A planing apparatus

Abstract

The application relates to a planing device, which comprises a shell, a moving bottom plate and a static bottom plate arranged at intervals along a first direction, a planing tool arranged between the moving bottom plate and the static bottom plate, a motor for driving the planing tool to rotate, and a circuit board electrically connected with the motor, the shell has a machine cavity and a chip removal cavity which are communicated with the outside, the motor and the circuit board are arranged in the machine cavity, a space where the planing tool is located and the machine cavity are communicated with the chip removal cavity, wherein the first direction is the moving direction of the planing device, and the planing device further comprises a blocking piece arranged between the motor and the circuit board, and a heat conduction piece which is in thermal connection with the circuit board and is in thermal connection with the static bottom plate and / or the shell, and heat at the circuit board can be conducted to the static bottom plate and / or the shell through the heat conduction piece. The above planing device can inhibit the impact of chips on the circuit board while ensuring heat dissipation.

Description

Technical Field

[0001] This invention relates to the field of planing technology, and in particular to a planing device. Background Technology

[0002] An electric planer is a handheld power tool that uses a motor to drive a planer blade via a transmission belt for planing operations. It is widely used in building construction, home decoration, and woodworking workshops, primarily for planing, beveling, and raking various types of wood. In related technologies, to enhance heat dissipation for components such as the circuit board in the electric planer, a large area of ​​the space containing the circuit board is connected to the space containing the motor. This allows some of the airflow drawn into the motor to pass over the area where the circuit board is located, thus carrying away the heat generated by the circuit board. However, if there are debris particles raised during planing in the environment, they may be drawn into the motor along with the airflow. If these debris particles impact the circuit board as they flow through it, they may damage the components on the circuit board. Summary of the Invention

[0003] Based on this, the present invention proposes a planing device that can suppress debris impacting the circuit board while ensuring heat dissipation.

[0004] A planing device includes a housing, a movable base plate and a stationary base plate spaced apart along a first direction, a planing blade disposed between the movable base plate and the stationary base plate, a motor for driving the planing blade to rotate, and a circuit board electrically connected to the motor. The housing has a body chamber and a chip removal chamber communicating with the outside. The motor and the circuit board are both disposed in the body chamber. The space containing the planing blade and the body chamber are both connected to the chip removal chamber. The first direction is the direction of movement of the planing device. The device also includes:

[0005] A blocking element is disposed between the motor and the circuit board;

[0006] A heat-conducting component is thermally connected to the circuit board and to the stationary base plate and / or the outer casing, so that heat from the circuit board can be conducted to the stationary base plate and / or the outer casing via the heat-conducting component.

[0007] In one embodiment, the housing has a motor air inlet connected to the outside at one end along the second direction, the circuit board is located on one side of the circumference of the motor, and the blocking member covers at least the area where the circuit board is located in the second direction, wherein the second direction is the axial direction of the motor and the second direction is perpendicular to the first direction.

[0008] In one embodiment, one end of the blocking member extending away from the motor air inlet along the second direction connects to a corresponding area of ​​the housing.

[0009] In one embodiment, one end of the blocking member extending along the second direction near the motor air inlet connects or abuts against the corresponding area of ​​the housing, thereby separating the space where the motor is located from the space where the circuit board is located.

[0010] In one embodiment, the blocking member is an arc shape that bulges outward along the radial direction of the motor.

[0011] In one embodiment, the planing equipment includes an impeller cover connected to the housing, an impeller is connected to one end of the motor away from the motor air inlet along the second direction, the impeller cover surrounds the outside of the impeller, and the end of the impeller cover away from the motor air inlet along the second direction extends to connect with or abut against the housing.

[0012] In one embodiment, one end of the impeller cover extending along the second direction near the motor air inlet is integrated with the blocking member.

[0013] In one embodiment, the impeller cover includes a first section and a second section arranged sequentially along the airflow path. Airflow drawn in through the motor inlet can flow into the chip removal chamber sequentially through the first section and the second section. The gap between the first section and the impeller is d1, and the gap between the second section and the impeller is d2, where d2 > d1, so that the impeller cover is volute-shaped.

[0014] In one embodiment, one of the impeller cover and the inner wall of the outer casing is provided with a limiting groove, and the other is provided with a corresponding limiting post. The limiting post is engaged in the limiting groove to restrict the rotation of the impeller cover.

