Wafer transmission and exchange system and method

Abstract

The present invention discloses a wafer transmission and exchange system and method, the wafer transmission and exchange system comprises: a vacuum working chamber, the interior of which is in a vacuum state; a pre-vacuum chamber, which is arranged adjacent to the vacuum working chamber, the pre-vacuum chamber is connected to the vacuum working chamber via a second valve on one side, and is connected to the atmosphere via a first valve on the opposite side; a lifting mechanism, which carries the wafer on the top surface; a detection workbench, which is arranged in the vacuum working chamber, which carries the wafer on the top surface and can be translated in three orthogonal directions; and a rotating mechanical arm, which is movably arranged in the vacuum working chamber and has a rotatable arm; the rotating mechanical arm is configured to transfer and exchange the wafer carried by the lifting mechanism with the wafer carried by the detection workbench through the rotating arm. The present invention realizes continuous and uninterrupted measurement / detection of wafers, saves a lot of time, improves work efficiency, does not need to lengthen the high-precision grating ruler corresponding to the detection workbench, and reduces equipment costs.

Description

Technical Field

[0001] The invention relates to a wafer transmission and exchange system and method, and belongs to the technical field of semiconductor equipment. Background Art

[0002] In the wafer manufacturing process, measurement and testing are the key to improving the yield of production lines and enhancing product competitiveness. During wafer measurement or testing, the wafer transfer and exchange system transfers the wafer to the test bench of the measurement or testing equipment, and transfers the tested wafer out of the measurement or testing equipment. Among them, the vacuum robot is the key to realizing wafer transfer and exchange.

[0003] In the traditional wafer transfer and exchange system, the vacuum robot is fixed in the loading / unloading area in front of the vacuum working chamber, and the inspection workbench is located in the inspection area behind the vacuum working chamber. Each time the wafer is transferred and exchanged, the inspection workbench must move to the loading / unloading area to complete the wafer transfer and exchange with the vacuum robot.

[0004] However, the heavy-loaded inspection table repeatedly moves back and forth between the loading / unloading area and the inspection area, causing a lot of time waste and seriously reducing the inspection efficiency. In addition, the movement accuracy of the inspection table is the premise for ensuring the accuracy of wafer inspection, and the movement accuracy of the inspection table requires its corresponding high-precision grating ruler to ensure it. Since the inspection table moves between the loading / unloading area and the inspection area over a long distance, its corresponding high-precision grating ruler must also be lengthened accordingly, increasing the equipment cost. Summary of the invention

[0005] To solve the above problems, the present invention provides a wafer transfer and exchange system and method, which can be used for wafer transportation in semiconductor measurement or testing equipment.

[0006] A first object of the present invention is to provide a wafer transmission and exchange system, comprising:

[0007] A vacuum working chamber, the interior of which is in a vacuum state;

[0008] a pre-vacuum chamber, disposed adjacent to the vacuum working chamber, the pre-vacuum chamber being connected to the vacuum working chamber via a second valve on one side and connected to the atmosphere via a first valve on the opposite side;

[0009] A lifting mechanism, which carries the wafer on its top surface and is configured to drive the wafer to perform lifting movement in the pre-vacuum chamber;

[0010] A detection workbench, disposed in the vacuum working chamber, which carries the wafer on its top surface and can translate along three orthogonal directions; and

[0011] A rotating robot arm is movably disposed in the vacuum working chamber and has a rotatable arm; the rotating robot arm is configured to transfer and exchange the wafer carried by the lifting mechanism and the wafer carried by the detection workbench through the rotating arm.

[0012] In one embodiment of the present invention, the vacuum working chamber is provided with a first guide rail, and the rotating robotic arm is movably connected to the first guide rail; the detection workbench includes an XY-axis moving mechanism connected to the first guide rail and a Z-axis moving mechanism connected to the XY-axis moving mechanism; the Z-axis moving mechanism carries the wafer on the top surface and is used to drive the wafer to move up and down, and the XY-axis moving mechanism is used to drive the Z-axis moving mechanism to translate along two orthogonal directions.

