Radio frequency sub-module, radio frequency front-end module and determination method of radio frequency sub-module

Abstract

The application relates to the technical field of electronic circuits, and provides a radio frequency sub-module, a radio frequency front end module and a determination method of the radio frequency sub-module. The radio frequency sub-module comprises a common circuit board, a first surface of the common circuit board comprises a second functional area, and a receiving filter of a first frequency band is arranged in the second functional area; a second surface of the common circuit board comprises a fourth pin area, a fifth pin area and a sixth pin area, and the three areas are distributed along three edges of the second surface; the fourth pin area comprises an antenna pin, and the antenna pin is used for connecting an antenna; the fifth pin area comprises a receiving control pin and a receiving power pin, the receiving control pin is used for connecting a control end of a receiving signal to input a control signal of the receiving signal, and the receiving power pin is used for inputting a first power voltage; and the sixth pin area comprises a receiving output pin, and the receiving output pin is used for outputting a receiving signal to a radio frequency chip. The pin distribution mode of the radio frequency sub-module can realize compatibility of multiple specifications and avoid repeated design.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic circuits, in particular to a radio frequency sub-module, a radio frequency front-end module and a determination method of the radio frequency sub-module. BACKGROUND

[0002] With the rapid development of integrated circuit technology, the integration of radio frequency components is becoming higher and higher. For example, different specifications of radio frequency front-end modules need to be selected to realize the processing of radio frequency signals. Generally, the selected crystal grains and the layout of circuits in different radio frequency front-end modules are different, which makes the design scheme of the circuit board used in different specifications of radio frequency front-end modules different.

[0003] For example, in the NR frequency band of 5G technology, two frequency bands of N77 and N79 are often involved. Some high-end machines need to support the 2T4R specification of N77 and N79, some need to support 2T4R of N77 and 1T4R of N79, some need to support 1T4R of N77 and 1T4R of N79, and some low-end machines only need to support N77 without supporting the frequency band of N79. In the traditional design process, different radio frequency front-end modules need to be designed to adapt to product requirements for different specifications of terminal devices. Different radio frequency front-end modules need to be laid out and designed according to their respective specification requirements.

[0004] However, the traditional way of laying out and designing the corresponding circuit board according to different specification requirements will result in a large number of types of radio frequency front-end module circuit boards, increasing the design complexity and thus increasing the design cost. SUMMARY

[0005] The present application provides a radio frequency sub-module, a radio frequency front-end module, a determination method of the radio frequency sub-module, an apparatus, a chip, an electronic device, a computer readable storage medium and a computer program product, which can be compatible with multiple specifications, avoid repeated design and reduce design complexity.

[0006] In a first aspect, a radio frequency sub-module is provided, and the radio frequency sub-module comprises a common circuit board;

[0007] The first surface of the common circuit board comprises a second functional area, and a receiving filter of a first frequency band is arranged in the second functional area;

[0008] The second surface of the common circuit board comprises a fourth pin area, a fifth pin area and a sixth pin area, and the fourth pin area, the fifth pin area and the sixth pin area are respectively distributed along three edges of the second surface;

[0009] The fourth pin area comprises an antenna pin, and the antenna pin is used to connect an antenna;

[0010] The fifth pin area comprises a receiving control pin and a receiving power pin, the receiving control pin is used for connecting a control end of a receiving signal to input a control signal of the receiving signal, and the receiving power pin is used for inputting a first power voltage;

[0011] The sixth pin area comprises a receiving output pin, and the receiving output pin is used for outputting the receiving signal to the radio frequency chip.

[0012] Optionally, the second surface further comprises a third functional area, and the third functional area is arranged with an antenna switch and a low noise amplifier of the first frequency band.

[0013] Optionally, the second functional area further comprises an impedance matching network of a receiving filter of the first frequency band.

[0014] Optionally, the first surface further comprises a first functional area, and the first functional area and the second functional area are not intersected with each other;

[0015] The first functional area is arranged with a power amplifier of the first frequency band, and the second functional area is further arranged with a transmitting filter of the first frequency band.

[0016] The second surface further comprises a first ground pin area, a first pin area, a second pin area and a seventh pin area;

[0017] The first ground pin area and the third functional area are not intersected with each other, the first pin area, the second pin area and the seventh pin area are respectively distributed along three edges of the periphery of the first ground pin area, and the first pin area, the second pin area and the seventh pin area are respectively distributed along three edges of the second surface;

[0018] The fourth pin area, the fifth pin area and the sixth pin area are respectively distributed along three edges of the periphery of the third functional area;

[0019] The first pin area comprises a transmitting input pin, and the transmitting input pin is used for inputting a transmitting signal output by the radio frequency chip;

[0020] The second pin area comprises a transmitting power pin, and the transmitting power pin is used for inputting a second power voltage;

[0021] The seventh pin area comprises a transmitting control pin, and the transmitting control pin is used for connecting a control end of a transmitting signal to input a control signal of the transmitting signal.

[0022] Optionally, the second surface further comprises a third pin area, the third pin area is distributed along any one of three edges of the periphery of the first ground pin area, and the third pin area is distributed along any one of three edges of the second surface;

[0023] The third pin area comprises a coupling input pin and a coupling output pin, the coupling input pin is used for inputting a first coupling signal, and the coupling output pin is used for outputting a second coupling signal.

[0024] Optionally, the first functional area further comprises a power matching network of the power amplifier of the first frequency band.

[0025] Optionally, the first ground pin area comprises a plurality of ground pins.

[0026] Optionally, the second functional area further comprises an impedance matching network of the receive filter of the first frequency band.

[0027] Optionally, the second functional area further comprises an impedance matching network of the receive filter of the first frequency band.

[0028] Optionally, the second functional area further comprises an impedance matching network of the receive filter of the first frequency band.

[0029] Optionally, the second functional area further comprises an impedance matching network of the receive filter of the first frequency band.

[0030] Optionally, the first functional area further comprises a power matching network of the power amplifier of the second frequency band.

[0031] Optionally, the first functional area further comprises a power matching network of the power amplifier of the second frequency band.

[0032] Optionally, the second functional area further comprises an antenna switch and a low noise amplifier of the first frequency band.

[0033] Optionally, the second surface further comprises a second ground pin area, and the second ground pin area comprises a plurality of ground pins.

[0034] Optionally, the second functional area further comprises an impedance matching network of the receive filter of the first frequency band.

[0035] Optionally, the first surface further comprises a first functional area, and the first functional area and the second functional area are mutually exclusive.

[0036] The first functional area comprises a power amplifier of the first frequency band, and the second functional area comprises a transmit filter of the first frequency band.

[0037] The second surface further comprises a first ground pin area, a first pin area, a second pin area and a seventh pin area.

[0038] The first ground pin area and the second ground pin area are mutually exclusive, the first pin area, the second pin area and the seventh pin area are respectively distributed along three edges of the periphery of the first ground pin area, and the first pin area, the second pin area and the seventh pin area are respectively distributed along three edges of the second surface.

[0039] The fourth pin area, the fifth pin area and the sixth pin area are respectively distributed along three edges of the periphery of the second ground pin area.

[0040] The first pin area includes a transmit input pin for inputting a transmit signal output by the radio frequency chip;

[0041] The second pin area includes a transmit power pin for inputting a second power voltage;

[0042] The seventh pin area includes a transmit control pin for connecting a control end of the transmit signal to input a control signal of the transmit signal.

[0043] Optionally, the second surface further includes a third pin area, the third pin area being distributed along any one or two of the three edges of the periphery of the first ground pin area, and the third pin area being distributed along any one or two of the three edges of the second surface;

[0044] The third pin area includes a coupling input pin for inputting a first coupling signal and a coupling output pin for outputting a second coupling signal.

[0045] Optionally, the first functional area further includes a power matching network of the power amplifier of the first frequency band.

[0046] Optionally, the first ground pin area includes a plurality of ground pins.

[0047] In a second aspect, a radio frequency front-end module is provided, including a first sub-module and a second sub-module, the first sub-module including a first common circuit board, and the second sub-module including a second common circuit board;

[0048] The second surface of the first common circuit board includes a first receive pin area, the first receive pin area including a fourth pin area, a fifth pin area and a sixth pin area, the fourth pin area, the fifth pin area and the sixth pin area being respectively distributed along the three edges of the second surface;

[0049] The fourth pin area includes an antenna pin for connecting an antenna;

[0050] The fifth pin area includes a receive control pin for connecting a control end of the receive signal to input a control signal of the receive signal and a receive power pin for inputting a first power voltage;

[0051] The sixth pin area includes a receive output pin for outputting the receive signal to the radio frequency chip;

[0052] The second surface of the second common circuit board includes a second receive pin area, the second receive pin area and the first receive pin area having the same pin distribution manner.

[0053] Optionally, the first sub-module is a radio frequency sub-module in the technical solution of the first aspect, and the second sub-module is a radio frequency sub-module in the technical solution of the first aspect.

[0054] Optionally, the first sub-module is a radio frequency sub-module in the technical solution of the first aspect, and the second sub-module is a radio frequency sub-module in the technical solution of the first aspect.

[0055] Optionally, the first sub-module is a radio frequency sub-module in the technical solution of the first aspect, and the second sub-module is a radio frequency sub-module in the technical solution of the first aspect.

[0056] Optionally, the first sub-module is a radio frequency sub-module in the technical solution of the first aspect, and the second sub-module is a radio frequency sub-module in the technical solution of the first aspect.

[0057] In a third aspect, a method for determining a radio frequency sub-module is provided, the radio frequency sub-module comprising a common circuit board, the method comprising:

[0058] determining a second functional area on a first surface of the common circuit board, and arranging a receiving filter of a first frequency band in the second functional area;

[0059] arranging a fourth pin area, a fifth pin area and a sixth pin area along three edges of a second surface of the common circuit board respectively;

[0060] arranging an antenna pin in the fourth pin area, the antenna pin being used for connecting an antenna;

[0061] arranging a receiving control pin and a receiving power pin in the fifth pin area, the receiving control pin being used for connecting a control end of a receiving signal to input a control signal of the receiving signal, and the receiving power pin being used for inputting a first power voltage;

[0062] arranging a receiving output pin in the sixth pin area, the receiving output pin being used for outputting a receiving signal to a radio frequency chip.

[0063] Optionally, the method further comprises:

[0064] arranging an antenna switch and a low noise amplifier of the first frequency band in a third functional area on the second surface.

[0065] Optionally, the method further comprises:

[0066] arranging an impedance matching network of the receiving filter of the first frequency band in the second functional area.

[0067] Optionally, fourth, fifth and sixth pin areas are arranged along three edges of the second surface of the common circuit board, respectively, including:

[0068] The fourth, fifth and sixth pin areas are arranged along three edges of the periphery of the third functional area;

[0069] The method further includes:

[0070] A first functional area is further determined in the first surface, and the first functional area and the second functional area are mutually exclusive;

[0071] A power amplifier of the first frequency band is arranged in the first functional area, and a transmitting filter of the first frequency band is further arranged in the second functional area;

[0072] A first ground pin area is further arranged in the second surface, and the first ground pin area and the third functional area are mutually exclusive;

[0073] First, second and seventh pin areas are arranged along three edges of the periphery of the first ground pin area, and the first, second and seventh pin areas are distributed along three edges of the second surface, respectively;

[0074] A transmitting input pin is arranged in the first pin area, and the transmitting input pin is used for inputting a transmitting signal output by a radio frequency chip;

[0075] A transmitting power pin is arranged in the second pin area, and the transmitting power pin is used for inputting a second power voltage;

[0076] A transmitting control pin is arranged in the seventh pin area, and the transmitting control pin is used for connecting a control end of the transmitting signal to input a control signal of the transmitting signal.

[0077] Optionally, the method further includes:

[0078] A third pin area is further arranged in the second surface, the third pin area is distributed along any one or two of the three edges of the periphery of the first ground pin area, and the third pin area is distributed along any one or two of the three edges of the second surface;

[0079] A coupling input pin and a coupling output pin are arranged in the third pin area, the coupling input pin is used for inputting a first coupling signal, and the coupling output pin is used for outputting a second coupling signal.

[0080] Optionally, the method further includes:

[0081] A power matching network of the power amplifier of the first frequency band is further arranged in the first functional area.

[0082] Optionally, the method further includes:

[0083] A plurality of ground pins are arranged in the first ground pin area.

[0084] Optionally, the method further comprises:

[0085] a receive filter of the second frequency band is further arranged in the second functional area;

[0086] a low noise amplifier and a multiplexing switch of the second frequency band are further arranged in the third functional area.

[0087] Optionally, the method further comprises:

[0088] an impedance matching network of the receive filter of the second frequency band is further arranged in the second functional area.

[0089] Optionally, the method further comprises:

[0090] a receive filter of the second frequency band is further arranged in the second functional area;

[0091] a low noise amplifier and a multiplexing switch of the second frequency band are further arranged in the third functional area.

[0092] Optionally, an impedance matching network of the receive filter of the second frequency band is further arranged in the second functional area.

[0093] Optionally, the method further comprises:

[0094] a power amplifier of the second frequency band is further arranged in the first functional area;

[0095] a transmit filter of the second frequency band is further arranged in the second functional area.

[0096] Optionally, the method further comprises:

[0097] a power matching network of the power amplifier of the second frequency band is further arranged in the first functional area.

[0098] Optionally, the method further comprises:

[0099] an antenna switch and a low noise amplifier of the first frequency band are further arranged in the second functional area.

[0100] Optionally, the method further comprises:

[0101] a second ground pin area is further arranged on the second surface, and a plurality of ground pins are arranged in the second ground pin area.

[0102] Optionally, the method further comprises:

[0103] an impedance matching network of the receive filter of the first frequency band is further arranged in the second functional area.

[0104] Optionally, fourth, fifth and sixth pin areas are respectively arranged along three edges of the second surface on the second surface of the common circuit board, comprising:

[0105] The fourth pin area, the fifth pin area and the sixth pin area are arranged along three edges of the periphery of the second ground pin area;

[0106] The method further comprises:

[0107] The first functional area is further determined in the first surface, and the first functional area and the second functional area are mutually exclusive;

[0108] The power amplifier of the first frequency band is arranged in the first functional area, and the transmitting filter of the first frequency band is further arranged in the second functional area;

[0109] The first ground pin area is further arranged in the second surface, and the first ground pin area and the second ground pin area are mutually exclusive;

[0110] The first ground pin area, the first pin area, the second pin area and the seventh pin area are arranged along three edges of the periphery of the first ground pin area, and the first pin area, the second pin area and the seventh pin area are respectively distributed along three edges of the second surface;

[0111] The transmitting input pin is arranged in the first pin area, and the transmitting input pin is used for inputting the transmitting signal output by the radio frequency chip;

[0112] The transmitting power pin is arranged in the second pin area, and the transmitting power pin is used for inputting the second power voltage;

[0113] The transmitting control pin is arranged in the seventh pin area, and the transmitting control pin is used for connecting a control end of the transmitting signal to input a control signal of the transmitting signal.

[0114] Optionally, the method further comprises:

[0115] The third pin area is further arranged in the second surface, the third pin area is distributed along any one or two edges of the three edges of the periphery of the first ground pin area, and the third pin area is distributed along any one or two edges of the three edges of the second surface;

[0116] The coupling input pin and the coupling output pin are arranged in the third pin area, the coupling input pin is used for inputting the first coupling signal, and the coupling output pin is used for outputting the second coupling signal.

[0117] Optionally, the method further comprises:

[0118] The power matching network of the power amplifier of the first frequency band is further arranged in the first functional area.

[0119] Optionally, the method further comprises:

[0120] A plurality of ground pins are arranged in the first ground pin area.

[0121] In a fourth aspect, a determination apparatus of a radio frequency sub-module is provided, which comprises a unit composed of software and / or hardware, and the unit is configured to execute any one of the methods in the technical solutions of the third aspect.

[0122] In a fifth aspect, an embodiment of the present application provides a chip, which comprises a processor; the processor is configured to read and execute a computer program stored in a memory, so as to execute any one of the methods in the technical solutions of the third aspect.

[0123] Optionally, the chip further comprises a memory, and the memory is connected with the processor through a circuit or a wire.

[0124] Further optionally, the chip further comprises a communication interface.

[0125] In a sixth aspect, an electronic device is provided, which comprises any one of the radio frequency sub-modules in the technical solutions of the first aspect.

[0126] In a seventh aspect, an electronic device is provided, which comprises any one of the radio frequency front-end modules in the technical solutions of the second aspect.

[0127] In an eighth aspect, an electronic device is provided, which comprises a processor, a memory and an interface; the processor, the memory and the interface cooperate with each other, so that the electronic device executes any one of the methods in the technical solutions of the third aspect.

[0128] In a ninth aspect, a computer readable storage medium is provided, and the computer readable storage medium stores a computer program; when the computer program is executed by a processor, the processor executes any one of the methods in the technical solutions of the third aspect.

[0129] In a tenth aspect, a computer program product is provided, and the computer program product comprises computer program code; when the computer program code is executed on an electronic device, the electronic device executes any one of the methods in the technical solutions of the third aspect. BRIEF DESCRIPTION OF DRAWINGS

[0130] Figure 1 FIG. 1 is a structural schematic diagram of a terminal device 100 provided by an embodiment of the present application;

[0131] Figure 2 FIG. 2 is an application scenario diagram of a radio frequency front-end module provided by an embodiment of the present application;

[0132] Figure 3 FIG. 3 is a circuit structural schematic diagram of a radio frequency front-end module provided by an embodiment of the present application;

[0133] Figure 4is a schematic diagram of multiple transceiving paths between transceiving devices provided by an embodiment of the present application;

[0134] Figure 5 is a circuit block diagram of a radio frequency sub-module provided by an embodiment of the present application;

[0135] Figure 6 is a layout schematic diagram and a pin distribution schematic diagram of a radio frequency sub-module implemented based on the circuit block diagram of Figure 5

[0136] Figure 7 is a layout schematic diagram and a pin distribution schematic diagram of a radio frequency sub-module implemented based on the circuit block diagram of Figure 5

[0137] Figure 8 is a layout schematic diagram and a pin distribution schematic diagram of a radio frequency sub-module implemented based on the circuit block diagram of Figure 5

[0138] Figure 9 is a layout schematic diagram and a pin distribution schematic diagram of a radio frequency sub-module implemented based on the circuit block diagram of Figure 5

[0139] Figure 10 is a layout schematic diagram and a pin distribution schematic diagram of a radio frequency sub-module implemented based on the circuit block diagram of Figure 5

[0140] Figure 11 is a layout schematic diagram and a pin distribution schematic diagram of a radio frequency sub-module implemented based on the circuit block diagram of Figure 5

[0141] Figure 12 is a layout schematic diagram and a pin distribution schematic diagram of a radio frequency sub-module implemented based on the circuit block diagram of Figure 5

[0142] Figure 13 is a circuit block diagram of a radio frequency sub-module provided by an embodiment of the present application;

[0143] Figure 14 is a layout schematic diagram and a pin distribution schematic diagram of a radio frequency sub-module implemented based on the circuit block diagram of Figure 13

[0144] Figure 15 is a circuit block diagram of a radio frequency sub-module provided by an embodiment of the present application;

[0145] ​​​​​​​​Figure 16 is a layout schematic diagram and a pin distribution schematic diagram of a radio frequency sub-module based on the circuit block diagram of Figure 15

[0146] Figure 17 is a layout schematic diagram and a pin distribution schematic diagram of a radio frequency sub-module based on the circuit block diagram of Figure 16

[0147] Figure 18 is another circuit block diagram of a radio frequency sub-module provided by an embodiment of the present application;

[0148] Figure 19 is a layout schematic diagram and a pin distribution schematic diagram of a radio frequency sub-module based on the circuit block diagram of Figure 18

[0149] Figure 20 is a layout schematic diagram and a pin distribution schematic diagram of a radio frequency sub-module based on the circuit block diagram of Figure 18

[0150] Figure 21 is another circuit block diagram of a radio frequency sub-module provided by an embodiment of the present application;

[0151] Figure 22 is a layout schematic diagram and a pin distribution schematic diagram of a radio frequency sub-module based on the circuit block diagram of Figure 21

[0152] Figure 23 is a layout schematic diagram and a pin distribution schematic diagram of a radio frequency sub-module based on the circuit block diagram of Figure 21

[0153] Figure 24 is a layout schematic diagram and a pin distribution schematic diagram of a radio frequency sub-module based on the circuit block diagram of Figure 21

[0154] Figure 25 is a flowchart of a determination method of a radio frequency front-end module provided by an embodiment of the present application;

[0155] Figure 26 is a layout schematic diagram of a first sub-module and a second sub-module in a radio frequency front-end module provided by an embodiment of the present application;

[0156] Figure 27 is a pin distribution diagram of a radio frequency sub-module in a radio frequency front-end module provided by an embodiment of the present application;

[0157] ​​​​​​​Figure 28 is another pin distribution diagram of a radio frequency sub-module in a radio frequency front-end module provided by an embodiment of the present application;

[0158] Figure 29 is another pin distribution diagram of a radio frequency sub-module in a radio frequency front-end module provided by an embodiment of the present application;

[0159] Figure 30 is another pin distribution diagram of a radio frequency sub-module in a radio frequency front-end module provided by an embodiment of the present application;

[0160] Figure 31 is another pin distribution diagram of a radio frequency sub-module in a radio frequency front-end module provided by an embodiment of the present application;

[0161] Figure 32 is another pin distribution diagram of a radio frequency sub-module in a radio frequency front-end module provided by an embodiment of the present application;

[0162] Figure 33 is a flow chart of a determination method of a radio frequency sub-module provided by an embodiment of the present application;

[0163] Figure 34 is a structural schematic diagram of a determination device of a radio frequency sub-module provided by an embodiment of the present application. DETAILED DESCRIPTION

[0164] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. In the description of the embodiments of the present application, unless otherwise specified, “ / ” represents or, for example, A / B can represent A or B; in this document, “and / or” only describes the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which means that there are three cases of A alone, A and B together, and B alone. In addition, in the description of the embodiments of the present application, “multiple” means two or more than two.

