Temperature measuring device and temperature measuring system for non-invasive temperature measurement

Abstract

The invention relates to a temperature measuring device (10) for non-invasively measuring a temperature (17) of a medium (14) in a pipe (12). The temperature measuring device (10) comprises a sensor carrier (30) and a thermal coupling element (20) configured for generating a thermal conduction path (47) from a pipe wall (16) of the pipe (12) to a first temperature sensor (32). According to the invention, the thermal coupling element (20) is configured in a layered design with components of different materials for adjusting the thermal conduction path (47). Alternatively or additionally, the thermal coupling element (20) has at least locally an arcuate profile (29) for inverting the thermal conduction path (47) in axial direction. The invention further relates to a temperature measuring system (50) comprising such a temperature measuring device (10). The invention further relates to a computer program product (60) suitable for simulating a behavior of operation of such a temperature measuring device (10).

Description

Technical Field

[0001] This invention relates to a temperature measuring device for non-invasive temperature measurement. It also relates to a temperature measuring system having such a device. Furthermore, it relates to a computer program product for simulating the operational behavior of such a temperature measuring device. Background Technology

[0002] International patent application WO 2019 / 063519 A1 discloses a temperature measuring device that can be installed on a pipe. The device includes two temperature sensors whose measuring tips are mounted at different radial distances from the pipe wall. Here, the measuring tips of the temperature sensors are embedded in an insulating layer to minimize errors caused by heat loss.

[0003] A temperature measuring device is known from reference WO 2017 / 131546 A1. This device includes two temperature sensors that produce individual measurements from which the temperature of the medium in the pipe can be calculated. Here, the thermal resistance of different components is considered.

[0004] Non-invasive temperature measurement is increasingly being used in various application areas, such as the manufacturing industry. Therefore, there is a demand for improved measurement accuracy, reliability, and cost-effectiveness. Similarly, installation-friendly design is sought to enable rapid retrofitting of existing facilities. The object of this invention is to provide a temperature measuring device that offers improvements in at least one of the described aspects. Summary of the Invention

[0005] This task is achieved by a temperature measuring device according to the invention, configured to non-invasively measure the temperature of a medium located in a pipe. The medium can be, for example, a liquid, gas, vapor, a mixture thereof, or a viscous substance. Here, the direction of pipe extension defines the axial direction. The temperature measuring device includes a sensor holder fixed to a thermal coupling element in an installed state. The thermal coupling element is configured to: generate thermally conductive contact with the pipe wall. The thermal coupling element is configured to be at least partially thermally conductive and suitable for defining a heat conduction path. The temperature measuring device also has a first temperature sensor configured to provide a first temperature measurement value. For this purpose, the first temperature sensor can be thermally connected to the thermal coupling element. The thermal coupling element is configured to establish a heat conduction path from the pipe wall to the first temperature sensor. Here, the heat conduction path is a portion of the thermal coupling element and / or the portion along which the heat flow from the pipe wall into the thermal coupling element propagates substantially. For example, heat loss from the thermal coupling element to the environment should not be attributed to the heat conduction path from the pipe wall to the first temperature sensor. This heat loss can be minimized or kept constant, for example, through an insulating layer.

[0006] According to the present invention, the thermal coupling element is configured to adjust the heat conduction path from the pipe wall to the first temperature sensor. This adjustment includes structurally presetting the thermal resistance or thermal conductivity of the heat conduction path via the thermal coupling element.

[0007] According to the present invention, the thermal coupling element is configured to reverse the axial direction of the heat conduction path, i.e., reverse it relative to the axial direction. By reversing the axial direction, the heat conduction path extends in substantially opposite directions at different locations. For this purpose, the thermal coupling element has at least a partially arcuate profile. Here, this profile can be understood in particular as the shape of the thermal coupling element viewed from the side. The axial deflection is achieved by extending the heat conduction path along multiple sections of the profile, i.e., substantially along the main structural axis therethrough. Compared to prior art solutions, this allows for extending the heat conduction path between the pipe wall and the first temperature sensor. Therefore, the thermal resistance present along the heat conduction path can be adjusted to allow for accurate measurement of the medium's temperature. In particular, by designing the thermal coupling element to extend in the axial direction, the heat conduction path can be extended radially in a space-saving manner. Simultaneously, due to the arcuate profile, the extension of the heat conduction path achieved in this way can be realized in a particularly compact manner.

