Chip Encapsulation Fixing Glue Separation Device

Abstract

The present invention relates to a device for separating a fixing adhesive for chip packaging, including a separation box. A guiding track is fixedly connected to the inner cavity of the separation box. A moving platform driven by a power mechanism is slidably connected to the bottom of the guiding track. The present invention relates to the technical field of chip packaging. For this device for separating a fixing adhesive for chip packaging, a negative pressure is drawn inside the negative pressure port to suck the blue film upward. Under the change of pressure, the blue film will separate from the chip and concave toward the negative pressure port, thereby reducing the contact area between the blue film and the chip, making it easy for the chip to separate from the blue film. While the separation plate moves up and down, the push rod moves up and down in the through groove, and the push rod continuously presses the blue film to push the chip off for separation. After heating the blue film, the blue film hardens and has no viscosity, and then through vibration and pressing, the chip can be completely separated, solving the problem of abnormal stripping caused by uneven heating in the bellows baking method, improving the product yield, reducing costs, and labor.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and specifically to a chip packaging fixing glue separation device. Background Art

[0002] In the packaging production line, for finished product cutting, the product is pasted on a thermal release film for single-piece cutting. After cutting, the product is removed after baking in an oven to make the film lose its viscosity. In the current process, for the cut substrate, a blade is used to cut off a distance of 0.5 - 1 cm outside the edge of the product. The cut film and the product are placed in a baking fixture, and then an oven is used for baking to separate the product from the thermal release film. In this process, the oven temperature and time need to be strictly controlled according to the process requirements. During baking, attention should be paid to avoiding various quality problems that occur during the packaging process, such as product damage caused by hitting the product during cutting, and abnormal stripping due to uneven heating in the air box baking method. Summary of the Invention

[0003] Aiming at the deficiencies of the prior art, the present invention provides a chip packaging fixing glue separation device, which solves the problems mentioned above.

[0004] To achieve the above objectives, the present invention is implemented through the following technical solutions: a chip packaging fixing glue separation device, including a separation box, the inner cavity of the separation box is fixedly connected to a guide track, the bottom of the guide track is slidably connected to a moving platform driven by a power mechanism, the inner cavity of the moving platform is rotatably connected to a separation plate through an embedded groove, the inner cavity of the separation plate is connected to a negative pressure port connected to an external negative pressure source through a negative pressure pipeline for adsorbing and fixing the blue film, the bottom of the separation plate is fixedly connected to an electric heating plate arranged around the negative pressure port and in contact with the blue film, one side of the moving platform is fixedly connected to a driving cylinder, One end of the driving cylinder piston rod is fixedly connected with a push rod that penetrates and extends to the inner cavity of the separation plate, the inner cavity of the separation plate is provided with a clamping groove that matches the surface of the push rod, and the left side of the separation plate is provided with a truncated cone groove that is connected to the clamping groove, the inner diameter of the truncated cone groove is larger than the diameter of the push rod, and the inner diameter of the truncated cone groove gradually decreases from left to right, and the minimum inner diameter of the truncated cone groove is the same as the inner diameter of the clamping groove, and the inner cavity of the embedded groove is fixedly connected with a push rod, and the inner cavity of the separation plate is provided with a through groove that matches the surface of the push rod, and the bottom of the push rod abuts against the top of the blue film, and when in use, the side of the blue film that adheres to the chip is facing The bottom is inverted on the lifting platform, and then the blue film is lifted to the bottom of the separation plate by the lifting platform. After the adsorption is completed through the negative pressure port, the moving platform slides along the guide track to the inside of the separation box. At this time, the blue film is heated by the electric heating plate to separate the internal glue from the chip, and while heating, the negative pressure port is drawn into negative pressure to suck the blue film upward. Under the pressure change, the blue film will separate from the chip and sink toward the negative pressure port, thereby reducing the contact area between the blue film and the chip, making it easy to separate the chip from the blue film, and while separating, the cylinder drives the ejector rod to reciprocate in the clamping groove and the truncated cone groove. Under the limit of the truncated cone groove The separation plate moves up and down repeatedly under the push of the push rod in the moving table, which drives the separation plate to vibrate repeatedly, drives the blue film to vibrate repeatedly, accelerates the separation process of the chip and the blue film, and while the separation plate moves up and down, the push rod moves up and down in the through groove, the push rod continuously squeezes the blue film, pushes the chip down for separation, and removes the blue film after separation, then resets the moving table and reprocesses, heats the blue film to make it hard and have no viscosity, and then vibrates and presses to make the chip completely detached, which solves the problem of abnormal stripping caused by uneven heating in the bellows baking method, improves product yield, and reduces costs and labor.