[0015] In one embodiment, the thermally conductive element is in contact with the circuit board and the stationary base plate.

[0016] In one embodiment, the heat-conducting element is arranged to form a receiving groove, the circuit board is mounted in the receiving groove, and the circuit board is in contact with at least a portion of the groove wall.

[0017] In one embodiment, the heat-conducting element is located inside the housing, the stationary base plate is located outside the housing, the housing is provided with a through groove, and one of the stationary base plate and the heat-conducting element is provided with a protrusion that passes through the through groove and contacts the other.

[0018] In one embodiment, the static base plate is provided with a protrusion extending toward the heat-conducting element, and the heat-conducting element is provided with a recess that mates with the protrusion.

[0019] In one embodiment, the through groove is provided at the center of the area on the outer casing that contacts the static base plate.

[0020] In one embodiment, the heat-conducting element is made of aluminum alloy.

[0021] In one embodiment, the chip removal chamber has a first opening communicating with the space where the planer blade is located, and a second opening communicating with the machine body chamber. The planing device includes a sealing member blocking one end of the chip removal chamber. The sealing member includes a blocking portion extending into the chip removal chamber. The blocking portion blocks the second opening, and there is an air inlet gap between the blocking portion and the chamber wall of the chip removal chamber. Airflow drawn in by the motor can flow into the chip removal chamber through the air inlet gap.

[0022] The aforementioned planing equipment has a baffle between the motor and the circuit board. Therefore, if debris is drawn into the machine cavity by the motor with the airflow, the baffle prevents it from impacting the circuit board, thus reducing the risk of damage to the components on the circuit board. However, because the baffle prevents large-area communication between the space containing the circuit board and the space containing the motor, the conventional method of heat dissipation through airflow across the circuit board is not feasible. Therefore, this application incorporates a heat-conducting component thermally connected to the circuit board and simultaneously to the stationary base plate and / or the outer casing. Heat generated on the circuit board can be conducted to the heat-conducting component, then to the stationary base plate and / or the outer casing, and finally dissipated to the external environment through the stationary base plate and / or the outer casing, thus achieving heat dissipation for the circuit board. Therefore, this planing equipment can ensure heat dissipation while preventing debris from impacting the circuit board. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of the planing equipment in one embodiment of this application;

[0024] Figure 2 for Figure 1 A sectional view of a medium planer;

[0025] Figure 3 for Figure 1 A schematic diagram of the structure of components such as the motor and circuit board of a medium planer;

[0026] Figure 4 for Figure 1 A structural diagram of the outer casing (partial area), circuit board, and static base plate of the medium planer;

[0027] Figure 5 This is a front view of a planing device according to an embodiment of this application (some parts are omitted);

[0028] Figure 6 for Figure 5 A front view of the impeller cover and impeller of a medium planing machine;

[0029] Figure 7 for Figure 1 A schematic diagram of the sealing component of a medium planing machine.

[0030] Figure label:

[0031] 100 outer casing, 110 machine body chamber, 111 motor mounting space, 112 circuit board mounting space, 120 chip removal chamber, 121 first opening, 122 second opening, 130 planer mounting space, 140 motor air inlet, 150 through slot, 160 air inlet gap, 170 limiting post;

[0032] Movable base plate 210, stationary base plate 220, protrusion 221;

[0033] Planer blade 310, motor 320, impeller 321, circuit board 330, battery pack 340, adjustment knob 350, handle 360;

[0034] Blocking component 400;

[0035] Thermal conductive component 500;

[0036] Impeller cover 600, first section 610, second section 620, limiting groove 630;

[0037] 700 sealing component, 710 shielding part, 720 snap-fit ​​part. Detailed Implementation

[0038] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0039] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0040] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0041] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0042] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0043] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0044] Figure 1 This is a schematic diagram of the overall structure of the planing equipment in one embodiment of this application; Figure 2 for Figure 1 A sectional view of a medium planer; Figure 3 for Figure 1 A schematic diagram of the structure of components such as the motor and circuit board of a medium planer;

[0045] Figure 4 for Figure 1A structural diagram of the outer casing (partial area), circuit board, and static base plate of the medium planing equipment.

