A method for manufacturing different height difference printed circuit boards

By creating multiple recessed areas of different depths on the printed circuit board test board, the application scenarios of the test board are enriched, the problem of low testing efficiency of filling equipment in the existing technology is solved, and more accurate filling performance evaluation is achieved.

CN118250907BActive Publication Date: 2026-05-12JIUJIANG SUNSHINE GLOBAL CIRCUITS TECHNOLOGY CO LTD
View PDF 1 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
JIUJIANG SUNSHINE GLOBAL CIRCUITS TECHNOLOGY CO LTD
Filing Date
2024-03-01
Publication Date
2026-05-12

AI Technical Summary

Technical Problem

In the existing technology, the application scenarios of printed circuit board (PCB) test boards are limited, resulting in low testing efficiency of filling equipment.

Method used

The number of adhesive sheets corresponding to the test board to be made is determined according to the reference filling quantity of the filling equipment, and multiple recessed areas of different depths are made on the test board to enrich the application scenarios of the test board.

Benefits of technology

It improves the testing efficiency of filling equipment and enables accurate evaluation of filling performance in scenarios with depressions of different depths.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN118250907B_ABST
    Figure CN118250907B_ABST
Patent Text Reader

Abstract

The application relates to a printed circuit board manufacturing method with different height differences. The method comprises the following steps: determining the number of adhesive sheets corresponding to a test board to be manufactured according to a reference filling quantity of a filling device, and obtaining adhesive sheets with the same number of adhesive sheets, and then manufacturing the test board comprising a plurality of recessed areas with different depths according to the adhesive sheets. The method can enrich the application scenarios of the test board, and further improve the test efficiency of the filling device.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This application relates to the field of printed circuit board manufacturing technology, and in particular to a method for manufacturing printed circuit boards with different height differences. Background Technology

[0002] During the manufacturing process of printed circuit boards (PCBs), the laminated board surface is often uneven due to the influence of the bonding sheet. In this case, filling equipment is often needed to fill the PCB to make the PCB surface smoother.

[0003] In related technologies, in order to test the filling capabilities of different filling devices, it is necessary to manufacture various test plates and determine the filling performance of each filling device based on the filling effect of the filling device on the corresponding test plate.

[0004] However, the test boards produced in this technology have the problem of limited application scenarios, which affects the testing efficiency of the filling equipment. Summary of the Invention

[0005] Therefore, it is necessary to provide a method for manufacturing printed circuit boards with different height differences to address the above-mentioned technical problems, so as to enrich the application scenarios of test boards and improve the testing efficiency of filling equipment.

[0006] Firstly, this application provides a method for manufacturing a test board, including:

[0007] Determine the number of adhesive sheets corresponding to the test board to be manufactured based on the reference filling quantity of the filling equipment;

[0008] Obtain the same number of adhesive sheets as the number of adhesive sheets;

[0009] Test plates are made based on each adhesive sheet; the test plates include multiple recessed areas of different depths.

[0010] In one embodiment, a test plate is fabricated based on each adhesive sheet, including:

[0011] The adhesive sheets are sorted to obtain the window opening order of each adhesive sheet;

[0012] Based on the opening sequence of each adhesive sheet, windows are opened sequentially on each adhesive sheet;

[0013] A test board is generated based on each adhesive sheet after the window is opened.

[0014] In one embodiment, windows are sequentially opened on each adhesive sheet based on the opening sequence of each adhesive sheet, including:

[0015] Based on the opening sequence of each adhesive sheet, a preset number of windows are opened on the first adhesive sheet;

[0016] Based on the window opened on the first adhesive sheet and the preset window opening rules for adjacent adhesive sheets, windows are opened on the remaining adhesive sheets in each adhesive sheet.

[0017] In one embodiment, the rules for opening adjacent adhesive sheet windows include:

[0018] On the next adhesive sheet, windows are opened in the same position and number as those on the previous adhesive sheet, and a preset number of new windows are opened in other positions on the next adhesive sheet.

[0019] In one embodiment, a test plate is generated based on each adhesive sheet after the window is opened, including:

[0020] Obtain the substrate of the test board; the size of the substrate is greater than or equal to the size of each adhesive sheet;

[0021] Based on the order of the number of windows on each adhesive sheet from smallest to largest, the adhesive sheets are pressed onto the substrate sequentially from bottom to top to obtain the test board.

[0022] Secondly, this application also provides a method for testing a filling device, the method comprising:

[0023] The filling device is controlled to fill recessed areas of different depths on the test plate; the test plate is manufactured according to the method in any embodiment of the first aspect;

[0024] The filling performance of the filling equipment is determined based on the flatness of the test plate after filling.