[0165] Hereinafter, the terms “first”, “second”, “third” are only used for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first”, “second”, “third” can explicitly or implicitly include one or more features.

[0166] The circuit board provided by the embodiments of the present application can be applied to a radio frequency front-end module, and the radio frequency front-end module can be applied to a terminal device such as a mobile phone, a tablet computer, a wearable device, a vehicle-mounted device, an augmented reality (AR) / virtual reality (VR) device, a notebook computer, an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (PDA), and the like. The embodiments of the present application do not limit the specific type of the terminal device.

[0167] Exemplarily, Figure 1 is a structural schematic diagram of a terminal device 100 provided by the embodiments of the present application. The terminal device 100 can include a processor 110, an external memory interface 120, an internal memory 121, a universal serial bus (USB) interface 130, a charging management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2, a mobile communication module 150, a wireless communication module 160, an audio module 170, a loudspeaker 170A, a receiver 170B, a microphone 170C, a headset interface 170D, a sensor module 180, a key 190, a motor 191, an indicator 192, a camera 193, a display screen 194, and a subscriber identification module (SIM) card interface 195, and the like. The sensor module 180 can include a pressure sensor 180A, a gyroscope sensor 180B, a barometric pressure sensor 180C, a magnetic sensor 180D, an acceleration sensor 180E, a distance sensor 180F, a proximity light sensor 180G, a fingerprint sensor 180H, a temperature sensor 180J, a touch sensor 180K, an ambient light sensor 180L, a bone conduction sensor 180M, and the like.

[0168] It can be understood that the structure illustrated by the embodiments of the present application does not constitute a specific limitation on the terminal device 100. In other embodiments of the present application, the terminal device 100 can include more or fewer components than those illustrated, or combine certain components, or split certain components, or different arrangement of components. The illustrated components can be implemented in hardware, software, or a combination of software and hardware.

[0169] The processor 110 can include one or more processing units, for example: the processor 110 can include an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a memory, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural-network processing unit (NPU), etc. Among them, different processing units can be independent devices, or can be integrated in one or more processors.

[0170] The controller can be the nerve center and command center of the terminal device 100. The controller can generate operation control signals according to instruction operation codes and timing signals, and complete the control of fetching instructions and executing instructions.

[0171] The memory in the processor 110 can also be configured to store instructions and data. In some embodiments, the memory in the processor 110 is a cache memory. The memory can save instructions or data that the processor 110 has just used or repeatedly uses. If the processor 110 needs to use the instructions or data again, it can directly call from the memory. Avoiding repeated access reduces the waiting time of the processor 110, thereby improving the efficiency of the system.

[0172] In some embodiments, the processor 110 can include one or more interfaces. The interface can include an inter-integrated circuit (I2C) interface, an inter-integrated circuit sound (I2S) interface, a pulse code modulation (PCM) interface, a universal asynchronous receiver / transmitter (UART) interface, a mobile industry processor interface (MIPI), a general-purpose input / output (GPIO) interface, a subscriber identity module (SIM) interface, and / or a universal serial bus (USB) interface, etc.

[0173] The I2C interface is a bidirectional synchronous serial bus, including a serial data line (SDA) and a serial clock line (SCL). In some embodiments, the processor 110 can contain multiple sets of I2C bus. The processor 110 can be coupled to the touch sensor 180K, the charger, the flash, the camera 193, etc. through different I2C bus interfaces respectively. For example, the processor 110 can be coupled to the touch sensor 180K through an I2C interface, so that the processor 110 and the touch sensor 180K communicate through the I2C bus interface, and the touch function of the terminal device 100 is realized.

[0174] The I2S interface can be used for audio communication. In some embodiments, the processor 110 can contain multiple sets of I2S bus. The processor 110 can be coupled to the audio module 170 through the I2S bus, and communication between the processor 110 and the audio module 170 is realized. In some embodiments, the audio module 170 can deliver audio signals to the wireless communication module 160 through the I2S interface, and the function of answering a phone through a Bluetooth headset is realized.

[0175] The PCM interface can also be used for audio communication, sampling, quantizing and encoding analog signals. In some embodiments, the audio module 170 and the wireless communication module 160 can be coupled through the PCM bus interface. In some embodiments, the audio module 170 can also deliver audio signals to the wireless communication module 160 through the PCM interface, and the function of answering a phone through a Bluetooth headset is realized. The I2S interface and the PCM interface can both be used for audio communication.

[0176] The UART interface is a universal serial data bus, which is used for asynchronous communication. The bus can be a bidirectional communication bus. It converts the data to be transmitted between serial communication and parallel communication. In some embodiments, the UART interface is usually used to connect the processor 110 and the wireless communication module 160. For example, the processor 110 communicates with the Bluetooth module in the wireless communication module 160 through the UART interface, and the Bluetooth function is realized. In some embodiments, the audio module 170 can deliver audio signals to the wireless communication module 160 through the UART interface, and the function of playing music through a Bluetooth headset is realized.

[0177] The MIPI interface can be used to connect the processor 110 and the display screen 194, the camera 193, and other peripheral devices. The MIPI interface includes a camera serial interface (CSI), a display serial interface (DSI), and the like. In some embodiments, the processor 110 and the camera 193 communicate through the CSI interface to implement the photographing function of the terminal device 100. The processor 110 and the display screen 194 communicate through the DSI interface to implement the display function of the terminal device 100.

[0178] The GPIO interface can be configured by software. The GPIO interface can be configured as a control signal or as a data signal. In some embodiments, the GPIO interface can be used to connect the processor 110 and the camera 193, the display screen 194, the wireless communication module 160, the audio module 170, the sensor module 180, and the like. The GPIO interface can also be configured as an I2C interface, an I2S interface, a UART interface, a MIPI interface, and the like.

[0179] The USB interface 130 is an interface that conforms to the USB standard specification, and can be a Mini USB interface, a Micro USB interface, a USB Type C interface, or the like. The USB interface 130 can be used to connect a charger to charge the terminal device 100, and can also be used to transmit data between the terminal device 100 and a peripheral device. The interface can also be used to connect a headset to play audio through the headset. The interface can also be used to connect other terminal devices, such as an AR device, and the like.

[0180] It can be understood that the interface connection relationship between the modules illustrated in the embodiments of the present application is only illustrative and does not constitute a structural limitation of the terminal device 100. In some other embodiments of the present application, the terminal device 100 can also use different interface connection methods or combinations of multiple interface connection methods as described in the above embodiments.

[0181] The charging management module 140 is used to receive charging input from a charger. The charger can be a wireless charger or a wired charger. In some wired charging embodiments, the charging management module 140 can receive charging input from a wired charger through the USB interface 130. In some wireless charging embodiments, the charging management module 140 can receive wireless charging input through a wireless charging coil of the terminal device 100. The charging management module 140 can charge the battery 142 while also providing power to the terminal device through the power management module 141.

[0182] The power management module 141 is configured to connect the battery 142 and the charging management module 140 to the processor 110. The power management module 141 receives input from the battery 142 and / or the charging management module 140 to power the processor 110, the internal memory 121, the external memory, the display 194, the camera 193, the wireless communication module 160, and the like. The power management module 141 can also be configured to monitor parameters such as the battery capacity, the number of battery cycles, the battery health status (leakage, impedance), and the like. In some other embodiments, the power management module 141 can also be disposed in the processor 110. In some other embodiments, the power management module 141 and the charging management module 140 can also be disposed in the same device.

[0183] The wireless communication function of the terminal device 100 can be implemented by the antenna 1, the antenna 2, the mobile communication module 150, the wireless communication module 160, the modem processor, and the baseband processor, and the like.

[0184] The antenna 1 and the antenna 2 are configured to transmit and receive electromagnetic wave signals. Figure 1 The structures of the antenna 1 and the antenna 2 in the terminal device 100 are only examples. Each antenna in the terminal device 100 can be configured to cover a single or multiple communication frequency bands. Different antennas can also be multiplexed to improve the utilization of the antennas. For example, the antenna 1 can be multiplexed as a diversity antenna of a wireless local area network. In some other embodiments, the antennas can be used in combination with a tuning switch.

[0185] The mobile communication module 150 can provide a solution for wireless communication including 2G / 3G / 4G / 5G and the like applied to the terminal device 100. The mobile communication module 150 can include at least one filter, a switch, a power amplifier, a low noise amplifier (LNA), and the like. The mobile communication module 150 can receive electromagnetic waves from the antenna 1, filter, amplify, and the like the received electromagnetic waves, and transmit the processed electromagnetic waves to the modem processor for demodulation. The mobile communication module 150 can also amplify signals modulated by the modem processor and radiate the signals as electromagnetic waves through the antenna 1. In some embodiments, at least part of the functional modules of the mobile communication module 150 can be disposed in the processor 110. In some embodiments, at least part of the functional modules of the mobile communication module 150 and at least part of the modules of the processor 110 can be disposed in the same device.

[0186] The modem processor can include a modulator and a demodulator. The modulator is configured to modulate a low frequency baseband signal to be transmitted into a medium-high frequency signal. The demodulator is configured to demodulate a received electromagnetic wave signal into a low frequency baseband signal. The demodulator then transmits the demodulated low frequency baseband signal to the baseband processor for processing. The low frequency baseband signal is processed by the baseband processor and then transmitted to the application processor. The application processor outputs a sound signal through an audio device (not limited to a speaker 170A, a microphone 170B, etc.), or displays an image or a video through the display 194. In some embodiments, the modem processor can be a separate device. In other embodiments, the modem processor can be independent of the processor 110 and can be disposed in the same device as the mobile communication module 150 or other functional modules.

[0187] The wireless communication module 160 can provide a wireless communication solution applied to the terminal device 100, including wireless local area networks (WLAN) (such as a wireless fidelity (Wi-Fi) network), Bluetooth (BT), a global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), infrared (IR) technology, and the like. The wireless communication module 160 can be one or more devices that integrate at least one communication processing module. The wireless communication module 160 receives electromagnetic waves via the antenna 2, performs frequency modulation and filtering processing on the electromagnetic wave signal, and transmits the processed signal to the processor 110. The wireless communication module 160 can also receive a signal to be transmitted from the processor 110, perform frequency modulation and amplification on the signal, and radiate the signal as an electromagnetic wave via the antenna 2.

[0188] In some embodiments, the antenna 1 and the mobile communication module 150 of the terminal device 100 are coupled, and the antenna 2 and the wireless communication module 160 are coupled, so that the terminal device 100 can communicate with a network and other devices through wireless communication technology. The wireless communication technology can include global system for mobile communications (GSM), general packet radio service (GPRS), code division multiple access (CDMA), wideband code division multiple access (WCDMA), time-division code division multiple access (TD-SCDMA), long term evolution (LTE), BT, GNSS, WLAN, NFC, FM, and / or IR technology, etc. The GNSS can include global positioning system (GPS), global navigation satellite system (GLONASS), beidou navigation satellite system (BDS), quasi-zenith satellite system (QZSS), and / or satellite based augmentation systems (SBAS).

[0189] The terminal device 100 implements a display function through a GPU, a display screen 194, and an application processor, etc. The GPU is a microprocessor for image processing, connected to the display screen 194 and the application processor. The GPU is used to perform mathematical and geometric calculations for graphics rendering. The processor 110 can include one or more GPUs that execute program instructions to generate or change display information.

[0190] The display screen 194 is configured to display images, videos, and the like. The display screen 194 includes a display panel. The display panel can be a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode (AMOLED), a flex light-emitting diode (FLED), a Miniled, a MicroLed, a Micro-oLed, a quantum dot light emitting diodes (QLED), or the like. In some embodiments, the terminal device 100 can include one or N display screens 194, where N is a positive integer greater than 1.

[0191] The terminal device 100 can implement the photographing function through the ISP, the camera 193, the video codec, the GPU, the display screen 194, and the application processor.

[0192] The ISP is configured to process the data fed back by the camera 193. For example, when taking a photo, the shutter is opened, the light is transmitted to the camera photosensitive element through the lens, the light signal is converted into an electrical signal, and the camera photosensitive element transmits the electrical signal to the ISP for processing to convert it into an image visible to the naked eye. The ISP can also optimize the noise, brightness, and skin color of the image. The ISP can also optimize the exposure, color temperature, and other parameters of the shooting scene. In some embodiments, the ISP can be disposed in the camera 193.

[0193] The camera 193 is configured to capture still images or videos. An object generates an optical image through a lens and projects it onto a photosensitive element. The photosensitive element can be a charge coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS) phototransistor. The photosensitive element converts the light signal into an electrical signal, which is then transmitted to the ISP to convert it into a digital image signal. The ISP outputs the digital image signal to the DSP for processing. The DSP converts the digital image signal into an image signal in a standard RGB, YUV, or the like format. In some embodiments, the terminal device 100 can include one or N cameras 193, where N is a positive integer greater than 1.

[0194] The digital signal processor is used to process digital signals, in addition to being able to process digital image signals, it can also process other digital signals. For example, when the terminal device 100 selects a frequency point, the digital signal processor is used to perform Fourier transform on the frequency point energy, etc.

[0195] The video codec is used to compress or decompress digital video. The terminal device 100 can support one or more video codecs. In this way, the terminal device 100 can play or record videos in multiple encoding formats, such as: moving picture experts group (MPEG) 1, MPEG 2, MPEG 3, MPEG 4, etc.

[0196] The NPU is a neural-network (NN) calculation processor, which can quickly process input information by drawing on the structure of a biological neural network, such as drawing on the transmission mode between human brain neurons, and can also continuously self-learn. Through the NPU, intelligent cognitive applications of the terminal device 100 can be realized, such as: image recognition, face recognition, voice recognition, text understanding, etc.

[0197] The external memory interface 120 can be used to connect an external memory card, such as a Micro SD card, to expand the storage capacity of the terminal device 100. The external memory card communicates with the processor 110 through the external memory interface 120 to realize data storage functions. For example, music, video, etc. Files are saved in the external memory card.

[0198] The internal memory 121 can be used to store computer executable program codes, which include instructions. The processor 110 executes various functional applications and data processing of the terminal device 100 by running the instructions stored in the internal memory 121. The internal memory 121 can include a program storage area and a data storage area. The program storage area can store an operating system, at least one application program required by a function (such as a sound playing function, an image playing function, etc.), etc. The data storage area can store data created during the use of the terminal device 100 (such as audio data, a phonebook, etc.), etc. In addition, the internal memory 121 can include a high-speed random access memory, and can also include a non-volatile memory, such as at least one magnetic disk storage device, a flash memory device, a universal flash storage (UFS), etc.

[0199] The terminal device 100 can realize audio functions through the audio module 170, the speaker 170A, the receiver 170B, the microphone 170C, the earphone interface 170D, and the application processor, etc. For example, music playing, recording, etc.

[0200] The audio module 170 is configured to convert digital audio information into an analog audio signal output, and to convert an analog audio input into a digital audio signal. The audio module 170 can also be configured to encode and decode audio signals. In some embodiments, the audio module 170 can be disposed in the processor 110, or some functional modules of the audio module 170 can be disposed in the processor 110.

[0201] The speaker 170A, also referred to as a “loudspeaker”, is configured to convert an audio electrical signal into a sound signal. The terminal device 100 can listen to music or listen to a hands-free call through the speaker 170A.

[0202] The receiver 170B, also referred to as a “earpiece”, is configured to convert an audio electrical signal into a sound signal. When the terminal device 100 answers a call or a voice message, the user can listen to the voice by holding the receiver 170B close to the ear.

[0203] The microphone 170C, also referred to as a “microphone”, “sound transducer”, is configured to convert a sound signal into an electrical signal. When making a call or sending a voice message, the user can speak into the microphone 170C by holding the mouth close to the microphone 170C, and input the sound signal into the microphone 170C. The terminal device 100 can be provided with at least one microphone 170C. In other embodiments, the terminal device 100 can be provided with two microphones 170C, in addition to collecting sound signals, the noise reduction function can also be realized. In other embodiments, the terminal device 100 can also be provided with three, four or more microphones 170C, in addition to collecting sound signals and noise reduction, the sound source can also be identified, and the directional recording function can also be realized.

[0204] The earphone interface 170D is configured to connect a wired earphone. The earphone interface 170D can be a USB interface 130, or a 3.5mm open mobile terminal platform (OMTP) standard interface, a cellular telecommunications industry association of the USA (CTIA) standard interface.

[0205] The pressure sensor 180A is configured to sense a pressure signal and convert the pressure signal into an electrical signal. In some embodiments, the pressure sensor 180A can be disposed on the display screen 194. The pressure sensor 180A can be of various types, such as a resistive pressure sensor, an inductive pressure sensor, a capacitive pressure sensor, etc. The capacitive pressure sensor can include at least two parallel plates of conductive material. When a force is applied to the pressure sensor 180A, the capacitance between the electrodes changes. The terminal device 100 determines the intensity of the pressure according to the change in capacitance. When a touch operation is applied to the display screen 194, the terminal device 100 detects the intensity of the touch operation according to the pressure sensor 180A. The terminal device 100 can also calculate the position of the touch according to the detection signal of the pressure sensor 180A. In some embodiments, touch operations applied to the same touch position but with different touch operation intensities can correspond to different operation instructions. For example, when a touch operation with a touch operation intensity less than a first pressure threshold is applied to a short message application icon, an instruction to view short messages is executed. When a touch operation with a touch operation intensity greater than or equal to the first pressure threshold is applied to the short message application icon, an instruction to create a new short message is executed.

[0206] The gyroscope sensor 180B can be configured to determine the motion attitude of the terminal device 100. In some embodiments, the angular velocity of the terminal device 100 around three axes (i.e., x, y, and z axes) can be determined by the gyroscope sensor 180B. The gyroscope sensor 180B can be used for anti-shake shooting. For example, when the shutter is pressed, the gyroscope sensor 180B detects the angle of shaking of the terminal device 100, calculates the distance that the lens module needs to compensate according to the angle, and lets the lens offset the shaking of the terminal device 100 by reverse movement to achieve anti-shake. The gyroscope sensor 180B can also be used for navigation and motion sensing game scenarios.

