Heat dissipation device and computing device

Abstract

The embodiment of the present application provides a heat dissipation device and a computing device, wherein the heat dissipation device comprises a base, which comprises a base body and a plurality of fins, the base body has oppositely arranged top and bottom surfaces, the bottom surface is used for being in contact with a heating element to absorb heat of the heating element; the plurality of fins are arranged at intervals on the top surface of the base body, and adjacent two fins and the top surface of the base body between the adjacent two fins form a cooling area; a jet flow assembly is arranged on the side of the base body away from the base body, the jet flow assembly comprises an inner cavity, a liquid inlet and at least one first nozzle, the liquid inlet and the first nozzle are in communication with the inner cavity of the jet flow assembly, and the first nozzle sprays cooling medium towards the cooling area. The heat dissipation device and the computing device provided by the present application have the advantages of targeted cooling, improved cooling efficiency, and convenient assembly and disassembly.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of electronic equipment, and in particular to a heat dissipation device and a computing device. Background Art

[0002] Internet service providers, enterprise platforms, research institutions, and other organizations all require massive computing resources. The platforms that handle storage, computing, and networking are called data centers. With the increasing demand for information and communications technology in modern society, the density of computing equipment in data centers has gradually shifted from low to high density. This has led to a significant increase in the amount of heat generated by computing equipment during operation, necessitating the development of cooling systems for computing equipment.

[0003] In related art, a computing device includes a housing, a circuit board disposed within the housing, and a heating element disposed on the circuit board. A heat sink is disposed on the side of the heating element away from the circuit board. The heat sink can contact and transfer heat to the heating element, thereby reducing the heat generated by the heating element. Heat from the heat sink can be dissipated through methods such as immersion cooling and spray cooling.

[0004] However, the cooling efficiency of the heat sink in the related art is limited and cannot meet the growing heat dissipation demand of computing devices. Summary of the Invention

[0005] The embodiments of the present application provide a heat dissipation device and a computing device to solve the problem that the heat dissipation device of the related art has limited cooling efficiency and cannot meet the growing heat dissipation demand of the computing device.

[0006] To achieve the above objectives, this application provides the following technical solutions:

[0007] One aspect of an embodiment of the present application provides a heat dissipation device, comprising: a base, comprising a base and a plurality of fins, the base having a top surface and a bottom surface disposed opposite to each other, the bottom surface being configured to contact a heating element to absorb heat from the heating element; the plurality of fins being spaced apart on the top surface of the base, and two adjacent fins and the top surface of the base located between the two adjacent fins forming a cooling zone;

[0008] A jet assembly is arranged on a side of the base away from the base, and the jet assembly includes an inner cavity, a liquid inlet and at least one first nozzle. The liquid inlet and the first nozzle are both connected to the inner cavity of the jet assembly, and the first nozzle sprays cooling medium toward the cooling zone.

[0009] The heat dissipation device provided in the application is characterized in that a base is arranged, the base comprises a base body, the bottom surface of the base body is in contact with the heat generating element for heat transfer, the top surface of the base body is arranged with a plurality of fins at intervals, and the cooling area is formed between the top surface of the base body between the adjacent two fins; and a jet flow assembly is arranged, the jet flow assembly has an inner cavity, a liquid inlet and a first nozzle, the liquid inlet and the first nozzle are in communication with the inner cavity of the jet flow assembly, so that the cooling medium enters the inner cavity of the jet flow assembly through the liquid inlet, and the cooling medium is sprayed out of the first nozzle towards the cooling area, so as to be cooled specifically, thereby improving the cooling efficiency of the heat dissipation device. In addition, compared with the related art in which the nozzle is mounted on the case of the computing device, the jet flow assembly provided in the embodiment of the application is mounted on the base, which has the advantages of facilitating the assembly and disassembly of the computing device.

[0010] In one possible implementation, the first nozzle sprays the cooling medium towards two opposite side walls of the adjacent two fins; and / or, the first nozzle sprays the cooling medium towards the top surface of the base body between the adjacent two fins.

[0011] Through the above scheme, the heat dissipation between the adjacent two fins is accelerated, and / or, the heat dissipation of the base body between the adjacent two fins is accelerated.

[0012] In one possible implementation, the jet flow assembly is arranged on the side of the fin away from the base body, and at least part of the bottom surface of the jet flow assembly covers the top of the cooling area and is provided with the first nozzle.

[0013] Through the above scheme, the cooling medium sprayed out of the first nozzle flows towards the top surface of the base body, thereby facilitating the heat dissipation of the top surface of the base body.