[0013] In one embodiment of the present invention, the rotating robotic arm includes a linear motor coil, a rotating motor and an arm drivingly connected to the rotating motor, wherein the rotating motor is used to drive the arm to rotate; a base is fixed below the first guide rail, and a linear motor magnetic rail connected to the linear motor coil is provided on the base, and the linear motor coil is used to drive the rotating robotic arm to translate.

[0014] In one embodiment of the present invention, the base is also provided with a grating ruler for detecting the operation of the rotating robotic arm and / or the detection workbench, and the accuracy of the grating ruler corresponding to the detection rotating robotic arm is less than the accuracy of the grating ruler corresponding to the detection workbench.

[0015] In one embodiment of the present invention, the arm is in a straight line shape, and the middle part thereof is connected to the output end of the rotating motor.

[0016] In one embodiment of the present invention, the lifting mechanism includes a lifting motor sealedly connected to the pre-vacuum chamber body of the pre-vacuum chamber and a tray connected to the output end of the lifting motor, the lifting motor is used to drive the tray to perform lifting movements, and the tray is arranged in the pre-vacuum chamber and is used to carry wafers.

[0017] In one embodiment of the present invention, the lifting mechanism includes a transmission shaft located outside the pre-vacuum chamber, the transmission shaft is connected to a plurality of lifting shafts via a connecting plate, the plurality of lifting shafts pass through the pre-vacuum chamber body of the pre-vacuum chamber and extend into the pre-vacuum chamber and are used to carry wafers, the lifting shaft is sealedly connected to the pre-vacuum chamber body, and the transmission shaft is externally connected to a lifting motor.

[0018] A second object of the present invention is to provide a wafer transfer and exchange method, using the wafer transfer and exchange system, the method comprising:

[0019] Step 1: Place the wafer to be tested on the lifting mechanism in the pre-vacuum chamber, move and rotate the arm, and transfer the wafer to be tested to the detection workbench in the vacuum working chamber;

[0020] Step 2: The inspection workbench measures the wafer to be tested;

[0021] Step 3: Place a new wafer to be tested on the lifting mechanism in the pre-vacuum chamber, and move and rotate the arm to transfer and exchange the wafer to be tested carried by the lifting mechanism with the tested wafer carried by the inspection workbench;

[0022] Step 4: Move the tested wafer out of the pre-vacuum chamber, and use the inspection workbench to inspect a new wafer to be tested. Repeat the above steps until all wafers have been measured / tested.

[0023] In one embodiment of the present invention, the step 1 specifically includes:

[0024] Place the wafer to be tested on the lifting mechanism in the pre-vacuum chamber, close the first valve, evacuate the pre-vacuum chamber, and open the second valve;

[0025] One end of the arm moves into the pre-vacuum chamber and is inserted between the lifting mechanism and the wafer, and the lifting mechanism moves downward to make the wafer to be tested fall on the arm;

[0026] The arm moves toward the inspection table and rotates, and the Z-axis moving mechanism of the inspection table rises to receive the wafer to be inspected.

[0027] In one embodiment of the present invention, the step three specifically includes:

[0028] Close the second valve, open the first valve, and place a new wafer to be tested onto the lifting mechanism in the pre-vacuum chamber;

[0029] Close the first valve to evacuate the pre-vacuum chamber, open the second valve, and move and rotate the arm to transfer and exchange the wafer to be tested carried by the lifting mechanism with the tested wafer carried by the detection workbench.

