Chip detection fixing device, chip detection equipment and fixing method

Abstract

The present application relates to the technical field of chip detection fixtures, and in particular to a chip detection fixture, a chip detection device, and a fixing method. The thin film film is supported by a first protrusion so that a gap is formed between the thin film film and a reference part. The thin film film is at least partially fitted to the reference surface by a negative pressure device. The negative pressure device suspends the air extraction, and the thin film film rebounds under the action of its own tension, so that the gas in the first space enters the space between the thin film film and the reference part under the action of the rebound of the thin film film, so that a gap is formed again between the thin film film and the reference part. The negative pressure device extracts air again, and the gas between the thin film film and the reference part is exhausted through the gap formed again, so that the thin film film is completely fitted to the reference surface. The space between the thin film film and the reference part is evacuated from the peripheral side of the thin film film and the reference part, so that the thin film film is completely fitted to the reference surface. In this way, the thin film film can be effectively sucked flat without affecting the chip detection.

Description

Technical Field

[0001] The present application relates to the technical field of chip detection and fixing devices, and in particular to a chip detection and fixing device, a chip detection equipment and a fixing method. Background Art

[0002] After the chip is cut into independent particles, each independent chip is regularly arranged and positioned on a flat film frame through a transfer and expansion mechanism. The chip is fixed and positioned by the film frame so that visual imaging can effectively detect scratches, damage, defects and other defects of chip particles.

[0003] In the process of chip inspection, since the metallographic objective lens of visual imaging has a large magnification and a short depth of field, the expansion film that fixes the chip needs to have a flat reference surface. The film is a thin-walled material with soft properties, so vacuum adsorption is required to ensure that the film can effectively fit with the base surface of the glass table, thereby ensuring the flatness of the film. At present, the glass table is usually made into a microporous vacuum suction cup structure to adsorb the entire surface of the film to achieve the effect of sucking the film flat.

[0004] However, it is difficult to process the glass table with a microporous structure on the entire surface, and it will affect the structural strength of the glass table. If microporous structures exist on the base surface, it will also interfere with the imaging effect of the transmitted light.

[0005] It can be seen that how to effectively flatten the thin film without affecting chip detection is a technical problem that needs to be solved urgently. Summary of the invention

[0006] The present application provides a chip detection fixing device, a chip detection equipment and a fixing method, which are intended to solve the technical problem in the prior art of how to effectively flatten a thin film without affecting chip detection.

[0007] The present application provides a chip detection fixing device, which fixes the chip to be tested by fixing a thin film film loaded with the chip to be tested, and includes:

[0008] Seat assembly;

[0009] An adjusting ring, the adjusting ring is mounted on the seat assembly, the adjusting ring comprises an annular body and a first protrusion, the first protrusion is annular in shape, and the inner wall of the annular body is within the annular range of the first protrusion;

[0010] A reference member, wherein the reference member is provided with a reference surface, the bearing direction of the reference surface is in the same direction as the protruding direction of the first protrusion, the reference surface is located within the annular range of the first protrusion, the height of the reference surface is lower than the protruding height of the first protrusion, and the side wall of the reference member is adapted to the inner wall of the annular body, so that a first space is formed between the reference member and the adjusting ring;

[0011] A negative pressure device, the negative pressure device is used to form a negative pressure in the first space;

[0012] Wherein, the first space is communicated with the upper space of the reference surface.

[0013] Furthermore, the seat assembly is provided with a first bearing surface and a second bearing surface;

[0014] The adjusting ring is provided with an adjusting member, the adjusting member at least partially extends out of the adjusting ring, the extending direction of the adjusting member is toward the first bearing surface, and the adjusting member abuts against the first bearing surface;

[0015] The reference member is provided with an abutting surface, and the abutting surface abuts against the second bearing surface;

[0016] Wherein, the extending direction of the adjusting member is away from the bearing direction of the second bearing surface, and the extending length of the adjusting member is adjustable.

[0017] Furthermore, the adjustment ring is provided with a second protrusion, the second protrusion is annular in shape, the second protrusion is adapted to the outer wall of the seat body assembly, a second space is formed between the adjustment ring and the seat body assembly, the second space is within the annular range of the second protrusion, and the second space is connected to the first space.

[0018] Furthermore, the adjustment ring is provided with at least two first air holes, which are distributed in a circular array along the central axis of the annular body, and the first air holes are connected to the first space, and the negative pressure device forms a negative pressure in the first space through the first air holes.

[0019] Furthermore, one of the seat assembly and the adjustment ring includes a magnet, and the other of the seat assembly and the adjustment ring includes a magnetic conductive member, and the magnet can attract the magnetic conductive member.

[0020] Furthermore, the chip detection and fixing device provided by the present application also includes a rotation mechanism, and the rotation mechanism includes:

[0021] A gear plate assembly, wherein the gear plate assembly is connected to the seat assembly;

[0022] A driving device drives the gear plate assembly to rotate, so that the seat assembly drives the adjusting ring and the reference member to rotate.

[0023] Furthermore, a chip detection and fixing device provided by the present application further includes a backlight assembly, wherein the backlight assembly includes a light-emitting assembly;

[0024] The base assembly is provided with a light-transmitting channel, and the light emitted from the light-emitting assembly is transmitted from the light-transmitting channel to the reference member, and the reference member is light-transmitting at least within the range of the reference plane.

