Real-time estimation method and system for transient maximum junction temperature of power module of converter

Abstract

The present application relates to the technical field of converter control, and provides a method and system for real-time estimation of transient maximum junction temperature of a power module of a converter, wherein the method comprises: storing the DC voltage, active power, reactive power, power module substrate temperature and power module radiator temperature of the converter at intervals; if the power of the converter jumps and enters an overload state, entering a real-time estimation program for the transient maximum junction temperature: recording the active power and reactive power of the converter after the jump; estimating the steady-state temperature of the power module substrate and the steady-state temperature of the power module radiator after the transient disturbance through a neural network; and estimating the transient maximum junction temperature of the power module through a simplified second-order thermal network model. The present application provides a method for real-time estimation of the transient maximum junction temperature of the power module of the converter, which can accurately estimate the transient maximum junction temperature under the overload condition of the converter and ensure the safe operation of the converter after the transient disturbance.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of converter control, and particularly relates to a method and system for real-time estimation of transient maximum junction temperature of a power module of a converter. BACKGROUND

[0002] A grid-forming converter is connected to a power grid in a voltage source mode, and in a transient process of the power grid suffering from a fault disturbance, the converter needs to withstand a short-time overload power of several times the rated capacity. In the short-time overload operation process of the converter, the most risky problem is that the power module is overheated and burned. However, the temperature detection of the power module of the converter currently generally adopts a built-in NTC resistance mode, and the detection is the power module substrate temperature, which deviates from the chip junction temperature and has a slow response speed, and thus reliable over-temperature protection cannot be implemented during the transient overload. SUMMARY

[0003] The present application aims to solve at least one of the technical problems in the background art, and provides a method and system for real-time estimation of transient maximum junction temperature of a power module of a converter.

[0004] To achieve the above-mentioned purpose, the present application provides a method for real-time estimation of transient maximum junction temperature of a power module of a converter, comprising:

[0005] storing the DC voltage, active power, reactive power, power module substrate temperature and power module radiator temperature of the converter at intervals of time periods;

[0006] if the power of the converter jumps and enters an overload state, entering a real-time estimation program of the transient maximum junction temperature:

[0007] recording the active power and reactive power of the converter after the jump;

[0008] estimating the steady-state temperature of the power module substrate and the steady-state temperature of the power module radiator after the transient disturbance through a neural network;

[0009] estimating the transient maximum junction temperature of the power module through a simplified second-order thermal network model.

[0010] According to an aspect of the present application, the storage of the DC voltage, active power, reactive power, power module substrate temperature and power module radiator temperature of the converter at intervals of time periods is that the DC voltage, active power, reactive power, power module substrate temperature and power module radiator temperature of the converter are stored once every 20 ms.

[0011] According to an aspect of the present application, the judgment method of the jump of the power of the converter is that the sudden change of the apparent power of the converter is greater than 10% of the rated power within 20 ms.

[0012] According to an aspect of the present application, the input parameters of the neural network for estimating the steady-state temperature of the power module substrate and the steady-state temperature of the power module heat sink after the transient disturbance include: DC voltage before the power converter power jump, active power before the power converter power jump, reactive power before the power converter power jump, power module substrate temperature before the power converter power jump, power module heat sink temperature before the power converter power jump, active power after the power converter power jump, and reactive power after the power converter power jump.

[0013] The output parameters of the neural network include: power module substrate steady-state temperature after the power converter power jump and heat sink steady-state temperature after the power converter power jump.

[0014] According to an aspect of the present application, the simplified second-order thermal network model is composed of chip thermal capacity, substrate thermal capacity, thermal resistance between chip and substrate, and thermal resistance between substrate and heat sink.

[0015] According to an aspect of the present application, the simplified second-order thermal network model estimates the transient maximum junction temperature of the power module by the following formula:

[0016]

[0017] Wherein, T j_max is the estimated value of the transient maximum junction temperature of the power module, T d0 is the measured value of the power module substrate temperature before the transient disturbance, T s0 is the measured value of the power module heat sink temperature before the transient disturbance, T d1 is the neural network estimated value of the power module substrate temperature after the transient disturbance, T s1 is the neural network estimated value of the power module heat sink temperature after the transient disturbance, C j is the chip thermal capacity, C d is the power module substrate thermal capacity, R jd is the thermal resistance between chip and power module substrate, R ds is the thermal resistance between power module substrate and power module heat sink, R js = R jd + R ds .