[0030] The beneficial effects of the present invention are:

[0031] The present invention coordinates and cooperates with each other among the pre-vacuum chamber, the vacuum working chamber, the first valve and the second valve, so that the vacuum working chamber can always maintain a vacuum degree within the process requirements, meet the vacuum degree requirements of wafer measurement or detection, realize continuous and uninterrupted measurement / detection of wafers, and greatly improve work efficiency. In addition, the present invention is combined with a rotating mechanical arm that can rotate and move, so there is no need to make the heavy-loaded detection workbench move back and forth between the loading / unloading area and the detection area, and the transmission and exchange of wafers can be completed, which saves a lot of time and greatly improves work efficiency. At the same time, there is no need to lengthen the high-precision grating ruler corresponding to the detection workbench. It is only necessary to rotate the low-precision grating ruler corresponding to the mechanical arm to ensure the accuracy of wafer detection, which greatly reduces the equipment cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 A schematic diagram of the structure of a wafer transmission and exchange system provided in one embodiment of the present invention.

[0033] Figure 2 A schematic structural diagram of a first valve provided in one embodiment of the present invention.

[0034] Figure 3 A schematic structural diagram of a lifting mechanism provided in one embodiment of the present invention.

[0035] Figure 4 A schematic structural diagram of a lifting mechanism provided in yet another embodiment of the present invention.

[0036] Figure 5 A schematic structural diagram of a rotating robotic arm provided in one embodiment of the present invention.

[0037] Figure 6 A cross-sectional view of a first guide rail, a base, and a first slider provided in accordance with an embodiment of the present invention.

[0038] Figure 7 Schematic diagram of the arm of the system of the present invention being in zero position.

[0039] Figure 8 This is a schematic diagram of the arm of the system of the present invention moving toward the inspection workbench to a position ready to pick up and place a wafer and rotating 90 degrees.

[0040] Fig. 9 The schematic diagram is that the arm of the system of the present invention moves toward the pre-vacuum chamber and prepares to take the wafer to be tested from the pre-vacuum chamber.

[0041] Fig.10 This is a schematic diagram of the lifting mechanism of the system of the present invention moving downward to allow the wafer to be tested to fall onto the arm.

[0042] Fig.11 This is a schematic diagram of the arm of the system of the present invention moving toward the detection workbench and rotating 180°.

[0043] Fig.12 The schematic diagram is that the Z-axis moving mechanism of the system of the present invention is raised to receive the wafer to be tested.

[0044] Fig.13 It is a schematic diagram of the arm of the system of the present invention moving toward the pre-vacuum chamber and rotating 180° back to the zero position.

[0045] Fig.14 The schematic diagram is that the Z-axis moving mechanism of the system of the present invention moves downward to prepare for measuring the wafer.

[0046] Fig.15 This is a schematic diagram of the system of the present invention completing measurement, the Z-axis moving mechanism lifting the measured wafer, and the pre-vacuum chamber loading the wafer to be measured.

[0047] Fig.16 This is a schematic diagram of the arm of the system of the present invention moving toward the inspection workbench to a position ready to pick up and place a wafer and rotating 180 degrees.

[0048] Fig.17 The schematic diagram is that the arm of the system of the present invention moves toward the pre-vacuum chamber to take out a wafer to be tested from the pre-vacuum chamber.

[0049] Fig.18 The schematic diagram is that the lifting mechanism of the system of the present invention moves downward and the arm bears the wafer to be tested.

[0050] Fig.19 A schematic diagram of the arm of the system of the present invention moving toward the inspection workbench to take away the inspected wafer.

[0051] Fig. 20 The schematic diagram is that the Z-axis moving mechanism of the system of the present invention descends and the arm receives the measured wafer.

[0052] Fig.21 The schematic diagram of the arm of the system of the present invention rotating 180 degrees to exchange wafers.

[0053] Fig. 22 The schematic diagram of the Z-axis moving mechanism of the system of the present invention rising to receive the wafer to be tested.

[0054] Fig.23 It is a schematic diagram of the arm of the system of the present invention moving toward the pre-vacuum chamber to put the tested wafer back into the pre-vacuum chamber.

[0055] Fig.24 The schematic diagram of the system of the present invention is that the lifting mechanism rises to receive the wafer to be measured, and the Z-axis moving mechanism descends to prepare for measuring the wafer.

[0056] Fig.25It is a schematic diagram of the arm of the system of the present invention moving out of the pre-vacuum chamber, closing the second valve, opening the first valve, and moving the measured wafer out of the pre-vacuum chamber.