[0025] Thirdly, this application also provides a test board fabrication apparatus, comprising:

[0026] The determination module is used to determine the number of adhesive sheets corresponding to the test board to be manufactured based on the reference filling quantity of the filling equipment.

[0027] The acquisition module is used to acquire the same number of adhesive sheets as the number of adhesive sheets.

[0028] The module is used to create test plates based on each adhesive sheet; the test plates include multiple recessed areas of different depths.

[0029] Fourthly, this application also provides a filling equipment testing apparatus, comprising:

[0030] The filling module is used to control the filling equipment to fill the recessed areas of different depths on the test plate;

[0031] The testing module is used to determine the filling performance of the filling equipment based on the flatness of the test plate after filling.

[0032] Fifthly, this application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps of the method in any of the embodiments of the first or second aspect described above.

[0033] In a sixth aspect, this application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the method in any of the embodiments of the first or second aspect described above.

[0034] In a seventh aspect, this application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the method in any of the embodiments of the first or second aspect described above.

[0035] The aforementioned method for fabricating printed circuit boards with varying height differences involves determining the number of bonding sheets corresponding to the test board to be fabricated based on the reference fill quantity of the filling equipment, obtaining bonding sheets of the same number, and then fabricating a test board including multiple recessed areas of different depths based on each bonding sheet. In this method, the number of bonding sheets for the test board is determined based on the reference fill quantity of the filling equipment, and the test board is fabricated according to the bonding sheets corresponding to this number. This method of fabricating the test board takes into account the reference fill capability of the filling equipment, resulting in more realistic and effective test results. Furthermore, the inclusion of multiple recessed areas of different depths on the test board means that it can also be applied to testing scenarios where the filling equipment faces recessed areas of different depths, facilitating further acquisition of the filling performance of the filling equipment under different testing scenarios. This enriches the application scenarios of the test board while improving the testing efficiency of the filling equipment. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 This is an internal structure diagram of a mechatronic device in one embodiment;

[0038] Figure 2 This is a flowchart illustrating a test board fabrication method in one embodiment;

[0039] Figure 3 This is a flowchart illustrating the test board fabrication method in another embodiment;

[0040] Figure 4 This is a flowchart illustrating the test board fabrication method in another embodiment;

[0041] Figure 5 This is a schematic diagram showing the window position of the adhesive sheet in one embodiment;

[0042] Figure 6 This is a schematic diagram showing the window position of the adhesive sheet in another embodiment;

[0043] Figure 7 This is a schematic diagram showing the window position of the adhesive sheet in another embodiment;

[0044] Figure 8 This is a flowchart illustrating the test board fabrication method in another embodiment;

[0045] Figure 9 This is a cross-sectional view of the test board in one embodiment;

[0046] Figure 10 This is a flowchart illustrating the test board fabrication method in another embodiment;

[0047] Figure 11 This is a flowchart illustrating a filling device testing method in one embodiment;

[0048] Figure 12 This is a structural block diagram of a test board fabrication apparatus in one embodiment;

[0049] Figure 13 This is a structural block diagram of a filling device testing apparatus in one embodiment. Detailed Implementation

[0050] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0051] The test board fabrication method provided in this application can be applied to mechatronic equipment in industrial settings, such as CNC machine tools and industrial robots. Taking a CNC machine tool as an example, a CNC machine tool is an automated machine tool equipped with a program control system. This control system can logically process programs with control codes or other symbolic instructions, decode them, represent them with coded numbers, input them to the CNC device through an information carrier, and after calculation and processing, the CNC device sends out various control signals to control the machine tool's movements. According to the pre-set shape and size, it automatically processes parts to obtain industrial products that meet the requirements.

[0052] Please see Figure 1 , Figure 1This is a structural diagram of the internal structure of a mechatronics device, including a processor, memory, input / output interfaces, a communication interface, a display unit, and input devices. The processor, memory, and input / output interfaces are connected via a system bus, and the communication interface, display unit, and input devices are also connected to the system bus via the input / output interfaces. The processor provides computing and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system and computer programs. The internal memory provides the environment for the operation of the operating system and computer programs stored in the non-volatile storage media. The input / output interfaces are used for exchanging information between the processor and external devices. The communication interface is used for wired or wireless communication with external terminals; wireless communication can be achieved through Wi-Fi, mobile cellular networks, NFC (Near Field Communication), or other technologies. When the computer program is executed by the processor, it implements a test board fabrication method.

[0053] Those skilled in the art will understand that Figure 1 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0054] During PCB manufacturing, the surface of the laminated PCB is uneven due to the influence of non-flowing adhesive sheets. Therefore, in actual production, filling equipment with filling capabilities, such as vacuum presses or regular presses, is often required to fill the areas where the adhesive sheets are located on the PCB.

