Cutting apparatus for semiconductor processing

Abstract

The application relates to the field of semiconductor processing equipment and discloses a cutting device for semiconductor processing; through the rotation of a bearing disc and the self-rotation of a wafer supporting table installed on the bearing disc, step-by-step cross cutting and longitudinal cutting of a wafer are realized, the reciprocating movement of a splitting cutter roller is matched, the moving track of a cutter is reduced, the cutting precision is ensured, the cutting efficiency is improved, the control difficulty is reduced, a spraying head is arranged, the wafer surface and the inner side of a cutting seam are centrifugally washed during the cutting process and the wafer transfer process, waste liquid and chippings are prevented from remaining on the wafer surface and the inner side of the cutting seam, the cleaning effect is improved, and subsequent processing is facilitated; through the hollow roller shaft and the spray holes arranged on the two sides of the cutter blade, deionized water is rapidly diffused on the cutter blade surface, and the cooling and chipping removal effects are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor processing equipment, more particularly to a cutting device for semiconductor processing. BACKGROUND

[0002] Wafer cutting is an indispensable process in the chip manufacturing process, which is a later process of wafer manufacturing. Wafer cutting is to divide the whole wafer of the chip into single chips according to the size of the chip. A high-speed rotating diamond blade cuts the wafer into individual wafer particles to form independent single crystals, which are prepared for subsequent processes.

[0003] In the cutting process of the traditional wafer cutting device, the cutter and the wafer supporting table need to perform complex conforming movements to form a mesh-shaped cutting seam. The control of the cutting piece movement track is difficult, and it is not convenient to clean the cutting debris due to the complex movement track of the cutting piece.

[0004] The present application provides a cutting device for semiconductor processing, which can perform step-by-step cutting and fully flush and clean the wafer. SUMMARY

[0005] 1. Technical problem to be solved

[0006] In view of the problems in the prior art, the purpose of the present application is to provide a cutting device for semiconductor processing, which can realize distributed cutting of the wafer and fully centrifugal flushing of the debris on the wafer surface and in the cutting seam during the cutting process and the transfer process, thereby ensuring the cutting quality and cleaning effect.

[0007] To solve the above problems, the present application adopts the following technical scheme.

[0008] A cutting device for semiconductor processing, comprising a base, a mounting cylinder fixedly connected to the base, a bearing disc rotatably connected to the upper end of the mounting cylinder, and a driving mechanism connected to the bearing disc to drive the rotation thereof; a wafer supporting table for adsorbing and fixing a wafer is installed on the bearing disc; a cross-cutting mechanism is installed on the left side of the bearing disc, and a longitudinal cutting mechanism is installed on the front side of the bearing disc, wherein the cross-cutting mechanism and the longitudinal cutting mechanism are structurally identical and are arranged in perpendicular directions;

[0009] The cross-cutting mechanism comprises a mounting cover fixedly connected to the mounting cylinder and extending above the bearing disc, a split cutter roller installed in the mounting cover, a moving frame rotatably connected to the split cutter roller and slidingly connected to the mounting cover, and a horizontal screw assembly connected to the moving frame to drive the horizontal movement of the moving frame along the direction of the mounting cover; one end of the split cutter roller extends to the outside of the moving frame and is connected to a high-speed motor through a transmission gear set; a spraying disc is installed on the upper part of the mounting cover and is arranged opposite to the wafer supporting table; the spraying disc is in communication with an external liquid supply mechanism, and the external liquid supply mechanism injects deionized water into the spraying disc;

[0010] The lower end of the piece bearing table is fixedly connected with a rotating shaft extending to the lower side of the bearing disc and being rotatably connected with the bearing disc, the lower end of the rotating shaft is fixedly connected with a rolling gear, the rolling gear is engaged with a fixed gear ring fixedly connected with the mounting cylinder; an annular groove for bearing waste liquid is formed in the upper portion of the mounting cylinder, the bearing disc is provided with a mesh on the outer side of the piece bearing table for waste liquid to flow down, and the mesh is oppositely arranged with the annular groove.