[0025] Furthermore, the backlight assembly further comprises a diffusion plate, and the light emitted by the light emitting assembly at least passes through the diffusion plate and then reaches the reference member.

[0026] On the other hand, the present application also provides a chip detection device, including the above-mentioned chip detection fixture, wherein the chip detection fixture is used to fix the chip to be tested.

[0027] On the other hand, the present application also provides a fixing method, which is implemented using the above-mentioned chip detection fixing device and includes the following steps:

[0028] The film film is placed on the chip detection fixture, and the first protrusion supports the film film so that a first gap is formed between the film film and the reference piece;

[0029] The negative pressure device evacuates air to exhaust the first gap, thereby making the film at least partially adhere to the reference surface;

[0030] The negative pressure device stops pumping air to allow the film to rebound, thereby forming a second gap between the film and the reference member;

[0031] The negative pressure device evacuates air again to exhaust the second gap, thereby making the film completely adhere to the reference surface.

[0032] The beneficial effects achieved by this application are:

[0033] The present application proposes a chip detection fixture, which fixes the chip to be tested by fixing a thin film film loaded with the chip to be tested. The thin film film loaded with the chip to be tested is placed on the chip detection fixture, and the thin film film is supported by a first protrusion so that a gap is formed between the thin film film and the reference part. The negative pressure device is used to evacuate air, so that the thin film film is at least partially in contact with the reference surface. The negative pressure device suspends the evacuation, and the thin film film rebounds under the action of its own tension, so that the gas in the first space enters the space between the thin film film and the reference part under the action of the rebound of the thin film film, so that a gap is formed again between the thin film film and the reference part. The negative pressure device evacuates air again, and then the gas between the thin film film and the reference part is exhausted through the gap formed again, so that the thin film film is completely in contact with the reference surface. The space between the thin film film and the reference part is evacuated from the peripheral side of the thin film film and the reference part, so that the thin film film is completely in contact with the reference surface. In this way, the thin film film can be effectively sucked flat without affecting the chip detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 Schematic diagram of the three-dimensional structure of the chip detection and fixing device in an embodiment of the present invention;

[0035] Figure 2 is a schematic diagram of a three-dimensional structure in which a thin film film is placed on a chip detection fixture in an embodiment of the present invention;

[0036] Figure 3 is a schematic diagram of the exploded structure of the chip detection and fixing device in an embodiment of the present invention;

[0037] Figure 4 is a cross-sectional view of a chip detection fixture in an embodiment of the present invention;

[0038] Figure 5 is a cross-sectional view of a film sheet placed on a chip detection fixture in an embodiment of the present invention;

[0039] Figure 6 It is a cross-sectional view of a film film placed on a chip detection fixture in an embodiment of the present invention when the gas in the gap is not completely exhausted after being evacuated by a negative pressure device;

[0040] Figure 7 is a cross-sectional view of the film and the reference member when they are attached to each other in the embodiment of the present invention;

[0041] Figure 8 In the embodiment of the present invention Figure 5 Magnified view at A in the middle;

[0042] Fig. 9 In the embodiment of the present invention Figure 5 Magnified view at B in the middle;

[0043] Fig.10Detailed description of the invention Figure 1 is a flow chart of a fixing method in an embodiment of the present invention.

[0044] Description of main component symbols:

[0045] 100. Chip detection fixture; 10. Base assembly; 11. First bearing surface; 12. Second bearing surface; 13. Second air hole; 14. Light transmission channel; 15. Magnet; 20. Adjustment ring; 21. Ring body; 22. First protrusion; 23. Second protrusion; 24. First air hole; 25. Adjustment member; 26. Magnetic member; 30. Reference member; 31. Reference surface; 32. Abutment surface; 41. First space; 42. Second space; 43. Gap; 50. Negative pressure device; 51. High-speed air source solenoid valve; 52. Pipeline; 60. Rotation mechanism; 61. Gear plate assembly; 62. Drive device; 63. Drive motor; 64. Transmission gear assembly; 70. Backlight assembly; 71. Light emitting assembly; 72. Diffuser; 81. Photoelectric sensor; 82. Position sensor; 90. Thin film; 91. Chip to be tested. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. In addition, it should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0047] In the description of the present invention, it is necessary to understand that the terms "length", "width", "up", "down", "left", "right", "horizontal", "top", "bottom", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0048] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0049] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0050] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0051] The disclosure below provides many different embodiments or examples to realize different structures of the present invention. In order to simplify the disclosure of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the examples of various specific processes and materials provided by the present invention, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0052] See also Figures 1 to 4 In some embodiments of the present application, a chip detection fixture 100 provided in the present application fixes the chip to be tested 91 by fixing a thin film film 90 loaded with the chip to be tested 91, and includes a seat assembly 10, an adjustment ring 20, a reference part 30 and a negative pressure device 50.

[0053] The adjusting ring 20 is mounted on the seat assembly 10 . The adjusting ring 20 includes an annular body 21 and a first protrusion 22 . The first protrusion 22 is annular in shape. The inner wall of the annular body 21 is within the annular range of the first protrusion 22 .

[0054] The reference member 30 is provided with a reference surface 31, the bearing direction of the reference surface 31 is in the same direction as the protruding direction of the first protrusion 22, the reference surface 31 is located within the annular range of the first protrusion 22, the height of the reference surface 31 is lower than the protruding height of the first protrusion 22, and the side wall of the reference member 30 is matched with the inner wall of the annular body 21, so that a first space 41 is formed between the reference member 30 and the adjustment ring 20. The negative pressure device 50 is used to form a negative pressure in the first space 41.

