Antifouling plated article and method of making and use thereof

Abstract

This application relates to the field of antifouling and waterproof materials technology, and in particular to an antifouling coated part, its preparation method, and its application, to solve the problems of insufficient stability, poor reliability, poor scratch resistance, and susceptibility to damage when subjected to external force in related technologies. An antifouling coated part includes: a substrate to be coated; a metal underlayer disposed on the surface of the substrate; a transition layer disposed on the surface of the metal underlayer facing away from the substrate; and a hydrophobic layer disposed on the surface of the transition layer facing away from the metal underlayer; wherein the materials of the transition layer and the hydrophobic layer both include inorganic materials, and both the transition layer and the hydrophobic layer contain silicon, and the surface of the hydrophobic layer facing away from the transition layer has a superhydrophobic surface micro / nano structure. This application is used for coating antifouling products with a hydrophobic film.

Description

Technical Field

[0001] This application relates to the field of antifouling and waterproof materials technology, and in particular to an antifouling plated part, its preparation method and application. Background Technology

[0002] Currently, with the continuous advancement of technology and the continuous improvement of people's living standards, people are paying more and more attention to the waterproof and stain-resistant functions of a large number of product surfaces. For example, kitchen and bathroom products, car parts, electronic products such as mobile phones, watches, and glasses increasingly need to be waterproof and stain-resistant to reduce the pollution and residue of fingerprints, stains, etc.

[0003] To address the problem of these products easily attracting dust, oil, water stains, etc., during use and being difficult to clean, an anti-fouling coating is typically applied to the surface of these products (also referred to here as the substrate to be plated). The anti-fouling coating's waterproof and anti-fouling properties achieve the product's self-cleaning function. Currently, examples of such anti-fouling coatings include hydrophobic films made of inert hydrophobic fluorosilicone composites, non-fluorosilicone polymer melts, and organic-inorganic hybrid superhydrophobic materials with nanostructures.

[0004] However, these hydrophobic films have drawbacks such as insufficient stability, poor reliability, and poor scratch resistance, making them easily damaged when subjected to external forces, which are detrimental to maintaining the hydrophobic properties of the product surface. Summary of the Invention

[0005] Therefore, it is necessary to provide an anti-fouling coated part, its preparation method and application, to solve the problems of insufficient stability, poor reliability, poor scratch resistance and easy damage when subjected to external force in the hydrophobic film layer in the related technology.

[0006] Firstly, an anti-fouling plated part is provided, comprising:

[0007] Substrate to be plated;

[0008] A metal underlayer is applied to the surface of the substrate to be plated.

[0009] A transition layer is disposed on the surface of the metal underlayer facing away from the substrate to be plated; and

[0010] A hydrophobic layer is disposed on the surface of the transition layer opposite to the metal underlayer;

[0011] The materials of the transition layer and the hydrophobic layer are independently selected from inorganic materials, and both the transition layer and the hydrophobic layer contain silicon. The surface of the hydrophobic layer away from the transition layer has a superhydrophobic surface micro / nano structure.

[0012] Optionally, the hydrophobic layer includes a first hydrophobic layer and a second hydrophobic layer stacked sequentially in a direction gradually moving away from the substrate to be plated;

[0013] The transition layer is made of silicon, the first hydrophobic layer is made of one or more of silicon carbide and silicon nitride, and the second hydrophobic layer is made of carbon.

[0014] Optionally, the thickness of the transition layer is 50 nm to 100 nm; and / or,

[0015] The thickness of the first hydrophobic layer is 50 nm to 100 nm; and / or,

[0016] The thickness of the second hydrophobic layer is 20nm to 50nm.

[0017] Optionally, the metal underlayment satisfies at least one of the following conditions:

[0018] (1) The material of the metal underlay includes one or more of Zr, Ti, Cr and Ta;

[0019] (2) The thickness of the metal underlayer is 10nm to 50nm.

[0020] Optionally, the material of the substrate to be plated is selected from one or more of glass, ceramics, metals, and plastics.

[0021] Secondly, a method for preparing an anti-fouling plated part is provided, comprising:

[0022] Form a metal underlayer on the surface of the substrate to be plated;

[0023] A transition layer is formed on the surface of the metal underlayer that is away from the substrate to be plated.

[0024] A hydrophobic layer is formed on the surface of the transition layer opposite to the metal underlayer.

[0025] The materials of the transition layer and the hydrophobic layer are independently selected from inorganic materials, and both the transition layer and the hydrophobic layer contain silicon. The surface of the hydrophobic layer away from the transition layer has a superhydrophobic surface micro / nano structure.

[0026] Optionally, the hydrophobic layer includes a first hydrophobic layer and a second hydrophobic layer, the transition layer is made of silicon, the first hydrophobic layer is made of one or more of silicon nitride and silicon carbide, and the second hydrophobic layer is made of carbon.

[0027] A transition layer is formed on the surface of the metal underlayer that is opposite to the substrate to be plated, including:

[0028] Using silicon as a target, the transition layer is deposited on the surface of the substrate to be plated by a first magnetron sputtering method.

[0029] A hydrophobic layer is formed on the surface of the transition layer opposite to the metal underlayer, comprising:

[0030] Using one or more of silicon nitride and silicon carbide as the target material, a first hydrophobic layer is deposited on the surface of the transition layer opposite to the metal underlayer by a second magnetron sputtering; and

[0031] Using graphite as the target material, a second hydrophobic layer is deposited on the surface of the first hydrophobic layer away from the transition layer using a first multi-arc ion plating process.

[0032] Optionally, the conditions for the first magnetron sputtering include:

[0033] The initial vacuum level in the vacuum chamber during the first magnetron sputtering is 8 × 10⁻⁶. -4 Pa~2×10 -2 During the reaction, the flow rate of the inert gas introduced is 200 sccm to 600 sccm, so that the gas pressure in the vacuum chamber is maintained at 8 × 10⁻⁶ Pa. -2 Pa~6×10 -1 Pa;

[0034] The first magnetron sputtering uses a power supply voltage of 300V to 600V, a current of 10A to 30A, a negative bias voltage of -30V to -100V applied to the substrate to be coated during the coating process, a temperature of 50℃ to 150℃ in the vacuum chamber, and a coating time of 1000s to 1500s.

