Gas temperature sensor, temperature measuring circuit, and method for detecting gas temperature

Abstract

This disclosure provides a gas temperature sensor, a temperature measuring circuit, and a method for detecting gas temperature. The gas temperature sensor includes a gas temperature sensor housing, a semiconductor thermistor, a pull-up resistor, and connector terminals. The semiconductor thermistor is located at the top of the gas temperature sensor housing, the pull-up resistor is located inside the gas temperature sensor housing, and the connector terminals are located at the tail end of the gas temperature sensor housing. The semiconductor thermistor, pull-up resistor, and connector terminals are connected in series, and the connector terminals are adapted to connect to connectors that are connected to pins of a controller. By installing the pull-up resistor inside the gas temperature sensor housing and connecting it in series with the semiconductor thermistor and connector terminals, the semiconductor thermistor and pull-up resistor are integrated, reducing errors caused by selecting the pull-up resistor during sensor design, thereby reducing the risk of gas temperature sensor malfunction or failure to perform its function.

Description

Technical Field

[0001] This application relates to the field of circuit design technology, and in particular to a gas temperature sensor, a temperature measuring circuit, and a method for detecting gas temperature. Background Technology

[0002] When the EGR (Exhaust Gas Recirculation) valve is operating, a gas temperature sensor can be used to detect temperature changes in the recirculated gas within the EGR valve to determine whether the recirculated gas is functioning correctly. Therefore, detecting temperature changes in the recirculated gas within the EGR valve using a gas temperature sensor is crucial for ensuring the normal operation of the EGR system.

[0003] Existing gas temperature sensors require an external pull-up resistor to ensure they can output a voltage signal correctly. With the continuous development of the automotive industry, different vehicles may utilize control units on different platforms, and these control unit platforms may have differences in hardware and structure. Selecting a suitable pull-up resistor value for the gas temperature sensor during the control unit hardware and structural design presents certain limitations and difficulties, requiring control unit engineers to invest more time in the initial design and development phase. Summary of the Invention

[0004] Therefore, this disclosure provides a gas temperature sensor, a temperature measuring circuit, and a method for detecting gas temperature, which eliminates the need to set a suitable pull-up resistor in the control unit that works in conjunction with the gas temperature sensor.

[0005] Specifically, the following technical solutions are included:

[0006] In a first aspect, this disclosure provides a gas temperature sensor, characterized in that the gas temperature sensor includes a gas temperature sensor housing, a semiconductor thermistor, a pull-up resistor, and a connector terminal.

[0007] The semiconductor thermistor is located at the top of the gas temperature sensor housing, the pull-up resistor is located inside the gas temperature sensor housing, and the connector terminal is located at the tail end of the gas temperature sensor housing.

[0008] The semiconductor thermistor is connected in series with the pull-up resistor and the connector terminal, and the connector terminal is adapted to be connected to a connector that is connected to a pin of the controller.

[0009] In a second aspect, this disclosure provides a temperature measuring device, characterized in that the temperature measuring device includes a controller and the gas temperature sensor described in the first aspect;

[0010] The controller includes a voltage source, an analog signal processor, a first pin, and a second pin;

[0011] The first pin and the second pin are respectively connected to the connector terminals of the gas temperature sensor;

[0012] In the controller, the first pin is connected to the voltage source and is used to output a high level, and the second pin is connected to the analog signal processor. The analog signal processor is used to acquire the voltage value between the first pin and the second pin and determine the temperature change of the gas based on the change of the voltage value.

[0013] Thirdly, this disclosure provides a method for detecting gas temperature, the method being performed by the temperature measuring device described in the second aspect, characterized in that the method includes:

[0014] Control the voltage source to output a constant DC voltage signal;

[0015] The analog signal processor is controlled to acquire the voltage value between the first pin and the second pin;

[0016] The temperature change of the recirculated gas in the EGR valve of the exhaust gas recirculation system, where the semiconductor thermistor is located, is determined based on the change in the voltage value, wherein the gas temperature sensor is installed downstream of the EGR valve.