[0011] As a further scheme of the present application, the slitting knife roll comprises a roll shaft and blades equidistantly distributed on the roll shaft, the roll shaft is provided with spray holes towards the blades on both sides of the roll shaft, and the outer end of the roll shaft is communicated with an external liquid supply mechanism through a rotary joint.

[0012] As a further scheme of the present application, the bearing disc is provided with scrap collecting grooves equidistantly distributed in a circle, the bottom plate of the scrap collecting groove is provided with uniformly distributed liquid leakage holes, and the piece bearing table is installed in the scrap collecting groove.

[0013] As a further scheme of the present application, the mounting cover is a rectangular cover with an open lower end, the mounting cover is sleeved above the scrap collecting groove, and the lower end of the mounting cover abuts against the bearing disc and is in sliding abutment with the bearing disc.

[0014] As a further scheme of the present application, the annular groove is an annular groove with an open upper end, the liquid leakage holes are all arranged directly above the annular groove, and the annular groove is communicated with a liquid discharge pipe.

[0015] As a further scheme of the present application, the fixed gear ring is fixedly connected with the inner wall of the annular groove through a fixed rod.

[0016] As a further scheme of the present application, the driving mechanism comprises a support shaft fixedly connected with the center position of the lower end of the bearing disc and extending into the mounting cylinder, and the support shaft is connected with a driving motor through a worm and gear assembly.

[0017] As a further scheme of the present application, the moving frame is in a door-shaped frame structure and its lower end extends into the mounting cover, and rectangular through grooves for the sliding of the moving frame are formed in the outer walls on both sides of the mounting cover.

[0018] As a further scheme of the present application, the horizontal screw rod assembly comprises a sliding groove frame, a screw rod installed in the sliding groove frame and threadedly connected with the upper portion of the moving frame, and a screw rod motor connected with the screw rod.

[0019] As a further scheme of the present application, two groups of spray holes equidistantly distributed in a circle are arranged on both sides of the blade, and the spray holes on both sides of the blade are oppositely and obliquely arranged.

[0020] Compared with the prior art, the present application has the following advantages:

[0021] (1) The present application realizes the step-by-step cross-cutting and longitudinal cutting of the wafer by the rotating bearing disc and the self-rotating wafer supporting table installed on the bearing disc, reduces the moving track of the cutter by the reciprocating movement of the cutting knife roller, ensures the cutting accuracy and improves the cutting efficiency, reduces the control difficulty, and by the spray head, centrifugal washing is performed on the wafer surface and the inside of the cutting seam during the cutting process and the wafer transfer process, waste liquid and debris are avoided to be left on the wafer surface and the inside of the cutting seam, the cleaning effect is improved, and subsequent processing is facilitated.

[0022] (2) The present application is characterized by the bearing disc provided with a chip collecting groove, the mounting cylinder provided with an annular groove, and the wafer supporting table installed on the inside and connected with the rotating shaft, which cooperates with the mounting cover to collect and discharge the waste liquid and debris, avoiding the splashing of debris and waste liquid.

[0023] (3) The present application is characterized by the rolling gear fixed below the wafer supporting table and the fixed gear ring cooperating with it, which ensures that the transverse cutting seam is perpendicular to the blade after the wafer is transferred between the cross-cutting mechanism and the longitudinal cutting mechanism, ensures the formation of a mesh-shaped cutting seam, and realizes the slicing operation; at the same time, cooperating with the spray head, the centrifugal force generated by the self-rotating wafer supporting table makes the waste liquid and debris quickly separate from the wafer, which has good cleaning effect.