[0207] The barometric pressure sensor 180C is configured to measure air pressure. In some embodiments, the terminal device 100 calculates the altitude, assists positioning and navigation by using the air pressure value measured by the barometric pressure sensor 180C.

[0208] The magnetic sensor 180D includes a Hall sensor. The terminal device 100 can detect the opening and closing of a flip cover by using the magnetic sensor 180D. In some embodiments, when the terminal device 100 is a flip phone, the terminal device 100 can detect the opening and closing of the flip cover according to the magnetic sensor 180D. Then, according to the detected opening and closing state of the cover or the flip cover, the terminal device 100 can set a feature such as automatic unlocking of the flip cover.

[0209] The acceleration sensor 180E can detect the acceleration of the terminal device 100 in various directions (generally three axes). When the terminal device 100 is stationary, the acceleration sensor 180E can detect the magnitude and direction of gravity. The acceleration sensor 180E can also be used to identify the attitude of the terminal device, and can be applied to landscape / portrait screen switching and pedometer applications.

[0210] Distance sensor 180F is configured to measure distance. Terminal device 100 can measure distance by infrared or laser. In some embodiments, terminal device 100 can utilize distance sensor 180F to measure distance for fast focusing when taking a picture.

[0211] Proximity light sensor 180G can include, for example, a light emitting diode (LED) and a light detector, such as a photodiode. The light emitting diode can be an infrared light emitting diode. Terminal device 100 emits infrared light outwardly through the light emitting diode. Terminal device 100 detects infrared reflected light from nearby objects using the photodiode. When sufficient reflected light is detected, terminal device 100 can determine that there is an object near terminal device 100. When insufficient reflected light is detected, terminal device 100 can determine that there is no object near terminal device 100. Terminal device 100 can utilize proximity light sensor 180G to detect when a user is holding terminal device 100 close to the ear for a phone call, so as to automatically turn off the screen to save power. Proximity light sensor 180G can also be used for automatic unlocking and locking of the screen in a holster mode or a pocket mode.

[0212] Ambient light sensor 180L is configured to sense ambient light brightness. Terminal device 100 can adaptively adjust the brightness of display screen 194 according to the sensed ambient light brightness. Ambient light sensor 180L can also be used to automatically adjust white balance when taking a picture. Ambient light sensor 180L can also cooperate with proximity light sensor 180G to detect whether terminal device 100 is in a pocket to prevent accidental touch.

[0213] Fingerprint sensor 180H is configured to acquire a fingerprint. Terminal device 100 can utilize the acquired fingerprint characteristics to implement fingerprint unlocking, access application lock, take a picture with fingerprint, answer a call with fingerprint, and the like.

[0214] Temperature sensor 180J is configured to detect temperature. In some embodiments, terminal device 100 utilizes the temperature detected by temperature sensor 180J to implement temperature handling strategies. For example, when the temperature reported by temperature sensor 180J exceeds a threshold, terminal device 100 implements performance reduction of a processor located near temperature sensor 180J to reduce power consumption and implement thermal protection. In other embodiments, when the temperature is below another threshold, terminal device 100 heats battery 142 to avoid abnormal shutdown of terminal device 100 caused by low temperature. In yet other embodiments, when the temperature is below yet another threshold, terminal device 100 implements voltage boosting of the output voltage of battery 142 to avoid abnormal shutdown caused by low temperature.

[0215] Touch sensor 180K, also referred to as "touch panel". Touch sensor 180K can be disposed on display screen 194, and touch sensor 180K and display screen 194 together form a touch screen, also referred to as "touch panel". Touch sensor 180K is configured to detect touch operations applied to or near the touch sensor 180K. The touch sensor 180K can transmit the detected touch operation to the application processor to determine the touch event type. Visual output related to the touch operation can be provided through display screen 194. In other embodiments, touch sensor 180K can also be disposed on the surface of terminal device 100, which is different from the position of display screen 194.

[0216] Bone conduction sensor 180M can obtain vibration signals. In some embodiments, bone conduction sensor 180M can obtain vibration signals of the human body's vocal vibration bone block. Bone conduction sensor 180M can also contact the human body pulse to receive blood pressure pulsation signals. In some embodiments, bone conduction sensor 180M can also be disposed in a headset to form a bone conduction headset. Audio module 170 can analyze voice signals based on the vibration signals of the vocal vibration bone block obtained by the bone conduction sensor 180M to realize voice functions. The application processor can analyze heart rate information based on the blood pressure pulsation signals obtained by the bone conduction sensor 180M to realize heart rate detection functions.

[0217] Keys 190 include power on / off keys, volume keys, and the like. Keys 190 can be mechanical keys. They can also be touch keys. Terminal device 100 can receive key input and generate key signal input related to user settings and function control of terminal device 100.

[0218] Motor 191 can generate vibration prompts. Motor 191 can be used for incoming call vibration prompts and also for touch vibration feedback. For example, touch operations applied to different applications (such as taking pictures, playing audio, etc.) can correspond to different vibration feedback effects. Touch operations applied to different regions of display screen 194 can also correspond to different vibration feedback effects. Different application scenarios (such as time reminders, received messages, alarms, games, etc.) can also correspond to different vibration feedback effects. Touch vibration feedback effects can also be customizable.

[0219] Indicator 192 can be an indicator light, which can be used to indicate charging status, power changes, and also to indicate messages, missed calls, notifications, and the like.

[0220] The SIM card interface 195 is used to connect a SIM card. The SIM card can be inserted into or pulled out of the SIM card interface 195 to realize contact and separation with the terminal device 100. The terminal device 100 can support one or N SIM card interfaces, where N is a positive integer greater than 1. The SIM card interface 195 can support a Nano SIM card, a Micro SIM card, a SIM card, and the like. The same SIM card interface 195 can simultaneously insert multiple cards. The types of the multiple cards can be the same or different. The SIM card interface 195 can also be compatible with different types of SIM cards. The SIM card interface 195 can also be compatible with external storage cards. The terminal device 100 interacts with a network through the SIM card to realize functions such as call and data communication. In some embodiments, the terminal device 100 uses an eSIM, that is, an embedded SIM card. The eSIM card can be embedded in the terminal device 100 and cannot be separated from the terminal device 100.

[0221] Figure 2 For a structural block diagram of a wireless communication system of a terminal device, the terminal device can include a processor 210, a filter 220, a low noise amplifier (LNA) 230, a power amplifier (PA) 240, a switching switch 250, and an antenna circuit 260 including at least one antenna 261. The LNA 230, the PA 240, the filter 220, and the switch 250 can be collectively referred to as a radio frequency front-end module. Figure 2 The structure shown is only to indicate the position of the radio frequency front-end module in the wireless communication system, and each of the transmission path and the reception path in the radio frequency front-end module is one example, and the number of antennas in the antenna circuit is one example.

[0222] The processor 210 can be provided with a memory for storing instructions and data. In some embodiments, the memory in the processor 210 is a cache memory. The memory can save instructions or data that the processor 210 has just used or repeatedly uses. If the processor 210 needs to use the instructions or data again, it can be directly called from the memory. This avoids repeated access and reduces the waiting time of the processor 210, thereby improving the efficiency of the system. In some embodiments, the memory can also be provided outside the processor and coupled to the processor 210.

[0223] BB211 refers to a component used to synthesize a baseband signal to be transmitted, or / and to decode a received baseband signal. Specifically, when transmitting, the baseband encodes a voice or other data signal into a baseband signal (baseband code) to be transmitted; when receiving, the baseband decodes a received baseband signal (baseband code) into a voice or other data signal. BB211 can include an encoder, a decoder, a baseband processor, and the like. The encoder is used to synthesize a baseband signal to be transmitted, and the decoder is used to decode a received baseband signal. The baseband processor can be a microcontroller unit (MCU). The baseband processor can be used to control the encoder and the decoder. For example, the baseband processor can be used to complete scheduling of encoding and decoding, communication between the encoder and the decoder, peripheral driving (enabling a component outside the baseband by sending an enable signal to the component outside the baseband), and the like.

[0224] A radio frequency integrated circuit (RFIC) 212 is used to process a baseband signal to form a transmit (TX) signal, and to deliver the transmit signal to a power amplifier 240 for amplification; or / and, the radio frequency integrated circuit is used to process a receive (RX) signal to form a baseband signal, and to deliver the formed baseband signal to the BB211 for decoding.

[0225] The processor 210 can frequency-modulate a signal according to a mobile communication technology or a wireless communication technology. The mobile communication technology can include a global system for mobile communications (GSM), a general packet radio service (GPRS), a code division multiple access (CDMA), a wideband code division multiple access (WCDMA), a time-division code division multiple access (TD-SCDMA), a long term evolution (LTE), an emerging wireless communication technology (also referred to as a 5th generation mobile communication technology, English: 5th generation mobile networks or 5th generation wireless systems, 5th-Generation, 5th-Generation New Radio, 5G, 5G technology, or 5G NR), etc. The wireless communication technology can include a wireless local area network (WLAN) (such as a wireless fidelity (Wi-Fi) network), a bluetooth (BT), a global navigation satellite system (GNSS), a frequency modulation (FM), a near field communication (NFC), an infrared (IR) technology, etc.

[0226] The processor 210 can include at least one baseband 211 and at least one radio frequency integrated circuit 212. In some embodiments, each baseband 211 corresponds to one radio frequency integrated circuit to frequency modulate signals according to one or more communication technologies. For example, a first baseband and a first radio frequency integrated circuit frequency modulate signals according to a 5G technology, a second baseband and a second radio frequency integrated circuit frequency modulate signals according to a 4G technology, a third baseband and a third radio frequency integrated circuit frequency modulate signals according to a Wi-Fi technology, a fourth baseband and a fourth radio frequency integrated circuit frequency modulate signals according to a Bluetooth technology, and so on. Alternatively, a first baseband and a first radio frequency integrated circuit can frequency modulate signals according to both a 4G technology and a 5G technology, a second baseband and a second radio frequency integrated circuit frequency modulate signals according to a Wi-Fi technology, and so on. In some embodiments, one baseband can correspond to multiple radio frequency integrated circuits to improve integration.

[0227] In some embodiments, the baseband 211 and the radio frequency integrated circuit 212 can be integrated in one integrated circuit with other components of the processor 210. In some embodiments, the baseband 211 and the radio frequency integrated circuit 212 can be independent devices from the processor 210. In some embodiments, one baseband 211 and one radio frequency integrated circuit 212 can be integrated in a device independent from the processor 210. In some embodiments, the baseband 211 and the radio frequency integrated circuit 212 are integrated in different integrated circuits, and the baseband 211 and the radio frequency integrated circuit 212 are packaged together, for example, in a system on a chip (SOC).

[0228] In the processor 210, different processing units can be independent devices or integrated in one or more integrated circuits.

[0229] The antenna circuit 260 is used to transmit and receive electromagnetic wave signals (radio frequency signals). The antenna circuit 260 can include multiple antennas 261 or multiple groups of antennas (a group of antennas includes more than two antennas), each antenna 261 or group of antennas can be used to cover a single or multiple communication frequency bands. The multiple antennas can be one or more of a multi-frequency antenna, an array antenna, or an on-chip antenna.

[0230] The processor 210 is coupled to the antenna circuit 260 to implement various functions associated with transmitting and receiving radio frequency signals. For example, when the terminal device transmits a signal, the BB 211 synthesizes data (digital signal) to be transmitted into a baseband signal to be transmitted, the baseband signal is converted into a transmission signal (radio frequency signal) by the radio frequency integrated circuit 212, the transmission signal is amplified by the power amplifier 4240, the amplified output signal output by the power amplifier 240 is transmitted to the switch 250, and the transmission signal is transmitted through the antenna circuit 260. The path through which the transmission signal is sent from the processor 210 to the switch 250 is a transmission path (or a transmission path, a transmission link). When the terminal device needs to receive a signal, the antenna circuit 260 sends a received signal (radio frequency signal) to the switch 250, the switch 250 sends the radio frequency signal to the radio frequency integrated circuit 212, the radio frequency integrated circuit 212 processes the radio frequency signal into a baseband signal and sends it to the BB 211, the BB 211 converts the processed baseband signal into data and sends it to the corresponding application processor. The path through which the radio frequency signal is sent from the switch 250 to the processor 210 is a receiving path (or a receiving path, a receiving link). The port of the processor 210 coupled to the transmission path is a transmission port TX, and the port of the processor 210 coupled to the receiving path is a receiving port RX.

[0231] The switch 250 can be configured to selectively couple the antenna circuit 260 to the transmission path or the receiving path. In some embodiments, the switch 250 can include a plurality of switches. The switch 250 can also be configured to provide additional functions. The coupling involved in the embodiments of the present application can include a connection state of direct connection for signal transmission, or a connection state of indirect connection for signal transmission through space coupling.

[0232] In some other embodiments of the present application, the communication system of the terminal device can include more or fewer components than those shown, or combine some components, or split some components, or different arrangement of components. The components shown can be implemented in hardware, software, or a combination of software and hardware. Among them, each transmission path or each receiving path can be understood as a transmission path.

[0233] In addition, Figure 2The illustration only shows one antenna in the terminal device. In reality, terminal devices typically have at least two antennas, for example, four antennas. These four antennas can simultaneously receive downlink signals transmitted by the base station through different receiving paths. That is, four transmission paths can be established between the base station and the terminal device. When wireless communication is established between the terminal device and the base station, in order for the base station to control data transmission on different transmission paths and achieve more efficient downlink data transmission, it is necessary to obtain the channel state of each transmission path. This can be achieved by sending a sounding reference signal (SRS) to the base station through the antenna. In other words, the SRS is used to enable the base station to obtain the channel state of the transmission path corresponding to the antenna. On the other hand, if the terminal device has a small number of transmission paths, such as four antennas having only one or two transmission paths, then SRS round-robin transmission is required. This involves switching the transmission path to each antenna using a switch, so that each antenna takes turns sending an SRS once. Although only one or two antennas are transmitting at the same time, as long as all antennas have sent an SRS once, the base station can obtain the channel state of the transmission paths corresponding to the four antennas.

[0234] For ease of understanding, the following embodiments of this application will use the terminal devices mentioned above as examples, combined with the accompanying drawings and application scenarios, to specifically illustrate the circuit boards, circuit board layout methods, chips, terminal devices, and related products provided in the embodiments of this application. The terminal devices involved in the embodiments of this application may be, for example, smartphones, tablet computers, wearable devices, in-vehicle devices, etc.

[0235] In the transceiver system circuit of terminal equipment, the radio frequency front-end module is used to combine, split, and switch the transmission and reception signals of different frequency bands. Therefore, the rationality of the path compatibility of the radio frequency front-end module directly affects the product specifications. Figure 3 A circuit block diagram of an RF front-end module 300 applied in a practical circuit is shown. Figure 3 In this diagram, TX represents the transmit path, TRX represents the common transmit / receive path in the time-division band, PRX represents the main receive path, and DRX represents the diversity receive path. "T" stands for transmit, "R" for receive, and "X" indicates crossover; that is, the base station's RX receives the terminal device's TX, and the terminal device's RX receives the base station's TX. "B" represents the LTE or WCDMA band, for example, B1 represents LTE Band 1 or WCDMA Band 1, B7 represents LTE Band 7, and so on. When the main antenna 310 receives the received signal, it enters the RF front-end module 300. In the RF front-end module 300, the main antenna switch 320 switches to the corresponding receive path. If it is a frequency-division band, such as B1, B2, B3, B7, etc.Figure 3 B1 and B2 are taken as an example, when the terminal device uses B1 to communicate with the base station, the main set antenna switch 320 switches the received signal to the path of B1 TRX, and after the main set received signal of B1 is input into the RFIC 212 via the duplexer 330 for amplification, filtering or frequency conversion, etc., the signal is input into the BB 211 for demodulation. If the current received signal is a time-division frequency band, such as B39, the received signal of B39 is switched to the corresponding main set receiving path B39 PRX of B39 by the main set antenna switch 320, and after filtering by the filter 360 corresponding to the frequency band, it enters the RFIC 212. When the RFIC 212 receives the transmission signal output by the BB 211, the transmission signal is processed by frequency conversion, amplification or filtering, etc., and output to the corresponding transmission path via the pin corresponding to the frequency band of the transmission signal, and enters the power amplifier module 370 for power amplification. If it is a frequency-division frequency band, such as B1, the amplified transmission signal is switched to the common path of the main set via the B1 TX path in the RF front-end module, the duplexer 330 and the main set antenna switch 320, and radiated via the main set antenna 310. If it is a frequency-division frequency band, such as B39, the amplified transmission signal is switched to the common path of the main set via the filter 360 and the main set antenna switch 320 and radiated via the main set antenna 310. When the diversity antenna 380 receives a received signal, the received signal is switched to a frequency band corresponding diversity receiving path by the diversity antenna switch 390, for example, when the terminal device uses B1 to communicate with the base station, the diversity received signal is switched to the B1 D RX path as shown in Figure 3 shown in the figure and enters the corresponding pin of the RFIC 212, and then is sent to the BB 211 for demodulation. If the terminal device uses B39 to communicate with the base station, the diversity received signal is switched to the B39 DRX path and enters the corresponding pin of the RFIC 212. At the same time, the RFIC 212, the BB 211 or the processor 210 can also output control signals through the control lines to realize the control of the main set antenna switch 310 or the diversity antenna switch 390 to switch different paths. In addition, the RFIC 212, the BB 211 or the processor 210 can also output control signals to the amplification module 370 and other components through the control lines to realize the control of the gain level of the amplification module. In addition, Figure 3 the type and number of frequency bands shown in the figure are only one example, and in some embodiments, based on Figure 3 more transmission paths and multiple receiving paths can be included according to product specifications, and multiple transmission paths or multiple receiving paths can be combined or split by a switch module, such as a main set antenna switch, a diversity antenna switch or a duplexer, etc. The RF path can include a transmission path and a receiving path of a radio frequency signal,Figure 3 The circuit structure shown does not limit the application scenarios of the radio frequency front-end module in the embodiments of the present application.

[0236] With the increasing update of mobile communication technology, the transmission scenario of big data is also more and more widely used, and people's demand for data transmission efficiency and data transmission volume is also higher and higher. The frequency resource of mobile communication is particularly precious. In the networking of LTE, the multiple input multiple output (MIMO) technology can greatly improve the channel capacity and improve the data throughput. The antenna form applied to MIMO is that the transmitting end and the receiving end both use multiple antennas to form an antenna system with multiple transmission paths between the transmitting and receiving devices. For example, Figure 4 As shown, Figure 4 In the embodiments, the antennas of the transmitting end taking the base station as an example and the antennas of the receiving end taking the terminal device as an example are all 4, the base station transmits through the transmitting antenna 1, the transmitting antenna 2, the transmitting antenna 3 and the transmitting antenna 4, and the terminal device receives signals through the receiving antenna 1, the receiving antenna 2, the receiving antenna 3 and the receiving antenna 4. Of course, in the same terminal device, the antennas for receiving and transmitting are shared, and signals of different frequency bands can be received through multiple antennas at the same time, and signals can also be transmitted through multiple antennas at the same time.

[0237] In order to adapt to the popularization and promotion of 5G network, integrated circuit technology also develops rapidly, and the integration of radio frequency components is higher and higher. For example, the radio frequency front-end module can include PA, LNA, filter (duplexer) and antenna switch, etc. For different versions corresponding to different product specifications, researchers need to select different radio frequency front-end modules for design. Usually, in different radio frequency front-end modules, the selected crystal grains and the layout of the circuit are different, which makes the design scheme of the circuit board used in different specifications of radio frequency front-end modules different. For example, in the NR frequency band of 5G technology, two frequency bands of N77 and N79 are often involved. Some high-end machines need to support the specifications of 2T4R (i.e. two transmitters and four receivers) of N77 and N79, some need to support 2T4R of N77 and 1T4R (i.e. one transmitter and four receivers) of N79, some need to support 1T4R of N77 and 1T4R of N79, and some low-end machines only need to support N77 without supporting the frequency band of N79. In the traditional design process, different radio frequency front-end modules need to be designed to adapt to the product demand for different specifications of terminal devices. Different radio frequency front-end modules need to be laid out and designed according to their respective specification requirements. If multiple specifications need to be supported, up to multiple different circuit boards need to be designed to cover the specification requirements. This will result in a large number of types of circuit boards of radio frequency front-end modules, increasing the design complexity and thus increasing the design cost.

