A space thruster and distributed space micro-thruster array

Abstract

The application discloses a space propeller and a distributed space micro-propulsion array, which comprises a first wafer layer, a second wafer layer, a third wafer layer and a fourth wafer layer, wherein the first wafer layer, the second wafer layer, the third wafer layer and the fourth wafer layer are all made of a MEMS system, and the first wafer layer, the second wafer layer, the third wafer layer and the fourth wafer layer are sequentially laminated to form the space propeller; and the space propeller is provided with an oxidant inlet, a fuel inlet, a coolant inlet, a coolant outlet and a jet outlet. The space propeller has the advantages that the volume and the total mass are far smaller than those of a common chemical propeller, the thrust-to-weight ratio of the propeller is improved, the spacecraft can retain the ability of obtaining a large amount of impulse in a short time to perform rapid orbit change on the premise of increasing the effective payload capacity, and the application range of the space propeller is further improved.

Description

Technical Field

[0001] This invention relates to the field of aerospace technology, specifically to a space thruster and a distributed space micro-propulsion array. Background Technology

[0002] Chemical thrusters, due to their high thrust and ability to provide a large impulse in a short time, are currently the essential choice for achieving many special orbital maneuvers (such as gravity capture and rapid orbit changes). Especially for the extraterrestrial launch missions actively planned by various countries, current electric thrusters, in terms of both thrust and thrust-to-weight ratio, cannot meet the requirements for escaping planetary gravity. Therefore, chemical thrusters will remain irreplaceable for a long time. However, with the reduction in maximum thrust and thruster mass of existing chemical thrusters, and the fact that the rate of thrust reduction exceeds the rate of mass reduction, the thrust-to-weight ratio also decreases rapidly. For example, the thrust-to-weight ratio of 100-Newton-class space thrusters used in large deep space probes is typically no higher than 20, while that of 10-Newton-class and Newton-class space thrusters can even drop to single digits. This low thrust-to-weight ratio reduces the proportion of usable payload in the satellite's mass and makes it difficult for spacecraft to perform rapid orbital maneuvers such as agile orbit changes, limiting the design of space systems, especially small spacecraft and their related missions. Summary of the Invention

[0003] The technical problem to be solved by this invention is how to improve the thrust-to-weight ratio of the thruster.

[0004] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0005] A space thruster includes a first wafer layer, a second wafer layer, a third wafer layer, and a fourth wafer layer, all of which are fabricated using a MEMS system. The first wafer layer, the second wafer layer, the third wafer layer, and the fourth wafer layer are stacked sequentially to form the space thruster. The space thruster is provided with an oxidizer inlet, a fuel inlet, a coolant inlet, a coolant outlet, and a jet outlet.

[0006] Both the first wafer layer and the fourth wafer layer are provided with oxidant channels, fuel channels and coolant channels. The oxidant inlet sequentially penetrates the first wafer layer, the second wafer layer and the third wafer layer to connect the oxidant channels on the first wafer layer and the fourth wafer layer. The fuel inlet sequentially penetrates the first wafer layer, the second wafer layer and the third wafer layer to connect the fuel channels on the first wafer layer and the fourth wafer layer. The coolant inlet and coolant outlet are connected to the coolant channels on the first wafer layer.

[0007] Combustion slots and Laval nozzle slots are provided on opposite sides of the second and third wafer layers. Two combustion slots are stacked to form a combustion chamber, and two Laval nozzle slots are stacked to form a Laval nozzle channel. The combustion slots and Laval nozzle slots are connected so that the stacked combustion chamber is connected to the Laval nozzle channel. The jet outlet is located at the bottom of the Laval nozzle channel. A through coolant side channel is provided on both the second and third wafer layers. The coolant channel on the first wafer layer is connected to the coolant channel on the fourth wafer layer through the coolant side channel. An oxidizer nozzle connected to an oxidizer channel and a fuel nozzle connected to a fuel channel are provided on the combustion slots of both the second and third wafer layers.

[0008] The space thruster provided by this invention has a much smaller volume and total mass than common chemical thrusters, which improves the thrust-to-weight ratio of the thruster. Therefore, it allows spacecraft to retain the ability to obtain a large impulse in a short time for rapid orbit change while increasing the effective payload capacity, thus further improving the applicability of the space thruster.

