Laser processing control method, system, electronic equipment and medium

Abstract

The present application provides a laser processing control method, system, electronic device and medium. The method includes: obtaining the processing parameters of the laser processing to be performed; based on the processing parameters, controlling the galvanometer motor inside the laser processing head to drive the galvanometer to swing to the target position; when the galvanometer is detected to swing to the target position, sending a first level signal to the preset gate circuit module of the main control board of the laser, the preset gate circuit module is used to output a second level signal when receiving the first level signal and the laser light enable signal output by the main control board; sending the second level signal to the laser to control the laser to turn on or off. The present application sends a first level signal to the preset gate circuit module when the galvanometer swings to the target position, so as to use the preset gate circuit module to directly output the corresponding second level signal, thereby controlling the laser to turn on or off, thereby realizing the rapid switching light of the laser and improving the laser processing effect.

Description

Technical Field

[0001] The present application relates to the field of laser processing technology, and in particular to a laser processing control method, system, electronic equipment and medium. Background Art

[0002] Laser cleaning has the advantages of being green, environmentally friendly, safe and efficient, so it is widely used in aviation, aerospace, ships, power batteries, molds, cultural relics cleaning and other fields. However, when using lasers for cleaning and other processing, the laser's on and off response time is often long, and it is impossible to achieve fast switching light, resulting in poor laser processing effects. Summary of the invention

[0003] The present application provides a laser processing control method, system, electronic device and medium, aiming to realize rapid switching light of the laser and improve the laser processing effect.

[0004] On the one hand, the present application provides a laser processing control method, the laser processing control method comprising:

[0005] Obtaining processing parameters for laser processing to be performed;

[0006] Based on the processing parameters, controlling the galvanometer motor inside the laser processing head to drive the galvanometer to swing, so that the galvanometer swings to a target position;

[0007] When it is detected that the galvanometer oscillates to the target position, a first level signal is sent to a preset gate circuit module of a main control board of the laser corresponding to the laser processing head, and the preset gate circuit module is used to output a second level signal when receiving the first level signal and a laser light-emitting enable signal output by the main control board;

[0008] The second level signal is sent to the laser to control the laser to turn on or off.

[0009] In a possible implementation of the present application, after obtaining the processing parameters for the laser processing to be performed, the method further includes:

[0010] Based on the processing parameters, determining the swing trajectory of the galvanometer;

[0011] In the swinging trajectory, obtaining a trajectory segment where the laser amplitude overlaps;

[0012] Determining a trajectory start point and a trajectory end point in the trajectory segment;

[0013] Among them, in the scheme of sending the second level signal to the laser to control the laser to turn off, the target position is the starting point of the trajectory, and in the scheme of sending the second level signal to the laser to control the laser to turn on, the target position is the end point of the trajectory.

[0014] In a possible implementation of the present application, the step of obtaining processing parameters for laser processing to be performed includes:

[0015] In a preset laser processing control terminal, a selected laser lens type is obtained, wherein different laser lens types have different lens focal lengths;

[0016] Determine, among a plurality of preset galvanometer motor parameters, a target galvanometer motor parameter associated with the selected laser lens type;

[0017] The target galvanometer motor parameters are displayed on the laser processing control end for adjustment, and the adjusted target galvanometer motor parameters are obtained. The processing parameters include the adjusted target galvanometer motor parameters.

[0018] In a possible implementation of the present application, the step of obtaining processing parameters for laser processing to be performed includes:

[0019] In the preset laser processing control terminal, obtain the selected galvanometer motor type;

[0020] Determining a maximum oscillation frequency of a galvanometer motor corresponding to the selected galvanometer motor type;

[0021] Obtaining a target galvanometer motor frequency set by the laser processing control end;

[0022] When the target galvanometer motor frequency is greater than the maximum oscillation frequency of the galvanometer motor, the maximum oscillation frequency of the galvanometer motor is used as the adjusted target galvanometer motor frequency, and the processing parameters include the adjusted target galvanometer motor frequency.

[0023] In a possible implementation of the present application, the step of obtaining processing parameters for laser processing to be performed includes:

[0024] In the preset laser processing control terminal, the selected laser width value is obtained;

[0025] Among the preset multiple amplitude values, a corrected amplitude value associated with the selected laser amplitude value is obtained, the processing parameters include the corrected amplitude value, and the association between the selected laser amplitude value and the corrected amplitude value is obtained based on the linear correlation between multiple preset amplitude values ​​and the actual amplitude value.

[0026] In a possible implementation of the present application, the step of obtaining processing parameters for laser processing to be performed includes:

[0027] In the preset laser processing control terminal, the selected laser width value is obtained;

[0028] An amplitude correction coefficient associated with the selected laser amplitude value is obtained, wherein the processing parameters include the selected laser amplitude value and the amplitude correction coefficient, and the amplitude correction coefficient is used to adjust the galvanometer motor drive signal generated based on the selected laser amplitude value, thereby adjusting the light output amplitude of the laser processing head.

[0029] In a possible implementation of the present application, the preset gate circuit module is an AND gate circuit module.

[0030] In a solution in which the second level signal is sent to the laser to control the laser to turn on, the first level signal is a high level signal, the laser light-emitting enable signal is a high level signal, and the second level signal is a high level signal;

[0031] In a solution of sending the second level signal to the laser to control the laser to turn off, the first level signal is a low level signal, the laser light emission enable signal is a high level signal, and the second level signal is a low level signal.