[0014] In one possible implementation, the jet flow assembly is provided with a second nozzle in communication with the inner cavity of the jet flow assembly, the second nozzle is located on the side of the fin away from the top surface of the base body, and sprays the cooling medium towards the side of the fin away from the top surface of the base body.

[0015] Through the above scheme, the temperature of the side of the fin away from the top surface of the base body is reduced.

[0016] In one possible implementation, at least part of the jet flow assembly extends into the cooling area and is provided with the first nozzle.

[0017] Through the above scheme, the heat dissipation effect is improved by reducing the distance between the first nozzle and the fin.

[0018] In one possible implementation, at least part of the jet assembly is located outside the outermost side wall of the outermost peripheral fin and is provided with a third jet opening, which sprays the cooling medium towards the outermost side wall of the outermost peripheral fin.

[0019] The above scheme is used to cool the outermost peripheral fin.

[0020] In one possible implementation, the jet assembly comprises a cover and a bottom plate, the cover has an inner cavity and an opening communicating with the inner cavity of the cover; the bottom plate is detachably connected with the cover and covers the opening of the cover, and together with the cover, the bottom plate encloses a space for storing the cooling medium, and the bottom plate is provided with the first jet opening.

[0021] The above scheme is used to simplify the assembly of the jet assembly and facilitate the processing of the jet assembly.

[0022] In one possible implementation, the fin is in the shape of a sheet and extends along a first direction, and a plurality of the fins are arranged at intervals along a second direction.

[0023] The first direction and the second direction are both parallel to the bottom surface of the base body, and the first direction intersects the second direction.

[0024] The cooling area is in communication with the outside at both ends in the first direction.

[0025] The above scheme is used to make the cooling medium of the cooling area flow out along the first direction, so as to further improve the heat dissipation effect.

[0026] In one possible implementation, the plurality of fins are arranged in multiple columns along a first direction, and adjacent two fins in each column are arranged at intervals along a second direction.

[0027] The first direction and the second direction are both parallel to the bottom surface of the base body, and the first direction intersects the second direction.

[0028] The cooling area is in communication with the outside in the first direction and in the second direction.

[0029] The above scheme is used to make the cooling medium of the cooling area diffuse to the surroundings, so as to further improve the heat dissipation effect.

[0030] Another aspect of the embodiments of the present application provides a computing device, comprising a cabinet, the cabinet having an inner cavity, an input port and an output port, the inner cavity of the cabinet being provided with a circuit board, a heat generating element and a heat dissipation device as described above, the input port being in communication with the liquid inlet of the heat dissipation device through a pipeline, the output port being in communication with the inner cavity of the cabinet and being used for the cooling medium to flow out; the heat generating element being arranged on the circuit board, and the heat generating element being in contact with the bottom surface of the base of the heat dissipation device for heat transfer.

[0031] The computing device provided by the embodiments of the present application has the advantages of targeted cooling and improved cooling efficiency of the heat dissipation device. In addition, compared with the related art in which the spray head is mounted on the cabinet of the computing device, the jet assembly provided by the embodiments of the present application is mounted on the base, and has the advantages of facilitating assembly and disassembly of the computing device.

[0032] In addition to the technical problems solved by the embodiments of the present application described above, the technical features constituting the technical solutions and the beneficial effects brought by these technical features, other technical problems solved by the embodiments of the present application, other technical features included in the technical solutions and the beneficial effects brought by these technical features will be further described in detail in the specific embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0033] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0034] Figure 1 The liquid jet cooling method of the related art;

[0035] Figure 2 A schematic diagram of a computing device provided by the embodiments of the present application;

[0036] Figure 3 A top view of a base provided by the embodiments of the present application;

[0037] Figure 4 A top view of another base provided by the embodiments of the present application;

[0038] Figure 5 A schematic diagram of a first heat dissipation device provided by the embodiments of the present application;

[0039] Figure 6 A schematic diagram of a second heat dissipation device provided by the embodiments of the present application;

[0040] Figure 7 A schematic diagram of a third heat dissipation device provided by the embodiments of the present application;

[0041] Figure 8A fourth heat dissipation device provided by the embodiment of the present application;

[0042] Figure 9 A perspective view of a body part provided by the embodiment of the present application;

[0043] Figure 10 For Figure 9 An exploded view of the body part is shown;

[0044] Figure 11 A top view of another jet assembly provided by the embodiment of the present application;

[0045] Figure 12 A schematic view of a server system provided by the embodiment of the present application.

