Microfluidic chip segmented pressure-holding bonding method and microfluidic chip

Abstract

The application discloses a micro-fluidic chip segmented pressure-keeping bonding method and a micro-fluidic chip. The method comprises the following steps: providing a micro-fluidic chip comprising a substrate and a cover plate; placing a first pressing block above the cover plate after aligning the cover plate and the substrate, wherein the first pressing block covers a first preset position on the cover plate; applying a specific pressure to the first pressing block to perform planar pressure keeping; removing the first pressing block, placing a second pressing block on the cover plate, wherein the second pressing block covers a second preset position on the cover plate, applying a specific pressure to the second pressing block to perform planar pressure keeping; and removing the second pressing block, sequentially placing an adaptive gasket and a third pressing block on the cover plate, wherein the adaptive gasket covers all positions on the cover plate, and the third pressing block covers an area of the cover plate except a valve, applying a specific pressure to the third pressing block to perform pressure keeping, and forming the micro-fluidic chip. The application can realize segmented bonding of different areas of the micro-fluidic chip, has low cost, and can be mass-produced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of microfluidic chip, in particular to a microfluidic chip segmented pressure bonding method and a microfluidic chip. BACKGROUND

[0002] The application of microfluidic technology is more and more widely used, which has the advantages of low manufacturing cost, convenient carrying, small amount of detection reagent, fast detection speed and the like. The microfluidic chip with thermoplastic polymer material as the base material has the characteristics of simple manufacturing process, low equipment requirement, biocompatibility and mass production, so the thermoplastic polymer material is one of the most commonly used base materials in the microfluidic chip. The bonding link of the microfluidic chip is one of the key links in the preparation of the microfluidic chip, and the quality of the bonding directly affects the actual application of the microfluidic chip. The main problems that need to be paid attention to in the bonding link of the microfluidic chip include: (1) the chip is required to be connected, the microchannel has sealing property, and has sufficient mechanical strength after bonding to avoid liquid leakage; (2) the microchannel is required to be prevented from being deformed, blocked or affected in the bonding process; (3) the surface physical and chemical properties are required to be prevented from being changed during bonding.

[0003] At present, the known polymer microfluidic chip bonding technologies include thermal compression bonding, solvent bonding, glue bonding, laser or ultrasonic bonding. The solvent bonding is easy to cause the change of the physical and chemical properties of the surface, which is not suitable for application in the biological and medical fields. The ultrasonic bonding technology has high requirements for the welding line, and the uneven height of the welding line may cause the liquid leakage at the virtual welding point, and the virtual welding point cannot be checked out. The laser bonding requires the use of materials that can absorb laser, and the heat generated by the laser at the bonding interface is used to melt the interface in the heated state to achieve the connection purpose. The implementation process of this method is relatively complex, and special materials or special preparation methods are required, which has high cost. The glue bonding introduces adhesive or double-sided adhesive between the base sheet and the cover sheet to realize the connection of the upper and lower devices. This method has the advantages of simple operation, low cost and high bonding strength, but also has the disadvantage of glue penetration into the channel to cause channel blockage. Since the flow channel heights of different structural regions of the microfluidic chip are inconsistent, and the injection molded microfluidic chip has a certain degree of warping, the bonding force required by different structural regions is inconsistent. If the same pressure is used for pressure retention in the existing thermal compression bonding for different structural regions, it is easy to cause partial channel blockage and liquid leakage, and the insufficient bonding strength also easily leads to liquid leakage of the microfluidic chip. SUMMARY

[0004] Therefore, it is necessary to provide a microfluidic chip segmented pressure bonding method. The microfluidic chip segmented pressure bonding method can realize segmented bonding of different regions of the microfluidic chip, and has the advantages of high bonding strength, low processing cost, fast bonding speed and wide application range, and can be used for mass production to reduce or avoid the blockage of the microfluidic chip.

[0005] An embodiment of the present application provides a microfluidic chip segmented pressure holding bonding method.

[0006] A microfluidic chip segmented pressure holding bonding method, which is segmented pressure holding bonding of different area structures of a microfluidic chip, comprises the following steps.

[0007] Step (1) provides a microfluidic chip, which comprises a substrate and a cover plate, and the upper surface of the substrate is provided with a plurality of microchannel structures.

