Positioning and heating mechanism of semiconductor automatic film tearing machine

Abstract

The application provides a positioning and heating mechanism of a semiconductor automatic film tearing machine. The first sliding member and the second sliding member are controlled to move towards the middle by adjusting the adjusting knob. The first sliding member and the second sliding member make the strip on the jig disc tend to be consistent with the width direction of the jig disc. The strip on the jig disc tends to be consistent with the length direction of the jig disc by manually adjusting the first moving member and the second moving member. The size of the strip is matched with the size of the jig disc. Meanwhile, the flatness of the strip placed on the jig disc is detected, the warping and deformation of the strip are detected, the heating platform heats the strip through the jig disc, the adhesion between the strip and the film is reduced, the film tearing abnormality is solved, the problem of inconvenient clamping caused by the position difference of the strip is solved, the subsequent conveying platform is parallel to the position of the strip, the strip with the warping and deformation problem is screened out, and the elastic material positioning member protects the strip from being damaged.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing equipment technology, and more specifically to the positioning and heating mechanism of an automatic semiconductor film peeling machine. Background Technology

[0002] Semiconductors are materials based on conductors and insulators that operate at room temperature. They are frequently used in technological fields such as aerospace, automotive, artificial intelligence, and communication systems. Common semiconductor materials include silicon, germanium, and gallium arsenide, with silicon being one of the most influential. However, semiconductors are also among the most delicate materials. In the daily semiconductor manufacturing process, to prevent the semiconductor panel from coming into contact with foreign objects, and to avoid damage to the semiconductor panel during wire bonding, lead securing, sealing, and panel scratches, a thin film with different process requirements is usually coated on the semiconductor material. After completing the above processing, the protective film needs to be removed.

[0003] Traditional film-tearing machines suffer from several drawbacks. During the robotic gripping process, the position of the film strips is not fixed, making operation difficult and hindering proper matching with the subsequent conveying platform. This leads to deviations in the film-tearing position, affecting the film-tearing process. Additionally, there are issues such as incomplete film removal and residues during the tearing process, resulting in a low product qualification rate. Furthermore, they cannot screen warped or deformed film strips, which also cause problems during subsequent film removal. Summary of the Invention

[0004] To address the aforementioned issues, an adjustment knob is used to control the first and second sliding members to move closer together. The first and second sliding members align the strips placed on the fixture tray in the width direction. Manual adjustment of the first and second sliding members aligns the strips on the fixture tray in the length direction. The dimensions of the strips and the fixture tray are matched, ensuring the strips are positioned to meet the requirements of subsequent processes. Simultaneously, the positioning element is made of elastic material to protect the strips from damage. The heating platform heats the strips through the fixture tray, reducing the adhesion between the strips and the film. To address the abnormalities in the film-tearing process, a first and second flatness detector are set up. These detectors are adjusted to rise or fall according to the thickness of the product strips placed on the fixture tray. The first and second flatness detectors work in conjunction with an amplifier to detect the warping and deformation of the strips on the fixture tray, preventing subsequent abnormal film-tearing of deformed strips. This design solves the problem of inconvenient gripping caused by the positional difference of the strips, thus ensuring parallel alignment with the subsequent conveyor platform for easy handling, and also addresses the issue of warping and deformation of the strips. It not only solves the problem of abnormal film-tearing but also protects the strips from damage.

[0005] The technical solution of the present invention: A positioning heating mechanism for an automatic semiconductor film peeling machine includes a main platform, comprising a first platform, a first support column fixedly disposed at the bottom of the first platform, an amplifier fixedly disposed on one side of the first support column, a second support column, a first side plate, a second side plate, and a third support column disposed on the first platform, the second support column being integrally and fixedly connected to the heating platform and a second slide rail, the second slide rail being provided with a second moving part and a second flatness detector, the third support column being integrally and fixedly connected to the heating platform and the first slide rail, the first slide rail being provided with a first moving part and a first flatness detector, the heating platform being connected to a temperature detector, the heating platform being provided with a heating wire, the heating platform being connected to a fixture plate, the first side plate and the second side plate being connected through a drive shaft, a first sliding shaft, and a second sliding shaft, the first sliding part and the second sliding part being provided with through holes disposed on the drive shaft, the first sliding shaft, and the second sliding shaft, the first sliding part being provided with a first positioning part, the second sliding part being provided with a second positioning part, and the drive shaft being connected to an adjustment knob via a pulley.