[0046] Marked with reference numerals:

[0047] 110 - heat sink; 111 - heat transfer part; 112 - fin part; 120 - top wall of the cabinet; 130 - nozzle; 140 - pipeline;

[0048] 200 - heat dissipation device;

[0049] 210 - base; 211 - base body; 212 - fin; 213 - cooling area;

[0050] 220 - jet assembly;

[0051] 221 - body part; 2211 - cover; 2212 - bottom plate; 2213 - sealing element; 2214 - pipe body;

[0052] 222 - drainage part;

[0053] 223 - liquid inlet; 224 - first nozzle; 225 - second nozzle; 226 - third nozzle;

[0054] 300 - cabinet; 310 - output port; 320 - input port;

[0055] 400 - circuit board;

[0056] 500 - heat generating element;

[0057] 600 - liquid level;

[0058] 700 - inflow pipe;

[0059] 810 - heat exchanger; 820 - liquid supply pump; 830 - computing device; 840 - cabinet.

[0060] The specific embodiments of the present application have been described in detail above with reference to the accompanying drawings. The drawings and detailed description are not intended to limit the scope of the present application in any way, but are merely intended to illustrate the concept of the present application to those skilled in the art. DETAILED DESCRIPTION

[0061] Figure 1 The related art is a jet liquid cooling method. Referring to Figure 1 In the related art, the nozzle 130 is mounted on the top wall 120 of the case of the computing device. The cooling medium is delivered to the nozzle 130 through the pipeline 140 and sprayed out of the top end of the heat sink 110 through the nozzle 130. The heat sink 110 includes a heat transfer portion 111 and a fin portion 112 which is arranged at the top surface of the heat transfer portion 111.

[0062] The present inventor has found that the temperature difference between the adjacent two fin portions 112 is large, and if the cooling medium is concentratedly sprayed between the adjacent two fin portions 112, the cooling efficiency of the heat sink 110 can be greatly improved. Figure 1 The dashed line in the figure indicates the cooling medium sprayed out of the nozzle 130. Referring to Figure 1 A part of the cooling medium sprayed out of the nozzle 130 is sprayed to the top surface of the fin portion 112 of the heat sink 110 and splashes away, resulting in a small amount of cooling medium sprayed between the adjacent two fin portions 112, and further resulting in that the cooling effect of the heat sink 110 of the related art is restricted. In addition, the nozzle 130 of the related art is mounted on the top wall 120 of the case of the computing device. When the operator disassembles the top wall 120 of the case for maintenance, the operator is forced to increase the operation difficulty and operation amount due to the pulling of the pipeline 140.

[0063] Therefore, the heat dissipation device provided by the embodiments of the present application sprays the cooling medium towards the cooling area through the first nozzle of the jet assembly, so as to target cooling and improve the cooling efficiency of the heat dissipation device. In addition, compared with the related art, the jet assembly provided by the embodiments of the present application is mounted on the base, which has the advantages of facilitating the assembly and disassembly of the computing device.

[0064] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments of the present application.

[0065] All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative work fall within the scope of the present application. The embodiments and features described below can be combined with each other without conflict.

[0066] Figure 2 A schematic diagram of a computing device is provided for the embodiments of the present application. Referring to Figure 2 , the computing device provided by the embodiments of the present application can include a case 300, a circuit board 400, and a heat generating element 500. The case 300 can have an inner cavity, the circuit board 400 can be disposed in the inner cavity of the case 300, and the heat generating element 500 can be disposed on the surface of the circuit board 400. The heat generating element 500 is an electronic component (such as a chip, a memory, a network card, etc.) that generates heat when working. The circuit board 400 can provide mechanical support for fixing and assembling various heat generating elements 500, and can also provide wiring and electrical connection or electrical insulation between various heat generating elements 500, and provide required electrical properties. Optionally, the computing device can be a server.

[0067] The inner cavity of the case 300 can store a certain height of cooling medium 600 as shown in Figure 2 , the heat generating element 500 of the computing device can be immersed in the cooling medium, and the heat generated by the heat generating element 500 can be taken away by the circulating flow of the cooling medium. The cooling medium can be made of a material such as a non-conductive material, and can be converted between liquid and gas during the cooling process of the heat generating element 500.