[0008] In one embodiment of the invention, the thermal coupling element can be configured as a layered structure having components made of different materials. Therefore, the layered components, in particular, have different thermal conductivities in the radial direction and define thermal conductivities in pairs between the components. Along the heat conduction path, at least one heat transfer occurs between the pipe wall and the first temperature sensor, within the thermal coupling element between its layered components. Thus, the overall heat conduction path from the pipe wall to the first temperature sensor can be adjusted in terms of thermal conductivity. Thermal conductivity adjusted in this way allows for accurate and non-invasive measurement of the medium temperature.

[0009] In another embodiment of the claimed temperature measuring device, the thermal coupling element has a C-shaped profile, an S-shaped profile, a Z-shaped profile, or a meandering profile. The C-shape can be manufactured in a simple and cost-effective manner. The S-shaped profile provides a significant extension of the heat conduction path while being particularly compact. The Z-shaped profile provides improved mechanical stability, particularly relative to stress in the radial direction of the pipe. The meandering profile provides further improvement in the extension of the heat conduction path. The claimed temperature measuring device has a thermal coupling element, which can therefore be manufactured in a variety of variations, thus providing the technical advantages of the invention. Therefore, the claimed temperature measuring device can be easily adapted to a wide range of applications.

[0010] Additionally, the temperature measuring device can have a second temperature sensor configured to provide a second temperature measurement value. Similar to the first temperature sensor, the second temperature sensor can be thermally connected to a thermal coupling element. Thus, in the installed state, the heat conduction path from the pipe wall around the second temperature sensor is also regulated within the thermal coupling element. Therefore, a heat conduction path exists between the first and second temperature sensors, substantially traversing the thermal coupling element. The first and second temperature sensors can be installed spaced apart from each other. This allows for the formation of an extended heat conduction path with a defined thermal resistance between the first and second temperature sensors. Specifically, the thermal resistance can be configured to enable the temperature measuring device to respond more rapidly to changes in the medium temperature. Similarly, the thermal coupling element can be configured to minimize overshoot when measuring temperature in a non-invasive medium. From a mechanical simulation perspective, the thermal resistance defined by the thermal coupling element acts as both a resistor and a damper. By jointly processing the first temperature measurement value from the first temperature sensor and the second temperature measurement value from the second temperature sensor, the temperature of the medium can be determined with higher accuracy.

[0011] Furthermore, a first temperature sensor can be arranged in a first axial portion of the thermal coupling element to obtain a first temperature measurement value. Correspondingly, a second temperature sensor can be arranged in a second axial portion of the thermal coupling element to obtain a second temperature measurement value. Here, the first or second axial portion is a portion of the thermal coupling element that extends substantially along the axial direction, i.e., along the pipe. In the first or second axial portion, the heat conduction path extends substantially along the axial direction, i.e., parallel to the pipe. The first and second axial portions can be configured to be spaced apart from each other in the radial direction. The first and second axial portions of the thermal coupling element can belong to at least a partially arcuate profile. Thus, the heat flow along the heat conduction path first reaches the second temperature sensor and then reaches the first temperature sensor. Therefore, a defined thermal resistance exists between the first and second temperature sensors, which allows for accurate measurement of the temperature of the medium. The claimed temperature measuring device can also have a third temperature sensor. Thus, the functions of the first and second temperature sensors can be reproduced, thereby enabling the realization of the outlined technical advantages to a greater extent.

[0012] In another embodiment of the claimed temperature measuring device, the thermal coupling element is at least partially made of a material having a temperature-dependent thermal conductivity gradient of up to 0.025 (W / (m*K)) / ℃. A larger thermal conductivity gradient results in more sensitive measurement of the medium temperature. Conversely, a low-valued, temperature-dependent thermal conductivity gradient provides simple and accurate measurement over a wide temperature range. Here, for the first and / or second temperature measurements, this temperature-dependent thermal conductivity gradient can exist in, for example, a range from 0℃ to 1200℃. Therefore, the claimed temperature measuring device achieves further improved measurement accuracy.