[0035] Optionally, the conditions for the second magnetron sputtering include:

[0036] The initial vacuum level in the vacuum chamber during the second magnetron sputtering is 8 × 10⁻⁶. -4 Pa~2×10 -2 During the reaction, the flow rate of the inert gas is 200 sccm to 600 sccm, and the flow rate of the reactant gas is 100 sccm to 300 sccm, so that the pressure in the vacuum chamber is maintained at 8 × 10⁻⁶ Pa. -2 Pa~6×10 -1 Pa;

[0037] The second magnetron sputtering uses a power supply voltage of 300V to 600V, a current of 10A to 30A, a negative bias voltage of -30V to -100V applied to the substrate to be coated during coating, a temperature of 50℃ to 150℃ in the vacuum chamber, and a coating time of 1000s to 1500s.

[0038] Optionally, the conditions for the first multi-arc ion plating process include:

[0039] The initial vacuum level in the vacuum chamber of the first multi-arc ion plating process is 8×10⁻⁶. -4 Pa~2×10 -2 During the reaction, the flow rate of the inert gas introduced is 200 sccm to 600 sccm, so that the gas pressure in the vacuum chamber is maintained at 8 × 10⁻⁶ Pa. -2 Pa~6×10 -1 Pa;

[0040] The first multi-arc ion plating process uses a power supply voltage of 20V to 40V, a current of 20A to 50A, a negative bias voltage of -100V to -300V applied to the substrate to be plated during the plating process, a temperature of 50℃ to 150℃ in the vacuum chamber, and a plating time of 120s to 240s.

[0041] Optionally, forming a metal underlayer on the surface of the substrate to be plated includes:

[0042] One or more of Zr, Ti, Cr and Ta are used as the target material, and the metal is deposited as the underlayer on the surface of the substrate to be plated using a second multi-arc ion plating process.

[0043] Optionally, the conditions for the second multi-arc ion plating process include:

[0044] The initial vacuum level in the vacuum chamber of the second multi-arc ion plating process is 8 × 10⁻⁶. -4 Pa~2×10 -2 During the reaction, the flow rate of the inert gas introduced is 200 sccm to 600 sccm, so that the gas pressure in the vacuum chamber is maintained at 8 × 10⁻⁶ Pa. -2 Pa~6×10 -1 Pa;

[0045] The second multi-arc ion plating process uses a power supply voltage of 20V to 40V, a current of 50A to 150A, a negative bias voltage of -100V to -300V applied to the substrate to be plated during plating, a temperature of 50℃ to 150℃ in the vacuum chamber, and a plating time of 60s to 1200s.

[0046] Thirdly, an application of the anti-fouling plating part as described in the first aspect as an anti-fouling product is provided.

[0047] The beneficial technical effects of the antifouling plated parts, their preparation methods, and applications provided in this application are as follows:

[0048] By sequentially forming a metal underlayer, a transition layer, and a hydrophobic layer on the surface of the substrate to be plated, all three layers are selected from inorganic materials. Since the transition layer and the hydrophobic layer both contain silicon, on the one hand, compared to preparing organic coatings on the surface of the substrate in related technologies, the coating on the surface of this antifouling plated part has higher hardness, reducing damage from scratches; on the other hand, by setting a superhydrophobic surface micro / nano structure on the hydrophobic layer surface, the antifouling plated part can be endowed with excellent superhydrophobic properties, thus achieving a self-cleaning effect similar to a lotus leaf. Furthermore, this superhydrophobic surface micro / nanostructure also possesses anti-corrosion properties, particularly for metal substrates. Environmental humidity can cause oxidation and corrosion of metal materials, and the superhydrophobic surface micro / nanostructure's excellent hydrophobic properties enhance the corrosion and oxidation resistance of the metal material. On the other hand, the coating of this antifouling coating exhibits higher hardness compared to organic coatings, and the superhydrophobic surface micro / nanostructure effectively reduces the coefficient of friction on the coating surface, thus significantly improving the coating's abrasion resistance and effectively maintaining its superhydrophobic properties. In summary, the antifouling coating provided in this application can solve the problems of insufficient stability, poor reliability, poor scratch resistance, and susceptibility to damage under external force in related technologies. Attached Figure Description

[0049] Figure 1 A cross-sectional structural diagram of an anti-fouling plated part provided in an embodiment of this application;

[0050] Figure 2 A scanning electron microscope image of the surface of an anti-fouling plated part provided in an embodiment of this application;

[0051] Figure 3 An atomic force microscope image of the surface morphology of an anti-fouling plated part provided in an embodiment of this application;

[0052] Figure 4 Initial contact angle test diagram of the anti-fouling plating part provided in Embodiment 1 of this application;

[0053] Figure 5 The contact angle test diagram of the anti-fouling plated surface provided in Embodiment 1 of this application after being continuously rubbed with a pig bristle brush under a load of 500g for 20,000 cycles;

[0054] Figure 6 Initial contact angle test diagram of the anti-fouling plating part provided for Embodiment 2 of this application;

[0055] Figure 7 The contact angle test diagram of the anti-fouling plated surface provided in Embodiment 2 of this application after being continuously rubbed with a pig bristle brush under a load of 500g for 20,000 cycles;

[0056] Figure 8 Initial contact angle test diagram of the anti-fouling plating part provided in Embodiment 3 of this application;

[0057] Figure 9 The contact angle test diagram of the anti-fouling plated surface provided in Embodiment 3 of this application after being continuously rubbed with a pig bristle brush under a load of 500g for 20,000 cycles;

[0058] Figure 10 Initial contact angle test diagram of the antifouling plated part provided for Comparative Example 1 of this application;

[0059] Figure 11 The contact angle test diagram of the anti-fouling plated surface provided in Comparative Example 1 of this application after being continuously rubbed with a pig bristle brush under a load of 500g for 20,000 cycles.

[0060] Figure 12 Initial contact angle test diagram of the anti-fouling plated part provided for Comparative Example 2 of this application;

[0061] Figure 13 The contact angle test diagram of the anti-fouling plated surface provided for Comparative Example 2 of this application after being continuously rubbed with a pig bristle brush under a load of 500g for 20,000 cycles. Detailed Implementation

[0062] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0063] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiment," "exemplary," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0064] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched regions shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0065] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0066] In this document, unless otherwise stated, "one or more" means one or more.

[0067] In this document, terms such as "for example," "like," "example," and "exemplary" are used for descriptive purposes to indicate a connection in the content covered by different technical solutions presented earlier and later. However, they should not be construed as limitations on the preceding technical solution or as restrictions on the scope of protection of this document. In this document, unless otherwise specified, A (like B) indicates that B is a non-limiting example of A, and it can be understood that A is not limited to B.

[0068] In this article, "optionally," "optionally," and "optional" mean that something is optional, that is, it means that it is selected from either "with" or "without." If there are multiple "options" in a technical solution, unless otherwise specified, and there are no contradictions or mutual constraints, then each "option" is independent.