[0055] The first space 41 is communicated with the upper space of the reference surface 31 .

[0056] The film film 90 loaded with the chip 91 to be tested is placed on the chip detection fixture 100 , and the film film 90 is supported by the first protrusion 22 so that a gap 43 is formed between the film film 90 and the reference piece 30 .

[0057] The negative pressure device 50 is used to evacuate the gas in the gap 43 , thereby reducing the air pressure in the space between the film 90 and the reference member 30 , and then under the action of the atmospheric pressure, the film 90 is at least partially attached to the reference surface 31 .

[0058] The negative pressure device 50 stops pumping air, and the thin film 90 rebounds under its own tension, so that the gas in the first space 41 enters the space between the thin film 90 and the reference member 30 under the rebound effect of the thin film 90, so that the gap 43 is formed between the thin film 90 and the reference member 30 again.

[0059] The negative pressure device 50 evacuates air again, and then exhausts the air between the film film 90 and the reference part 30 through the gap 43 formed again, so that the film film 90 is completely attached to the reference surface 31. The space between the film film 90 and the reference part 30 is evacuated from the peripheral side of the film film 90 and the reference part 30, so that the film film 90 is completely attached to the reference surface 31. In this way, the film film 90 can be effectively sucked flat without affecting the chip detection.

[0060] It should be noted that if the film film 90 is still not completely in contact with the reference surface 31 after two vacuuming operations, the negative pressure device 50 may repeatedly perform a “pause-vacuuming” cycle until the film film 90 is completely in contact with the reference surface 31 .

[0061] Understandably, see Figures 4 to 5 ,and Figures 8 to 9After the film film 90 loaded with the chip 91 to be tested is placed on the chip detection fixture 100, the film film 90 is supported by the first protrusion 22. The height of the first protrusion 22 is higher than the height of the reference surface 31, and the protruding direction of the first protrusion 22 is in the same direction as the bearing direction of the reference surface 31. Therefore, under the tension of the film film 90 itself, a gap 43 can be formed between the film film 90 and the reference piece 30.

[0062] The first protrusion 22 is annular in shape, and the inner wall of the annular body 21 is within the annular range of the first protrusion 22. The side wall of the reference part 30 is matched with the inner wall of the annular body 21. Therefore, a first space 41 can be formed between the adjustment ring 20 and the reference part 30, and the first space 41 is an annular space surrounding the reference part 30.

[0063] The first space 41 is connected to the upper space of the reference surface 31. Therefore, after the gap 43 is formed between the thin film film 90 and the reference member 30, the first space 41 is connected to the gap 43 formed between the thin film film 90 and the reference member 30, and the gap 43 is surrounded by the first space 41.

[0064] See also Figure 6 When the negative pressure device 50 forms a negative pressure in the first space 41, the gas in the gap 43 flows into the first space 41 and is pumped out by the negative pressure device 50. During the pumping process of the negative pressure device 50, the air pressure in the first space 41 and the air pressure in the gap 43 both decrease, and then under the action of the atmospheric pressure, the film 90 is at least partially attached to the reference member 30.

[0065] Since the gas in the gap 43 flows from the circumferential direction into the first space 41, the gas at the edge of the gap 43 first enters the first space 41, and the gas in the center of the gap 43 first flows to the edge of the gap 43 and then enters the first space 41. Therefore, the pressure drop speed at the edge of the gap 43 is faster than the pressure drop speed at the center of the gap 43, which causes the portion of the thin film 90 close to the first space 41 to approach the reference member 30 first.

[0066] In some cases, the gas in the central space of the gap 43 has not yet had time to flow out completely, and the portion of the thin film film 90 close to the first space 41 is in contact with the reference part 30, which prevents the gas in the gap 43 from flowing into the first space 41. That is, the gas in the gap 43 is confined in the space of the gap 43 by the thin film film 90 and the reference part 30.

[0067] In this case, the negative pressure device 50 stops pumping air, and then the tension of the film film 90 overcomes the atmospheric pressure, so that the film film 90 is separated from the reference member 30. At this time, the gas in the first space 41 flows back to the space between the film film 90 and the reference member 30, so that the film film 90 can be separated from the reference member 30 smoothly.

[0068] When the film film 90 is separated from the reference member 30, a gap 43 is formed again between the film film 90 and the reference member 30, thereby connecting the first space 41 with the space in the gap 43. At this time, the negative pressure device 50 evacuates air again, thereby causing the gas in the gap 43 to continue to flow into the first space 41 and be evacuated by the negative pressure device 50.

[0069] See also Figure 7 , since the gas in the first space 41 flows back to the space between the thin film 90 and the reference part 30, no external gas is added to the first space 41 and the space in the gap 43, that is, the gas in the first space 41 is sucked into the space between the thin film 90 and the reference part 30 by the tension of the thin film 90. Therefore, the total amount of gas in the space formed by the first space 41 and the space in the gap 43 is reduced, and its air pressure is lower than the external air pressure. At this time, the negative pressure device 50 evacuates air again, which will reduce the gas in the space formed by the first space 41 and the space in the gap 43 again, or even exhaust it. If the gas in the space formed by the first space 41 and the space in the gap 43 is reduced again, the bubble space formed between the thin film 90 and the reference part 30 will be reduced; if the gas in the space formed by the first space 41 and the space in the gap 43 is exhausted, the bubble space formed between the thin film 90 and the reference part 30 will disappear, that is, the thin film 90 and the reference part 30 are completely attached.