[0008] Step (2) aligns the cover plate and the substrate, and places a first pressing block above the cover plate after alignment, wherein the first pressing block covers a first preset position on the cover plate.

[0009] Step (3) places the aligned cover plate and substrate, and the first pressing block together on a pressure holding platform, and applies a specific pressure to the first pressing block for planar pressure holding.

[0010] Step (4) removes the first pressing block, places a second pressing block on the cover plate, wherein the second pressing block covers a second preset position on the cover plate, and applies a specific pressure to the second pressing block for planar pressure holding.

[0011] Step (5) removes the second pressing block, sequentially places an adaptive gasket and a third pressing block on the cover plate, wherein the adaptive gasket covers all positions on the cover plate, the third pressing block covers the area of the cover plate except the valve, and a specific pressure is applied to the third pressing block for pressure holding, and the substrate and the cover plate are bonded to form the microfluidic chip.

[0012] In some embodiments, the cover plate comprises a cover film and a glue layer, the glue layer connects the cover film, and the glue layer is located on the surface of the cover film used for cooperation with the substrate.

[0013] In some embodiments, the cover film of the cover plate is made of one or both of polyethylene terephthalate and biaxially oriented polypropylene film.

[0014] In some embodiments, the thickness of the glue layer is 30 μm-60 μm.

[0015] In some embodiments, the thickness of the adaptive gasket is 1 mm-5 mm.

[0016] In some embodiments, the material of the adaptive gasket is silica gel.

[0017] In some embodiments, the material for manufacturing the microfluidic chip is selected from one or more of polymethyl methacrylate, acrylonitrile-butadiene-styrene copolymer, polycarbonate and polystyrene.

[0018] In some embodiments, the specific pressure in step (3) is 2000N-4000N.

[0019] In some embodiments, the specific pressure in step (4) is 2000N-4000N.

[0020] In some embodiments, the specific pressure in step (5) is 2000N-4000N.

[0021] An embodiment of the present application further provides a microfluidic chip.

[0022] A microfluidic chip is prepared by the microfluidic chip segmented pressure-keeping bonding method.

[0023] The microfluidic chip segmented pressure-keeping bonding method can realize segmented bonding of different regions of the microfluidic chip, and has high bonding strength, low processing cost, fast bonding speed, wide application range, can be used for mass production, and can reduce or avoid the phenomenon of microfluidic chip blockage. The microfluidic chip segmented pressure-keeping bonding method bonds the base plate and the cover plate of the plastic microfluidic chip by the adhesive combined segmented planar pressure-keeping method, has high bonding strength, and can realize segmented bonding of different regions of the microfluidic chip. This method can not only ensure the stability of the microfluidic chip bonding, but also reduce the phenomenon of microfluidic chip leakage by segmented pressure-keeping bonding. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0025] In order to more completely understand the present application and its beneficial effects, the following will be described with reference to the drawings. In the following description, the same reference numerals represent the same parts.

[0026] Figure 1 The microfluidic chip segmented pressure-keeping bonding method flowchart according to an embodiment of the present application. DETAILED DESCRIPTION

[0027] In order to make the above objectives, features and advantages of the present application more clear and comprehensible, the specific embodiments of the present application will be described below in detail with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in many different manners without the specific details, and it is to be understood that the present application is not limited to the specific embodiments described below and that the specific embodiments are given for the purposes of exemplification only.

[0028] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0029] In addition, the terms "first", "second", "third" and the like are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified.

[0030] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0031] In the present application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can be direct contact between the first and second features, or indirect contact between the first and second features through intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0032] It is to be noted that when an element is referred to as being "on" or "connected to" another element, it can be directly on the other element or intervening elements can also be present. In addition, the term "connected" can refer to physical or logical connections made by wires or wireless connections as is conventionally known in the art.

[0033] In the description of the present application, the plural form is used for convenience in describing one or more than one intension, the plural form is used for convenience in describing two or more than two intensions, greater than, less than, exceeding, and the like are understood as not including the number, above, below, within, and the like are understood as including the number. If it is described as first, second, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or the order of indicated technical features.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0035] Embodiments of the present application provide a microfluidic chip segmented pressure bonding method to solve the problem that the existing microfluidic chip has different structural regions with inconsistent flow channel heights, and the required bonding force is different. The same pressure is used for pressure bonding in different structural regions by using the existing hot pressing bonding, which is easy to cause partial flow channel blockage and liquid leakage, and the insufficient bonding strength also easily leads to microfluidic chip liquid leakage. The microfluidic chip segmented pressure bonding method will be described below in combination with the drawings.