[0017] On the other hand, a computer device is provided, the computer device including a processor and a memory, the memory storing at least one computer program, the at least one computer program being loaded and executed by the processor to enable the computer device to implement any of the above-described methods for detecting gas temperature.

[0018] On the other hand, a computer-readable storage medium is also provided, wherein at least one computer program is stored therein, the at least one computer program being loaded and executed by a processor to enable a computer to implement any of the above-described methods for detecting gas temperature.

[0019] This disclosure provides a gas temperature sensor, a temperature measuring device, and a method for detecting gas temperature. The gas temperature sensor includes a gas temperature sensor housing, a semiconductor thermistor, a pull-up resistor, and connector terminals. By installing the pull-up resistor inside the gas temperature sensor housing and connecting it in series with the semiconductor thermistor and connector terminals, the semiconductor thermistor and pull-up resistor are integrated, eliminating the need to set a suitable pull-up resistor in the control unit that works with the gas temperature sensor. Using this design, the gas temperature sensor does not require changes to the connector terminals, reducing the need for external controller hardware and lowering errors caused by selecting the pull-up resistor during matching, thereby reducing the risk of malfunction or failure of the gas temperature sensor. Furthermore, during the design and development of the gas temperature sensor, there is no need for matching design with the controller hardware circuit, reducing the need for communication and confirmation between the gas temperature sensor development engineer and the controller hardware engineer, and improving the work efficiency of both parties. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of a gas temperature sensor provided in an embodiment of this disclosure;

[0022] Figure 2 This is a schematic diagram of the structure of a temperature measuring device provided in an embodiment of this disclosure;

[0023] Figure 3 This is a flowchart of a method for detecting gas temperature provided in an embodiment of this disclosure;

[0024] Figure 4 This is a schematic diagram of the structure of a computer device provided in an embodiment of this disclosure.

[0025] The reference numerals in the figure indicate:

[0026] 1-Gas temperature sensor housing; 2-Semiconductor thermistor; 3-Pull-up resistor; 4-Connector terminal; 5-PCB (printed circuit board); 6-First wire; 7-Second wire; 8-Third wire; 9-Fourth wire; 10-Voltage source; 11-Analog signal processor; 12-First pin; 13-Second pin.

[0027] The accompanying drawings have illustrated specific embodiments of this disclosure, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concepts of this disclosure to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0028] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0029] Unless otherwise defined, all technical terms used in the embodiments of this disclosure have the same meaning as commonly understood by one of ordinary skill in the art.

[0030] To make the technical solutions and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0031] In a first aspect, embodiments of this disclosure provide a gas temperature sensor, with reference to... Figure 1 The gas temperature sensor includes a gas temperature sensor housing 1, a semiconductor thermistor 2, a pull-up resistor 3, and a connector terminal 4.

[0032] The semiconductor thermistor 2 is located at the top of the gas temperature sensor housing 1, the pull-up resistor 3 is located inside the gas temperature sensor housing 1, and the connector terminal 4 is located at the tail end of the gas temperature sensor housing 1. Generally speaking, the semiconductor thermistor 2 can be exposed outside the gas temperature sensor housing 1, or it can be enclosed by the gas temperature sensor housing 1 but has a passage to communicate with the outside gas, so as to better contact with the gas and measure the gas temperature.

[0033] The semiconductor thermistor 2 is connected in series with the pull-up resistor 3 and the connector terminal 4, which is adapted to be connected to a connector that is connected to the pins of the controller.

[0034] In summary, in the gas temperature sensor provided by this embodiment, the semiconductor thermistor 2, the pull-up resistor 3, and the connector terminal 4 are all located inside the gas temperature sensor housing 1, and the semiconductor thermistor 2 is connected in series with the pull-up resistor 3 and the connector terminal 4.

[0035] Therefore, the pull-up resistor 3 can divide the voltage in the circuit where the semiconductor thermistor 2 is located, ensuring that the voltage value of the semiconductor thermistor 2 is within the range that can be accurately measured. By installing the pull-up resistor 3 inside the gas temperature sensor housing 1 and connecting it in series with the semiconductor thermistor 2 and the connector terminal 4, the semiconductor thermistor 2 and the pull-up resistor 3 are integrated, eliminating the need to set a suitable pull-up resistor 3 in the control unit that works with the gas temperature sensor.