[0070] In this way, the film 90 can be effectively sucked flat without affecting chip detection.

[0071] Understandably, see Figure 1 to Figure 2 , the chips cut into independent particles are loaded and fixed by the thin film film 90, and then the chip to be tested 91 is accurately positioned, the chip to be tested 91 is protected from damage, the detection outflow is simplified, and the detection efficiency is improved. However, the thin film film 90 is a thin-walled material with soft properties, so it cannot form a good detection plane. The reference piece 30 made of hard material supports the thin film film 90, and the reference surface 31 is made on the reference piece 30. The thin film film 90 can be effectively attached to the reference surface 31 by exhausting air, so that the chip to be tested 91 on the thin film film 90 is on the same plane, so that the chip to be tested 91 can be effectively detected.

[0072] See also Figures 4 to 9In some embodiments of the present application, the seat assembly 10 is provided with a first bearing surface 11 and a second bearing surface 12. The adjusting ring 20 is provided with an adjusting member 25, and the adjusting member 25 at least partially extends out of the adjusting ring 20, and the extending direction of the adjusting member 25 is toward the first bearing surface 11, and the adjusting member 25 abuts against the first bearing surface 11. The reference member 30 is provided with an abutting surface 32, and the abutting surface 32 abuts against the second bearing surface 12. The extending direction of the adjusting member 25 is away from the bearing direction of the second bearing surface 12, and the extending length of the adjusting member 25 is adjustable.

[0073] The abutting surface 32 abuts against the second bearing surface 12, thereby making the reference member 30 abut against the seat assembly 10, thereby making the distance between the reference surface 31 and the seat assembly 10 remain unchanged. By making the adjusting member 25 extend in a direction away from the bearing direction of the second bearing surface 12 and making the adjusting member 25 abut against the first bearing surface 11, the extension length of the adjusting member 25 can be adjusted, and then the distance between the first protrusion 22 and the seat assembly 10 can be adjusted by adjusting the extension length of the adjusting member 25. Since the distance between the reference surface 31 and the seat assembly 10 remains unchanged, and the distance between the first protrusion 22 and the seat assembly 10 can be adjusted by the adjusting member 25, the distance between the first protrusion 22 and the reference surface 31 can be adjusted by the adjusting member 25.

[0074] After the film film 90 loaded with the chip to be tested 91 is placed in the chip detection fixture 100, the film film 90 is supported by the first protrusion 22. The protrusion height of the first protrusion 22 is higher than the height of the reference surface 31, so a gap 43 can be formed between the film film 90 and the reference surface 31. The size of the gap 43 can be adjusted by adjusting the distance between the first protrusion 22 and the reference surface 31 through the adjustment member 25.

[0075] It is understandable that the larger the gap 43 between the thin film film 90 and the reference surface 31, the greater the distance that the thin film film 90 moves toward the reference surface 31 to fit with the reference surface 31, and the longer the time consumed in this process. The longer the time required for the thin film film 90 to move to fit with the reference surface 31, the more gas in the gap 43 will be sucked out of the gap 43 space. To a certain extent, a larger gap 43 is conducive to the complete fit of the thin film film 90 and the reference surface 31. However, the larger the gap 43 between the thin film film 90 and the reference surface 31, the greater the total amount of gas in the gap 43 space. Therefore, the longer the time required to exhaust the gas in the gap 43. To a certain extent, a larger gap 43 is not conducive to the complete fit of the thin film film 90 and the reference surface 31. It can be seen from the above phenomenon that the gap 43 between the thin film film 90 and the reference surface 31 should not be too large or too small. The size of the gap 43 between the film film 90 and the reference surface 31 is adjusted by the adjusting member 25, so that the size of the gap 43 is within the expected range, so that the bonding effect between the film film 90 and the reference surface 31 meets the expected requirements. The size of the gap 43 between the film film 90 and the reference surface 31 can be adjusted by the adjusting member 25 by means of calculation, measurement, debugging, etc., so that the bonding effect between the film film 90 and the reference surface 31 meets the expected requirements.

[0076] See also Figure 2 and Fig. 9 In some embodiments of the present application, the adjusting member 25 may include an adjusting screw, and the adjusting ring 20 may be provided with a screw hole. The screw hole is adapted to the adjusting screw, and the adjusting screw is installed in the screw hole. The adjusting screw partially extends out of the adjusting ring 20, and the adjusting screw is connected to the first bearing surface 11.

[0077] By turning the adjusting screw, the length of the adjusting screw extending out of the adjusting ring 20 is adjusted, and the distance between the adjusting ring 20 and the seat body assembly 10 is adjusted, thereby adjusting the distance between the first protrusion 22 and the seat body assembly 10, and then adjusting the distance between the first protrusion 22 and the reference surface 31, thereby adjusting the size of the gap 43 between the film film 90 and the reference surface 31, so that the fitting effect between the film film 90 and the reference surface 31 meets the expected requirements.

[0078] See also Figure 2 In some embodiments of the present application, the number of screw holes is at least three, and an adjusting screw is installed in each screw hole.

[0079] The adjusting ring 20 is supported by at least three adjusting screws, so that the force on the adjusting ring 20 is more uniform, and the adjusting screws can adjust the parallelism between the plane where the top of the first protrusion 22 is located and the reference plane 31, thereby ensuring the detection effect of the chip 91 to be tested.