[0069] In this article, descriptions such as "optionally contains" and "optionally includes" indicate whether or not the component X is present. "Optional component X" indicates whether component X is present or absent, or whether or not component X is present.

[0070] In this document, the terms "first aspect," "second aspect," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or quantity, nor should they be construed as implicitly indicating the importance or quantity of the indicated technical features.

[0071] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0072] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0073] In this article, the technical features described in an open-ended manner include both closed technical solutions composed of the listed features and open technical solutions that include the listed features.

[0074] In this document, "at least one" means one or more, such as one, two, or more. "Multiple" or "several" means at least two, such as two, three, etc., and "multi-layered" means at least two layers, such as two layers, three layers, etc., unless otherwise expressly and specifically defined. In the description of this application, "several" means at least one, such as one, two, etc., unless otherwise expressly and specifically defined.

[0075] In this document, when referring to numerical intervals (i.e., numerical ranges), unless otherwise specified, the distribution of selectable values ​​within a numerical interval is considered continuous, and includes the two endpoints (i.e., the minimum and maximum values) of the numerical interval, as well as every value between these two endpoints. Unless otherwise specified, when a numerical interval refers only to integers within that interval, it includes the two endpoint integers of the numerical range, as well as every integer between the two endpoints, which is equivalent to directly listing every integer. When multiple numerical ranges are provided to describe features or characteristics, these numerical ranges can be merged. In other words, unless otherwise specified, the numerical ranges disclosed herein should be understood to include any and all subranges included therein. The "numerical value" in this numerical interval can be any quantitative value, such as a number, percentage, ratio, etc. The term "numerical interval" can be broadly included to include percentage intervals, ratio intervals, proportion intervals, and other numerical interval types.

[0076] In this article, percentage content refers to mass percentage for solid-liquid mixtures and solid-solid mixtures, and volume percentage for liquid-liquid mixtures, unless otherwise specified.

[0077] Unless otherwise specified, all percentage concentrations mentioned in this article refer to the final concentration. The final concentration refers to the proportion of the added ingredient in the system after the addition of that ingredient.

[0078] In this article, % (w / w) and wt% both represent weight percentage, % (v / v) refers to volume percentage, and % (w / v) refers to mass-volume percentage.

[0079] In this document, temperature parameters are used. Unless otherwise specified, both isothermal processing and processing within a certain temperature range are permitted. The isothermal processing allows temperature fluctuations within the precision range controlled by the instrument.

[0080] In this document, the terms "room temperature" or "normal temperature" generally refer to 4°C to 35°C, for example, 20°C ± 5°C. In some embodiments of this document, "room temperature" or "normal temperature" refers to 10°C to 30°C. In some embodiments of this document, "room temperature" or "normal temperature" refers to 20°C to 30°C.

[0081] In related technologies, cleaning films on the surfaces of kitchen and bathroom products, automotive parts, electronic products such as mobile phones and watches, and glasses can be AF (Anti-fingerprint) films. AF films are usually made of low surface energy materials such as silicone and fluorine. When they are vapor-deposited onto the surfaces of these products, they have the problem of being thin and easily worn. Similarly, by spraying organic coatings onto the surfaces of these products, there is also the problem that the organic coatings have a short service life because the product surfaces are not scratch-resistant.

[0082] Based on the above technical problems, firstly, some embodiments of this application provide an anti-fouling plating part, such as... Figure 1 As shown, the antifouling coating includes: a substrate 11 to be coated, a metal underlayer 12, a transition layer 13, and a hydrophobic layer 14. The metal underlayer 12 is disposed on the surface of the substrate 11 to be coated, the transition layer 13 is disposed on the surface of the metal underlayer 12 facing away from the substrate 11, and the hydrophobic layer 14 is disposed on the surface of the transition layer 13 facing away from the metal underlayer 12. The materials of the transition layer 13 and the hydrophobic layer 14 are independently selected from inorganic materials, and both the transition layer 13 and the hydrophobic layer 14 contain silicon. The surface of the hydrophobic layer 14 facing away from the transition layer 13 has a superhydrophobic surface micro / nano structure.

[0083] Surface micro-nano structures have characteristics such as regular texture and periodicity, and different types of surface micro-nano structures exist according to different functional characteristics.

[0084] A superhydrophobic surface refers to a surface with a stable contact angle (in this application, it refers to the water contact angle) greater than 110°, similar to the characteristics of a "lotus leaf" surface, having a large number of micro-protrusion structures. These micro-protrusion structures give the lotus leaf superhydrophobic properties.

[0085] Inspired by the micro- and nano-structures on the surface of lotus leaves, superhydrophobic surface micro- and nano-structures are fabricated on the surface of hydrophobic layer 14. For example... Figure 2 As shown, a scanning microscope image of the surface of the anti-fouling plating is displayed. Figure 2 In this context, EHT = 10.00kV means that the accelerating voltage applied to the surface of the anti-fouling plating is 10kV when using a scanning electron microscope (SEM); WD = 4.9mm means the working distance (i.e., the distance from the SEM lens to the anti-fouling plating) is 4.9mm; Mag = 40.00KX means the magnification of the SEM is 40,000x; Signal A = inLens means that an inLens detector is used to acquire the scanning signal. Figure 3 As shown, an atomic force microscope image of the surface morphology of the anti-fouling plating part is presented; by Figure 2 and Figure 3 It can be seen that the surface of this anti-fouling plating part has holes and is relatively rough, such as... Figure 3 As shown, the surface of this antifouling coating has numerous raised structures, with the highest protrusion reaching a height of 0.13 micrometers. It can be seen that the surface of this antifouling coating forms a superhydrophobic micro / nano structure resembling a lotus leaf.

[0086] A metal underlayer 12, a transition layer 13, and a hydrophobic layer 14 are sequentially formed on the surface of the substrate 11 to be plated. The metal underlayer 12, the transition layer 13, and the hydrophobic layer 14 are all selected from inorganic materials. The metal underlayer improves the adhesion between the transition layer 13 and the substrate 11 to be plated, thereby increasing the bonding force between the plating layer and the substrate 11. The transition layer 13 serves as a transition layer and also improves the bonding force between the hydrophobic layer 14 and the metal underlayer 12. The hydrophobic layer 14 serves as a hydrophobic and antifouling layer.