[0009] Preferably, the oxidant inlet and oxidant channel are located at the top of the first wafer layer, the fuel inlet and fuel channel are located in the middle of the first wafer, and the coolant outlet and coolant inlet are located between the fuel inlet and the oxidant inlet.

[0010] Preferably, the expansion ratio of the Laval nozzle channel is 3-10.

[0011] Preferably, the oxidizer nozzles and fuel nozzles are staggered on the same wafer layer.

[0012] Preferably, the oxidizer nozzle and the fuel nozzle are arranged opposite each other on different wafer layers.

[0013] Preferably, the jet direction of the oxidizer nozzle and the fuel nozzle is perpendicular to the jet direction of the jet outlet.

[0014] Preferably, the nozzle diameters of the oxidizer nozzle and the fuel nozzle are 20-100 μm.

[0015] Preferably, the combustion chamber is a flat square tube with a height of 0.8-1.5 mm;

[0016] Preferably, the first wafer layer, the second wafer layer, the third wafer layer, and the fourth wafer layer are standard wafers with a single layer thickness of 0.8-1 mm.

[0017] Preferably, a distributed space micro-propulsion array includes multiple space thrusters, an array frame, and a patch microwave transmitting antenna. Each long side of the array frame is embedded with three space thrusters, and each short side is embedded with two space thrusters. A patch microwave transmitter is disposed in the middle of the upper part of the array frame.

[0018] Compared with the prior art, the beneficial effects of the present invention are:

[0019] The space thruster provided by this invention has a much smaller volume and total mass than common chemical thrusters, which improves the thrust-to-weight ratio of the thruster. Therefore, it allows spacecraft to retain the ability to obtain a large impulse in a short time for rapid orbit change while increasing the effective payload capacity, thus further improving the applicability of the space thruster. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of the present invention;

[0021] Figure 2 This is an exploded view of Embodiment 1 of the present invention;

[0022] Figure 3 This is a schematic diagram of the structure of the first wafer layer in Embodiment 1 of the present invention;

[0023] Figure 4 This is a schematic diagram of the structure of the second wafer layer in Embodiment 1 of the present invention;

[0024] Figure 5 This is a schematic diagram of the structure of the third wafer layer in Embodiment 1 of the present invention;

[0025] Figure 6 This is a schematic diagram of the structure of the fourth wafer layer in Embodiment 1 of the present invention;

[0026] Figure 7 This is a schematic diagram of the structure of Embodiment 2 of the present invention. Detailed Implementation

[0027] To facilitate understanding of the technical solution of the present invention by those skilled in the art, the technical solution of the present invention will now be further described in conjunction with the accompanying drawings.

[0028] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0029] In this application, unless otherwise expressly specified and limited, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise expressly and specifically limited.

[0030] Example 1

[0031] See Figures 1 to 6 This embodiment discloses a space thruster, including a first wafer layer 1, a second wafer layer 2, a third wafer layer 3, and a fourth wafer layer 4. The first wafer layer 1, the second wafer layer 2, the third wafer layer 3, and the fourth wafer layer 4 are all made of MEMS systems. The first wafer layer 1, the second wafer layer 2, the third wafer layer 3, and the fourth wafer layer 4 are stacked sequentially to form a space thruster. In this embodiment, the first wafer layer 1, the second wafer layer 2, the third wafer layer 3, and the fourth wafer layer 4 are standard wafers with a single layer thickness of 0.8-1 mm.

[0032] The aforementioned wafer is made of silicon, silicon dioxide, silicon carbide, silicon nitride, alumina, or other silicon-based materials or low-temperature co-fired ceramics that can be used as MEMS system materials. The wafer is manufactured using MEMS system manufacturing processes, including but not limited to photolithography, electrolithography, plasma etching, vapor deposition, laser engraving, or micromachining. The wafer is assembled using MEMS system bonding processes. Based on the characteristics of MEMS system materials, this space thruster is highly compatible with non-contact microwave ignition, avoiding the problems of damage to the integrity and sealing of the combustion chamber structure and reduction in mechanical structure, system reliability, and production yield caused by directly etching the ignition electrode grooves connected to the combustion chamber on the MEMS system.