[0013] Furthermore, in the claimed temperature measuring device, the thermal coupling element can be made of stainless steel. Stainless steel offers relatively low thermal conductivity compared to other metallic materials. Therefore, an increased thermal resistance is obtained for the heat conduction path to the first or each of the second temperature sensors. Similarly, an increased thermal resistance is also obtained between the first and second temperature sensors. Combined with the temperature-dependent thermal conductivity gradient of stainless steel, higher measurement accuracy is achieved for the first or second temperature measurements. Therefore, the claimed temperature measuring device offers a wide range of possible applications. In addition, stainless steel has improved corrosion resistance and heat resistance, making the claimed temperature measuring device robust and durable even for applications with harsh environmental conditions.

[0014] Furthermore, the side of the thermal coupling element facing the pipe can be configured as a dovetail joint. Here, the side facing the pipe has a recess in the middle region, such that the thermal coupling element, in the installed state, is substantially positioned on two lateral support portions on the pipe, which extend substantially in the axial direction. For this purpose, the recess has, for example, a trapezoidal or irregular quadrilateral profile. Thus, the thermally conductive contact between the pipe wall and the thermal coupling element essentially comprises two line contacts. Therefore, a substantially continuous thermally conductive contact is maintained between the pipe wall and the thermal coupling element across different pipe diameters. Thus, even with different pipe diameters, the claimed temperature measuring device provides accurate, non-invasive temperature measurement.

[0015] Furthermore, the thermal coupling element may have at least one recess in the region facing the pipe. This recess is suitable for threading a fixing mechanism, such as a belt, chain, or retainer. Thus, the fixing mechanism can be guided through the thermal coupling element close to the pipe wall, thereby simplifying installation and counteracting any tilting of the thermal coupling element. In particular, this stabilizes the temperature measuring device during installation. Consequently, even in a reduced structural space, the temperature measuring device requiring protection can be installed quickly and easily. This at least one recess is, for example, formed in the axial portion radially inside the thermal coupling element, which also directly contacts the pipe wall. Furthermore, the reduced volume of the thermal coupling element by the recess further accelerates the response of the temperature measuring device.

[0016] Furthermore, the claimed temperature measuring device can have an axial end portion positioned downstream of the first thermal coupling element and / or the second temperature sensor along the heat conduction path. Here, the axial end portion can be configured as part of a first, second, third, or similar axial portion. The axial end portion ensures that the heat conduction path passes through the first or second temperature sensor substantially without interference. The effects of edge effects on the heat conduction path, such as the configuration of a hot end, are reduced in the region of the first or second temperature sensor, where heat transported along the heat conduction path is output to the environment via convection. The farther the axial end portion is from the first or second temperature sensor, the stronger the minimization of edge effects. Therefore, accurate measurement of the medium temperature can be achieved in a simple manner.

[0017] In the claimed temperature measuring device, the first and / or second temperature sensors can also be configured to be mounted radially along the pipe. For this purpose, the first or second sensor can be configured substantially rod-shaped, for example, as a resistance thermometer. The first and / or second temperature sensors can have a first or second measurement recorder attached to the area facing the pipe, particularly to the pipe-facing end of the respective temperature sensor. Here, the first or second measurement recorder is the part of the respective temperature sensor in direct thermal contact with the thermal coupling element. The first and / or second temperature sensors can also be mounted through holes in the thermal coupling element. This allows for stable installation, easy disassembly for recalibration, and simple replacement of the temperature sensors. Preferably, the first and / or second temperature sensors are each configured as a thin-film resistor, which provides an advantageous thermal connection to the thermal coupling element.

[0018] Alternatively, the first and / or second temperature sensors can be mounted along the axial direction of the pipe. For this purpose, a hole, particularly a blind hole, can be formed in one of the axial portions of the thermal coupling element, extending substantially parallel to the pipe axis. For example, the first temperature sensor can be at least partially accommodated in the first axial portion, and the second temperature sensor can be at least partially accommodated in the second axial portion. Higher measurement accuracy is also achieved through this structure, due to the at least partially arcuate profile of the thermal coupling element, where the thermal resistance extends along the heat conduction path through the first and second axial portions. Therefore, a particularly compact temperature measuring device can be realized in the radial direction using the thermal coupling element according to the invention.