[0087] Based on the above structure, in this antifouling coating, since both the transition layer 13 and the hydrophobic layer 14 contain silicon, on the one hand, compared with the organic coating prepared on the surface of the substrate to be coated in related technologies, the coating on the surface of this antifouling coating has higher hardness, which can reduce damage caused by scratches; on the other hand, by setting a superhydrophobic surface micro-nano structure on the surface of the hydrophobic layer 14, the antifouling coating can be endowed with excellent superhydrophobic properties, thereby achieving a self-cleaning effect similar to a "lotus leaf". At the same time, the superhydrophobic surface micro-nano structure also has anti-corrosion properties. In particular, for the metal substrate 11 to be coated, the humidity of the environment will cause oxidation and corrosion to the metal material, and the superhydrophobic surface micro-nano structure has good hydrophobic properties, thereby improving the corrosion resistance and oxidation resistance of the metal material; furthermore, the coating of this antifouling coating has higher hardness than the organic coating, and the superhydrophobic surface micro-nano structure can also effectively reduce the friction coefficient of the coating surface, thus effectively improving the friction resistance of the coating, thereby effectively maintaining the superhydrophobic properties of the coating. In summary, the antifouling coating provided in this application can solve the problems of insufficient stability, poor reliability, poor scratch resistance, and easy damage when subjected to external force in the hydrophobic film layer in the related technology.

[0088] The specific materials of the transition layer 13 and the hydrophobic layer 14 are not limited, as long as an inorganic material coating can be formed and a superhydrophobic surface micro-nano structure can be formed on the surface of the hydrophobic layer 14.

[0089] In some embodiments, such as Figure 1 As shown, the hydrophobic layer 14 includes a first hydrophobic layer 141 and a second hydrophobic layer 142 stacked sequentially in a direction gradually moving away from the substrate 11 to be plated; wherein, the material of the transition layer 13 is silicon, the material of the first hydrophobic layer 141 includes one or more of silicon carbide and silicon nitride, and the material of the second hydrophobic layer 142 is carbon.

[0090] In these embodiments, by providing a first hydrophobic layer 141 and a second hydrophobic layer 142, and since the transition layer 13 is made of silicon, the first hydrophobic layer 141 is made of one or more of silicon carbide and silicon nitride, and the second hydrophobic layer 142 is made of carbon, the first hydrophobic layer 141 has high hardness and wear resistance, and can be made to have a micro-nano structure on its surface, thereby giving the anti-fouling plating part high wear resistance and surface hydrophobicity. Furthermore, the transition layer 13 can act as a base layer for the first hydrophobic layer 141, facilitating its adhesion to the metal base layer 12. Moreover, since the second hydrophobic layer 142 is made of carbon, it has higher hardness, giving the anti-fouling plating part higher hardness and better wear resistance during use. On the one hand, the second hydrophobic layer 142 is relatively dense, which can give the antifouling coating a high density structure, making the antifouling coating have good impermeability, improving the physical shielding ability of the coating in the antifouling coating, and further improving its corrosion resistance. At the same time, the material of the second hydrophobic layer 142 includes carbon. Therefore, the second hydrophobic layer 142 can be a carbon layer with a diamond crystal structure, which can further improve the surface wear resistance and hardness of the antifouling coating, thus making it scratch-resistant. Meanwhile, the formation of the micro-nano structure on the surface of the first hydrophobic layer 141 can make the surface of the second hydrophobic layer 142 also have a micro-nano structure. When liquid (such as water) comes into contact with the surface of the antifouling coating, the surface structure helps to trap air on the surface of the antifouling coating, thus exhibiting superhydrophobic properties.

[0091] In addition, some embodiments of this application tested the surface elemental distribution of an anti-fouling plating part where the metal underlayer material is Cr, the transition layer material is silicon, the first hydrophobic layer 141 material is silicon nitride, and the second hydrophobic layer 142 material is carbon. The test results are shown in Table 1 below:

[0092] Table 1

[0093] element Atomic percentage C 6.69％ N 44.38％ O 5.81％ Si 32.87％ Ar 1.00％ Cr 8.96％

[0094] The thickness of the transition layer 13, the first hydrophobic layer 141, and the second hydrophobic layer 142 are not specifically limited, and all thickness values ​​that can have the above characteristics are within the protection scope of this application.

[0095] In some embodiments, the thickness of the transition layer 13 is 50 nm to 100 nm; and / or, the thickness of the first hydrophobic layer 141 is 50 nm to 100 nm; and / or, the thickness of the second hydrophobic layer 142 is 20 nm to 50 nm.

[0096] In these embodiments, by limiting the thickness of the transition layer 13 to the range of 50 nm to 100 nm, a transition function is achieved, facilitating the adhesion of the first hydrophobic layer 141 and the second hydrophobic layer 142 to the surface of the substrate 11 to be plated, thereby improving the bonding force between the first hydrophobic layer 141 and the second hydrophobic layer 142 and the substrate 11 to be plated. By limiting the thickness of the first hydrophobic layer 141 to the range of 50 nm to 100 nm, a surface micro / nanostructure with a certain roughness can be formed, thereby facilitating the formation of a surface micro / nanostructure with hydrophobic properties on the surface of the second hydrophobic layer 142. By limiting the thickness of the second hydrophobic layer 142 to the range of 20 nm to 50 nm, the second hydrophobic layer 142 can maintain the aforementioned superhydrophobic surface micro / nanostructure, while also ensuring that the second hydrophobic layer 142 has good density properties, thereby enabling the antifouling plated part to have good impermeability and corrosion resistance.

[0097] The specific material and thickness of the metal underlayment 12 are not limited, and can be selected according to actual needs.

[0098] In some embodiments, the metal underlayment 12 satisfies at least one of the following conditions:

[0099] (1) The material of the metal underlayer 12 includes one or more of Zr, Ti, Cr and Ta;

[0100] (2) The thickness of the metal underlayer 12 is 10nm to 50nm.

[0101] In these embodiments, by selecting these metals as the base material, the adhesion between the transition layer 13 and the substrate to be plated can be improved. By limiting the thickness of the metal base layer 12 to the range of 10nm to 50nm, it can be ensured that the metal base layer 12 has a good base effect, avoiding the problem of high stress caused by direct contact between the transition layer 13 and the substrate to be plated, thereby improving the adhesion between the transition layer 13 and the substrate 11 to be plated.

[0102] In some embodiments, the material of the substrate 11 to be plated is selected from one or more of glass, ceramic, metal and plastic.

[0103] For example, the substrate 11 to be plated can be a kitchen faucet, a bathroom shower head, a shower fitting, etc.; or, the substrate 11 to be plated can be a mobile phone casing, a car rearview mirror casing, a watch casing, an eyeglass frame, etc.