[0005] As a further solution of the present invention: an electric heating wire is built into the end of the push rod, and the electric heating plate and the electric heating plate are arranged to ensure that the surface of the blue film is fully heated, so that the internal glue is quickly separated from the chip.

[0006] As a further solution of the present invention: Rotating motors are fixedly connected to both sides of the separation plate, and a pressing plate is fixedly connected to the surface of the output shaft of the rotating motor. Through the arrangement of the pressing plates on both sides, after the separation plate adsorbs the blue film through the negative pressure port, the rotating motor drives the pressing plate to rotate, which can limit both sides of the blue film, preventing the blue film from falling off due to insufficient suction of the negative pressure port.

[0007] As a further solution of the present invention: When the pressing plate is in the initial position, the size of the pressing plate protruding below the separation plate is the same as the height of the blue film and the chip. By using the pressing plate to limit the separation plate, while being able to adsorb the blue film, it can prevent the separation plate from squeezing the chip on the blue film and causing damage.

[0008] As a further solution of the present invention: A workpiece placement table is fixedly connected to one side of the separation box. A lifting table driven by a lifting mechanism is slidably connected to the inner cavity of the workpiece placement table. Place the chip on the blue film facing down above the workpiece placement table, and then lift the lifting table to drive the blue film and the chip to rise and move below the negative pressure port of the separation plate, which can quickly transport the blue film in place.

[0009] As a further solution of the present invention: A receiving table is fixed in the inner cavity of the separation box below the separation plate. An outlet channel communicating with the receiving table is provided on the surface of the separation box. A blowing nozzle with an air outlet facing the outlet channel is provided on the side of the separation box. Through the setting of the blowing nozzle, while being able to blow off the chip adsorbed under the blue film, it can blow the chip out along the outlet channel for collection after the chip falls into the receiving table.

[0010] The present invention has the following beneficial effects compared with the prior art:

[0011] 1. In the present invention, a negative pressure is drawn in the negative pressure port to suck the blue film upward. Under the change of pressure, the blue film will separate from the chip and sink toward the negative pressure port, thereby reducing the contact area between the blue film and the chip, making it easy for the chip to separate from the blue film. While the separation plate moves up and down, the push rod moves up and down in the through groove. The push rod continuously squeezes the blue film to push the chip off for separation. After heating the blue film, the blue film hardens and has no viscosity, and then through vibration and pressing, the chip can be completely separated, solving the problem of abnormal stripping caused by uneven heating in the air box baking method, improving the product yield, reducing costs, and labor.

[0012] 2. In the present invention, through the arrangement of the pressing plates on both sides, after the separation plate adsorbs the blue film through the negative pressure port, the rotating motor drives the pressing plate to rotate, which can limit both sides of the blue film, preventing the blue film from falling off due to insufficient suction of the negative pressure port.

[0013] 3. In the present invention, the blowing nozzle is arranged such that while it can blow off the chip adsorbed under the blue film, it can also blow the chip along the discharge channel for collection after the chip falls onto the receiving table. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a schematic structural diagram of the present invention;

[0015] Figure 2 is a structural cross-sectional view of the present invention;

[0016] Figure 3 is a structural cross-sectional view of the moving table of the present invention;

[0017] Figure 4 is of the present invention Figure 3 partial enlarged view at A in;

[0018] Figure 5 is of the present invention Figure 3 partial enlarged view at B in.

[0019] In the figure: 1, separation box; 2, guiding track; 3, workpiece placement table; 4, lifting table; 5, moving table; 6, separation plate; 7, embedded groove; 8, driving cylinder; 9, ejector rod; 10, clamping groove; 11, conical table groove; 13, electric heating plate; 14, rotating motor; 15, pressing plate; 16, through groove; 17, push rod; 18, negative pressure pipeline; 19, negative pressure port; 20, blue film; 21, discharge channel. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] To further elaborate on the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the following, in conjunction with the accompanying drawings and preferred embodiments, details the specific embodiments, structures, features, and their effects of the present invention as follows.