[0080] See also Figures 4 to 9 In some embodiments of the present application, the adjustment ring 20 is provided with a second protrusion 23, the shape of the second protrusion 23 is annular, the second protrusion 23 is adapted to the outer wall of the seat body assembly 10, and a second space 42 is formed between the adjustment ring 20 and the seat body assembly 10. The second space 42 is within the annular range of the second protrusion 23, and the second space 42 is connected to the first space 41.

[0081] The inner wall of the second protrusion 23 is adapted to the outer wall of the seat body assembly 10, and the outer wall of the seat body assembly 10 is used to limit the adjustment ring 20 in the radial direction to avoid misalignment between the adjustment ring 20 and the seat body assembly 10. The adjustment ring 20 can move axially relative to the seat body assembly 10 under the guidance of the outer wall of the seat body assembly 10, thereby ensuring the effect of the adjustment member 25 in adjusting the distance between the first protrusion 22 and the reference surface 31.

[0082] By making the second space 42 formed between the adjusting ring 20 and the seat assembly 10, the side wall of the reference member 30 is matched with the inner wall of the adjusting ring 20, the reference member 30 is in contact with the second bearing surface 12, and the second protrusion 23 is matched with the outer wall of the seat assembly 10, so as to ensure the airtightness of the second space 42. By making the second space 42 communicate with the first space 41, so that when the gas in the first space 41 flows back to the gap 43 between the thin film film 90 and the reference member 30, the gas in the second space 42 can be supplemented into the first space 41, so that the gas in the first space 41 can enter the gap 43 between the thin film film 90 and the reference member 30 more smoothly and quickly, so that a channel connecting the middle area of ​​the gap 43 can be formed between the thin film film 90 and the reference member 30 more smoothly and quickly. By vacuuming the negative pressure device 50 again, the gas between the thin film film 90 and the reference part 30 is completely exhausted, so that the thin film film 90 and the reference part 30 are completely attached to each other, thereby ensuring the detection effect of the chip 91 to be tested.

[0083] See also Figures 1 to 3 In some embodiments of the present application, the negative pressure device 50 includes a high-speed air source solenoid valve 51.

[0084] The air path of the negative pressure device 50 is quickly opened and closed through the high-speed air source solenoid valve 51, so that the negative pressure device 50 can perform a "vacuum-pause-vacuum" cycle, so that the negative pressure device 50 can quickly exhaust the gas between the thin film film 90 and the reference part 30, so that the thin film film 90 can quickly fit with the reference part 30, and ensure that the fitting effect of the thin film film 90 and the reference part 30 meets the expected requirements.

[0085] In some embodiments of the present application, the chip detection fixture 100 may be equipped with a self-contained air extraction device, or may be connected to an external negative pressure gas source through a pipeline 52. The air extraction action is then achieved through the air extraction device or the external negative pressure gas source.

[0086] In some embodiments of the present application, the adjustment ring 20 is provided with at least two first air holes 24, and the first air holes 24 are distributed in a circular array along the central axis of the annular body 21. The first air holes 24 are connected to the first space 41, and the negative pressure device 50 forms a negative pressure in the first space 41 through the first air holes 24.

[0087] The negative pressure device 50 evacuates the first space 41 through at least two first air holes 24, thereby making the gas in the first space 41 flow more evenly and increasing the speed at which the gas in the first space 41 is evacuated, thereby ensuring that the efficiency and effect of the bonding between the thin film film 90 and the reference member 30 meet the expected requirements.

[0088] In some embodiments of the present application, the seat assembly 10 is provided with a second air hole 13 , the second air hole 13 is communicated with the second space 42 , and the air suction port of the negative pressure device 50 is connected to the second air hole 13 .

[0089] During the process of the negative pressure device 50 exhausting air, the air between the film film 90 and the reference member 30 enters the first space 41 from all sides, then enters the second space 42 through the first air holes 24 , and is then exhausted by the negative pressure device 50 through the second air holes 13 .

[0090] In some embodiments of the present application, the number of the first air holes 24 is three or more. The number of the second air holes 13 is two, the first air holes 24 connect the first space 41 and the second space 42 , and the second air holes 13 are connected to the air extraction holes of the negative pressure device 50 .

[0091] During the vacuuming process of the negative pressure device 50, the second space 42 is vacuumed through the two air holes, thereby reducing the air pressure in the second space 42, and then the second space 42 vacuums the first space 41 through the first air holes 24. In this way, the negative pressure device 50 completes the vacuuming of the first air holes 24 with a large number of air holes through the second air holes 13 with a small number, and ensures that the flow rate of the air flow in each first air hole 24 is close, thereby making the gas in the first space 41 flow more evenly, and increasing the speed at which the gas in the first space 41 is vacuumed, thereby ensuring that the efficiency and effect of the lamination of the thin film film 90 and the reference member 30 meet the expected requirements.

[0092] By reducing the number of second air holes 13 and thus reducing the complexity of the pipeline 52 of the negative pressure device 50, the structure of the chip detection fixture 100 is made simpler, which facilitates the installation, maintenance and debugging of the chip detection fixture 100 and reduces the production cost.

[0093] In some embodiments of the present application, one of the seat assembly 10 and the adjustment ring 20 includes a magnet 15 , and the other of the seat assembly 10 and the adjustment ring 20 includes a magnetic conductive member 26 , and the magnet 15 can attract the magnetic conductive member 26 .