[0033] In addition, by using silicon-based compounds or low-temperature co-fired ceramics as manufacturing materials for this space thruster, the feasibility of obtaining production materials in outer space is improved, the applicability of in-situ resource utilization technology in outer space is expanded, and the material basis for the on-orbit and on-Earth extraterrestrial manufacturing of space thrusters is provided, thereby improving the flexibility of extraterrestrial exploration missions.

[0034] The space thruster is equipped with an oxidizer inlet 5, a fuel inlet 6, a coolant inlet 7, a coolant outlet 8, and a jet outlet 9.

[0035] Oxidant channels 10, fuel channels 11, and coolant channels 12 are provided on both the first wafer layer 1 and the fourth wafer layer 4. The oxidant inlet 5 passes through the first wafer layer 1, the second wafer layer 2, and the third wafer layer 3 in sequence, connecting the oxidant channels 10 on the first wafer layer 1 and the fourth wafer layer 4. The fuel inlet 6 passes through the first wafer layer 1, the second wafer layer 2, and the third wafer layer 3 in sequence, connecting the fuel channels 11 on the first wafer layer 1 and the fourth wafer layer 4. The coolant inlet 7 and the coolant outlet 8 are connected to the coolant channels 12 on the first wafer layer 1.

[0036] Specifically, the oxidant inlet 5 and oxidant channel 10 are located at the top of the first wafer layer 1, the fuel inlet 6 and fuel channel 11 are located in the middle of the first wafer 1, and the coolant outlet 8 and coolant inlet 7 are located between the fuel inlet 6 and the oxidant inlet 5.

[0037] Combustion grooves 13 and Laval nozzle grooves 14 are provided on opposite sides of the second wafer layer 2 and the third wafer layer 3. Two combustion grooves 13 are stacked to form a combustion chamber. In this embodiment, the combustion chamber is a flat square tube with a height of 0.8-1.5 mm. Two Laval nozzle grooves 14 are stacked to form a Laval nozzle channel. In this embodiment, the expansion ratio of the Laval nozzle channel is 3-10. The combustion grooves 14 and Laval nozzle grooves 13 are connected, causing the stacked combustion chamber to communicate with the Laval nozzle. The nozzle channel is connected, and the jet outlet 9 is located at the bottom of the Laval nozzle channel. The second wafer layer 2 and the third wafer layer 3 are both provided with through coolant side channels 15. The coolant channel 12 on the first wafer layer 1 is connected to the coolant channel 12 on the fourth wafer layer 4 through the coolant side channel 15. The combustion chamber 13 of the second wafer layer 2 and the third wafer layer 3 are both provided with oxidant nozzles 16 connected to oxidant channels 10 and fuel nozzles 17 connected to fuel channels 11.

[0038] Specifically, the oxidant nozzles 16 and fuel nozzles 17 on the same wafer layer are staggered, while the oxidant nozzles 16 and fuel nozzles 17 on different wafer layers are arranged opposite each other to ensure that the oxidant and fuel are fully mixed. In this embodiment, the oxidant is oxygen and the fuel is methane.

[0039] Furthermore, the jet direction of the oxidizer nozzle 16 and the fuel nozzle 17 is perpendicular to the jet direction of the jet outlet 9.

[0040] Furthermore, the diameters of the oxidizer nozzle 16 and the fuel nozzle 17 are 20-100 μm.

[0041] The working principle of this embodiment is as follows: oxygen enters from the oxidizer inlet 5, and methane enters from the fuel inlet 6. After passing through the oxidizer channel 10 and the fuel channel 11 respectively, they are injected into the combustion chamber through the oxidizer nozzle 16 and the fuel nozzle 17 to mix and burn. Then, they are ejected from the nozzle outlet 3 to generate thrust. At the same time, coolant enters from the coolant inlet 7 and leaves the thruster from the coolant outlet 8.

[0042] The space thruster provided by this invention, due to its significantly smaller size and total mass compared to common chemical thrusters, improves the thrust-to-weight ratio. This allows spacecraft to retain the ability to quickly gain a large impulse for rapid orbital maneuvers while increasing payload capacity, further expanding the applicability of space thrusters. Furthermore, this space thruster is a novel bicomponent chemical propulsion system integrating MEMS technology, cryogenic propulsion technology, microwave ignition technology, and distributed propulsion concepts. It features low cost, small size, light weight, high reliability, reusable ignition, high thrust-to-weight ratio, and flexible use and production. This effectively improves the efficiency of bicomponent chemical propulsion systems and in-situ resource utilization systems on exoplanets, enriching the design options for space missions.