[0036] The gas temperature sensor designed according to this invention does not require changes to connector terminal 4, reducing the need for external controller hardware and minimizing errors caused by selecting pull-up resistor 3 during matching. This reduces the risk of malfunction or failure of the gas temperature sensor. Furthermore, the design and development of the gas temperature sensor eliminates the need for matching with controller hardware circuitry, reducing the need for communication and confirmation between gas temperature sensor development engineers and controller hardware engineers, thus improving the efficiency of both parties.

[0037] In some embodiments, the gas temperature sensor further includes a printed circuit board PCB5; PCB5 is installed inside the gas temperature sensor housing 1; and a pull-up resistor 3 is installed on PCB5.

[0038] In this embodiment, the pull-up resistor 3 is installed on the PCB5 inside the gas temperature sensor housing 1, which facilitates the connection of the pull-up resistor 3 to the connector terminal 4 and the semiconductor thermistor 2 through the printed circuit on the PCB5, simplifying the connection of the wires and reducing the connection difficulty of the gas temperature sensor.

[0039] In some embodiments, the two ends of the semiconductor thermistor 2 are connected to the PCB5 via a first wire 6 and a second wire 7, respectively, and the second wire 7 is connected to the first end of the pull-up resistor 3 via printed lines on the PCB5.

[0040] In this embodiment, the semiconductor thermistor 2 is connected to the PCB 5 via the second wire 7, and then connected to the pull-up resistor 3 via printed circuitry on the PCB 5, thus achieving series connection between the semiconductor thermistor 2 and the pull-up resistor 3. Therefore, the pull-up resistor 3 can divide the voltage in the circuit containing the semiconductor thermistor 2, ensuring that the voltage value of the semiconductor thermistor 2 is within a range that can be accurately measured.

[0041] In some embodiments, the connector terminal 4 is connected to the PCB5 via a third wire 8 and a fourth wire 9, respectively, and the third wire 8 is connected to the first wire 6 via printed lines on the PCB5, and the fourth wire 9 is connected to the second terminal of the pull-up resistor 3 via printed lines on the PCB5.

[0042] In this embodiment, connector terminal 4 is connected to the PCB 5 via the fourth wire 9, and then connected to the pull-up resistor 3 via printed circuitry on the PCB 5, thus connecting the pull-up resistor 3 and connector terminal 4 in series. Connector terminal 4 is also connected to the PCB 5 via the third wire 8, and then connected to the first wire 6 via printed circuitry on the PCB 5. This facilitates subsequent acquisition of voltage changes between the semiconductor thermistor 2 and the pull-up resistor 3 via connector terminal 4.

[0043] Secondly, embodiments of this disclosure provide a temperature measuring device, with reference to Figure 2 The temperature measuring device includes a controller and a gas temperature sensor as described in the above embodiments;

[0044] The controller includes a voltage source 10, an analog signal processor 11, a first pin 12, and a second pin 13;

[0045] The first pin 12 and the second pin 13 are respectively connected to the connector terminal 4 of the gas temperature sensor;

[0046] In the controller, the first pin 12 is connected to the voltage source 10 and is used to output a high level, and the second pin 13 is connected to the analog signal processor 11. The analog signal processor 11 is used to acquire the voltage value between the first pin 12 and the second pin 13 and determine the temperature change of the gas based on the change of the voltage value.

[0047] In summary, in the temperature measuring device provided by this embodiment, the voltage source 10 is connected to the connector terminal 4 of the gas temperature sensor via the first pin 12, providing a high-level voltage signal to the semiconductor thermistor 2 and the pull-up resistor 3. The analog signal processor 11 is connected to the connector terminal 4 of the gas temperature sensor via the second pin 13, facilitating the detection of changes in the voltage values ​​of the semiconductor thermistor 2 and the pull-up resistor 3. In one possible implementation, the voltage source 10 and the analog signal processor 11 can be connected in parallel before being connected to the connector terminal 4 of the gas temperature sensor.