[0055] Different filling devices have different filling capabilities, so different test boards need to be made to test them. For example, if filling device 1 supports filling PCBs with 3 layers of adhesive sheets, then test board 1 with a 3-layer adhesive sheet recess depth needs to be made; if filling device 2 supports filling PCBs with 5 layers of adhesive sheets, then test board 2 with a 5-layer adhesive sheet recess depth needs to be made.

[0056] Furthermore, for any filling device, the filling effectiveness of the filling device also needs to be verified. For example, in an actual filling scenario, can filling device 1 effectively fill a PCB including 3 layers of adhesive sheets? If not, can it effectively fill a PCB including 2 layers of adhesive sheets? And so on, to obtain the actual filling performance of the filling device.

[0057] In related technologies, to test the filling capabilities of different filling devices, it is necessary to fabricate multiple test plates with different degrees of indentation, and then fill each test plate one by one according to the filling device to obtain the filling performance of the filling device. However, the test scenarios for test plates fabricated in this way are relatively limited, which affects the testing efficiency of the filling device.

[0058] Based on this, this application provides a test board manufacturing method. By creating recessed areas with different height differences on the same test board, the actual filling capabilities of different types of filling equipment can be verified, thereby expanding the application scenarios of the test board and improving the testing efficiency of filling equipment.

[0059] The technical solution of this application and how it solves the above-mentioned technical problems will be described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will be described below with reference to the accompanying drawings.

[0060] In one exemplary embodiment, such as Figure 2 As shown, a method for fabricating a test board is provided, including the following steps:

[0061] S201, determine the number of adhesive sheets corresponding to the test board to be manufactured based on the reference filling quantity of the filling equipment.

[0062] The reference fill quantity indicates the theoretical number of adhesive sheets in a PCB that the filling device can support filling.

[0063] To verify the filling performance of the filling equipment, the reference filling quantity of the filling equipment can be directly read and determined as the number of adhesive sheets corresponding to the test board to be made.

[0064] In practical scenarios, considering that the reference filling quantity of the filling equipment is usually the rated reference value set by the filling equipment manufacturer, which is often lower than the actual filling capacity of the filling equipment, in order to test the maximum filling performance of the filling equipment, a preset filling quantity can be superimposed on the reference filling quantity, and the superposition result of the reference filling quantity and the preset filling quantity can be determined as the number of adhesive sheets corresponding to the test board to be made.

[0065] In another scenario, considering factors such as the aging of the filling equipment, its service life, and the filling environment, half of the reference filling quantity can be used as the number of adhesive sheets corresponding to the test board to be made.

[0066] S202, Obtain the same number of adhesive sheets as the number of adhesive sheets.

[0067] It should be noted that each adhesive sheet serves as a raw material for the test board.

[0068] Mechatronics equipment can identify adhesive sheets of the same quantity as the adhesive sheets in the adhesive sheet warehouse and grab them onto the operating platform; it can also send an adhesive sheet acquisition request carrying adhesive sheet quantity information to a third-party intelligent device based on a communication network, and receive adhesive sheets of the same quantity sent by the third-party intelligent device, thereby sharing the computational burden of the mechatronics equipment.

[0069] S203, make a test plate according to each adhesive sheet; the test plate includes multiple recessed areas of different depths.

[0070] In cases where the test board includes multiple recessed areas of different depths, the present application embodiments do not limit the manufacturing process of the test board.

[0071] Optionally, the adhesive sheets are stacked first, and then multiple recessed areas of different depths are opened from top to bottom at different positions of the topmost adhesive sheet to obtain a test plate.

[0072] In this embodiment, the number of adhesive sheets corresponding to the test board to be manufactured is determined based on the reference filling quantity of the filling device, and adhesive sheets of the same number are obtained. Then, a test board including multiple recessed areas of different depths is manufactured based on each adhesive sheet. In this method, the number of adhesive sheets for the test board is determined based on the reference filling quantity of the filling device, and then the test board is manufactured based on the adhesive sheets corresponding to the number of adhesive sheets. This method of manufacturing the test board takes into account the reference filling capability of the filling device, so the test results obtained by testing the filling device based on this test board are more realistic and effective. Furthermore, the test board includes multiple recessed areas of different depths, meaning that the test board can also be applied to test scenarios where the filling device faces recessed areas of different depths, so as to further obtain the filling performance of the filling device under different test scenarios. Such a test board enriches the application scenarios of the test board and improves the testing efficiency of the filling device.

[0073] In the foregoing embodiments, the method of manufacturing the test board is not limited. Therefore, one possible method of manufacturing the test board is described below. In an exemplary embodiment, such as... Figure 3 As shown, a test board is fabricated based on each adhesive sheet, including:

[0074] S301, sort the adhesive sheets to obtain the window opening order of each adhesive sheet.