[0043] Example 2

[0044] See Figure 7 This embodiment discloses a distributed space micro-propulsion array, including multiple space thrusters as described in Embodiment 1, an array frame 18, and a patch microwave transmitting antenna 19. Each long side of the array frame 18 is embedded with 3 space thrusters, and each short side is embedded with 2 space thrusters. A patch microwave transmitter 19 is disposed in the middle of the upper part of the array frame 18.

[0045] When the propulsion array is in operation, propellant is directly injected. Since silicon dioxide is almost transparent to microwaves, the microwave transmitter can directly heat and ignite the propellant in the combustion chamber to generate thrust.

[0046] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention, and no reference numerals in the claims should be construed as limiting the scope of the claims.

[0047] The above embodiments are merely examples of implementation methods of the invention. The scope of protection of the present invention is not limited to the above embodiments. For those skilled in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all fall within the scope of protection of the present invention.

Claims

1. A space thruster, characterized in that: It includes a first wafer layer, a second wafer layer, a third wafer layer, and a fourth wafer layer. The first wafer layer, the second wafer layer, the third wafer layer, and the fourth wafer layer are all made of MEMS system. The first wafer layer, the second wafer layer, the third wafer layer, and the fourth wafer layer are stacked sequentially to form a space thruster. The space thruster is provided with an oxidizer inlet, a fuel inlet, a coolant inlet, a coolant outlet, and a jet outlet. Both the first and fourth wafer layers are provided with oxidant channels, fuel channels, and coolant channels. The oxidant inlet sequentially penetrates the first, second, and third wafer layers, connecting the oxidant channels on the first and fourth wafer layers. The fuel inlet sequentially penetrates the first, second, and third wafer layers, connecting the fuel channels on the first and fourth wafer layers. The coolant inlet and coolant outlet are connected to the coolant channels on the first wafer layer. Combustion slots and Laval nozzle slots are provided on opposite sides of the second and third wafer layers. Two combustion slots are stacked to form a combustion chamber, and two Laval nozzle slots are stacked to form a Laval nozzle channel. The combustion slots and Laval nozzle slots are connected so that the stacked combustion chamber is connected to the Laval nozzle channel. The jet outlet is located at the bottom of the Laval nozzle channel. A through coolant side channel is provided on both the second and third wafer layers. The coolant channel on the first wafer layer is connected to the coolant channel on the fourth wafer layer through the coolant side channel. An oxidizer nozzle connected to an oxidizer channel and a fuel nozzle connected to a fuel channel are provided on the combustion slots of both the second and third wafer layers.

2. A space thruster according to claim 1, characterized in that: The oxidant inlet and oxidant channel are located at the top of the first wafer layer, the fuel inlet and fuel channel are located in the middle of the first wafer, and the coolant outlet and coolant inlet are located between the fuel inlet and the oxidant inlet.

3. A space thruster according to claim 1, characterized in that: The expansion ratio of the Laval nozzle channel is 3-10.

4. A space thruster according to claim 1, characterized in that: Oxidant nozzles and fuel nozzles are staggered on the same wafer layer.

5. A space thruster according to claim 1, characterized in that: Oxidant nozzles and fuel nozzles are arranged opposite each other on different wafer layers.

6. A space thruster according to claim 1, characterized in that: The jet direction of the oxidizer nozzle and fuel nozzle is perpendicular to the jet direction of the jet outlet.

7. A space thruster according to claim 1, characterized in that: The nozzle diameters of the oxidizer nozzle and the fuel nozzle are 20-100 μm.

8. A space thruster according to claim 1, characterized in that: The combustion chamber is a flat square tube with a height of 0.8-1.5 mm.

9. A space thruster according to claim 1, characterized in that: The first wafer layer, the second wafer layer, the third wafer layer, and the fourth wafer layer are standard wafers with a single layer thickness of 0.8-1 mm.

10. A distributed space micro-propulsion array, characterized in that: It includes multiple space thrusters, array frames, and patch microwave transmitting antennas as described in any one of claims 1-9, wherein three space thrusters are embedded in each long side of the array frame, two space thrusters are embedded in each short side, and a patch microwave transmitter is disposed in the middle of the upper part of the array frame.

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