Display panels, displays and electronic devices

Abstract

The present application provides a display panel, a display screen and an electronic device, wherein the display panel includes a plurality of anodes, a pixel definition layer, a hole functional layer, a plurality of light-emitting layers, at least one organic connection layer, an electronic functional layer and a cathode, any two adjacent anodes among the plurality of anodes are isolated by the pixel definition layer, and the plurality of anodes, the hole functional layer, the plurality of light-emitting layers, the electronic functional layer and the cathode are stacked in sequence; each organic connection layer is connected between two adjacent light-emitting layers; the material of each organic connection layer includes a main material and a doping material doped in the main material, and the square resistance of each organic connection layer in any lateral direction is greater than or equal to 1GΩ / □, wherein any lateral direction is perpendicular to the thickness direction of the organic connection layer. The solution of the present application can improve the lateral crosstalk between pixels and avoid the defects of the traditional partition-type Tandem OLED solution.

Description

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on June 25, 2023, with application number 202310756435.8 and application name “Display Panel, Display Screen and Electronic Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of display panels, and in particular to a display panel, a display screen and an electronic device. Background Art

[0003] Tandem organic light-emitting diode (Tandem OLED) is an OLED device structure formed by stacking multiple traditional OLED devices in series through a charge generation layer (CGL). Display panels manufactured using Tandem OLED technology have the characteristics of high brightness, low power consumption and long life.

[0004] However, since CGL has a high lateral conductivity characteristic (i.e., conductivity in the direction parallel to the display panel), it will cause lateral light crosstalk between pixels in the Tandem OLED display panel (for example, when a red pixel is adjacent to a blue pixel, the blue pixel will emit red light, causing the blue light emitted by the blue pixel to be impure), resulting in a variety of problems such as reduced color gamut of the screen, color shift, and abnormal picture display. Summary of the invention

[0005] Embodiments of the present application provide a display panel, a display screen, and an electronic device, which can improve lateral crosstalk between pixels.

[0006] In the first aspect, an embodiment of the present application provides a display panel, comprising multiple anodes, a pixel definition layer, a hole functional layer, multiple light-emitting layers, at least one organic connection layer, an electronic functional layer and a cathode, wherein any two adjacent anodes among the multiple anodes are isolated by the pixel definition layer, and the multiple anodes, the hole functional layer, the multiple light-emitting layers, the electronic functional layer and the cathode are stacked in sequence; each organic connection layer is connected between two adjacent light-emitting layers; the material of each organic connection layer comprises a main material and a doping material doped in the main material, and the square resistance of each organic connection layer in any lateral direction is greater than or equal to 1 GΩ / □, wherein any lateral direction is perpendicular to the thickness direction of the organic connection layer.

[0007] In this solution, by eliminating the isolation groove on the PDL or setting isolation structures such as isolation columns, the surface of the PDL in the area between any two anodes is continuous, without protrusions or grooves, so that the cathode can be continuous and unbroken, the voltage drop on the cathode is reduced, and the power consumed by the cathode is reduced, thereby making the driving voltage and power consumption of the display panel lower, and avoiding abnormal pixel lighting. In addition, it can also avoid the addition of additional masks and photolithography processes, thereby simplifying the process and reducing costs. In addition, the reliability of the display panel can also be improved. Through the doping modification of the organic connection layer, the organic connection layer has a very high lateral square resistance, which can greatly improve the lateral crosstalk. Since the organic connection layer does not need to be arranged following the distribution of sub-pixels, the pixel design has no effect on the design of the organic connection layer. Therefore, the design of improving lateral crosstalk through the organic connection layer can be applied to all TandemOLED products, and the design has strong compatibility and can meet the needs of mass production.

[0008] In an implementation of the first aspect, the organic connection layer includes a charge generation layer, and the charge generation layer includes an N-type charge generation layer and a P-type charge generation layer; the P-type charge generation layer and the N-type charge generation layer are stacked and located on the side of the N-type charge generation layer facing the cathode.

[0009] In this solution, an N-type charge generation layer and a P-type charge generation layer are provided to transfer carriers to two light-emitting layers connected in series through an organic connecting layer, so as to realize the light emission of the series-connected OLED.

[0010] In an implementation of the first aspect, the main material of the N-type charge generation layer includes an N-type main material, the doping material of the N-type charge generation layer includes an N-type doping material, and the concentration of the N-type doping material is ∈(0%, 100%).

[0011] In this solution, by adjusting the doping concentration of the N-type charge generation layer within this range, the lateral square resistance, longitudinal mobility and charge generation capacity of the N-type charge generation layer can be comprehensively adjusted as needed to achieve the purpose of reducing lateral crosstalk.

[0012] In an implementation of the first aspect, the N-type main material includes an organic aromatic material, and / or the N-type doping material includes a metal material with a work function ≤3.5eV, or a metal oxide material with a work function ≤3.5eV, or an organic material with a work function ≤3.5eV, or an organic-metal complex material with a work function ≤3.5eV.

[0013] In this solution, the above-mentioned N-type main material and N-type doping material have excellent performance and can meet the needs of doping modification.

[0014] In an implementation of the first aspect, the main material of the P-type charge generation layer includes a P-type main material, the doping material of the P-type charge generation layer includes a P-type doping material, and the concentration of the P-type doping material is ∈(0%, 100%).

[0015] In this solution, by adjusting the doping concentration of the P-type charge generation layer within this range, the lateral square resistance, longitudinal mobility and charge generation capacity of the P-type charge generation layer can be comprehensively adjusted as needed to achieve the purpose of reducing lateral crosstalk.

[0016] In an implementation of the first aspect, the P-type main material includes an organic aromatic material, and / or the P-type doping material includes an organic material with a lowest unoccupied molecular orbital energy level ≤-3.0 eV, or an inorganic material with a work function ≥3.0 eV.

[0017] In this solution, the above-mentioned P-type main material and P-type doping material have excellent performance and can meet the needs of doping modification.

[0018] In an implementation of the first aspect, the charge generation layer further includes an intermediate layer connected between the N-type charge generation layer and the P-type charge generation layer.

[0019] In this solution, the intermediate layer can play a bridging role and can reduce the potential barrier between the N-type charge generation layer and the P-type charge generation layer.

[0020] In an implementation of the first aspect, the organic connecting layer also includes at least one of a hole blocking layer, an electron transport layer, a hole injection layer and a hole transport layer, wherein the hole blocking layer, the N-type charge generation layer and the P-type charge generation layer are stacked in sequence; the electron transport layer, the N-type charge generation layer and the P-type charge generation layer are stacked in sequence, and when the hole blocking layer is present, the hole blocking layer, the electron transport layer and the N-type charge generation layer are stacked in sequence; the hole injection layer and the P-type charge generation layer are stacked and located on the side of the P-type charge generation layer facing the cathode; the hole transport layer and the P-type charge generation layer are stacked and located on the side of the P-type charge generation layer facing the cathode, and when the hole injection layer is present, the P-type charge generation layer, the hole injection layer and the hole transport layer are stacked in sequence.

[0021] In this solution, by making the organic connection layer also include at least one of a hole blocking layer, an electron transport layer, a hole injection layer and a hole transport layer, the performance of the organic connection layer can be optimized, the generation, injection and transport of carriers can be guaranteed, and the light emission of the series OLED can be realized.

[0022] In an implementation of the first aspect, the longitudinal mobility of the organic connecting layer is 10 -1 cm 2 / (V·S)~10 - 6 cm2 / (V·S).

[0023] In this solution, by performing doping modification, the organic connection layer can have a higher longitudinal mobility, which is beneficial to reduce the driving voltage and save power consumption.

[0024] In an implementation manner of the first aspect, the thickness of each organic connecting layer is less than or equal to 300 nm.

[0025] In this solution, by controlling the thickness of the organic connection layer within this range, the lateral sheet resistance of the organic connection layer can be made larger, which is beneficial to reducing lateral crosstalk.

[0026] In an implementation of the first aspect, the plurality of anodes include a first anode and a second anode, the first anode is adjacent to the second anode, and the first anode has a top surface facing the cathode; the portion of the pixel definition layer between the first anode and the second anode has a slope angle; the acute angle formed by the line connecting any two points on the surface of the cathode facing the pixel definition layer and the top surface is less than or equal to the slope angle; the acute angle formed by the line connecting any two points on the surface of the cathode facing away from the pixel definition layer and the top surface is less than or equal to the slope angle. By designing as above, the pixel definition layer presents a flat structure in the area between any two anodes, and the surface of the area is continuous, without protrusions or grooves. Such a pixel definition layer has no isolation structure, which can make the cathode continuous and unbroken, reduce the voltage drop on the cathode, and reduce the power consumed by the cathode, thereby making the driving voltage and power consumption of the display panel lower, and avoiding abnormal pixel lighting. In addition, the mask and photolithography process required for the isolation structure can be avoided, thereby simplifying the process and reducing costs. In addition, the reliability of the display panel can also be improved.

[0027] In an implementation of the first aspect, the display panel further includes an isolation structure, which is formed on the pixel definition layer, and the isolation structure runs through the hole functional layer, multiple light-emitting layers, at least one organic connection layer, the electronic functional layer and the cathode.

[0028] In this solution, the isolation structure can partially disconnect the organic connection layer from the light-emitting layer by means of physical isolation, and separate the sub-pixels of different colors in the display panel, thereby improving the lateral crosstalk. The simultaneous provision of the isolation structure and the organic connection layer with high lateral square resistance can strengthen this effect, thereby avoiding lateral crosstalk. This solution can meet some specific product design requirements.

[0029] In an implementation of the first aspect, the display panel includes a plurality of sub-pixels, a portion of the plurality of sub-pixels includes a first sub-pixel and a second sub-pixel, the first sub-pixel is adjacent to the second sub-pixel, and the isolation structure is located between the first sub-pixel and the second sub-pixel. By providing the isolation structure only between some of the sub-pixels, the number of isolation structures in the display panel is reduced, which can reduce damage to the cathode, reduce power consumption of the display panel, and ensure the display effect of the display panel. In addition, it is also easier to make the isolation structure avoid directions and positions with poor bending reliability, thereby greatly improving the reliability of the display panel.

[0030] In an implementation of the first aspect, the isolation structure includes a columnar structure. The isolation structure of this structure is mature and reliable, and can fully separate sub-pixels of different colors in the display panel to meet specific product design requirements.

[0031] In an implementation of the first aspect, the isolation structure includes a groove, and the side of the pixel definition layer facing away from the cathode is the bottom wall of the groove. The isolation structure of this structure is mature and reliable, and can fully separate sub-pixels of different colors in the display panel to meet specific product design requirements.

[0032] In an implementation of the first aspect, the sub-pixels in the display panel form a true red, green and blue arrangement, a diamond arrangement, a delta arrangement, a tripod arrangement, a pentile arrangement or a diamond-like arrangement. This solution can be applied to various common pixel arrangements, has strong compatibility, and can meet mass production needs.

[0033] In an implementation manner of the first aspect, each light-emitting layer includes a red light-emitting unit, a green light-emitting unit, and a blue light-emitting unit.

[0034] In this solution, the colorization of the display panel can be achieved by directly emitting light through RGB sub-pixels. The design of reducing lateral crosstalk can be applied to the panel architecture in which the colorization of the display panel is achieved by directly emitting light through RGB sub-pixels.

[0035] In an implementation of the first aspect, the display panel includes a first color filter film, the first color filter film includes a plurality of first red light filter units, a plurality of first green light filter units and a plurality of first blue light filter units; the first color filter film is located on a side of the cathode facing away from the electron functional layer, or the first color filter film is located on a side of the plurality of anodes facing away from the hole functional layer; at least two of the plurality of light-emitting layers are respectively used to emit light of different colors, and the plurality of light-emitting layers as a whole emit white light; the first red light filter unit is used to filter the white light and emit red light, the first green light filter unit is used to filter the white light and emit green light, and the first blue light filter unit is used to filter the white light and emit blue light.

[0036] In this solution, the colorization of the display panel can be achieved by means of white light + first color filter film. The design of reducing lateral crosstalk can be applied to the panel architecture that realizes the colorization of the display panel by means of white light + first color filter film.

[0037] In an implementation of the first aspect, the display panel includes a color conversion layer, the color conversion layer includes multiple red light conversion units and multiple green light conversion units, the color conversion layer is located on the side of the cathode facing away from the electron functional layer, or the color conversion layer is located on the side of the multiple anodes facing away from the hole functional layer; each of the multiple light-emitting layers is used to emit blue light, the red light conversion unit is used to convert the color of the blue light and emit red light, and the green light conversion unit is used to convert the color of the blue light and emit green light.

[0038] In this solution, the colorization of the display panel can be achieved by means of blue light + color conversion layer. The design of reducing lateral crosstalk can be applied to the panel architecture that realizes the colorization of the display panel by means of blue light + color conversion layer.

[0039] In an implementation of the first aspect, the display panel also includes a second color filter film, which is located on the side of the color conversion layer facing away from the cathode; the second color filter film includes a plurality of second red light filter units, a plurality of second green light filter units, and a plurality of second blue light filter units, the second red light filter unit is used to filter the red light emitted by the red light conversion unit and emit red light, the second green light filter unit is used to filter the green light emitted by the green light conversion unit and emit green light, and the second blue light filter unit is used to filter the blue light and emit blue light.

[0040] In this solution, by adding a second color filter film, the light color of the display panel can be made pure.

[0041] In an implementation of the first aspect, the display panel also includes a substrate, a plurality of thin film transistors, a covering layer and an encapsulation layer, the plurality of thin film transistors are arranged on a side of the substrate facing the plurality of anodes, the plurality of thin film transistors are electrically connected to the plurality of anodes one-to-one, the covering layer is located on a side of the cathode facing away from the electronic functional layer, and the encapsulation layer is located on a side of the covering layer facing away from the cathode; wherein the first color filter film is located on a side of the encapsulation layer facing away from the covering layer, or on a side of the substrate facing away from the plurality of thin film transistors; the color conversion layer is located on a side of the encapsulation layer facing away from the covering layer, or on a side of the substrate facing away from the plurality of thin film transistors; a portion of the encapsulation layer is filled in the groove and covers the pixel definition layer.

[0042] In this solution, the design of reducing lateral crosstalk can be applied to common, typical tandem OLED panels, thereby improving the lateral crosstalk problem of such tandem OLED panels.

[0043] In a second aspect, an embodiment of the present application provides a display screen, comprising a cover plate and the display panel, wherein the cover plate is bonded to the display panel.

[0044] The display screen of this solution has a display panel capable of improving lateral crosstalk, so the display screen has better performance and lower cost.

[0045] In a third aspect, an embodiment of the present application provides an electronic device, including a structural member and the display screen, wherein the display screen is fixed to the structural member.