[0032] On the other hand, the present application provides a laser processing control system, the laser processing control system comprising:

[0033] An acquisition module, used for acquiring processing parameters of the laser processing to be performed;

[0034] A control module, for controlling a galvanometer motor inside the laser processing head to drive the galvanometer to swing based on the processing parameters, so that the galvanometer swings to a target position;

[0035] A sending module, used for sending a first level signal to a preset gate circuit module of a main control board of the laser corresponding to the laser processing head when detecting that the galvanometer has swung to the target position, wherein the preset gate circuit module is used for outputting a second level signal when receiving the first level signal and a laser light-emitting enable signal output by the main control board;

[0036] The sending module is further used to send the second level signal to the laser to control the laser to turn on or off.

[0037] On the other hand, the present application also provides an electronic device, the electronic device comprising:

[0038] one or more processors;

[0039] Memory; and

[0040] One or more application programs, wherein the one or more application programs are stored in the memory and configured to be executed by the processor to implement the laser processing control method.

[0041] On the other hand, the present application also provides a computer-readable storage medium on which a computer program is stored, and the computer program is loaded by a processor to execute the steps in the laser processing control method.

[0042] The embodiments of the present application provide a laser processing control method, system, electronic device and medium. The laser processing control method includes: obtaining the processing parameters of the laser processing to be performed; based on the processing parameters, controlling the galvanometer motor inside the laser processing head to drive the galvanometer to swing, so that the galvanometer swings to the target position; when the galvanometer is detected to swing to the target position, sending a first level signal to the preset gate circuit module of the main control board of the laser corresponding to the laser processing head, the preset gate circuit module is used to output a second level signal when receiving the first level signal and the laser light enable signal output by the main control board; sending the second level signal to the laser to control the laser to turn on or off. The present application sends a first level signal to the preset gate circuit module when the galvanometer swings to the target position, so as to use the preset gate circuit module to directly output the corresponding second level signal, thereby controlling the laser to turn on or off, thereby realizing the rapid switching light of the laser and improving the laser processing effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0044] Figure 1 It is a schematic flow chart of an embodiment of the laser processing control method provided in the embodiments of the present application;

[0045] Figure 2 It is a schematic diagram of the structure of an embodiment of a laser processing control system provided in an embodiment of the present application;

[0046] Figure 3 is a schematic diagram of an embodiment of the swing trajectory of the galvanometer provided in the embodiment of the present application;

[0047] Figure 4 It is a structural schematic diagram of another embodiment of the laser processing control system provided in the embodiments of the present application;

[0048] Figure 5 It is a schematic diagram of the structure of an embodiment of an electronic device provided in the embodiments of the present application. DETAILED DESCRIPTION

[0049] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0050] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, "plurality" means two or more, unless otherwise clearly and specifically defined.

[0051] In this application, the term "in some embodiments of the present application" is used to mean "used as an example, illustration or description". Any embodiment described in this application as "in some embodiments of the present application" is not necessarily to be construed as being more preferred or advantageous than other embodiments. The following description is given to enable any technician in the field to implement and use the present application. In the following description, details are listed for the purpose of explanation. It should be understood that a person of ordinary skill in the art can recognize that the present application can be implemented without using these specific details. Therefore, the present application is not intended to be limited to the embodiments shown, but is consistent with the widest scope consistent with the principles and features disclosed in the present application.

[0052] The embodiments of the present application provide a laser processing control method, a laser processing control system, an electronic device and a medium, which are described in detail below.

[0053] First, the laser processing control method provided in the embodiment of the present application is introduced.

[0054] In the embodiment of the laser processing control method of the embodiment of the present application, the laser processing control system is used as the execution subject. For the sake of simplicity and ease of description, the execution subject will be omitted in the subsequent method embodiments.

[0055] See also Figure 1 , Figure 1 The following is a flow chart of an embodiment of a laser processing control method provided in an embodiment of the present application. The laser processing control method includes:

[0056] 101. Obtain processing parameters for laser processing to be performed.

[0057] In an embodiment of the present application, laser processing is performed by a complete machine including a laser processing head and a laser, and the laser processing may be laser cleaning, laser welding, laser cutting and other laser processing. The laser may specifically be a pulsed laser, a continuous laser, a semiconductor laser, or a composite laser that combines at least two of pulsed, continuous and semiconductor. The processing parameters to be laser processed are used to indicate how to control the parameters of the laser and / or laser processing head for processing. The processing parameters may include laser parameters such as laser power, laser frequency, and laser type, and may also include parameters such as the swing speed of the galvanometer motor inside the laser processing head and the laser width, as well as information such as the type of lens used and the type of galvanometer motor used. It can be understood that by setting the processing parameters, the corresponding laser processing can be controlled.