[0238] The embodiment of the present application provides a radio frequency front end module design scheme, through analyzing similarities and differences between radio frequency front end modules of different specifications, common circuits in the radio frequency front end modules of different specifications are split to obtain a first sub-module; then, specific circuits in each specification except the common circuits are compared, and a most complete one (usually, the one with the most radio frequency components) in the specific circuits corresponding to the specifications is taken as a second sub-module, and the radio frequency front end module with the most complete specifications (that is, the one with the most radio frequency components) is obtained by combining the first sub-module and the second sub-module. The above common circuits refer to radio frequency components included in the common circuits, and the different specific circuits can refer to different radio frequency components included in the specific circuits. On the basis of the radio frequency front end module with the most complete specifications, other radio frequency front end modules of other specifications can be obtained by deleting corresponding components in the second sub-module. Deleting corresponding components in the second sub-module does not need to change the design scheme of the circuit board of the second sub-module, and only needs to reduce the surface-mounted components, so that the second sub-module corresponding to different specifications can be realized. The method can flexibly adapt to different versions of specification requirements without changing the circuit board of the second sub-module, realizes the compatibility of the circuit board of multiple specifications, thereby reducing the design complexity of the circuit board and even the radio frequency front end module, and reducing the design cost. Moreover, since the circuit board can be compatible with multiple specification requirements, the wiring of the same circuit board is the same, and there is no need to repeatedly debug for different specifications, so that the debugging time of the developer can be reduced, and the debugging efficiency is improved.

[0239] On this basis, the components involved in the common circuits and the specific circuits of the most complete specifications can be balanced and adjusted for multiple specifications, that is, part of the circuits is adjusted and increased between the common circuits and the specific circuits of the most complete specifications, so that the circuits of the first sub-module corresponding to the common circuits and the second sub-module corresponding to the specific circuits of the most complete specifications are the same or close, then the pins are reasonably set, so that the pins of the first sub-module and different second sub-modules are compatible, thereby realizing that multiple sub-modules can adopt a unified circuit board. The first sub-module and the second sub-module can also be referred to as radio frequency sub-modules.

[0240] That is, the radio frequency front-end module involved in the embodiments of the present application can be composed of the same or different multiple radio frequency sub-modules. Through reasonable layout and pin design, the different radio frequency sub-modules can realize the compatibility of the pins of different radio frequency sub-modules, so that different radio frequency sub-modules can realize functions by using the same circuit board. When different radio frequency sub-modules are needed, only different components need to be attached to the same circuit board to realize their respective functions. Then, the same or different multiple radio frequency sub-modules are combined to support different specifications of terminal devices. The radio frequency sub-modules realized by using the same compatible circuit board do not need to be designed for different specifications, which greatly reduces the design complexity and design cost of the circuit board. At the same time, since the types of circuit boards are reduced, the types of inventory in the production stage are also reduced, which can reduce the overall number of circuit board inventory and reduce the cost of inventory. The radio frequency sub-modules realized by using the same compatible circuit board can be seamlessly replaced in different radio frequency sub-modules, so there is no need to reserve additional components or wiring. The wiring of the same circuit board is the same, and there is no need to repeat debugging for different specifications, which can reduce the debugging time of developers and improve the debugging efficiency.

[0241] Generally, the radio frequency front-end module needs to support multiple frequency bands. Here, the combination of different specifications supporting N77 and N79 is exemplarily described. In actual use, the N77 and N79 frequency bands can be replaced by other two frequency bands, and the components on the corresponding paths can be replaced by components of other frequency bands to realize the corresponding functions. Some versions of terminal devices need to support N77 2T4R and N79 2T4R specifications, some versions need to support N77 2T4R and N79 1T4R, some versions need to support N77 1T4R and N79 1T4R, and some versions only need to support N77 without supporting N79 frequency bands.

[0242] Taking the multiple specifications involved in Table 1 as an example, the first specification with the most complete specifications is 2T4R supporting N77 and N79 dual frequency. The remaining specifications are all based on the reduction of the first specification. The reduction of the specifications includes the reduction of the transmit path and / or the reduction of the receive path, based on which, the 2T4R specification of the N77 frequency band can be taken as the maximum design specification of the sub-module, and the sub-module supporting the 2T4R specification of the N77 frequency band is denoted as radio frequency sub-module A.

[0243] Table 1

[0244]

[0245] When 2T4R of N77 and N79 dual frequency needs to be supported, the radio frequency front end module can be combined by two radio frequency sub-modules A. In order to facilitate description, the two radio frequency sub-modules A are respectively referred to as a first radio frequency sub-module A and a second radio frequency sub-module A. It should be noted that the antenna pins in the radio frequency sub-module A can be three, two of which can be used to connect two antennas, and the third antenna pin is used to connect the antenna pin of another radio frequency sub-module A in the radio frequency front end module, realizing the SRS rotation of four antennas.

[0246] The second specification is 2T4R of N77 and 1T4R of N79. On the basis of the radio frequency front end module corresponding to the first specification, the second radio frequency sub-module A can be reduced, the components and the corresponding power matching network on the transmission path of N79 are reduced, and the transmission input pin of N79 is suspended. The second radio frequency sub-module A after reduction can be used as a new radio frequency sub-module B, and by combining one radio frequency sub-module A and one radio frequency sub-module B, a radio frequency front end module supporting the second specification is obtained.

[0247] In various embodiments of the present application, the pin suspension mentioned means that the pin is not connected to other devices in the radio frequency sub-module.

[0248] The third specification is 1T4R of N77 and N79 dual frequency. On the basis of the radio frequency front end module corresponding to the second specification, the radio frequency sub-module B can be further reduced, the components and the corresponding power matching network on the transmission path of N77 are reduced, and the transmission input pin of N77 is suspended. The radio frequency sub-module B after reduction can be used as a new radio frequency sub-module D, and by combining one radio frequency sub-module A and one radio frequency sub-module D, a radio frequency front end module supporting the third specification is obtained. Alternatively, the description here is only to reflect the difference between the radio frequency sub-module D and the radio frequency sub-module B. The radio frequency sub-module D can also be based on the second radio frequency sub-module A, and the components and the corresponding power matching network on the transmission path of N77 and N79 are reduced, and the transmission input pin of N77 and N79 is suspended.

[0249] The fourth specification is 1T4R supporting N77. Based on the RF front-end module corresponding to the third specification mentioned above, the components and corresponding impedance matching networks on the transmit and receive paths of N79 in the first RF sub-module A can be removed, and the first RF sub-module A can be used as a new RF sub-module C; the components and corresponding impedance matching networks on the receive path of N79 in RF sub-module D can be removed, and RF sub-module D can be used as a new RF sub-module E. By combining an RF sub-module C and an RF sub-module E, an RF front-end module supporting the fourth specification is obtained. Optionally, the description here is only to show the difference between RF sub-module D and RF sub-module E. The RF sub-module E can also be obtained by removing the components and corresponding power matching networks on the transmit paths of N77 and N79, and the components and corresponding impedance matching networks on the receive path of N79 from the second RF sub-module A. The RF sub-module E can also be obtained by removing the components and corresponding power matching network on the transmit path of N77, and the components and corresponding impedance matching network on the receive path of N79, based on the RF sub-module B.

[0250] The previous section introduced how different RF sub-modules can be combined to support different specifications. The following section describes in detail the specific circuit structure and pin distribution of each RF sub-module.

[0251] Figure 5 The circuit block diagram is for RF sub-module A, which supports 2T4R for N77 and 2T4R for N79, that is, it supports two-way transmission and four-way reception for the N77 and N79 frequency bands.

[0252] like Figure 5 As shown, RF sub-module A includes one N77 transmit path, one N79 transmit path, two N77 receive paths, and two N79 receive paths. Specifically, it includes: the PA of N77, the PA of N79, the power matching network corresponding to the PA of N77, the power matching network corresponding to the PA of N79, the transmit filter and the corresponding impedance matching network of N77, the transmit filter and the corresponding impedance matching network of N79, an antenna switch, the two receive filters and the corresponding impedance matching networks of N77, the two receive filters and the corresponding impedance matching networks of N79, the two LNAs of N77, the two LNAs of N79, and a multiplexer (MUX) switch.

[0253] Figure 5 The components in the RFIC can be implemented using chips. For example, the power amplifier (PA) can be implemented using a PA chip, the filter can be implemented using a filter chip, the switch can be implemented using a switch chip, and the low-frequency amplifier (LNA) can be implemented using an LNA chip. The PA is used to amplify the transmitted signal output from the RFIC. Figure 5The PA of N77 and the PA of N79 in the N77 and the N79 can be used to amplify the transmitting signals of the N77 and the N79 respectively, and the PA die of the N77 and the PA die of the N79 can be realized by one PA die or two PA dies. Optionally, the PA die can be a die using a III-V compound semiconductor process or a die using a silicon-based CMOS semiconductor process, and the application does not limit the type of process used by the PA die as long as it can amplify the transmitting signals. Each PA will be provided with a corresponding power matching network for adjusting the output impedance (i.e. loadpull) of the PA, so that the PA can work in a matched state to ensure the transmitting performance of the PA. The power matching network can be composed of IPD, such as a T-shaped, π-shaped or L-shaped matching network formed by parallel or series connection of inductors and capacitors. The capacitors and inductors can be lumped parameter devices, such as surface-mounted capacitors and inductors, or distributed parameter devices, such as inductive or capacitive wiring units formed by wiring or winding on a substrate, and the application does not limit this as long as it can realize the function of impedance matching.

[0254] Figure 5The transmit filter in the above-mentioned transmitting circuit can be implemented by a transmit filter die. The transmit filter scheme can be implemented on one filter die, i.e., implemented by one diplexer die; or implemented on two filter dies, i.e., one filter die for N77 and one filter die for N79. When implemented by one diplexer, the diplexer has one common port, and from the common port to the port corresponding to N77, the impedance for the signal of the N77 band is close to 50 ohms, which can select the signal of the N77 band; and for the signal of the N79 band, it is in a high impedance state, and the impedance is far away from 50 ohms on the Smith chart, which can be located at the middle position of the right side of the impedance chart. From the common port to the port corresponding to N79, the impedance for the signal of the N79 band is close to 50 ohms, which can select the signal of the N79 band; and for the signal of the N77 band, it is in a high impedance state, and the impedance is far away from 50 ohms on the Smith chart, which can be located at the middle position of the right side of the impedance chart. Optionally, the input port and the input port of the above-mentioned transmit filter can also be provided with an impedance matching network to adjust the impedance of the port, realize impedance matching, and thus adjust the performance of the circuit. Optionally, the above-mentioned transmit filter can be an acoustic filter (surface acoustic wave filter SAW or bulk acoustic wave filter BAW), can also be a low temperature co-fired ceramic (LTCC) filter, and can also be a filter implemented by other processes. The impedance matching network of the transmit filter can be composed of passive integrated devices, such as T-shaped, π-shaped or L-shaped matching networks formed by parallel or series connection of inductors, capacitors and other components. The capacitors and inductors can be lumped parameter components, such as surface-mounted capacitors and inductors, or can be distributed parameter components, such as inductive or capacitive wiring units formed by wiring or winding on a substrate, and the present application does not limit this.

[0255] Figure 5The receiving filter in the transceiver can be implemented by a receiving filter die. The receiving filter can be implemented on one filter die, i.e., by one diplexer die, or on two filter dies, i.e., one filter die for N77 and one filter die for N79. When implemented by one diplexer, the diplexer has one common port. From the common port to the port corresponding to N77, the impedance for the signal of the N77 band is close to 50 ohms, which can select the signal of the N77 band. For the signal of the N79 band, the impedance is far from 50 ohms on the Smith chart, which can be located at the middle of the right side of the impedance chart. From the common port to the port corresponding to N79, the impedance for the signal of the N79 band is close to 50 ohms, which can select the signal of the N79 band. For the signal of the N77 band, the impedance is far from 50 ohms on the Smith chart, which can be located at the middle of the right side of the impedance chart. Optionally, the input port and the input port of the transmitting filter can be provided with an impedance matching network to adjust the impedance of the port, achieve impedance matching, and thus adjust the performance of the circuit. Optionally, the receiving filter can be an acoustic filter, an LTCC filter, or a filter implemented by other processes. The impedance matching network of the receiving filter can be composed of passive integrated devices, such as T-shaped, π-shaped, or L-shaped matching networks formed by parallel or series connection of inductors and capacitors. The capacitors and inductors can be lumped parameter devices, such as surface-mounted capacitors and inductors, or distributed parameter devices, such as inductive or capacitive wiring units formed by wiring or winding on a substrate. The application does not limit the capacitors and inductors as long as they can achieve impedance matching.

[0256] Optionally, the transmitting filter and the receiving filter can be different filters. For example, the transmitting filter can be an acoustic filter, which has high out-of-band rejection and high power tolerance, and is suitable for filtering high-power transmitting signals. Optionally, the transmitting filter can be implemented by multiple resonators in series or parallel connection, and the first resonator directly connected to the PA in the transmitting filter can be adjusted to adapt to the PA, so as to adjust the output impedance of the PA and improve the transmitting capability of the PA as much as possible. The receiving filter can also be implemented by multiple resonators in series or parallel connection. The receiving filter can be an electromagnetic coupling filter or an acoustic coupling filter, such as an acoustic filter or an LTCC filter. Since the received signal usually has low power, a filter with low insertion loss (referred to as insertion loss) can be selected, and high out-of-band rejection is not required, for example, a passive integrated device filter, i.e., a filter composed of lumped parameter capacitors and inductors.

[0257] The coupler is used to couple the transmit signal of the input antenna switch to realize the power detection function. Optionally, the coupler can be an element using a silicon-based CMOS semiconductor process, an LTCC element, or an element of other processes. The coupler can be a passive integrated device or a wire with coupling capability formed by substrate wiring or winding, and the present application does not limit this. As long as it can realize the function of signal coupling, it can be used in the present application. In some embodiments, the coupler can also not be provided in the radio frequency sub-module, for example, the coupler is separately provided, and the switch of the coupler is not shared with the antenna switch, and then Figure 5 In the embodiment, the corresponding path in the coupler and the antenna switch is deleted, and details are not repeated here. Figure 5 In the embodiment, the radio frequency sub-module is compatible with the coupler, and the switch of the antenna switch compatible with the coupler is taken as an example. Compared with separately providing the coupler and the switch, the integration of the radio frequency sub-module can be improved, the layout area is reduced, and the layout and wiring are facilitated.

[0258] The antenna switch can be implemented by an antenna switch die, as shown in Figure 5 The antenna switch includes a single-pole three-throw switch (path is ), which is used to realize multi-antenna rotation of the transmit path; a single-pole double-throw switch (path is ), which is used to realize multi-antenna rotation of the external PA through the antenna switch; and two single-pole single-throw switches (path is ), which are used to realize downlink carrier aggregation of N77 and N79. The process of the antenna switch die can be but is not limited to an element using a silicon-based CMOS semiconductor process.

[0259] The LNA can be implemented by an LNA die, which can include two independent N77-band LANs, two independent N79-band LANs, and a multi-pole multi-throw switch, Figure 5 which is exemplified by a four-pole four-throw switch. The low-noise amplifier can be but is not limited to an element using a silicon-based CMOS semiconductor process.

[0260] Optionally, the antenna switch and the LNA can also be implemented on the same die to facilitate common layout and compatibility.

[0261] The controller can be implemented by a controller die, which is used to output a control signal to adjust the bias voltage or current of the PA, control the switching of the antenna switch, the frequency band and gear of the LNA, and the like. The controller die can be but is not limited to an element using a silicon-based CMOS semiconductor process.

[0262] The aforementioned RF sub-module A has two transmit channels and four receive channels, and its functions include: transmit and receive functions in the N77 band and the N79 band; transmit signals from N77 are transmitted in rotation via SRS on antennas ANT1, ANT2, and ANT3, and transmit signals from N79 are transmitted in rotation via SRS on antennas ANT1, ANT2, and ANT3; external transmit signals are transmitted in rotation via SRS on ANT1 and ANT2; uplink carrier aggregation of N77 and N79; simultaneous main and diversity reception of N77 (i.e., 2×2 MIMO reception); simultaneous main and diversity reception of N79 (i.e., 2×2 MIMO reception); downlink carrier aggregation of N77 and N79, supporting 2x2 MIMO reception; and transmit power control for N77 and N79. It should be noted that in this embodiment, pin ANT1 represents pin ANT1 for N77 and pin ANT1 for N77 / N79 in this application, pin AN2 represents pin ANT2 for N77 and pin ANT2 for N77 / N79 in this application, and pin ANT3 represents pin AN3 for N77 and pin ANT3 for N77 / N79 in this application.

[0263] In the layout and pin design scheme of the circuit board of the above-mentioned RF sub-module A, the pins related to the transmit path and the pins related to the receive path are designed in separate areas. When it is not necessary to support the transmit RF band, only the distribution of the pins related to the receive path can be used without readjusting the pin design scheme, thus achieving compatibility with multiple specifications.

[0264] Figure 6 Based on Figure 5 The circuit block diagram shown illustrates the layout scheme and pin distribution method implemented. Figure 5 The RF sub-module A shown is arranged on a common circuit board, which includes a first side and a second side. The first side and the second side are the two sides with the largest area on the common circuit board. The first side can be the front side of the RF sub-module, and the second side can be the back side of the RF sub-module. Typically, the front side of the chip is used to arrange components, and the back side is used to arrange pins; in some cases, components can also be arranged on the back side, while pins are usually not arranged on the front side. A layout diagram of the front side can be shown as follows. Figure 6As shown in (a) of FIG. 1, the back of the common circuit board includes a first functional area and a second functional area. The first functional area and the second functional area are sequentially arranged along the length direction of the common circuit board and do not intersect. The first functional area includes a controller arrangement area, a PA arrangement area, and a power matching network arrangement area. The controller arrangement area is used to arrange a controller, for example, a controller die, which is used to output a control signal to control the gain level of the PA to achieve transmit power control. The PA arrangement area is used to arrange a PA, for example, two PA dies of N77 and N79. Optionally, the PA dies can be arranged along an edge of the common circuit board or adjacent to an edge. The PA dies are used to amplify the transmit signal output by the RFIC. The power matching network arrangement area is used to arrange a power matching network. The power matching network is arranged at the output end of the corresponding PA. Each PA die can be provided with a power matching network, which is used to adjust the output impedance of the PA to adjust the performance of the PA. The second functional area can be a filter and impedance matching network arrangement area, which is used to arrange a filter and an impedance matching network. For example, filter dies or duplexer dies of N77 and N79 can be arranged. The filter can include a transmit filter and a receive filter. Each filter die can be connected to a corresponding impedance matching network. The impedance matching network is used to adjust the impedance of the channel to improve the performance of the channel.