[0046] The electronic device of this solution has a display panel capable of improving lateral crosstalk, so the electronic device has better performance and lower cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 It is a partial top view schematic diagram of a traditional partitioned Tandem OLED display panel;

[0048] Figure 2 yes Figure 1 AA partial cross-sectional schematic diagram;

[0049] Figure 3 is a schematic diagram of the structure of an electronic device according to an embodiment of the present application;

[0050] Figure 4 is a schematic structural diagram of another electronic device according to an embodiment of the present application;

[0051] Figure 5 is a schematic structural diagram of another electronic device according to an embodiment of the present application;

[0052] Figure 6 is a schematic structural diagram of another electronic device according to an embodiment of the present application;

[0053] Figure 7 is a schematic structural diagram of another electronic device according to an embodiment of the present application;

[0054] Figure 8 is a schematic structural diagram of another electronic device according to an embodiment of the present application;

[0055] Fig. 9 is a schematic structural diagram of another electronic device according to an embodiment of the present application;

[0056] Fig.10 is a schematic structural diagram of another electronic device according to an embodiment of the present application;

[0057] Fig.11a is a schematic diagram of a partial cross-sectional structure of a display panel of Embodiment 1;

[0058] Fig.11bis a schematic diagram of a flat structure of the pixel definition layer in the first embodiment in a region between any two anodes;

[0059] Fig.11c is a schematic diagram of a partial cross-sectional structure of a display panel according to another embodiment;

[0060] Fig.12 yes Fig.11a A schematic diagram of a cross-sectional structure of an organic connecting layer;

[0061] Fig.13 It is a principle schematic diagram to explain the super square resistance phenomenon of organic conductive surface;

[0062] Fig.14 It is a principle schematic diagram to explain the phenomenon that the metal conductive surface has no super square resistance;

[0063] Fig.15 It is a schematic diagram illustrating the principle of reducing the super square resistance phenomenon of organic-inorganic hybrid conducting surface;

[0064] Fig.16 yes Fig.11a A simple connection circuit for sub-pixels in a display panel;

[0065] Fig.17 is an IV curve graph of an OLED device;

[0066] Fig.18 is a simulation curve showing the relationship between the lateral square resistance of the organic connection layer, the equivalent resistor 36R and the lighting voltage across the light-emitting unit 3c;

[0067] Fig.19 is a schematic diagram of a partial cross-sectional structure of a display panel of Embodiment 2;

[0068] Fig. 20 is a schematic diagram of a partial cross-sectional structure of a display panel of Embodiment 5;

[0069] Fig.21 is a schematic diagram of a partial cross-sectional structure of a display panel of Embodiment 6;

[0070] Fig. 22 is a schematic diagram of a partial cross-sectional structure of a display panel in an implementation manner of the seventh embodiment;

[0071] Fig.23 express Fig. 22 Schematic microstructure of a stack from anode to cathode located between adjacent anodes;

[0072] Fig.24 is a schematic diagram of a partial cross-sectional structure of a display panel in another implementation manner of Example 7;

[0073] Fig.25express Fig.24 Schematic microstructure of a stack from anode to cathode located between adjacent anodes;

[0074] Figure 26-Figure 31 A schematic diagram showing the application of the design for improving lateral crosstalk according to Embodiment 7 in a 2B in 1 arrangement in a real red, green and blue arrangement;

[0075] Figure 32-Figure 37 A schematic diagram showing the application of the design for improving lateral crosstalk according to Embodiment 7 in a 1B in 1 arrangement in a real red, green and blue arrangement;

[0076] Figure 38-Figure 43 A schematic diagram showing the application of the design for improving lateral crosstalk according to Embodiment 7 in a diamond arrangement;

[0077] Figure 44-Figure 47 They are schematic diagrams of partial cross-sectional structures of display panels in different implementations of the eighth embodiment;

[0078] Fig.48 and Fig.49 A partial cross-sectional structural diagram of a display panel according to the twelfth embodiment is shown. DETAILED DESCRIPTION

[0079] For ease of understanding, the relevant technical terms involved in the embodiments of the present application are explained and described below.

[0080] In the description of the embodiments of the present application, unless otherwise specified, “multiple (layers)” refers to two (layers) or more.

[0081] The terms "first", "second", etc. are used for descriptive purposes only and should not be understood to imply or suggest relative importance or implicitly indicate the number of technical features indicated. Features qualified as "first" or "second" may explicitly or implicitly include one or more of the features.

[0082] "Connect" should be understood in a broad sense, for example, "connect" can be detachably connected or non-detachably connected; it can be directly connected or indirectly connected through an intermediate medium. "Fix" should also be understood in a broad sense, for example, "fix" can be directly fixed or indirectly fixed through an intermediate medium.

[0083] The directional terms mentioned in the embodiments of the present application, such as "upper", "lower", "top", "bottom", etc., are only references to the directions of the drawings. The directional terms are for better and clearer explanation and understanding of the embodiments of the present application, and do not explicitly or implicitly indicate that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, etc., and therefore cannot be understood as limiting the embodiments of the present application.

[0084] In the description of the embodiments of the present application, unless otherwise specified, "and / or" is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone.

[0085] The embodiment of the present application first describes the traditional partition-type Tandem OLED solution.

[0086] Figure 1 It is a partial top view schematic diagram of a partitioned Tandem OLED display panel (hereinafter referred to as the display panel), wherein the sight direction is perpendicular to the xy plane, and any direction in the xy plane can be called horizontal.

[0087] like Figure 1 As shown, a plurality of array-arranged sub-pixels (indicated by dashed boxes), such as sub-pixel 1a, sub-pixel 1b and sub-pixel 1c, are provided in the display panel 1. Basically, a spacer column (indicated by a thick black line) is provided between any two adjacent sub-pixels, such as spacer column 12 and spacer column 13. There are a large number of spacer columns, which are distributed at multiple locations in the display panel 1, and these spacer columns can be crisscrossed. Adjacent sub-pixels are separated by spacer columns, which are used to block lateral crosstalk between sub-pixels.

[0088] Figure 2 for Figure 1 AA partial cross-sectional diagram, wherein the sight direction is perpendicular to the xz plane, the direction along the z-axis can be called the longitudinal direction, and the transverse direction can be the direction along the x-axis.

[0089] like Figure 2 As shown, the display panel 1 may include a substrate 11, thin film transistors (TFT) 121, TFT 122 and TFT 123, anodes 131, 132 and 133, a pixel definition layer (PDL) 14, isolation columns 12 and 13, emitting units (EML) 151, 152 and 153, multiple CGLs 16, emitting units 171, 172 and 173, emitting units 181, 182 and 183, a cathode 19, a capping layer (CPL) 110 and an encapsulation layer 111.

[0090] Each light-emitting unit participates in forming a sub-pixel. Figure 1 and Figure 2As shown, sub-pixel 1a may include light-emitting unit 151, light-emitting unit 171 and light-emitting unit 181, sub-pixel 1b may include light-emitting unit 152, light-emitting unit 172 and light-emitting unit 182, and sub-pixel 1c may include light-emitting unit 153, light-emitting unit 173 and light-emitting unit 183. Multiple light-emitting units arranged along the z-axis can emit light of the same color, for example, light-emitting unit 151, light-emitting unit 171 and light-emitting unit 181 can emit red light. Multiple light-emitting units arranged along the x-axis can emit light of different colors, for example, light-emitting unit 151, light-emitting unit 152 and light-emitting unit 153 can emit red light, green light and blue light respectively.

[0091] like Figure 2 As shown, there is a CGL 16 between every two layers of light emitting units, and every two layers of light emitting units are connected in series through the CGL 16. The number of series layers of light emitting units can be set as needed ( Figure 2 “…” is used in the figure to indicate the omitted light emitting unit layer and CGL 16).

[0092] like Figure 2 As shown, the isolation column 12 and the isolation column 13 are both formed on the PDL 14. Figure 2 and Figure 1 As shown, the isolation column (such as the isolation column 12) partially disconnects the layer from the light-emitting unit 151 to the cover layer 110, and the isolation column separates adjacent light-emitting units (such as the light-emitting unit 151 and the light-emitting unit 152) on the same layer in some lateral directions, and disconnects multiple CGLs 16 and cathodes 19 in the lateral directions. Figure 2 and Figure 1 As shown, in order to ensure that the cathode 19 can work normally, the isolation column does not isolate the cathode 19 in all lateral directions, that is, the isolation column does not divide the cathode 19 into multiple mutually isolated regions, but makes each region of the cathode 19 still conductive. Correspondingly, the isolation column does not isolate the CGL 16 in all lateral directions, and each region of the CGL 16 is still conductive.

[0093] The above-mentioned partitioned Tandem OLED solution achieves the purpose of partial disconnection of CGL 16 by means of physical partition, thereby reducing lateral crosstalk. However, as mentioned above, CGL16 is not disconnected in all lateral directions, and each area of ​​CGL16 is still conductive, which causes lateral crosstalk to still exist. Since the cathode 19 will be partially disconnected and discontinuous, the surface impedance of the cathode 19 will increase, the voltage drop (current and resistance drop, IRdrop) on the cathode 19 will increase, and the power consumed by the cathode 19 will increase, which will lead to higher driving voltage and power consumption of the display panel 1. In particular, when the number of isolation columns is large, the cathode 19 is greatly damaged, resulting in more obvious high power consumption defects. In addition, the disconnection of the cathode 19 will also cause abnormal pixel lighting. In addition, the preparation of the isolation column requires one or two additional photolithography masks and photolithography steps, and additional processes need to be introduced, resulting in increased costs. In addition, the display panel 1 will also have reliability issues. When the display panel 1 faces scenes such as bending, long-term high brightness, squeezing, etc., the performance of the display panel 1 is easily degraded due to the failure of the isolation column. For example, the display panel 1 may have defects such as dark spots, black spots, and abnormal pixel light emission. Especially when the number of isolation columns is large, the reliability defects will become more obvious. Moreover, the isolation structure in the partition-type Tandem OLED solution needs to be arranged according to the distribution of sub-pixels. The pixel design has a great impact on the isolation structure design. The same isolation structure design cannot be directly migrated to all Tandem OLED products, resulting in a lack of design compatibility and difficulty in meeting mass production needs.

[0094] In view of this, the following embodiments of the present application provide an alternative to the traditional partitioned Tandem OLED, which can improve or overcome the above-mentioned defects of the traditional partitioned Tandem OLED.

[0095] The embodiment of the present application provides an electronic device, which includes but is not limited to mobile phones (such as straight-plate mobile phones, foldable mobile phones, curved screen mobile phones, etc.), tablet computers, laptops (including foldable laptops), smart screens, desktop monitors, smart bracelets, smart watches, mixed reality devices (mixed reality, MR), virtual reality devices (virtual reality, VR), augmented reality devices (augmented reality, AR), vehicle-mounted devices (such as car computers), etc. The electronic device includes a structural member and a display screen fixed on the structural member, and the display screen may include a cover plate and a display panel, the cover plate is bonded to the display panel, and the display panel may be a Tandem OLED display panel. The specific forms of several electronic devices are listed below.

[0096] For example Figure 3As shown, the electronic device 2 may be a foldable mobile phone, and the electronic device 2 may include a structural member 21 and a display screen 22 fixed on the structural member 21. The structural member 21 may include a middle frame, and the display screen 22 may be installed on the middle frame. The display screen 22 may include a flexible cover plate and a display panel that fit together. Schematically, when the electronic device 2 is folded, the display screen 22 may be located on the outside, and the electronic device 2 may be an external folding screen mobile phone. In other embodiments, when the electronic device 2 is folded, the display screen 22 may be located on the inside, and this electronic device 2 may be an internal folding screen mobile phone.

[0097] and Figure 3 The difference is that, Figure 4 As shown, the electronic device 2 may be a straight-screen mobile phone, and the display screen 22 may include a rigid cover plate and a display panel that fit together. Figure 4 The difference is that, Figure 5 As shown, the electronic device 2 may be a tablet computer.

[0098] like Figure 6 As shown, the electronic device 2 may be a notebook computer, and the electronic device 2 may include a screen portion and a keyboard portion, the structural member 21 may be a housing of the screen portion, and the display screen 22 may include a rigid cover plate and a display panel that fit together. Figure 6 The difference is that, Figure 7 As shown, the electronic device 2 may be a smart screen, the structural member 21 may include a middle frame, and the display screen 22 may be mounted on the middle frame. The display screen 22 may include a rigid cover plate and a display panel that fit together.

[0099] like Figure 8 As shown, the electronic device 2 may be a smart bracelet, the structural member 21 may include a bracket, and the display screen 22 may be mounted on the bracket. The display screen 22 may include a rigid cover plate and a display panel that fit together. Figure 8 The difference is that, Fig. 9 As shown, the electronic device 2 may be a smart watch, the structural member 21 may include a watch case, and the display screen 22 may be mounted on the watch case.

[0100] like Fig.10 As shown, the electronic device 2 may be VR glasses or MR glasses, the structural member 21 may include a frame, the head display device 23 may be mounted on the frame, the display screen 22 may be disposed in the head display device 23, and it may be considered that the display screen 22 is also mounted on the frame. The display screen 22 may include a rigid cover plate and a display panel that fit together. When the electronic device 2 is MR glasses, the head display device 23 may also have a built-in camera and / or other sensors.

[0101] The display panel according to the embodiment of the present application will be described in detail below.

[0102] Fig.11aFIG. 1 is a schematic diagram of a partial cross-sectional structure of a display panel 3 of Embodiment 1. The display panel 3 may be a Tandem OLED display panel. Fig.11a As shown, the display panel 3 may include a substrate 30, TFT311, TFT 312 and TFT313, anodes 321, 322 and 323, a PDL 33, a hole functional layer 34, a light-emitting layer 35a, an organic connecting layer 36, a light-emitting layer 37a, an electronic functional layer 38, a cathode 39, a CPL 310 and an encapsulation layer 320.

[0103] Understandably, Fig.11a It only illustrates the positional relationship of each material layer, and does not limit whether each material layer is directly connected. Fig.11a The material layers shown are not all the material layers of the display panel 3. As required, the display panel 3 may further include other laminated layers, such as a touch layer formed on the encapsulation layer 320, and a polarizer formed on the touch layer. In another embodiment, the display panel 3 may not have the polarizer, and the display panel 3 may be manufactured using a technology of forming a color filter on encapsulation (COE) on the encapsulation layer.

[0104] The substrate 30 includes but is not limited to a hard glass substrate, a flexible substrate, a silicon substrate, etc., which can drive the light-emitting layer to emit light. Among them, the flexible substrate includes but is not limited to a substrate that can be bent, folded or arbitrarily changed in shape, such as polyimide (PI) and fabric. The silicon substrate includes but is not limited to a single crystal silicon wafer, etc.

[0105] A TFT array layer 31a may be formed on the substrate 30. The TFT array layer 31a may include a plurality of TFTs arranged in an array. Fig.11a The TFT 311, TFT 312 and TFT 313 are shown. Each TFT is used to drive one sub-pixel.