[0046] See Figures 1 to 4 An embodiment of the planing equipment provided by the present invention includes a housing 100, a movable base plate 210, a stationary base plate 220, a planer blade 310, a motor 320, a circuit board 330, a blocking member 400, and a heat-conducting member 500. The movable base plate 210 and the stationary base plate 220 are arranged at intervals along a first direction, and the planer blade 310 is disposed between the movable base plate 210 and the stationary base plate 220. The circuit board 330 is electrically connected to the motor 320, and the motor 320 is used to drive the planer blade 310 to rotate. The housing 100 has a body chamber 110 and a chip removal chamber 120 communicating with the outside. The motor 320 and the circuit board 330 are both disposed in the body chamber 110, and the space where the planer blade 310 is located and the body chamber 110 are both connected to the chip removal chamber 120. A blocking component 400 is disposed between the motor 320 and the circuit board 330. A heat-conducting component 500 is thermally connected to the circuit board 330 and also thermally connected to the stationary base plate 220 and / or the outer casing 100. Heat from the circuit board 330 can be conducted to the stationary base plate 220 and / or the outer casing 100 via the heat-conducting component 500. The first direction is the moving direction of the planing equipment.

[0047] In the aforementioned planing equipment, a blocking component 400 is provided between the motor 320 and the circuit board 330. Therefore, if debris from the external environment is drawn into the machine cavity 110 by the motor 320 with the airflow, the blocking component 400 can prevent the debris from impacting the circuit board 330, thus preventing damage to the components on the circuit board 330. Because the blocking component 400 is provided between the motor 320 and the circuit board 330, a large-area connection cannot be achieved between the space containing the circuit board 330 and the space containing the motor 320. Therefore, the conventional method of heat dissipation through airflow across the circuit board 330 cannot be implemented. Based on this, a heat-conducting component 500 is provided in this application. The heat-conducting component 500 is thermally connected to the circuit board 330, and simultaneously, it is thermally connected to the stationary base plate 220 and / or the outer casing 100. The heat generated at the circuit board 330 can be conducted to the heat-conducting component 500, and then to the stationary base plate 220 and / or the outer casing 100, and dissipated to the external environment through the stationary base plate 220 and / or the outer casing 100, thereby achieving heat dissipation for the circuit board 330. Therefore, this planing equipment can reduce the probability of debris impacting the circuit board 330 while ensuring heat dissipation.

[0048] Specifically, a thermal connection between two components refers to a direct or indirect connection between the two components, enabling heat conduction between them. For example, the two components may be directly connected to achieve heat conduction, or they may not be directly connected, but each is connected to another intermediate component, through which heat conduction occurs. It should be noted that if the two components are in contact, this is also considered a connection.

[0049] Specifically, from the perspective of the attached diagram, the left-right direction is the first direction, which is also the direction of movement of the planing equipment. The space where the planer 310 is located is... Figure 4 The space for the planer blade mounting space 130 is shown. The space where the motor 320 is located is the motor mounting space 111, and the space where the circuit board 330 is located is the circuit board mounting space 112. From the perspective of the attached drawing, the motor mounting space 111 is located to the right of the planer blade mounting space 130, and the two are separated by a part of the housing 100. The circuit board mounting space 112 is located to the right of the motor mounting space 111.

[0050] To facilitate understanding, the main structure and working principle of the planing equipment will be briefly introduced below.

[0051] See Figures 1 to 4 The movable base plate 210, the stationary base plate 220, and the planer blade 310 are all located at the bottom of the entire planing equipment. The battery pack 340 in the planing equipment is electrically connected to the motor 320 and the circuit board 330 to provide power. The planing equipment includes a handle 360, which the operator can grip to move the planing equipment left and right. The motor 320 drives the planer blade 310 to rotate via a synchronous belt. When the planing equipment moves left and right relative to the workpiece, the planer blade 310 can perform planing operations on the workpiece. An adjustment knob 350 is connected to the movable base plate 210, and the vertical position of the movable base plate 210 can be adjusted by rotating the adjustment knob 350, thereby allowing the planer blade 310 to contact or separate from the workpiece.

[0052] Figure 5 This is a front view of a planing device according to an embodiment of this application (some parts are omitted).