[0018] To achieve the above-mentioned purposes, the present application also provides a real-time estimation system for the transient maximum junction temperature of the power module of the power converter, comprising:

[0019] A data storage module stores the DC voltage, active power, reactive power, power module substrate temperature and power module heat sink temperature of the power converter at time intervals;

[0020] Transient maximum junction temperature real-time estimation module, if the converter power jumps and enters the overload state, the transient maximum junction temperature real-time estimation program is entered:

[0021] Converter power recording module, recording the active power and reactive power of the converter after the jump;

[0022] Steady-state temperature estimation module, estimating the steady-state temperature of the power module substrate and the steady-state temperature of the power module heat sink after the transient disturbance through the neural network;

[0023] Power module transient maximum junction temperature estimation module, estimating the power module transient maximum junction temperature through a simplified second-order thermal network model.

[0024] To achieve the above purpose, the application further provides an electronic device, including a processor, a memory and a computer program stored on the memory and executable on the processor, and the computer program is executed by the processor to realize the converter power module transient maximum junction temperature real-time estimation method as described above.

[0025] To achieve the above purpose, the application further provides a computer readable storage medium, and the computer readable storage medium stores a computer program, and the computer program is executed by a processor to realize the converter power module transient maximum junction temperature real-time estimation method as described above.

[0026] According to the above scheme of the application, the application provides a converter power module transient maximum junction temperature real-time estimation method aiming at the problem that the power module junction temperature of the converter cannot be accurately and reliably detected in the transient process, estimates the steady-state junction temperature of the overload working condition through a large amount of running data, and inversely calculates the transient maximum junction temperature through a thermal impedance model, so as to realize the fast and accurate estimation of the transient maximum junction temperature of the converter in the initial stage of the overload working condition, and guarantee the safe operation of the converter after the transient disturbance. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 A flow chart schematically showing a converter power module transient maximum junction temperature real-time estimation method according to an embodiment of the application;

[0028] Figure 2 A structure diagram schematically showing a simplified second-order thermal network model according to an embodiment of the application. DETAILED DESCRIPTION

[0029] The content of the application will now be discussed with reference to exemplary embodiments. It should be understood that the discussed embodiments are only for better understanding and thus realizing the content of the application by those of ordinary skill in the art, and are not intended to imply any limitation on the scope of the application.

[0030] As used herein, the term "includes" and its variants are to be read as open-ended terms that mean "including, but not limited to." The term "based on" is to be construed as "based at least in part on." The terms "one implementation" and "an implementation" are to be construed as "at least one implementation."

[0031] Figure 1 The flow chart schematically represents a method for real-time estimation of transient maximum junction temperature of a power module of a converter according to an embodiment of the present application. In the present embodiment, the method for real-time estimation of transient maximum junction temperature of a power module of a converter comprises:

[0032] The DC voltage, active power, reactive power, power module substrate temperature and power module heat sink temperature of the converter are stored at time intervals;

[0033] If the power of the converter jumps and enters an overload state, the real-time estimation program of the transient maximum junction temperature is entered:

[0034] The active power and reactive power of the converter after the jump are recorded;

[0035] The steady-state temperature of the power module substrate and the steady-state temperature of the power module heat sink after the transient disturbance are estimated by the neural network;

[0036] The transient maximum junction temperature of the power module is estimated by the simplified second-order thermal network model.

[0037] According to the above method of the present application, the transient maximum junction temperature can be accurately estimated under the overload condition of the converter, and the safe operation of the converter after the transient disturbance is ensured.

[0038] Further, according to an embodiment of the present application, the time interval storage of the DC voltage, active power, reactive power, power module substrate temperature and power module heat sink temperature of the converter is that the DC voltage, active power, reactive power, power module substrate temperature and power module heat sink temperature of the converter are stored once every 20 ms. In this way, the converter data can be measured quickly, and the subsequent estimation and discrimination can be more accurate and reliable.