[0057] Fig.26 This is a schematic diagram of the arm of the system of the present invention returning to the zero position and starting measurement.

[0058] In the figure: 1. first valve; 2. lifting mechanism; 3. pre-vacuum chamber; 4. second valve; 5. vacuum working chamber; 6. rotating robot arm; 7. detection workbench; 8. XY axis moving mechanism; 9. Z axis moving mechanism; 10. wafer; 11. valve plate; 12. push rod; 13. limit block; 14. rocker arm; 15. second guide rail; 16. second slider; 17. connecting rod; 18. elastic member; 19. linear actuator; 21. connecting plate; 22. transmission shaft; 23. lifting shaft; 24. lifting motor; 25. tray; 30. pre-vacuum chamber; 40. first guide rail; 41. linear motor magnetic track; 42. base; 43. grating ruler; 61. arm; 62. mounting plate; 63. mounting bracket; 64. rotating motor; 65. linear motor coil; 66. first slider. DETAILED DESCRIPTION

[0059] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0060] In the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0061] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0062] like Figure 1-6 As shown, the present invention provides a wafer transfer and exchange system, which can be used for wafer transportation in semiconductor measurement or detection equipment, and the wafer transfer and exchange system includes: a vacuum working chamber 5, the interior of which is in a vacuum state and is provided with a first guide rail 40; a pre-vacuum chamber 3, which is arranged adjacent to the vacuum working chamber 5, the pre-vacuum chamber 3 is connected to the vacuum working chamber 5 via a second valve 4 on one side, and is connected to the atmosphere via a first valve 1 on the opposite side; a lifting mechanism 2, which supports the wafer on the top surface 10, configured to drive the wafer 10 to perform lifting and lowering movements in the pre-vacuum chamber 3; an inspection workbench 7, arranged in the vacuum working chamber 5, which carries the wafer 10 on its top surface and can translate along three orthogonal directions; and a rotating robot arm 6, arranged in the vacuum working chamber 5 and movably connected to the first guide rail 40, which has a rotatable arm 61; the rotating robot arm 6 is configured to transfer and exchange the wafer 10 carried by the lifting mechanism 2 with the wafer 10 carried by the inspection workbench 7 through the rotating arm 61.

[0063] Optionally, in one embodiment, the inspection workbench 7 includes an XY-axis moving mechanism 8 connected to the first guide rail 40 and a Z-axis moving mechanism 9 connected to the XY-axis moving mechanism 8; the Z-axis moving mechanism 9 supports the wafer 10 on the top surface and is used to drive the wafer 10 to move up and down, and the XY-axis moving mechanism 8 is used to drive the Z-axis moving mechanism 9 to translate in two orthogonal directions.

[0064] In this embodiment, the XY axis moving mechanism 8 can drive the Z axis moving mechanism 9 to translate along the orthogonal X axis and Y axis, wherein the Y axis is parallel to the first guide rail 40, and the X axis is perpendicular to the first guide rail 40. The Z axis moving mechanism 9 can drive the wafer 10 to perform Z axis lifting and lowering motion, so that the wafer 10 carried on the top surface of the detection workbench 7 can translate along the orthogonal X axis, Y axis, and Z axis three directions.

[0065] Optionally, in one embodiment, the rotating robotic arm 6 includes a mounting plate 62, a linear motor coil 65 connected to the mounting plate 62, a first slider 66 connected to the mounting plate 62, a rotating motor 64 connected to the mounting plate 62 via a mounting bracket 63, and an arm 61 drivingly connected to the rotating motor 64, wherein the rotating motor 64 is used to drive the arm 61 to rotate, the first slider 66 is slidingly connected to the first guide rail 40, a base 42 is fixed below the first guide rail 40, a linear motor magnetic rail 41 is provided on the base 42, the linear motor coil 65 is connected to the linear motor magnetic rail 41 and can move relative to the linear motor magnetic rail 41, and the linear motor coil 65 is used to drive the rotating robotic arm 6 to translate along the first guide rail 40.