[0265] As shown in (a) of FIG. 1, the back of the common circuit board includes a first functional area and a second functional area. The first functional area and the second functional area are sequentially arranged along the length direction of the common circuit board and do not intersect. The first functional area includes a controller arrangement area, a PA arrangement area, and a power matching network arrangement area. The controller arrangement area is used to arrange a controller, for example, a controller die, which is used to output a control signal to control the gain level of the PA to achieve transmit power control. The PA arrangement area is used to arrange a PA, for example, two PA dies of N77 and N79. Optionally, the PA dies can be arranged along an edge of the common circuit board or adjacent to an edge. The PA dies are used to amplify the transmit signal output by the RFIC. The power matching network arrangement area is used to arrange a power matching network. The power matching network is arranged at the output end of the corresponding PA. Each PA die can be provided with a power matching network, which is used to adjust the output impedance of the PA to adjust the performance of the PA. The second functional area can be a filter and impedance matching network arrangement area, which is used to arrange a filter and an impedance matching network. For example, filter dies or duplexer dies of N77 and N79 can be arranged. The filter can include a transmit filter and a receive filter. Each filter die can be connected to a corresponding impedance matching network. The impedance matching network is used to adjust the impedance of the channel to improve the performance of the channel. Figure 6 As shown in (b) of FIG. 1, the back of the common circuit board includes a third functional area. The third functional area can be arranged opposite to the second functional area, that is, the third functional area and the second functional area overlap partially or completely on the projection of the front of the common circuit board. The third functional area can also be arranged separately from the second functional area, that is, the third functional area and the second functional area overlap partially or completely on the projection of the front of the common circuit board. The third functional area includes an antenna switch arrangement area and a low noise amplifier arrangement area, which are used to arrange an antenna switch, for example, an antenna switch die, and a low noise amplifier, for example, two low noise amplifiers of N77 and two low noise amplifiers of N79. The back can also be provided with a first pin area, a second pin area, a third pin area, a fourth pin area, a fifth pin area, a sixth pin area, and a seventh pin area. The seven pin areas are used to arrange functional pins. The functional pins referred to in the embodiments of the present application are all the pins of the non-ground pins in the radio frequency sub-module, which are used to connect peripheral devices, for example, transmit input pins, receive output pins, and pins for related control signals. Figure 6In (b) of FIG. 1, in order to clearly show the distribution of different pin areas, the division of each pin area is shown by the name of the corresponding pin. In fact, the division of the pin area is performed according to the position of the pin corresponding to the shown pin name. The first pin area includes a transmit input pin, which is used to input a transmit signal, for example, a transmit input pin N77 TX IN of N77 and a transmit input pin N79 TX IN of N79; the second pin area includes a power input pin (for example, VCC), which is used to input a power voltage; the third pin area includes a coupling input pin (for example, pin CPL IN) and a coupling output pin (for example, pin CPL OUT), which are used to input and output a coupling signal; the fourth pin area includes an antenna pin (for example, SRS IN, ANT1 for N77 / N79, ANT2 for N77 / N79, ANT3 for N77 / N79), which is used to directly or indirectly connect an antenna; the fifth pin area includes a receive control pin, which is used to input a control signal of a receive signal, for example, including SDATA RX, SCLK RX, VIO RX and VDD LNA; the sixth pin area includes a receive output pin, for example, a receive output pin N77 / N79 RX1, N77 / N79 RX2, N77 / N79 RX3 and N77 / N79 RX4 of N77 and N79, which is used to output a receive signal; and the seventh pin area includes a transmit control pin, which is used to input a control signal of a transmit signal, for example, including SDATA TX, SCLK TX, VIO TX and Vbatt. The above-mentioned seven pin areas can be distributed along the four edges of the back surface or adjacent to the four edges. Optionally, the back surface is further provided with a plurality of ground pins for connecting a reference ground. It should be noted that the ground pins can be distributed between other functional pins, or a plurality of ground pins can be arranged in an area without other functional pins to ensure electromagnetic compatibility. Figure 6 Pin1 in (a) and (b) of FIG. 1 is the same pin. Figure 6 The black pin in (b) of FIG. 1 is a ground pin, and the pin with diagonal lines is a functional pin.

[0266] The back surface of the common circuit board further includes a first ground pin area, the first ground pin area and the third functional area are not intersected, and the first ground pin area and the third functional area can be adjacent or not adjacent. A plurality of ground pins can be distributed in the first ground pin area for grounding, or some suspended pins can be distributed, and the distribution mode and number of the ground pins and the suspended pins in the first ground pin area are not limited in the embodiments of the present application, and the principle of ensuring electromagnetic compatibility of the radio frequency sub-module is ensured; the first ground pin area can further distribute a whole piece of metal for connecting a reference ground, and a large-area ground can facilitate heat dissipation.

[0267] It should be noted that in the embodiments of the present application, the ground pins in the region where the continuous ground pins are arranged can be replaced by the suspended pins or no pins are arranged, or a whole piece of metal can be arranged in the region of the continuous ground pins for linking the reference ground, and the embodiments of the present application do not limit this, as long as the electromagnetic compatibility of the radio frequency sub-module can be ensured.

[0268] Optionally, the packaging form of the radio frequency sub-module A is a double side ball grid assembly (Double Side Ball Grid Assembly). In a possible implementation manner, the radio frequency sub-module A can be implemented in a size of 5 mm in length and 2.75 mm in width, wherein the interval between the pins is 0.375 mm.

[0269] In the above Figure 6 , the position distribution of the components in the radio frequency sub-module A can be seen from Figure 7 . Figure 7 (a) of FIG. in the above

[0270] Figure 7 (b) of FIG. in the above

[0271] In the above Figure 6 and Figure 7 , the power input pin VCC in the second pin region and the transmission input pins N77 TX_IN and N79 TX_IN are arranged on two mutually perpendicular edges of the common circuit board. Optionally, the power input pin VCC can also be arranged with the transmission input pins N77 TX_IN and N79 TX_IN on the same edge of the common circuit board, and the ground pin can be used to separate them to avoid interference.

[0272] In some implementations, the functional pins in the same pin area in the above-mentioned radio frequency sub-module A can also be exchanged with each other. For example, the positions of the two transmit input pins in the first pin area can be exchanged, for example, the transmit input pin of N77 and the transmit input pin of N79 are exchanged, and the PA die of N77 and the PA die of N79 on them are also exchanged accordingly, and the corresponding power matching network is also exchanged. The coupling input pin CPL_IN and the coupling output pin CPL_OUT in the third pin area can also be exchanged. The SRS_IN, ANT1 for N77 / N79, ANT2 for N77 / N79, and ANT3 for N77 / N79 in the fourth pin area can also be exchanged. The SDATA_RX, SCLK_RX, VIO_RX, and VDD_LNA in the fifth pin area can also be exchanged. The N77 / N79 RX1, N77 / N79 RX2, N77 / N79 RX3, and N77 / N79 RX4 in the sixth pin area can also be exchanged. The SDATA_TX, SCLK_TX, VIO_TX, and Vbatt in the seventh pin area can also be exchanged. Figure 8 The distribution mode of different pins in the same pin area after exchange is shown in (b) of FIG. 1. There can be multiple implementation modes for the scheme of exchanging the positions of more than two pins. The embodiment does not limit the exchange mode of the pins in the same pin area. In some implementations, after the positions of the pins are exchanged, the positions of the corresponding connected components can also be adjusted, which will not be described here.

[0273] In some implementations, the arrangement areas of different pin areas can also be adjusted. The principle of adjustment is that the pin areas related to the transmit path are concentrated on one side of the common circuit board, and the pin areas related to the receive path are concentrated on the other side of the common circuit board. Please refer to the description in the following embodiments.

[0274] Figure 9 (b) of FIG. 1 is a layout and pin distribution diagram of the back of the common circuit board after the different pin areas are adjusted along the length direction. The layout of the components is also adjusted. The distribution mode of the components can refer to the layout diagram of the front shown in (a) of FIG. 1. Optionally, Figure 7 (b) of FIG. 1, the positions of the pins in each pin area can also be exchanged within the pin area, and the positions of the corresponding components can also be adjusted, which will not be described here. Figure 9 Figure 9 (b) of FIG. 1, the positions of the pins in each pin area can also be exchanged within the pin area, and the positions of the corresponding components can also be adjusted, which will not be described here.

[0275] Figure 10 (b) of FIG. 1 is a layout and pin distribution diagram of the back of the common circuit board after the different pin areas are adjusted along the length direction. The layout of the components is also adjusted. The distribution mode of the components can refer to the layout diagram of the front shown in (a) of FIG. 1. Optionally, Figure 7 ​Based on the diagram shown, this is a schematic of the layout and pin distribution on the back of the common circuit board after mirroring and adjusting the different pin areas along the width of the module. The component layout is also adjusted accordingly; the component distribution can be found in [reference needed]. Figure 10 The front layout diagram is shown in (a) of the diagram. Optionally, Figure 10 In Figure (b), the pin positions within each pin area can also be interchanged within the same pin area, and the positions of the corresponding components can be adjusted accordingly, which will not be elaborated here.

[0276] Figure 11 Figure (b) is based on Figure 7 Based on the diagram shown, the layout and pin distribution on the back of the common circuit board are shown after swapping the positions of the first and third pin areas, and the fourth and fifth pin areas. The component layout is also adjusted accordingly; please refer to [reference needed]. Figure 11 The front layout diagram is shown in (a) of the diagram. Optionally, Figure 11 In Figure (b), the pin positions within each pin area can be interchanged within that pin area, and the positions of the corresponding components can be adjusted accordingly; this will not be elaborated further here. Optionally, it can also be... Figure 7 Based on the previous embodiment, the positions of the first and third pin areas are interchanged, while the fourth and fifth pin areas are not interchanged; or the first and third pin areas are not interchanged, while the positions of the fourth and fifth pin areas are interchanged. The layout of the components on the front and back is also adjusted accordingly.

[0277] Figure 12 Figure (b) is based on Figure 7 Based on the diagram shown, the pinouts are shown after swapping the positions of the first and seventh pin areas, and the fifth and sixth pin areas. When the first and seventh pin areas are swapped, Vbatt can also be moved from the wide side to the long side. The component layout is also adjusted accordingly; please refer to [reference needed]. Figure 12 The front layout diagram shown in (a) is shown in the figure. Figure 12 Figure (b) shows a schematic diagram of the pin distribution on the back side.

[0278] It should be noted that the component layout in this embodiment is only illustrative. The actual placement and orientation of the components can be adaptively adjusted according to the signal flow and electromagnetic compatibility considerations. Furthermore, the relative positions of the functional pins and ground pins are also illustrative and do not impose any limitations on the absolute positions of the functional pins.

[0279] Generally, the functional pins in the seven pin areas can be distributed along the four edges of the common circuit board. Alternatively, in some cases, the functional pins can also be distributed in the middle area of the common circuit board, and the periphery of the common circuit board can be provided with ground pins or other pins. For example, based on the arrangement shown in Figure 7 One or more of the functional pins can be moved inward by one or more rows of the common circuit board as long as no conflict occurs and electromagnetic compatibility is ensured. Figure 7 The number of pins shown is an example, and can be increased or decreased by one row, one column, multiple rows, or multiple columns as needed. The functional pins and the adjacent ground pins in the same pin area can also be interchanged, and the embodiments of the present application do not limit this. That is, the first pin area, the second pin area, the third pin area, and the seventh pin area are distributed in the transmission pin area on the back of the common circuit board, the fourth pin area, the fifth pin area, and the sixth pin area are distributed in the receiving pin area on the back of the common circuit board, and the transmission pin area and the receiving pin area do not intersect each other, for example, as shown in (b) of Figure 12 .

[0280] In some implementations, the interchanging of different pin areas can also not be adjusted in the form of an entire pin area, but can be interchanged between the functional pins in two different pin areas, as long as the functional pins in the transmission pin area are interchanged or the functional pins in the receiving pin area are interchanged. For example, the functional pins in the first pin area, the second pin area, the third pin area, and the seventh pin area are interchanged, and the functional pins in the fourth pin area, the fifth pin area, and the sixth pin area are interchanged.

[0281] When the radio frequency sub-module does not contain a coupler, for example, the coupler is separately arranged and a separate switch of the coupler is used without sharing the antenna switch, in the pin distribution diagrams shown in all embodiments of the present application, in the embodiments in which the third pin area exists, the coupling input pin (for example, pin CPL IN) and the coupling output pin (for example, pin CPL OUT) in the third pin area can be deleted. The coupling input pin and the coupling output pin in the third pin area can be suspended or arranged with the functional pins in the first pin area, the second pin area, and the seventh pin area, which is not limited here.

[0282] When the terminal device needs to support the specifications of 2T4R of N77 and 1T4R of N79, the circuit of one of the radio frequency sub-modules A can be simplified to obtain a radio frequency sub-module B, and the circuit diagram of the radio frequency sub-module B can be referred to Figure 13 . Then, one radio frequency sub-module A and one radio frequency sub-module B are combined to support the specifications of 2T4R of N77 and 1T4R of N79. Compared with the radio frequency sub-module A, the radio frequency sub-module B, that is, Figure 13 compared with Figure 5, reduces the transmitting path of N79, i.e. reduces the PA of N79, the power matching network of the PA of N79 and the transmitting filter of N79. Of course, if the transmitting filter of N79 (i.e. the filter unit of N79 in the duplexer) cannot be deleted alone when N77 and N79 share the same duplexer for transmitting signal filtering, the PA of N79 and the power matching network of the PA of N79 can be reduced. Figure 13 The detailed description of each component in the circuit block diagram shown in Figure 5 will not be repeated here.

[0283] It should be noted that when reducing the transmitting filter or receiving filter of one frequency band on the path in each embodiment of the present application, if the transmitting filter or receiving filter is shared with another frequency band using the same duplexer, the filter or filter unit of one frequency band cannot be deleted alone, the shared duplexer can be retained, and the components on the path to be deleted and not shared with other frequency bands can be reduced.

[0284] Figure 14 (a) and (b) in FIG. are layout schematic diagrams and pin distribution diagrams realized based on the circuit block diagram shown in Figure 13 . The radio frequency sub-module B can use the same public circuit board as the radio frequency sub-module A to realize the function of the compatible radio frequency sub-module B. In some embodiments, the implementation of the layout and pin distribution of the radio frequency sub-module B can also refer to the implementation of the layout and pin distribution of the radio frequency sub-module A in Figure 8 , Figure 9 , Figure 10 , Figure 11 and Figure 12 and other embodiments, accordingly, only the components related to the transmitting path of N79 are not pasted, and the N79 transmitting input pin N79 TX_IN is left hanging (NC), which will not be repeated here. Figure 14 (a) and (b) in FIG. are layout schematic diagrams and pin distribution diagrams of the radio frequency sub-module B realized based on the public circuit board used by the radio frequency sub-module A shown in Figure 7 .

[0285] The radio frequency sub-module B described above supports one-way transmission and four-way reception, and can realize functions including: transmitting function and receiving function of N77 frequency band, receiving function of N79 frequency band; SRS round-robin of N77 transmitting signal on antennas ANT1, ANT2 and ANT3; SRS round-robin of external transmitting signal on ANT1 and ANT2; N77 main set and diversity simultaneous reception, i.e. 2x2 MIMO reception; N79 main set and diversity simultaneous reception, i.e. 2x2 MIMO reception; N77+N79 downlink carrier aggregation, simultaneously supporting 2x2 MIMO reception; N77 transmitting power control.

[0286] When the terminal device needs to support the specifications of 1T4R of N77 and 2T4R of N79, the above-mentioned Figure 13 and Figure 14 ways can be used to implement the common circuit board of the radio frequency sub-module A, and only the corresponding components of the transmission path of N77 need to be reduced, and the corresponding transmission input pins of N77 are left unused, which will not be described here again. The pin left unused in the embodiments of the present application means that the pin is not connected to other components due to the default of the components on the signal path in the radio frequency sub-module.

[0287] When the terminal device needs to support the specifications of 1T4R of N77 and does not need to support the specifications of N79, the circuit of the radio frequency sub-module A can be simplified, and the transmission path and the receiving path of N79 are deleted to obtain the radio frequency sub-module C. The circuit block diagram of the radio frequency sub-module C can be seen from Figure 15 . The radio frequency sub-module C can support the specifications of 1T2R, and in combination with a radio frequency sub-module supporting the specifications of 2R of N77, the specifications of 1T4R of N77 can be most simply implemented. Compared with the radio frequency sub-module A, the radio frequency sub-module C also Figure 15 compared with Figure 5 , reduces the transmission path of N79 and the receiving path of N79, that is, reduces the PA of N79, the power matching network of the PA of N79, the transmission filter of N79, the low-noise amplifier of N79, the receiving filter of N79 and the corresponding impedance matching network, and the MUX switch. Figure 15 The detailed description of each component in the circuit block diagram shown in Figure 5 can be seen from the description of the corresponding components in , which will not be described here again.

[0288] Figure 16 The (a) and (b) in Figure 15 are layout schematic diagrams and pin distribution diagrams implemented based on the circuit block diagram shown in. The radio frequency sub-module C can use the same common circuit board as the radio frequency sub-module A to implement the function of the radio frequency sub-module C. It should be noted that the pin RX1 in the embodiments of the present application represents the pin N77 / N79 RX1 and the pin N77 RX1 in the present application, the pin RX2 represents the pin N77 / N79 RX2 and the pin N77 RX2 in the present application, the pin RX3 represents the pin N77 / N79 RX3 and the pin N77 RX3 in the present application, and the pin RX4 represents the pin N77 / N79 RX4 and the pin N77 RX4 in the present application. In some embodiments, the implementation manner of the layout and the pin distribution of the radio frequency sub-module C can also be seen from Figure 8 , Figure 9 , Figure 10 , Figure 11 andFigure 12 The embodiments of the layout and pin distribution of the radio frequency sub-module A and other radio frequency sub-modules, correspondingly, only need to leave the components on the transmitting path of N79 and the receiving path of N79, and leave the transmitting input pin N79 TX IN and the receiving output pin (two of N77 RX1, N77 RX2, N77 RX3, and N77 RX4) of N79 suspended. Figure 16 The embodiments of suspending the two pins N77 RX2 and N77 RX4 are shown, and actually any two of the four receiving output pins can be suspended, which is not described here. Among them, the two receiving output pins that are retained for use, for example, N77 RX1 and N77 RX3, can be the pins corresponding to the main set receiving signal (PRX) and the diversity receiving signal (DRX) of N77, respectively.

[0289] The radio frequency sub-module C described above supports one-way transmission and two-way reception, and can realize functions including: the transmission function and the receiving function of the N77 frequency band; the SRS rotation of the transmission signal of N77 at the antennas ANT1, ANT2, and ANT3; the SRS rotation of the external transmission signal at ANT1 and ANT2; the simultaneous reception of the main set and the diversity of N77, that is, 2x2 MIMO reception; the transmission power control of N77.

[0290] The (a) figure and the (b) figure in the above Figure 16 are the layout schematic diagram and the pin distribution diagram of the radio frequency sub-module C in the form of double-sided packaging. Since the radio frequency sub-module C simplifies the transceiving function of the N79 frequency band, the number of components is reduced, and the layout space on the front of the common circuit board is relatively loose, the form of single-sided packaging can be adopted, and the low-noise amplifier and the antenna switch originally located on the back are arranged on the front, and the positions of the functional pins still inherit the distribution mode of the previous functional pins and are not adjusted, so that the compatibility of the design of the common circuit board can be realized. For details, see the (a) figure and the (b) figure in the above Figure 17 , the low-noise amplifier, the antenna switch, and the impedance matching network are all distributed on the front, and the pins are distributed in the originally empty area on the back. The form of single-sided packaging can simplify the production process and reduce the manufacturing cost.

[0291] In some embodiments, the implementation of the single-sided packaging of the radio frequency sub-module C can also be based on the above Figure 8 , Figure 9 , Figure 10 , Figure 11 and Figure 12The embodiments of the radio frequency sub-module A and other layout and pin distribution manners of the radio frequency sub-module A are implemented, only the components of the transceiving path of N79 of the radio frequency sub-module A are deleted, then the low-noise amplifier, the filter and the corresponding impedance matching network originally located on the back are arranged on the second functional area of the front of the common circuit board, without changing the distribution of the functional pins, the implementation manner of the single-face packaging of the radio frequency sub-module C is compatible.