[0106] An anode array layer 32a may be formed on the TFT array layer 31a. The anode array layer 32a includes a plurality of anodes arranged in an array, such as Fig.11a The anode 321, anode 322 and anode 323 are shown. Each anode can be made of inorganic or metal materials, such as indium tin oxide (ITO), titanium (Ti), silver (Ag), aluminum (Al), etc. Each anode can generate holes under an applied driving voltage, and the holes from the anode will move to the light-emitting layer under the driving of the applied driving voltage.

[0107] like Fig.11aAs shown, PDL 33 can be formed between each anode to isolate each anode. No isolation structure such as isolation groove or isolation column is provided on PDL 33. The area between any two anodes of PDL 33 presents a flat structure, and the surface of the area is continuous without protrusions or grooves.

[0108] The flat structure can be combined with Fig.11b Describe geometrically. Fig.11b The schematic microstructure of the stack from the anode to the cathode 39 between the adjacent anodes 321 (or first anode) and 322 (or second anode) can be shown. Fig.11b As shown, between the anode 321 and the anode 322, the PDL 33 may be in the shape of a water drop, and its slope angle a may be defined: a tangent line L0 of the arc surface 33a is made through the intersection of the arc surface 33a of the PDL 33 and the top surface 31b of the anode, and the acute angle formed by the tangent line L0 and the top surface 31b is called the slope angle a. For the portion of the cathode 39 located between the adjacent anodes 321 and 322: the acute angle formed by the line connecting any two points in the surface 39a of the cathode 39 facing the PDL 33 and the top surface 31b is less than or equal to the slope angle a, for example, the acute angle b formed by the line L1 and the top surface 31b is less than the slope angle a; the acute angle formed by the line connecting any two points in the surface 39b of the cathode 39 facing away from the PDL 33 and the top surface 31b is less than or equal to the slope angle a, for example, the acute angle c formed by the line L2 and the top surface 31b is less than the slope angle a. Fig.11b Only the case where the acute angle formed by the connecting line and the top surface 31b is smaller than the slope angle a is listed. It is easy to understand that there is such a connecting line, the acute angle formed by the connecting line and the top surface 31b is equal to the slope angle a.

[0109] In this embodiment, since no isolation structure is provided on the PDL 33, the hole functional layer 34, the organic connection layer 36, the electronic functional layer 38, the cathode 39 and the CPL 310 are all continuous films without any local disconnection. The hole functional layer 34, the organic connection layer 36, the electronic functional layer 38, the cathode 39 and the CPL 310, which are continuously extended and all regions of which are interconnected, can be referred to as common layers.

[0110] like Fig.11aAs shown, the hole functional layer 34 can be located above the anode array layer 32a and the PDL 33. The hole functional layer 34 may include a hole injection layer (hole injection layer, HIL), a hole transport layer (hole transport layer, HTL) and an electron blocking layer, and the anode array layer 32a, the hole injection layer, the hole transport layer and the electron blocking layer can be stacked in sequence. The hole injection layer can smoothly inject holes from each anode into the hole transport layer. The material of the hole transport layer can be an aromatic amine material, such as HTC01, etc., and the hole transport layer can transport holes to the light-emitting layer. The electron blocking layer is used to block electrons from entering the hole transport layer. In this embodiment, the hole functional layer 34 can be an organic conducting-surface (OCS) structure. In other embodiments, as needed, the hole functional layer 34 may not have an electron blocking layer.

[0111] like Fig.11a As shown, the hole function layer 34, the light emitting layer 35a, the organic connection layer 36, the light emitting layer 37a, the electron function layer 38, the cathode 39 and the CPL 310 may be sequentially stacked.

[0112] The light-emitting layer 35a and the light-emitting layer 37a are connected in series through an organic connecting layer 36, thereby forming a series OLED structure of two light-emitting layers. It can be understood that this is only an example, and the first embodiment does not limit the number of series layers of the light-emitting layer. For example, the light-emitting layer can also be three or more layers, and any two light-emitting layers are connected in series through an organic connecting layer 36.

[0113] In the first embodiment, the light-emitting layer may include a plurality of light-emitting units arranged in an array according to a certain rule, and these light-emitting units include but are not limited to red light-emitting units (R), green light-emitting units (G), blue light-emitting units (B), white light-emitting units (W), and yellow light-emitting units (Y). For example, the light-emitting layer 35a includes a red light-emitting unit 351, a green light-emitting unit 352, and a blue light-emitting unit 353, and the light-emitting layer 37a includes a red light-emitting unit 371, a green light-emitting unit 372, and a blue light-emitting unit 373. The red light-emitting unit may be formed by mixing a main material and a red light-emitting material dopant, the green light-emitting unit may be formed by mixing a main material and a green light-emitting material dopant, and the blue light-emitting unit may be formed by mixing a main material and a blue light-emitting material dopant.

[0114] There may be gaps between the red light emitting unit (R), the green light emitting unit (G) and the blue light emitting unit (B), or they may overlap and be connected. It is understood that Fig.11aThe red light emitting unit (R), the green light emitting unit (G) and the blue light emitting unit (B) are arranged in sequence along the x-axis. This is just an example. In fact, the arrangement of sub-pixels can be set as needed, and the first embodiment does not limit it. For example, multiple adjacent light emitting units in a certain area can emit the same color light or different color light.

[0115] like Fig.11a As shown, the height of the red light emitting unit can be greater than the height of the green light emitting unit, and the height of the green light emitting unit can be greater than the height of the blue light emitting unit. For example, the height of the red light emitting unit 351 can be greater than the height of the green light emitting unit 352, and the height of the green light emitting unit 352 can be greater than the height of the blue light emitting unit 353. The height refers to the size of the light emitting unit along the z-axis direction, or is called the thickness. The heights of the red light emitting unit (R), the green light emitting unit (G), and the blue light emitting unit (B) are reduced in sequence, and a microcavity structure can be constructed for the red light emitting unit (R), the green light emitting unit (G), and the blue light emitting unit (B), respectively. The microcavity structure can produce a microcavity effect to increase the light extraction rate of the OLED, and improve the luminous efficiency and brightness of the OLED.

[0116] In other embodiments, different from the first embodiment, the height relationship between the red light emitting unit (R), the green light emitting unit (G) and the blue light emitting unit (B) may not be limited. Fig.11c In the display panel 3' shown, the heights of the light-emitting units in each light-emitting layer can be consistent or substantially consistent. For example, the heights of the red light-emitting unit 351, the green light-emitting unit 352, and the blue light-emitting unit 353 in the light-emitting layer 35a can be consistent or substantially consistent. In addition, the light-emitting layer in the display panel 3' can also be three or more layers, for example Fig.11c Light-emitting layers such as the light-emitting layer 35 a , the light-emitting layer 37 a , and the light-emitting layer 330 a are shown, and any two light-emitting layers are connected in series via an organic connecting layer 36 .

[0117] In the first embodiment, the light-emitting layer may further include a primer layer, on which the light-emitting units are formed, for example, the red light-emitting unit 351, the green light-emitting unit 352 and the blue light-emitting unit 353 in the light-emitting layer 35a are all formed on the primer layer. The primer layer is used to adjust the microcavities of different light colors.

[0118] In the first embodiment, the organic connection layer 36 has the functions of charge generation, charge transport and charge injection into the light-emitting layer, and the charge includes electrons and holes, the same below. The organic connection layer 36 has a very small thickness of nanometer level, and its thickness can be less than or equal to 300nm, such as 2nm, 10nm, 50nm, 100nm, 300nm, etc. The organic connection layer 36 is essentially an organic nano film, which can include at least one of an organic conducting surface (OCS) and an organic-inorganic hybrid conducting surface (OIHCS). Among them, according to the conduction characteristics, the organic conducting surface is divided into an N-type conducting surface, a P-type conducting surface and a bipolar conducting surface. The electron mobility of the N-type conductive surface is much greater than that of the P-type conductive surface, and it only conducts electrons on the surface, such as the hole blocking layer, electron transport layer, N-CGL, and intermediate layer described below; the hole mobility of the P-type conductive surface is much greater than the electron mobility, and it only conducts holes on the surface, such as the P-CGL, hole injection layer, and hole transport layer described below; the electron mobility and hole mobility of the bipolar conductive surface are equivalent, and it can conduct both electrons and holes on the surface, such as the intermediate layer. The evaluation indicators of organic conductive surfaces can include the conductive surface square resistance and longitudinal mobility; and for N-CGL and P-CGL, the evaluation indicators of charge generation ability can be added as an additional factor.

[0119] Organic conductive surfaces and organic-inorganic hybrid conductive surfaces can be modified by doping to adjust the lateral square resistance, longitudinal mobility and charge generation capacity. By adjusting the above characteristics, lateral crosstalk can be improved, and the specific principle will be explained below.

[0120] In the first embodiment, Fig.12 As shown, the organic connection layer 36 may include, for example, a hole blocking layer 360, an electron transport layer 361, an N-type CGL 362, a P-type CGL 363, a hole injection layer 364, a hole transport layer 365, and an electron blocking layer 366 stacked in sequence. Fig.12 and Fig.11a As shown, the hole blocking layer 360 may be close to the light emitting layer 35a, and the electron blocking layer 366 may be close to the light emitting layer 37a.

[0121] The hole blocking layer 360 blocks holes in the light-emitting layer 35a from entering the electron transport layer 361 to prevent carrier quenching. The electron transport layer 361 transports electrons to the red light-emitting unit 351, the green light-emitting unit 352 and the blue light-emitting unit 353 near the anode.

[0122] Under an external driving voltage, holes and electrons are generated at the interface of the N-type CGL 362 and the P-type CGL 363. The function of the N-type CGL 362 is to transport electrons at the interface of the N-type CGL 362 and the P-type CGL 363 to the adjacent electron transport layer 361. The function of the P-type CGL 363 is to transport holes at the interface of the N-type CGL 362 and the P-type CGL 363 to the adjacent hole injection layer 364 or hole transport layer 365.

[0123] In the first embodiment, the N-type CGL 362 and the P-type CGL 363 constitute a two-layer CGL. In other embodiments, there may be an interlayer between the N-type CGL 362 and the P-type CGL 363, the interlayer connecting the N-type CGL 362 and the P-type CGL 363, and the interlayer may play a bridging role to reduce the potential barrier between the N-type CGL 362 and the P-type CGL 363. The interlayer may be a single-layer structure; or a multi-layer structure, such as a two-layer or more structure. When the interlayer is a single-layer structure, the N-type CGL 362, the interlayer and the P-type CGL 363 may constitute a three-layer CGL; when the interlayer is a multi-layer structure, the N-type CGL 362, the interlayer and the P-type CGL 363 may constitute a multi-layer CGL.

[0124] The hole injection layer 364 is used to transfer the holes transferred from the P-type CGL 363 to the hole transport layer 365 .

[0125] The hole transport layer 365 is used to transfer the holes transferred from the P-type CGL 363 or the hole injection layer 364 to the light emitting unit.

[0126] The electron blocking layer 366 is used to block electrons in the light emitting layer 37 a from entering the hole transporting layer 365 .

[0127] Different from the first embodiment, in other embodiments, the organic connection layer may not have any one or more of the hole blocking layer 360, the electron transport layer 361, the hole injection layer 364, the hole transport layer 365, and the electron blocking layer 366. For example, the organic connection layer may include the electron transport layer 361, the N-type CGL 362, the P-type CGL 363, and the hole transport layer 365, without the hole blocking layer 360 and the hole injection layer 364. Alternatively, the organic connection layer may include the N-type CGL 362 and the P-type CGL 363, without the hole blocking layer 360, the electron transport layer 361, the hole injection layer 364, and the hole transport layer 365.

[0128] In the first embodiment, the material of the organic connection layer 36 includes a main material and a doping material doped in the main material. Through doping modification, the organic connection layer 36 can have an ultra-high lateral square resistance, for example, the square resistance in any lateral direction can be greater than or equal to 1GΩ / □, such as 1GΩ / □, 10GΩ / □, 50GΩ / □, 196GΩ / □, etc. The organic connection layer 36 with high lateral square resistance can greatly improve lateral crosstalk.

[0129] In one embodiment, the N-type CGL 362 is doped and modified. The material of the N-type CGL 362 includes an N-type main material and an N-type doping material.

[0130] Among them, the N-type host material can be an organic aromatic material, such as an organic material containing pyridine, pyrazine, pyrimidine, triazine, imidazole, phenyl, naphthyl, anthracenyl, phenanthryl, pyrene and the like. Or the N-type host material can be an organic material containing deuterium, tritium, N 15 Isotope-substituted organic materials, such as TmPyPB (1,3,5-tris(3-pyridyl-3-phenyl)benzene), Bphen (4,7-diphenyl-1,10-phenanthroline), TPBi (1,3,5-tris(1-phenyl-1H-benzimidazol-2-yl)benzene) and other organic materials.

[0131] The N-type doping material may include metal materials with a work function of ≤3.5 eV such as ytterbium (Yb), lithium (Li), samarium (Sm), barium (Ba), cesium (Cs) or calcium (Ca), or may include lithium oxide (Li 2 O), lithium carbonate (Li 2 CO 3 ), cesium oxide (Cs 2 O), cesium carbonate (Cs 2 CO 3 ) or other metal oxide materials with a work function ≤3.5eV, or may include Liq (8-hydroxyquinoline-lithium), Libpp (2-(2',2"-bipyridine-6'-yl)-phenol-based lithium) or other organic materials with a work function ≤3.5eV or organic-metal complex materials with a work function ≤3.5eV. The doping concentration of the N-type doping material may be less than or equal to 100%, for example, 0% to 3%, and illustratively may be 0.5%.

[0132] In the first embodiment, the material selection of the N-type main material and the N-type doping material are independent of each other. According to needs, any N-type doping material can be doped into any N-type main material.

[0133] In the first embodiment, when the N-type doping material is an organic material, the N-type CGL 362 formed by doping can be called an organic conductive surface. When the N-type doping material is an inorganic material, the N-type CGL 362 formed by doping can be called an organic-inorganic hybrid conductive surface.

[0134] In one embodiment, the P-type CGL 363 is doped and modified. The material of the P-type CGL 363 includes a P-type main material and a P-type doping material.

[0135] Among them, the P-type main material includes organic aromatic materials, such as organic materials containing primary amine groups, secondary amine groups, tertiary amine groups, quaternary ammonium groups, phenyl groups, naphthyl groups, anthracene groups, phenanthryl groups, pyrenyl groups, fluorene groups, spirofluorene groups and the like. Or the P-type main material can be organic materials containing the above-mentioned groups of deuterium, tritium, N 15 Isotope-substituted organic materials, such as TAPC (4-[1-[4-[di(4-methylphenyl)amino]phenyl]cyclohexyl]-N-(3-methylphenyl)-N-(4-methylphenyl)aniline), NPB (N,N'-diphenyl-N,N'-(1-naphthyl)-1,1'-biphenyl-4,4'-diamine), TCTA (4,4',4'-tris(carbazole-9-yl)triphenylamine) and other organic materials.