[0075] It should be noted that all the adhesive sheets before the window was opened had flat surfaces and were of the same size, meaning that the shape and material of each adhesive sheet were the same.

[0076] Based on this, the windowing sequence of each adhesive sheet can be determined according to the time sequence of acquisition, or the number of each adhesive sheet can be determined according to the distance between each adhesive sheet and the windowing tool in the mechatronics equipment, and the number of each adhesive sheet can be used as the corresponding windowing sequence. The windowing tool is used to open the windows of the adhesive sheets.

[0077] S302, windows are opened sequentially on each adhesive sheet based on the opening sequence of each adhesive sheet.

[0078] Taking three adhesive sheets as an example, windows are opened in the order of opening windows on the first adhesive sheet, the second adhesive sheet, and the third adhesive sheet. In other words, the adhesive sheet with the corresponding window position is removed from each adhesive sheet to obtain each adhesive sheet after opening windows.

[0079] S303, generate a test board based on each adhesive sheet after opening the window.

[0080] The adhesive sheets with the windows opened are stacked and pressed together to obtain the test plate.

[0081] In this embodiment, windows are sequentially opened on each adhesive sheet according to the opening order of each adhesive sheet. This is equivalent to sorting the adhesive sheets first and then opening windows on them to obtain the test board. This method of generating the test board is logically clear, easy to program and implement, and improves the production efficiency of the test board to a certain extent.

[0082] The following example illustrates one implementation of opening a window in the aforementioned embodiments. In an exemplary embodiment, such as... Figure 4 As shown, based on the windowing sequence of each adhesive sheet, windows are sequentially opened on each adhesive sheet, including:

[0083] S401, based on the windowing sequence of each adhesive sheet, opens a preset number of windows on the first adhesive sheet.

[0084] Based on the windowing sequence of each adhesive sheet, the first adhesive sheet is determined, and a preset number of windows are opened on the first adhesive sheet.

[0085] Please see Figure 5 , Figure 5 This is a schematic diagram showing the window position of the first adhesive sheet, and a top view of the adhesive sheet, taking a preset quantity of 3 as an example. Figure 5 The three windows (window 1, window 2 and window 3) are the same size and are all cutout areas of the adhesive sheet, representing the three windows opened on the adhesive sheet.

[0086] S402, based on the window opened on the first adhesive sheet and the preset window opening rules for adjacent adhesive sheets, open windows for the remaining adhesive sheets in each adhesive sheet.

[0087] The rules for opening windows on adjacent adhesive sheets include: opening windows on the next adhesive sheet in the same position and number as those on the previous adhesive sheet, and opening a preset number of new windows in other positions on the next adhesive sheet.

[0088] by Figure 5 For example, please refer to the first adhesive sheet shown. Figure 6 , Figure 6 This is a schematic diagram showing the window position of the second adhesive sheet, and a top view of the adhesive sheet. Figure 6 It includes six windows, of which three windows (window 4, window 5, and window 6) are positioned relative to... Figure 5 The three windows (window 1, window 2, and window 3) of the first adhesive sheet shown are in the same position and have the same number (three in total). Additionally, Figure 6 The other three windows (windows 7, 8, and 9) are in different positions from windows 4, 5, and 6, and have the same number of windows as in the first adhesive sheet.

[0089] Using the example of three adhesive sheets corresponding to the test board, please continue to refer to [link / reference]. Figure 7 , Figure 7 This is a schematic diagram showing the window position of the third adhesive sheet, and a top view of the adhesive sheet. Figure 7 It includes nine windows, of which six windows (windows 10-15) are positioned relative to... Figure 6 The six windows (windows 1-6) of the second adhesive sheet shown are in the same position and have the same number, all six. Additionally, Figure 7 The other three windows (windows 16-18) are in different positions from windows 10-15, and have the same number of windows as in the first adhesive sheet.

[0090] In this embodiment, for the first adhesive sheet, a preset number of windows are opened on the first adhesive sheet. For each adhesive sheet after the first adhesive sheet, windows are opened on each adhesive sheet according to the preset rules for opening windows of adjacent adhesive sheets. And so on, windows are opened on each adhesive sheet corresponding to the test board. This method of opening windows is logically clear and easy to deploy.

[0091] The following example illustrates one implementation of generating a test board based on the adhesive sheet with a window opened, as described in the aforementioned embodiments. In an exemplary embodiment, such as... Figure 8 As shown, a test plate is generated based on the adhesive sheets after the windows are opened, including:

[0092] S801, Obtain the substrate of the test board; the size of the substrate is greater than or equal to the size of each adhesive sheet.

[0093] The substrate is the basic material for manufacturing PCBs. It can be a copper-clad laminate and has the characteristics of conductivity, insulation, and support. In the embodiments of this application, the substrate is used to support multiple adhesive sheets, which requires that the size of the substrate be greater than or equal to the size of the adhesive sheets.