[0006] As a further aspect of the present invention, the first flatness detection and the second flatness detection are adjusted to rise or fall according to the thickness of the product strip placed on the fixture plate. The first flatness detection and the second flatness detection are combined with the amplifier to detect the warping and deformation of the strip on the fixture plate.

[0007] As a further embodiment of the present invention, the first slide rail and the first moving member cooperate, and the second moving member cooperates with the second flatness detection. By manually adjusting the first moving member and the second moving member, the strip placed on the jig plate tends to match the length direction of the jig plate.

[0008] As a further embodiment of the present invention, the drive shaft cooperates with the first sliding member, the second sliding member, the first side plate, and the second side plate. By adjusting the adjustment knob, the forward rotation of the adjustment knob corresponds to the first sliding member and the second sliding member moving closer to the center, and the reverse rotation of the adjustment knob corresponds to the first sliding member and the second sliding member moving further away. The first sliding shaft and the second sliding shaft play a stabilizing role in the movement of the first sliding member and the second sliding member along the drive shaft direction. The function of the first sliding member and the second sliding member makes the strip placed on the jig plate tend to match the width direction of the jig plate.

[0009] As a further aspect of the present invention, the heating platform heats the jig plate, which then conducts heat to the strip. The heating platform can replace different jig plates according to the different specifications of the strip, and the temperature detection measures the temperature of the contact surface between the heating platform and the jig plate.

[0010] As a further aspect of the present invention, the size of the jig disc is matched with the size of the strip placed on the jig disc.

[0011] As a further aspect of the present invention, the contact positioning element of the first moving member and the second moving member restricting the strip is made of elastic material, and the first positioning element and the second positioning element are made of elastic material.

[0012] Beneficial effects of the present invention

[0013] The positioning and heating mechanism of the semiconductor automatic film peeling machine of this invention uses an adjustment knob to control the first and second sliding members to move closer together. The first and second sliding members align the strip placed on the fixture tray in the width direction with the tray. Manual adjustment of the first and second sliding members aligns the strip placed on the fixture tray in the length direction with the tray. The size of the strip matches the size of the fixture tray, ensuring the strip's position adapts to the requirements of subsequent processes. The positioning member is made of elastic material to protect the strip from damage. The heating platform heats the strip through the fixture tray. Heat reduces the adhesion between the sheet and the film, resolving film tearing abnormalities. Simultaneously, the first and second flatness detectors are adjusted upwards or downwards according to the thickness of the product sheet placed on the fixture tray. These detectors, in conjunction with an amplifier, detect warping and deformation of the sheet on the fixture tray, preventing subsequent film tearing abnormalities caused by deformed sheets. These features resolve the issues of inconvenient gripping due to sheet positional differences, as well as the problems of sheet warping and deformation, thus eliminating film tearing abnormalities and protecting the sheet from damage. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings are briefly described. However, the drawings do not constitute any limitation on the present invention. For those skilled in the art, other drawings can be obtained based on the following drawings without creative effort.

[0015] Explanation of reference numerals in the attached figures:

[0016] Figure 1 The three-dimensional representation of the present invention Figure 1 ;

[0017] Figure 2 This is the three-dimensional representation of the present invention. Figure 2 ;

[0018] Figure 3 This is a breakdown of the present invention. Figure 1 ;

[0019] Figure 4 This is a breakdown of the present invention. Figure 2 ;

[0020] 1. First support column, 2. First platform, 3. Second support column, 4. First side plate, 5. First sliding member, 6. Drive shaft, 7. First sliding shaft, 8. Second sliding shaft, 9. First slide rail, 10. First moving member, 11. First flatness detection, 12. Heating platform, 13. First positioning member, 14. Second positioning member, 15. Second sliding member, 16. Temperature detection, 17. Fixture plate, 18. Amplifier, 19. Second moving member, 20. Second slide rail, 21. Second flatness detection, 22. Pulley, 23. Adjustment knob, 24. Second side plate, 25. Third support column. Detailed Implementation