[0292] When the terminal device needs to support the 1T4R specification of N79 without supporting the transceiving function of N77, the implementation manner of the terminal device can be referred to the implementation manner of the terminal device in the above Figure 16 and Figure 17 and the related embodiments, the compatible common circuit board can still be used, only the components of the transmitting path and the receiving path of N77 are correspondingly reduced, and the transmitting input pin and the receiving output pin of N77 are suspended, which will not be described herein.

[0293] When the terminal device needs to support the 1T4R specification of N77 and the 1T4R specification of N79, the circuit of one radio frequency sub-module A can be simplified to obtain a radio frequency sub-module D, the circuit block diagram of the radio frequency sub-module D can be referred to the circuit block diagram shown in Figure 18 . Then one radio frequency sub-module A and one radio frequency sub-module D are combined to support the corresponding specification. Compared with the radio frequency sub-module A, Figure 18 compared with Figure 5 , the transmitting paths of N77 and N79 are reduced, that is, the PA, the power matching network of the PA and the transmitting filter of N77 and N79 are reduced. Figure 18 The detailed description of each component in the circuit block diagram shown in Figure 5 can be referred to the description of the corresponding components in , which will not be described herein.

[0294] Figure 19 Figure 17 The (a) and (b) of the above table are layout schematic diagrams and pin distribution diagrams implemented based on the circuit block diagram shown in Figure 8 . The radio frequency sub-module D can be implemented compatible with the function of the radio frequency sub-module D using the same common circuit board as the radio frequency sub-module A. In some embodiments, the implementation manner of the layout and the pin distribution of the radio frequency sub-module D can also be referred to the embodiments of the radio frequency sub-module A and other layout and pin distribution manners of the radio frequency sub-module A, and correspondingly, only the related components of the transmitting paths of N77 and N79 are not pasted, and the transmitting input pins of N77 and N79 are suspended, which will not be described herein. Figure 9 Figure 10 Figure 11 Figure 12 Figure 19 Figure 7 ​​​​​The layout and pinout diagrams of RF sub-module A shown are illustrated below to demonstrate the layout and pinout diagrams of RF sub-module D when they are compatible with RF sub-module A. RF sub-module D still uses the corresponding functional pinout distribution method of RF sub-module A, therefore a common circuit board can be used, eliminating the need for separate design, simplifying the circuit board design, shortening the design time, and saving design costs.

[0295] In some embodiments, RF sub-module D can also adopt the layout and pin distribution scheme of RF sub-module A, while cutting off a portion of the common circuit board. Since there are no distributed components or functional pins on either the front or back side of the side where pin 1 is located in Figures (a) and (b) of 19, the layout diagram and pin distribution diagram shown in Figures (a) and (b) of 19 can be replaced with... Figure 20 The implementation is shown in Figures (a) and (b). Figure 20 In the implementation shown, the design of the common circuit board remains unchanged; only the unnecessary portion needs to be cut off. While maintaining the design compatibility of the common circuit board, its area is reduced compared to... Figure 19 This can reduce the size by about half, lowering costs and making it easier to deploy throughout the terminal device.

[0296] The aforementioned RF sub-module D supports 4-channel reception and can perform the following functions: reception of N77 and N79 bands; external transmitted signals in SRS rotation on ANT1 and ANT2; simultaneous reception of N77 main and diversity signals, and simultaneous reception of N79 main and diversity signals, i.e., 2×2 MIMO reception.

[0297] When a terminal device needs to support the N77 1T4R specification, the circuitry of one of the RF sub-modules A can be simplified to obtain RF sub-module E, or RF sub-module E can be obtained by simplifying the RF sub-module D described above. The circuit block diagram of RF sub-module E can be found in [reference needed]. Figure 21 As shown. Then, an RF sub-module C and an RF sub-module E are combined to support the corresponding specifications. Compared to RF sub-module A, RF sub-module E reduces the number of components in the N79 transceiver path and also reduces the number of components in the N77 transmit path. Compared to RF sub-module D, RF sub-module E... Figure 21 compared to Figure 18 This reduces the number of receiving paths for the N79, which in turn reduces the number of low-noise amplifiers, receiving filters, and corresponding impedance matching networks required for the N79. Figure 21 Detailed descriptions of the components in the circuit block diagram shown can be found in [reference needed]. Figure 5 The descriptions of the corresponding components are not repeated here.

[0298] Figure 22Figures (a) and (b) are based on Figure 21 The circuit block diagram shown illustrates the layout and pinout. This RF sub-module E can use the same common circuit board as RF sub-module A to achieve compatibility with the functionality of RF sub-module E. In some embodiments, the implementation of the layout and pinout of RF sub-module E can also be found in [reference needed]. Figure 8 , Figure 9 , Figure 10 , Figure 11 and Figure 12 In the embodiments and other layouts and pin distributions of the RF sub-module A, it is only necessary to omit the components of the transmit path of N77 and N79 and the receive path of N79, and leave the transmit input pin of N77 and N79 and the receive output pin of N79 floating. This will not be elaborated further here. Figure 22 Based on Figure 7 The layout and pinout diagrams of RF sub-module A shown are used to implement the layout and pinout diagrams of RF sub-module E when they are compatible. RF sub-module E still uses the corresponding functional pinouts of RF sub-module A, so a common circuit board can be used, eliminating the need for a separate circuit board design, simplifying the circuit board design, shortening the design time, and saving design costs.

[0299] In some embodiments, the RF sub-module E can also adopt the layout and pin distribution scheme of the RF sub-module A, while cutting off a portion of the common circuit board. Since there are no components or functional pins distributed on the front and back sides of the side where pin 1 is located in Figures (a) and (b) of 22, the layout diagram and pin distribution diagram shown in Figures (a) and (b) of 22 can be replaced with... Figure 23 As shown in Figures (a) and (b). Figure 23 In the implementation shown, the design of the common circuit board remains unchanged; only the unnecessary portion needs to be cut off. While maintaining the design compatibility of the common circuit board, its area is reduced compared to... Figure 22 In terms of implementation, it can reduce the size by about half, lower the cost, and facilitate deployment throughout the terminal device.

[0300] The above Figure 22 , Figure 23 The figure shows the layout and pinout of the RF sub-module E, which uses a double-sided package. Because RF sub-module E simplifies the transceiver functions of the N79 band and the transmit functions of the N77 band, the number of components is reduced. Therefore, a single-sided package can be used, placing the N77 band low-noise amplifier and antenna switch, originally located on the back, on the front. The positions of the functional pins remain unchanged, thus ensuring compatibility with common circuit boards. See [link to details] for further information.Figure 24 As shown in Figures (a) and (b), Figure 24 The diagram shows the layout and pinout of a single-sided packaged RF sub-module E. The low-noise amplifier, antenna switch, and impedance matching network are all located on the front, leaving the rear area for grounding pins. Using a single-sided package simplifies the manufacturing process and reduces production costs.

[0301] In some embodiments, the single-sided packaging of the RF sub-module E can also be implemented based on the above. Figure 8 , Figure 9 , Figure 10 , Figure 11 and Figure 12 The implementation can be achieved using the same method as other RF sub-modules A, by simply removing the transceiver components of N77 and N79 in RF sub-module A, and then arranging the low-noise amplifier, filter and corresponding impedance matching network originally located on the back side in the second functional area on the front side of the common circuit board. Without changing the distribution of the functional pins, it can be compatible with the single-sided package implementation of RF sub-module E.

[0302] The above Figures 21-24 The diagram shows the N77 RX2 and N77 RX4 pins left floating. In reality, any two of the four receive output pins can also be left floating, but this will not be elaborated further. N77 RX1 and N77 RX3 can be the pins corresponding to the main receive signal (PRX) and diversity receive signal (DRX) of the N77, respectively.

[0303] The aforementioned RF sub-module E supports two-channel reception and can perform the following functions: reception of the N77 band; external N77 band transmission signals are transmitted in SRS rotation on ANT1 and ANT2; simultaneous reception of N77 main and diversity signals, i.e., 2×2 MIMO reception.

[0304] When a terminal device needs to support the N79 1T4R specification but does not need to support the N77 transceiver function, the above can be referred to. Figure 21 , Figure 22 and Figure 23 The implementation can still be achieved using a compatible common circuit board. It only requires reducing the components in the transmit and receive paths of the N77 and leaving the corresponding transmit input pin and receive output pin of the N77 floating. This will not be elaborated further here.

[0305] In some implementations, the functional pin positions in the same pin area on the common circuit board shared by the above-mentioned radio frequency sub-modules A, B, C, D and E can be adjusted mutually, and the arrangement areas of different pin areas can also be adjusted mutually. The principle of adjustment between pin areas is that the pin areas related to the transmission path are distributed in the transmission pin area of the common circuit board, and the pin areas related to the receiving path are distributed in the receiving pin area of the common circuit board, and the transmission pin area and the receiving pin area do not intersect each other. The first, second, third and seventh pin areas can be exchanged mutually as a whole pin area, and the fourth, fifth and sixth pin areas can be adjusted mutually as a whole pin area, and the layout of the corresponding components can be adjusted according to the adjustment of the functional pins. Optionally, the exchange mode of different pin areas can also be adjusted without being a whole pin area, that is, the functional pins in two different pin areas can be exchanged and adjusted, the functional pins in the first, second, third and seventh pin areas can be exchanged and adjusted across the pin areas, and the functional pins in the fourth, fifth and sixth pin areas can be exchanged and adjusted across the pin areas. Optionally, the suspended pins (NC) can also be exchanged and adjusted with the functional pins and ground pins in the same pin area, and the embodiments of the present application do not limit this.

[0306] In summary, the combination modes of different radio frequency sub-modules can be referred to Table 2, and each combination corresponds to support a specification.

[0307] Table 2

[0308]

[0309] In Table 1, if 2T4R of N77 and N79 dual frequency needs to be supported, two radio frequency sub-modules A are selected to realize; if 2T4R of N77 and 1T4R of N79 needs to be supported, one radio frequency sub-module A and one radio frequency sub-module B are selected to realize; if 1T4R of N77 and N79 dual frequency needs to be supported, one radio frequency sub-module A and one radio frequency sub-module D are selected to realize; if 1T4R of N77 needs to be supported, one radio frequency sub-module C and one radio frequency sub-module E are selected to realize.

[0310] The above-mentioned radio frequency sub-modules A, B, C, D and E realized by the same common circuit board with compatibility can be seamlessly replaced in different radio frequency sub-modules, so there is no need to reserve additional components or wires, the wires of the same common circuit board are the same, and there is no need to repeat debugging for different specifications, which can reduce the debugging time of developers and improve the debugging efficiency.

[0311] The embodiment of the present application further provides a layout method of a radio frequency front end module group. The method can refer to Figure 25 as shown in the figure, comprising:

[0312] S2501, dividing the to-be-arranged area into a first area and a second area. The first area and the second area are not intersected with each other.

[0313] Optionally, the to-be-arranged area can be a rectangular area, used for arranging a radio frequency sub-module. The rectangular to-be-arranged area can be divided into the first area and the second area arranged in sequence along the length direction. For example Figure 26 as shown in the figure.

[0314] S2502, obtaining a to-be-implemented specification. The to-be-implemented specification is used for representing the type and quantity of radio frequency paths required to be supported by the radio frequency front end module group.

[0315] For example, the to-be-implemented specification is 2T4R of dual frequency of N77 and N79, which indicates that two paths of the transmitting path of N77, two paths of the transmitting path of N79, four paths of the receiving path of N77 and four paths of the receiving path of N79 are required to be included.

[0316] Optionally, the to-be-implemented specification can include 2T4R of dual frequency of N77 and N79, 2T4R of N77 and 1T4R of N79, 1T4R of dual frequency of N77 and N79 and 1T4R of N77.

[0317] S2503, querying a preset correspondence table according to the to-be-implemented specification to obtain a first sub-module and a second sub-module corresponding to the to-be-implemented specification.

[0318] The first sub-module and the second sub-module are radio frequency sub-modules, for example, can be the radio frequency sub-module A, the radio frequency sub-module B, the radio frequency sub-module C, the radio frequency sub-module D or the radio frequency sub-module E. The first sub-module and the second sub-module can be the same radio frequency sub-module or different radio frequency sub-modules.

[0319] Optionally, the preset correspondence table can refer to the example of Table 2. By querying the preset correspondence table, the category and combination of the radio frequency sub-modules corresponding to different specifications can be obtained.

[0320] When the to-be-implemented specification is 2T4R of dual frequency of N77 and N79, it can be obtained through querying the preset correspondence table that the first sub-module and the second sub-module are both the radio frequency sub-module A; when the to-be-implemented specification is 2T4R of N77 and 1T4R of N79, it can be obtained through querying the preset correspondence table that the first sub-module is the radio frequency sub-module A and the second sub-module is the radio frequency sub-module B; when the to-be-implemented specification is 1T4R of dual frequency of N77 and N79, it can be obtained through querying the preset correspondence table that the first sub-module is the radio frequency sub-module A and the second sub-module is the radio frequency sub-module D; when the to-be-implemented specification is 1T4R of N77, it can be obtained through querying the preset correspondence table that the first sub-module is the radio frequency sub-module C and the second sub-module is the radio frequency sub-module E.

[0321] S2504, arrange the first sub-module in the first region, and arrange the second sub-module in the second region.

[0322] In the embodiment, the preset correspondence table is queried to obtain the combination of the radio frequency sub-modules matched with the current to-be-implemented specification, and then the radio frequency sub-modules in the combination of the radio frequency sub-modules are arranged in the to-be-arranged region in sequence to realize the transceiving function of the radio frequency front-end module. The method can flexibly select different radio frequency sub-modules and combine them according to the specification requirement to realize different functions, avoids the complex operation of respectively laying out different radio frequency front-end modules for each specification, can reduce the complexity of laying out the radio frequency front-end module, simplifies the process of designing and laying out the radio frequency front-end module, shortens the design and layout time, and thus improves the efficiency.

[0323] In some embodiments, the specification needs to support 2T4R of dual frequency of N77 and N79, that is, the specification needs to support N77 frequency band uplink double flow, downlink four flow, N79 frequency band uplink double flow, and downlink four flow, two radio frequency sub-modules A can be selected and arranged in the first region and the second region. Other specifications can be obtained by replacing the modules based on this specification. In the embodiment of the application, the uplink means transmission, the downlink means reception, and the flow represents a channel, that is, the uplink double flow represents two transmission channels, and the downlink four flow represents four reception channels.

[0324] When the specification needs to be compatible with 2T4R of N77 and 1T4R of N79, that is, the specification needs to support N77 frequency band uplink double flow, downlink four flow, N79 frequency band uplink single flow, and downlink four flow, one of the two radio frequency sub-modules A can be replaced by the radio frequency sub-module B. For details, see Figure 27 illustrated in Figure 27 .

[0325] When the specification needs to support 1T4R of dual frequency of N77 and N79, that is, to support N77 frequency band uplink single stream and downlink four streams, N79 frequency band uplink single stream and downlink four streams, one of the two radio frequency submodules A can be replaced by radio frequency submodule D. For details, see Figure 28 , Figure 28 which is illustrated by replacing the radio frequency submodule A in the second area with radio frequency submodule D. And Figure 28 The radio frequency submodule D in Figure 28 The radio frequency submodule D in Figure 19 may also adopt the structure before being trimmed, for example

[0326] When the specification needs to support 1T4R of N77, that is, to support N77 frequency band uplink single stream and downlink four streams, one of the two radio frequency submodules A can be replaced by radio frequency submodule C, and the other can be replaced by radio frequency submodule E. For details, see Figure 29 , Figure 29 which is illustrated by replacing the radio frequency submodule A in the first area with radio frequency submodule C and replacing the radio frequency submodule A in the second area with radio frequency submodule D. And Figure 29 The radio frequency submodule C and the radio frequency submodule E in Figure 29 The radio frequency submodule E in Figure 29 may also adopt the structure before being trimmed, for example Figure 23 .

[0327] On the basis of the above Figure 27 embodiments, that is, originally supporting N77 frequency band uplink double stream and downlink four stream, N79 frequency band uplink single stream and downlink four stream specification, radio frequency submodule A is arranged in the first area, and radio frequency submodule B is arranged in the second area. On this basis, when it is needed to support N77 frequency band uplink single stream and downlink four stream, N79 frequency band uplink single stream and downlink four stream specification, see Figure 30 which is illustrated by replacing the radio frequency submodule B in the second area with radio frequency submodule D. Figure 30 The radio frequency submodule D in Figure 30 may also adopt the structure before being trimmed, for example Figure 19 .

[0328] On the basis of the above-mentioned Figure 27 embodiments, that is, originally supporting N77 frequency band uplink double flow, downlink four flow, N79 frequency band uplink single flow, downlink four flow specifications, the radio frequency sub-module A is arranged in the first area, and the radio frequency sub-module B is arranged in the second area. On this basis, when the N77 frequency band uplink single flow, downlink four flow specifications need to be implemented, the radio frequency sub-module A in the first area can be replaced with the radio frequency sub-module C, and the radio frequency sub-module B in the second area can be replaced with the radio frequency sub-module D, as shown in Figure 31 . The radio frequency sub-module C and the radio frequency sub-module E in Figure 31 are examples of double-sided packaging, and in some embodiments, single-sided packaging radio frequency sub-modules C and / or radio frequency sub-modules E can also be used. Figure 31 The radio frequency sub-module E in Figure 31 is a structure with useless areas cut off, and in some embodiments, Figure 23 the radio frequency sub-module E can also use a structure before cutting, such as the structure shown in .

[0329] On the basis of the above-mentioned Figure 30 embodiments, that is, originally supporting N77 frequency band uplink single flow, downlink four flow, N79 frequency band uplink single flow, downlink four flow specifications, the radio frequency sub-module A is arranged in the first area, and the radio frequency sub-module D is arranged in the second area. On this basis, when the N77 frequency band uplink single flow, downlink four flow specifications need to be implemented, the radio frequency sub-module A in the first area can be replaced with the radio frequency sub-module C, and the radio frequency sub-module D in the second area can be replaced with the radio frequency sub-module E, as shown in Figure 32 . The radio frequency sub-module C and the radio frequency sub-module E in Figure 32 are examples of double-sided packaging, and in some embodiments, single-sided packaging radio frequency sub-modules C and / or radio frequency sub-modules E can also be used. Figure 31 The radio frequency sub-module E in Figure 32 is a structure with useless areas cut off, and in some embodiments, Figure 23 the radio frequency sub-module E can also use a structure before cutting, such as the structure shown in .

[0330] The embodiment of the present application further provides a radio frequency sub-module, which comprises a common circuit board, a first surface of the common circuit board comprises a second functional area, and a receiving filter of a first frequency band is arranged in the second functional area; a second surface of the common circuit board comprises a fourth pin area, a fifth pin area and a sixth pin area, and the fourth pin area, the fifth pin area and the sixth pin area are respectively distributed along three edges of the second surface; the fourth pin area comprises an antenna pin, and the antenna pin is used for connecting an antenna; the fifth pin area comprises a receiving control pin and a receiving power pin, the receiving control pin is used for connecting a control end of a receiving signal to input a control signal of the receiving signal, and the receiving power pin is used for inputting a first power voltage; and the sixth pin area comprises a receiving output pin, and the receiving output pin is used for outputting a receiving signal to a radio frequency chip. The first surface and the second surface are two surfaces with the largest area of the common circuit board. The first surface can be a front surface of the radio frequency sub-module, and the second surface can be a back surface of the radio frequency sub-module. Generally, the front surface of the radio frequency sub-module is used for arranging components, and the back surface is used for arranging pins; in some cases, the area of the back surface can also be used for arranging components, and the front surface generally does not arrange pins. A circuit block diagram of the embodiment can be referred to as shown in FIG. 8. Figure 21 Detailed description of the circuit block diagram can be referred to the foregoing embodiment, and will not be repeated here. The radio frequency sub-module can be the radio frequency sub-module E in the foregoing, and the distribution of components and the pin distribution of the radio frequency sub-module E can be referred to as shown in FIGS. 9 and 10, Figure 22 and Figure 23 , Figure 23 and Figure 22 are the component layout and pin distribution diagrams of the radio frequency sub-module after the area without arranging components is cut out, and Figure 22 and Figure 23 have the same pin distribution mode.