[0053] The chip removal chamber 120 extends in the front-to-back direction, with openings at both its front and rear ends. A sealing member 700 seals one of these openings. For example, in the embodiment shown in the attached figure, the sealing member 700 seals the front opening, allowing chips in the chip removal chamber 120 to be discharged through the rear opening. When the motor 320 drives the impeller 321 connected to its output shaft to rotate, external airflow is drawn into the machine body chamber 110 and then flows into the chip removal chamber 120. Due to the suction force of this airflow, chips generated by planing at the planer blade 310 are drawn upwards into the chip removal chamber 120, flowing backwards with the airflow and being discharged from the rear opening (see reference). Figure 5 (The airflow and debris flow directions are shown).

[0054] The above-mentioned main structure and working principle of the planing equipment are basically existing technologies, so only a brief introduction is given above, and its specific structure will not be elaborated further. The following is an introduction to the relevant content of the invention points of this application.

[0055] See Figure 2 and Figure 3 In some embodiments, the housing 100 has a motor air inlet 140 communicating with the outside at one end along the second direction, the circuit board 330 is located on one side of the peripheral surface of the motor 320, and the blocking member 400 covers at least the area where the circuit board 330 is located in the second direction, wherein the second direction is the axial direction of the motor 320 and the second direction is perpendicular to the first direction.

[0056] Specifically, the second direction is the front-to-back direction shown in the attached diagram. The rear end portion of the outer casing 100 is hollowed out to form a motor air inlet 140. When the motor 320 is operating, external airflow is drawn into the housing chamber 110 through the motor air inlet 140 and flows forward. The circuit board 330 is located to the right of the motor 320. The blocking member 400 at least covers the area where the circuit board 330 is located in the front-to-back direction; that is, the rear end of the blocking member 400 is located behind the rear end of the circuit board 330, or flush with the rear end of the circuit board 330; the front end of the blocking member 400 is located in front of the front end of the circuit board 330, or flush with the front end of the circuit board 330. Thus, when the airflow flows forward within the housing chamber 110, the blocking member 400 can provide good shielding for the area where the circuit board 330 is located, resulting in better debris blocking.

[0057] Furthermore, in some embodiments, one end of the blocking member 400 that is away from the motor air inlet 140 along the second direction extends to connect with or abut against the corresponding area of ​​the housing 100.

[0058] Specifically, from the perspective of the attached drawings, the end of the blocking member 400 facing away from the motor air inlet 140 along the second direction is the front end of the blocking member 400. The front end of the blocking member 400 extends forward to connect with or abut against the inner wall of the front end of the housing 100. In this way, the front area of ​​the circuit board 330 can be effectively blocked, preventing debris sucked in from the air inlet 140 from falling onto the circuit board 330. In addition, after a small amount of debris generated by planing at the planer 310 is sucked upward into the chip discharge chamber 120, if some of the debris enters the area around the impeller 321 in the motor mounting space 111 from the chip discharge chamber 120, the movement range of these debris can be limited because the front end of the blocking member 400 extends forward to connect with or abut against the inner wall of the front end of the housing 100, making it difficult for them to reach the circuit board 330.

[0059] Furthermore, in some embodiments, one end of the blocking member 400 near the motor air inlet 140 along the second direction extends to connect with or abut against the corresponding area of ​​the housing 100, so as to separate the space where the motor 320 is located from the space where the circuit board 330 is located.

[0060] Specifically, from the perspective of the attached drawings, the end of the blocking member 400 near the motor air inlet 140 along the second direction is the rear end of the blocking member 400. The rear end of the blocking member 400 extends rearward to connect with the rear inner wall of the housing 100. In this way, the rear area of ​​the circuit board 330 can be better shielded, preventing debris from falling onto the circuit board 330 from these areas. In this embodiment, the front end of the blocking member 400 is connected to the front inner wall of the housing 100, and the rear end of the blocking member 400 is connected to the rear inner wall of the housing 100, thereby completely separating the motor mounting space 111 and the circuit board mounting space 112. With this configuration, the airflow can only carry debris within the motor mounting space 111 and cannot reach the circuit board mounting space 112, thus preventing it from reaching the circuit board 330, resulting in a better shielding effect. In addition, when the motor mounting space 111 and the circuit board mounting space 112 are completely separated, all the airflow drawn in from the motor air inlet 140 flows into the chip removal chamber 120 and will not be diverted to the circuit board mounting space 112. The airflow drawn in is used to suck up the chips generated by planing at the planer blade 310, resulting in higher suction efficiency.