[0068] In addition, relatively short heat generating elements 500 such as CPUs (central processing units) and ASICs (application specific integrated circuits) can be completely immersed in the liquid, and the top of relatively high heat generating elements 500 such as memories and network cards can be located above the liquid level 600 of the cooling medium. In order to improve the cooling effect of relatively short heat generating elements 500 such as chips, a heat dissipation device 200 is usually arranged on the side of the heat generating element 500 away from the circuit board 400.

[0069] Specifically, the heat dissipation device 200 provided by the embodiment of the present application can include a base 210, and the base 210 can include a base body 211 and a plurality of fins 212. The base body 211 can have a top surface and a bottom surface arranged oppositely, the bottom surface of the base body 211 can be in direct contact with the heat generating element 500 for heat transfer or in contact with the heat generating element 500 through a heat transfer material, and the top surface of the base body 211 can be provided with a plurality of fins 212 arranged at intervals. The fins 212 can enhance the disturbance of the cooling medium, prevent the large-scale thickening of the thermal boundary layer, reduce the thermal resistance of the thermal boundary layer, and improve the film heat transfer coefficient of the convection side. The fins 212 can also increase the heat dissipation area, thereby ensuring the overall heat dissipation capacity. The material of the fins 212 can generally be cast aluminum alloy, and the fins 212 can be processed by precision machining equipment. In addition, in order to reduce the resistance consumed by the liquid cooling medium, the fins 212 can adopt a water droplet-shaped structure with a front round and a rear sharp, so as to reduce the local flow resistance loss, enhance the fluid disturbance at the position of the fins 212, and enhance the heat exchange efficiency at the position. Of course, the fins 212 can also be elliptical with a front round and a rear round or rhombic with a front sharp and a rear sharp, which can also achieve the purpose of reducing the local flow resistance loss, and the embodiment of the present application is not limited in this regard.

[0070] In addition, the arrangement mode of the plurality of fins 212 can be as follows:

[0071] Figure 3 FIG. 2 is a top view of the base 210 provided by the embodiment of the present application, and Figure 3 In one possible implementation, the fins 212 can be sheet-shaped and extend along a first direction X. The plurality of fins 212 can be arranged at intervals along a second direction Y. The first direction X and the second direction Y are both parallel to the bottom surface of the base body 211, and the first direction X intersects the second direction Y.

[0072] Figure 4 FIG. 3 is another top view of the base 210 provided by the embodiment of the present application, and Figure 4 In one possible implementation, the plurality of fins 212 are arranged in multiple columns along a first direction X, and adjacent two fins 212 in each column are arranged at intervals along a second direction Y. The first direction X and the second direction Y are both parallel to the bottom surface of the base body 211, and the first direction X intersects the second direction Y. In addition, the adjacent two columns of fins 212 can be arranged in alignment as shown in Figure 4 or staggered.

[0073] In addition, in order to improve the heat dissipation effect of the heat dissipation device 110, the heat dissipation device 200 provided by the embodiment of the present application can further include a jet flow assembly 220. The jet flow assembly 220 can be connected with the fins 212 or the base body 211 through welding or the like. Alternatively, the jet flow assembly 220 can be detachably connected with the fins 212 or the base body 211 through buckling, clamping or the like.

[0074] Figure 5 A first schematic diagram of a heat dissipation device 200 is provided in the embodiments of the present application. Referring to Figure 5 , the jet assembly 220 can be arranged on the base 210, and the jet assembly 220 can have an inner cavity, a liquid inlet 223, and a first jet port 224. The liquid inlet 223 and the first jet port 224 can both communicate with the inner cavity of the jet assembly 220. The cooling medium can flow into the inner cavity of the jet assembly 220 through the liquid inlet 223, and can be sprayed out through the first jet port 224. Figure 2 The flow pipe 700 shown can flow into the inner cavity of the jet assembly 220 from the outside of the case 300 through the liquid inlet 223, and can be sprayed out through the first jet port 224.

[0075] Exemplarily, the cooling medium can be made of a material (such as fluorinated liquid, etc.) having a boiling point between 30°C and 60°C. Referring to Figure 5 On the one hand, the cooling medium sprayed out through the first jet port 224 can hit the base 210, so that the liquid cooling medium is heated, and changes from liquid to gas and absorbs a large amount of heat, thereby reducing the temperature of the base 210, and thereby reducing the heat of the heat-generating element 500 in contact with the base 210. Referring to Figure 2 In order to facilitate the recycling of the cooling medium, the case 300 can have an outlet 310 communicating with the inner cavity of the case 300. The gaseous cooling medium mentioned above can flow out of the inner cavity of the case 300 through the outlet 310, and can be converted from gas to liquid by reducing temperature and / or compressing volume, and then returned to the inner cavity of the jet assembly 220 through the pipeline 140.