[0104] Secondly, some embodiments of this application provide a method for preparing an anti-fouling plated part, the method comprising the following steps S41) to S43):

[0105] S41) Form a metal underlayer on the surface of the substrate to be plated;

[0106] S42) A transition layer is formed on the surface of the metal underlayer that is away from the substrate to be plated;

[0107] S43) A hydrophobic layer is formed on the surface of the transition layer away from the metal substrate; wherein the materials of the transition layer and the hydrophobic layer are independently selected from inorganic materials, and both the transition layer and the hydrophobic layer contain silicon elements, and the surface of the hydrophobic layer away from the transition layer has a superhydrophobic surface micro-nano structure.

[0108] The specific deposition methods for forming a metal underlayer on the surface of the substrate to be plated, forming a transition layer on the surface of the metal underlayer away from the substrate to be plated, and forming a hydrophobic layer on the surface of the transition layer away from the metal underlayer are not limited. All process means that can achieve the deposition of the metal underlayer, transition layer and hydrophobic layer are within the protection scope of this application.

[0109] In the method for preparing the antifouling plated part provided in this application embodiment, a metal underlayer, a transition layer, and a hydrophobic layer are sequentially formed on the surface of the substrate to be plated. Since the metal underlayer, transition layer, and hydrophobic layer 14 are all selected from inorganic materials, and since both the transition layer and the hydrophobic layer contain silicon, on the one hand, compared with the preparation of organic coatings on the surface of the substrate in related technologies, the coating on the surface of this antifouling plated part has higher hardness, which can reduce damage caused by scratches; on the other hand, by forming a superhydrophobic surface micro-nano structure on the surface of the hydrophobic layer, the antifouling plated part can be endowed with excellent superhydrophobic properties, thereby achieving a self-cleaning effect similar to a "lotus leaf." Simultaneously, the superhydrophobic surface micro-nano structure also has anti-corrosion properties. Especially for metal substrates, environmental humidity can cause oxidation and corrosion. The superhydrophobic surface micro-nano structure has excellent hydrophobic properties, thereby improving the corrosion and oxidation resistance of the metal material. Furthermore, the coating of the antifouling coating has high hardness, and the superhydrophobic surface micro-nano structure can effectively reduce the friction coefficient of the coating surface, thus effectively improving the friction resistance of the coating. It has the same technical effect as the antifouling coating provided in the embodiments of this application, solving the problems of insufficient stability, poor reliability, and poor scratch resistance of hydrophobic films in related technologies, which are easily damaged when subjected to external force. This is beneficial to maintaining the hydrophobic properties of the antifouling coating surface.

[0110] The material of the substrate to be plated can be selected from one or more of glass, ceramics, metals and plastics, without any specific limitation.

[0111] The metal underlay material can include one or more of Zr, Ti, Cr, and Ta. These metal underlay materials can improve the adhesion between the transition layer and the substrate to be plated, and can enhance the corrosion resistance of the coating.

[0112] Before forming the metal underlayer on the surface of the substrate to be plated (S41), to facilitate a good bond between the metal underlayer and the surface of the substrate, the preparation method may further include: pretreatment of the substrate to be plated. This pretreatment may, for example, include one or more of the following steps: bright chrome plating, ultrasonic degreasing, ultrasonic dewaxing, acid activation, water washing, and baking. This results in a cleaner surface, facilitating the subsequent adhesion of the metal underlayer to the surface of the substrate.

[0113] In some embodiments, S41) forming a metal underlayer on the surface of the substrate to be plated includes:

[0114] Using one or more of Zr, Ti, Cr and Ta as the target material, a second multi-arc ion plating process is used to deposit a metal underlayer on the surface of the substrate to be plated.

[0115] In these embodiments, a metal underlayer can be formed on the surface of the substrate to be plated using a second multi-arc ion plating process.

[0116] In some embodiments, the conditions of the second multi-arc ion plating process include:

[0117] The initial vacuum level in the vacuum chamber of this second multi-arc ion plating process is 8 × 10⁻⁶. -4 Pa~2×10 -2 During the reaction, the flow rate of the inert gas introduced is 200 sccm to 600 sccm, so that the gas pressure in the vacuum chamber is maintained at 8 × 10⁻⁶ Pa. -2 Pa~6×10 -1 Pa;

[0118] The second multi-arc ion plating process uses a power supply voltage of 20V to 40V, a current of 50A to 150A, a negative bias voltage of -100V to -300V applied to the substrate to be plated during the plating process, a temperature of 50℃ to 150℃ in the vacuum chamber, and a plating time of 60s to 120s.

[0119] In these embodiments, by controlling the second multi-arc ion plating process to meet the above conditions, it is possible to ensure the formation of a relatively dense and stable metal underlayer, thereby ensuring that the coating has good stability and corrosion resistance.

[0120] In some embodiments, the hydrophobic layer includes a first hydrophobic layer and a second hydrophobic layer, the transition layer is made of silicon, the first hydrophobic layer is made of one or more of silicon nitride and silicon carbide, and the second hydrophobic layer is made of carbon.

[0121] A transition layer is formed on the surface of the metal underlayer that is away from the substrate to be plated, including:

[0122] Using silicon as the target material, a transition layer is deposited on the surface of the substrate to be plated by first magnetron sputtering.

[0123] A hydrophobic layer is formed on the surface of the transition layer away from the metal underlayer, including:

[0124] Using one or more of silicon nitride and silicon carbide as the target material, a first hydrophobic layer is deposited on the surface of the transition layer away from the metal underlayer using a second magnetron sputtering method; and

[0125] Using graphite as the target material, a second hydrophobic layer is deposited on the surface of the first hydrophobic layer away from the transition layer using the first multi-arc ion plating process.

[0126] In these embodiments, by depositing a transition layer on a metal substrate using a first magnetron sputtering process and then depositing a first hydrophobic layer on the transition layer using a second magnetron sputtering process, the fabrication of both the transition layer and the first hydrophobic layer can be completed in the same chamber, saving process steps. Simultaneously, when depositing the first hydrophobic layer on the transition layer using the second magnetron sputtering process, a surface micro / nano structure with a certain roughness can be formed, thus facilitating the imparting of superhydrophobic properties similar to a "lotus leaf" to the antifouling plating part. Furthermore, when depositing the second hydrophobic layer on the surface of the first hydrophobic layer using the first multi-arc ion plating process, it is convenient to form a nanosheet-like carbon layer structure (such as...). Figure 1 As shown, the carbon layer surface morphology presents a rough surface composed of nanosheets, which has high hardness and density, thereby reducing the friction coefficient of the coating surface and improving the coating's impermeability.