[0061] See Figure 3 In some embodiments, the blocking member 400 is an arc shape that protrudes outward along the radial direction of the motor 320.

[0062] Specifically, the blocking component 400 does not need to completely surround the outer edge of the motor 320; it only needs to be positioned on the side of the motor 320 near the circuit board 330 to achieve the blocking effect. Preferably, the blocking component 400 is designed as a ring, completely surrounding the outer edge of the motor 320, which provides a better blocking effect. The blocking component 400 can be fixedly installed on the motor 320, or it can be fixedly installed on the housing 100 or other components. When the blocking component 400 is designed as an arc protruding radially outward from the motor 320, it better matches the shape of the motor 320, minimizes the space occupied by the blocking component 400, and provides a better blocking effect.

[0063] Of course, in other embodiments, the blocking member 400 may also be configured as a flat plate or other shapes.

[0064] See Figure 3 In some embodiments, the planing equipment includes an impeller cover 600 connected to the housing 100. An impeller 321 is connected to one end of the motor 320 away from the motor air inlet 140 along a second direction. The impeller cover 600 surrounds the outside of the impeller 321. The end of the impeller cover 600 away from the motor air inlet 140 along the second direction extends to connect with or abut against the housing 100.

[0065] Specifically, the impeller 321 is located at the front end of the motor 320 and coaxially connected to the output shaft of the motor 320. The end of the impeller cover 600 facing away from the motor air inlet 140 along the second direction is its front end, and the front end of the impeller cover 600 extends forward to connect with or abut against the inner wall of the front end of the housing 100. Similar to the blocking member 400 extending forward to connect with or abut against the inner wall of the front end of the housing 100 in the aforementioned embodiment, when the impeller cover 600 is configured in this way, a small amount of debris generated by the planer 310 is sucked upward into the chip discharge chamber 120. If the debris entering the chip discharge chamber 120 then enters the area around the impeller 321 in the motor mounting space 111, the movement range of these debris can be limited because the front end of the impeller cover 600 extends forward to connect with or abut against the inner wall of the front end of the housing 100, making it less likely to reach the circuit board 330.

[0066] See Figure 3 In some embodiments, one end of the impeller cover 600 near the motor inlet 140 along the second direction extends to be integrated with the blocking member 400.

[0067] Specifically, the end of the impeller cover 600 closest to the motor air inlet 140 along the second direction is its rear end, meaning the rear end of the impeller cover 600 extends rearward to be integrated with the blocking member 400. This is similar to the blocking member 400 extending forward to connect with the front inner wall of the outer casing 100 in the aforementioned embodiment, thus achieving greater blocking coverage and better suppressing debris from falling onto the circuit board 330.

[0068] In the above embodiments, the rear end of the impeller cover 600 extends rearward to be integrated with the blocking member 400, which can be considered as the blocking member 400 being formed by the rearward extension of the rear end of the impeller cover 600. In other embodiments, the blocking member 400 may also be formed by a component extending forward from the inner wall of the rear end of the housing 100, or by a component extending rearward from the inner wall of the front end of the housing 100.

[0069] Figure 6 for Figure 5 A front view of the impeller cover and impeller of a medium planing machine.

[0070] See Figures 4 to 6 In some embodiments, the impeller shroud 600 includes a first section 610 and a second section 620 arranged sequentially along the airflow path. The airflow drawn in through the motor inlet 140 can flow into the chip removal chamber 120 sequentially through the first section 610 and the second section 620. The gap between the first section 610 and the impeller 321 is d1, and the gap between the second section 620 and the impeller 321 is d2, where d2 > d1, so that the impeller shroud 600 is volute-shaped.

[0071] Specifically, when the impeller 321 rotates synchronously with the output shaft of the motor 320, a rotating airflow is formed. This airflow flows into the chip removal chamber 120 through the first section 610 and the second section 620 in sequence. A small amount of debris generated by the planer 310 is drawn upwards into the chip removal chamber 120. If this debris then enters the area around the impeller 321 in the motor mounting space 111 from the chip removal chamber 120, the rotating airflow around the impeller 321 will carry these debris into the chip removal chamber 120 and eventually discharge it to the external environment. When d2 and d1 satisfy the aforementioned relationship, the airflow in the second section 620 is further away from the rotation center of the impeller 321, resulting in a greater centrifugal force. This makes it easier to throw the debris back into the chip removal chamber 120, preventing it from entering the next cycle and causing it to continuously rotate around the impeller 321.