[0048] Based on the gas temperature sensor and temperature measuring device described in the above embodiments, this disclosure provides a method for detecting gas temperature, such as... Figure 3 As shown, taking the application of this method to a computing device in a vehicle as an example, the method includes steps 301-303.

[0049] In step 301, the control voltage source outputs a constant DC voltage signal.

[0050] In one possible implementation, the computing device on the vehicle controls the voltage source 10 to output a constant DC voltage signal. This DC voltage signal is transmitted via the first pin 12 to the connector terminal 4 of the gas temperature sensor, then via the third wire 8 and the fourth wire 9 to the PCB 5. From there, it is transmitted via printed circuitry on the PCB 5 to the second terminal of the pull-up resistor 3 and the first wire 6, and finally via the first wire 6 to the semiconductor thermistor 2. Optionally, the DC voltage signal value can be set empirically or adjusted according to actual conditions.

[0051] In step 302, the analog signal processor is controlled to acquire the voltage value between the first pin and the second pin.

[0052] In one possible implementation, the semiconductor thermistor 2 is located within the gas temperature sensor housing 1, wherein the gas temperature sensor is installed downstream of the exhaust gas recirculation (EGR) valve. Exemplarily, controlling the analog signal processor 11 to acquire the voltage value between the first pin 12 and the second pin 13 includes: a computing device on the vehicle controlling the analog signal processor 11 via a bus to acquire the voltage value between the first pin 12 and the second pin 13, and using the voltage value between the first pin 12 and the second pin 13 as the voltage value between the semiconductor thermistor 2 and the pull-up resistor 3. Optionally, the bus can be a CAN (Controller Area Network) bus.

[0053] For example, the semiconductor thermistor 2 is NTC (Negative Temperature Coefficient), and its output resistance decreases due to the increase in temperature of the recirculated gas in the EGR valve where the semiconductor thermistor 2 is located; and / or its output resistance increases due to the decrease in temperature of the recirculated gas in the EGR valve where the semiconductor thermistor 2 is located.

[0054] Optionally, a suitable pull-up resistor 3 is selected based on the NTC characteristics of the semiconductor thermistor 2. The selection must ensure that, under the temperature conditions corresponding to various vehicle operating conditions, when the semiconductor thermistor 2 and the pull-up resistor 3 are connected in series, and the voltage signal provided by the voltage source 10 is within the reference range, the current flowing through the semiconductor thermistor 2 does not exceed a reference milliampere. For example, the reference range and the reference milliampere can be set empirically; for instance, the reference range can be from 4.5 ft to 5.5 ft, and the reference milliampere can be 1 milliampere. The resistance value of the pull-up resistor 3 can also be set empirically within the range of approximately 0.1 ohms to around 1000 ohms.

[0055] In one possible implementation, when the temperature of the recirculated gas within the EGR valve containing the thermistor 2 increases, the output resistance of the thermistor 2 decreases, resulting in a decrease in the voltage drop across the thermistor 2 and a decrease in the voltage between the thermistor 2 and the pull-up resistor 3. Conversely, when the temperature of the recirculated gas within the EGR valve containing the thermistor 2 decreases, the output resistance of the thermistor 2 increases, resulting in an increase in the voltage drop across the thermistor 2 and an increase in the voltage between the thermistor 2 and the pull-up resistor 3.

[0056] By installing a gas temperature sensor containing a semiconductor thermistor 2 downstream of the EGR valve, the change in the resistance of the semiconductor thermistor 2 can be determined based on the change in the voltage value of the semiconductor thermistor 2 and the pull-up resistor 3, thereby monitoring the temperature of the recirculated gas in the EGR valve.

[0057] In step 303, the temperature change of the recirculated gas in the EGR valve where the semiconductor thermistor is located is determined based on the change in voltage value, wherein the gas temperature sensor is installed downstream of the EGR valve.

[0058] For example, determining the temperature change of the recirculated gas in the EGR valve where the semiconductor thermistor 2 is located based on the change in voltage value includes: the analog signal processor 11 determining that the temperature of the recirculated gas in the EGR valve where the semiconductor thermistor 2 is located decreases based on the continuously acquired voltage value increasing over time; and the analog signal processor 11 determining that the temperature of the recirculated gas in the EGR valve where the semiconductor thermistor 2 is located increases based on the continuously acquired voltage value decreasing over time.