[0024] (4) The present application is characterized by the hollow roller shaft and the spray holes arranged on both sides of the blade, which makes the deionized water quickly spread on the surface of the blade, improves the cooling and debris removal effect. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 is a perspective structural schematic view of the left side of the present application;

[0026] Figure 2 is a perspective structural schematic view of the right side of the present application;

[0027] Figure 3 is a transverse sectional structural schematic view of the present application;

[0028] Figure 4 is Figure 3 is an enlarged structural schematic view of position A in the present application;

[0029] Figure 5 is a longitudinal sectional structural schematic view of the present application;

[0030] Figure 6 is a perspective structural schematic view of the bearing disc in the present application;

[0031] Figure 7 is an assembly structural schematic view of the wafer supporting table and the mounting cylinder in the present application;

[0032] Figure 8 is a perspective structural schematic view of the cross-cutting mechanism in the present application;

[0033] Figure 9 Assembling structure diagram of slitting cutter roller in the present application;

[0034] Figure 10 Sectional structure diagram of slitting cutter roller in the present application;

[0035] Figure 11 Assembling structure diagram of slitting cutter roller in the present application Figure 10 Enlarged structure diagram at B in the present application.

[0036] Label explanation in the figure: 1, base; 2, mounting cylinder; 201, annular groove; 3, bearing disc; 301, chip collecting groove; 302, liquid leakage hole; 4, wafer bearing table; 5, wafer; 6, cross-cut mechanism; 7, longitudinal-cut mechanism; 8, support shaft; 9, worm and gear assembly; 10, driving motor; 11, mounting cover; 12, slitting cutter roller; 1201, roller shaft; 1202, blade; 1203, spray hole; 13, moving frame; 14, horizontal screw assembly; 15, shower tray; 16, rotating shaft; 17, rolling gear; 18, fixed gear ring; 19, fixed rod; 20, high-speed motor. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application; obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application, and all other embodiments obtained by those of ordinary skill in the art without creative efforts based on the embodiments in the present application shall fall within the protection scope of the present application.

[0038] In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer", "top / bottom end" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0039] In the description of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "provided with", "sleeved / connected", "connected" and the like should be understood broadly, for example, "connected" can be fixedly connected, or can be detachably connected, or integrally connected; can be mechanically connected, or can be electrically connected; can be directly connected, or can be indirectly connected through an intermediate medium; can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0040] Referring to Figures 1-9 In one embodiment of the present application, a cutting device for semiconductor processing includes a base 1, the base 1 is fixedly connected with a mounting cylinder 2, the mounting cylinder 2 is rotatably connected with a bearing disc 3 at the upper end, the bearing disc 3 is connected with a driving mechanism for driving the rotation of the bearing disc 3; the bearing disc 3 is provided with a wafer supporting table 4 for adsorbing and fixing a wafer 5; a transverse cutting mechanism 6 is installed on the left side of the bearing disc 3, a longitudinal cutting mechanism 7 is installed on the front side of the bearing disc 3, the transverse cutting mechanism 6 and the longitudinal cutting mechanism 7 are the same structure and are arranged vertically;

[0041] The transverse cutting mechanism 6 includes a mounting cover 11 fixedly connected with the mounting cylinder 2 and extending above the bearing disc 3, a slitting knife roller 12 is installed in the mounting cover 11, the slitting knife roller 12 is rotatably connected with a moving frame 13 which is slidingly connected with the mounting cover 11, the moving frame 13 is connected with a horizontal screw assembly 14 for driving the horizontal movement of the moving frame 13 along the direction of the mounting cover 11; one end of the slitting knife roller 12 extends to the outside of the moving frame 13 and is connected with a high-speed motor 20 through a transmission gear set; a spraying disc 15 is installed on the upper part of the mounting cover 11 and is arranged opposite to the wafer supporting table 4, the spraying disc 15 is communicated with an external liquid supply mechanism, and the external liquid supply mechanism injects deionized water into the spraying disc 15;

[0042] The wafer supporting table 4 is fixedly connected with a rotating shaft 16 extending below the bearing disc 3 and rotatably connected with the bearing disc 3 at the lower end, the rotating shaft 16 is fixedly connected with a rolling gear 17 at the lower end, and the rolling gear 17 is engaged with a fixed gear ring 18 fixedly connected with the mounting cylinder 2; an annular groove 201 for bearing waste liquid is formed in the upper part of the mounting cylinder 2, and a mesh is provided on the wafer supporting table 4 outside the bearing disc 3 for waste liquid to flow down, and the mesh is arranged opposite to the annular groove 201.