[0136] Among them, the P-type doping material may include an organic material with a deep LUMO (lowest unoccupied molecular orbital) energy level, for example, a LUMO energy level ≤-3.0 eV. The P-type doping material may specifically include organic materials such as NDP-9 (4-({2,3-bis[cyano(4-cyano-2,3,5,6-tetrafluorophenyl)methylidene]cyclopropylidene}(cyano)methyl)-2,3,5,6-tetrafluorobenzene-1-carbonitrile), HAT-CN (2,3,6,7,10,11-hexacyano-1,4,5,8,9,12-hexaazatriphenylene), F4-TCNQ (tetrafluoro-tetracyanoquinodimethane). Or the P-type doping material may include an inorganic material with a work function ≥3.0 eV, such as indium tin oxide (ITO), molybdenum trioxide (MoO 3 ), vanadium pentoxide (V 2 O 5 ), ferric chloride (FeCl 3 ), tungsten trioxide (WO 3 ), rhenium trioxide (ReO 3 ) etc. The doping concentration of the P-type doping material may be less than or equal to 100%, for example, 0% to 20%, and illustratively may be 1%.

[0137] In the first embodiment, the material selection of the P-type main material and the P-type doping material are independent of each other. According to needs, any P-type doping material can be doped into any P-type main material.

[0138] In the first embodiment, when the P-type doping material is an organic material, the P-type CGL 363 formed by doping can be called an organic conductive surface. When the P-type doping material is an inorganic material, the P-type CGL 363 formed by doping can be called an organic-inorganic hybrid conductive surface. In the first embodiment, the N-type CGL 362 or the P-type CGL 363 can be doped and modified, or the N-type CGL 362 and the P-type CGL 363 can be doped and modified at the same time.

[0139] In summary, the organic connection layer 36 may contain at least one of an organic conductive surface and an organic-inorganic hybrid conductive surface. The principle of making the organic connection layer 36 have a high lateral square resistance through doping modification will be described below.

[0140] It has been explained above that the organic connecting layer 36 may include an organic conductive surface. The organic conductive surface is essentially an organic nanofilm with an extremely small thickness (for example, the thickness may be less than or equal to 100 nm). Unlike inorganic materials such as metals or semiconductors, the organic conductive surface has a hyper square resistance (HSR) characteristic, that is, as the film thickness of the organic conductive surface decreases, its lateral square resistance changes, generally showing a sharp increase, and the change characteristics of the lateral square resistance with the film thickness do not conform to the resistivity formula R = ρ*L / S, wherein ρ is the resistivity of the material making the resistor, L is the length of the wire wound into the resistor, S is the cross-sectional area of ​​the wire wound into the resistor, and R is the resistance value.

[0141] The super square resistance characteristics of the organic conductive surface can be intuitively seen from the following Tables 1 and 2. Tables 1 and 2 show the measured test current (the third column of the table), the real square resistance calculated according to R=U / I (the fourth column of the table), and the square resistance calculated according to the resistivity formula (the fifth column of the table) for different device structures derived from reference SID 2022DIGEST,877-880 at the same test voltage of 20V. Among them, from NO.5 to NO.1 in Table 1, the film thickness of the organic conductive surface in each device structure decreases successively; from NO.9 to NO.6 in Table 2, the film thickness of the organic conductive surface in each device structure decreases successively; the data in the column of the real square resistance calculation result of each row in Table 1 is expressed by the ratio of the real square resistance calculation result of each row to the real square resistance calculation result of NO.5 (taking the real square resistance calculation result of NO.5 as the benchmark 100%), and the data in the column of the resistivity formula calculation result in Table 1 is also subjected to the same benchmark processing; the data in the column of the real square resistance calculation result of each row in Table 2 is expressed by the ratio of the real square resistance calculation result of each row to the real square resistance calculation result of NO.9 (taking the real square resistance calculation result of NO.9 as the benchmark 100%), and the data in the column of the resistivity formula calculation result in Table 2 is also subjected to the same benchmark processing.

[0142] Table 1: Calculation results of the square resistance of the organic conductive surface of device structures 1 to 5

[0143]

[0144] Table 2: Calculation results of the square resistance of the organic conductive surface of device structures 6 to 9

[0145]

[0146] The mechanism by which organic conducting surfaces have super-square resistance characteristics can be explained by the hypothesis of carrier transport along molecular orbitals and the difference in carrier transport on the surface and inside of organic conducting surfaces.

[0147] As a comparison, the carrier transport characteristics in a nanofilm composed of metal, namely, a metal conducting-surface (MCS), are first explained. Fig.13 1 is a schematic diagram illustrating the principle of the super-square resistance characteristics of the organic conductive surface, wherein the pixel definition layer gap (PDL gap) (such as 20 um) and the film thickness of the organic conductive surface = 10 nm are set as an example. Fig.13As shown in the figure, for the surface and interior of the metal conductor, since the diameter of the metal molecule is less than 0.5nm (such as the radius of the Ag atom is 0.144nm), the metal molecules are densely packed, and the metal molecules are connected to each other through strong metal bonds, the connection is relatively tight, the difference in the transmission behavior of the carrier inside the film and on the surface of the film is small, and the transmission capacity is the same, so that the carrier can quickly pass through the metal nanofilm in the horizontal direction, and the carrier will be transmitted along the shortest path, and the transmission path of the carrier is approximately equal to the minimum distance between the positive and negative electrodes. Therefore, when the metal conductor transmits carriers in the horizontal direction, it follows the resistivity formula R = ρ * L / S, and there is no super square resistance phenomenon.

[0148] like Fig.14 As shown in the figure, for organic conductive surfaces, since organic molecules are irregular and have large molecular diameters (reaching the same nanometer level as organic conductive surfaces), the intermolecular forces are weaker than covalent bonds, metal bonds, and ionic bonds. Since there are a large number of benzene rings and conjugated double bond structures in the organic materials that make up OLEDs, there are many π-π stacking phenomena between molecules, and carriers can easily be transmitted between different molecules through these π bonds with delocalized characteristics. Since the stacking of molecules in organic materials is disordered when forming films, the π-π stacking between molecules is also disordered, resulting in disordered transmission channels. Based on this disorder, and the fact that the transmission channels of carriers on the surface of organic conductive surfaces have two-dimensional characteristics, and the carriers inside organic conductive surfaces have three-dimensional characteristics, it can be concluded that for the surface of organic conductive surfaces, the intermolecular interactions such as π-π stacking are weak, the transmission channels are few, and the transmission performance is poor; for the inside of organic conductive surfaces, the intermolecular interactions such as π-π stacking are strong, the transmission channels are many, and the transmission performance is better than that of organic conductive surfaces. The closer to the surface of the organic conductive surface, the worse the transmission characteristics are. The surface of the organic conductive surface has the worst transmission characteristics. Therefore, the thinner the organic conductive surface, the higher the proportion of carrier transmission on the film surface, the higher the impedance increase, and thus the super-square resistance phenomenon occurs. According to this hypothesis, the larger the orbital size of the highest occupied molecular orbital (HOMO) and the lowest unoccupied molecular orbital (LUMO), the weaker the intermolecular interaction force such as π-π stacking, and the thinner the organic conductive surface, the easier it is to have super-square resistance characteristics.

[0149] As a control, Fig.15As shown, for an organic-inorganic hybrid conductive surface, if 5% by weight of metal Yb or Li is doped into an organic molecule with a molecular weight of about 800Da to prepare an organic-inorganic hybrid conductive surface with a thickness of 10nm, for the surface of the organic-inorganic hybrid conductive surface: because inorganic materials with small molecular weight such as metals fill the gaps between organic molecules, the carrier transmission channels are increased, the surface transmission capacity is greatly enhanced, and the difference with the transmission capacity inside the organic-inorganic hybrid conductive surface is reduced; for the inside of the organic-inorganic hybrid conductive surface: because inorganic materials with small molecular weight such as metals fill the gaps between organic molecules, the internal transmission path is shortened and the internal transmission capacity is enhanced. Therefore, when the doping concentration of inorganic materials with small molecular weight and good transmission performance is reduced, the square resistance of the organic-inorganic hybrid conductive surface will increase significantly, and the super square resistance phenomenon will be more obvious, and the organic conductive surface can also be explained by the same mechanism.

[0150] In the first embodiment, by performing doping modification, the longitudinal mobility of the N-type CGL 362 and the P-type CGL 363 can be similar, for example, the difference between the two can be within 10 times, thereby making the organic connection layer 36 have a higher longitudinal mobility, which is beneficial to reduce the driving voltage and save power consumption. For example, the driving voltage can be reduced by 0.2V to 0.5V. Schematically, the longitudinal mobility of the organic connection layer 36 can reach 10 -6 cm 2 / (V·S)~10 -1 cm 2 / (V·S), e.g. 10 -6 cm 2 / (V·S),10 -3 cm 2 / (V·S), 10 -1 cm 2 / (V·S), etc.

[0151] In the first embodiment, the CGL in the organic connection layer 36 can also have a better charge generation capability through doping modification. For example, under an electric field of 8V, the current density of a single charge generation layer device can reach 100mA / cm 2 Improving the charge generation capability is beneficial to improving the current efficiency (for example, the current efficiency can be improved by 3% to 5%), reducing the driving voltage (for example, the driving voltage can be reduced by 0.2V to 0.5V), and improving the lifespan (for example, the lifespan is improved by 20%).

[0152] In the first embodiment, the electronic functional layer 38 may include a hole blocking layer, an electron transport layer (ETL) and an electron injection layer (EIL), and the hole blocking layer, the electron transport layer, the electron injection layer and the cathode 39 may be stacked in sequence. The hole blocking layer is used to block holes from entering the electron transport layer from the light-emitting layer. The electron injection layer can smoothly inject electrons from the cathode 39 into the electron transport layer, and the electron transport layer can transfer electrons to the light-emitting layer. In this embodiment, the electronic functional layer 38 may be an organic conductive surface structure. In other embodiments, as needed, the electronic functional layer 38 may not have a hole blocking layer and / or an electron injection layer.

[0153] In the first embodiment, the material of the electron transport layer can be an organic aromatic material, such as an organic material containing pyridine, pyrazine, pyrimidine, triazine, imidazole, phenyl, naphthyl, anthracenyl, phenanthryl, pyrene and the like, or the material of the electron transport layer can be an organic material containing deuterium, tritium, N 15 Organic materials with isotope substitution, such as TmPyPB (1,3,5-tris(3-pyridyl-3-phenyl)benzene), Bphen (4,7-diphenyl-1,10-phenanthroline), TPBi (1,3,5-tris(1-phenyl-1H-benzimidazol-2-yl)benzene), etc. The material of the electron injection layer can be lithium fluoride (LiF), ytterbium (Yb), etc.

[0154] The cathode 39 may include an electron injection layer and a metal cathode, wherein the electron injection layer, the metal cathode and the CPL 310 are stacked in sequence. Alternatively, the cathode 39 may include an electron injection layer and an alloy cathode, wherein the electron injection layer, the alloy cathode and the CPL 310 are stacked in sequence. The material of the electron injection layer may be, for example, ytterbium (Yb), lithium (Li), lithium fluoride (LiF), 8-hydroxyquinoline lithium (LiQ), calcium (Ca), cesium (Cs) or lithium oxide (LiO). 2 O), etc. The material of the metal cathode may be, for example, silver (Ag), magnesium (Mg), aluminum (Al), gold (Au), etc., and the material of the alloy cathode may be, for example, an alloy of silver (Ag), magnesium (Mg), aluminum (Al), gold (Au), etc.

[0155] like Fig.11a As shown, in the first embodiment, the cathode 39 can generate electrons under an external driving voltage, and the electrons from the cathode 39 will move toward the light-emitting layer under the driving of the external driving voltage. In some embodiments, the cathode 39 can have the function of the electron injection layer in the above-mentioned electronic functional layer 38, and in this case, there may be no electron injection layer in the electronic functional layer 38.

[0156] CPL 310 is formed on cathode 39. CPL 310 may be made of a material having light refraction and light extraction effects, such as lithium fluoride (LiF). CPL 310 may be used to improve light extraction efficiency, and may also be used to adjust light extraction efficiency and select a spectrum. In some embodiments, CPL 310 may be absent.

[0157] The encapsulation layer 320 may be formed on the CPL 310, and the encapsulation layer 320 may encapsulate the CPL 310, the cathode 39, the electronic functional layer 38, the light-emitting layer 37a, the organic connection layer 36, the light-emitting layer 35a, the hole functional layer 34, the PDL 33, the anode array layer 32a, and the TFT array layer 31a. The encapsulation layer 320 may be a flexible encapsulation, such as any one or a combination of encapsulation forms such as chemical vapor deposition (CVD), thin film encapsulation (TFE), and atomic layer deposition (ALD). The encapsulation layer 320 may also be a rigid encapsulation, such as glass glue (Frit) + glass cover plate encapsulation.

[0158] The following will take the red light emitting unit 351 and the red light emitting unit 371 as examples to explain the light emitting principle of the sub-pixels in the display panel 3. The light emitting principles of other light emitting units are the same.

[0159] refer to Fig.11a As shown, when a driving voltage is applied between the cathode 39 and the anode 321, electrons from the cathode 39 will be injected into the electron functional layer 38 and transported therein, and holes from the anode 321 will be injected into the hole functional layer 34 and transported therein. Under the action of the driving voltage, in the CGL of the organic connection layer 36, carriers will transition between different molecular orbitals under the action of the electric field, thereby generating electrons in new molecular orbitals and transmitting them to the adjacent electron transport layer 361, and generating holes in the old molecular orbitals and transmitting them to the adjacent hole injection layer 364 or hole transport layer 365. Holes from the anode 321 and electrons from the electron transport layer 361 meet in the red light emitting unit 351 and recombine to form excitons, which radiatively transition back to the ground state and emit red light. The electrons from the cathode 39 and the holes from the hole injection layer 364 or the hole transport layer 365 meet and recombine into excitons in the red light emitting unit 371, and the excitons radiatively transition back to the ground state and emit red light. Thus, the red light emitting unit 351 and the red light emitting unit 371 can emit red light. The red light can be emitted upward from the side of the CPL 310 (this is a top emission structure), or can be emitted downward from the side of the substrate 30 (this is a bottom emission structure).

[0160] The principle of how the high lateral square resistance of the organic connection layer 36 can improve the lateral crosstalk will be described below.