[0072] See Figures 4 to 6 In some embodiments, the inner walls of the impeller cover 600 and the outer shell 100 are provided with a limiting groove 630 and a corresponding limiting post 170. The limiting post 170 is inserted into the limiting groove 630 to restrict the rotation of the impeller cover 600.

[0073] Specifically, in the embodiment shown in the attached drawings, a limiting groove 630 is provided on the outwardly protruding boss on the outer wall of the impeller cover 600, and a limiting post 170 is provided at a corresponding position on the outer shell 100. The limiting post 170 is engaged with the limiting groove 630 to limit the impeller cover 600. Of course, in other embodiments, the positions of the limiting post 170 and the limiting groove 630 can be interchanged. The limiting post 170 and the limiting groove 630 can also be added in pairs. When multiple sets of limiting posts 170 and limiting grooves 630 are provided, the position of the impeller cover 600 can be basically fixed, without the need to set other structures between the impeller cover 600 and the outer shell 100 to achieve the fixation of the two.

[0074] The following section will introduce the heat dissipation aspects of circuit board 330 in the planing equipment.

[0075] As previously described, the heat-conducting element 500 is thermally connected to the static base plate 220 and / or the housing 100. In some embodiments, the heat-conducting element 500 is thermally connected to the static base plate 220, allowing heat from the circuit board 330 to be conducted to the static base plate 220 via the heat-conducting element 500, and then dissipated to the external environment. Alternatively, in some embodiments, the heat-conducting element 500 is thermally connected to the housing 100, allowing heat from the circuit board 330 to be conducted to the housing 100 via the heat-conducting element 500, and then dissipated to the external environment. Alternatively, in some embodiments, the heat-conducting element 500 is thermally connected to both the static base plate 220 and the housing 100, allowing heat from the circuit board 330 to be conducted to the static base plate 220 via the heat-conducting element 500, and then dissipated to the external environment; heat from the circuit board 330 can also be conducted to the housing 100 via the heat-conducting element 500, and then dissipated to the external environment.

[0076] See Figures 3 to 4In some embodiments, the heat-conducting element 500 is in contact with the circuit board 330 and the static base plate 220.

[0077] Specifically, from the perspective of the attached drawing, the heat-conducting component 500 is located above the static base plate 220. The heat of the circuit board 330 can be directly transferred to the heat-conducting component 500 in contact with it, and then directly transferred to the static base plate 220 in contact with it through the heat-conducting component 500, thereby dissipating heat to the external environment. The heat conduction efficiency is high and the heat dissipation effect is good.

[0078] In other embodiments, thermally conductive adhesive may be provided between the thermally conductive element 500 and the circuit board 330, and / or between the thermally conductive element 500 and the static base plate 220.

[0079] See Figures 3 to 4 In some embodiments, the heat-conducting element 500 surrounds a receiving groove, the circuit board 330 is installed in the receiving groove, and the circuit board 330 is in contact with at least a portion of the groove wall.

[0080] Specifically, the heat-conducting component 500 forms a receiving groove with an open top, through which the circuit board 330 can be placed. The circuit board 330 is in contact with at least a portion of the groove wall, allowing heat generated at the circuit board 330 to be transferred to the groove wall and then to the stationary base plate 220. Preferably, the shape and dimensions of the receiving groove match the circuit board 330, and the sidewalls and bottom wall of the circuit board 330 are in contact with corresponding areas on the groove wall to increase the heat exchange area and improve heat transfer efficiency.

[0081] See Figures 3 to 4 In some embodiments, the heat-conducting element 500 is located inside the housing 100, the static base plate 220 is located outside the housing 100, the housing 100 is provided with a through groove 150, and one of the static base plate 220 and the heat-conducting element 500 is provided with a protrusion 221 that passes through the through groove 150 and contacts the other.

[0082] Specifically, in the embodiment shown in the attached drawings, the stationary base plate 220 is provided with a protrusion 221 extending toward the heat-conducting component 500, and the protrusion 221 passes through the through groove 150 and contacts the bottom surface of the heat-conducting component 500. Of course, in other embodiments, the protrusion 221 extending toward the stationary base plate 220 can also be provided on the bottom surface of the heat-conducting component 500, and the protrusion 221 passes through the through groove 150 and contacts the top surface of the stationary base plate 220.