[0066] In this embodiment, by setting the first guide rail 40 and the first slider 66 to be slidably connected, the stability of the rotary robot arm 6 during lateral translation can be provided, the operation accuracy of the rotary robot arm 6 is ensured, and the accuracy of wafer 10 detection is further improved. Among them, the linear motor magnetic rail 41 is a magnetic rail, which is connected to the magnetic rail through the linear motor coil 65 to achieve the translation of the rotary robot arm 6.

[0067] Furthermore, the base 41 is also provided with a grating ruler 43 for detecting the operation of the rotating mechanical arm 6 and / or the detection workbench 7 , and the accuracy of the grating ruler 43 corresponding to the detection rotating mechanical arm 6 is less than the accuracy of the grating ruler 43 corresponding to the detection workbench 7 .

[0068] The rotating mechanical arm 6 and the detection workbench 7 in the system provided by the present invention share the first guide rail 40, and the detection workbench 7 can also achieve a wide range of translation on the first guide rail 40. By arranging a grating ruler 43 for detecting the operation of the rotating mechanical arm 6 and / or the detection workbench 7 on the base 41, it is possible to detect the operation of the rotating mechanical arm 6 and the detection workbench 7, thereby achieving the precise operation of the rotating mechanical arm 6 and the detection workbench 7 to ensure the accuracy of wafer detection. In addition, the system does not need to make the detection workbench 7 with a large load move back and forth between the loading / unloading area and the detection area. Only the rotating mechanical arm 6 with a small load can rotate and move to complete the transmission and exchange of the wafer, which saves a lot of time and greatly improves work efficiency. In addition, the system does not need to lengthen the high-precision grating ruler 43 corresponding to the detection workbench 7, and only the low-precision grating ruler 43 corresponding to the rotating mechanical arm 6 can ensure the accuracy of wafer detection, which greatly reduces the equipment cost.

[0069] Optionally, the arm 61 is in a straight line shape, and the middle part thereof is connected to the output end of the rotary motor 64 .

[0070] In addition, the present invention can receive wafers by moving the lifting mechanism 2 up and down. The present invention provides the following two structures of the lifting mechanism 2.

[0071] In one embodiment, the present invention provides a lifting mechanism 2 of a first structure, which includes a lifting motor 24 sealedly connected to a pre-vacuum chamber body 30 of the pre-vacuum chamber 3 and a tray 25 connected to an output end of the lifting motor 24, wherein the lifting motor 24 is used to drive the tray 25 to perform lifting movements, and the tray 25 is arranged in the pre-vacuum chamber 3 and is used to carry a wafer 10.

[0072] In another embodiment, the present invention provides a lifting mechanism 2 of a second structure, which includes a transmission shaft 22 located outside the pre-vacuum chamber 3, and the transmission shaft 22 is connected to a plurality of lifting shafts 23 through a connecting plate 21. The plurality of lifting shafts 23 pass through the pre-vacuum chamber body 30 of the pre-vacuum chamber 3 and extend into the pre-vacuum chamber 3 and are used to carry the wafer 10. The lifting shaft 23 is sealedly connected to the pre-vacuum chamber body 30, and the transmission shaft 22 is externally connected to a lifting motor 24.

[0073] The lifting mechanism 2 provided in this embodiment of the present invention is connected to the connecting plate 21 through a plurality of lifting shafts 23, and the transmission shaft 22 is driven by an external lifting motor 24 to move up and down to receive the wafer 10. The lifting mechanism 2 of the second structure provided by the present invention moves in the pre-vacuum chamber 30 through the lifting shaft 23 to receive the wafer 10. Compared with the lifting mechanism 2 of the first structure, the lifting mechanism 2 of the second structure will greatly reduce the volume of the pre-vacuum chamber 3, thereby increasing the speed of evacuating the pre-vacuum chamber 3, making it easier to evacuate, and further improving the working efficiency of the system.