[0331] In some embodiments, the second surface further comprises a third functional area, and an antenna switch and a low-noise amplifier of the first frequency band are arranged in the third functional area. Optionally, the second functional area further comprises an impedance matching network of the receiving filter of the first frequency band. A circuit block diagram of the embodiment can be referred to as shown in FIG. 11. Detailed description of the circuit block diagram can be referred to the foregoing embodiment, and will not be repeated here. The radio frequency sub-module can be the radio frequency sub-module E in the foregoing, and the distribution of components and the pin distribution of the radio frequency sub-module E can be referred to as shown in FIGS. 12 and 13, Figure 21 and Figure 22 , Figure 23 are Figure 23 , Figure 22 are the component layout and pin distribution diagrams of the radio frequency sub-module after the area without arranging components is cut out, and Figure 22 and Figure 23 have the same functional pin distribution mode.

[0332] In some embodiments, on the basis of the radio frequency sub-module E of the double-sided package, the first side further comprises a first functional area, the first functional area and the second functional area are mutually exclusive; the first functional area is arranged with a power amplifier of the first frequency band, and the second functional area is further arranged with a transmitting filter of the first frequency band; the second side further comprises a first ground pin area, a first pin area, a second pin area, and a seventh pin area; the first ground pin area and the third functional area are mutually exclusive, the first pin area, the second pin area, and the seventh pin area are respectively distributed along three edges of the periphery of the first ground pin area, and the first pin area, the second pin area, and the seventh pin area are respectively distributed along three edges of the second side; the fourth pin area, the fifth pin area, and the sixth pin area are respectively distributed along three edges of the periphery of the third functional area; the first pin area comprises a transmitting input pin, the transmitting input pin is used for inputting a transmitting signal output by a radio frequency chip; the second pin area comprises a transmitting power pin, the transmitting power pin is used for inputting a second power voltage; and the seventh pin area comprises a transmitting control pin, the transmitting control pin is used for connecting a control end of the transmitting signal to input a control signal of the transmitting signal. A circuit block diagram of this embodiment can be seen from Figure 15 . The detailed description of the circuit block diagram can be seen from the related description in the foregoing embodiments, which will not be repeated here. The radio frequency sub-module can be the radio frequency sub-module C in the foregoing, and the layout and pin distribution of the components of the radio frequency sub-module C can be seen from Figure 16 , Figure 16 the fourth pin area, the fifth pin area, and the sixth pin area in

[0333] Optionally, Figure 16 for example, the second side further comprises a third pin area, the third pin area is distributed along any one or two edges of the periphery of the first ground pin area, and the third pin area is distributed along any one or two edges of the periphery of the second side. The third pin area comprises a coupling input pin and a coupling output pin, the coupling input pin is used for inputting a first coupling signal, and the coupling output pin is used for outputting a second coupling signal. Figure 15 and Figure 16 The embodiments shown in

[0334] Optionally, Figure 15 and Figure 16 for example, the first functional area further comprises a power matching network of the power amplifier of the first frequency band. Figure 15 and Figure 16 The embodiments shown in

[0335] Optionally, multiple ground pins can be arranged in the first ground pin area for grounding, and some suspended pins can also be distributed. The distribution manner and number of the ground pins and the suspended pins in the first ground pin area are not limited in the embodiments of the present application, and the principle of ensuring the electromagnetic compatibility of the radio frequency sub-module is taken into account; the first ground pin area can also be distributed with a whole piece of metal for connecting the reference ground. The large-area grounding can facilitate heat dissipation.

[0336] In some embodiments, on the basis of the radio frequency sub-module C of the double-sided package, a second frequency band receiving filter is arranged in the second functional area, and a second frequency band low noise amplifier and a multiplexing switch are arranged in the third functional area. A circuit block diagram of this embodiment can be seen from Figure 18 . The detailed description of the circuit block diagram can be seen from the related description in the foregoing embodiments, and will not be repeated here. The radio frequency sub-module can be the radio frequency sub-module D in the foregoing, and the layout of the components and the pin distribution of the radio frequency sub-module D can be seen from Figure 19 and Figure 20 , Figure 19 for Figure 20 the layout of the components and the pin distribution of the radio frequency sub-module after the area in which the components are not arranged is trimmed, and Figure 19 and Figure 20 the functional pin distribution manners are the same. Figure 19 and Figure 20 the fourth pin area, the fifth pin area and the sixth pin area in

[0337] Optionally, Figure 18 , Figure 19 and Figure 20 are taken as examples in which the second functional area further includes the impedance matching network of the second frequency band receiving filter. Figure 18 , Figure 19 and Figure 20 The embodiments shown in

[0338] In some embodiments, on the basis of the radio frequency sub-module D, a second frequency band receiving filter is arranged in the second functional area, and a second frequency band low noise amplifier and a multiplexing switch are arranged in the third functional area. A circuit block diagram of this embodiment can be seen from Figure 13 . The detailed description of the circuit block diagram can be seen from the related description in the foregoing embodiments, and will not be repeated here. The radio frequency sub-module can be the radio frequency sub-module B in the foregoing, and the layout of the components and the pin distribution of the radio frequency sub-module B can be seen from Figure 14 . Figure 14The fourth pin area, the fifth pin area and the sixth pin area in the fourth embodiment are the same as the pin distribution of the same function in the RF sub-module E, C and D.

[0339] Optionally, the second functional area further comprises an impedance matching network of the receiving filter of the second frequency band. Figure 13 and Figure 14 In the embodiment shown, the impedance matching network of the receiving filter of the second frequency band can also be not included, but the impedance is controlled by means such as RF trace, so that the receiving path reaches the state of impedance matching.

[0340] In some embodiments, on the basis of the RF sub-module B, the first functional area further arranges a power amplifier of the second frequency band, and the second functional area further arranges a transmitting filter of the second frequency band. A circuit block diagram of this embodiment can be seen from Figure 5 The detailed description of the circuit block diagram can be seen from the related description in the foregoing embodiments, and will not be repeated here. The RF sub-module can be the RF sub-module A in the foregoing, and the layout and pin distribution of the components of the RF sub-module A can be seen from Figure 7 . Figure 7 The fourth pin area, the fifth pin area and the sixth pin area in the fourth embodiment are the same as the pin distribution of the same function in the RF sub-module E, C, D and B.

[0341] Optionally, Figure 5 and Figure 7 The power matching network of the power amplifier of the second frequency band in the first functional area is exemplified. Figure 5 and Figure 7 In the embodiment of the RF sub-module, the power matching network of the power amplifier of the first frequency band can also be not included, but the impedance is controlled by means such as RF trace, so that the power amplifier of the second frequency band reaches the state of impedance matching.

[0342] In some embodiments, the second functional area arranges an antenna switch and a low noise amplifier of the first frequency band. A circuit block diagram of this embodiment can be seen from Figure 21 The detailed description of the circuit block diagram can be seen from the related description in the foregoing embodiments, and will not be repeated here. The RF sub-module can be the RF sub-module E in the foregoing, and the layout and pin distribution of the components of the RF sub-module E can be seen from Figure 24 . Figure 24 is a component layout and pin distribution diagram of the RF sub-module after the area where the components are not arranged is trimmed.

[0343] Optionally, in the above Figure 24The second surface can further include a second ground pin area. The second ground pin area can be arranged with a plurality of ground pins for grounding. The second surface can also be arranged with a plurality of floating pins. The embodiments of the present application do not limit the distribution and number of the ground pins and the floating pins in the first ground pin area, as long as the electromagnetic compatibility of the radio frequency sub-module is ensured.

[0344] Optionally, Figure 21 and Figure 24 The second functional area in the second functional area further includes an impedance matching network of a receiving filter of the first frequency band. Figure 21 and Figure 24 The embodiments of the present application can not include the power matching network of the power amplifier of the first frequency band, but control the impedance through radio frequency traces and other means to make the power amplifier of the second frequency band reach the state of impedance matching.

[0345] In some embodiments, on the basis of the single-surface packaged radio frequency sub-module E, the first surface further includes a first functional area. The first functional area and the second functional area do not intersect with each other. The first functional area is arranged with a power amplifier of the first frequency band. The second functional area is further arranged with a transmitting filter of the first frequency band. The second surface further includes a first ground pin area, a first pin area, a second pin area, and a seventh pin area. The first ground pin area and the second ground pin area do not intersect with each other. The first pin area, the second pin area, and the seventh pin area are respectively distributed along three edges of the periphery of the first ground pin area. The first pin area, the second pin area, and the seventh pin area are respectively distributed along three edges of the second surface. The fourth pin area, the fifth pin area, and the sixth pin area are respectively distributed along three edges of the periphery of the second ground pin area. The first pin area includes a transmitting input pin. The transmitting input pin is used to input a transmitting signal output by a radio frequency chip. The second pin area includes a transmitting power pin. The transmitting power pin is used to input a second power voltage. The seventh pin area includes a transmitting control pin. The transmitting control pin is used to connect a control end of the transmitting signal to input a control signal of the transmitting signal. A circuit block diagram of this embodiment can be seen in FIG. 8. Figure 15 The detailed description of the circuit block diagram can be found in the foregoing embodiments, and will not be repeated here. The radio frequency sub-module can be the double-surface packaged radio frequency sub-module C in the foregoing. The layout of the components and the pin distribution of the radio frequency sub-module C can be seen in FIG. 6. Figure 17 Figure 17 The fourth pin area, the fifth pin area, and the sixth pin area in the embodiment of the present application have the same pin distribution as the same function in the radio frequency sub-module E.

[0346] Optionally, Figure 17 ​The third pin area in the second surface is taken as an example, the third pin area is distributed along any one or two edges of the three edges of the periphery of the first ground pin area, and the third pin area is distributed along any one or two edges of the three edges of the second surface; the third pin area includes a coupling input pin and a coupling output pin, the coupling input pin is used for inputting the first coupling signal, and the coupling output pin is used for outputting the second coupling signal. Figure 15 and Figure 17 The coupling input pin and the coupling output pin in the third pin area can also be not included in the embodiment shown.

[0347] Optionally, Figure 15 and Figure 17 The power matching network of the power amplifier of the first frequency band in the first functional area is taken as an example. Figure 15 and Figure 17 The power matching network of the power amplifier of the first frequency band can also be not included in the embodiment shown, and the impedance is controlled by means such as radio frequency wires, so that the power amplifier of the first frequency band reaches the state of impedance matching.

[0348] In some embodiments, optionally, a plurality of ground pins for grounding can be arranged in the first ground pin area, and some suspended pins can also be distributed, and the distribution mode and the number of the ground pins and the suspended pins in the first ground pin area are not limited in the embodiments of the application, and the principle of ensuring electromagnetic compatibility of the radio frequency sub-module is ensured; the first ground pin area can also be distributed with a whole piece of metal for connecting a reference ground, and large-area grounding can facilitate heat dissipation.

[0349] It should be noted that, Figure 5 The layout and pin distribution diagram of the radio frequency sub-module A shown can also be other forms, for example, refer to Figures 8 to 12 When the layout and pin distribution diagram of the radio frequency sub-module A are fixed, the same pin distribution form of the public circuit board can be used to compatible the functions of the radio frequency sub-module B, the radio frequency sub-module C, the radio frequency sub-module D and the radio frequency sub-module E.

[0350] The embodiment of the application further provides a radio frequency front end module, comprising a first sub-module and a second sub-module, the first sub-module comprising a first common circuit board, and the second sub-module comprising a second common circuit board; the second surface of the first common circuit board comprises a first receiving pin area, the first receiving pin area comprises a fourth pin area, a fifth pin area and a sixth pin area, and the fourth pin area, the fifth pin area and the sixth pin area are respectively distributed along three edges of the second surface; the fourth pin area comprises an antenna pin, and the antenna pin is used for connecting an antenna; the fifth pin area comprises a receiving control pin and a receiving power pin, the receiving control pin is used for connecting a control end of a receiving signal to input a control signal of the receiving signal, and the receiving power pin is used for inputting a first power voltage; the sixth pin area comprises a receiving output pin, and the receiving output pin is used for outputting a receiving signal to a radio frequency chip; the second surface of the second common circuit board comprises a second receiving pin area, and the second receiving pin area and the first receiving pin area have the same distribution mode. That is, in the embodiment, the pins in the receiving pin areas of the two radio frequency sub-modules are distributed in the same way.

[0351] Optionally, the first sub-module is a radio frequency sub-module C, and the second sub-module is a radio frequency sub-module E. The radio frequency front end module can support the 1T4R specification of the first frequency band.

[0352] Optionally, the first sub-module is a radio frequency sub-module A, and the second sub-module is a radio frequency sub-module D. The radio frequency front end module can support the 1T4R specification of the first frequency band and the 1T4R specification of the second frequency band.

[0353] Optionally, the first sub-module is a radio frequency sub-module A, and the second sub-module is a radio frequency sub-module B. The radio frequency front end module can support the 2T4R specification of the first frequency band and the 1T4R specification of the second frequency band.

[0354] Optionally, the first sub-module is a radio frequency sub-module A, and the second sub-module is a radio frequency sub-module A. The radio frequency front end module can support the 2T4R specification of the first frequency band and the 2T4R specification of the second frequency band.

[0355] The embodiment of the application further provides a method for determining a radio frequency sub-module, which is used to generate the radio frequency sub-modules described above, and the radio frequency sub-module comprises a common circuit board. As shown in the method, Figure 33 the method comprises the following steps.

[0356] S3301, determining a second functional area on a first surface of the common circuit board, and arranging a receiving filter of the first frequency band in the second functional area;

[0357] S3302, arranging a fourth pin area, a fifth pin area and a sixth pin area on a second surface of the common circuit board along three edges of the second surface respectively;

[0358] S3303, arranging an antenna pin in the fourth pin area, and the antenna pin is used for connecting an antenna;

[0359] S3304, setting a receiving control pin and a receiving power pin in the fifth pin area, the receiving control pin being used for connecting a control end of the receiving signal to input a control signal of the receiving signal, and the receiving power pin being used for inputting a first power voltage;

[0360] S3305, setting a receiving output pin in the sixth pin area, the receiving output pin being used for outputting the receiving signal to the radio frequency chip.

[0361] In some embodiments, the method further comprises: setting a third functional area on the second surface, and setting an antenna switch and a low noise amplifier of the first frequency band in the third functional area.

[0362] In some embodiments, the method further comprises: setting an impedance matching network of the receiving filter of the first frequency band in the second functional area.

[0363] In some embodiments, the fourth pin area, the fifth pin area and the sixth pin area are respectively set along three edges of the second surface on the second surface of the common circuit board, including: setting the fourth pin area, the fifth pin area and the sixth pin area along three edges of the periphery of the third functional area; the method further comprises: determining a first functional area in the first surface, and the first functional area and the second functional area are non-intersecting; setting a power amplifier of the first frequency band in the first functional area, and setting a transmitting filter of the first frequency band in the second functional area; setting a first ground pin area in the second surface, and the first ground pin area and the third functional area are non-intersecting; setting a first pin area, a second pin area and a seventh pin area along three edges of the periphery of the first ground pin area, and the first pin area, the second pin area and the seventh pin area are respectively distributed along three edges of the second surface; setting a transmitting input pin in the first pin area, the transmitting input pin being used for inputting a transmitting signal output by the radio frequency chip; setting a transmitting power pin in the second pin area, the transmitting power pin being used for inputting a second power voltage; and setting a transmitting control pin in the seventh pin area, the transmitting control pin being used for connecting a control end of the transmitting signal to input a control signal of the transmitting signal.

[0364] In some embodiments, the method further comprises: setting a third pin area on the second surface, the third pin area being distributed along any one or two of three edges of the periphery of the first ground pin area, and the third pin area being distributed along any one or two of three edges of the second surface; setting a coupling input pin and a coupling output pin in the third pin area, the coupling input pin being used for inputting a first coupling signal, and the coupling output pin being used for outputting a second coupling signal.

[0365] In some embodiments, the method further comprises: setting a power matching network of the power amplifier of the first frequency band in the first functional area.

[0366] In some embodiments, the method for determining the radio frequency sub-module further comprises: arranging a plurality of ground pins in the first ground pin area.

[0367] In some embodiments, the method for determining the radio frequency sub-module further comprises: arranging a second frequency band receiving filter in the second functional area; and arranging a second frequency band low noise amplifier and a multiplexing switch in the third functional area.

[0368] In some embodiments, an impedance matching network of the second frequency band receiving filter is arranged in the second functional area.

[0369] In some embodiments, the method for determining the radio frequency sub-module further comprises: arranging a second frequency band receiving filter in the second functional area; and arranging a second frequency band low noise amplifier and a multiplexing switch in the third functional area.

[0370] In some embodiments, an impedance matching network of the second frequency band receiving filter is arranged in the second functional area.

[0371] In some embodiments, the method for determining the radio frequency sub-module further comprises: arranging a second frequency band power amplifier in the first functional area; and arranging a second frequency band transmitting filter in the second functional area.

[0372] In some embodiments, the method for determining the radio frequency sub-module further comprises: arranging a power matching network of the second frequency band power amplifier in the first functional area.

[0373] In some embodiments, the method for determining the radio frequency sub-module further comprises: arranging an antenna switch and a first frequency band low noise amplifier in the second functional area.

[0374] In some embodiments, the method for determining the radio frequency sub-module further comprises: arranging a second ground pin area on the second surface, and arranging a plurality of ground pins in the second ground pin area.

[0375] In some embodiments, the method for determining the radio frequency sub-module further comprises: arranging an impedance matching network of the first frequency band receiving filter in the second functional area.

[0376] In some embodiments, the fourth pin area, the fifth pin area and the sixth pin area are arranged along three edges of the second surface of the common circuit board respectively, the determination of the radio frequency sub-module includes: arranging the fourth pin area, the fifth pin area and the sixth pin area along three edges of the periphery of the second ground pin area; the determination method of the radio frequency sub-module further includes: determining a first functional area in the first surface, the first functional area and the second functional area are not intersected with each other; arranging a power amplifier of the first frequency band in the first functional area, and further arranging a transmitting filter of the first frequency band in the second functional area; further arranging a first ground pin area in the second surface, the first ground pin area and the second ground pin area are not intersected with each other; arranging the first ground pin area, the first pin area, the second pin area and the seventh pin area along three edges of the periphery of the first ground pin area, and the first pin area, the second pin area and the seventh pin area are distributed along three edges of the second surface respectively; arranging a transmitting input pin in the first pin area, the transmitting input pin is used for inputting a transmitting signal output by a radio frequency chip; arranging a transmitting power pin in the second pin area, the transmitting power pin is used for inputting a second power voltage; arranging a transmitting control pin in the seventh pin area, the transmitting control pin is used for connecting a control end of the transmitting signal to input a control signal of the transmitting signal.

[0377] In some embodiments, the determination method of the radio frequency sub-module further includes: further arranging a third pin area in the second surface, the third pin area is distributed along any one or two of the three edges of the periphery of the first ground pin area, and the third pin area is distributed along any one or two of the three edges of the second surface; arranging a coupling input pin and a coupling output pin in the third pin area, the coupling input pin is used for inputting a first coupling signal, and the coupling output pin is used for outputting a second coupling signal.

[0378] In some embodiments, the determination method of the radio frequency sub-module further includes: further arranging a power matching network of the power amplifier of the first frequency band in the first functional area.

[0379] In some embodiments, the determination method of the radio frequency sub-module further includes: arranging a plurality of ground pins in the first ground pin area.

[0380] The detailed introduction and technical effects of the above-mentioned determination method of the radio frequency sub-module can be referred to the description in the foregoing, which will not be repeated here.

[0381] In some scenarios, the designer can perform the design process of the radio frequency sub-module according to the above-mentioned determination method of the radio frequency sub-module.

[0382] In some scenarios, the computer device can also be used to perform the automatic design of the radio frequency sub-module according to the above-mentioned determination method of the radio frequency sub-module.