[0076] Continuing to refer to Figure 5 On the other hand, the cooling medium sprayed out through the first jet port 224 can hit the base 210, so that the bubbles generated in the boiling heat dissipation process of the cooling medium on the base 210 can quickly escape, accelerating the bubble generation rate, and thereby improving the heat dissipation efficiency. In addition, compared with Figure 1 The related art shows that the nozzle 130 is installed in the case 300 of the computing device, referring to Figure 5 The jet assembly 220 provided in the embodiments of the present application is installed in the base 210, so as to facilitate the assembly and disassembly of the computing device.

[0077] As mentioned above, the present inventors found that the temperature difference between the adjacent two fins 212 is large, which indicates that the cooling effect at this place is excellent. In order to improve the cooling efficiency of the heat dissipation device 200, targeted cooling can be performed at this place. Referring to Figure 5 The top surface of the base 211 between the adjacent two fins 212 can form a cooling area 213. The first jet port 224 can spray the cooling medium towards the cooling area 213, so as to facilitate targeted cooling, and thereby improve the cooling efficiency of the heat dissipation device 200.

[0078] In order to facilitate the flow of the gaseous cooling medium, the heat dissipation device 200 can be provided with an opening in communication with the cooling area 213, which can be in communication with the outside (the inner cavity of the case 300). Exemplarily, referring to Figure 3 When the fins 212 are in the form of plates and extend along the first direction X, and the plurality of fins 212 are arranged in multiple columns along the second direction Y, the cooling area 213 can be in communication with the inner cavity of the case 300 at both ends of the first direction X. Another exemplary, referring to Figure 4 When the plurality of fins 212 are arranged in multiple columns along the first direction X, and the adjacent two fins 212 in each column are arranged along the second direction Y, the cooling area 213 can be in communication with the inner cavity of the case 300 along both the first direction X and the second direction Y.

[0079] In addition, referring to Figure 5 The cooling medium flowing out of the first jet port 224 can be sprayed towards the top surface of the base 211 between the adjacent two fins 212; or the cooling medium flowing out of the first jet port 224 can be sprayed towards the two opposite side walls of the adjacent two fins 212; or part of the cooling medium flowing out of the first jet port 224 can be sprayed towards the top surface of the base 211 between the adjacent two fins 212, and another part of the cooling medium flowing out of the first jet port 224 can be sprayed towards the top surface of the base 211 between the adjacent two fins 212.

[0080] Further, the applicant finds that the temperature difference of the fin 212 close to one end of the base 211 is larger than that at other positions, in order to improve the cooling efficiency, the first jet port 224 can spray the cooling medium towards the connection between the fin 212 and the base 211.

[0081] Optionally, referring to Figure 5 The jet assembly 220 can include a body portion 221, which can be arranged on the side of the fin 212 away from the top surface of the base 211. And at least part of the body portion 221 can cover the top of the cooling area 213, and is provided with the first jet port 224. In this way, the first jet port 224 can be opposite to the top surface of the base 211 between the adjacent two fins 212, that is, the projection of the first jet port 224 along the normal direction of the top surface of the base 211 on the top surface of the base 211 can be located in the top surface of the base 211 between the adjacent two fins 212. And the adjacent two fins 212, the top surface of the base 211 between the adjacent two fins 212 and the bottom surface of the body portion 221 between the adjacent two fins 212 can form a chamber with a closed figure in the longitudinal section, so as to avoid the cooling medium sprayed out of the first jet port 224 from splashing out of the top of the fin 212, so as to facilitate the concentrated cooling of the side wall of the fin 212 and the top surface of the base 211 in the cooling area 213, and further improve the cooling effect.

[0082] In the embodiment, the body part 221 can cover the top of the cooling area 213 in a way that it abuts against the end face of the base 211, as shown in the figure; or the body part 221 can cover the top of the cooling area 213 in a way that it is embedded in the cooling area 213. Figure 5 In the embodiment, the body part 221 can cover the top of the cooling area 213 in a way that it abuts against the end face of the base 211, as shown in the figure; or the body part 221 can cover the top of the cooling area 213 in a way that it is embedded in the cooling area 213.

[0083] Figure 6 A second schematic diagram of the heat dissipation device 200 is provided in the embodiment. Referring to the figure, Figure 6 Optionally, the body part can further be provided with a second spout 225, which can be in communication with the inner cavity of the jet assembly 220 and can be located on the side of the fin 212 away from the top face of the base 211 and can spray the cooling medium towards the end face of the top face of the base 211, so as to increase the contact area of the cooling medium with the fin 212 and improve the heat dissipation effect.