[0074] The present invention sets a pre-vacuum chamber 3 on one side of the vacuum working chamber 5, and the pre-vacuum chamber 3 is connected to the vacuum working chamber 5 via the second valve 4 on one side, and is connected to the atmospheric environment via the first valve 1 on the opposite side. The wafer 10 that needs to be measured or detected first enters the pre-vacuum chamber 3, the pre-vacuum chamber 3 is evacuated, and then the wafer 10 in the pre-vacuum chamber 3 is transferred to the vacuum working chamber 5 by controlling the first valve 1 and / or the second valve 4. Through this arrangement, the wafer 10 can always maintain the vacuum degree of the vacuum working chamber 5 during the process of entering the vacuum working chamber 5 from the atmospheric environment to meet the vacuum degree requirements of the wafer 10 measurement or detection. In addition, reducing the volume of the pre-vacuum chamber 3 can increase the speed of vacuuming and improve work efficiency. According to actual tests, the internal height of the pre-vacuum chamber 3 of the lifting mechanism 2 of the second structure can be as low as 13mm. At the same time, the lifting mechanism 2 moves downward by 6mm, which can realize the transmission requirements of the wafer 10 from the outside to the vacuum working chamber 5, and can greatly shorten the movement time.

[0075] When the pre-vacuum chamber 3 is evacuated to a certain vacuum degree and the second gate valve 4 is opened to transfer the wafer 10, the vacuum degree of the vacuum working chamber 5 increases instantaneously, but cannot exceed the vacuum degree required by the process. The vacuum degree requirement of the vacuum working chamber 5 is <1.0x10 -6 Torr, vacuum degree can reach 5.0x10 -7 According to actual tests, when the vacuum degree of the pre-vacuum chamber 3 is 1.0x10 -4 Torr, when the second gate valve 4 is opened to transfer the wafer 10, the instantaneous vacuum degree of the vacuum working chamber 5 is 9.0x10 -7 Torr, to meet the process requirements, this setting can greatly reduce the vacuuming time and improve work efficiency.

[0076] Optionally, in one embodiment, the first valve 1 includes a second guide rail 15 connected to one side of the pre-vacuum chamber 3, a second slider 16 slidably connected to the second guide rail 15, and a push rod 12 connected to the second slider 16, one end of the push rod 12 is connected to a linear actuator 19, and the other end is connected to a gate plate 11, the output end of the linear actuator 19 is rotatably connected to the push rod 12, and the linear actuator 19 is used to drive the push rod 12 to move; guide rail seats are provided at both ends of the second guide rail 15, and the second slider 16 is abutted against the guide rail seat at one end of the second guide rail 15 through an elastic member 18; the second slider 16 is rotatably connected to a rocker rod 14, and the other end of the rocker rod 14 is rotatably connected to the push rod 12; the second slider 16 is also rotatably connected to a connecting rod 17, and the other end of the connecting rod 17 is rotatably connected to the push rod 12.

[0077] Optionally, one end of the push rod 12 is connected to the linear actuator 19, and the other end is bent toward the pre-vacuum chamber 3; the push rod 12 includes a straight rod section and a bent section connected to the straight rod section, one end of the straight rod section away from the bent section is connected to the output end of the linear actuator 19, and one end of the bent section away from the straight rod section is connected to the gate 11; the bottom of the straight rod section is connected to the connecting rod 17, and the top of the straight rod section is connected to the rocker arm 14.

[0078] Optionally, a sealing ring is provided on one side of the valve plate 11 close to the pre-vacuum chamber 3; a limit block 13 is fixedly connected to the guide rail seat above the second guide rail 15, and the limit block 13 is located at the end of the guide rail seat away from the pre-vacuum chamber 3; one end of the elastic member 18 abuts against the second slider 16, and the other end abuts against the guide rail seat at the bottom end of the second guide rail 15.