[0039] Further, according to an embodiment of the present application, the method for determining the power jump of the converter is that the apparent power of the converter changes more than 10% of the rated power within 20 ms. In this way, the fault power jump and the normal load fluctuation can be accurately distinguished. Further, according to an embodiment of the present application, the input parameters of the neural network for estimating the steady-state temperature of the power module substrate and the steady-state temperature of the power module heat sink after the transient disturbance include: the DC voltage before the power jump of the converter, the active power before the power jump of the converter, the reactive power before the power jump of the converter, the temperature of the power module substrate before the power jump of the converter, the temperature of the power module heat sink before the power jump of the converter, the active power after the power jump of the converter, and the reactive power after the power jump of the converter.

[0040] The output parameters of the neural network include: the steady-state temperature of the power module substrate after the power jump of the converter and the steady-state temperature of the heat sink after the power jump of the converter.

[0041] Further, according to an embodiment of the present application, the simplified second-order thermal network model is composed of the chip thermal capacity, the substrate thermal capacity, the thermal resistance between the chip and the substrate, and the thermal resistance between the substrate and the heat sink.

[0042] Further, Figure 2 The structural diagram of the simplified second-order thermal network model according to an embodiment of the present application is schematically shown. As shown in the figure, Figure 2 In this embodiment, the simplified second-order thermal network model estimates the transient maximum junction temperature of the power module by the following formula:

[0043]

[0044] Wherein, T j_max is the estimated value of the transient maximum junction temperature of the power module, T d0 is the measured value of the temperature of the power module substrate before the transient disturbance, T s0 is the measured value of the temperature of the power module heat sink before the transient disturbance, T d1 is the estimated value of the temperature of the power module substrate after the transient disturbance, T s1 is the estimated value of the temperature of the power module heat sink after the transient disturbance, C j is the chip thermal capacity, C d is the power module substrate thermal capacity, R jd is the thermal resistance between the chip and the power module substrate, R ds is the thermal resistance between the power module substrate and the power module heat sink, R js = R jd + R ds .

[0045] According to the above scheme of the present application, in order to solve the problem that the power module junction temperature of the converter cannot be accurately and reliably detected in the transient process, a real-time estimation method for the transient maximum junction temperature of the power module of the converter is provided, the steady-state junction temperature of the overload working condition is estimated through a large amount of operation data, and the transient maximum junction temperature is back calculated through a thermal impedance model (a simplified second-order thermal network model), so that the transient maximum junction temperature is quickly and accurately estimated at the initial stage of the overload working condition of the converter, and the safe operation of the converter after the transient disturbance is ensured.

[0046] Further, in order to achieve the above object, the present application further provides a real-time estimation system for the transient maximum junction temperature of the power module of the converter, comprising:

[0047] a data storage module, which stores the DC voltage, active power, reactive power, power module substrate temperature and power module radiator temperature of the converter at time intervals;

[0048] a real-time estimation module for the transient maximum junction temperature, which enters a real-time estimation program for the transient maximum junction temperature if the power of the converter jumps and enters an overload state:

[0049] a converter power recording module, which records the active power and reactive power of the converter after the jump;

[0050] a steady-state temperature estimation module, which estimates the steady-state temperature of the power module substrate and the steady-state temperature of the power module radiator after the transient disturbance through a neural network;

[0051] a power module transient maximum junction temperature estimation module, which estimates the transient maximum junction temperature of the power module through a simplified second-order thermal network model.

[0052] According to the above method of the present application, the transient maximum junction temperature can be accurately estimated under the overload working condition of the converter, and the safe operation of the converter after the transient disturbance is ensured.

[0053] Further, according to an embodiment of the present application, the time interval storage of the DC voltage, active power, reactive power, power module substrate temperature and power module radiator temperature of the converter is that the DC voltage, active power, reactive power, power module substrate temperature and power module radiator temperature of the converter are stored once every 20 ms.

[0054] Further, according to an embodiment of the present application, the judgment method for the jump of the power of the converter is that the apparent power mutation of the converter in 20 ms is greater than 10% of the rated power.

[0055] Further, according to an embodiment of the present application, the input parameters of the neural network for estimating the steady-state temperature of the power module substrate and the steady-state temperature of the power module heat sink after the transient disturbance include: the DC voltage before the power jump of the converter, the active power before the power jump of the converter, the reactive power before the power jump of the converter, the temperature of the power module substrate before the power jump of the converter, the temperature of the power module heat sink before the power jump of the converter, the active power after the power jump of the converter, and the reactive power after the power jump of the converter.

[0056] The output parameters of the neural network include: the steady-state temperature of the power module substrate after the power jump of the converter and the steady-state temperature of the heat sink after the power jump of the converter.