[0094] The magnet 15 attracts the magnetic conductive member 26, thereby magnetically connecting the seat assembly 10 to the adjustment ring 20, thereby preventing the adjustment ring 20 from being separated from the seat assembly 10 during operation, thereby improving the reliability and stability of the chip detection fixture 100 structure.

[0095] In some embodiments of the present application, the magnet 15 may include at least one of a permanent magnet and an electromagnet. The magnetic conductive member 26 may include a structure made of a ferromagnetic material. In this way, when the magnet 15 and the magnetic conductive member 26 are close to each other, the magnet 15 can generate a magnetic attraction to the magnetic conductive member 26, thereby preventing the adjustment ring 20 from being separated from the seat assembly 10 during operation, thereby improving the reliability and stability of the chip detection fixture 100 structure.

[0096] In some embodiments of the present application, a chip detection fixture 100 provided by the present application further includes a rotating mechanism 60, and the rotating mechanism 60 includes a gear plate assembly 61 and a driving device 62. The gear plate assembly 61 is connected to the seat assembly 10. The driving device 62 drives the gear plate assembly 61 to rotate, so that the seat assembly 10 drives the adjustment ring 20 and the reference member 30 to rotate.

[0097] The gear plate assembly 61 is driven to rotate by the driving device 62 , thereby driving the seat assembly 10 to rotate through the gear plate assembly 61 , and further driving the adjustment ring 20 and the reference member 30 to rotate through the seat assembly 10 .

[0098] In some embodiments of the present application, the driving device 62 includes a driving motor 63 and a transmission gear assembly 64 . The transmission gear assembly 64 is meshed with the gear plate assembly 61 , and the driving motor 63 drives the transmission gear assembly 64 to operate.

[0099] After placing the film film 90 loaded with the chip to be tested 91 on the chip detection fixture 100, the negative pressure device 50 is used to evacuate air, thereby making the film film 90 fit with the reference piece 30. When the rotating mechanism 60 drives the seat assembly 10 to rotate, the chip to be tested 91 in the film film 90 is driven to rotate, thereby adjusting the angle of the chip to be tested 91 so that the outer edge of the chip to be tested 91 is parallel to the moving axis direction of the detection device. The image information of the chip to be tested 91 is obtained through the visual module, and then the outer contour edges of the two chips to be tested 91 located on the same line are extracted, and the contour centers of the two chips to be tested 91 are respectively fitted. Computer software is used to calculate the angle between the line connecting the two contour center points and the X-axis on the XY plane, and then the angle is converted according to the gear plate assembly 61 and the gear assembly 64 in the drive device 62. The corresponding mold pulse equivalent is converted and a command is sent to the drive motor 63 of the drive device 62 via the motion controller to adjust the angle of the chip 91 to be tested so that the outer edge of the chip 91 to be tested is parallel to the direction of the motion axis of the detection equipment, so as to ensure that the reliability of the AOI visual appearance inspection results meets the expected requirements.

[0100] In some embodiments of the present application, a chip detection fixture 100 provided by the present application further includes a photoelectric sensor 81 , and the photoelectric sensor 81 is used to detect whether the film 90 is correctly placed in the chip detection fixture 100 .

[0101] The sensing light emitted by the photoelectric sensor 81 is irradiated from the outer edge of the reference part 30 to the normal direction of the reference surface 31. If the film film 90 is correctly placed in the chip detection fixture 100, the sensing light is reflected by the film film 90, thereby triggering the photoelectric sensor 81, so that the photoelectric sensor 81 detects that the film film 90 is correctly placed in the chip detection fixture 100. The control system starts the negative pressure device 50 to evacuate air so that the film film 90 is attached to the reference surface 31.

[0102] If the film 90 is not placed in the chip detection fixture 100 or the position of the film 90 placed in the chip detection fixture 100 is deviated, the sensing light emitted by the photoelectric sensor 81 cannot be reflected by the film 90, and the photoelectric sensor 81 will not be triggered, so that the photoelectric sensor 81 detects that the film 90 is not correctly placed in the chip detection fixture 100, and the control system does not respond. In this way, misoperation is prevented and the reliability and safety of the chip detection fixture 100 are improved.

[0103] In some embodiments of the present application, a chip detection fixture 100 provided by the present application further includes a position sensor 82 , and the position sensor 82 is used to limit the rotation angle of the gear plate assembly 61 .

[0104] The position sensor 82 is used to limit the rotation angle of the gear plate assembly 61, thereby preventing the gear plate assembly 61 from rotating too much, so that the rotation angle of the chip to be tested 91 is within the control range, and the angle of the chip to be tested 91 can be adjusted to the expected range more quickly, thereby improving the working efficiency of the chip detection fixture 100.

[0105] In some embodiments of the present application, a chip detection fixture 100 provided by the present application further includes a backlight assembly 70, and the backlight assembly 70 includes a light emitting assembly 71. The base assembly 10 is provided with a light transmission channel 14, and the light emitted from the light emitting assembly 71 is transmitted from the light transmission channel 14 to the reference member 30, and the reference member 30 is light-transmissive at least within the range of the reference surface 31.

[0106] The backlight assembly 70 emits light to the reference part 30 , and the light passes through the reference part 30 to illuminate the chip 91 to be tested, thereby providing backlight for the detection of the chip 91 to be tested, so that the AOI detection system can obtain a clearer image of the chip 91 to be tested, thereby improving the detection effect.