[0036] The microfluidic chip segmented pressure bonding method provided by the embodiments of the present application is exemplarily shown in Figure 1 The microfluidic chip segmented pressure bonding method provided by the embodiments of the present application is exemplarily shown in Figure 1 The microfluidic chip segmented pressure bonding method provided by the embodiments of the present application is exemplarily shown in the structural schematic diagram of the microfluidic chip segmented pressure bonding method. The microfluidic chip segmented pressure bonding method of the present application can be used for the bonding between the cover plate and the substrate of the microfluidic chip.

[0037] In order to more clearly illustrate the structure of the microfluidic chip segmented pressure bonding method, the microfluidic chip segmented pressure bonding method will be introduced below in combination with the drawings.

[0038] The microfluidic chip segmented pressure bonding method provided by the embodiments of the present application is exemplarily shown in Figure 1 The microfluidic chip segmented pressure bonding method provided by the embodiments of the present application is exemplarily shown in Figure 1A structural schematic diagram of a microfluidic chip segmented pressure holding bonding method provided by the embodiments of the present application. A microfluidic chip segmented pressure holding bonding method, which segments pressure holding bonding of different area structures of a microfluidic chip, comprises the following steps:

[0039] Step (1), providing a microfluidic chip, which comprises a substrate and a cover plate, and the upper surface of the substrate is provided with a plurality of microchannel structures.

[0040] Step (2), aligning the cover plate and the substrate, and placing a first pressing block above the cover plate after alignment, the first pressing block covering a first preset position on the cover plate.

[0041] Step (3), placing the aligned cover plate and the substrate, and the first pressing block together on a pressure holding platform, and applying a specific pressure to the first pressing block for planar pressure holding;

[0042] Step (4), removing the first pressing block, placing a second pressing block on the cover plate, the second pressing block covering a second preset position on the cover plate, and applying a specific pressure to the second pressing block for planar pressure holding.

[0043] Step (5), removing the second pressing block, placing a self-adaptive gasket and a third pressing block in sequence on the cover plate, the self-adaptive gasket covering all positions on the cover plate, and the third pressing block covering the area of the cover plate except the valve, and applying a specific pressure to the third pressing block for pressure holding, and the substrate and the cover plate are bonded to form the microfluidic chip.

[0044] In some embodiments, the first preset position can be a valve structure, a dilution structure, a cup dividing structure, a reaction unit, etc.

[0045] In some embodiments, the second preset position can be a valve structure, a dilution structure, a cup dividing structure, a reaction unit, etc.

[0046] In some embodiments, the cover plate comprises a cover film and a glue layer. The glue layer connects the cover film, and the glue layer is located on the surface of the cover film for cooperation with the substrate.

[0047] In some embodiments, the number of self-adaptive gaskets can be one or several.

[0048] In some embodiments, the cover film of the cover plate is made of one or both of polyethylene terephthalate (PET) and biaxially oriented polypropylene film (BOPP).

[0049] In some embodiments, the thickness of the glue layer is 30 μm-60 μm. For example, in one embodiment, the thickness of the glue layer is 30 μm. In another embodiment, the thickness of the glue layer is 60 μm. It is appreciated that in other embodiments, the thickness of the glue layer can also be 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, or other parameters.

[0050] In some embodiments, the glue layer can be formed by drying and solidifying the adhesive.

[0051] In some embodiments, the thickness of the adaptive spacer is 1 mm-5 mm. For example, in one embodiment, the thickness of the adaptive spacer is 1 mm. In another embodiment, the thickness of the adaptive spacer is 5 mm. It is appreciated that in other embodiments, the thickness of the adaptive spacer can also be 1.5 mm, 2 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, 4.5 mm, or other parameters.

[0052] In some embodiments, the material of the adaptive spacer is silica gel. That is, the adaptive spacer is a silica gel spacer.