[0059] In one possible implementation, the computing device on the vehicle continuously acquires the voltage values ​​collected by the analog signal processor 11 via the CAN bus and stores each acquired voltage value.

[0060] For example, if the voltage values ​​of the semiconductor thermistor 2 and pull-up resistor 3 continuously acquired by the analog signal processor 11 increase over time, indicating that the output resistance of the semiconductor thermistor 2 increases over time, then based on the characteristics of the semiconductor thermistor 2 of the NTC, it is determined that the temperature of the recirculated gas in the EGR valve where the semiconductor thermistor 2 is located decreases over time. Conversely, if the voltage values ​​of the semiconductor thermistor 2 and pull-up resistor 3 continuously acquired by the analog signal processor 11 decrease over time, indicating that the output resistance of the semiconductor thermistor 2 decreases over time, then based on the characteristics of the semiconductor thermistor 2 of the NTC, it is determined that the temperature of the recirculated gas in the EGR valve where the semiconductor thermistor 2 is located increases over time.

[0061] For example, if the difference between the voltage value obtained this time and the voltage value obtained last time is greater than a reference threshold, an abnormal temperature of the recirculated gas in the EGR valve is indicated.

[0062] In one possible implementation, the vehicle's computing device calculates the difference between the voltage values ​​of the semiconductor thermistor 2 and pull-up resistor 3 acquired by the analog signal processor 11 this time and the previously acquired voltage values. If the difference between the voltage values ​​of the semiconductor thermistor 2 and pull-up resistor 3 acquired by the analog signal processor 11 this time and the previously acquired voltage values ​​is greater than a reference threshold, it indicates that the temperature change of the recirculated gas in the EGR valve is large, and it is determined that the temperature of the recirculated gas in the EGR valve is abnormal. For example, the reference threshold can be determined experimentally, selecting the difference between the voltage value corresponding to the temperature when the EGR is abnormal and the voltage value corresponding to the temperature under normal operation as the reference threshold, or it can be adjusted according to the actual situation.

[0063] Optionally, after determining that the temperature of the recirculated gas in the EGR valve is abnormal, a notification of the abnormal temperature of the recirculated gas in the EGR valve is provided. This includes: the computing device on the vehicle controlling the display screen installed on the vehicle via CAN to provide a notification of the abnormal temperature of the recirculated gas in the EGR valve. For example, the notification can be provided to the user by displaying text information indicating that the temperature of the recirculated gas in the EGR valve is abnormal and / or that the EGR valve is malfunctioning.

[0064] This embodiment of the disclosure uses a voltage source to output a constant DC voltage signal, which is then used to power the semiconductor thermistor and pull-up resistor. An analog signal processor then acquires the voltage values ​​between the first and second pins to determine the changes in the voltage values ​​of the semiconductor thermistor and pull-up resistor, thereby determining the changes in the output resistance of the semiconductor thermistor. Because the gas temperature sensor is installed downstream of the EGR valve, the temperature changes of the recirculated gas within the EGR valve where the semiconductor thermistor is located can be determined based on the changes in the output resistance of the semiconductor thermistor, thus determining whether the EGR is operating normally.

[0065] In an exemplary embodiment, a computer device is also provided, comprising a processor and a memory storing at least one computer program. The at least one computer program is loaded and executed by one or more processors to enable the computer device to implement any of the methods described above for detecting gas temperature.

[0066] For example, a schematic diagram of the computer device is shown below. Figure 4 As shown, the computer device typically includes a processor 401 and a memory 402.

[0067] Processor 401 may include one or more processing cores, such as a quad-core processor, an octa-core processor, etc. Processor 401 may be implemented using at least one hardware form selected from DSP (Digital Signal Processing), FPGA (Field-Programmable Gate Array), and PLA (Programmable Logic Array). Processor 401 may also include a main processor and a coprocessor. The main processor, also known as a CPU (Central Processing Unit), is used to process data in the wake-up state; the coprocessor is a low-power processor used to process data in the standby state. In some embodiments, processor 401 may integrate a GPU (Graphics Processing Unit), which is responsible for rendering and drawing the content required to be displayed on the screen. In some embodiments, processor 401 may also include an AI (Artificial Intelligence) processor, which is used to handle computational operations related to machine learning.