[0107] In some embodiments of the present application, the backlight assembly 70 further includes a diffusion plate 72 , and the light emitted by the light emitting assembly 71 at least passes through the diffusion plate 72 and then reaches the reference member 30 .

[0108] The light emitted by the backlight assembly 70 is homogenized by the diffusion plate 72, so that the light irradiated to the chip to be tested 91 is more uniform, the backlight effect of the chip to be tested 91 is improved, and the detection effect is further improved.

[0109] On the other hand, in some embodiments of the present application, the present application further provides a chip detection device, including the above-mentioned chip detection fixture 100, and the chip detection fixture 100 is used to fix the chip 91 to be tested.

[0110] The film film 90 loaded with the chip 91 to be tested is placed on the chip detection fixture 100 , and the film film 90 is supported by the first protrusion 22 so that a gap 43 is formed between the film film 90 and the reference piece 30 .

[0111] The negative pressure device 50 is used to evacuate the gas in the gap 43 , thereby reducing the air pressure in the space between the film 90 and the reference member 30 , and then under the action of the atmospheric pressure, the film 90 is at least partially attached to the reference surface 31 .

[0112] The negative pressure device 50 stops pumping air, and the thin film 90 rebounds under its own tension, so that the gas in the first space 41 enters the space between the thin film 90 and the reference member 30 under the rebound effect of the thin film 90, so that the gap 43 is formed between the thin film 90 and the reference member 30 again.

[0113] The negative pressure device 50 evacuates air again, and then exhausts the air between the film film 90 and the reference member 30 through the gap 43 formed again, so that the film film 90 is completely attached to the reference surface 31. The space between the film film 90 and the reference member 30 is evacuated from the peripheral sides of the film film 90 and the reference member 30, so that the film film 90 is completely attached to the reference surface 31.

[0114] The backlight assembly 70 provides backlight to the chip 91 to be tested, and the reference part 30 has no micro-holes or other structures, and the reference part 30 is a continuous and flat structure, thereby reducing the influence of the reference part 30 on the backlight propagation, so that the AOI inspection system can obtain a clearer image of the chip 91 to be tested.

[0115] In this way, the film 90 can be effectively sucked flat without affecting the chip detection.

[0116] On the other hand, see Fig.10 In some embodiments of the present application, the present application further provides a fixing method, which is implemented using the above-mentioned chip detection fixing device 100 and includes the following steps:

[0117] The film film 90 is placed on the chip detection fixture 100, and the first protrusion 22 supports the film film 90 so that a first gap is formed between the film film 90 and the reference member 30;

[0118] The negative pressure device 50 evacuates air to exhaust the first gap, thereby making the film 90 at least partially adhere to the reference surface 31;

[0119] The negative pressure device 50 stops pumping air to allow the film 90 to rebound, thereby forming a second gap between the film 90 and the reference member 30;

[0120] The negative pressure device 50 evacuates air again to exhaust the second gap, thereby making the film 90 completely adhere to the reference surface 31 .

[0121] It can be understood that after the film film 90 loaded with the chip 91 to be tested is placed on the chip detection fixture 100, the film film 90 is supported by the first protrusion 22. The height of the first protrusion 22 is higher than the height of the reference surface 31, and the protruding direction of the first protrusion 22 is in the same direction as the bearing direction of the reference surface 31. Therefore, under the tension of the film film 90 itself, a first gap can be formed between the film film 90 and the reference member 30.

[0122] The first protrusion 22 is annular in shape, and the inner wall of the annular body 21 is within the annular range of the first protrusion 22. The side wall of the reference part 30 is matched with the inner wall of the annular body 21. Therefore, a first space 41 can be formed between the adjustment ring 20 and the reference part 30, and the first space 41 is an annular space surrounding the reference part 30.

[0123] The first space 41 is connected to the upper space of the reference surface 31. Therefore, after the first gap is formed between the thin film 90 and the reference member 30, the first space 41 is connected to the first gap formed between the thin film 90 and the reference member 30, and the first gap is surrounded by the first space 41.

[0124] When the negative pressure device 50 forms a negative pressure in the first space 41, the gas in the first gap flows into the first space 41 and is pumped out by the negative pressure device 50. During the pumping process of the negative pressure device 50, the air pressure in the first space 41 and the air pressure in the first gap both decrease, and then under the action of the atmospheric pressure, the film 90 is at least partially attached to the reference member 30.

[0125] Since the gas in the first gap flows from the circumferential direction into the first space 41, the gas at the edge of the first gap first enters the first space 41, and the gas in the center of the first gap first flows toward the edge of the first gap and then enters the first space 41. Therefore, the pressure drop speed at the edge of the gap 43 is faster than the pressure drop speed at the center of the gap 43, which causes the portion of the thin film 90 close to the first space 41 to approach the reference member 30 first.

[0126] In some cases, the gas in the central space of the first gap has not yet had time to flow out completely, and the portion of the thin film film 90 close to the first space 41 is in contact with the reference part 30, which prevents the gas in the first gap from flowing into the first space 41, that is, the gas in the first gap is confined in the first gap space by the thin film film 90 and the reference part 30.

[0127] In this case, the negative pressure device 50 stops pumping air, and then the tension of the film film 90 overcomes the atmospheric pressure, so that the film film 90 is separated from the reference member 30. At this time, the gas in the first space 41 flows back to the space between the film film 90 and the reference member 30, so that the film film 90 can be separated from the reference member 30 smoothly.