[0019] The basic objective is also achieved by the temperature measurement system according to the invention. This temperature measurement system is configured to measure the temperature of a medium in a pipeline and has a temperature measuring device connected to an evaluation unit. The evaluation unit is configured to receive and evaluate at least one temperature measurement value from the temperature measuring device. The evaluation unit can be housed in a housing fixed to a sensor bracket. Alternatively or additionally, the evaluation unit can also be configured separately and connected to the temperature measuring device via a communication data connection. In particular, the evaluation unit can be implemented at least functionally in an industrial control device, a host computer, and / or a computer cloud. According to the invention, the temperature measuring device is configured according to one of the above embodiments. Thus, the technical advantages of the temperature measuring device can be transferred to the temperature measurement system.

[0020] Similarly, the objective described at the beginning is achieved by a computer program product according to the invention. The computer program product according to the invention is designed to simulate the operational behavior of a temperature measuring device. To this end, the computer program product can include commands that simulate the operational behavior of a temperature measuring device during execution.

[0021] Specifically, the computer program product can be designed to simulate the operating behavior of a temperature measuring device by pre-setting the structure of the temperature measuring device therein, i.e., storing its image. Alternatively, the operating behavior can also be represented by an abstract computational model independent of the spatial structure of the temperature measuring device. Alternatively, the operating behavior can also be derived from a combination of these. According to the invention, the temperature measuring device to be simulated is constructed according to one of the above embodiments. For simulation, the computer program product can have a physical model in which the temperature measuring device is depicted and, for example, the electrical or signal behavior of the temperature measuring device can be adjusted under adjustable operating conditions. Adjustable operating conditions include, for example, the flow rate in the pipe cross-section, the temperature, pressure, and viscosity of the medium in the pipe, the heat transfer behavior of the pipe wall, the heat conduction behavior of the thermal coupling element, and / or convection behavior. For this purpose, the computer program product can have a data interface through which corresponding data can be preset via user input and / or other simulation-oriented computer program products. The computer program product can also have a data interface for outputting simulation results to the user and / or other simulation-oriented computer program products. By means of a computer program product, for example, it is possible to check the reasonableness of temperature measurement values ​​from temperature sensors of a temperature measuring device or other sensor values ​​from facilities in which a temperature measuring device is to be used. This enables, but is not limited to, the identification of faulty sensors, particularly temperature sensors of temperature measuring devices. The invention is based, but is not limited to, on the surprising discovery that the aforementioned methods, such as thermal conduction behavior in thermally coupled elements, can be modeled with increased accuracy with relatively low computational cost. Therefore, the computer program product according to the invention provides a wide range of possibilities for monitoring and / or testing corresponding temperature measuring devices while simultaneously saving computational power. The computer program product can be configured as a so-called digital twin, as described in more detail, for example, in reference US2017 / 286572 A1. The disclosure of US 2017 / 286572 A1 is incorporated herein by reference. The computer program product can be monolithically configured, i.e., executed entirely on a hardware platform. Alternatively, the computer program product can be modularly configured and include multiple subroutines that can execute on separate hardware platforms and collaborate via communication data links. In particular, the computer program product can be configured in a manner that allows execution in a computer cloud. Furthermore, the computer program product according to the invention can, for example, be used to test and / or optimize temperature measurement equipment through simulation in the case of planned retrofits in a facility. Attached Figure Description

[0022] The invention will now be explained in more detail with reference to the various embodiments shown in the accompanying drawings. The drawings should be interpreted as complementary to each other, as the same reference numerals in different drawings have the same technical meaning. Features of the various embodiments can also be combined with each other. Furthermore, the embodiments shown in the drawings can be combined with the features outlined above. The drawings are shown in detail below:

[0023] Figure 1 A partially cut-away side view schematically illustrates the structure of a first embodiment of the temperature measuring device for which protection is claimed;