[0161] Fig.16 3 shows a simple connection circuit of sub-pixels in the display panel 3, which can be used as a model for analyzing the lateral crosstalk of TandemOLED. Fig.16 As shown, the light-emitting unit 3a and the light-emitting unit 3b in a sub-pixel are connected in series to form a TandemOLED. The equivalent resistance 36R corresponding to the organic connecting layer 36 is equal to the equivalent resistance 36R, so the equivalent resistance 36R is relatively large. Under the rated driving voltage, the light-emitting unit 3a and the light-emitting unit 3b can be lit, but due to the voltage division of the equivalent resistance 36R, the voltage across the light-emitting unit 3c is lower than its driving voltage, making it difficult for the light-emitting unit 3c to light up. The larger the equivalent resistance 36R, the lower the voltage across the light-emitting unit 3c, making it more difficult for the light-emitting unit 3c to light up. Therefore, the risk of lateral crosstalk between the light-emitting unit 3a and the light-emitting unit 3b and the light-emitting unit 3c is reduced. Therefore, it can be seen from Fig.16 A general conclusion is drawn from the above: the organic connection layer 36 with high lateral square resistance can improve lateral crosstalk, and the larger the lateral square resistance, the less likely it is to cause crosstalk.

[0162] The above conclusions will be verified through specific examples below.

[0163] Taking an OLED device described in reference ACS Photonics 2019, 6, 767-778 as an example, the structure of the TandemOLED device is:

[0164] Experimental sheet-R: ITO / HAT-CN (5nm) / TAPC (50nm) / TCTA (5nm) / TPB-AC: 3% Ir (dmdppr-dmp) 2 (divm) (20nm) / BmPyPB (40nm) / LiF (1nm) / Al (120nm);

[0165] Experimental sheet-G: ITO / HAT-CN (5nm) / TAPC (50nm) / TCTA (5nm) / TPB-AC: 5% Ir(ppy)2acac (20nm) / BmPyPB (40nm) / LiF (1nm) / Al (120nm);

[0166] Experimental sheet-B: ITO / HAT-CN (5nm) / TAPC (50nm) / TCTA (5nm) / TPB-AC (20nm) / BmPyPB (40nm) / LiF (1nm) / Al (120nm).

[0167] The area of ​​the experimental piece is 0.16 cm2 The IV data of the OLED device is measured as follows Fig.17 Based on this data, it can be calculated that at a current density of 0.0001 mA / cm 2 , the internal resistance of the OLED sub-pixel is shown in Table 3 under the conditions that the red sub-pixel size is 20μm×20μm, the green sub-pixel size is 20μm×30μm, and the blue sub-pixel size is 20μm×40μm.

[0168] Table 3: Estimated internal resistance of OLED sub-pixels

[0169] Sub-Pixel Red photon pixel Green sub-pixel Blue sub-pixel <![CDATA[J=0.0001mA / cm 2 Internal resistance under (unit GΩ)]]> 3076 2835 2415

[0170] The following will combine Table 3 and Fig.16 Calculate. Assume that light-emitting unit 3a and light-emitting unit 3b are two light-emitting units in the blue light TandemOLED sub-pixel, for example, light-emitting unit 3a can correspond to blue light-emitting unit 373, and light-emitting unit 3b can correspond to blue light-emitting unit 353; light-emitting unit 3c is a light-emitting unit close to the cathode side in the red light TandemOLED sub-pixel, for example, light-emitting unit 3c can correspond to red light-emitting unit 371 and green light-emitting unit 372. Take the case of turning on blue light with red light crosstalk as an example: at low brightness and low grayscale, the internal resistance of light-emitting unit 3a is 2415GΩ, and the internal resistance of light-emitting unit 3c is 3076GΩ. Since the lighting and driving voltage of blue light OLED is higher than that of red light, for example, when the voltage across light-emitting unit 3a reaches 2.50V, light-emitting unit 3a lights up (such as brightness = 0.02nit), and when the voltage across light-emitting unit 3c reaches 2.35V, light-emitting unit 3c lights up (such as brightness = 0.02nit). A voltage of 2.5 V is applied across the parallel circuit formed by the light-emitting unit 3a and the equivalent resistor 36R+the light-emitting unit 3c. When the equivalent resistance of the equivalent resistor 36R exceeds 196 GΩ, the voltage divided across the equivalent resistor 36R exceeds 0.15 V. Since the voltage across the equivalent resistor 36R+the light-emitting unit 3c is 2.5 V, the voltage divided across the light-emitting unit 3c will be less than 2.35 V. It can be concluded that the greater the square resistance of the equivalent resistor 36R, the more difficult it is to light up the light-emitting unit 3c, and the lower the risk of crosstalk.

[0171] Fig.18 The simulation curve shows the relationship between the lateral square resistance of the organic connection layer 36, the equivalent resistance 36R and the lighting voltage across the light-emitting unit 3c. Fig.18 It can be seen intuitively that as the lateral square resistance of the organic connection layer 36 increases, the driving voltage across the light-emitting unit 3c decreases to below the lighting voltage, and the light-emitting unit 3c is more difficult to light up, so the risk of lateral crosstalk is reduced.

[0172] In the first embodiment, schematically, RGB sub-pixels may be directly evaporated by a fine metal mask (FMM) method, and the colorization of the display panel 3 may be achieved by direct light emission of the RGB sub-pixels.

[0173] The display panel 3 of the first embodiment can be applied to small electronic devices such as mobile phones, tablet computers, laptop computers, smart watches, and smart bracelets.

[0174] In summary, the solution of the first embodiment, by canceling the isolation structure on the PDL, makes the PDL 33 a flat structure, can make the cathode 39 continuous and unbroken, reduce the voltage drop on the cathode 39, and reduce the power consumed by the cathode 39, thereby making the driving voltage and power consumption of the display panel 3 lower, and can also avoid abnormal pixel lighting. In addition, it can also avoid the additional addition of photomasks and photolithography processes, thereby simplifying the process and reducing costs. In addition, the reliability of the display panel 3 can also be improved. Through the doping modification of the organic connection layer 36, the lateral crosstalk can be greatly improved. Since the organic connection layer 36 does not need to be arranged following the distribution of sub-pixels, the pixel design has no effect on the design of the organic connection layer 36. Therefore, the design of improving the lateral crosstalk through the organic connection layer 36 can be applied to all Tandem OLED products, and the design has strong compatibility and can meet the needs of mass production.

[0175] Different from the first embodiment in which colorization is achieved by directly emitting light through RGB sub-pixels, the following embodiments can achieve colorization by using white light + color filter film.

[0176] Fig.19 FIG. 4 is a schematic diagram showing a partial cross-sectional structure of the display panel 4 of the second embodiment. Fig.11a As shown, the display panel 4 may include a substrate 40, TFT411, TFT 412 and TFT413, anodes 421, anodes 422 and anodes 423, a PDL 43, a hole functional layer 44, a light-emitting layer 45, an organic connecting layer 46, a light-emitting layer 47, an electronic functional layer 48, a cathode 49, a CPL 410, an encapsulation layer 420 and a first color filter film (CF) 43a.

[0177] Similar to the first embodiment, the display panel 4 of the second embodiment cancels the isolation structure on the PDL 43, making the PDL 43 a flat structure, so that the cathode 49 is continuous and unbroken, the voltage drop on the cathode 49 is reduced, and the power consumed by the cathode 39 is reduced, thereby making the driving voltage and power consumption of the display panel 4 lower, and avoiding abnormal pixel lighting. In addition, it is also possible to avoid the additional addition of photomasks and photolithography processes, thereby simplifying the process and reducing costs. In addition, the reliability of the display panel 4 can also be improved. Through the doping modification of the organic connection layer 46, the lateral crosstalk can be greatly improved. The design of improving the lateral crosstalk through the organic connection layer 46 can be applied to all Tandem OLED products, and the design has strong compatibility and can meet the needs of mass production.

[0178] Different from the first embodiment, the display panel 4 of the second embodiment can be colored by using white light + color filter film.

[0179] like Fig.19 As shown, the light-emitting layer 45 and the light-emitting layer 47 are both laterally continuous organic material layers, and the deposition of the light-emitting layer 45 or the light-emitting layer 47 can be completed by one evaporation without using the FMM process and only using the common metal mask (CMM) process. The light-emitting layer 45 and the light-emitting layer 47 can emit light of different colors respectively, and the light of the light-emitting layer 45 and the light-emitting layer 47 can be mixed to produce white light. Schematically, the light-emitting layer 45 can include a red light-emitting unit (R) and a green light-emitting unit (G), and the red light emitted by the red light-emitting unit (R) and the green light emitted by the green light-emitting unit (G) can be mixed to produce yellow light, so the light-emitting layer 45 can emit yellow light. Schematically, the light-emitting layer 47 can include a blue light-emitting unit (B), and the light-emitting layer 47 can emit blue light. The yellow light emitted by the light-emitting layer 45 can be mixed with the blue light emitted by the light-emitting layer 47 to form white light, and finally all the light-emitting layers as a whole emit white light.

[0180] like Fig.19 As shown, a first color filter film 43a can be formed on the encapsulation layer 420. The first color filter film 43a may include a plurality of first red light filter units 431, a plurality of first green light filter units 432, and a plurality of first blue light filter units 433. The first red light filter units 431, the first green light filter units 432, and the first blue light filter units 433 may be arranged in an array according to a certain rule. It can be understood that the first red light filter unit 431, the first green light filter unit 432, and the first blue light filter unit 433 are arranged in sequence along the x-axis. This is just an example. In fact, the arrangement of the filter units can be set as needed, and the second embodiment does not limit it.

[0181] refer to Fig.19As shown, the white light emitted by the entire light-emitting layer can be transmitted upward and enter the first red light filter unit 431, the first green light filter unit 432 and the first blue light filter unit 433 respectively. The first red light filter unit 431 filters the white light and emits red light, the first green light filter unit 432 filters the white light and emits green light, and the first blue light filter unit 433 filters the white light and emits blue light, thereby realizing color display of the display panel 4.

[0182] The display panel 4 of the second embodiment may adopt a top-emitting structure, and light is transmitted upward and emitted from the first color filter film 43a above the encapsulation layer 420. In other embodiments, the display panel 4 may adopt a bottom-emitting structure, and the first color filter film 43a is located below the substrate 40 (i.e., the side of the substrate 40 facing away from the light-emitting layer), and light is transmitted downward and emitted from the first color filter film 43a below the substrate 40.

[0183] The second embodiment uses white light + color filter film to achieve colorization, which is beneficial to improve the pixel density (pixels per inch, PPI) of the display panel. The display panel 4 of the second embodiment, for example, can be applied to electronic devices such as silicon-based OLED TVs or OLED TVs.

[0184] In other embodiments, other white light OLED device structures may be used as required to achieve colorization using white light + color filter film.

[0185] For example, in Example 3, refer to Fig.19 As shown, the light-emitting layer 45 can include a blue light-emitting unit (B), and the light-emitting layer 45 can emit blue light. The light-emitting layer 47 can include a red light-emitting unit (R) and a green light-emitting unit (G), and the light-emitting layer 45 can emit yellow light. The blue light emitted by the light-emitting layer 45 can be mixed with the yellow light emitted by the light-emitting layer 47 to form white light, and finally all the light-emitting layers as a whole emit white light.

[0186] Alternatively, in the fourth embodiment, a red light emitting layer, a green light emitting layer and a blue light emitting layer may be provided separately, and the three light emitting layers are stacked (not limited to stacked in sequence), and any two light emitting layers are connected in series via an organic connecting layer. The red light emitted by the red light emitting layer, the green light emitted by the green light emitting layer and the blue light emitted by the blue light emitting layer are mixed into white light, and finally all the light emitting layers emit white light as a whole.

[0187] or in Fig. 20 In the fifth embodiment shown, two blue light emitting layers and one yellow light emitting layer can be provided, and white light is generated by mixing the blue light and the yellow light. Fig. 20As shown, the display panel 5 of the fifth embodiment may include a substrate 50, TFT511, TFT512 and TFT513, anodes 521, 522 and 523, PDL 53, hole functional layer 54, light emitting layer 55, organic connection layer 56, light emitting layer 57, organic connection layer 58, light emitting layer 59, electronic functional layer 510, cathode 520, CPL530, encapsulation layer 540 and a first color filter film 55a. The first color filter film 55a may include a plurality of first red light filter units 551, a plurality of first green light filter units 552 and a plurality of first blue light filter units 553.

[0188] like Fig. 20 As shown, the light-emitting layer 55 may include a blue light-emitting unit (B), and the light-emitting layer 55 may emit blue light. The light-emitting layer 57 may include a red light-emitting unit (R) and a green light-emitting unit (G), and the light-emitting layer 57 may emit yellow light. The light-emitting layer 59 may include a blue light-emitting unit (B), and the light-emitting layer 59 may emit blue light. Finally, all the light-emitting layers as a whole emit white light. It can be understood that the arrangement order of the light-emitting layer 55-the light-emitting layer 57-the light-emitting layer 59 is only an example. In fact, the arrangement order of each light-emitting layer can be set as needed, and the fifth embodiment does not limit it.

[0189] In the Tandem OLED, since the efficiency of the organic light emitting layer in emitting blue light is low, it is difficult to emit blue light. Therefore, in the fifth embodiment, an additional light emitting layer emitting blue light is provided to improve the light extraction efficiency of blue light.

[0190] Or in another embodiment, the first light-emitting layer and the second light-emitting layer can be provided separately, and the first light-emitting layer and the second light-emitting layer can be provided in a stacked manner. The first light-emitting layer can include a red light-emitting unit (R), and the first light-emitting layer can emit red light; the second light-emitting layer can include a green light-emitting unit (G) and a blue light-emitting unit (B), and the second light-emitting layer can emit cyan light, and finally all the light-emitting layers as a whole emit white light.

[0191] Alternatively, in another embodiment, the first light-emitting layer and the second light-emitting layer may be provided separately, and the first light-emitting layer and the second light-emitting layer may be provided in a stacked manner. The first light-emitting layer may include a green light-emitting unit (G), and the first light-emitting layer may emit green light; the second light-emitting layer may include a red light-emitting unit (R) and a blue light-emitting unit (B), and the second light-emitting layer may emit magenta light, and finally all the light-emitting layers as a whole may emit white light.

[0192] It is understandable that the above only exemplifies some white light OLED device structures. In the embodiments of the present application, different white light OLED device structures can be set as needed, and these white light OLED device structures meet the following design: among the multiple light-emitting layers, at least two light-emitting layers can emit light of different colors respectively, and the light emitted by all the light-emitting layers can be mixed into white light, and finally all the light-emitting layers emit white light as a whole.

[0193] Different from the above-mentioned embodiment that uses white light + color filter film to achieve colorization, the sixth embodiment can use blue light + color conversion layer to achieve colorization.