[0083] Preferably, in some embodiments, the stationary base plate 220 has a protrusion 221 extending toward the heat-conducting element 500, and the heat-conducting element 500 has a recess that mates with the protrusion 221. The mate between the stationary base plate 220 and the heat-conducting element 500 increases the heat exchange area between them and improves heat transfer efficiency.

[0084] See Figures 3 to 4 In some embodiments, a through groove 150 is provided at the center of the area on the outer casing 100 that contacts the static base plate 220.

[0085] Specifically, the aforementioned through groove 150 is provided at the center of the area on the outer casing 100 above the static base plate 220. Compared to the through groove 150 being located at the end of the outer casing 100, in this embodiment, the through groove 150 is a solid structure on all sides, which can prevent excessive reduction in the strength of the outer casing 100 and improve the structural robustness and stability. Preferably, the through groove 150 is circular to reduce stress concentration.

[0086] Preferably, in some embodiments, the heat-conducting element 500 is made of metal, which conducts heat quickly and accelerates heat dissipation. Further, the heat-conducting element 500 is made of aluminum alloy, which not only conducts heat quickly but is also lightweight.

[0087] Figure 7 for Figure 1 A schematic diagram of the sealing component of a medium planing machine.

[0088] See Figure 2 , Figure 4 , Figure 5 and Figure 7 In some embodiments, the chip removal chamber 120 has a first opening 121 communicating with the space where the planer blade 310 is located, and a second opening 122 communicating with the machine body chamber 110. The planing device includes a blocking member 700 blocking one end of the chip removal chamber 120. The blocking member 700 includes a shielding part 710 extending into the chip removal chamber 120. The shielding part 710 shields the second opening 122, and there is an air inlet gap 160 between the shielding part 710 and the chamber wall of the chip removal chamber 120. The airflow drawn in by the motor 320 can flow into the chip removal chamber 120 through the air inlet gap 160.

[0089] Specifically, the chip removal chamber 120 has a first opening 121 communicating with the planer mounting space 130 and a second opening 122 communicating with the motor mounting space 111. The sealing member 700 can be snapped onto the outer wall of the chip removal chamber 120 via the snap-fit ​​part 720 for detachable installation. The blocking part 710 is located opposite the snap-fit ​​part 720, extending into the chip removal chamber 120 and located in the area of ​​the second opening 122. The blocking part 710 does not completely block the second opening 122, but forms an air inlet gap 160 between itself and the inner wall of the chip removal chamber 120. Figure 2As shown, the airflow drawn in from the motor inlet 140 flows from back to front. After reaching the vicinity of the impeller 321, it bends at the second opening 122 and flows into the air inlet gap 160, then bends again and flows into the chip removal chamber 120. Under the suction of this airflow, the chips generated by planing at the planer blade 310 are drawn upwards and flow into the chip removal chamber 120 from the first opening 121. Afterwards, the airflow carrying the chips flows out from front to back within the chip removal chamber 120.

[0090] In this embodiment, since a shielding part 710 is provided at the second opening 122, a shield can be formed between the motor mounting space 111 and the chip removal chamber 120, preventing the chips generated by the planer 310 during planing from being drawn into the chip removal chamber 120 and then entering the motor mounting space 111 due to airflow turbulence or other reasons.

[0091] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0092] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these modifications and improvements all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A planing device, comprising a housing (100), a handle (360), a moving bottom plate (210) and a static bottom plate (220) arranged in a first direction, a planing tool (310) arranged between the moving bottom plate (210) and the static bottom plate (220), a motor (320) for driving the planing tool (310) to rotate, and a circuit board (330) electrically connected with the motor (320), the housing (100) has a machine cavity (110) and a chip removal cavity (120) communicated with the outside, the motor (320) and the circuit board (330) are arranged in the machine cavity (110), a space where the planing tool (310) is located and the machine cavity (110) are all communicated with the chip removal cavity (120), wherein, The first direction is the moving direction of the planing device, and the planing device further comprises: a blocking piece (400) arranged between the motor (320) and the circuit board (330); a heat conducting piece (500) in thermal connection with the circuit board (330), and the heat conducting piece (500) is in thermal connection with the static bottom plate (220) and / or the shell (100), and heat at the circuit board (330) can be conducted to the static bottom plate (220) and / or the shell (100) through the heat conducting piece (500); wherein one end of the shell (100) in a second direction is provided with a motor air inlet (140) communicated with the outside, the circuit board (330) is located on one side of the peripheral surface of the motor (320), and the blocking piece (400) covers at least the range where the circuit board (330) is located in the second direction, wherein the second direction is the axial direction of the motor (320), and the second direction is perpendicular to the first direction, and the blocking piece (400) separates the space where the motor (320) is located from the space where the circuit board (330) is located.