[0057] Further, according to an embodiment of the present application, the simplified second-order thermal network model is composed of the chip thermal capacity, the substrate thermal capacity, the thermal resistance between the chip and the substrate, and the thermal resistance between the substrate and the heat sink.

[0058] Further, Figure 2 The structural diagram of the simplified second-order thermal network model according to an embodiment of the present application is schematically shown. As shown in Figure 2 In the present embodiment, the simplified second-order thermal network model estimates the transient maximum junction temperature of the power module by the following formula:

[0059]

[0060] wherein, T j_max is the estimated value of the transient maximum junction temperature of the power module, T d0 is the measured value of the temperature of the power module substrate before the transient disturbance, T s0 is the measured value of the temperature of the power module heat sink before the transient disturbance, T d1 is the estimated value of the temperature of the power module substrate after the transient disturbance, T s1 is the estimated value of the temperature of the power module heat sink after the transient disturbance, C j is the chip thermal capacity, C d is the power module substrate thermal capacity, R jd is the thermal resistance between the chip and the power module substrate, R ds is the thermal resistance between the power module substrate and the power module heat sink, R js =R jd +R ds .

[0061] According to the above scheme of the present application, in order to solve the problem that the power module junction temperature of the converter cannot be accurately and reliably detected in a transient process, a real-time estimation method for the transient maximum junction temperature of the power module of the converter is provided, the steady-state junction temperature of the overload working condition is estimated through a large amount of operation data, and the transient maximum junction temperature is back calculated through a thermal impedance model, so that the transient maximum junction temperature is quickly and accurately estimated at the initial stage of the overload working condition of the converter, and the safe operation of the converter after the transient disturbance is ensured.

[0062] Further, in order to achieve the above object, the present application further provides an electronic device, comprising a processor, a memory, and a computer program stored in the memory and executable on the processor, and the computer program is executed by the processor to implement the method as described above.

[0063] Further, in order to achieve the above object, the present application further provides a computer readable storage medium, and the computer readable storage medium stores a computer program, and the computer program is executed by the processor to implement the method as described above.

[0064] Those skilled in the art can understand that the modules and algorithm steps described in combination with the embodiments disclosed herein can be realized by electronic hardware or a combination of computer software and electronic hardware. Whether the functions are realized in hardware or software depends on the specific application and design constraints of the technical solution. The skilled person can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present application.

[0065] Those skilled in the art can clearly understand that, for the convenience and brevity of the description, the specific working process of the above-described device and equipment can refer to the corresponding process in the foregoing method embodiments, which will not be repeated here.

[0066] In the embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the division of the modules is only a logical function division, and actual implementation can have another division manner, for example, a plurality of modules or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the shown or discussed mutual ones can be indirect coupling or communication connection through some interfaces, devices or modules, and can be electrical, mechanical or other forms.

[0067] The modules described as separate components may or may not be physically separate, and the components shown as modules may or may not be physical modules, i.e., may be located in one place or distributed over multiple network modules. Some or all of the modules can be selected according to actual needs to achieve the purpose of the embodiments of the present application.

[0068] In addition, each functional module in the embodiments of the present application can be integrated into one processing module, or each module can exist physically independently, or two or more modules can be integrated into one module.

[0069] If the functions are realized in the form of software functional modules and sold or used as independent products, they can be stored in a computer readable storage medium. Based on this understanding, the technical solutions of the present application or the part of the present application that essentially contributes to the prior art or the part of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the energy-saving signal transmission / reception method of the embodiments of the present application. The aforementioned storage medium includes a U disk, a mobile hard disk, a ROM, a RAM, a magnetic disk or an optical disk, and various program code storage media.

[0070] The above description is only the preferred embodiments of the present application and the explanation of the applied technical principles. Those skilled in the art should understand that the scope of the application involved in the present application is not limited to the technical solutions formed by the specific combinations of the above technical features, and also covers other technical solutions formed by any combination of the above technical features or equivalent features without departing from the inventive concept. For example, the above features are replaced with the technical features disclosed in the present application (but not limited to) having similar functions to form technical solutions.