[0194] Fig.21 FIG. 4 is a schematic diagram showing a partial cross-sectional structure of a display panel 6 according to Embodiment 6. Fig.21 As shown, the display panel 6 may include a substrate 60, TFT 611, TFT 612 and TFT 613, anodes 621, 622 and 623, PDL 63, hole functional layer 64, light emitting layer 65, organic connection layer 66, light emitting layer 67, light emitting layer 68, electronic functional layer 69, cathode 610, CPL 620, encapsulation layer 630 and color change layer (color change layer, CCL) 64a. Among them, the light emitting layer 65, the light emitting layer 67 and the light emitting layer 68 are stacked in sequence, and two adjacent light emitting layers are connected in series through an organic connection layer 66.

[0195] Similar to the second embodiment, the display panel 6 of the sixth embodiment cancels the isolation structure on the PDL 63, making the PDL 63 a flat structure, so that the cathode 610 is continuous and unbroken, the voltage drop on the cathode 610 is reduced, and the power consumed by the cathode 610 is reduced, thereby making the driving voltage and power consumption of the display panel 6 lower, and avoiding abnormal pixel lighting. In addition, it is also possible to avoid the additional addition of photomasks and photolithography processes, thereby simplifying the process and reducing costs. In addition, the reliability of the display panel 6 can also be improved. Through doping modification, the organic connection layer 66 becomes an organic conductive surface. Through the doping modification of the organic connection layer 66, the lateral crosstalk can be greatly improved. The design of improving lateral crosstalk through the organic connection layer 66 can be applied to all Tandem OLED products, and the design has strong compatibility and can meet the needs of mass production.

[0196] Different from the second embodiment, the display panel 6 of the sixth embodiment can be colored by using a blue light+color conversion layer method.

[0197] like Fig.21 As shown, the light-emitting layer 65, the light-emitting layer 67 and the light-emitting layer 68 all include a blue light-emitting unit (B), and the light-emitting layer 65, the light-emitting layer 67 and the light-emitting layer 68 can all emit blue light, and finally all the light-emitting layers as a whole emit blue light.

[0198] like Fig.21 As shown, a color conversion layer 64a can be formed on the encapsulation layer 630. The color conversion layer 64a can include a plurality of red light conversion units 641, a plurality of green light conversion units 642, and a plurality of blue light conversion units 643. The red light conversion units 641, the green light conversion units 642, and the blue light conversion units 643 can be arranged in an array according to a certain rule. It can be understood that the red light conversion unit 641, the green light conversion unit 642, and the blue light conversion unit 643 are arranged in sequence along the x-axis. This is just an example. In fact, the arrangement of the conversion units can be set as needed, and the sixth embodiment does not limit it.

[0199] refer to Fig.21 As shown, the blue light emitted by the entire light-emitting layer can be transmitted upward and enter the red light conversion unit 641, the green light conversion unit 642 and the blue light conversion unit 643 respectively. The red light conversion unit 641 can convert the color of the blue light and emit red light, the green light conversion unit 642 can convert the color of the blue light and emit green light, and the blue light conversion unit 643 can narrow the spectrum of the blue light and emit purer blue light, thereby realizing color display of the display panel 6.

[0200] The display panel 6 of the sixth embodiment may adopt a top-emitting structure, and light is transmitted upward and emitted from the color conversion layer 64a above the encapsulation layer 630. In other embodiments, the display panel 6 may adopt a bottom-emitting structure, and the color conversion layer 64a is located below the substrate 60 (i.e., the side of the substrate 60 facing away from the light-emitting layer), and light is transmitted downward and emitted from the color conversion layer 64a below the substrate 60.

[0201] In the sixth embodiment, schematically, in order to ensure the purity of the light color of the display panel 6, a second color filter film may be further provided outside the color conversion layer 64a, and the second color filter film may be located on the side of the color conversion layer 64a away from the encapsulation layer 630 (top light-emitting structure), or located on the side of the color conversion layer 64a away from the substrate 60 (bottom light-emitting structure). The second color filter film may include a plurality of second red light filter units, a plurality of second green light filter units, and a plurality of second blue light filter units, the second red light filter unit corresponds to the red light conversion unit, the second red light filter unit may filter the red light emitted by the red light conversion unit and emit red light, the second green light filter unit may filter the green light emitted by the green light conversion unit and emit green light, and the second blue light filter unit may filter the blue light emitted by the blue light conversion unit and emit blue light.

[0202] Embodiment 6 uses blue light + color conversion layer to achieve colorization, which is conducive to simplifying the process, reducing voltage drop, reducing power consumption of the display panel, and improving the brightness of the display panel. The display panel 6 of embodiment 6 can be applied to electronic devices such as high-brightness televisions.

[0203] Different from the sixth embodiment, in other embodiments, the color conversion layer may not have a blue light conversion unit, and the second color filter film may include a second blue light filter unit that filters the blue light emitted by the light-emitting layer.

[0204] The above embodiments describe in detail a Tandem OLED display panel using a PDL with a flat structure and a doped modified organic connection layer. The following embodiments describe a Tandem OLED display panel using a PDL with a semi-flat structure + a semi-isolated structure and a doped modified organic connection layer.

[0205] Fig. 22 FIG. 2 is a schematic diagram showing a partial cross-sectional structure of a display panel 7 in an implementation manner of the seventh embodiment. Fig. 22 As shown, the display panel 7 may include a substrate 70, TFT 711, TFT 712 and TFT 713, an anode 721, an anode 722 and an anode 723, a PDL 73, a hole functional layer 74, a light-emitting layer 75, a light-emitting layer 77 and a light-emitting layer 78 and other multiple light-emitting layers, multiple organic connecting layers 76, an electronic functional layer 79, a cathode 710, a CPL 720, an encapsulation layer 730 and an isolation structure 740.

[0206] Among them, any two adjacent light-emitting layers in the display panel 7 can be connected in series through an organic connecting layer 76. Each light-emitting layer can include a plurality of light-emitting units, for example, the light-emitting layer 75 can include a light-emitting unit 751, a light-emitting unit 752 and a light-emitting unit 753, the light-emitting layer 77 can include a light-emitting unit 771, a light-emitting unit 772 and a light-emitting unit 773, and the light-emitting layer 78 can include a light-emitting unit 781, a light-emitting unit 782 and a light-emitting unit 783. Each light-emitting layer can also include a preset layer, on which the light-emitting unit is formed, and the preset layer is used to adjust the microcavities of different light colors. Schematically, each light-emitting layer can include a plurality of red light-emitting units, green light-emitting units and blue light-emitting units, for example, the light-emitting unit 771 can be a red light-emitting unit, the light-emitting unit 772 can be a green light-emitting unit, and the light-emitting unit 773 can be a blue light-emitting unit.

[0207] In this embodiment, the RGB sub-pixels can be directly evaporated by the FMM method, and the colorization of the display panel 7 can be achieved by the direct emission of the RGB sub-pixels.

[0208] In this embodiment, except for the isolation structure 740, the structure, material, characteristics and working principle of the remaining stacked layers can be the same as those in the above embodiment, and will not be repeated here. The isolation structure 740 will be described in detail below.

[0209] Fig. 22An isolation structure 740 formed on the PDL 73 is illustrated. The isolation structure 740 can be roughly a columnar structure similar to a column, and its specific structure can be designed as needed, which is not limited in this embodiment. The isolation structure 740 has a large height, and it can sequentially penetrate the hole functional layer 74, multiple light-emitting layers, multiple organic connection layers 76, electronic functional layer 79, cathode 710 and CPL 720 along the z-axis direction (i.e., longitudinal direction). The isolation structure 740 makes the hole functional layer 74, the organic connection layer 76, the cathode 710 and the CPL 720 no longer a continuous and complete whole-surface structure, but partially disconnected. The isolation structure 740 also separates the adjacent light-emitting units in each light-emitting layer (for example, the light-emitting unit 751 and the light-emitting unit 752 in the light-emitting layer 75, the light-emitting unit 781 and the light-emitting unit 782 in the light-emitting layer 78, etc.) in some lateral directions. It can be considered that the isolation structure 740 makes each light-emitting layer partially disconnected.

[0210] Reference Fig. 22 As shown, due to process reasons, a cathode material may also be deposited on the top of the isolation structure 740. The cathode material is the same as the material of the cathode 710, but the cathode material does not have the function of the cathode 720. It can be considered that the cathode material is a redundant structure generated by the process. Fig. 22 It is not indicated.

[0211] Fig.23 Can be expressed Fig. 22 Schematic microstructure of the stack from anode to cathode 710 between adjacent anodes 721 (or first anode) and anode 722 (or second anode). Fig.23 As shown, between the anode 721 and the anode 722, the PDL 73 may be in the shape of a water drop, and its slope angle a may be defined as follows: a tangent line L0 of the arc surface 73a is made through the intersection of the arc surface 73a of the PDL 73 and the top surface 72b of the anode, and the acute angle formed by the tangent line L0 and the top surface 72b is called the slope angle a. Fig.23 and Fig. 22 As shown, in the manufacturing process of the display panel 7, after forming the isolation structure 740 on the PDL 73, the stacked layers from the hole function layer 74 to the cathode 710 are sequentially formed (in order to highlight the key points, Fig.23 Only the cathode 710 of these stacked layers is shown in FIG. 1 ). Due to process reasons, the top of the isolation structure 740 may also be covered with the cathode material 750. Therefore, when preparing the isolation structure 740, a Fig.23The convex structure shown. The convex structure can be geometrically described: there is a line connecting a point on the cathode material 750 and a point on the cathode 710, and the acute angle formed by the line and the top surface 72b is greater than or equal to the slope angle a. For example, there is a line L3, and the acute angle d formed by the line L3 and the top surface 72b is greater than the slope angle a. Alternatively, there is a line L4 parallel to the tangent line L0, and the acute angle e formed by the line L4 and the top surface 72b is equal to the slope angle a.

[0212] In this embodiment, the isolation structure 740 can partially disconnect the organic connection layer 76 by physical isolation, and separate the sub-pixels of different colors in the display panel 7, thereby improving the lateral crosstalk. The simultaneous provision of the isolation structure 740 and the organic connection layer 76 with high lateral square resistance can strengthen this effect, thereby avoiding lateral crosstalk.

[0213] Fig.24 FIG. 1 is a schematic diagram of a partial cross-sectional structure of a display panel 7 in another implementation manner of the seventh embodiment. Fig. 22 The difference shown is that Fig.24 The isolation structure 740 shown can be a groove, which passes through the hole functional layer 74, multiple light-emitting layers, multiple organic connection layers 76, electronic functional layer 79, cathode 710 and CPL 720 in sequence upward, and passes through a certain depth of PDL73 downward, and the side of PDL 73 facing the substrate 70 serves as the bottom wall 73b of the groove. In the process of the display panel 7, after the groove is formed on the PDL 73, the stack from the hole functional layer 74 to the cathode 710 is formed in sequence. Due to process reasons, the bottom wall 73b of the groove can also be covered with cathode material, which does not have the function of cathode 720, but the side wall of the groove cannot be deposited with cathode material. A portion 730a of the encapsulation layer 730 can be filled into the groove and cover the cathode material and PDL 73. Similarly, the isolation structure 740 makes the hole functional layer 74, the organic connecting layer 76, the cathode 710 and the CPL 720 no longer a continuous and complete whole-surface structure, but partially disconnected; the isolation structure 740 also makes the adjacent light-emitting units in each light-emitting layer (for example, the light-emitting unit 751 and the light-emitting unit 752 in the light-emitting layer 75, the light-emitting unit 781 and the light-emitting unit 782 in the light-emitting layer 78, etc.) separated in some lateral directions. It can be considered that the isolation structure 740 causes each light-emitting layer to be partially disconnected.

[0214] Fig.25 Can be expressed Fig.24 Schematic microstructure of the stack from anode to cathode 710 between adjacent anodes 721 and 722 (in order to highlight the key points, Fig.23 Only the cathode 710 of these stacks is shown. Fig.25As shown, between the anode 721 and the anode 722, the PDL 73 may be in the shape of a water drop, and its slope angle a may be defined as follows: a tangent line L0 of the arc surface 73a is made through the intersection of the arc surface 73a of the PDL 73 and the top surface 72b of the anode, and the acute angle formed by the tangent line L0 and the top surface 72b is called the slope angle a. When preparing the isolation structure 740, a Fig.25 The groove structure shown in the figure can be described by the following geometric relationship: there is a line connecting a point on the cathode material 750 and a point on the cathode 710, and the acute angle formed by the line and the top surface 72b is greater than or equal to the slope angle a. For example, there is a line L5, and the acute angle f formed by the line L5 and the top surface 72b is greater than the slope angle a. Alternatively, there is a line L6 parallel to the tangent line L0, and the acute angle g formed by the line L6 and the top surface 72b is equal to the slope angle a.

[0215] In this embodiment, the isolation structure 740 can partially disconnect the organic connection layer 76 by physical isolation, and separate the sub-pixels of different colors in the display panel 7, thereby improving the lateral crosstalk. The isolation structure 740 and the organic connection layer 76 with high lateral square resistance are provided at the same time, which can strengthen this effect and avoid lateral crosstalk.

[0216] In this embodiment, Fig. 22 and Fig.24 As shown, along the x-axis direction, the isolation structure 740 can be located between the adjacent anodes 721 and anode 722, which is merely a schematic diagram. In fact, an isolation structure 740 can be provided between any two adjacent anodes in a part of the anodes (this part of the anodes is only a part of all the anodes, and this part of the anodes can be arranged together or dispersedly). Alternatively, an isolation structure 740 can be provided between any two adjacent anodes in all the anodes in the display panel 7. In this embodiment, such two anodes can be referred to as the first anode and the second anode, respectively, and the isolation structure 740 is located between the first anode and the second anode. It is easy to understand from the above that the number of the first anode and the second anode can be greater than or equal to 1. In this embodiment, there can be one isolation structure 740 between the first anode and the second anode, or there can be multiple isolation structures 740 arranged side by side.

[0217] In other words, Fig. 22 and Fig.24 As shown, the isolation structure 740 can be located between adjacent sub-pixels and separate the adjacent sub-pixels. Wherein, a sub-pixel can be defined as: from a TFT to a portion of the CPL 720 corresponding to the TFT, and the entire stacked structure therebetween. For example, Fig. 22A sub-pixel on the left side is the entire stacked structure from TFT 711 to a portion of CPL 720 corresponding to the TFT, including TFT 711, anode 721, a portion of the hole functional layer 74, a light-emitting unit 751, a portion of the organic connecting layer 76, a light-emitting unit 771, a portion of the organic connecting layer 76... a light-emitting unit 781, a portion of the electronic functional layer 79, a portion of the cathode 710, and a portion of the CPL 720.