[0383] The above describes examples of the method provided by the present application in detail. It can be understood that the corresponding device includes the hardware structure and / or software module corresponding to the execution of each function in order to achieve the above functions. Those skilled in the art should easily realize that, in combination with the units and algorithm steps of each example described in the embodiments disclosed herein, the present application can be realized in the form of hardware or a combination of hardware and computer software. Whether a certain function is executed in the form of hardware or computer software driving hardware depends on the specific application and design constraints of the technical solution. The skilled person can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present application.

[0384] The present application can divide the functional modules of the radio frequency front-end module determination device according to the above method examples. For example, each function can be divided into a functional module, or two or more functions can be integrated into one module. The above integrated module can be realized in the form of hardware or software functional module. It should be noted that the division of the modules in the present application is illustrative, and is only a logical functional division. Actual implementation can have another division method.

[0385] The specific manner in which the radio frequency front-end module determination device executes the radio frequency front-end module determination method and the beneficial effects produced can be referred to the related description in the method embodiments, which will not be repeated here.

[0386] The present application can divide the functional modules of the radio frequency sub-module determination device according to the above method examples. For example, each function can be divided into a functional module, or two or more functions can be integrated into one module. The above integrated module can be realized in the form of hardware or software functional module. It should be noted that the division of the modules in the present application is illustrative, and is only a logical functional division. Actual implementation can have another division method.

[0387] Figure 34 A structure diagram of a radio frequency sub-module determination device provided by the present application is shown. The device 3400 includes:

[0388] The first setting module 3401 is configured to determine a second functional area on a first surface of a common circuit board, and set a first frequency band receiving filter in the second functional area.

[0389] The second setting module 3402 is configured to set a fourth pin area, a fifth pin area and a sixth pin area along three edges of the second surface respectively on the second surface of the common circuit board.

[0390] The third setting module 3403 is configured to set an antenna pin in the fourth pin area; set a receiving control pin and a receiving power pin in the fifth pin area; and set a receiving output pin in the sixth pin area. The receiving output pin is configured to output a receiving signal to the radio frequency chip, the receiving control pin is configured to connect a control end of the receiving signal to input a control signal of the receiving signal, and the receiving power pin is configured to input a first power voltage, and the antenna pin is configured to connect an antenna.

[0391] In some embodiments, the first setting module 3401, the second setting module 3402 and the third setting module 3403 are further configured to perform the corresponding steps in the method for determining the radio frequency sub-module.

[0392] The specific implementation manners of the apparatus 3400 for performing the method for determining the radio frequency sub-module and the beneficial effects generated by the apparatus 3400 can be referred to the related description in the method embodiments, and will not be described here.

[0393] The embodiments of the present application further provide an electronic device including the processor described above. The electronic device provided by the embodiments of the present application can be Figure 1 The terminal device 100 shown in FIG. 10 is configured to perform the method for determining the radio frequency sub-module and the method for determining the radio frequency front-end module. In the case of using an integrated unit, the terminal device can include a processing module, a storage module and a communication module. The processing module can be configured to control and manage the actions of the terminal device, for example, can be configured to support the terminal device to perform the steps performed by the display unit, the detection unit and the processing unit. The storage module can be configured to support the terminal device to store program codes and data, etc. The communication module can be configured to support the terminal device to communicate with other devices.

[0394] The processing module can be a processor or a controller. It can realize or execute various exemplary logical blocks, modules and circuits described in combination with the disclosure of the present application. The processor can also be a combination realizing a computing function, for example, a combination of one or more microprocessors, a combination of a digital signal processing (DSP) and a microprocessor, etc. The storage module can be a memory. The communication module can be a radio frequency circuit, a Bluetooth chip, a Wi-Fi chip, etc. and other devices for interacting with other terminal devices.

[0395] In one embodiment, when the processing module is a processor and the storage module is a memory, the terminal device involved in the embodiments of the present application can be a device with Figure 1 the structure shown in FIG. 10.

[0396] The embodiment of the present application further provides a computer readable storage medium, wherein the computer readable storage medium stores a computer program, and the computer program causes a processor to execute the determination method of the radio frequency sub-module and the determination method of the radio frequency front end module when the computer program is executed by the processor.

[0397] The embodiment of the present application further provides a computer program product, which causes a computer to execute the related steps when the computer program product is run on the computer, so as to realize the determination method of the radio frequency sub-module and the determination method of the radio frequency front end module in the above embodiment.

[0398] The electronic device, the computer readable storage medium, the computer program product or the chip provided by the embodiment can be used to execute the corresponding method provided above, and thus the beneficial effects achieved by the electronic device, the computer readable storage medium, the computer program product or the chip can refer to the beneficial effects of the corresponding method provided above, and will not be described here.

[0399] In the several embodiments provided by the present application, it should be understood that the disclosed device and method can be implemented in other ways. For example, the device embodiment described above is only illustrative, and the division of the modules or units is only a logical function division, and there can be another division manner in actual implementation, for example, a plurality of units or components can be combined or integrated into another device, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the units shown or discussed can be indirect coupling or communication connection through some interface, and the replaced units can or can not be physically separate, and the components shown as units can be one physical unit or a plurality of physical units, that is, can be located in one place or distributed in a plurality of different places. According to actual needs, some or all of the units can be selected to achieve the purpose of the embodiment scheme.

[0400] In addition, each functional unit in the embodiments of the present application can be integrated in one processing unit, or each unit can be physically present separately, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of a software functional unit.

[0401] The integrated unit, if implemented in the form of a software function unit and sold or used as an independent product, can be stored in a readable storage medium. Based on such understanding, the technical solutions of the embodiments of the present application essentially or say the part that contributes to the prior art or the whole or part of the technical solutions can be embodied in the form of a software product. The software product is stored in a storage medium, including a plurality of instructions to make a device (which can be a single-chip microcomputer, a chip, etc.) or a processor execute all or part of the steps of the various embodiments of the method of the present application. The aforementioned storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, and various media that can store program codes.

[0402] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A radio frequency sub-module, characterized in that, The radio frequency sub-module comprises a common circuit board; The first surface of the common circuit board comprises a second functional area, and a receiving filter of a first frequency band is arranged in the second functional area; The second surface of the common circuit board comprises a fourth pin area, a fifth pin area and a sixth pin area, and the fourth pin area, the fifth pin area and the sixth pin area are respectively distributed along three edges of the second surface; The fourth pin area comprises an antenna pin, and the antenna pin is used for connecting an antenna; The fifth pin area comprises a receiving control pin and a receiving power pin, the receiving control pin is used for connecting a control end of a receiving signal to input a control signal of the receiving signal, and the receiving power pin is used for inputting a first power voltage; The sixth pin area comprises a receiving output pin, and the receiving output pin is used for outputting the receiving signal to a radio frequency chip.

2. The radio frequency subassembly of claim 1, wherein, The second surface further comprises a third functional area, and an antenna switch and a low noise amplifier of the first frequency band are arranged in the third functional area.

3. The radio frequency subassembly of claim 2, wherein, The second functional area further comprises an impedance matching network of the receiving filter of the first frequency band.

4. The radio frequency subassembly of claim 2 or 3, wherein, The first surface further comprises a first functional area, and the first functional area and the second functional area are not intersected with each other; The first functional area is arranged with a power amplifier of the first frequency band, and the second functional area is further arranged with a transmitting filter of the first frequency band; The second surface further comprises a first ground pin area, a first pin area, a second pin area and a seventh pin area; The first ground pin area and the third functional area are not intersected with each other, the first pin area, the second pin area and the seventh pin area are respectively distributed along three edges of the periphery of the first ground pin area, and the first pin area, the second pin area and the seventh pin area are respectively distributed along three edges of the second surface; The fourth pin area, the fifth pin area and the sixth pin area are respectively distributed along three edges of the periphery of the third functional area; The first pin area comprises a transmitting input pin, and the transmitting input pin is used for inputting a transmitting signal output by the radio frequency chip; The second pin area comprises a transmitting power pin, and the transmitting power pin is used for inputting a second power voltage; The seventh pin area comprises a transmitting control pin, and the transmitting control pin is used for connecting a control end of a transmitting signal to input a control signal of the transmitting signal.

5. The radio frequency subassembly of claim 4, wherein, The second surface further comprises a third pin area, and the third pin area is distributed along any one of three edges of the periphery of the first ground pin area, and the third pin area is distributed along any one of three edges of the second surface; The third pin area comprises a coupling input pin and a coupling output pin, the coupling input pin is used for inputting a first coupling signal, and the coupling output pin is used for outputting a second coupling signal.

6. The radio frequency subassembly of claim 4, wherein: The first functional area further comprises a power matching network of the power amplifier of the first frequency band.

7. The radio frequency subassembly of claim 4, wherein: The first ground pin area is arranged with a plurality of ground pins.

8. The radio frequency subassembly of claim 2 or 3, wherein, The second functional area is further arranged with a receiving filter of a second frequency band, and the third functional area is further arranged with a low noise amplifier and a multiplexing switch of the second frequency band.

9. The radio frequency subassembly of claim 8, wherein, The second functional area further comprises an impedance matching network of the receiving filter of the second frequency band.

10. The radio frequency subassembly of claim 4, wherein: The second functional area further comprises an impedance matching network of a receiving filter of the second frequency band.

11. The radio frequency subassembly of claim 10, wherein, The second functional area further comprises an impedance matching network of a receiving filter of the second frequency band.

12. The radio frequency subassembly of claim 10, wherein: The first functional area further comprises a power matching network of a power amplifier of the second frequency band.

13. The radio frequency subassembly of claim 12, wherein: The second functional area further comprises a power matching network of a power amplifier of the second frequency band.

14. The radio frequency subassembly of claim 1, wherein: The second functional area further comprises an antenna switch and a low noise amplifier of the first frequency band.

15. The radio frequency subassembly of claim 14, wherein: The second surface further comprises a second ground pin area, and a plurality of ground pins are arranged in the second ground pin area.

16. The radio frequency subassembly of claim 14 or 15, wherein, The second functional area further comprises an impedance matching network of a receiving filter of the first frequency band.

17. The radio frequency subassembly of claim 15, wherein: The first surface further comprises a first functional area, and the first functional area and the second functional area are not intersected with each other; The first functional area comprises a power amplifier of the first frequency band, and the second functional area further comprises a transmitting filter of the first frequency band; The second surface further comprises a first ground pin area, a first pin area, a second pin area and a seventh pin area; The first ground pin area and the second ground pin area are not intersected with each other, the first pin area, the second pin area and the seventh pin area are respectively distributed along three edges of the periphery of the first ground pin area, and the first pin area, the second pin area and the seventh pin area are respectively distributed along three edges of the second surface; The fourth pin area, the fifth pin area and the sixth pin area are respectively distributed along three edges of the periphery of the second ground pin area; The first pin area comprises a transmitting input pin, and the transmitting input pin is used for inputting a transmitting signal output by the radio frequency chip; The second pin area comprises a transmitting power supply pin, and the transmitting power supply pin is used for inputting a second power voltage; The seventh pin area comprises a transmitting control pin, and the transmitting control pin is used for connecting a control end of a transmitting signal to input a control signal of the transmitting signal.

18. The radio frequency subassembly of claim 17, wherein, The second surface further comprises a third pin area, and the third pin area is distributed along any one or two edges of three edges of the periphery of the first ground pin area, and the third pin area is distributed along any one or two edges of three edges of the second surface; The third pin area comprises a coupling input pin and a coupling output pin, the coupling input pin is used for inputting a first coupling signal, and the coupling output pin is used for outputting a second coupling signal.

19. The radio frequency subassembly of claim 17 or 18, wherein, The first functional area further comprises a power matching network of a power amplifier of the first frequency band.

20. The radio frequency subassembly of claim 17 or 18, wherein, A plurality of ground pins are arranged in the first ground pin area.

21. A radio frequency front end module, comprising: The first common circuit board comprises a first receiving pin area, and the first receiving pin area comprises a fourth pin area, a fifth pin area and a sixth pin area, and the fourth pin area, the fifth pin area and the sixth pin area are respectively distributed along three edges of the second surface; The fourth pin area comprises an antenna pin, and the antenna pin is used for connecting an antenna; ​ The fifth pin area includes a receiving control pin and a receiving power pin, the receiving control pin is used for connecting a control end of a receiving signal to input a control signal of the receiving signal, and the receiving power pin is used for inputting a first power voltage; The sixth pin area includes a receiving output pin, and the receiving output pin is used for outputting the receiving signal to the radio frequency chip; The second surface of the second common circuit board includes a second receiving pin area, and the second receiving pin area and the first receiving pin area have the same pin distribution mode.

22. The radio frequency front end module of claim 21, wherein, The first sub-module is the radio frequency sub-module as claimed in any one of claims 4 to 7 and 17 to 20, and the second sub-module is the radio frequency sub-module as claimed in any one of claims 2 or 3 and 14 to 16.

23. The radio frequency front end module of claim 21, wherein, The first sub-module is the radio frequency sub-module as claimed in claim 12 or 13, and the second sub-module is the radio frequency sub-module as claimed in claim 8 or 9.

24. The radio frequency front end module of claim 21, wherein, The first sub-module is the radio frequency sub-module as claimed in claim 12 or 13, and the second sub-module is the radio frequency sub-module as claimed in claim 10 or 11.

25. The radio frequency front end module of claim 21, wherein, The first sub-module is the radio frequency sub-module as claimed in claim 12 or 13, and the second sub-module is the radio frequency sub-module as claimed in claim 12 or 13.

26. A method of determining a radio frequency sub-module, the method comprising: The radio frequency sub-module includes a common circuit board, and the method includes: determining a second functional area on a first surface of the common circuit board, and arranging a receiving filter of a first frequency band in the second functional area; arranging a fourth pin area, a fifth pin area and a sixth pin area along three edges of a second surface of the common circuit board respectively; arranging an antenna pin in the fourth pin area, the antenna pin being used for connecting an antenna; arranging a receiving control pin and a receiving power pin in the fifth pin area, the receiving control pin being used for connecting a control end of a receiving signal to input a control signal of the receiving signal, and the receiving power pin being used for inputting a first power voltage; arranging a receiving output pin in the sixth pin area, the receiving output pin being used for outputting the receiving signal to a radio frequency chip.

27. The method of claim 26, wherein, The method further includes: arranging an antenna switch and a low noise amplifier of the first frequency band in a third functional area arranged on the second surface.

28. The method of claim 27, wherein, The method further includes: arranging an impedance matching network of the receiving filter of the first frequency band in the second functional area.

29. The method of claim 27 or 28, wherein, The arranging of the fourth pin area, the fifth pin area and the sixth pin area along the three edges of the second surface of the common circuit board includes: arranging the fourth pin area, the fifth pin area and the sixth pin area along the three edges of the periphery of the third functional area; The method further includes: determining a first functional area in the first surface, the first functional area and the second functional area being non-intersected; arranging a power amplifier of the first frequency band in the first functional area, and arranging a transmitting filter of the first frequency band in the second functional area; arranging a first ground pin area in the second surface, the first ground pin area and the third functional area being non-intersected; The first pin area, the second pin area and the seventh pin area are arranged along three edges of the periphery of the first ground pin area, and the first pin area, the second pin area and the seventh pin area are respectively distributed along three edges of the second surface; A transmitting input pin is arranged in the first pin area, and the transmitting input pin is used for inputting a transmitting signal output by the radio frequency chip; A transmitting power pin is arranged in the second pin area, and the transmitting power pin is used for inputting a second power voltage; A transmitting control pin is arranged in the seventh pin area, and the transmitting control pin is used for connecting a control end of the transmitting signal to input a control signal of the transmitting signal.

30. The method of claim 29, wherein, The method further comprises: A third pin area is further arranged on the second surface, the third pin area is distributed along any one or two edges of the three edges of the periphery of the first ground pin area, and the third pin area is distributed along any one or two edges of the three edges of the second surface; A coupling input pin and a coupling output pin are arranged in the third pin area, the coupling input pin is used for inputting a first coupling signal, and the coupling output pin is used for outputting a second coupling signal.

31. The method of claim 29, wherein, The method further comprises: A power matching network of the power amplifier of the first frequency band is further arranged in the first functional area.

32. The method of claim 30 or 31, wherein, The method further comprises: A plurality of ground pins are arranged in the first ground pin area.

33. The method of claim 27 or 28, wherein, The method further comprises: A receiving filter of a second frequency band is further arranged in the second functional area; A low noise amplifier and a multiplexing switch of the second frequency band are further arranged in the third functional area.

34. The method of claim 33, wherein, The method further comprises: An impedance matching network of the receiving filter of the second frequency band is further arranged in the second functional area.

35. The method of claim 29, wherein, The method further comprises: A receiving filter of a second frequency band is further arranged in the second functional area; A low noise amplifier and a multiplexing switch of the second frequency band are further arranged in the third functional area.

36. The method of claim 35, wherein, An impedance matching network of the receiving filter of the second frequency band is further arranged in the second functional area.

37. The method of claim 35 or 36, wherein, The method further comprises: A power amplifier of the second frequency band is further arranged in the first functional area; A transmitting filter of the second frequency band is further arranged in the second functional area.

38. The method of claim 37, wherein, The method further comprises: A power matching network of the power amplifier of the second frequency band is further arranged in the first functional area.

39. The method of claim 26, wherein, The method further comprises: An antenna switch and a low noise amplifier of the first frequency band are further arranged in the second functional area.

40. The method of claim 29, wherein, The method further comprises: A second ground pin area is further arranged on the second surface, and a plurality of ground pins are arranged in the second ground pin area.

41. The method of claim 29, wherein, The method further comprises: An impedance matching network of the receiving filter of the first frequency band is further arranged in the second functional area.

42. The method of claim 40, wherein, The fourth pin area, the fifth pin area and the sixth pin area are respectively arranged along three edges of the second surface on the second surface of the common circuit board, comprising: The fourth pin area, the fifth pin area and the sixth pin area are arranged along three edges of the periphery of the second ground pin area; The method further comprises: A first functional area is further determined in the first surface, and the first functional area and the second functional area do not intersect with each other; The power amplifier of the first frequency band is arranged in the first functional area, and a transmitting filter of the first frequency band is further arranged in the second functional area; A first ground pin area is further arranged in the second surface, and the first ground pin area and the second ground pin area are not intersected with each other; A first ground pin area, a first pin area, a second pin area and a seventh pin area are arranged along three edges of the periphery of the first ground pin area, and the first pin area, the second pin area and the seventh pin area are respectively distributed along three edges of the second surface; A transmitting input pin for inputting a transmitting signal output by the radio frequency chip is arranged in the first pin area; A transmitting power pin for inputting a second power voltage is arranged in the second pin area; A transmitting control pin for connecting a control end of the transmitting signal to input a control signal of the transmitting signal is arranged in the seventh pin area.

43. The method of claim 32, wherein, The method further comprises: A third pin area is further arranged in the second surface, the third pin area is distributed along any one or two edges of the three edges of the periphery of the first ground pin area, and the third pin area is distributed along any one or two edges of the three edges of the second surface; A coupling input pin for inputting a first coupling signal and a coupling output pin for outputting a second coupling signal are arranged in the third pin area.

44. The method of claim 32, wherein, The method further comprises: A power matching network of the power amplifier of the first frequency band is further arranged in the first functional area.

45. The method of claim 32, wherein, The method further comprises: A plurality of ground pins are arranged in the first ground pin area.

46. An electronic device, comprising: Comprise: A processor, a memory and an interface; The processor, the memory and the interface cooperate with each other, so that the electronic device executes the method as claimed in any one of claims 26 to 45.

47. A computer-readable storage medium, comprising: The computer readable storage medium stores a computer program, when the computer program is executed by the processor, so that the processor executes the method as claimed in any one of claims 26 to 45.

48. An electronic device, comprising: Comprise the radio frequency sub-module as claimed in any one of claims 1 to 20.

49. An electronic device, comprising: Comprise the radio frequency front end module as claimed in any one of claims 21 to 25.

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