[0068] The memory 402 may include one or more computer-readable storage media, which may be non-transitory. The memory 402 may also include high-speed random access memory and non-volatile memory, such as one or more disk storage devices or flash memory devices. In some embodiments, the non-transitory computer-readable storage media in the memory 402 are used to store at least one instruction, which is executed by the processor 401 to cause the terminal to implement the method for detecting gas temperature provided in the method embodiments of this application.

[0069] In some embodiments, the terminal may also optionally include: a peripheral device interface 403 and at least one peripheral device. The processor 401, memory 402, and peripheral device interface 403 can be connected via a bus or signal line. Each peripheral device can be connected to the peripheral device interface 403 via a bus, signal line, or circuit board. Specifically, the peripheral device includes at least one of: a radio frequency circuit 404, a display screen 405, a camera assembly 406, an audio circuit 407, and a power supply 408.

[0070] Peripheral device interface 403 can be used to connect at least one I / O (Input / Output) related peripheral device to processor 401 and memory 402. In some embodiments, processor 401, memory 402 and peripheral device interface 403 are integrated on the same chip or circuit board; in some other embodiments, any one or two of processor 401, memory 402 and peripheral device interface 403 can be implemented on separate chips or circuit boards, which is not limited in this embodiment.

[0071] The radio frequency (RF) circuit 404 is used to receive and transmit RF (Radio Frequency) signals, also known as electromagnetic signals. The RF circuit 404 communicates with communication networks and other communication devices via electromagnetic signals. The RF circuit 404 converts electrical signals into electromagnetic signals for transmission, or converts received electromagnetic signals back into electrical signals. Optionally, the RF circuit 404 includes: an antenna system, an RF transceiver, one or more amplifiers, a tuner, an oscillator, a digital signal processor, a codec chipset, a user identity module card, etc. The RF circuit 404 can communicate with other terminals through at least one wireless communication protocol. This wireless communication protocol includes, but is not limited to: metropolitan area networks (MANs), various generations of mobile communication networks (2G, 3G, 4G, and 5G), wireless local area networks (WLANs), and / or WiFi (Wireless Fidelity) networks. In some embodiments, the RF circuit 404 may also include circuitry related to NFC (Near Field Communication), which is not limited in this application.

[0072] Display screen 405 is used to display a UI (User Interface). This UI may include graphics, text, icons, videos, and any combination thereof. When display screen 405 is a touch display screen, it also has the ability to collect touch signals on or above its surface. These touch signals can be input as control signals to processor 401 for processing. In this case, display screen 405 can also be used to provide virtual buttons and / or a virtual keyboard, also known as soft buttons and / or a soft keyboard. In some embodiments, display screen 405 may be a single screen, located on the front panel of the terminal; in other embodiments, display screen 405 may be at least two screens, respectively located on different surfaces of the terminal or in a folded design; in other embodiments, display screen 405 may be a flexible display screen, located on a curved or folded surface of the terminal. Furthermore, display screen 405 may be configured as a non-rectangular, irregular shape, i.e., a non-rectangular screen. Display screen 405 may be made of materials such as LCD (Liquid Crystal Display) or OLED (Organic Light-Emitting Diode).

[0073] The camera assembly 406 is used to acquire images or videos. Optionally, the camera assembly 406 includes a front-facing camera and a rear-facing camera. Typically, the front-facing camera is located on the front panel of the terminal, and the rear-facing camera is located on the back of the terminal. In some embodiments, there are at least two rear-facing cameras, which are any one of a main camera, a depth-sensing camera, a wide-angle camera, and a telephoto camera, to achieve background blurring by fusion of the main camera and the depth-sensing camera, panoramic shooting by fusion of the main camera and the wide-angle camera, VR (Virtual Reality) shooting, or other fusion shooting functions. In some embodiments, the camera assembly 406 may also include a flash. The flash can be a single-color temperature flash or a dual-color temperature flash. A dual-color temperature flash refers to a combination of a warm-light flash and a cool-light flash, which can be used for light compensation at different color temperatures.