[0043] Specifically, when cutting the wafer 5, first, the wafer 5 after being pasted with the film is placed on the wafer supporting table 4 on the bearing disc 3 by an external mechanical arm, and the wafer supporting table 4 adsorbs the wafer 5 after being pasted with the film; the driving mechanism is started, the driving mechanism drives the rotation of the bearing disc 3, the bearing disc 3 rotates the wafer supporting table 4 adsorbing the wafer 5 to below the transverse cutting mechanism 6, and the driving mechanism is turned off;

[0044] The high-speed motor 20, the horizontal screw assembly 14 and the external liquid supply mechanism are started; the high-speed motor 20 drives the slitting knife roller 12 to rotate at high speed through the transmission gear set, at the same time, the horizontal screw assembly 14 drives the moving frame 13 and the slitting knife roller 12 thereon to move transversely and reciprocally, and the wafer 5 is cut transversely and reciprocally, and the slitting knife roller 12 forms equidistantly distributed cutting seams on the wafer 5; at the same time of cutting, the external liquid supply mechanism injects deionized water into the spraying disc 15, sprays and cools the cutting slitting knife roller 12, and flushes the debris accumulated on the wafer 5 after cutting, and the high-speed motor 20 and the horizontal screw assembly 14 are turned off;

[0045] The driving mechanism is started, the driving mechanism drives the bearing disc 3 to rotate by 90 degrees, so that the wafer support table 4 drives the transversely cut wafer 5 to move to below the longitudinal cutting mechanism 7, in the transfer process, the rolling gear 17 rolls on the fixed gear ring 18, the rolling gear 17 drives the wafer support table 4 to rotate in a circle through the rotating shaft 16, at the same time, the deionized water sprayed by the spraying disc 15 continuously washes the rotating wafer 5, the waste liquid containing debris is separated from the surface of the wafer 5 and the transverse cutting seam under the action of centrifugal force, so that the surface of the wafer 5 and the transverse cutting seam are free of debris during longitudinal cutting, and the cutting quality is ensured; in addition, in the transfer process, the wafer support table 4 is driven by the rolling gear 17 to rotate by 270 degrees, so that the transverse cutting seam of the wafer 5 is parallel to the slitting roller 12 of the longitudinal cutting mechanism 7.

[0046] Similarly, the longitudinal cutting mechanism 7 is started, and the transversely cut wafer 5 is longitudinally cut, the longitudinal cutting seam is formed on the wafer 5, the cutting is completed, and the longitudinal cutting mechanism 7 is closed.

[0047] The driving mechanism is started again, so that the bearing disc 3 drives the cut wafer 5 to rotate by 90 degrees and separate from the longitudinal cutting mechanism 7, and the wafer is washed by the external liquid supply mechanism during the separation process, so that the cleanliness of the cut wafer is ensured; then the wafer is discharged by the external mechanical arm.

[0048] The traditional wafer cutting machine adopts the composite motion of the cutter and the wafer support table to realize the wafer slicing, the motion trajectory of the cutter and the wafer support table is complex, and the control difficulty is large, the technical scheme provided in the application realizes the step-by-step transverse cutting and longitudinal cutting through the rotating bearing disc 3, the self-rotating wafer support table 4 and the transverse cutting mechanism 6 and the longitudinal cutting mechanism 7 including the slitting roller, the slitting roller 12 only needs to move horizontally and vertically, the moving trajectory is simple, and the cutting precision and stability are ensured; at the same time, the wafer 5 is centrifugally washed during the cutting process and the cutting gap, and the cutting precision and the cleanliness of the wafer after cutting are further ensured.

[0049] Please refer to Figure 6 and Figure 7 In the embodiment, the bearing disc 3 is provided with the debris collecting grooves 301 distributed in a circle, the bottom plate of the debris collecting groove 301 is provided with uniformly distributed liquid leakage holes 302, and the wafer support table 4 is installed in the debris collecting groove 301.

[0050] Specifically, the waste liquid generated after cutting is conveniently collected.