[0024] Figure 2 A detailed view of the thermal coupling element of a first embodiment of the temperature measuring device to be protected is shown;

[0025] Figure 3 A detailed cross-sectional view of a second embodiment of the temperature measuring device for which protection is claimed is shown. Detailed Implementation

[0026] exist Figure 1 A side view of a schematic structure of a first embodiment of the claimed temperature measuring device 10 is shown in partial cross-section. The temperature measuring device 10 is mounted on a pipe 12 having a diameter 13 and a medium 14 located within it. The pipe 12 extends along a pipe axis 15, which also defines an axial direction 19. A radial direction 18 is defined perpendicular to the axial direction 19. The temperature 17 of the medium 14 can be obtained by the temperature measuring device 10. The temperature measuring device 10 has a thermal coupling element 20, which is detachably fixed to the pipe wall 16 of the pipe 12 by a fixing mechanism 31. Here, the fixing mechanism 31 is configured as a retaining ring. A sensor holding device 30 is attached to the thermal coupling element 20, and a first temperature sensor and a second temperature sensor 32, 34 are housed in the sensor holding device. The first temperature sensor and the second temperature sensor 32, 34 are configured as substantially rod-shaped resistance thermometers, with measurement recorders 33, 35 located at their respective ends. The first temperature sensor 32, via the first measurement recorder 33, is configured to acquire temperature at one location within the thermal coupling element 20, and the second temperature sensor 34, via the second measurement recorder 35, acquires temperature at another location within the thermal coupling element 20. Furthermore, a housing 40 is arranged on the sensor holder 30, housing an evaluation unit 42. The housing 40, with the evaluation unit 42, forms a temperature measurement system 50 with the temperature measuring device 10. The evaluation unit 42 is coupled to the first and second temperature sensors 32 and 34 and is configured to receive a first temperature measurement value 41 or a second temperature measurement value 43 from the temperature sensor, process and evaluate it to determine the temperature 17 of the medium 14. The first temperature measurement value 41 corresponds here to the temperature at the first measurement recorder 33, and the second temperature measurement value 43 corresponds to the temperature at the second measurement recorder 35.

[0027] A heat flow 45 is induced by the temperature 17 present in the medium 14, flowing from the pipe wall 16 of the pipe 12 into the thermal coupling element 20. This heat flow 45 allows for the detection of temperature measurements 41 and 43 that deviate from each other by means of a first temperature sensor and a second temperature sensor 32, 34. Based on these different temperature measurements 41 and 43, the temperature 17 of the medium 14 can be determined. The thermal coupling element 20 has a substantially Z-shaped or S-shaped profile 29 through which the heat flow 45 is guided and deflected. This Z-shaped or S-shaped profile 29 improves the measurement accuracy in determining the temperature 17 of the medium 14. The operational behavior of the temperature measuring device 10 can be simulated by a computer program product 60, which essentially constitutes a digital twin of the temperature measuring device 10.

[0028] exist Figure 2 Detailed description based on Figure 1 The embodiment includes a thermal coupling element 20. The thermal coupling element 20 is positioned on the pipe wall 16 of the pipe 12, allowing a heat flow 45 to enter the thermal coupling element 20 from the pipe wall 16. The heat flow 45 enters from the pipe wall 16 into a second axial portion 24 of the thermal coupling element 20, which is in thermal contact with the pipe wall 16. A recess 21 is formed in the second axial portion 24, which is adapted to allow the insertion of a fixing mechanism 31, such as... Figure 1 As shown. The second axial portion 24 is incorporated into the first axial portion 22 in the radial direction 18. The first axial portion and the second axial portions 22, 24 are separated from each other by a recessed separation gap 23. Similarly, a transition is formed between the first axial portion 22 and the third axial portion 26, wherein the first axial portion 22 is also separated from the third axial portion 26 by a recessed separation gap 23. This forms a substantially Z-shaped or S-shaped profile 29 of the thermal coupling element 20. Thus, in the second axial portion 24, a substantially axial heat conduction path 47 is applied for the heat flow 45. In the transition from the second axial portion 24 to the first axial portion 22, the heat flow 45 is further deflected, and thus the heat conduction path 47 is further deflected. The transition between the first axial portion and the second axial portions 22, 24 forms an arc shape, and the heat conduction path 47 follows this arc shape. In the first axial portion 22, the heat conduction path 47 extends substantially along the axial direction 19. The heat conduction path 47 in Figure 2The direction indicated by the arrow is opposite in the first axial portion 22 to the direction in the second axial portion 24. Therefore, the reversal 25 of the heat conduction path 47 occurs between the first and second axial portions 22 and 24. Similarly, the reversal 25 of the heat conduction path 47 also occurs during the transition from the first axial portion 22 to the third axial portion 26. The heat flow 45 travels along the heat conduction path 47 radially away from the pipe wall 18 in the direction 18, but here extends in the alternating axial direction 19. Based on this, the heat conduction path 47 is extended by the profile 29 of the thermal coupling element 20. The separation gap 23 is filled with an insulating material, particularly air, such that heat transfer by convection from the second axial portion 24 to the first axial portion 22 or from the first axial portion 22 to the third axial portion 26 can be substantially negligible.