[0094] S802, according to the order of the number of windows on each adhesive sheet from smallest to largest, press each adhesive sheet onto the substrate in sequence from bottom to top to obtain the test board.

[0095] Based on the order of the number of windows on each adhesive sheet from smallest to largest, the substrate is placed at the bottom, and the adhesive sheet with the fewest windows is stacked on top of the substrate and pressed together to obtain the first intermediate part of the test board; then the adhesive sheet with the second fewest windows is stacked on the first intermediate part and pressed together to obtain the second intermediate part of the test board; and so on, pressing each adhesive sheet onto the substrate in sequence from bottom to top to obtain the test board.

[0096] by Figures 5-7 Taking the first, second, and third adhesive sheets shown as examples, Figure 9 This is a cross-sectional view of the test board obtained by pressing the three adhesive sheets onto the substrate from bottom to top. Figure 9 In the middle, the bottom layer is the substrate of the test board, the layer above the substrate is the first adhesive sheet, the layer above the first adhesive sheet is the second adhesive sheet, and the layer above the second adhesive sheet is the third adhesive sheet.

[0097] from Figure 9 As can be seen, the test board includes, from right to left, recessed areas corresponding to the thickness of one layer of adhesive sheet, recessed areas corresponding to the thickness of two layers of adhesive sheet, and recessed areas corresponding to the thickness of three layers of adhesive sheet. Specifically, the recessed area corresponding to the thickness of one layer of adhesive sheet is formed by the window of the third adhesive sheet; the recessed area corresponding to the thickness of two layers of adhesive sheet is formed by the overlapping windows of the second and third adhesive sheets; and the recessed area corresponding to the thickness of three layers of adhesive sheet is formed by the overlapping windows of the first, second, and third adhesive sheets.

[0098] In this embodiment, considering the easy deformation of the adhesive sheet, each adhesive sheet after the window is opened is fixed by a substrate, and a test board is obtained based on the pressing process. This process restores the actual manufacturing process of the PCB board to a certain extent, making the test board closer to the real PCB board, and thus testing the filling performance of the filling device in actual application scenarios.

[0099] In one exemplary embodiment, such as Figure 10 As shown, a method for fabricating a test board is provided, including the following steps:

[0100] S1001, determine the number of adhesive sheets corresponding to the test board to be manufactured based on the reference filling quantity of the filling equipment.

[0101] S1002, Obtain adhesive sheets that are the same number as the number of adhesive sheets.

[0102] S1003, sort the adhesive sheets to obtain the window opening order of each adhesive sheet.

[0103] S1004, based on the windowing sequence of each adhesive sheet, a preset number of windows are opened on the first adhesive sheet.

[0104] S1005, based on the window opened on the first adhesive sheet and the preset window opening rules for adjacent adhesive sheets, open windows for the remaining adhesive sheets in each adhesive sheet.

[0105] The rules for opening windows on adjacent adhesive sheets include: opening windows on the next adhesive sheet in the same position and number as those on the previous adhesive sheet, and opening a preset number of new windows in other positions on the next adhesive sheet.

[0106] S1006, Obtain the substrate of the test board; the size of the substrate is greater than or equal to the size of each adhesive sheet.

[0107] S1007, according to the order of the number of windows on each adhesive sheet from smallest to largest, press each adhesive sheet onto the substrate in sequence from bottom to top to obtain the test board.

[0108] The test board includes multiple recessed areas of varying depths.

[0109] In this embodiment, the number of adhesive sheets corresponding to the test board to be manufactured is determined based on the reference filling quantity of the filling device, and adhesive sheets of the same number are obtained. Then, a test board including multiple recessed areas of different depths is manufactured based on each adhesive sheet. In this method, the number of adhesive sheets for the test board is determined based on the reference filling quantity of the filling device, and then the test board is manufactured based on the adhesive sheets corresponding to the number of adhesive sheets. This method of manufacturing the test board takes into account the reference filling capability of the filling device, so the test results obtained by testing the filling device based on this test board are more realistic and effective. Furthermore, the test board includes multiple recessed areas of different depths, meaning that the test board can also be applied to test scenarios where the filling device faces recessed areas of different depths, so as to further obtain the filling performance of the filling device under different test scenarios. Such a test board enriches the application scenarios of the test board and improves the testing efficiency of the filling device.

[0110] In one exemplary embodiment, such as Figure 11 As shown, a filling device testing method is provided, including the following steps:

[0111] S1101 controls the filling device to fill the recessed areas of different depths on the test plate.

[0112] The test board is made according to any of the above-mentioned test board manufacturing methods.

[0113] S1102, Determine the filling performance of the filling equipment based on the flatness of the test plate after filling.