[0051] Please refer to Figure 2 , Figure 3 and Figure 8 In the embodiment, the mounting cover 11 is a rectangular cover with an open lower end, the mounting cover 11 is sleeved above the debris collecting groove 301, and the lower end of the mounting cover 11 abuts against the bearing disc 3 and is in sliding abutment with the bearing disc 3.

[0052] Specifically, the waste liquid is prevented from splashing and overflowing.

[0053] Please refer to Figure 5 and Figure 7 In the embodiment, the annular groove 201 is an annular groove with an open upper end, the liquid leakage holes 302 are arranged directly above the annular groove 201, and the annular groove 201 is communicated with the liquid discharge pipe.

[0054] Specifically, the waste liquid is collected and discharged through the liquid discharge pipe.

[0055] Please refer to Figure 7 In the embodiment, the fixed gear ring 18 is fixedly connected with the inner wall of the annular groove 201 through the fixing rod 19.

[0056] Specifically, the stability of the rolling gear 17 rolling on the fixed gear ring 18 is ensured.

[0057] Please refer to Figure 3 In the embodiment, the driving mechanism includes the support shaft 8 fixedly connected with the center position of the lower end of the bearing disc 3 and extending into the mounting cylinder 2, and the support shaft 8 is connected with the driving motor 10 through the worm gear assembly 9.

[0058] Specifically, the driving motor 10 drives the support shaft 8 to rotate through the worm gear assembly 9, and the support shaft 8 drives the bearing disc 3 to rotate, thereby stably transferring the wafer carrier table 4 and the wafer 5 thereon.

[0059] Please refer to Figure 8 and Figure 9 In the embodiment, the moving frame 13 has a door-shaped frame structure and extends into the mounting cover 11 at the lower end, and the mounting cover 11 is provided with a rectangular through slot on the outer wall of each side for the sliding of the moving frame 13.

[0060] Please refer to Figure 3 and Figure 5 In the embodiment, the horizontal screw rod assembly 14 includes a sliding groove frame, a screw rod installed in the sliding groove frame and screw-connected with the upper part of the moving frame 13, and a screw rod motor connected with the screw rod.

[0061] Specifically, the horizontal screw rod assembly 14 drives the moving frame 13 to stably move along the mounting cover 11.

[0062] Please refer to Figure 1 and Figures 9-11 In another embodiment of the present application, the slitting knife roller 12 includes a roller shaft 1201 and knife blades 1202 equidistantly distributed on the roller shaft 1201, the roller shaft 1201 is provided with spray holes 1203 facing the knife blades 1202 on both sides of the knife blades 1202, and the outer end of the roller shaft 1201 is communicated with an external liquid supply mechanism through a rotary joint.

[0063] Specifically, when cutting, the external liquid supply mechanism injects deionized water into the air knife roller 12 and sprays it from the spray holes 1203, cools the roller shaft 1201 with the deionized water, and sprays the deionized water onto the rotating blade 1202, so that the deionized water spreads evenly on the surface of the blade 1202 under the action of centrifugal force, enhancing the heat dissipation of the blade 1202, and at the same time, the cutting position of the blade 1202 in contact with the wafer 5 always has sufficient deionized water, improving the cooling and chip removal effect.

[0064] Please refer to Figure 11 In this embodiment, the blade 1202 is provided with two groups of circumferentially equidistantly distributed spray holes 1203 on both sides, and the spray holes 1203 on both sides of the blade 1202 are oppositely inclined.

[0065] Specifically, the diffusion effect of the deionized water is improved.

[0066] The above is only a preferred specific embodiment of the present application; however, the protection scope of the present application is not limited to this. Any person skilled in the art, within the technical range disclosed by the present application, according to the technical solution and improvement concept of the present application, makes equivalent replacement or changes, which should be covered in the protection scope of the present application.