[0058] In some embodiments of the present application, the laser processing control system has compatibility with different lens types, different galvanometer motor types, different laser types, etc. Examples are as follows:

[0059] Taking the compatibility of different lens types as an example, obtaining the processing parameters for the laser processing to be performed may include: obtaining the laser lens type selected by the operator in the preset laser processing control terminal (such as a host computer, a touch screen, etc.), wherein the focal lengths of the lenses of different laser lens types are generally different; determining the target galvanometer motor parameters associated with the selected laser lens type among the preset multiple galvanometer motor parameters, and the values ​​of different target galvanometer motor parameters are generally different; displaying the target galvanometer motor parameters on the laser processing control terminal for the operator to adjust based on actual needs, and obtaining the adjusted target galvanometer motor parameters, and the processing parameters include the adjusted target galvanometer motor parameters. Among them, multiple groups of different galvanometer motor parameters are pre-set in the laser processing control system, and different groups of galvanometer motor parameters are adapted to lenses of different laser lens types, so that the galvanometer motor parameters can be automatically adjusted according to lenses of different focal lengths, achieving compatibility with different lens types, and making the setting of processing parameters more convenient and quick.

[0060] Taking the compatibility of different galvanometer motor types as an example, obtaining the processing parameters for the laser processing to be performed may include: obtaining the galvanometer motor type selected by the operator in the preset laser processing control terminal; determining the maximum swing frequency of the galvanometer motor corresponding to the selected galvanometer motor type, wherein the maximum swing frequencies of galvanometer motors of different galvanometer motor types are generally different; obtaining the target galvanometer motor frequency set by the operator of the laser processing control terminal; when the target galvanometer motor frequency is greater than the maximum swing frequency of the galvanometer motor, using the maximum swing frequency of the galvanometer motor as the adjusted target galvanometer motor frequency to avoid the galvanometer motor from operating beyond its maximum swing frequency (i.e., overclocking), avoiding overclocking and affecting the service life of the galvanometer motor, and also improving the stability of the galvanometer motor when it is working. The processing parameters include the adjusted target galvanometer motor frequency.

[0061] Taking the compatibility of different laser types as an example, obtaining the processing parameters for laser processing may include: obtaining the laser type selected by the operator in the preset laser processing control terminal, wherein the laser type is, for example, a MOPA laser, a Q-switched laser, etc.; determining a set of laser parameter items associated with the selected laser type, wherein a set of laser parameter items may include multiple different laser parameters, and different groups of laser parameter items are not exactly the same, for example, a set of laser parameter items associated with a MOPA laser may include a laser parameter of pulse width, while a set of laser parameter items associated with a Q-switched laser does not include a laser parameter of pulse width; in the preset laser processing control terminal, displaying a set of laser parameter items associated with the selected laser type, so that the operator can adjust the values ​​of each laser parameter in the set of laser parameter items based on demand, thereby realizing the setting of laser parameters. It can be seen that based on the different laser types, a corresponding set of laser parameter items can be automatically displayed to be compatible with different laser types.

[0062] In some embodiments of the present application, the laser processing control system may also provide a laser width calibration function. Specifically, because the actual width may be different from the expected width due to long-term operation or consistency of the galvanometer motor, the actual width can be corrected through the laser width calibration function. The laser width calibration function can use full width calibration or proportional coefficient calibration, as detailed below.

[0063] Taking full-width calibration as an example, obtaining the processing parameters for the laser processing to be performed may include: obtaining the laser width value selected by the operator in the preset laser processing control terminal, the selected laser width value is the set expected width value; obtaining the corrected width value associated with the selected laser width value among the preset multiple width values, and the processing parameters may include the corrected width value. In this way, when the laser processing is controlled based on the processing parameters, the control is specifically performed according to the corrected width value.

[0064] Among them, a plurality of amplitude values ​​and corrected amplitude values ​​associated with each amplitude value are pre-stored, so as to screen out the corrected amplitude value associated with the selected laser amplitude value. The corrected amplitude value associated with each amplitude value can be obtained based on the linear correlation between a plurality of preset amplitude values ​​and the actual amplitude value (the corrected amplitude value associated with each amplitude value is the actual amplitude value linearly correlated with the corresponding preset amplitude value). Specifically, the above-mentioned linear correlation relationship can be obtained through the following steps: dividing the full width (for example, 0%-100%) controlled by laser processing into multiple width segments, for example, every 10% of the width is regarded as a width segment; for each width segment, pre-testing the actual width value corresponding to the width value at the end point of the width segment, for example, pre-testing the actual width value corresponding to the width values ​​at the two end points of 30% and 40% in the width segment 30%-40%; based on the actual width value corresponding to the width value at the end point of the width segment, generating a linear correlation curve between the preset width value and the actual width value in the width segment, the linear correlation curve including the width value at the end point of the width segment and the corresponding actual width value (the linear correlation curve is the above-mentioned linear correlation relationship, and each width segment corresponds to a linear correlation curve). In the linear correlation curve, a value is taken according to a preset interval (for example, 1% of the width) to obtain multiple preset width values, and the actual width value corresponding to each preset width value in the corresponding linear correlation curve is the actual width value linearly associated with the preset width value. It can be seen that this full-width calibration method can more conveniently and quickly perform width correction.

[0065] Taking the calibration of proportional coefficient as an example, obtaining the processing parameters of the laser processing to be performed may include: obtaining the laser amplitude value selected by the operator in the preset laser processing control terminal; obtaining the amplitude correction coefficient associated with the selected laser amplitude value, and the processing parameters include the selected laser amplitude value and the amplitude correction coefficient. In this way, when the laser processing control is performed based on the selected laser amplitude value, the amplitude correction coefficient can be used to adjust the amplitude of the galvanometer motor drive signal generated based on the selected laser amplitude value, thereby adjusting the light output amplitude of the laser processing head. For example, the amplitude correction coefficient can be used as an amplification ratio to proportionally amplify the amplitude of the galvanometer motor drive signal generated based on the selected laser amplitude value.