[0029] A hole 27 is formed in the thermal coupling element 20, and the hole extends substantially in the radial direction 18. A first temperature sensor or a second temperature sensor 32, 34 can be accommodated in the hole 27, respectively. Figure 1 As shown in the diagram. A hole 27 for accommodating the first temperature sensor 32 is provided as a blind hole terminating in the first axial portion 22. In the installed state, the first measurement recorder 33 at the first temperature sensor 32 is therefore in thermally conductive contact with the first axial portion 22 of the thermal coupling element 20. A hole 27 for accommodating the second temperature sensor 34 is provided as a blind hole terminating in the second axial portion 24. In the installed state, the second measurement recorder 35 at the second temperature sensor 34 is in thermally conductive contact with the second axial portion 24. Therefore, the heat flow 45 reaching the second measurement recorder 35 also reaches the first measurement recorder 33. The thermal coupling element 20 is made of stainless steel. Due to the contour 29 of the thermal coupling element 20, a defined heat conduction path 47 exists between the first measurement recorder 33 (i.e., the first temperature sensor 32) and the second measurement recorder 35 (i.e., the second temperature sensor 34). Thus, as Figure 1 As shown, the temperature 17 of the medium 14 can be determined with higher accuracy. Through deflection 25 from the first axial portion 22 to the third axial portion 26, the heat flow 45, and thus the heat conduction path 47, is further deflected along the axial direction 19. Consequently, an edge effect of the heat conduction path 47 exists in the region of the end axial portion 38 of the third axial portion 26. This also ensures the defined heat conduction path 47 within the region of the first measurement recorder 33. Figure 2 The thermal coupling element 20 shown can be simulated in the computer program product 60 in its operating behavior, which is the propagation of heat flow 45 and, consequently, the shape of heat conduction path 47. For this purpose, the computer program product 60 is essentially configured as a digital twin of the temperature measuring device 10, which includes... Figure 2 Thermal coupling element 20.

[0030] exist Figure 3 The image depicts a cross-section of a thermal coupling element 20 according to a second embodiment of the present invention. The thermal coupling element 20 belongs to a temperature measuring device 10 mounted on the wall 16 of a pipe 12. The pipe 12 is filled with a medium 14, and the temperature 17 of the medium is obtained using the temperature measuring device 10. The thermal coupling element 20 has a substantially centered recess in its second axial portion 24 on a side 28 facing the pipe 12. Two support portions 37 are formed through this recess, via which the thermal coupling element 20 is supported at the pipe wall 16. Thermally conductive contact is established between the thermal coupling element 20 and the pipe wall 16 via the support portions 37. The support portions 37 form thermally conductive contact with the pipe wall 16 via line contacts 49. Therefore, heat flow 45 from the pipe wall 16 into the thermal coupling element 20 is carried through the line contacts 49. Thus, a substantially constant contact surface exists even if the pipe diameter 13 is different. Furthermore, the thermal coupling element 20 can be easily installed at pipes 12 with different diameters 13 via the substantially centered recess 36. The recess 36 forms a dovetail joint 39 on the side 28 facing the pipe 12. Therefore, the recess 36 has a substantially trapezoidal or irregular quadrilateral profile. Thus, within the scope of the modification, the temperature measuring device 10 that requires protection can be quickly attached to different pipes 12. When the thermal coupling element 20 is reinstalled on the pipe wall 16, the thermal effect of the offset of the thermal coupling element 20 relative to its previous position is minimized. In particular, the thermal coupling element 20 can be reinstalled without recalibration. The operating behavior of the temperature measuring device 10 can be simulated by a computer program product 60 (not shown in detail), which is essentially a digital twin of the temperature measuring device 10, and the heat flow 45 entering the thermal coupling element 20 from the pipe wall 16 is part of this operating behavior.