[0127] In some embodiments, the conditions for the first magnetron sputtering include:

[0128] The initial vacuum level in the vacuum chamber during the first magnetron sputtering was 8 × 10⁻⁶. -4 Pa~2×10 -2 During the reaction, the flow rate of the inert gas introduced is 200 sccm to 600 sccm, maintaining the pressure in the vacuum chamber at 8 × 10⁻⁶ Pa. - 2 Pa~6×10 -1 Pa;

[0129] The first magnetron sputtering method uses a power supply voltage of 300V to 600V and a current of 10A to 30A. The negative bias voltage applied to the substrate during deposition is -30V to -100V, and the temperature in the vacuum chamber is 50℃.

[0130] ~150℃, coating time is 1000s~1500s.

[0131] In some embodiments, the conditions for the second magnetron sputtering include:

[0132] The initial vacuum level in the vacuum chamber during the second magnetron sputtering was 8 × 10⁻⁶. -4 Pa~2×10 -2 During the reaction, the flow rate of the inert gas is 200 sccm to 600 sccm, and the flow rate of the reactant gas is 100 sccm to 300 sccm, so that the pressure in the vacuum chamber is maintained at 8 × 10⁻⁶ Pa. -2 Pa~6×10 -1 Pa;

[0133] The second magnetron sputtering uses a power supply voltage of 300V to 600V, a current of 10A to 30A, a negative bias voltage of -30V to -100V applied to the substrate to be coated during coating, a temperature of 50℃ to 150℃ in the vacuum chamber, and a coating time of 1000s to 1500s.

[0134] In some embodiments, the conditions of the first multi-arc ion plating process include:

[0135] The initial vacuum level in the vacuum chamber of this first multi-arc ion plating process is 8 × 10⁻⁶. -4 Pa~2×10 -2 During the reaction, the flow rate of the inert gas introduced is 200 sccm to 600 sccm, maintaining the pressure in the vacuum chamber at 8 × 10⁻⁶ Pa. -2 Pa~6×10 -1 Pa;

[0136] The first multi-arc ion plating process uses a power supply voltage of 20V to 40V, a current of 20A to 50A, a negative bias voltage of -100V to -300V applied to the substrate to be plated during the plating process, a temperature of 50℃ to 150℃ in the vacuum chamber, and a plating time of 120s to 240s.

[0137] Thirdly, some embodiments of this application provide an application of the anti-fouling plating as described in the first aspect as an anti-fouling product.

[0138] For example, the anti-fouling plating can be used in kitchen and bathroom products. In this case, the anti-fouling plating has a self-cleaning function, can be used for waterproofing and stain prevention, is easy to clean, and is scratch-resistant and corrosion-resistant. For example, the anti-fouling plating can be used for kitchen faucets, basin faucets, shower heads, shower fittings, etc.

[0139] As another example, the anti-fouling coating can be used for electronic product casings, such as mobile phone casings and watch casings, to prevent stains, oil stains, and fingerprints.

[0140] For another example, the anti-fouling coating can be used for the housing of a car rearview mirror, which can serve to prevent water, oil, and fingerprints.

[0141] In order to objectively evaluate the technical effects of the embodiments of this application, this application will be described in detail by way of example through the following embodiments and comparative examples.

[0142] In the following examples and comparative examples, all raw materials were commercially available, and to maintain the reliability of the experiments, the raw materials used in the following examples and comparative examples had the same physical and chemical parameters or were prepared by the same processing method.

[0143] Example 1

[0144] Example 1 provides a faucet, the preparation method of which is as follows:

[0145] Step 1) Pre-treatment of the substrate surface of the part to be plated: Plating a bright chromium layer on the metal substrate by electroplating.

[0146] Step 2) Clean the substrate of the part to be plated with bright chromium layer: perform ultrasonic degreasing, two-stage water washing, ultrasonic dewaxing, two-stage water washing, acid activation, four-stage water washing, slow drawing and baking treatment in sequence.

[0147] Step 3) Prepare a composite coating on the surface of the substrate to be plated after cleaning:

[0148] Step S31): Install the Cr target in the vacuum chamber of the multi-arc ion plating process, and pre-evacuate the chamber to a vacuum level of 8 × 10⁻⁶. -3 The pressure inside the vacuum chamber is maintained at 1.2 × 10⁻⁶ Pa, with an argon gas flow rate of 300 sccm. -1 Pa;

[0149] Step S32) Control the power supply voltage of the multi-arc ion plating to be 22V, the current to be 100A, the negative bias voltage applied to the substrate to be plated during the plating process to be -200V, the temperature in the vacuum chamber to be 80℃, the plating time to be 120s, and control the thickness of the Cr metal layer to be within the range of 10nm~50nm.

[0150] Step 33) Install the Si target in the magnetron sputtering vacuum chamber and pre-evacuate the chamber to a vacuum level of 8 × 10⁻⁶. -3 The pressure inside the vacuum chamber is maintained at 1.2 × 10⁻⁶ Pa, with an argon gas flow rate of 300 sccm. -1 Pa;

[0151] S34) The power supply voltage for medium-frequency magnetron sputtering is controlled to be 500V, the current is 30A, the negative bias voltage applied to the substrate to be deposited during the coating process is -50V, the temperature in the vacuum chamber is 75℃, the coating time is 1200s, and the thickness of the silicon layer is controlled to be in the range of 50nm~100nm.

[0152] S35) A Si target is installed in the magnetron sputtering vacuum chamber, and the chamber is pre-evacuated to a vacuum level of 8 × 10⁻⁶. - 3 The pressure inside the vacuum chamber is maintained at 1.6 × 10⁻⁶ Pa, with an argon gas flow rate of 300 sccm and a nitrogen gas flow rate of 200 sccm. -1 Pa;

[0153] S36) The power supply voltage for medium-frequency magnetron sputtering is controlled to be 500V, the current is 30A, the negative bias voltage applied to the substrate to be coated is -50V, the temperature in the vacuum chamber is 75℃, the coating time is 1500s, and the thickness of the silicon nitride layer is controlled to be in the range of 50nm~100nm.

[0154] S37) A graphite target is installed in the vacuum chamber of the multi-arc ion plating process, and the vacuum chamber is pre-evacuated to a vacuum level of 8 × 10⁻⁶. -3 The pressure inside the vacuum chamber is maintained at 1.2 × 10⁻⁶ Pa, with an argon gas flow rate of 300 sccm. -1 Pa;

[0155] S38) The power supply voltage for multi-arc ion plating is controlled to be 24V, the current to be 30A, the negative bias voltage applied to the substrate to be plated during the plating process is -200V, the temperature in the vacuum chamber is 80℃, the plating time is 120s, and the thickness of the final carbon layer is controlled to be within the range of 20nm to 50nm.