[0053] In some embodiments, the material of the microfluidic chip is selected from one or more of polymethyl methacrylate (PMMA), acrylonitrile-butadiene-styrene copolymer (ABS), polycarbonate (PC), and polystyrene (PS).

[0054] In some embodiments, the specific pressure in step (3) is 2000N-4000N. Preferably, the specific pressure in step (3) is 200N-800N. For example, in one specific embodiment, the specific pressure in step (3) is 200N. In another specific embodiment, the specific pressure in step (3) is 1000N. It is appreciated that in other specific examples, the specific pressure in step (3) can also be 300N, 400N, 500N, 600N, 700N, 800N, 900N, or other parameters.

[0055] In some embodiments, the specific pressure in step (4) is 2000N-4000N. Preferably, the specific pressure in step (4) is 1000N-1800N. Further preferably, the specific pressure in step (4) is 1200N-1500N. For example, in one specific embodiment, the specific pressure in step (4) is 1000N. In another specific embodiment, the specific pressure in step (4) is 2000N. It is understood that in other specific examples, the specific pressure in step (4) can also be 1100N, 1200N, 1300N, 1400N, 1500N, 1600N, 1700N, 1800N, 1900N or other parameters.

[0056] In some embodiments, the specific pressure in step (5) is 2000N-4000N. Preferably, the specific pressure in step (5) is 2000N-3500N. Further preferably, the specific pressure in step (5) is 2500N-3000N. For example, in one specific embodiment, the specific pressure in step (5) is 2000N. In another specific embodiment, the specific pressure in step (5) is 4000N. It is understood that in other specific examples, the specific pressure in step (5) can also be 2100N, 2200N, 2300N, 2400N, 2500N, 2600N, 2700N, 2800N, 2900N, 3000N, 3100N, 3200N, 3300N, 3400N, 3500N, 3600N, 3700N, 3800N, 3900N or other parameters.

[0057] An embodiment of the present application further provides a microfluidic chip.

[0058] A microfluidic chip is prepared by the microfluidic chip segmented pressure-keeping bonding method.

[0059] An embodiment of the present application further provides a microfluidic chip.

[0060] A microfluidic chip, which comprises a substrate and a cover plate, the upper surface of the substrate is provided with a plurality of microchannel structures, the substrate can cooperate with the cover plate, and the substrate is provided with a plurality of valve positions. The substrate and the cover plate are prepared by the microfluidic chip segmented pressure-keeping bonding method.

[0061] Embodiment 1

[0062] The embodiment provides a microfluidic chip segmented pressure-keeping bonding method.

[0063] A microfluidic chip segmented pressure-keeping bonding method, comprising the following steps:

[0064] Step (1), providing a microfluidic chip, the preparation material of the microfluidic chip is selected from polymethyl methacrylate (PMMA).

[0065] The microfluidic chip comprises a substrate and a cover plate, and the upper surface of the substrate is provided with a plurality of microchannel structures; wherein the cover plate comprises a cover film and a glue layer. The glue layer connects the cover film, and the glue layer is located on the surface of the cover film for cooperation with the substrate. The cover film material of the cover plate is selected from polyethylene terephthalate (PET). The thickness of the glue layer is 30 μm.

[0066] Step (2), aligning the cover plate and the substrate, and placing a first pressing block above the cover plate after alignment, the first pressing block covering a first preset position on the cover plate.

[0067] Step (3), placing the aligned cover plate and substrate and first pressing block together on a pressure maintaining platform, and applying a specific pressure to the first pressing block to perform planar pressure maintaining of the first valve at the first preset position. The specific pressure in step (3) is 200N.

[0068] Step (4), removing the first pressing block, placing a second pressing block on the cover plate, the second pressing block covering a second preset position on the cover plate, and applying a specific pressure to the second pressing block to perform planar pressure maintaining of the second valve at the second preset position. The specific pressure in step (4) is 1000N.

[0069] Step (5), removing the second pressing block, sequentially placing an adaptive gasket and a third pressing block on the cover plate, the adaptive gasket covering all positions on the cover plate, the thickness of the adaptive gasket being 5mm, the third pressing block covering the area of the cover plate except the valve, and applying a specific pressure to the third pressing block to perform pressure maintaining. The specific pressure in step (5) is 2000N. The substrate and the cover plate are bonded to form the microfluidic chip.