Claims

1. A temperature measuring device (10) for non-invasively measuring the temperature (17) of a medium (14) in a pipe (12), the temperature measuring device comprising a first temperature sensor (32), a sensor support (30), and a thermal coupling element (20), the thermal coupling element being configured to generate a heat conduction path (47) from the pipe wall (16) of the pipe (12) to the first temperature sensor (32), the first temperature sensor being configured to provide a first temperature measurement (41), characterized in that, The thermal coupling element (20) has an arcuate profile (29) for at least partially adjusting the heat conduction path (47) to achieve axial reversal of the heat conduction path (47), wherein the axial reversal is related to the axial direction defined by the extension direction of the pipe (12).

2. The temperature measuring device (10) according to claim 1, characterized in that, In order to regulate the heat conduction path (47), the thermal coupling element (20) is implemented as a layered design with components made of different materials.

3. The temperature measuring device (10) according to claim 1 or 2, characterized in that, The thermal coupling element (20) has a C-shaped profile, an S-shaped profile, a Z-shaped profile, or a meandering profile.

4. The temperature measuring device (10) according to claim 1 or 2, characterized in that, The temperature measuring device (10) has a second temperature sensor (34).

5. The temperature measuring device (10) according to claim 4, characterized in that, The first temperature sensor (32) is arranged in the first axial portion (22) of the thermal coupling element (20) to acquire a first temperature measurement value (41), and the second temperature sensor (34) is arranged in the second axial portion (24) of the thermal coupling element (20) to acquire a second temperature measurement value (43).

6. The temperature measuring device (10) according to claim 1 or 2, characterized in that, The thermal coupling element (20) is at least partially composed of components having a numerical value up to 0.025 (W / (m²)). It is made of a material with a temperature-dependent thermal conductivity gradient of K)) / °C.

7. The temperature measuring device (10) according to claim 6, characterized in that, The material is stainless steel.

8. The temperature measuring device (10) according to claim 1 or 2, characterized in that, The side (28) of the thermal coupling element (20) facing the pipe (12) is implemented as a dovetail joint.

9. The temperature measuring device (10) according to claim 1 or 2, characterized in that, A recess (21) for threading fastening device (31) is provided in the region of the thermal coupling element (20) facing the pipe (12).

10. The temperature measuring device (10) according to claim 4, characterized in that, The thermal coupling element (20) has an end axial portion (38) positioned downstream of the first temperature sensor and / or the second temperature sensor (34) along the heat conduction path (47).

11. The temperature measuring device (10) according to claim 4, characterized in that, The first temperature sensor and / or the second temperature sensor (32, 34) can be installed in the radial direction (18) of the pipe (12).

12. The temperature measuring device (10) according to claim 4, characterized in that, The first temperature sensor and / or the second temperature sensor can be installed along the axial direction (19) of the pipe (12).

13. A temperature measurement system (50), comprising a temperature measurement device (10) coupled to an evaluation unit (40), characterized in that, The temperature measuring device (10) shall be implemented according to any one of claims 1 to 12.

14. A computer program product (60) for simulating the operation of a temperature measuring device (10) installed on a pipe (12), the temperature measuring device being used to measure the temperature (17) of a medium (14) located in the pipe, characterized in that, The temperature measuring device (10) is implemented according to any one of claims 1 to 12, wherein the computer program product (60) is implemented as a digital twin of the temperature measuring device (10).

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