[0156] Example 2

[0157] The method for preparing the faucet in Example 2 is basically the same as that in Example 1, except that:

[0158] In step S38), the power supply voltage of the multi-arc ion plating is controlled to be 20V, the current is 20A, the negative bias voltage applied to the substrate to be plated during the plating process is -200V, the temperature in the vacuum chamber is 80℃, the plating time is 120s, and the thickness of the final carbon layer is controlled to be in the range of 20nm to 50nm.

[0159] Example 3

[0160] The method for preparing the faucet in Example 3 is basically the same as that in Example 1, except that:

[0161] In step S38), the power supply voltage of the multi-arc ion plating is controlled to be 40V, the current is 50A, the negative bias voltage applied to the substrate to be plated during the plating process is -200V, the temperature in the vacuum chamber is 80℃, and the plating time is 120s; the thickness of the final carbon layer is controlled to be in the range of 20nm to 50nm.

[0162] Example 4

[0163] The method for preparing the faucet in Example 4 is basically the same as that in Example 1, except that:

[0164] In step S38), the power supply voltage of the multi-arc ion plating is controlled to be 24V, the current is 30A, the negative bias voltage applied to the substrate to be plated during the plating process is -200V, the temperature in the vacuum chamber is 80℃, and the plating time is 150s; the thickness of the final carbon layer is controlled to be in the range of 20nm to 50nm.

[0165] Example 5

[0166] The method for preparing the faucet in Example 5 is basically the same as that in Example 1, except that:

[0167] In step S38), the power supply voltage of the multi-arc ion plating is controlled to be 24V, the current is 30A, the negative bias voltage applied to the substrate to be plated during the plating process is -200V, the temperature in the vacuum chamber is 80℃, and the plating time is 180s; the thickness of the final carbon layer is controlled to be in the range of 20nm to 50nm.

[0168] Comparative Example 1

[0169] The method for preparing the faucet in Comparative Example 1 is basically the same as that for preparing the faucet in Example 1, except that:

[0170] In step 3), a SiO2 layer and a hydrophobic and oleophobic composite film are sequentially prepared on the surface of the cleaned faucet:

[0171] Step S31): Install the Si target in the intermediate frequency magnetron sputtering vacuum chamber, and pre-evacuate the chamber to a vacuum level of 8 × 10⁻⁶. -3 The pressure inside the vacuum chamber is maintained at 1.6 × 10⁻⁶ Pa, with argon gas introduced at a flow rate of 100 sccm and oxygen gas introduced at a flow rate of 100 sccm. -1 Pa;

[0172] Step S32) Control the power supply voltage of the medium frequency magnetron sputtering to be 800V, the current to be 50A, the negative bias voltage applied to the substrate to be deposited during the coating process to be -50V, the temperature in the vacuum chamber to be 75℃, the coating time to be 180s, and control the thickness of the final SiO2 layer to be in the range of 20nm to 100nm.

[0173] Step S33) Turn off the mid-frequency magnetron sputtering for preparing the SiO2 film in step S32). The specific steps are as follows: Pre-evacuate to a vacuum level of 8*10 -3 Pa, turn on the evaporation power supply to evaporate fluorosilane on the surface of SiO2 layer. The power supply current is 5A and the deposition time is 300s. Control the thickness of the final fluorosilane to be in the range of 10nm to 50nm.

[0174] Comparative Example 2

[0175] The method for preparing the faucet in Comparative Example 2 is basically the same as that for preparing the faucet in Example 1, except that:

[0176] In step S2), the substrate to be plated is cleaned with two sets of pure water at room temperature (i.e., the workpiece (i.e., the substrate to be plated) is cleaned in two consecutive pure water tanks) for 480s; the substrate to be plated is degreased with ultrasonic waves, wherein the degreasing powder concentration is 55±5g / L, the temperature is 60±10℃, the time is 480s~600s, and the ultrasonic current is 2±1A; finally, it is cleaned again with five sets of pure water at room temperature (i.e., the workpiece is cleaned in five consecutive pure water tanks) for 1200s.

[0177] Preparation of the hydrophobic coating in step 3):

[0178] A hydrophobic coating is formed on the substrate to be plated using a spray painting process. The coating materials include perfluorohexane, perfluoropolyether, and organic fluorine compounds. During spraying, the voltage is 60 kV, the air pressure is 6 kg / cm², and the paint flow rate is 25 cc / min. After spraying, the paint layer on the workpiece needs to undergo leveling. During leveling, the production line speed is 1.5 m / min, and the leveling time is 25 min. After leveling, curing is required. During curing, the production line speed is 1.5 m / min, and the curing time is 60 min.

[0179] Test case

[0180] The surface properties of the faucets provided in Examples 1-5 and Comparative Examples 1-2 were tested, and the specific test results are shown in Table 2 below:

[0181] Table 2

[0182]

[0183] In Table 2 above, the friction method was as follows: A 500g pig bristle brush was used to continuously rub the surfaces of the faucets provided in Examples 1-5 and Comparative Examples 1-2 for 10,000 and 20,000 cycles, respectively. The water contact angle before and after friction was tested. Some specific test results are shown below. Figures 4 to 13 As shown, in Figures 4 to 13 In this context, CAleft represents the angle to the left, and CAright represents the angle to the right.

[0184] The mud scratch resistance test method is as follows: mud is flowed over the surface of the faucets provided in Examples 1-5 and Comparative Examples 1-2. The mud flow rate is any value between 3 ml / min and 3.5 ml / min. The faucets provided in Examples 1-5 did not wear through the coating after more than 7000 friction cycles, while the faucet provided in Comparative Example 1 wore through after 2500 friction cycles, and the faucet provided in Comparative Example 2 wore through after 1000 friction cycles. It should be noted that during the test, one back-and-forth movement of the brush in the friction machine is counted as one cycle, and the number of friction cycles is recorded as 1.

[0185] The coating hardness test was conducted by using a Vickers hardness tester to test the hardness of the faucet surfaces provided in Examples 1-5 and Comparative Examples 1-2. The test results are shown in Table 2.