[0084] In order to control the splashing area of the cooling medium sprayed through the second spout 225 when it contacts the top face of the fin 212, the second spout 225 can be arranged at the bottom of the groove, and the groove can be arranged outside the top of the fin 212, as shown in the figure. Figure 6 In this way, the splashing area of the cooling medium after it impacts the top face of the fin 212 is controlled in the inner cavity of the groove, and part of the cooling medium can flow along the outer edge of the top face of the fin 212 towards the side wall of the fin 212 and can flow along the side wall of the fin 212 towards the base 211, so as to further reduce the temperature of the fin 212. Of course, in order to concentrate on cooling the joint between the fin 212 and the base 211, the cross section of the first spout 224 can be larger than that of the second spout 225, so that the flow rate of the first spout 224 is greater than that of the second spout 225 per unit time.

[0085] Figure 7 A fourth schematic diagram of the heat dissipation device 200 is provided in the embodiment. Referring to the figure, Figure 7 Optionally, at least part of the body part can be located outside the outermost fin 212 and can be provided with a third spout 226, which can spray the cooling medium towards the outermost side wall of the outermost fin 212.

[0086] Specifically, the outermost fin 212 is the fin 212 close to the outer edge of the base 211, and the side wall of the outermost fin 212 away from the side wall of the cooling space can be referred to as the outermost side wall of the outermost fin 212. By spraying the cooling medium towards the outermost side wall of the outermost fin 212, the heat dissipation effect of the entire base 210 can be improved.

[0087] Figure 8 A third schematic diagram of the heat dissipation device 200 is provided in the embodiment. Referring to the figure, Figure 8Optionally, the jet assembly 220 can comprise a flow guide 222. The flow guide 222 can extend into the cooling area 213 and can be provided with a first nozzle 224, so as to reduce the distance between the first nozzle 224 and the top surface of the base 211, thereby improving the cooling effect of the cooling medium flowing out of the first nozzle 224 on the fins 212 and the base 211.

[0088] The first nozzle 224 can spray the cooling medium towards the top surface of the base 211, and / or the first nozzle 224 can spray the cooling medium towards the side wall of the fins 212. Of course, when the first nozzle 224 sprays the cooling medium towards the top surface of the base 211, the first nozzle 224 can have a first preset distance from the top surface of the base 211. When the first nozzle 224 sprays the cooling medium towards the side wall of the fins 212, the first nozzle 224 can have a second preset distance from the side wall of the fins 212. In addition, the length of the flow guide 222 extending into the cooling area 213 can be adjusted as needed, so as to improve the flexibility of the device. In addition, the flow guide 222 can be in communication with the main body, and can be arranged in a direction perpendicular to the top surface of the base 211, so as to adjust the length of the flow guide 222 extending into the cooling area 213.

[0089] The following describes several possible implementations of the main body 221:

[0090] Figure 9 A perspective view of the main body 221 provided by an embodiment of the present application, Figure 10 A perspective view of the main body 221 provided by an embodiment of the present application, Figure 9 An exploded view of the main body 221. Referring to Figure 9 With Figure 10 Exemplarily, the main body 221 can comprise a cover 2211 and a bottom plate 2212. The cover 2211 can have an inner cavity and an opening, and the opening can be in communication with the inner cavity of the cover 2211. The bottom plate 2212 can cover the opening of the cover 2211, and can form a space with the cover 2211 for storing a certain amount of cooling medium.

[0091] The inlet 223 can be provided on the cover 2211, so as to be connected with Figure 2 The first nozzle 224 and / or the second nozzle 225 and / or the third nozzle 226 can be provided on the bottom plate 2212. In addition, the bottom plate 2212 can be detachably connected to the cover 2211, so that when the arrangement of the plurality of fins 212 on the base 211 changes, the new arrangement can be adapted by replacing the bottom plate 2212, so as to improve the application range of the jet assembly 220. In addition, in order to realize the sealing between the cover 2211 and the bottom plate 2212, a sealing member 2213 can be provided therebetween. The sealing member 2213 can be made of rubber material.