[0218] In the present embodiment, an isolation structure 740 may be provided between any two adjacent sub-pixels in a part of the sub-pixels (this part of the sub-pixels is only a part of all the sub-pixels, and this part of the sub-pixels may be arranged together or dispersedly). Alternatively, an isolation structure 740 may be provided between any two adjacent sub-pixels in all the sub-pixels in the display panel 7. In the present embodiment, such two sub-pixels may be respectively referred to as the first sub-pixel and the second sub-pixel, and the isolation structure 740 is located between the first sub-pixel and the second sub-pixel, and separates the first sub-pixel from the second sub-pixel. It is easy to understand from the above that the number of the first sub-pixel and the second sub-pixel may be greater than or equal to 1. In the present embodiment, there may be one isolation structure 740 between the first sub-pixel and the second sub-pixel, or there may be multiple isolation structures 740 arranged side by side.

[0219] In this embodiment, when the isolation structure 740 is provided only between some sub-pixels, the number of isolation structures 740 in the display panel 7 is relatively small, which can reduce the damage to the cathode 710 (for example, it can be reduced by 2 / 3), reduce the power consumption of the display panel 7, and ensure the display effect of the display panel 7. In addition, it is also easier to make the isolation structure 740 avoid the direction and position with poor bending reliability, thereby greatly improving the reliability of the display panel 7.

[0220] In this embodiment, the isolation structures 740 in the display panel 7 may all be columnar structures, or all be grooves, or a portion of the isolation structures 740 may be columnar structures and another portion of the isolation structures 740 may be grooves.

[0221] In this embodiment, a flat structure can be formed in the area where the isolation structure 740 is not provided, and the flat structure is applicable to the geometric description described above. A partition structure can be formed in the area where the isolation structure 740 is provided, and the partition structure can adopt the geometric description of the above-mentioned convex structure. Therefore, it can be considered that the solution of embodiment 7 adopts a semi-flat structure + a semi-partition structure.

[0222] In this embodiment, the isolation structure 740 can be located between the red light sub-pixel and the green light sub-pixel, and the isolation structure 740 separates the red light sub-pixel from the green light sub-pixel; and / or, the isolation structure 740 can be located between the red light sub-pixel and the blue light sub-pixel, and the isolation structure 740 separates the red light sub-pixel from the blue light sub-pixel; and / or, the isolation structure 740 can be located between the green light sub-pixel and the blue light sub-pixel, and the isolation structure 740 separates the green light sub-pixel from the blue light sub-pixel.

[0223] The design for improving lateral crosstalk in this embodiment can be applied to various pixel arrangements, which will be listed below.

[0224] Figure 26-Figure 31 All of them are schematic diagrams showing the application of the improved lateral crosstalk design of this embodiment in a 2B in 1 arrangement in a real red, green and blue (Real RGB) arrangement. The ratio of physical pixels to real pixels in the Real RGB arrangement is 1:1; the 2B in 1 arrangement means that two blue sub-pixels are evaporated in one FMM hole, and the distance d1 between the two blue sub-pixels is small; "red", "green" and "blue" represent red sub-pixels, green sub-pixels and blue sub-pixels respectively.

[0225] like Fig.26 As shown, schematically, the isolation structure 740 is only disposed between the green sub-pixel and the red sub-pixel, and only isolates a portion of adjacent green sub-pixels and red sub-pixels, not all adjacent green sub-pixels and red sub-pixels.

[0226] and Fig.26 The difference is that, Fig. 27 As shown, schematically, the isolation structure 740 may be disposed between all adjacent green sub-pixels and red sub-pixels.

[0227] and Fig.26 The difference is that, Fig.28 As shown, schematically, the isolation structure 740 is only provided between the red sub-pixel and the blue sub-pixel, and only isolates a portion of adjacent red sub-pixels and blue sub-pixels, not all adjacent red sub-pixels and blue sub-pixels.

[0228] and Fig.28 The difference is that, Fig.29 As shown, schematically, the isolation structure 740 may be substantially disposed between all adjacent red sub-pixels and blue sub-pixels.

[0229] and Fig.26 The difference is that, Fig.30As shown, schematically, the isolation structure 740 is only disposed between the green sub-pixel and the blue sub-pixel, and only isolates a portion of adjacent green sub-pixels and blue sub-pixels, not all adjacent green sub-pixels and blue sub-pixels.

[0230] and Fig.30 The difference is that, Fig.31 As shown, schematically, the isolation structure 740 may be disposed between all adjacent green sub-pixels and blue sub-pixels.

[0231] Figure 32-Figure 37 Both are schematic diagrams showing the application of the improved lateral crosstalk design of this embodiment in the 1Bin 1 arrangement in the Real RGB pixel arrangement. In the 1B in 1 arrangement, that is, one blue light sub-pixel is evaporated in one FMM hole, and the distance d2 between two adjacent blue light sub-pixels is relatively large.

[0232] like Fig.32 As shown, schematically, the isolation structure 740 is only disposed between the green sub-pixel and the red sub-pixel, and only isolates a portion of adjacent green sub-pixels and red sub-pixels, not all adjacent green sub-pixels and red sub-pixels.

[0233] and Fig.32 The difference is that, Fig.33 As shown, schematically, the isolation structure 740 may be disposed between all adjacent green sub-pixels and red sub-pixels.

[0234] and Fig.32 The difference is that, Fig.34 As shown, schematically, the isolation structure 740 is only provided between the red sub-pixel and the blue sub-pixel, and only isolates a portion of adjacent red sub-pixels and blue sub-pixels, not all adjacent red sub-pixels and blue sub-pixels.

[0235] and Fig.34 The difference is that, Fig.35 As shown, schematically, the isolation structure 740 may be disposed between all adjacent red sub-pixels and blue sub-pixels.

[0236] and Fig.32 The difference is that, Fig.36 As shown, schematically, the isolation structure 740 is only disposed between the green sub-pixel and the blue sub-pixel, and only isolates a portion of adjacent green sub-pixels and blue sub-pixels, not all adjacent green sub-pixels and blue sub-pixels.

[0237] and Fig.36 The difference is that, Fig.37As shown, schematically, the isolation structure 740 may be disposed between all adjacent green sub-pixels and blue sub-pixels.

[0238] Figure 38-Figure 43 Schematic diagrams showing the application of the design for improving lateral crosstalk in the present embodiment in a diamond arrangement, wherein only a portion of the isolation structure 740 is shown to keep the drawings clear.

[0239] like Fig.38 As shown, schematically, the isolation structure 740 is only provided between the red sub-pixel and the green sub-pixel, and only isolates a portion of adjacent red sub-pixels and green sub-pixels, not all adjacent red sub-pixels and green sub-pixels.

[0240] and Fig.38 The difference is that, Fig.39 As shown, schematically, the isolation structure 740 may be disposed between all adjacent red sub-pixels and green sub-pixels.

[0241] and Fig.38 The difference is that, Fig.40 As shown, schematically, the isolation structure 740 is only provided between the red sub-pixel and the blue sub-pixel, and only isolates a portion of adjacent red sub-pixels and blue sub-pixels, not all adjacent red sub-pixels and blue sub-pixels.

[0242] and Fig.40 The difference is that, Fig.41 As shown, schematically, the isolation structure 740 may be disposed between all adjacent red sub-pixels and blue sub-pixels.

[0243] and Fig.38 The difference is that, Fig.42 As shown, schematically, the isolation structure 740 is only disposed between the green sub-pixel and the blue sub-pixel, and only isolates a portion of adjacent green sub-pixels and blue sub-pixels, not all adjacent green sub-pixels and blue sub-pixels.

[0244] and Fig.42 The difference is that, Fig.43 As shown, schematically, the isolation structure 740 may be disposed between all adjacent green sub-pixels and blue sub-pixels.

[0245] In addition to the above pixel arrangement, the design for improving lateral crosstalk in this embodiment can also be applied to any other suitable pixel arrangement, including but not limited to Delta arrangement, tripod arrangement, Pentile arrangement, diamond-like arrangement, etc.

[0246] This embodiment does not limit the shape of the sub-pixel. For example, the sub-pixel can be a regular shape such as a rectangle, a rectangle with rounded corners, a circle, a triangle, etc., or a polygon of any shape or a smooth irregular shape. It can also be divided into two or more discontinuous luminous small blocks, each of which can be a rectangle, a rectangle with rounded corners, a circle, a triangle, a polygon of any shape or a smooth irregular shape, etc.

[0247] The pixel arrangement and sub-pixel shape described in the seventh embodiment are applicable to any embodiment of the present application.

[0248] In addition to being applied to the above-mentioned pixel arrangement, the improved lateral crosstalk design of this embodiment can also be applied to semi-flat and semi-partitioned Tandem OLEDs with different partition structure designs, wherein: the isolation column between two sub-pixels (or on the PDLGap) can be single (can be called a single column), or two (can be called double columns) or more than two (can be called multiple columns); the isolation groove can be single (can be called a single groove), or two (can be called double grooves) or more than two (can be called multiple grooves); the cross-sectional shape of the isolation column or isolation groove can be a rectangle, a regular trapezoid, an inverted trapezoid, or other regular or irregular geometric shapes; the shape, height or depth, width and other structural dimensions of different isolation structures on the same PDLGap (or between the same pair of sub-pixels) can be the same or different.

[0249] Different from the seventh embodiment, the display panel 8 of the eighth embodiment can be colored by using white light + color filter film. Figure 44-Figure 47 They are schematic diagrams of partial cross-sectional structures of the display panel 8 in different implementation modes of the eighth embodiment.

[0250] like Fig.44 and Fig.45 As shown, the display panel 8 may include a substrate 80, TFT 811, TFT 812 and TFT 813, anode 821, anode 822 and anode 823, PDL 83, hole functional layer 84, light emitting layer 85, organic connection layer 86, light emitting layer 87, electronic functional layer 88, cathode 89, CPL 810, encapsulation layer 820, first color filter film 830 and isolation structure 840. Among them, Fig.44 The isolation structure 840 in the embodiment is a columnar structure. Fig.45 The isolation structure 840 in the embodiment is a groove, and a portion 820 a of the encapsulation layer 820 may be filled into the groove and cover the PDL 83 .

[0251] Similar to the seventh embodiment, the display panel 8 of the eighth embodiment also adopts a semi-flat structure + a semi-isolated structure + a high-resistance organic connection layer 86 , wherein the isolation structure separates sub-pixels of different colors in the display panel 8 .

[0252] Different from the seventh embodiment, Fig.44 and Fig.45 As shown, the light-emitting layer 85 and the light-emitting layer 87 are both laterally continuous organic material layers. Instead of using the FMM process, the CMM process can be used, and the deposition of the light-emitting layer 85 or the light-emitting layer 87 can be completed by one evaporation. The light-emitting layer 85 and the light-emitting layer 87 can emit light of different colors respectively, and the light of the light-emitting layer 85 and the light-emitting layer 87 can be mixed to produce white light. Schematically, the light-emitting layer 85 may include a red light-emitting unit (R) and a green light-emitting unit (G), and the red light emitted by the red light-emitting unit (R) and the green light emitted by the green light-emitting unit (G) can be mixed to produce yellow light, so the light-emitting layer 85 can emit yellow light. Schematically, the light-emitting layer 87 may include a blue light-emitting unit (B), and the light-emitting layer 87 can emit blue light. The yellow light emitted by the light-emitting layer 85 can be mixed with the blue light emitted by the light-emitting layer 87 to form white light, and finally all the light-emitting layers as a whole emit white light.

[0253] like Fig.44 and Fig.45 As shown, a first color filter film 830 can be formed on the encapsulation layer 820. The first color filter film 830 can include a plurality of first red light filter units 831, a plurality of first green light filter units 832, and a plurality of first blue light filter units 833. The first red light filter units 831, the first green light filter units 832, and the first blue light filter units 833 can be arranged in an array according to a certain rule. It can be understood that the first red light filter unit 831, the first green light filter unit 832, and the first blue light filter unit 833 are arranged in sequence along the x-axis. This is just an example. In fact, the arrangement of the filter units can be determined according to the pixel arrangement, and the eighth embodiment does not limit it.

[0254] refer to Fig.44 and Fig.45 As shown, the white light emitted by the entire light-emitting layer can be transmitted upward and enter the first red light filter unit 831, the first green light filter unit 832 and the first blue light filter unit 833 respectively. The first red light filter unit 831 filters the white light and emits red light, the first green light filter unit 832 filters the white light and emits green light, and the first blue light filter unit 833 filters the white light and emits blue light, thereby realizing color display of the display panel 8.

[0255] The display panel 8 of the eighth embodiment may adopt a top-emitting structure, and light is transmitted upward and emitted from the first color filter film 830 on the encapsulation layer 820. In other embodiments, the display panel 8 may adopt a bottom-emitting structure, and the first color filter film 830 is located below the substrate 80 (i.e., the side of the substrate 80 facing away from the light-emitting layer), and light is transmitted downward and emitted from the first color filter film 830 below the substrate 80.

[0256] The eighth embodiment uses white light + color filter film to achieve colorization, which is beneficial to improve the PPI of the display panel. The display panel 8 of the eighth embodiment can be applied to electronic devices such as silicon-based OLED TVs or OLED TVs.

[0257] In other embodiments, other white light OLED device structures may be used as required to achieve colorization using white light + color filter film.

[0258] For example, in Example 9, refer to Fig.44 or Fig.45 As shown, the light-emitting layer 85 can include a blue light-emitting unit (B), and the light-emitting layer 85 can emit blue light. The light-emitting layer 87 can include a red light-emitting unit (R) and a green light-emitting unit (G), and the light-emitting layer 87 can emit yellow light. The blue light emitted by the light-emitting layer 85 can be mixed with the yellow light emitted by the light-emitting layer 87 to form white light, and finally all the light-emitting layers as a whole emit white light.

[0259] Alternatively, in the tenth embodiment, a red light emitting layer, a green light emitting layer and a blue light emitting layer may be provided separately, and the three light emitting layers are stacked (not limited to stacked in sequence), and any two light emitting layers are connected in series via an organic connecting layer. The red light emitted by the red light emitting layer, the green light emitted by the green light emitting layer and the blue light emitted by the blue light emitting layer are mixed into white light, and finally all the light emitting layers emit white light as a whole.

[0260] or in Fig.46 and Fig.47 In the eleventh embodiment shown, two light-emitting layers emitting blue light and one light-emitting layer emitting yellow light may be provided, and white light is generated by mixing the blue light and the yellow light.

[0261] like Fig.46 and Fig.47 As shown, the display panel 9 of the eleventh embodiment may include a substrate 90, TFT 911, TFT 912 and TFT 913, anodes 921, 922 and 923, PDL 93, hole functional layer 94, light emitting layer 95, organic connection layer 96, light emitting layer 97, organic connection layer 96, light emitting layer 98, electronic functional layer 99, cathode 910, CPL 920, encapsulation layer 930, first color filter film 940 and isolation structure 950. Among them: Fig.46 The isolation structure 950 is a columnar structure. Fig.47 The isolation structure 950 is a groove, and a portion 930a of the encapsulation layer 930 can be filled into the groove and cover the PDL 93. The first color filter film 940 can include a plurality of first red light filter units 941, a plurality of first green light filter units 942, and a plurality of first blue light filter units 943.