[0071] It should be understood that the sequence of the steps in the summary and embodiments of the present application does not absolutely mean the order of execution, and the execution order of the processes should be determined according to their functions and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

Claims

1. A real-time estimation method for the transient maximum junction temperature of a converter power module, characterized in that: include: Storing converter DC voltage, active power, reactive power, power module substrate temperature, and power module heat sink temperature at time intervals; If the converter power jumps and enters the overload state, the transient maximum junction temperature real-time estimation program is entered: Record the active power and reactive power of the converter after the jump; The steady-state temperature of the power module substrate and the steady-state temperature of the power module heat sink after transient disturbance are estimated by neural network; Estimate the transient maximum junction temperature of the power module by simplifying the second-order thermal network model; The simplified second-order thermal network model is composed of the chip heat capacity, the substrate heat capacity, the thermal resistance between the chip and the substrate, and the thermal resistance between the substrate and the heat sink; The simplified second-order thermal network model estimates the transient maximum junction temperature of the power module using the following formula: ， in, , is the estimated value of the transient maximum junction temperature of the power module, is the measured temperature of the power module substrate before the transient disturbance, is the measured temperature of the power module heat sink before the transient disturbance, is the neural network estimated value of the power module substrate temperature after transient disturbance, is the neural network estimated value of the power module heat sink temperature after transient disturbance, is the chip thermal capacity, is the thermal capacity of the power module substrate, is the thermal resistance between the chip and the power module substrate, is the thermal resistance between the power module substrate and the power module heat sink, .

2. The method for real-time estimation of transient maximum junction temperature of a converter power module according to claim 1, characterized in that: The converter DC voltage, active power, reactive power, power module substrate temperature and power module radiator temperature are stored at intervals of 20 ms.

3. The method for real-time estimation of transient maximum junction temperature of a converter power module according to claim 1, characterized in that: The method for judging whether the converter power jump occurs is: the apparent power sudden change of the converter is greater than 10% of the rated power within 20ms.

4. The method for real-time estimation of transient maximum junction temperature of a converter power module according to claim 1, characterized in that: The input parameters of the neural network for estimating the steady-state temperature of the power module substrate and the steady-state temperature of the power module radiator after the transient disturbance include: the DC voltage before the converter power jump, the active power before the converter power jump, the reactive power before the converter power jump, the power module substrate temperature before the converter power jump, the power module radiator temperature before the converter power jump, the active power after the converter power jump, and the reactive power after the converter power jump; The output parameters of the neural network include: a steady-state temperature of a power module substrate after a power jump of the converter and a steady-state temperature of a heat sink after a power jump of the converter.

5. A real-time estimation system for the transient maximum junction temperature of a converter power module, characterized in that: include: A data storage module stores the converter DC voltage, active power, reactive power, power module substrate temperature, and power module heat sink temperature at time intervals; The module for real-time estimation of transient maximum junction temperature is used. If the converter power jumps and enters the overload state, the module will enter the real-time estimation program of transient maximum junction temperature: Converter power recording module, recording the active power and reactive power of the converter after the jump; Steady-state temperature estimation module, which estimates the steady-state temperature of the power module substrate and the steady-state temperature of the power module heat sink after transient disturbance through a neural network; The power module transient maximum junction temperature estimation module estimates the power module transient maximum junction temperature by simplifying the second-order thermal network model; The simplified second-order thermal network model is composed of the chip heat capacity, the substrate heat capacity, the thermal resistance between the chip and the substrate, and the thermal resistance between the substrate and the heat sink; The simplified second-order thermal network model estimates the transient maximum junction temperature of the power module using the following formula: ， in, , is the estimated value of the transient maximum junction temperature of the power module, is the measured temperature of the power module substrate before the transient disturbance, is the measured temperature of the power module heat sink before the transient disturbance, is the neural network estimated value of the power module substrate temperature after transient disturbance, is the neural network estimated value of the power module heat sink temperature after transient disturbance, is the chip thermal capacity, is the thermal capacity of the power module substrate, is the thermal resistance between the chip and the power module substrate, is the thermal resistance between the power module substrate and the power module heat sink, .

6. An electronic device, characterized in that The invention comprises a processor, a memory and a computer program stored in the memory and executable on the processor, wherein when the computer program is executed by the processor, the method for real-time estimation of the transient maximum junction temperature of the converter power module according to any one of claims 1 to 4 is implemented.

7. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method for real-time estimation of the transient maximum junction temperature of a converter power module is implemented according to any one of claims 1 to 4.

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