[0092] Figure 11 Another plan view of a jet assembly 220 is provided for the embodiments of the present application. Referring to Figure 11 In another example, the body part 221 can be composed of a plurality of mutually connected pipe bodies 2214. At least one pipe body 2214 can be provided with a liquid inlet 223, and at least one pipe body 2214 can be provided with a first jet 224 and / or a second jet 225 and / or a third jet 226. The pipe bodies 2214 can be detachably connected by joints or the like, so that when the arrangement of the plurality of fins 212 on the base 211 is changed, the new arrangement can be adapted by changing the connection mode of the plurality of pipe bodies 2214 or the length of the pipe bodies 2214, so as to improve the application range of the jet assembly 220.

[0093] Figure 12 A schematic diagram of a server system is provided for the embodiments of the present application. Referring to Figure 12 The embodiments of the present application also provide a server system, which can include a cooling medium distribution device, a first pipe, a second pipe, and a computing device 830 as provided above. The cooling medium distribution device can include a heat exchanger 810 and a liquid supply pump 820. The computing device 830, the heat exchanger 810, and the liquid supply pump 820 can form a circulation loop for the flow of cooling medium.

[0094] Specifically, the computing device 830 can have an input port 320 and an output port 310. Referring to Figure 12 The heat exchanger 810 can cool the cooling medium flowing therethrough, and the liquid supply pump 820 can provide power for the circulation flow of the cooling medium between the heat exchanger 810 and the computing device 830. The input port 320 of the computing device 830 and the liquid supply pump 820 (or the heat exchanger 810) can be connected by the second pipe, and the output port 310 of the computing device 830 and the heat exchanger 810 (or the liquid supply pump 820) can be connected by the first pipe. The gaseous cooling medium flowing out of the output port 310 of the computing device 830 can enter the heat exchanger 810 through the first pipe under the guidance of the liquid supply pump 820; after being liquefied by the heat exchanger 810, the gaseous cooling medium can become liquid cooling medium and flow into the computing device 830 from the input port 320 through the second pipe; the liquid cooling medium entering the computing device 830 can communicate with the liquid inlet 223 of the jet assembly 220 of the heat dissipation device 200 through the inflow pipe 700, and be sprayed to the heat generating element 500 through the jet assembly 220, and become gaseous cooling medium again after contacting higher temperature components or higher temperature air and flowing out of the output port 310 of the computing device 830; in this way, a channel for the circulation flow of the cooling medium is formed.

[0095] In addition, the server system can further include a cabinet 840, which can be arranged in various shapes. Generally, the cabinet 840 is arranged in a square shape, and compared with other shapes, the square shape has a larger available volume and can deploy more devices therein. A plurality of partitions (not shown in the figure) can be installed in the cabinet 840, so as to divide the space in the cabinet 840 into at least two storage spaces, each of which can be used to place the computing device 830. The plurality of partitions can be arranged in a vertical direction, so that the plurality of storage spaces can be arranged in the vertical direction. Figure 12

[0096] In addition, the heat exchanger 810 and the liquid supply pump 820 can be assembled inside the cabinet 840 as shown in the figure, or can be assembled outside the cabinet 840. Figure 12 The computing device 830 can be one or at least two, and each of the computing devices 830 can form a circulation loop with the heat exchanger 810 and the liquid supply pump 820. The computing device 830, the heat exchanger 810 and the liquid supply pump 820 can be arranged one by one, or a plurality of computing devices 830 in one cabinet 840 can share one heat exchanger 810 and one liquid supply pump 820, or a plurality of computing devices 830 in a plurality of cabinets 840 can share one heat exchanger 810 and one liquid supply pump 820. In addition, in order to convert the gaseous cooling medium into liquid cooling medium when passing through the heat exchanger 810, the heat exchanger 810 can directly release heat to the environment, which can refer to the atmospheric environment or the indoor environment. The heat exchanger 810 can use air cooling or liquid cooling.

[0097] The embodiment of the present application can also provide a data center, which generally refers to a system that realizes centralized processing, exchange and management of data in a physical space. The data center provided by the embodiment of the present application can include a machine room and a plurality of server systems provided as above in the machine room to meet the demand for data processing capacity.

[0098] For ease of description, when the server system is normally working, the end of the server system facing the ground or other support surface is the lower end (or bottom end), and the end of the server system away from the ground or other support surface is the upper end. The side of the server system facing the operator installing the server system is the front side, and the side of the server system opposite to the front side is the rear side (or back side). The remaining two sides are the left side and the right side, respectively. The left-right direction is the length direction of the server system, the front-rear direction is the width direction of the server system, and the up-down direction is the height direction of the server system.