[0021] Please refer to Figures 1-5, the present invention provides a technical solution: a chip encapsulation fixing glue separation device, including a separation box 1. A guiding track 2 is fixedly connected to the inner cavity of the separation box 1. A moving table 5 driven by a power mechanism is slidably connected to the bottom of the guiding track 2. A separation plate 6 is rotatably connected to the inner cavity of the moving table 5 through an embedded groove 7. A negative pressure port 19 for adsorbing and fixing the blue film 20 and communicating with an external negative pressure source is communicated with the inner cavity of the separation plate 6 through a negative pressure pipeline 18. A heating plate 13 is fixedly connected to the bottom of the separation plate 6 and is arranged around the negative pressure port 19 and contacts the blue film 20. A driving cylinder 8 is fixedly connected to one side of the moving table 5. One end of the piston rod of the driving cylinder 8 is fixedly connected with a push rod 9 that penetrates and extends into the inner cavity of the separation plate 6. A clamping groove 10 adapted to the surface of the push rod 9 is formed in the inner cavity of the separation plate 6. A frustum-shaped groove 11 communicated with the clamping groove 10 is formed on the left side of the separation plate 6. The inner diameter of the frustum-shaped groove 11 is larger than the diameter of the push rod 9, and the inner diameter of the frustum-shaped groove 11 gradually decreases from left to right. The minimum inner diameter of the frustum-shaped groove 11 is the same as the inner diameter of the clamping groove 10. A push rod 17 is fixedly connected to the inner cavity of the embedded groove 7. A through groove 16 adapted to the surface of the push rod 17 is formed in the inner cavity of the separation plate 6. The bottom of the push rod 17 abuts against the top of the blue film 20. When in use, the side of the blue film 20 adhered with the chip is buckled downward above the lifting table 4, and then the blue film 20 is lifted by the lifting table 4 to the lower part of the separation plate 6. After adsorption through the negative pressure port 19, the moving table 5 slides along the guiding track 2 into the interior of the separation box 1. At this time, the blue film 20 is heated by the heating plate 13 to separate the glue inside it from the chip. And while heating, the negative pressure port 19 is evacuated to negative pressure to suck the blue film 20 upward. The blue film 20 will separate from the chip and dent toward the negative pressure port 19 under the change of pressure, thereby reducing the contact area between the blue film 20 and the chip and making it easy for the chip to separate from the blue film 20. And while separating, the air cylinder drives the push rod 9 to reciprocate in the clamping groove 10 and the frustum-shaped groove 11. Under the limitation of the frustum-shaped groove 11, the separation plate 6 repeatedly moves up and down in the moving table 5 under the extrusion of the push rod 9, driving the separation plate 6 to vibrate repeatedly, driving the blue film 20 to vibrate repeatedly, accelerating the process of separating the chip from the blue film 20. And while the separation plate 6 moves up and down, the push rod 17 moves up and down in the through groove 16, and the push rod 17 continuously squeezes the blue film 20 to push the chip off for separation. After separation, the blue film 20 is taken off, and then the moving table 5 resets to reprocess. By heating the blue film 20, the blue film 20 is hardened and has no viscosity, and then through vibration and pressing, the chip can be completely separated, solving the problem of abnormal stripping caused by uneven heating in the bellows baking method, improving the product yield, and reducing the cost and labor.

[0022] An electric heating wire is built into the end of the push rod 17. Through the setting of the heating plate 13 and the heating plate 13, it is ensured that the surface of the blue film 20 is fully heated, so that the glue inside it quickly separates from the chip.

[0023] Rotating motors 14 are fixedly connected to both sides of the separation plate 6. A pressing plate 15 is fixedly connected to the surface of the output shaft of the rotating motor 14. Through the arrangement of the pressing plates 15 on both sides, after the separation plate 6 adsorbs the blue film 20 through the negative pressure port 19, the rotating motor 14 drives the pressing plate 15 to rotate, which can limit both sides of the blue film 20, and prevent the blue film 20 from falling off due to insufficient suction of the negative pressure port 19.