[0262] like Fig.46 and Fig.47 As shown, the light-emitting layer 95 may include a blue light-emitting unit (B), and the light-emitting layer 95 may emit blue light. The light-emitting layer 97 may include a red light-emitting unit (R) and a green light-emitting unit (G), and the light-emitting layer 97 may emit yellow light. The light-emitting layer 98 may include a blue light-emitting unit (B), and the light-emitting layer 98 may emit blue light. Finally, all the light-emitting layers as a whole emit white light. It can be understood that the arrangement order of the light-emitting layer 95-the light-emitting layer 97-the light-emitting layer 98 is only an example. In fact, the arrangement order of each light-emitting layer can be set as needed, and the embodiment 11 is not limited thereto.

[0263] In the Tandem OLED, since the efficiency of the organic light emitting layer in emitting blue light is low, it is difficult to emit blue light. Therefore, in the eleventh embodiment, an additional light emitting layer emitting blue light is provided to improve the light extraction efficiency of blue light.

[0264] Or in another embodiment, the first light-emitting layer and the second light-emitting layer can be provided separately, and the first light-emitting layer and the second light-emitting layer can be provided in a stacked manner. The first light-emitting layer can include a red light-emitting unit (R), and the first light-emitting layer can emit red light; the second light-emitting layer can include a green light-emitting unit (G) and a blue light-emitting unit (B), and the second light-emitting layer can emit cyan light, and finally all the light-emitting layers as a whole emit white light.

[0265] Alternatively, in another embodiment, the first light-emitting layer and the second light-emitting layer may be provided separately, and the first light-emitting layer and the second light-emitting layer may be provided in a stacked manner. The first light-emitting layer may include a green light-emitting unit (G), and the first light-emitting layer may emit green light; the second light-emitting layer may include a red light-emitting unit (R) and a blue light-emitting unit (B), and the second light-emitting layer may emit magenta light, and finally all the light-emitting layers as a whole may emit white light.

[0266] It is understandable that the above only exemplifies some white light OLED device structures. In the embodiments of the present application, different white light OLED device structures can be set as needed, and these white light OLED device structures meet the following design: among the multiple light-emitting layers, at least two light-emitting layers can emit light of different colors respectively, and the light emitted by all the light-emitting layers can be mixed into white light, and finally all the light-emitting layers emit white light as a whole.

[0267] Different from the above-mentioned embodiment that uses white light + color filter film to achieve colorization, the twelfth embodiment can use blue light + color conversion layer to achieve colorization.

[0268] Fig.48 and Fig.49 FIG. 1 is a schematic diagram showing a partial cross-sectional structure of a display panel 10 according to the twelfth embodiment. Fig.48 and Fig.49As shown, the display panel 10 may include a substrate 100, TFTs 101, 102, and 103, anodes 104, 105, and 106, a PDL 107, a hole functional layer 108, a light emitting layer 109, an organic connection layer 112, a light emitting layer 113, a light emitting layer 114, an electronic functional layer 115, a cathode 116, a CPL 117, an encapsulation layer 118, a color conversion layer 119, and an isolation structure 120. Among them: Fig.48 The isolation structure 120 is a columnar structure. Fig.49 The isolation structure 120 is a groove, and a portion 118a of the encapsulation layer 118 can be filled into the groove and cover the PDL 107. The light-emitting layer 109, the light-emitting layer 113 and the light-emitting layer 114 are stacked in sequence, and two adjacent light-emitting layers are connected in series through an organic connecting layer 112. The light-emitting layer 109, the light-emitting layer 113 and the light-emitting layer 114 all include a blue light-emitting unit (B), and the light-emitting layer 109, the light-emitting layer 113 and the light-emitting layer 114 can all emit blue light, and finally all the light-emitting layers as a whole emit blue light.

[0269] like Fig.48 and Fig.49 As shown, a color conversion layer 119 may be formed on the encapsulation layer 118. The color conversion layer 119 may include a plurality of red light conversion units 119a, a plurality of green light conversion units 119b, and a plurality of blue light conversion units 119c. The red light conversion units 119a, the green light conversion units 119b, and the blue light conversion units 119c may be arranged in an array according to a certain rule. It can be understood that the red light conversion units 119a, the green light conversion units 119b, and the blue light conversion units 119c are arranged in sequence along the x-axis. This is only an example. In fact, the arrangement of the conversion units can be determined according to the pixel arrangement, and the embodiment 12 does not limit this.

[0270] like Fig.48 and Fig.49 As shown, the blue light emitted by the entire light-emitting layer can be transmitted upward and enter the red light conversion unit 119a, the green light conversion unit 119b and the blue light conversion unit 119c respectively. The red light conversion unit 119a can convert the color of the blue light and emit red light, the green light conversion unit 119b can convert the color of the blue light and emit green light, and the blue light conversion unit 119c can narrow the spectrum of the blue light and emit purer blue light, thereby realizing color display of the display panel 10.

[0271] The display panel 10 of the twelfth embodiment may adopt a top-emitting structure, and light is transmitted upward and emitted from the color conversion layer 119 above the encapsulation layer 118. In other embodiments, the display panel 10 may adopt a bottom-emitting structure, and the color conversion layer 119 is located below the substrate 100 (i.e., the side of the substrate 100 facing away from the light-emitting layer), and light is transmitted downward and emitted from the color conversion layer 119 below the substrate 100.

[0272] In the twelfth embodiment, schematically, in order to ensure the purity of the light color of the display panel 10, a second color filter film may be further provided outside the color conversion layer 119, and the second color filter film may be located on the side of the color conversion layer 119 away from the encapsulation layer 118 (top emission structure), or located on the side of the color conversion layer 119 away from the substrate 100 (bottom emission structure). The second color filter film may include a plurality of second red light filter units, a plurality of second green light filter units, and a plurality of second blue light filter units, the second red light filter unit corresponds to the red light conversion unit, the second red light filter unit may filter the red light emitted by the red light conversion unit and emit red light, the second green light filter unit may filter the green light emitted by the green light conversion unit and emit green light, and the second blue light filter unit may filter the blue light emitted by the blue light conversion unit and emit blue light.

[0273] The twelfth embodiment uses blue light + color conversion layer to achieve colorization, which is conducive to simplifying the process, reducing voltage drop, reducing the power consumption of the display panel, and improving the brightness of the display panel. The display panel 10 of the twelfth embodiment can be applied to electronic devices such as high-brightness televisions.

[0274] Different from the twelfth embodiment, in other embodiments, the color conversion layer may not have a blue light conversion unit, and the second color filter film may include a second blue light filter unit that filters the blue light emitted by the light-emitting layer.

[0275] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A display panel, characterized in that: It comprises a plurality of anodes, a pixel definition layer, a hole function layer, a plurality of light-emitting layers, at least one organic nanofilm, an electronic function layer and a cathode, wherein any two adjacent anodes among the plurality of anodes are isolated by the pixel definition layer, the plurality of anodes, the hole function layer, the plurality of light-emitting layers, the electronic function layer and the cathode are stacked in sequence, and each of the organic nanofilms is connected between two adjacent light-emitting layers; The material of each of the organic nano-thin films includes a main material and a doping material doped in the main material, and the lateral square resistance of each of the organic connecting layers is greater than or equal to 1 GΩ / □.

2. The display panel according to claim 1, characterized in that: The organic nanofilm includes a charge generation layer, which includes an N-type charge generation layer and a P-type charge generation layer; the P-type charge generation layer and the N-type charge generation layer are stacked and located on a side of the N-type charge generation layer facing the cathode.

3. The display panel according to claim 2, characterized in that: The main body material of the N-type charge generation layer includes an N-type main body material, the doping material of the N-type charge generation layer includes an N-type doping material, and the concentration of the N-type doping material ∈ (0%, 100%].

4. The display panel according to claim 3, characterized in that: The N-type main material includes organic aromatic materials, and / or, The N-type doping material includes a metal material with a work function of ≤3.5 eV, or a metal oxide material with a work function of ≤3.5 eV, or an organic material with a work function of ≤3.5 eV, or an organic-metal complex material with a work function of ≤3.5 eV.

5. The display panel according to any one of claims 2 to 4, characterized in that: The main material of the P-type charge generation layer includes a P-type main material, the doping material of the P-type charge generation layer includes a P-type doping material, and the concentration of the P-type doping material is ∈(0%, 100%).

6. The display panel according to claim 5, characterized in that: The P-type main material includes organic aromatic materials, and / or, The P-type doping material includes an organic material with a lowest unoccupied molecular orbital energy level of ≤-3.0 eV, or an inorganic material with a work function of ≥3.0 eV.

7. The display panel according to any one of claims 2 to 4 or claim 6, characterized in that: The charge generation layer further includes an intermediate layer connected between the N-type charge generation layer and the P-type charge generation layer.

8. The display panel according to any one of claims 2 to 4 or claim 6, characterized in that: The organic nanofilm further comprises at least one of a hole blocking layer, an electron transport layer, a hole injection layer and a hole transport layer, wherein: The hole blocking layer, the N-type charge generation layer and the P-type charge generation layer are stacked in sequence; The electron transport layer, the N-type charge generation layer and the P-type charge generation layer are sequentially stacked, and when the hole blocking layer is present, the hole blocking layer, the electron transport layer and the N-type charge generation layer are sequentially stacked; The hole injection layer is stacked with the P-type charge generation layer and is located on a side of the P-type charge generation layer facing the cathode; The hole transport layer is stacked with the P-type charge generation layer and is located on the side of the P-type charge generation layer facing the cathode, and when the hole injection layer is present, the P-type charge generation layer, the hole injection layer and the hole transport layer are stacked in sequence.

9. The display panel according to any one of claims 1 to 4 or claim 6, characterized in that: The longitudinal mobility of the organic nanofilm is 10 -1 cm 2 / (V·S)~10 -6 cm 2 / (V·S).

10. The display panel according to any one of claims 1 to 4 or claim 6, characterized in that: The thickness of each of the organic nanofilms is less than or equal to 300 nm.

11. The display panel according to any one of claims 1 to 4 or claim 6, characterized in that: The plurality of anodes include a first anode and a second anode, the first anode is adjacent to the second anode, and the first anode has a top surface facing the cathode; The portion of the pixel definition layer located between the first anode and the second anode has a slope angle; The acute angle formed by a line connecting any two points on the surface of the cathode facing the pixel definition layer and the top surface is less than or equal to the slope angle; the acute angle formed by a line connecting any two points on the surface of the cathode facing away from the pixel definition layer and the top surface is less than or equal to the slope angle.

12. The display panel according to any one of claims 1 to 4 or claim 6, characterized in that: The display panel further includes an isolation structure, which is formed on the pixel definition layer and penetrates the hole functional layer, the plurality of light-emitting layers, the at least one organic nanofilm, the electronic functional layer and the cathode.

13. The display panel according to claim 12, characterized in that: The display panel includes a plurality of sub-pixels, a portion of the plurality of sub-pixels include a first sub-pixel and a second sub-pixel, the first sub-pixel is adjacent to the second sub-pixel, and the isolation structure is located between the first sub-pixel and the second sub-pixel.

14. The display panel according to claim 12, characterized in that: The isolation structure includes a columnar structure.

15. The display panel according to claim 12, characterized in that: The isolation structure comprises a groove, and a side of the pixel definition layer facing away from the cathode is a bottom wall of the groove.

16. The display panel according to any one of claims 1 to 4 or any one of claims 13 to 15, characterized in that: The sub-pixels in the display panel form a true red, green and blue arrangement, a diamond arrangement, a delta arrangement, a tripod arrangement, a pentile arrangement or a diamond-like arrangement.

17. The display panel according to any one of claims 1 to 4 or any one of claims 13 to 15, characterized in that: Each of the light-emitting layers includes a red light-emitting unit, a green light-emitting unit and a blue light-emitting unit.

18. The display panel according to any one of claims 1 to 4 or any one of claims 13 to 15, characterized in that: The display panel includes a first color filter film, which includes a plurality of first red light filter units, a plurality of first green light filter units, and a plurality of first blue light filter units; the first color filter film is located on a side of the cathode facing away from the electronic functional layer, or the first color filter film is located on a side of the anodes facing away from the hole functional layer; At least two of the multiple light-emitting layers are used to emit light of different colors, respectively, and the multiple light-emitting layers as a whole emit white light; the first red light filtering unit is used to filter the white light and emit red light, the first green light filtering unit is used to filter the white light and emit green light, and the first blue light filtering unit is used to filter the white light and emit blue light.

19. The display panel according to any one of claims 1 to 4 or any one of claims 13 to 15, characterized in that: The display panel comprises a color conversion layer, the color conversion layer comprises a plurality of red light conversion units and a plurality of green light conversion units, the color conversion layer is located on a side of the cathode facing away from the electron functional layer, or the color conversion layer is located on a side of the plurality of anodes facing away from the hole functional layer; Each of the plurality of light-emitting layers is used to emit blue light, the red light conversion unit is used to convert the color of the blue light and emit red light, and the green light conversion unit is used to convert the color of the blue light and emit green light.

20. The display panel according to claim 19, characterized in that: The display panel also includes a second color filter film, which is located on the side of the color conversion layer facing away from the cathode; the second color filter film includes a plurality of second red light filter units, a plurality of second green light filter units and a plurality of second blue light filter units, the second red light filter unit is used to filter the red light emitted by the red light conversion unit and emit red light, the second green light filter unit is used to filter the green light emitted by the green light conversion unit and emit green light, and the second blue light filter unit is used to filter the blue light and emit blue light.

21. The display panel according to any one of claims 1 to 4 or any one of claims 13 to 15 or claim 20, characterized in that: The display panel further comprises a substrate, a plurality of thin film transistors, a covering layer and an encapsulation layer, wherein the plurality of thin film transistors are arranged on a side of the substrate facing the plurality of anodes, the plurality of thin film transistors are electrically connected to the plurality of anodes one-to-one, the covering layer is located on a side of the cathode facing away from the electronic functional layer, and the encapsulation layer is located on a side of the covering layer facing away from the cathode; wherein, The first color filter film is located on a side of the encapsulation layer facing away from the cover layer, or on a side of the substrate facing away from the plurality of thin film transistors; The color conversion layer is located on a side of the encapsulation layer facing away from the cover layer, or on a side of the substrate facing away from the plurality of thin film transistors; A portion of the encapsulation layer fills the groove and covers the pixel definition layer.

22. A display screen, characterized in that: It comprises a cover plate and the display panel according to any one of claims 1 to 21, wherein the cover plate is bonded to the display panel.

23. An electronic device, characterized in that: It comprises a structural member and the display screen according to claim 22, wherein the display screen is fixed to the structural member.

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