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0022] like Figure 1-4 As shown, the positioning and heating mechanism of the semiconductor automatic film peeling machine is characterized by: including a first platform 2, a first support column 1 fixedly disposed at the bottom of the first platform 2, an amplifier 18 fixedly disposed on one side of the first support column 1, a second support column 3, a first side plate 4, a second side plate 24 and a third support column 25 disposed on the first platform 2, the second support column 3 being integrally fixedly connected to the heating platform 12 and the second slide rail 20, the second slide rail 20 being provided with a second moving part 19 and a second flatness detector 21, the third support column 25 being integrally fixedly connected to the heating platform 12 and the first slide rail 9, the first slide rail 9 being provided with a... The first moving part 10 and the first flatness detection 11 are connected. The heating platform 12 is connected to the temperature detection 16. The heating platform 12 is equipped with an electric heating wire. The heating platform 12 is connected to the fixture plate 17. The first side plate 4 and the second side plate 24 are connected through the drive shaft 6, the first sliding shaft 7 and the second sliding shaft 8. The first sliding part 5 and the second sliding part 15 are provided with through holes on the drive shaft 6, the first sliding shaft 7 and the second sliding shaft 8. The first sliding part 5 is provided with a first positioning part 13 and the second sliding part 15 is provided with a second positioning part 14. The drive shaft 6 is connected to the adjustment knob 23 through the pulley 22.

[0023] The first flatness detector 11 and the second flatness detector 21 are adjusted to rise or fall according to the thickness of the product strip placed on the fixture plate 17. The first flatness detector 11 and the second flatness detector 21 cooperate with the amplifier 18 to detect the warping and deformation of the strip on the fixture plate 17.

[0024] The first slide rail 9 and the first moving part 10 cooperate, and the second moving part 19 and the second flatness detection 21 cooperate. By manually adjusting the first moving part 10 and the second moving part 19, the strip placed on the jig plate 17 tends to match the length direction of the jig plate 17.

[0025] The drive shaft 6 cooperates with the first sliding member 5, the second sliding member 15, the first side plate 4, and the second side plate 24. By adjusting the adjustment knob 23, the forward rotation of the adjustment knob 23 corresponds to the first sliding member 5 and the second sliding member 15 moving closer to the center, and the reverse rotation of the adjustment knob 23 corresponds to the first sliding member 5 and the second sliding member 15 moving further apart. The first sliding shaft 7 and the second sliding shaft 8 play a stabilizing role in the movement of the first sliding member 5 and the second sliding member 15 along the drive shaft 6. The function of the first sliding member 5 and the second sliding member 15 makes the strip placed on the jig plate 17 tend to match the width direction of the jig plate 17.

[0026] The heating platform 12 heats the fixture plate 17, which then conducts heat to the strip. The heating platform 12 can be replaced with different fixture plates 17 according to the different specifications of the strip. The temperature detection 16 detects the temperature of the contact surface between the heating platform 12 and the fixture plate 17.

[0027] The dimensions of the jig tray 17 are matched with the dimensions of the strips placed on the jig tray 17.

[0028] The first moving member 10 and the second moving member 19 restrict the contact positioning members of the strip to be made of elastic material, and the first positioning member 13 and the second positioning member 14 are made of elastic material.

[0029] Working Principle: The positioning and heating mechanism of the semiconductor automatic film peeling machine of this invention uses an adjustment knob 23 to control the first sliding member 5 and the second sliding member 15 to move closer to the center. The first sliding member 5 and the second sliding member 15 make the strip placed on the fixture tray 17 more aligned with the width direction of the fixture tray 17. By manually adjusting the first moving member 10 and the second moving member 19, the strip placed on the fixture tray 17 is made more aligned with the length direction of the fixture tray. The size of the strip matches the size of the fixture tray 17, so that the position of the strip adapts to the requirements of subsequent processes. At the same time, the positioning member is made of elastic material to protect the strip from damage. The heating platform 12 is connected to the fixture tray. 17. Heating the strip reduces the adhesion between the strip and the film, resolving abnormal film tearing during the process. Simultaneously, the first flatness detector 11 and the second flatness detector 21 are adjusted to rise or fall according to the thickness of the product strip placed on the fixture tray 17. The first flatness detector 11 and the second flatness detector 21 work in conjunction with the amplifier 18 to detect the warping and deformation of the strip on the fixture tray 17, preventing subsequent abnormal film tearing of deformed strips. The above settings solve the problem of inconvenient gripping caused by the positional difference of the strip, as well as the problem of warping and deformation of the strip. They also solve the abnormal film tearing and protect the strip from damage.