[0114] Flatness is the average flatness corresponding to each concave area. The average flatness corresponding to different concave areas on the test board is obtained through image recognition technology. If the average flatness is greater than the average flatness, the filling performance of the filling equipment is determined to be qualified.

[0115] In another scenario, image recognition technology is used to obtain the flatness corresponding to each recessed area. Then, each flatness is compared with a flatness threshold, and the deepest recess depth exceeding the flatness threshold is determined as the filling performance of the filling device. For example, the test board includes recessed areas with a depth of one layer of adhesive sheet, two layers of adhesive sheet, and three layers of adhesive sheet, with corresponding flatnesses of 100%, 100%, and 75%, respectively. If the flatness threshold is 80%, then among the recessed areas with a depth of one layer of adhesive sheet and the recessed areas with a depth of two layers of adhesive sheet, the recessed area with a depth of two layers of adhesive sheet is determined as the filling performance of the filling device.

[0116] In this embodiment, the filling device is controlled to fill the recessed areas of different depths on the test board, and the filling performance of the filling device when facing recessed areas of different depths is obtained at one time. Based on the flatness of the test board after filling, the filling performance of the filling device is objectively and accurately determined.

[0117] It should be understood that although the steps in the flowcharts of the embodiments described above are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the embodiments described above may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0118] Based on the same inventive concept, this application also provides a test board fabrication apparatus for implementing the test board fabrication method described above. The solution provided by this apparatus is similar to the solution described in the above method; therefore, the specific limitations in one or more test board fabrication apparatus embodiments provided below can be found in the limitations of the test board fabrication method described above, and will not be repeated here.

[0119] In one exemplary embodiment, such as Figure 12 As shown, a test board fabrication apparatus is provided, comprising: a determining module 1201, an acquiring module 1202, and a fabrication module 1203, wherein:

[0120] The determination module 1201 is used to determine the number of adhesive sheets corresponding to the test board to be manufactured based on the reference filling quantity of the filling equipment.

[0121] The acquisition module 1202 is used to acquire adhesive sheets of the same quantity as the adhesive sheets;

[0122] Module 1203 is used to fabricate test plates based on each adhesive sheet; the test plates include multiple recessed areas of different depths.

[0123] In an exemplary embodiment, the manufacturing module 1203 includes a sorting unit, an opening unit, and a generating unit, wherein:

[0124] The sorting unit is used to sort the adhesive sheets to obtain the windowing order of each adhesive sheet;

[0125] An opening unit is used to sequentially open windows on each adhesive sheet based on the opening sequence of each adhesive sheet;

[0126] The generation unit is used to generate a test plate based on each adhesive sheet after the window is opened.

[0127] In an exemplary embodiment, the opening unit includes a first opening subunit and a second opening subunit, wherein:

[0128] The first opening subunit is used to open a preset number of windows on the first adhesive sheet based on the opening sequence of each adhesive sheet;

[0129] The second opening subunit is used to open windows on the remaining adhesive sheets in each adhesive sheet according to the windows opened on the first adhesive sheet and the preset opening rules for adjacent adhesive sheet windows.

[0130] In one exemplary embodiment, the rules for opening adjacent adhesive sheet windows include:

[0131] On the next adhesive sheet, windows are opened in the same position and number as those on the previous adhesive sheet, and a preset number of new windows are opened in other positions on the next adhesive sheet.

[0132] In one exemplary embodiment, the generation unit includes a substrate acquisition subunit and a substrate lamination subunit, wherein:

[0133] The substrate acquisition subunit is used to acquire the substrate of the test board; the size of the substrate is greater than or equal to the size of each adhesive sheet;

[0134] The substrate pressing subunit is used to press each adhesive sheet onto the substrate in order from bottom to top, according to the order of the number of windows on each adhesive sheet from smallest to largest, to obtain a test board.

[0135] Each module in the aforementioned test board fabrication device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in or independent of the processor in a computer device, or stored in the memory of a computer device as software, so that the processor can call and execute the operations corresponding to each module.

[0136] Based on the same inventive concept, this application also provides a filling device testing apparatus for implementing the filling device testing method described above. The solution provided by this apparatus is similar to the implementation scheme described in the above method; therefore, the specific limitations in one or more filling device testing apparatus embodiments provided below can be found in the limitations of the filling device testing method described above, and will not be repeated here.

[0137] In one exemplary embodiment, such as Figure 13 As shown, a filling equipment testing apparatus is provided, including: a filling module 1301 and a testing module 1302, wherein:

[0138] The filling module 1301 is used to control the filling device to fill the recessed areas of different depths on the test plate;

[0139] Test module 1302 is used to determine the filling performance of the filling equipment based on the flatness of the test plate after filling.

[0140] Each module in the aforementioned filling equipment testing apparatus can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in or independent of the processor in a computer device, or stored in the memory of a computer device as software, so that the processor can call and execute the operations corresponding to each module.