[0066] Among them, the amplitude correction coefficient associated with the selected laser amplitude value can be determined through preliminary testing. Specifically, the actual amplitude value corresponding to the selected laser amplitude value can be pre-tested, and the ratio of the selected laser amplitude value to the actual amplitude value is used as the amplitude correction coefficient associated with the selected laser amplitude value. In some embodiments of the present application, in order to more accurately adjust the galvanometer motor drive signal, the amplitude correction coefficient can be amplified by a preset multiple and then applied to the proportional amplification of the galvanometer motor drive signal, so that the light output amplitude correction of the laser processing head is more accurate.

[0067] 102. Based on the processing parameters, the galvanometer motor inside the laser processing head is controlled to drive the galvanometer to swing, so that the galvanometer swings to the target position.

[0068] In the embodiment of the present application, the target position may be the position where the laser needs to be controlled to be turned on or off. The target position may be specifically determined based on the processing requirements of the laser on the workpiece and is not limited here.

[0069] 103. When it is detected that the galvanometer has swung to the target position, a first level signal is sent to a preset gate circuit module of the main control board of the laser corresponding to the laser processing head. The preset gate circuit module is used to output a second level signal when receiving the first level signal and the laser light enable signal output by the main control board.

[0070] 104. Send the second level signal to the laser to control the laser to turn on or off.

[0071] In the present application embodiment, Figure 2 As shown, the laser is connected to a main control board. The main control board is used to communicate and interact with the control end of the laser, control the light emission of the laser, communicate with the slave control board, etc. The main control board can be set in an electric control box or an electrical cabinet. The preset laser processing control end is mainly used for setting laser parameters such as laser power, laser frequency, laser type, the swing speed of the galvanometer motor in the laser, laser format and other parameters, the type of lens used, the type of galvanometer motor and other information. It can also be used for reading fault data of the laser processing control system, setting related fault alarm thresholds, etc. The slave control board is used to control the above-mentioned galvanometer motor and detect whether there is an abnormality inside the laser processing head. The slave control board and at least one detection unit for detecting whether there is an abnormality inside the laser processing head can be set inside the laser processing head.

[0072] like Figure 2As shown, a preset gate circuit module is provided on the main control board, and the preset gate circuit module may include at least one of an AND gate, an OR gate, a NOT gate, an NAND gate, an NOR gate, an AND-NOR gate, and an XOR gate, as long as the preset gate circuit module can output a second level signal when receiving a first level signal and a laser light-emitting enable signal output by the main control board. The second level signal is used to control the laser to turn on or off. For example, the second level signal can be a low level signal, and the laser will automatically turn off when receiving the low level signal. The laser light-emitting enable signal is an enable signal originally sent by the main control board, which is used to control the light emission of the laser. The laser light-emitting enable signal can be, for example, a high level signal.

[0073] In some embodiments of the present application, the preset gate circuit module can be an AND gate circuit module, and the AND gate circuit module outputs a high level only when all inputs are high levels, and outputs a low level when at least one input is not high. In the scheme of sending the second level signal to the laser to control the laser to turn on, the first level signal is a high level signal, and the laser light-emitting enable signal is a high level signal, which can make the second level signal a high level signal, thereby controlling the laser to turn on. In the scheme of sending the second level signal to the laser to control the laser to turn off, the first level signal is a low level signal, and the laser light-emitting enable signal is a high level signal, which can make the second level signal a low level signal, thereby controlling the laser to turn off. It should be noted that the preset gate circuit module can also be a combination of at least two of an AND gate, an OR gate, a NOT gate, an NAND gate, an NOR gate, an AND-NOR gate, and an XOR gate, so as to realize the function of the preset gate circuit module through multiple gate circuits.

[0074] In some embodiments of the present application, an example is given to illustrate the method of determining the target position. Specifically, after obtaining the processing parameters of the laser processing to be performed, the method may also include: determining the swing trajectory of the galvanometer based on the processing parameters. The swing trajectory may be, for example, Figure 3 In the swing track, the track segments of the laser format overlap are obtained, for example, Figure 3In the two overlapping track parts on the right side (or the left side), the track part with a later track movement order is taken as the track segment; the track starting point and the track end point in the track segment are determined. At this time, in the scheme of sending the second level signal to the laser to control the laser to turn off, the target position can be the track starting point to control the laser to turn off at the target position. In the scheme of sending the second level signal to the laser to control the laser to turn on, the target position can be the track end point to control the laser to turn on at the target position. It can be seen that the embodiment of the present application avoids excessive laser burning caused by repeated laser processing of the same position (such as the two ends of the laser processing format). After combining the second level signal output by the preset gate circuit module, the laser can be quickly switched on and off, which can more accurately avoid this problem and significantly improve the process effect of laser processing such as laser cleaning.

[0075] In some embodiments of the present application, the main control board may also use a detection unit to read in real time the water flow rate of the water cooling circuit of the whole machine including the laser and / or the laser processing head, and the water cooling circuit is used to cool the laser and / or the laser processing head. If the water flow rate of the water cooling circuit is less than the preset flow rate, it indicates that the water cooling circuit has a poor heat dissipation effect on the laser and / or the laser processing head, which may damage the laser and / or the laser processing head. At this time, an alarm message may be output and the laser may be turned off to protect the laser and / or the laser processing head.