2. The planing apparatus according to claim 1, characterized in that One end of the blocking piece (400) in the second direction away from the motor air inlet (140) extends to connect with the corresponding area of the shell (100).

3. The planing apparatus according to claim 2, characterized in that One end of the blocking piece (400) in the second direction close to the motor air inlet (140) extends to connect or abut with the corresponding area of the shell (100).

4. The planing apparatus according to any one of claims 1 to 3, characterized in that, The blocking piece (400) is arc-shaped and protrudes outward along the radial direction of the motor (320).

5. The shaving apparatus of claim 1, wherein, The planing device comprises an impeller cover (600) connected to the shell (100), one end of the motor (320) in the second direction away from the motor air inlet (140) is connected with an impeller (321), the impeller cover (600) surrounds the outside of the impeller (321), and one end of the impeller cover (600) in the second direction away from the motor air inlet (140) extends to connect or abut with the shell (100).

6. The planing apparatus according to claim 5, characterized in that One end of the impeller cover (600) in the second direction close to the motor air inlet (140) extends to be integrated with the blocking piece (400).

7. The planing apparatus according to claim 5, characterized in that The impeller cover (600) comprises a first section (610) and a second section (620) arranged in sequence along the airflow flow path, and the airflow sucked in through the motor air inlet (140) can flow into the chip removal chamber (120) through the first section (610) and the second section (620) in sequence, the gap between the first section (610) and the impeller (321) is d1, the gap between the second section (620) and the impeller (321) is d2, and d2>d1, so that the impeller cover (600) is in the shape of a volute.

8. The planing apparatus according to claim 7, characterized in that One of the impeller cover (600) and the inner wall of the shell (100) is provided with a limiting groove (630), and the other is provided with a limiting column corresponding thereto, the limiting column is clamped into the limiting groove (630), so as to limit the rotation of the impeller cover (600).

9. The shaving apparatus of claim 1, wherein, The heat-conducting member (500) is in contact with the circuit board (330), and the heat-conducting member (500) is in contact with the static bottom plate (220).

10. The planing apparatus according to claim 9, characterized in that The heat-conducting member (500) forms a containing groove, the circuit board (330) is installed in the containing groove, and the circuit board (330) is at least partially attached to the groove wall of the containing groove.

11. The planing apparatus according to claim 9, characterized in that The heat-conducting member (500) is located inside the shell (100), the static bottom plate (220) is located outside the shell (100), the shell (100) is provided with a through groove (150), and one of the heat-conducting member (500) and the static bottom plate (220) is provided with a protruding part (221) that passes through the through groove (150) and is in contact with the other.

12. The planing apparatus according to claim 11, characterized in that The static bottom plate (220) is provided with the protruding part (221) that protrudes towards the heat-conducting member (500), and the heat-conducting member (500) is provided with a recessed part that is in concave-convex cooperation with the protruding part (221).

13. The shaving apparatus of claim 11, wherein, The through groove (150) is arranged at the center position of the contact area of the static bottom plate (220) and the shell (100).

14. The shaving apparatus of claim 1, wherein, The material of the heat-conducting member (500) is aluminum alloy.

15. The shaving apparatus of claim 1, wherein, The chip removal chamber (120) has a first opening (121) in communication with the space where the planer knife (310) is located, and a second opening (122) in communication with the machine body chamber (110), the planing device comprises a blocking member blocked at one end of the chip removal chamber (120), the blocking member comprises a shielding part (710) extending into the chip removal chamber (120), the shielding part (710) is shielded at the second opening (122), and the shielding part (710) and the chamber wall of the chip removal chamber (120) have an air inlet gap (160), the airflow sucked by the motor (320) can flow into the chip removal chamber (120) through the air inlet gap (160).

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