[0030] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A positioning and heating mechanism for an automatic semiconductor film peeling machine, characterized in that: The system includes a first platform (2), a first support column (1) fixedly installed at the bottom of the first platform (2), an amplifier (18) fixedly installed on one side of the first support column (1), a second support column (3), a first side plate (4), a second side plate (24) and a third support column (25) installed on the first platform (2), the second support column (3) being integrally fixedly connected to the heating platform (12) and the second slide rail (20), the second slide rail (20) being provided with a second moving part (19) and a second flatness detector (21), the third support column (25) being integrally fixedly connected to the heating platform (12) and the first slide rail (9), the first slide rail (9) being provided with a first moving part (10) and a first flatness detector (21). 11), the heating platform (12) is connected to the temperature detection (16), the heating platform (12) is provided with an electric heating wire, the heating platform (12) is connected to the jig plate (17), the first side plate (4) and the second side plate (24) are connected through the drive shaft (6), the first sliding shaft (7) and the second sliding shaft (8), the drive shaft (6), the first sliding shaft (7) and the second sliding shaft (8) are slidably connected to the through holes provided on the first sliding member (5) and the second sliding member (15), the first sliding member (5) is provided with a first positioning member (13), the second sliding member (15) is provided with a second positioning member (14), the drive shaft (6) is connected to the adjustment knob (23) through the pulley (22).

2. The positioning and heating mechanism of the semiconductor automatic film peeling machine according to claim 1, characterized in that: The first flatness test (11) and the second flatness test (21) are adjusted to rise or fall according to the thickness of the product strip placed on the fixture plate (17). The first flatness test (11) and the second flatness test (21) cooperate with the amplifier (18) to detect the warping and deformation of the strip on the fixture plate (17).

3. The positioning and heating mechanism of the semiconductor automatic film peeling machine according to claim 1, characterized in that: The first slide rail (9) and the first moving part (10) cooperate with each other, and the second moving part (19) and the second flatness detection (21) cooperate with each other. By manually adjusting the first moving part (10) and the second moving part (19), the product strips placed on the jig plate (17) tend to match the length direction of the jig plate (17).

4. The positioning and heating mechanism of the semiconductor automatic film peeling machine according to claim 1, characterized in that: The drive shaft (6) cooperates with the first sliding member (5), the second sliding member (15), the first side plate (4), and the second side plate (24). By adjusting the adjustment knob (23), the forward rotation of the adjustment knob (23) corresponds to the first sliding member (5) and the second sliding member (15) moving closer to the center, and the reverse rotation of the adjustment knob (23) corresponds to the first sliding member (5) and the second sliding member (15) moving further apart. The first sliding shaft (7) and the second sliding shaft (8) play a stabilizing role in the movement of the first sliding member (5) and the second sliding member (15) along the drive shaft (6). The function of the first sliding member (5) and the second sliding member (15) makes the product strip placed on the jig plate (17) tend to match the width direction of the jig plate (17).

5. The positioning and heating mechanism of the semiconductor automatic film peeling machine according to claim 1, characterized in that: The heating platform (12) heats the jig plate (17), which then conducts heat to the product strip. The heating platform (12) changes to different jig plates (17) according to the specifications of the product strip. The temperature detection (16) detects the temperature of the contact surface between the heating platform (12) and the jig plate (17).

6. The positioning and heating mechanism of the semiconductor automatic film peeling machine according to claim 5, characterized in that: The dimensions of the jig tray (17) are matched with the dimensions of the product strips placed on the jig tray (17).

7. The positioning and heating mechanism of the semiconductor automatic film peeling machine according to claim 1, characterized in that: The first moving part (10) and the second moving part (19) restrict the contact positioning of the product strip to be made of elastic material, and the first positioning part (13) and the second positioning part (14) are made of elastic material.

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