[0076] In some embodiments of the present application, in addition to being used to control the above-mentioned galvanometer motor, the control board can also be used to detect whether there is any abnormality inside the laser processing head. Abnormal conditions inside the laser processing head generally include lens abnormalities, motor abnormalities, humidity abnormalities, etc. inside the laser processing head. Among them, the lens can be, for example, at least one of the reflective lens, collimating lens, focusing lens, and lower protective lens inside the laser processing head. The lens abnormality can be, for example, the lens falling off, the lens burning, and the lens having a burn point. The motor generally refers to a driving motor used to drive the lens to swing. The motor abnormality can be, for example, the motor drives the lens to deflect abnormally, the motor structural parts of the motor The temperature is abnormal. Humidity abnormality generally refers to the humidity abnormality in the cavity of the laser processing head.

[0077] In some embodiments of the present application, abnormal conditions inside the laser processing head can be detected by a corresponding detection unit, such as Figure 2As shown in . The detection unit may, for example, include at least one of a scattered light detection unit, a lens temperature detection unit, a structural component temperature detection unit, a humidity detection unit inside the laser processing head cavity, and a motor fault signal detection unit, so as to monitor the inside of the laser processing head in multiple dimensions, and further improve the safety inside the laser processing head. When an abnormality is detected by at least one detection unit, it can be determined that an abnormality has occurred inside the laser processing head. If none of the detection units detects an abnormality, it is determined that no abnormality has occurred inside the laser processing head. In addition, if an abnormality occurs inside the laser processing head, a third level signal may be sent to a preset gate circuit module of the main control board, and the preset gate circuit module is used to output a fourth level signal when receiving the third level signal and the laser light enable signal output by the main control board, and send the fourth level signal to the laser to control the laser to shut down, so that the laser is shut down in a shorter time, faster and more timely, reducing the risk of damage to the laser, preventing damage to the processed workpiece, and enhancing laser safety protection.

[0078] Taking the detection unit including a scattered light detection module as an example, detecting whether an abnormal situation occurs inside the laser processing head may include: using the scattered light detection module inside the laser processing head to collect scattered light information inside the laser processing head, and the scattered light information may be, for example, a scattered light voltage value; based on the scattered light information, judging whether the lens inside the laser processing head is detached or burned, for example, when the scattered light voltage value is greater than a preset voltage value, judging that the lens inside the laser processing head is detached, and when the scattered light voltage value is less than or equal to the preset voltage value, judging that the lens inside the laser processing head is not detached; if it is judged that the lens is detached or burned, it is determined that an abnormal situation occurs inside the laser processing head. Among them, the scattered light detection module may be arranged near the lens, and / or the scattered light detection module may be arranged toward the lens, so that when the lens is detached or burned, and the laser irradiates other positions inside the laser processing head to generate scattered light, the change of scattered light can be timely collected.

[0079] Taking the detection unit including a structural component temperature detection unit as an example, detecting whether an abnormal situation occurs inside the laser processing head may include: using the structural component temperature detection module inside the laser processing head to collect the structural component temperature of the drive motor of the reflective lens inside the laser processing head, the structural component temperature detection module may include a contact or non-contact temperature sensor, wherein the contact temperature sensor may be arranged at the structural component of the drive motor, and the non-contact temperature sensor may be arranged toward the structural component of the drive motor; based on the structural component temperature, judging whether the structural component temperature of the drive motor is abnormal, for example, when the structural component temperature is greater than the first temperature threshold, judging that the structural component temperature of the drive motor is abnormal, and when the structural component temperature is less than or equal to the first temperature threshold, judging that the structural component temperature of the drive motor is not abnormal; if it is judged that the structural component temperature of the drive motor is abnormal, determining that an abnormal situation occurs inside the laser processing head. It can be understood that when the structural component temperature of the drive motor is abnormal, it is easy to cause damage to the drive motor or damage to the workpiece being processed, so it is necessary to monitor the structural component temperature of the drive motor.

[0080] Taking the detection unit including a lens temperature detection unit as an example, detecting whether an abnormality occurs inside the laser processing head may include: using the lens temperature detection unit inside the laser processing head to collect the lens temperature of the reflective lens inside the laser processing head, the lens temperature detection unit may include a non-contact temperature sensor, and the non-contact temperature sensor may be arranged toward the reflective lens; judging whether the lens temperature is abnormal, for example, when the lens temperature is greater than a second temperature threshold, judging that the lens temperature is abnormal and the lens may have a burn point, and when the lens temperature is less than or equal to the second temperature threshold, judging that the lens temperature is not abnormal; if the lens temperature is judged to be abnormal, determining that an abnormality occurs inside the laser processing head. It is understandable that when the lens temperature is abnormal, it is easy to cause the lens to burn or the workpiece being processed to be damaged, so it is necessary to monitor the lens temperature.