[0186] From the data in Table 2 above and Figures 4 to 13 It can be seen that the faucet provided in this application embodiment has advantages such as high surface hardness and good scratch resistance, and can maintain a good hydrophobic effect for a long time. In contrast, the coatings of the vapor-deposited composite film and the nano-oil spraying method in the comparative example have low hardness and poor scratch resistance, resulting in a significant decrease in hydrophobic performance after 20,000 continuous rubbing cycles with a 500g load on the bristle brush.

[0187] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0188] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A type of anti-fouling plated part, characterized in that, include: Substrate to be plated; A metal underlayer is applied to the surface of the substrate to be plated. A transition layer is disposed on the surface of the metal underlayer that is opposite to the substrate of the part to be plated; as well as A hydrophobic layer is disposed on the surface of the transition layer opposite to the metal underlayer; The hydrophobic layer has a superhydrophobic surface micro / nano structure on the surface away from the transition layer. The hydrophobic layer includes a first hydrophobic layer and a second hydrophobic layer stacked sequentially along a direction that gradually moves away from the substrate of the workpiece to be plated. The transition layer is made of silicon, the first hydrophobic layer is made of one or more of silicon carbide and silicon nitride, and the second hydrophobic layer is made of carbon.

2. The anti-fouling plated part according to claim 1, characterized in that, The thickness of the transition layer is 50nm~100nm.

3. The anti-fouling plated part according to claim 1, characterized in that, The thickness of the first hydrophobic layer is 50nm~100nm.

4. The anti-fouling plated part according to claim 1, characterized in that, The thickness of the second hydrophobic layer is 20nm~50nm.

5. The anti-fouling plated part according to any one of claims 1 to 4, characterized in that, The metal underlayment satisfies at least one of the following conditions: (1) The material of the metal underlay includes one or more of Zr, Ti, Cr and Ta; (2) The thickness of the metal underlayer is 10nm~50nm.

6. The anti-fouling plated part according to any one of claims 1 to 4, characterized in that, The material of the substrate to be plated is selected from one or more of glass, ceramics, metals, and plastics.

7. A method for preparing an anti-fouling plated part, characterized in that, include: Form a metal underlayer on the surface of the substrate to be plated; A transition layer is formed on the surface of the metal underlayer that is away from the substrate to be plated. A hydrophobic layer is formed on the surface of the transition layer opposite to the metal underlayer. The hydrophobic layer has a superhydrophobic surface micro / nano structure on the surface away from the transition layer. The hydrophobic layer includes a first hydrophobic layer and a second hydrophobic layer, the transition layer is made of silicon, the first hydrophobic layer is made of one or more of silicon nitride and silicon carbide, and the second hydrophobic layer is made of carbon. A transition layer is formed on the surface of the metal underlayer that is opposite to the substrate to be plated, including: Using silicon as a target, the transition layer is deposited on the surface of the substrate to be plated by a first magnetron sputtering method. A hydrophobic layer is formed on the surface of the transition layer opposite to the metal underlayer, comprising: Using one or more of silicon nitride and silicon carbide as the target material, a second magnetron sputtering method is employed to deposit the first hydrophobic layer on the surface of the transition layer opposite to the metal underlayer; and Using graphite as the target material, a second hydrophobic layer is deposited on the surface of the first hydrophobic layer away from the transition layer using a first multi-arc ion plating process.

8. The preparation method according to claim 7, characterized in that, The conditions for the first magnetron sputtering include: The initial vacuum level in the vacuum chamber during the first magnetron sputtering is 8 × 10⁻⁶. -4 Pa~2×10 -2 During the reaction, the flow rate of the inert gas introduced is 200 sccm to 600 sccm, so that the gas pressure in the vacuum chamber is maintained at 8 × 10⁻⁶ Pa. -2 Pa ~ 6×10 -1 Pa; The first magnetron sputtering uses a power supply voltage of 300V~600V and a current of 10A~30A. The negative bias voltage applied to the substrate to be coated during the coating process is -30V~-100V. The temperature in the vacuum chamber is 50℃~150℃, and the coating time is 1000s~1500s.

9. The preparation method according to claim 7, characterized in that, The conditions for the second magnetron sputtering include: The initial vacuum level in the vacuum chamber during the second magnetron sputtering is 8 × 10⁻⁶. -4 Pa~2×10 -2 During the reaction, the flow rate of the inert gas is 200 sccm to 600 sccm, and the flow rate of the reactant gas is 100 sccm to 300 sccm, so that the pressure in the vacuum chamber is maintained at 8 × 10⁻⁶ Pa. -2 Pa ~ 6×10 -1 Pa; The second magnetron sputtering uses a power supply voltage of 300V~600V, a current of 10A~30A, a negative bias voltage of -30V~-100V applied to the substrate to be coated during the coating process, a temperature of 50℃~150℃ in the vacuum chamber, and a coating time of 1000s~1500s.

10. The preparation method according to claim 7, characterized in that, The conditions for the first multi-arc ion plating process include: The initial vacuum level in the vacuum chamber of the first multi-arc ion plating process is 8×10⁻⁶. -4 Pa~2×10 -2 During the reaction, the flow rate of the inert gas introduced is 200 sccm to 600 sccm, so that the gas pressure in the vacuum chamber is maintained at 8 × 10⁻⁶ Pa. -2 Pa ~ 6×10 -1 Pa; The first multi-arc ion plating process uses a power supply voltage of 20V~40V, a current of 20A~50A, a negative bias voltage of -100V~-300V applied to the substrate to be plated during the plating process, a temperature of 50℃~150℃ in the vacuum chamber, and a plating time of 120s~240s.

11. The preparation method according to any one of claims 7 to 10, characterized in that, The process of forming a metal underlayer on the surface of the substrate to be plated includes: One or more of Zr, Ti, Cr and Ta are used as the target material, and the metal is deposited as the underlayer on the surface of the substrate to be plated using a second multi-arc ion plating process.

12. The preparation method according to claim 11, characterized in that, The conditions for the second multi-arc ion plating process include: The initial vacuum level in the vacuum chamber of the second multi-arc ion plating process is 8 × 10⁻⁶. -4 Pa~2×10 -2 During the reaction, the flow rate of the inert gas introduced is 200 sccm to 600 sccm, so that the gas pressure in the vacuum chamber is maintained at 8 × 10⁻⁶ Pa. -2 Pa ~ 6×10 -1 Pa; The second multi-arc ion plating process uses a power supply voltage of 20V~40V, a current of 50A~150A, a negative bias voltage of -100V~-300V applied to the substrate to be plated during the plating process, a temperature of 50℃~150℃ in the vacuum chamber, and a plating time of 60s~120s.

13. The application of the anti-fouling plating part as described in any one of claims 1 to 6 as an anti-fouling product.

Images