[0024] When the pressing plate 15 is in the initial position, the dimension by which the pressing plate 15 protrudes below the separation plate 6 is the same as the height of the blue film 20 and the chip. By using the pressing plate 15 to limit the separation plate 6, while being able to adsorb the blue film 20, it can prevent the separation plate 6 from squeezing the chip on the blue film 20 and causing damage.

[0025] A workpiece placement table 3 is fixedly connected to one side of the separation box 1. A lifting table 4 driven by a lifting mechanism is slidably connected to the inner cavity of the workpiece placement table 3. The chip on the blue film 20 is placed downward above the workpiece placement table 3, and then the lifting table 4 is raised to drive the blue film 20 and the chip to rise and move below the negative pressure port 19 of the separation plate 6, so as to quickly transport the blue film 20 in place.

[0026] A receiving table located below the separation plate 6 is fixed in the inner cavity of the separation box 1. An outlet channel 21 communicating with the receiving table is arranged on the surface of the separation box 1. A blowing nozzle with an air outlet facing the outlet channel 21 is arranged on the side of the separation box 1. Through the arrangement of the blowing nozzle, while being able to blow off the chip adsorbed under the blue film 20, it can blow the chip out along the outlet channel 21 for collection after the chip falls into the receiving table.

[0027] The above is only a preferred embodiment of the present invention, and does not impose any form of limitation on the present invention. Although the present invention has been disclosed as above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make some changes or modifications to equivalent embodiments by using the disclosed technical content within the scope of the technical solution of the present invention. However, as long as it does not depart from the content of the technical solution of the present invention, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. Chip encapsulation fixing glue separation device, including a separation box (1), the inner cavity of the separation box (1) is fixedly connected with a guiding track (2), characterized in that: A moving platform (5) driven by a power mechanism is slidably connected to the bottom of the guiding track (2). A separating plate (6) is rotatably connected to the inner cavity of the moving platform (5) through an embedded groove (7). The inner cavity of the separating plate (6) is communicated with a negative pressure port (19) communicated with an external negative pressure source through a negative pressure pipeline (18) for adsorbing and fixing a blue film (20). A heating plate (13) is fixedly connected to the bottom of the separating plate (6) and is arranged around the negative pressure port (19) and contacts the blue film (20). A driving cylinder (8) is fixedly connected to one side of the moving platform (5). One end of the piston rod of the driving cylinder (8) is fixedly connected to a ejector rod (9) that penetrates and extends into the inner cavity of the separating plate (6). A clamping groove (10) adapted to the surface of the ejector rod (9) is formed in the inner cavity of the separating plate (6). A frustum-shaped groove (11) communicated with the clamping groove (10) is formed on the left side of the separating plate (6). The inner diameter of the frustum-shaped groove (11) is larger than the diameter of the ejector rod (9), and the inner diameter of the frustum-shaped groove (11) gradually decreases from left to right. The minimum inner diameter of the frustum-shaped groove (11) is the same as the inner diameter of the clamping groove (10). A push rod (17) is fixedly connected to the inner cavity of the embedded groove (7). A through groove (16) adapted to the surface of the push rod (17) is formed in the inner cavity of the separating plate (6). The bottom of the push rod (17) abuts against the top of the blue film (20).

2. The chip package fixing glue separation device according to claim 1, characterized in that: An electric heating wire is built in the end of the push rod (17).

3. The chip package fixing glue separation device according to claim 1, characterized in that: Rotating motors (14) are fixedly connected to both sides of the separating plate (6). A pressing plate (15) is fixedly connected to the surface of the output shaft of the rotating motor (14).

4. The chip package fixing glue separation device according to claim 3, wherein: When the pressing plate (15) is in the initial position, the dimension that the pressing plate (15) protrudes below the separating plate (6) is the same as the height of the blue film (20) and the chip.

5. The chip package fixing glue separating device according to claim 1, characterized in that: A workpiece placing table (3) is fixedly connected to one side of the separating box (1). A lifting platform (4) driven by a lifting mechanism is slidably connected to the inner cavity of the workpiece placing table (3).

6. The chip package fixing glue separation device according to claim 1, characterized in that: A receiving table located below the separating plate (6) is fixed in the inner cavity of the separating box (1). A discharge channel (21) communicated with the receiving table is arranged on the surface of the separating box (1). A blowing nozzle with an air outlet facing the discharge channel (21) is arranged on the side surface of the separating box (1).

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