[0081] Taking the detection unit including the humidity detection unit inside the cavity of the laser processing head as an example, detecting whether an abnormal situation occurs inside the laser processing head may include: using the humidity detection unit inside the cavity of the laser processing head to collect the humidity inside the cavity of the laser processing head; judging whether the humidity inside the cavity is abnormal, for example, when the humidity inside the cavity is greater than the preset humidity, judging that the humidity inside the cavity is abnormal, and when the humidity inside the cavity is less than or equal to the preset humidity, judging that the humidity inside the cavity is not abnormal; if the humidity inside the cavity is judged to be abnormal, determining that an abnormal situation occurs inside the laser processing head. It is understandable that when the humidity inside the cavity is abnormal, it is usually due to the abnormal sealing of the cavity, causing the moisture in the water circulation used to cool the laser processing head to enter the cavity, so it is necessary to monitor the humidity inside the cavity.

[0082] Taking the detection unit including a motor fault signal detection unit as an example, detecting whether an abnormal situation occurs inside the laser processing head may include: using the motor fault signal detection unit to detect whether the drive motor triggers a motor fault signal; if the drive motor triggers a motor fault signal, determining that the motor drives the lens to deflect abnormally, and determining that an abnormal situation occurs inside the laser processing head.

[0083] In some embodiments of the present application, Figure 2 As shown, the slave control board and the main control board can also be connected via a controller area network (CAN) bus or a serial port such as RS-485. After detecting whether an abnormal situation occurs inside the laser processing head, it can also include: if an abnormal situation occurs inside the laser processing head, the slave control board generates an abnormal data signal, the abnormal data signal is serial data, and the abnormal data signal carries various operating parameters when an abnormal situation occurs inside the laser processing head (such as the data collected by the above-mentioned detection units); the abnormal data signal is output to the main control board using the controller area network bus or serial port, so that the main control board can parse the abnormal data signal and display the above-mentioned operating parameters in the parsing result in the preset laser processing control terminal, so as to facilitate fault alarm and related operators to check and understand.

[0084] The laser processing control method provided in the embodiment of the present application sends a first level signal to a preset gate circuit module when the galvanometer swings to the target position, so as to use the preset gate circuit module to directly output a corresponding second level signal, thereby controlling the laser to be turned on or off. In this process, there is no need for the main control board to parse the data signal and control the laser to be turned on or off according to the analysis result, so that the time taken to turn the laser on or off is shortened, so as to realize the rapid switching light of the laser and improve the laser processing effect.

[0085] In order to better implement the laser processing control method in the embodiment of the present application, based on the laser processing control method, a laser processing control system is also provided in the embodiment of the present application, such as Figure 4 As shown, the laser processing control system 400 includes:

[0086] An acquisition module 401 is used to acquire processing parameters for laser processing to be performed;

[0087] The control module 402 is used to control the galvanometer motor inside the laser processing head to drive the galvanometer to swing based on the processing parameters, so that the galvanometer swings to the target position;

[0088] The sending module 403 is used to send a first level signal to a preset gate circuit module of the main control board of the laser corresponding to the laser processing head when the galvanometer is detected to swing to the target position, and the preset gate circuit module is used to output a second level signal when receiving the first level signal and the laser light enable signal output by the main control board;

[0089] The sending module 403 is further used to send the second level signal to the laser to control the laser to turn on or off.

[0090] The laser processing control system provided in the embodiment of the present application sends a first level signal to a preset gate circuit module when the galvanometer swings to the target position, so as to use the preset gate circuit module to directly output a corresponding second level signal, thereby controlling the laser to turn on or off, thereby realizing rapid switching of the laser light and improving the laser processing effect.

[0091] In some embodiments of the present application, the acquisition module 401 is further used to:

[0092] Based on the processing parameters, determine the swing trajectory of the galvanometer;

[0093] In the swinging trajectory, a trajectory segment with overlapping laser amplitudes is obtained;

[0094] Determine a trajectory start point and a trajectory end point in a trajectory segment;

[0095] Among them, in the scheme of sending the second level signal to the laser to control the laser to turn off, the target position is the starting point of the track, and in the scheme of sending the second level signal to the laser to control the laser to turn on, the target position is the end point of the track.

[0096] In some embodiments of the present application, the acquisition module 401 is further used to:

[0097] In a preset laser processing control terminal, a selected laser lens type is obtained, wherein different laser lens types have different lens focal lengths;

[0098] Determine a target galvanometer motor parameter associated with the selected laser lens type among a plurality of preset galvanometer motor parameters;

[0099] The target galvanometer motor parameters are displayed on the laser processing control end for adjustment, and the adjusted target galvanometer motor parameters are obtained. The processing parameters include the adjusted target galvanometer motor parameters.

[0100] In some embodiments of the present application, the acquisition module 401 is further used to:

[0101] In the preset laser processing control terminal, obtain the selected galvanometer motor type;

[0102] Determine the maximum oscillation frequency of the galvanometer motor corresponding to the selected galvanometer motor type;

[0103] Obtain the target galvanometer motor frequency set by the laser processing control end;

[0104] When the target galvanometer motor frequency is greater than the maximum swing frequency of the galvanometer motor, the maximum swing frequency of the galvanometer motor is used as the adjusted target galvanometer motor frequency, and the processing parameters include the adjusted target galvanometer motor frequency.

[0105] In some embodiments of the present application, the acquisition module 401 is further used to:

[0106] In the preset laser processing control terminal, the selected laser width value is obtained;

[0107] Among the preset multiple amplitude values, a corrected amplitude value associated with the selected laser amplitude value is obtained, the processing parameters include the corrected amplitude value, and the association between the selected laser amplitude value and the corrected amplitude value is obtained based on the linear correlation between the multiple preset amplitude values ​​and the actual amplitude value.