[0099] ​The plurality of server systems can be arranged side by side and close to each other along the length direction, i.e. the left-right direction, so that the arrangement of the server systems is compact and regular. A certain space can be reserved between two adjacent rows of server systems along the front-back direction or the width direction of the server systems, i.e. a preset distance between two adjacent server systems, so as to facilitate the operation of the server systems or the observation of the conditions of the server systems by the workers from the front side of the server systems. In addition, the plurality of server systems can form a square array, so as to facilitate the transmission of wireless signals. In addition, directional antennas can be used for communication connection between two server systems, and directional antennas in the same direction can form an antenna array, which can enhance the strength of the signals and increase the anti-interference ability when the directional antennas are used for the transmission of wireless signals.

[0100] Wherein, the terms such as "upper", "lower" and the like are used to describe the relative positional relationship of various structures in the drawings, which are only for the convenience of clear description, and are not used to limit the scope of the application. The change or adjustment of the relative relationship without substantial change of the technical content is also regarded as the scope of the application.

[0101] It should be noted that: in the present application, unless otherwise specified and limited, the first feature is "on" or "under" the second feature. The first and second features can be in direct contact or indirect contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0102] In addition, in the present application, unless otherwise specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral; it can be directly connected, or indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0103] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present disclosure. In the present specification, the exemplary description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0104] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipating device, characterized by, The application relates to a heat dissipation device and a computer. The heat dissipation device comprises a base and a fluid jet assembly. The base comprises a base body and a plurality of fins. The base body has a top surface and a bottom surface.

2. The heat dissipating device according to claim 1, wherein The bottom surface is used for contacting a heat generating element to absorb heat of the heat generating element.

3. The heat dissipating device of claim 1, wherein The plurality of fins are arranged on the top surface of the base body.

4. The heat dissipating device according to any one of claims 1 to 3, characterized in that Two adjacent fins and the top surface of the base body between the two adjacent fins form a cooling area.

5. The heat dissipating device according to any one of claims 1 to 3, wherein The fluid jet assembly is arranged on a side of the base body away from the base. The fluid jet assembly comprises a cavity, a liquid inlet and at least one first nozzle. The liquid inlet and the first nozzle are in communication with the cavity of the fluid jet assembly.

6. The heat dissipating device according to any one of claims 1 to 3, wherein The first nozzle sprays cooling medium towards the cooling area. The first nozzle sprays cooling medium towards two opposite side walls of two adjacent fins. The first nozzle sprays cooling medium towards the top surface of the base body between two adjacent fins.

7. A computing device, comprising: The fluid jet assembly is arranged on a side of the fin away from the base body. At least part of the bottom surface of the fluid jet assembly covers the top of the cooling area. At least part of the fluid jet assembly exceeds the outermost side wall of the outermost fin. A third nozzle is arranged on the fluid jet assembly. The third nozzle sprays cooling medium towards the outermost side wall of the outermost fin. The fluid jet assembly is welded to the fin or the base body. The fluid jet assembly is detachably connected to the fin or the base body. The fluid jet assembly is provided with a second nozzle in communication with the cavity of the fluid jet assembly. The second nozzle is arranged on a side of the top surface of the fin away from the base body. The second nozzle sprays cooling medium towards the side of the top surface of the fin away from the base body. At least part of the fluid jet assembly extends into the cooling area. The fluid jet assembly comprises a cover and a bottom plate. The cover has a cavity and an opening in communication with the cavity. The bottom plate is detachably connected to the cover and covers the opening of the cover. The bottom plate and the cover enclose a space for storing the cooling medium. The bottom plate is provided with the first nozzle. The fin is in the shape of a sheet and extends along a first direction. A plurality of fins are arranged along a second direction. The first direction and the second direction are parallel to the bottom surface of the base body. The first direction intersects the second direction. The cooling area is in communication with the outside at both ends in the first direction. A plurality of fins are arranged in a plurality of columns along a first direction. Adjacent two fins in each column are arranged along a second direction. The first direction and the second direction are parallel to the bottom surface of the base body. The first direction intersects the second direction. The cooling area is in communication with the outside in the first direction and the second direction. The computer comprises a case. The case has a cavity, an input port and an output port. The case is provided with a circuit board, a heat generating element and a heat dissipation device. The input port is in communication with the liquid inlet of the heat dissipation device through a pipeline. The output port is in communication with the cavity of the case and is used for flowing out of the cooling medium. The heat generating element is arranged on the circuit board. One side of the heat generating element away from the circuit board is in contact with the bottom surface of the base body of the heat dissipation device for heat transfer.

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