[0074] The audio circuit 407 may include a microphone and a speaker. The microphone is used to collect sound waves from the user and the environment, converting the sound waves into electrical signals that are input to the processor 401 for processing, or input to the radio frequency circuit 404 to achieve voice communication. For stereo sound acquisition or noise reduction purposes, multiple microphones may be used, each positioned at a different location on the terminal. The microphone may also be an array microphone or an omnidirectional microphone. The speaker is used to convert the electrical signals from the processor 401 or the radio frequency circuit 404 into sound waves. The speaker may be a traditional diaphragm speaker or a piezoelectric ceramic speaker. When the speaker is a piezoelectric ceramic speaker, it can convert electrical signals not only into audible sound waves but also into inaudible sound waves for purposes such as distance measurement. In some embodiments, the audio circuit 407 may also include a headphone jack.

[0075] Power supply 408 is used to power the various components in the terminal. Power supply 408 can be AC ​​power, DC power, a disposable battery, or a rechargeable battery. When power supply 408 includes a rechargeable battery, the rechargeable battery can support wired or wireless charging. The rechargeable battery can also be used to support fast charging technology.

[0076] In some embodiments, the terminal further includes one or more sensors 409. The one or more sensors 409 include, but are not limited to: an acceleration sensor 410, a gyroscope sensor 411, a pressure sensor 412, an optical sensor 413, and a proximity sensor 414.

[0077] Accelerometer 410 can detect the magnitude of acceleration along the three coordinate axes of a coordinate system established by the terminal. For example, accelerometer 410 can be used to detect the components of gravitational acceleration along the three coordinate axes. Processor 401 can control display screen 405 to display the user interface in either a landscape or portrait view based on the gravitational acceleration signal acquired by accelerometer 410. Accelerometer 410 can also be used for games or for acquiring user motion data.

[0078] The gyroscope sensor 411 can detect the terminal's orientation and rotation angle. The gyroscope sensor 411 can work in conjunction with the accelerometer sensor 410 to collect the user's 3D movements on the terminal. Based on the data collected by the gyroscope sensor 411, the processor 401 can perform the following functions: motion sensing (e.g., changing the UI based on the user's tilt), image stabilization during shooting, game control, and inertial navigation.

[0079] The pressure sensor 412 can be disposed on the side bezel of the terminal and / or the lower layer of the display screen 405. When the pressure sensor 412 is disposed on the side bezel of the terminal, it can detect the user's grip signal on the terminal, and the processor 401 can perform left / right hand recognition or quick operation based on the grip signal collected by the pressure sensor 412. When the pressure sensor 412 is disposed on the lower layer of the display screen 405, the processor 401 can control the operable controls on the UI interface based on the user's pressure operation on the display screen 405. The operable controls include at least one of button controls, scroll bar controls, icon controls, and menu controls.

[0080] Optical sensor 413 is used to collect ambient light intensity. In one embodiment, processor 401 can control the display brightness of display screen 405 based on the ambient light intensity collected by optical sensor 413. Specifically, when the ambient light intensity is high, the display brightness of display screen 405 is increased; when the ambient light intensity is low, the display brightness of display screen 405 is decreased. In another embodiment, processor 401 can also dynamically adjust the shooting parameters of camera assembly 406 based on the ambient light intensity collected by optical sensor 413.

[0081] The proximity sensor 414, also known as a distance sensor, is typically installed on the front panel of the terminal. The proximity sensor 414 is used to detect the distance between the user and the front of the terminal. In one embodiment, when the proximity sensor 414 detects that the distance between the user and the front of the terminal is gradually decreasing, the processor 401 controls the display screen 405 to switch from a screen-on state to a screen-off state; when the proximity sensor 414 detects that the distance between the user and the front of the terminal is gradually increasing, the processor 401 controls the display screen 405 to switch from a screen-off state to a screen-on state.