[0141] In one exemplary embodiment, a computer device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to perform the following steps:

[0142] Determine the number of adhesive sheets corresponding to the test board to be manufactured based on the reference filling quantity of the filling equipment;

[0143] Obtain the same number of adhesive sheets as the number of adhesive sheets;

[0144] Test plates are made based on each adhesive sheet; the test plates include multiple recessed areas of different depths.

[0145] In one exemplary embodiment, the processor further performs the following steps when executing the computer program:

[0146] The adhesive sheets are sorted to obtain the window opening order of each adhesive sheet;

[0147] Based on the opening sequence of each adhesive sheet, windows are opened sequentially on each adhesive sheet;

[0148] A test board is generated based on each adhesive sheet after the window is opened.

[0149] In one exemplary embodiment, the processor further performs the following steps when executing the computer program:

[0150] Based on the opening sequence of each adhesive sheet, a preset number of windows are opened on the first adhesive sheet;

[0151] Based on the window opened on the first adhesive sheet and the preset window opening rules for adjacent adhesive sheets, windows are opened on the remaining adhesive sheets in each adhesive sheet.

[0152] In one exemplary embodiment, the rules for opening adjacent adhesive sheet windows include:

[0153] On the next adhesive sheet, windows are opened in the same position and number as those on the previous adhesive sheet, and a preset number of new windows are opened in other positions on the next adhesive sheet.

[0154] In one exemplary embodiment, the processor further performs the following steps when executing the computer program:

[0155] Obtain the substrate of the test board; the size of the substrate is greater than or equal to the size of each adhesive sheet;

[0156] Based on the order of the number of windows on each adhesive sheet from smallest to largest, the adhesive sheets are pressed onto the substrate sequentially from bottom to top to obtain the test board.

[0157] In one exemplary embodiment, the processor further performs the following steps when executing the computer program:

[0158] The filling device is controlled to fill recessed areas of different depths on the test plate; the test plate is manufactured according to the method in any embodiment of the first aspect;

[0159] The filling performance of the filling equipment is determined based on the flatness of the test plate after filling.

[0160] In one exemplary embodiment, a computer-readable storage medium is provided having a computer program stored thereon, which, when executed by a processor, performs the following steps:

[0161] Determine the number of adhesive sheets corresponding to the test board to be manufactured based on the reference filling quantity of the filling equipment;

[0162] Obtain the same number of adhesive sheets as the number of adhesive sheets;

[0163] Test plates are made based on each adhesive sheet; the test plates include multiple recessed areas of different depths.

[0164] In one exemplary embodiment, when the computer program is executed by the processor, it further performs the following steps:

[0165] The adhesive sheets are sorted to obtain the window opening order of each adhesive sheet;

[0166] Based on the opening sequence of each adhesive sheet, windows are opened sequentially on each adhesive sheet;

[0167] A test board is generated based on each adhesive sheet after the window is opened.

[0168] In an exemplary embodiment, when the computer program is executed by the processor, it further performs the following steps: opening a preset number of windows on the first adhesive sheet based on the windowing sequence of each adhesive sheet;

[0169] Based on the window opened on the first adhesive sheet and the preset window opening rules for adjacent adhesive sheets, windows are opened on the remaining adhesive sheets in each adhesive sheet.

[0170] In one exemplary embodiment, the rules for opening adjacent adhesive sheet windows include:

[0171] On the next adhesive sheet, windows are opened in the same position and number as those on the previous adhesive sheet, and a preset number of new windows are opened in other positions on the next adhesive sheet.

[0172] In one exemplary embodiment, when the computer program is executed by the processor, it further performs the following steps: obtaining the substrate of the test board; the size of the substrate is greater than or equal to the size of each adhesive sheet;

[0173] Based on the order of the number of windows on each adhesive sheet from smallest to largest, the adhesive sheets are pressed onto the substrate sequentially from bottom to top to obtain the test board.

[0174] In one exemplary embodiment, when the computer program is executed by the processor, it further performs the following steps:

[0175] The filling device is controlled to fill recessed areas of different depths on the test plate; the test plate is manufactured according to the method in any embodiment of the first aspect;

[0176] The filling performance of the filling equipment is determined based on the flatness of the test plate after filling.

[0177] In one exemplary embodiment, a computer program product is provided, including a computer program that, when executed by a processor, performs the following steps:

[0178] Determine the number of adhesive sheets corresponding to the test board to be manufactured based on the reference filling quantity of the filling equipment;

[0179] Obtain the same number of adhesive sheets as the number of adhesive sheets;

[0180] Test plates are made based on each adhesive sheet; the test plates include multiple recessed areas of different depths.

