised and lowered is provided in the working area. The workbench is provided with a winding and unwinding unit, a first winding and rewinding unit, a second winding and rewinding unit, and a pressing unit located between the winding and unwinding unit and the first winding and rewinding unit and above the working area; The unwinding unit, the first winding unit, and the pressing unit are all capable of moving horizontally on the workbench to enter or leave the work area; on opposite sides of the unwinding unit and the first winding unit, there are respectively a film peeling module and a film taking module that are both capable of moving to approach or move away from the workbench surface. The unwinding unit is used to release the adhesive film, the peeling end of the peeling module is used to peel off the adhesive layer and protective film on the adhesive film, the second winding unit is used to wind up the protective film, the pressing unit is used to press the adhesive layer onto the wafer, and the first winding unit is used to wind up the excess adhesive layer after pressing.

2. The film-applying device as described in claim 1, characterized in that: The film peeling module includes a film peeling plate and several rollers disposed on the side of the film peeling plate away from the working area and respectively located on the upper and lower sides of the film peeling plate; one of the rollers is connected to a tension monitoring device.

3. The film-applying device as described in claim 2, characterized in that: The unwinding unit further includes an unwinding bracket that is horizontally slidably disposed on the worktable and an unwinding roller module that is fixedly disposed on the unwinding bracket, and the film peeling module is vertically slidably disposed on the unwinding bracket.

4. The film-applying device as described in claim 1, characterized in that: The first take-up unit further includes a take-up bracket that is horizontally slidably disposed on the worktable and a rotating frame that is rotatably disposed on the take-up bracket. A take-up roller module and the take-up module that are eccentrically disposed with respect to the rotating shaft are disposed on the rotating frame.

5. The film-applying device as described in claim 4, characterized in that: A lifting mechanism is connected between the take-up bracket and the rotating frame, and located on one side of the rotating shaft. The lifting mechanism is used to push the rotating frame to rotate so that the take-up module moves closer to or away from the worktable.

6. The film application device as described in any one of claims 1 to 5, characterized in that: A braking mechanism is provided in either or both of the unwinding unit and the first winding unit. The braking mechanism includes a brake roller and a brake plate that can abut against the brake roller. The adhesive film and / or the adhesive layer are disposed between the brake roller and the brake plate.

7. The film-applying device as described in claim 6, characterized in that: In the direction of the adhesive layer winding, the braking mechanism is disposed before the film peeling module, and / or the braking mechanism is disposed after the film taking-up module.

8. The film application device as described in any one of claims 1 to 5, characterized in that: The pressing unit includes a pressing frame that is horizontally slidably disposed on the worktable and a pressing roller that is vertically movable disposed on the pressing frame; a heating module is disposed in the pressing roller.

9. The film-applying device as described in claim 1, characterized in that: Linear slides are provided on both sides of the workbench along its length, and the first winding unit and the pressing unit are both located on the linear slides.

10. The film-applying device as claimed in claim 1, characterized in that: An antistatic device is also provided on the unwinding unit and / or the first winding unit.

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