[0082] In an exemplary embodiment, a computer-readable storage medium is also provided, which stores at least one computer program that is loaded and executed by a processor of a computer device to enable the computer to implement any of the above-described methods for detecting gas temperature.

[0083] In one possible implementation, the aforementioned computer-readable storage medium may be a read-only memory (ROM), a random access memory (RAM), a compact disc read-only memory (CD-ROM), a magnetic tape, a floppy disk, and an optical data storage device, etc.

[0084] In this disclosure, the terms “first” and “second” are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term “multiple” means two or more, unless otherwise expressly defined.

[0085] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only.

[0086] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A gas temperature sensor, characterized in that, The gas temperature sensor includes a gas temperature sensor housing (1), a semiconductor thermistor (2), a pull-up resistor (3), and a connector terminal (4). The semiconductor thermistor (2) is located at the top of the gas temperature sensor housing (1), the pull-up resistor (3) is located inside the gas temperature sensor housing (1), and the connector terminal (4) is located at the tail end of the gas temperature sensor housing (1). The semiconductor thermistor (2) is connected in series with the pull-up resistor (3) and the connector terminal (4), and the connector terminal (4) is adapted to be connected to a connector connected to a pin of the controller. The gas temperature sensor also includes a printed circuit board (PCB) (5); The PCB (5) is installed inside the gas temperature sensor housing (1); The pull-up resistor (3) is mounted on the PCB (5); The two ends of the semiconductor thermistor (2) are connected to the PCB (5) through a first wire (6) and a second wire (7), respectively, and the second wire (7) is connected to the first end of the pull-up resistor (3) through the printed circuit on the PCB (5); The connector terminals (4) are connected to the PCB (5) via the third wire (8) and the fourth wire (9) respectively. The third wire (8) is connected to the first wire (6) via the printed circuit on the PCB (5), and the fourth wire (9) is connected to the second end of the pull-up resistor (3) via the printed circuit on the PCB (5).

2. A temperature measuring device, characterized in that, The temperature measuring device includes a controller and the gas temperature sensor as described in claim 1; The controller includes a voltage source (10), an analog signal processor (11), a first pin (12), and a second pin (13). The first pin (12) and the second pin (13) are respectively connected to the connector terminal (4) of the gas temperature sensor. In the controller, the first pin (12) is connected to the voltage source (10) and is used to output a high level, and the second pin (13) is connected to the analog signal processor (11). The analog signal processor (11) is used to acquire the voltage value between the first pin (12) and the second pin (13) and determine the temperature change of the gas based on the change of the voltage value.

3. A method for detecting the temperature of a gas, said method being performed by the temperature measuring device according to claim 2, characterized in that, The method includes: The voltage source (10) outputs a constant DC voltage signal; The analog signal processor (11) acquires the voltage value between the first pin (12) and the second pin (13); The analog signal processor (11) determines the temperature change of the recirculated gas in the EGR valve of the exhaust gas recirculation system where the semiconductor thermistor (2) is located based on the change of the voltage value, wherein the gas temperature sensor is installed downstream of the EGR valve.

4. The method according to claim 3, characterized in that The determination of the temperature change of the recirculated gas within the EGR valve where the semiconductor thermistor (2) is located based on the change in the voltage value includes: The analog signal processor (11) determines that the temperature of the recirculated gas in the EGR valve where the semiconductor thermistor (2) is located decreases based on the continuously acquired voltage value increasing over time. The analog signal processor (11) determines that the temperature of the recirculated gas in the EGR valve where the semiconductor thermistor (2) is located increases based on the continuously acquired voltage value decreasing over time.

5. The method according to claim 4, characterized in that, The method further includes: The difference between the voltage value obtained this time and the voltage value obtained last time is greater than the reference threshold, indicating that the temperature of the recirculated gas in the EGR valve is abnormal.

6. A computer device, characterized in that, The computer device includes a processor and a memory, the memory storing at least one computer program, which is loaded and executed by the processor to enable the computer device to control a temperature measuring device to implement the method for detecting gas temperature as described in any one of claims 3 to 5.

7. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores at least one computer program, which is loaded and executed by a processor to enable the computer to implement the method for detecting gas temperature as described in any one of claims 3 to 5.

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