[0108] In some embodiments of the present application, the acquisition module 401 is further used to:

[0109] In the preset laser processing control terminal, the selected laser width value is obtained;

[0110] The amplitude correction coefficient associated with the selected laser amplitude value is obtained. The processing parameters include the selected laser amplitude value and the amplitude correction coefficient. The amplitude correction coefficient is used to adjust the galvanometer motor drive signal generated based on the selected laser amplitude value, thereby adjusting the light output amplitude of the laser processing head.

[0111] In addition to the above-described laser processing control method and laser processing control system, the embodiment of the present application further provides an electronic device, which integrates any laser processing control system provided in the embodiment of the present application, and the electronic device includes:

[0112] one or more processors;

[0113] Memory; and

[0114] One or more applications, wherein the one or more applications are stored in the memory and configured to execute, by the processor, any step in any embodiment of the above-mentioned laser processing control method.

[0115] The present application also provides an electronic device that integrates any laser processing control system provided in the present application. Figure 5 As shown, it shows a schematic diagram of the structure of the electronic device involved in the embodiment of the present application, specifically:

[0116] The electronic device may include components such as a processor 501 with one or more processing cores, a storage unit 502 with one or more computer-readable storage media, a power supply 503, and an input unit 504. Those skilled in the art will appreciate that Figure 5 The electronic device structure shown in the figure does not constitute a limitation on the electronic device, and may include more or fewer components than shown in the figure, or combine certain components, or arrange the components differently.

[0117] The processor 501 is the control center of the electronic device. It uses various interfaces and lines to connect various parts of the entire electronic device. By running or executing software programs and / or modules stored in the storage unit 502 and calling data stored in the storage unit 502, it executes various functions of the electronic device and processes data, thereby monitoring the electronic device as a whole. Optionally, the processor 501 may include one or more processing cores; preferably, the processor 501 may integrate an application processor and a modem processor, wherein the application processor mainly processes the operating system, user interface, and application programs, and the modem processor mainly processes wireless communications. It is understandable that the above-mentioned modem processor may not be integrated into the processor 501.

[0118] The storage unit 502 can be used to store software programs and modules. The processor 501 executes various functional applications and data processing by running the software programs and modules stored in the storage unit 502. The storage unit 502 may mainly include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function (such as a sound playback function, an image playback function, etc.), etc.; the data storage area may store data created according to the use of the electronic device, etc. In addition, the storage unit 502 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other volatile solid-state storage devices. Accordingly, the storage unit 502 may also include a memory controller to provide the processor 501 with access to the storage unit 502.

[0119] The electronic device also includes a power supply 503 for supplying power to each component. Preferably, the power supply 503 can be logically connected to the processor 501 through a power management system, so as to manage charging, discharging, power consumption and other functions through the power management system. The power supply 503 can also include one or more DC or AC power supplies, recharging systems, power failure detection circuits, power converters or inverters, power status indicators and other arbitrary components.

[0120] The electronic device may further include an input unit 504, which may be used to receive input digital or character information and generate keyboard, mouse, joystick, optical or trackball signal input related to user settings and function control.

[0121] Although not shown, the electronic device may further include a display unit, etc., which will not be described in detail herein. Specifically, in the embodiment of the present application, the processor 501 in the electronic device will load the executable file corresponding to the process of one or more application programs into the storage unit 502 according to the following instructions, and the processor 501 will run the application program stored in the storage unit 502, thereby realizing various functions, such as:

[0122] Acquire processing parameters of the laser processing to be performed; based on the processing parameters, control the galvanometer motor inside the laser processing head to drive the galvanometer to swing, so that the galvanometer swings to the target position; when it is detected that the galvanometer swings to the target position, send a first level signal to a preset gate circuit module of the main control board of the laser corresponding to the laser processing head, the preset gate circuit module is used to output a second level signal when receiving the first level signal and the laser light enable signal output by the main control board; send the second level signal to the laser to control the laser to turn on or off.

[0123] To this end, an embodiment of the present application provides a computer-readable storage medium, which may include: a read-only memory (ROM), a random access memory (RAM), a disk or an optical disk, etc. The computer-readable storage medium stores a plurality of instructions, which can be loaded by a processor to execute the steps of any laser processing control method provided in the embodiment of the present application. For example, the instruction can execute the following steps:

[0124] Acquire processing parameters of the laser processing to be performed; based on the processing parameters, control the galvanometer motor inside the laser processing head to drive the galvanometer to swing, so that the galvanometer swings to the target position; when it is detected that the galvanometer swings to the target position, send a first level signal to a preset gate circuit module of the main control board of the laser corresponding to the laser processing head, the preset gate circuit module is used to output a second level signal when receiving the first level signal and the laser light enable signal output by the main control board; send the second level signal to the laser to control the laser to turn on or off.