Claims

1. A cutting apparatus for semiconductor processing, characterized in that, The device includes a base (1), on which a mounting cylinder (2) is fixedly connected. A carrier plate (3) is rotatably connected to the upper end of the mounting cylinder (2), and the carrier plate (3) is connected to a drive mechanism that drives its rotation. A wafer stage (4) for adsorbing and fixing wafers (5) is installed on the carrier plate (3). A cross-cutting mechanism (6) is installed on the left side of the carrier plate (3), and a longitudinal cutting mechanism (7) is installed on the front side of the carrier plate (3). The cross-cutting mechanism (6) and the longitudinal cutting mechanism (7) have the same structure and are set perpendicularly. The cross-cutting mechanism (6) includes components that are fixedly connected to the mounting cylinder (2) and extend to the carrier plate (3). The upper mounting cover (11) houses a slitting roller (12), which is rotatably connected to a movable frame (13) that is slidably connected to the mounting cover (11). The movable frame (13) is connected to a horizontal lead screw assembly (14) that drives it to move horizontally along the mounting direction of the mounting cover (11). One end of the slitting roller (12) extends to the outside of the movable frame (13) and is connected to a high-speed motor (20) via a transmission gear set. A spray plate (15) is mounted on the upper part of the mounting cover (11) and is positioned opposite to the plate support (4). The spray plate (15) is connected to an external power supply. The liquid supply mechanism is connected, and the external liquid supply mechanism injects deionized water into the spray plate (15); the lower end of the support plate (4) is fixedly connected to a rotating shaft (16) extending to the lower part of the support plate (3) and rotatably connected thereto, and the lower end of the rotating shaft (16) is fixedly connected to a rolling gear (17), and the rolling gear (17) meshes with a fixed gear ring (18) fixedly connected to the mounting cylinder (2); the upper part of the mounting cylinder (2) is provided with an annular groove (201) for carrying waste liquid, and the support plate (3) is located outside the support plate (4) and is provided with a mesh for waste liquid to flow down, the mesh being opposite to the annular groove (201). The slitting roller (12) includes a roller shaft (1201) and blades (1202) evenly distributed on the roller shaft (1201). The roller shaft (1201) has spray holes (1203) on both sides of the blades (1202) facing the blades (1202). The outer end of the roller shaft (1201) is connected to an external liquid supply mechanism through a rotary joint. The bearing plate (3) has chip collection grooves (301) evenly distributed in a circular pattern. The bottom plate of the chip collection groove (301) has evenly distributed leakage holes (302). The plate support (4) is installed in the chip collection groove (301).

2. The semiconductor cutting apparatus according to claim 1, characterized in that, The mounting cover (11) is a rectangular cover with an opening at the lower end. The mounting cover (11) is fitted above the chip collection groove (301). The lower end of the mounting cover (11) abuts against the bearing plate (3) and slides against the bearing plate (3).

3. The semiconductor cutting apparatus according to claim 1, characterized in that, The annular groove (201) is an annular groove with an opening at the top. The leakage holes (302) are all located directly above the annular groove (201). The annular groove (201) is connected to a drain pipe.

4. The semiconductor cutting apparatus according to claim 2, characterized in that, The fixed gear ring (18) is fixedly connected to the inner wall of the annular groove (201) by a fixed rod (19).

5. A semiconductor cutting apparatus according to claim 1, characterized in that, The drive mechanism includes a support shaft (8) that is fixedly connected to the lower center of the bearing plate (3) and extends into the mounting cylinder (2). The support shaft (8) is connected to a drive motor (10) via a worm gear assembly (9).

6. The semiconductor cutting apparatus according to claim 1, characterized in that, The movable frame (13) has a portal frame structure and its lower end extends into the mounting cover (11). Rectangular through slots for the movable frame (13) to slide are provided on the outer walls of both sides of the mounting cover (11).

7. A semiconductor cutting apparatus according to claim 6, characterized in that, The horizontal lead screw assembly (14) includes a slide rail, a lead screw installed in the slide rail and threaded to the upper part of the movable frame (13), and a lead screw motor connected to the lead screw.

8. A semiconductor cutting apparatus according to claim 1, characterized in that, The blade (1202) has two sets of nozzles (1203) that are circumferentially equidistant on both sides, and the nozzles (1203) on both sides of the blade (1202) are arranged at an angle relative to each other.

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