[0070] Embodiment 2

[0071] The embodiment provides a microfluidic chip segmented pressure maintaining bonding method.

[0072] A microfluidic chip segmented pressure maintaining bonding method comprises the following steps:

[0073] Step (1), providing a microfluidic chip, the preparation material of the microfluidic chip is selected from acrylonitrile-butadiene-styrene copolymer.

[0074] The microfluidic chip comprises a substrate and a cover plate, and the upper surface of the substrate is provided with a plurality of microchannel structures; wherein the cover plate comprises a cover film and a glue layer. The glue layer connects the cover film, and the glue layer is located on the surface of the cover film for cooperation with the substrate. The cover film material of the cover plate is selected from polyethylene terephthalate (PET). The thickness of the glue layer is 30 μm.

[0075] Step (2), align the cover plate and the substrate, and place a first pressing block above the cover plate after alignment, the first pressing block covering a first preset position on the cover plate.

[0076] Step (3), place the aligned cover plate and substrate and first pressing block together on a pressure maintaining platform, and apply a specific pressure to the first pressing block to perform planar pressure maintaining of the first valve at the first preset position; the specific pressure in step (3) is 200 N.

[0077] Step (4), remove the first pressing block, place a second pressing block on the cover plate, the second pressing block covering a second preset position on the cover plate, and apply a specific pressure to the second pressing block to perform planar pressure maintaining of the second valve at the second preset position; the specific pressure in step (4) is 1000 N.

[0078] Step (5), remove the second pressing block, place an adaptive gasket and a third pressing block in sequence on the cover plate, the adaptive gasket covering all positions on the cover plate, the thickness of the adaptive gasket being 1 mm, and the third pressing block covering the area of the cover plate except the valves, and apply a specific pressure to the third pressing block to perform pressure maintaining; the specific pressure in step (5) is 4000 N. The substrate and the cover plate are bonded to form the microfluidic chip.

[0079] Embodiment 3

[0080] The embodiment provides a microfluidic chip segmented pressure maintaining bonding method.

[0081] A microfluidic chip segmented pressure maintaining bonding method, comprising the following steps:

[0082] Step (1), providing a microfluidic chip, and polycarbonate (PC) and polystyrene (PS) are selected as the preparation materials of the microfluidic chip.

[0083] The microfluidic chip comprises a substrate and a cover plate, and the upper surface of the substrate is provided with a plurality of microchannel structures; wherein the cover plate comprises a cover film and a glue layer. The glue layer is connected to the cover film and is located on the surface of the cover film for cooperation with the substrate. The cover film of the cover plate is made of polyethylene terephthalate. The thickness of the glue layer is 40 μm.

[0084] Step (2), align the cover plate and the substrate, and place a first pressing block above the cover plate after alignment, the first pressing block covering a first preset position on the cover plate.

[0085] Step (3), place the aligned cover plate and substrate and first pressing block together on a pressure maintaining platform, and apply a specific pressure to the first pressing block to perform planar pressure maintaining of the first valve at the first preset position; the specific pressure in step (3) is 200 N.

[0086] Step (4), removing the first pressing block, placing a second pressing block on the cover plate, the second pressing block covering a second preset position on the cover plate, and applying a specific pressure to the second pressing block for planar pressure preservation of the second valve at the second preset position. The specific pressure in step (4) is 1000N.

[0087] Step (5), removing the second pressing block, placing a self-adapting gasket and a third pressing block on the cover plate in sequence, the self-adapting gasket covering all positions on the cover plate, the thickness of the self-adapting gasket being 3mm, and the third pressing block covering the area of the cover plate except the valve. A specific pressure is applied to the third pressing block for pressure preservation. The specific pressure in step (5) is 3000N. The substrate and the cover plate are bonded to form the microfluidic chip.

[0088] The microfluidic chip prepared by the microfluidic chip segmented pressure preservation bonding method of examples 1-3 is subjected to chip full process test, and the plugging and liquid leakage rates are both less than 5%

[0089] Comparative example 1

[0090] The microfluidic chip is subjected to planar pressure preservation bonding by using the same pressure (1000-2000N). The planar pressure preservation means that the same pressure is used for pressure preservation of different structural areas of the microfluidic chip. The microfluidic chip prepared by the planar pressure preservation bonding is subjected to chip full process test, and the plugging and liquid leakage rates are both greater than 30%.