[0125] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0126] The above is a detailed introduction to a laser processing control method, system, electronic device and medium provided in the embodiments of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for technical personnel in this field, according to the ideas of the present application, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A laser processing control method, characterized in that: The laser processing control method is applied to a slave control board, comprising: Obtaining processing parameters for laser processing to be performed; Based on the processing parameters, controlling the galvanometer motor inside the laser processing head to drive the galvanometer to swing, so that the galvanometer swings to a target position; When it is detected that the galvanometer has swung to the target position, a first level signal is sent to a preset gate circuit module of a main control board of the laser corresponding to the laser processing head, and the preset gate circuit module is used to output a second level signal when receiving the first level signal and a laser light-emitting enable signal output by the main control board, wherein the laser light-emitting enable signal is an enable signal issued by the main control board, and the laser light-emitting enable signal is a high level signal; Sending the second level signal to the laser to control the laser to turn on or off; The preset gate circuit module is an AND gate circuit module, In a solution in which the second level signal is sent to the laser to control the laser to turn on, the first level signal is a high level signal, the laser light-emitting enable signal is a high level signal, and the second level signal is a high level signal; In a solution of sending the second level signal to the laser to control the laser to turn off, the first level signal is a low level signal, the laser light emission enable signal is a high level signal, and the second level signal is a low level signal.

2. The laser processing control method according to claim 1, characterized in that: After obtaining the processing parameters to be laser processed, the method further includes: Based on the processing parameters, determining the swing trajectory of the galvanometer; In the swinging trajectory, obtaining a trajectory segment where the laser amplitude overlaps; Determining a trajectory start point and a trajectory end point in the trajectory segment; Among them, in the scheme of sending the second level signal to the laser to control the laser to turn off, the target position is the starting point of the trajectory, and in the scheme of sending the second level signal to the laser to control the laser to turn on, the target position is the end point of the trajectory.

3. The laser processing control method according to claim 1, characterized in that: The step of obtaining the processing parameters for the laser processing to be performed includes: In a preset laser processing control terminal, a selected laser lens type is obtained, wherein different laser lens types have different lens focal lengths; Determine, among a plurality of preset galvanometer motor parameters, a target galvanometer motor parameter associated with the selected laser lens type; The target galvanometer motor parameters are displayed on the laser processing control end for adjustment, and the adjusted target galvanometer motor parameters are obtained. The processing parameters include the adjusted target galvanometer motor parameters.

4. The laser processing control method according to claim 1, characterized in that: The step of obtaining the processing parameters for the laser processing to be performed includes: In the preset laser processing control terminal, obtain the selected galvanometer motor type; Determining a maximum oscillation frequency of a galvanometer motor corresponding to the selected galvanometer motor type; Obtaining a target galvanometer motor frequency set by the laser processing control end; When the target galvanometer motor frequency is greater than the maximum oscillation frequency of the galvanometer motor, the maximum oscillation frequency of the galvanometer motor is used as the adjusted target galvanometer motor frequency, and the processing parameters include the adjusted target galvanometer motor frequency.

5. The laser processing control method according to claim 1, characterized in that: The step of obtaining the processing parameters for the laser processing to be performed includes: In the preset laser processing control terminal, the selected laser width value is obtained; Among the preset multiple amplitude values, a corrected amplitude value associated with the selected laser amplitude value is obtained, the processing parameters include the corrected amplitude value, and the association between the selected laser amplitude value and the corrected amplitude value is obtained based on the linear correlation between multiple preset amplitude values ​​and the actual amplitude value.

6. The laser processing control method according to claim 1, characterized in that: The step of obtaining the processing parameters for the laser processing to be performed includes: In the preset laser processing control terminal, the selected laser width value is obtained; An amplitude correction coefficient associated with the selected laser amplitude value is obtained, wherein the processing parameters include the selected laser amplitude value and the amplitude correction coefficient, and the amplitude correction coefficient is used to adjust the galvanometer motor drive signal generated based on the selected laser amplitude value, thereby adjusting the light output amplitude of the laser processing head.

7. A laser processing control system, characterized in that: The laser processing control system is applied to the slave control board, including: An acquisition module, used for acquiring processing parameters of the laser processing to be performed; A control module, for controlling a galvanometer motor inside the laser processing head to drive the galvanometer to swing based on the processing parameters, so that the galvanometer swings to a target position; a sending module, used for sending a first level signal to a preset gate circuit module of a main control board of the laser corresponding to the laser processing head when detecting that the galvanometer has swung to the target position, the preset gate circuit module being used for outputting a second level signal when receiving the first level signal and a laser light-emitting enable signal output by the main control board, the laser light-emitting enable signal being an enable signal issued by the main control board, and the laser light-emitting enable signal being a high level signal; The sending module is further used to send the second level signal to the laser to control the laser to turn on or off; The preset gate circuit module is an AND gate circuit module, In a solution in which the second level signal is sent to the laser to control the laser to turn on, the first level signal is a high level signal, the laser light-emitting enable signal is a high level signal, and the second level signal is a high level signal; In a solution of sending the second level signal to the laser to control the laser to turn off, the first level signal is a low level signal, the laser light emission enable signal is a high level signal, and the second level signal is a low level signal.

8. An electronic device, characterized in that: The electronic device comprises: one or more processors; Memory; and One or more application programs, wherein the one or more application programs are stored in the memory and are configured to be executed by the processor to implement the laser processing control method according to any one of claims 1 to 6.

9. A computer-readable storage medium, characterized in that: A computer program is stored thereon, and the computer program is loaded by a processor to execute the steps in the laser processing control method according to any one of claims 1 to 6.

Images