[0128] When the film film 90 is separated from the reference member 30, a second gap is formed between the film film 90 and the reference member 30, thereby connecting the first space 41 with the space in the second gap. At this time, the negative pressure device 50 evacuates air again, thereby causing the gas in the second gap space to flow into the first space 41 and be evacuated by the negative pressure device 50.

[0129] Since the gas in the first space 41 flows back to the space between the thin film 90 and the reference part 30, no external gas is added to the first space 41 and the space in the second gap, that is, the gas in the first space 41 is sucked into the space between the thin film 90 and the reference part 30 by the tension of the thin film 90. Therefore, the total amount of gas in the space formed by the first space 41 and the space in the second gap is reduced, and its air pressure is lower than the external air pressure. At this time, the negative pressure device 50 evacuates air again, which will reduce the gas in the space formed by the first space 41 and the space in the second gap again, or even exhaust it. If the gas in the space formed by the first space 41 and the space in the second gap is reduced again, the bubble space formed between the thin film 90 and the reference part 30 will be reduced; if the gas in the space formed by the first space 41 and the space in the second gap is exhausted, the bubble space formed between the thin film 90 and the reference part 30 will disappear, that is, the thin film 90 and the reference part 30 are completely attached.

[0130] If the film film 90 still does not completely adhere to the reference surface 31 after two vacuuming operations, the negative pressure device 50 can be repeatedly cycled in a “pause-vacuuming” manner until the film film 90 completely adheres to the reference surface 31 .

[0131] In this way, the film 90 can be effectively sucked flat without affecting the chip detection.

[0132] In the description of this specification, the description with reference to the terms "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0133] In addition, the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modification, equivalent replacement and improvement made within the spirit and principle of the present invention shall be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A chip detection fixture, which fixes the chip to be tested by fixing a thin film film loaded with the chip to be tested, It is characterized in that include: A seat assembly, wherein the seat assembly is provided with a first bearing surface and a second bearing surface; the second bearing surface is higher than the first bearing surface; An adjusting ring, the adjusting ring is mounted on the seat assembly, the adjusting ring comprises an annular body and a first protrusion, the first protrusion is annular in shape, and the inner wall of the annular body is within the annular range of the first protrusion; A reference member, wherein the reference member is provided with a reference surface, the bearing direction of the reference surface is in the same direction as the protruding direction of the first protrusion, the reference surface is located within the annular range of the first protrusion, the height of the reference surface is lower than the protruding height of the first protrusion, and the side wall of the reference member is adapted to the inner wall of the annular body, so that a first space is formed between the reference member and the adjusting ring; A negative pressure device, the negative pressure device is used to form a negative pressure in the first space; Wherein, the first space is connected with the upper space of the reference surface; The adjusting ring is provided with an adjusting member, the adjusting member at least partially extends out of the adjusting ring, the extending direction of the adjusting member is toward the first bearing surface, and the adjusting member abuts against the first bearing surface; The reference member is provided with an abutting surface, and the abutting surface abuts against the second bearing surface; Wherein, the extending direction of the adjusting member is away from the bearing direction of the second bearing surface, and the extending length of the adjusting member is adjustable; The adjusting ring is provided with a second protrusion, the second protrusion is annular in shape, the second protrusion is matched with the outer wall of the seat body assembly, a second space is formed between the adjusting ring and the seat body assembly, the second space is within the annular range of the second protrusion, and the second space is connected with the first space; The adjusting ring is provided with at least two first air holes, the first air holes are distributed in a circumferential array along the central axis of the annular body, the first air holes are connected with the first space, and the negative pressure device forms a negative pressure in the first space through the first air holes; The operating steps of the device are as follows: The film film is placed on the chip detection fixture, and the first protrusion supports the film film so that a first gap is formed between the film film and the reference piece; The negative pressure device evacuates air to exhaust the first gap, thereby making the film at least partially adhere to the reference surface; The negative pressure device stops pumping air to allow the film to rebound, thereby forming a second gap between the film and the reference member; The negative pressure device evacuates air again to exhaust the second gap, thereby making the film completely adhere to the reference surface.

2. The chip detection fixture according to claim 1, It is characterized in that One of the seat assembly and the adjusting ring includes a magnet, and the other of the seat assembly and the adjusting ring includes a magnetic conductive member, and the magnet can attract the magnetic conductive member.

3. The chip detection and fixing device according to claim 1, It is characterized in that Also includes a rotating mechanism, the rotating mechanism comprising: A gear plate assembly, wherein the gear plate assembly is connected to the seat assembly; A driving device drives the gear plate assembly to rotate, so that the seat assembly drives the adjusting ring and the reference member to rotate.

4. The chip detection fixture according to claim 1, It is characterized in that Also included is a backlight assembly, the backlight assembly including a light emitting assembly; The seat assembly is provided with a light-transmitting channel, and the light emitted from the light-emitting assembly is transmitted from the light-transmitting channel to the reference member, and the reference member is light-transmitting at least within the range of the reference plane.

5. The chip detection and fixing device according to claim 4, It is characterized in that The backlight assembly further includes a diffusion plate, and the light emitted by the light emitting assembly at least passes through the diffusion plate before reaching the reference member.

6. A chip testing device, It is characterized in that It comprises a chip detection fixture as described in any one of claims 1 to 5, wherein the chip detection fixture is used to fix the chip to be tested.

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