[0091] In summary, the above-mentioned microfluidic chip segmented pressure preservation bonding method can realize segmented bonding of different areas of the microfluidic chip. This bonding method has high bonding strength, low processing cost, fast bonding speed, and wide application range, and can be used for mass production, thereby reducing or avoiding the plugging phenomenon of the microfluidic chip. The above-mentioned microfluidic chip segmented pressure preservation bonding method bonds the substrate and the cover plate of the plastic microfluidic chip by means of adhesive combined with segmented planar pressure preservation, has high bonding strength, and can realize segmented bonding of different areas of the microfluidic chip. This method can not only ensure the stability of the microfluidic chip bonding, but also reduce the liquid leakage phenomenon of the microfluidic chip through segmented pressure preservation.

[0092] In the above examples, the description of each example has its own emphasis. The parts not described in detail in a certain example can be referred to the related description of other examples.

[0093] The technical features of the above-mentioned examples can be combined arbitrarily. In order to make the description concise, all possible combinations of the technical features in the above-mentioned examples are not described. However, as long as the combination of these technical features does not exist contradictory, it should be considered as the scope of the present disclosure.

[0094] The above embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the patent scope of the present application. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, several modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A segmented voltage-holding bonding method for microfluidic chips, characterized in that, Segmented pressure bonding of different regions of the microfluidic chip includes the following steps: Step (1) A microfluidic chip is provided, the microfluidic chip includes a substrate and a cover plate, and the upper surface of the substrate is provided with a plurality of microchannel structures; Step (2): Align the cover plate and the substrate, and after alignment, place a first pressing block above the cover plate, with the first pressing block covering a first preset position on the cover plate; Step (3): Place the aligned cover plate, the substrate and the first pressure block together on the pressure holding platform, and apply a specific pressure to the first pressure block for planar pressure holding. The specific pressure in step (3) is 2000N-4000N. Step (4): Remove the first pressure block, place a second pressure block on the cover plate, the second pressure block covers the second preset position on the cover plate, apply a specific pressure to the second pressure block for planar pressure holding, the specific pressure in step (4) is 2000N-4000N; as well as Step (5): Remove the second pressure block, and place an adaptive gasket and a third pressure block in sequence on the cover plate. The adaptive gasket covers all positions on the cover plate, and the third pressure block covers the area of ​​the cover plate except for the valve. Apply a specific pressure to the third pressure block to maintain pressure. The specific pressure in step (5) is 1000N-2000N. After the substrate and the cover plate are bonded, the microfluidic chip is formed.

2. The segmented pressure-holding bonding method for microfluidic chips according to claim 1, characterized in that, The cover plate includes a cover film and an adhesive layer, the adhesive layer being connected to the cover film and located on the surface of the cover film for mating with the substrate.

3. The segmented pressure-holding bonding method for microfluidic chips according to claim 2, characterized in that, The cover material of the cover plate is selected from one or both of polyethylene terephthalate and biaxially oriented polypropylene film.

4. The segmented pressure-holding bonding method for microfluidic chips according to claim 2, characterized in that, The thickness of the adhesive layer is 30 μm-60 μm.

5. The segmented pressure-holding bonding method for microfluidic chips according to any one of claims 1-4, characterized in that, The thickness of the adaptive pad is 1 mm to 5 mm.

6. The segmented pressure-holding bonding method for microfluidic chips according to any one of claims 1-4, characterized in that, The adaptive pad is made of silicone.

7. The segmented pressure-holding bonding method for microfluidic chips according to any one of claims 1-4, characterized in that, The microfluidic chip is circular or fan-shaped.

8. The segmented pressure-holding bonding method for microfluidic chips according to any one of claims 1-4, characterized in that, The microfluidic chip is prepared using one or more of the following materials: polymethyl methacrylate, acrylonitrile-butadiene-styrene copolymer, polycarbonate, and polystyrene.

9. A microfluidic chip, characterized in that, It is prepared by the segmented pressure-holding bonding method for microfluidic chips according to any one of claims 1-8.

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