[0181] In one exemplary embodiment, when the computer program is executed by the processor, it further performs the following steps:

[0182] The adhesive sheets are sorted to obtain the window opening order of each adhesive sheet;

[0183] Based on the opening sequence of each adhesive sheet, windows are opened sequentially on each adhesive sheet;

[0184] A test board is generated based on each adhesive sheet after the window is opened.

[0185] In an exemplary embodiment, when the computer program is executed by the processor, it further performs the following steps: opening a preset number of windows on the first adhesive sheet based on the windowing sequence of each adhesive sheet;

[0186] Based on the window opened on the first adhesive sheet and the preset window opening rules for adjacent adhesive sheets, windows are opened on the remaining adhesive sheets in each adhesive sheet.

[0187] In one exemplary embodiment, the rules for opening adjacent adhesive sheet windows include:

[0188] On the next adhesive sheet, windows are opened in the same position and number as those on the previous adhesive sheet, and a preset number of new windows are opened in other positions on the next adhesive sheet.

[0189] In one exemplary embodiment, when the computer program is executed by the processor, it further performs the following steps: obtaining the substrate of the test board; the size of the substrate is greater than or equal to the size of each adhesive sheet;

[0190] Based on the order of the number of windows on each adhesive sheet from smallest to largest, the adhesive sheets are pressed onto the substrate sequentially from bottom to top to obtain the test board.

[0191] In one exemplary embodiment, when the computer program is executed by the processor, it further performs the following steps:

[0192] The filling device is controlled to fill recessed areas of different depths on the test plate; the test plate is manufactured according to the method in any embodiment of the first aspect;

[0193] The filling performance of the filling equipment is determined based on the flatness of the test plate after filling.

[0194] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of the relevant data must comply with relevant regulations.

[0195] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments described above. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these.

[0196] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0197] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A method for fabricating a test board, characterized in that, The method includes: The number of adhesive sheets corresponding to the test board to be manufactured is determined based on the reference filling quantity of the filling equipment; the reference filling quantity represents the number of adhesive sheets in the test board that the filling equipment supports filling. Obtain the same number of adhesive sheets as the number of adhesive sheets mentioned above; The adhesive sheets are sorted to obtain the window opening order of each adhesive sheet; Based on the opening sequence of each adhesive sheet, windows are sequentially opened on each adhesive sheet; The adhesive sheets with windows are stacked and pressed together to obtain a test plate. In the test plate, the next adhesive sheet has windows in the same position and number as the previous adhesive sheet, and a preset number of new windows are opened in other positions on the next adhesive sheet. The test plate includes multiple recessed areas of different depths.

2. The method according to claim 1, characterized in that, The step of stacking and pressing the adhesive sheets after opening the window to obtain the test plate includes: Obtain the substrate of the test board; the size of the substrate is greater than or equal to the size of each adhesive sheet; According to the order of the number of windows on each adhesive sheet from smallest to largest, the adhesive sheets are pressed onto the substrate in sequence from bottom to top to obtain the test board.

3. A method for testing filling equipment, characterized in that, The method includes: The filling device is controlled to fill recessed areas of different depths on the test plate; the test plate is manufactured according to the method described in claim 1 or 2. The filling performance of the filling device is determined based on the flatness of the test plate after filling.

4. The method according to claim 3, characterized in that, Determining the filling performance of the filling equipment based on the flatness of the test plate after filling includes: The flatness of each recessed area on the test board is obtained through image recognition. Each of the flatness values ​​is compared with a flatness threshold, and the deepest depression depth that is greater than the flatness threshold is determined as the filling performance of the filling device.

5. A test board fabrication apparatus, characterized in that, The device includes: The determining module is used to determine the number of adhesive sheets corresponding to the test board to be manufactured based on the reference filling quantity of the filling equipment; the reference filling quantity represents the number of adhesive sheets in the test board that the filling equipment supports filling. The acquisition module is used to acquire the same number of adhesive sheets as the number of adhesive sheets. The manufacturing module is used to sort the adhesive sheets to obtain the windowing order of the adhesive sheets; based on the windowing order of the adhesive sheets, windows are opened on each adhesive sheet in sequence; the adhesive sheets after opening the windows are stacked and pressed together to obtain a test plate; in the test plate, the next adhesive sheet in an adjacent adhesive sheet has windows in the same position and number as the previous adhesive sheet, and the next adhesive sheet has a preset number of new windows in other positions; the test plate includes multiple recessed areas of different depths.

6. A filling equipment testing apparatus, characterized in that, The device includes: A filling module is used to control the filling device to fill recessed areas of different depths on the test plate; the test plate is manufactured according to the method described in claim 1 or 2. The testing module is used to determine the filling performance of the filling device based on the flatness of the test plate after filling.

7. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 4.

8. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 4.

9. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 4.