[0079] When the first valve 1 is in the open state, the linear actuator 19 is in the reset state, the elastic member 18 is compressed to the lowest position by the second slider 16, and the valve plate 11 is at the lower edge of the opening of the pre-vacuum chamber 3. At this time, the pre-vacuum chamber 3 is fully opened and the wafer 10 can be transferred; when the first valve 1 is in the optical closed state, the linear actuator 19 is pushed out, driving the push rod 12 to move upward, and at the same time, the push rod 12 drives the second slider 16 to move upward along the second guide rail 15 through the connecting rod 17. When the second slider 16 moves to the top of the second guide rail 15, the valve plate 11 just covers the opening of the pre-vacuum chamber 3; when the first valve 1 is in the closed state: the linear actuator 19 continues to push out, because the second slider 16 is already at the highest position of the second guide rail 15, the push rod 12 is driven by the swing rod 14 to rotate to the right, and when the push rod 12 contacts the limit block 13 above the second guide rail 15, the valve plate 11 just presses the opening of the pre-vacuum chamber 3 to achieve a sealing effect.

[0080] The first valve 1 provided in this embodiment of the present invention has a simple structure, low cost, convenience and practicality, and does not require a complex cylinder drive mechanism. The working process is driven by only one linear actuator 19. The first valve 1 realizes the vertical movement and rotation of the valve plate 11 through the second slider 16, elastic member 18, push rod 12, rocker rod 14 and connecting rod 17. The rotation angle of the valve plate 11 is controlled by the limit block 13, and the opening, closing and sealing functions of the valve plate 11 to the pre-vacuum chamber 3 can be effectively completed.

[0081] In addition, the present invention also provides a wafer transmission and exchange method, using the wafer transmission and exchange system, the wafer transmission and exchange method can be used for wafer transportation in semiconductor measurement or detection equipment, the method comprising:

[0082] Step 1: Place the wafer 10 to be tested on the lifting mechanism 2 in the pre-vacuum chamber 3, and move and rotate the arm 61 to transfer the wafer 10 to the detection workbench 7 in the vacuum working chamber 5;

[0083] Step 2: the testing workbench 7 measures the wafer 10 to be tested;

[0084] Step 3: Place a new wafer 10 to be tested on the lifting mechanism 2 in the pre-vacuum chamber 3, and move and rotate the arm 61 to transfer and exchange the wafer 10 to be tested carried by the lifting mechanism 2 and the tested wafer 10 carried by the inspection workbench 7;

[0085] Step 4: Move the tested wafer 10 out of the pre-vacuum chamber 3 , and use the testing workbench 7 to test a new wafer 10 to be tested. Repeat the above steps until the measurement / testing of all wafers 10 is completed.

[0086] In one embodiment, the step 1 specifically includes:

[0087] Place the wafer 10 to be tested on the lifting mechanism 2 in the pre-vacuum chamber 3, close the first valve 1, evacuate the pre-vacuum chamber 3, and open the second valve 4;

[0088] One end of the arm 61 moves into the pre-vacuum chamber 3 and is inserted between the lifting mechanism 2 and the wafer 10. The lifting mechanism 2 moves downward to allow the wafer 10 to be tested to fall on the arm 61.

[0089] The arm 61 moves toward the inspection table 7 and rotates, and the Z-axis moving mechanism 9 of the inspection table 7 rises to receive the wafer 10 to be inspected.

[0090] In one embodiment, the step three specifically includes:

[0091] Close the second valve 4, open the first valve 1, and place a new wafer 10 to be tested onto the lifting mechanism 2 in the pre-vacuum chamber 3;

[0092] The first valve 1 is closed to evacuate the pre-vacuum chamber 3 , and the second valve 4 is opened. The arm 61 moves and rotates to transfer and exchange the wafer 10 to be tested carried by the lifting mechanism 2 and the wafer 10 already tested carried by the inspection workbench 7 .

[0093] Specifically, Figure 7-26 As shown, the specific method of using the wafer transmission and exchange system provided by the present invention includes the following steps:

[0094] S1, delivering the wafer 10 to the lifting mechanism 2 in the pre-vacuum chamber 3, closing the first valve 1, evacuating the pre-vacuum chamber 3, opening the second valve 4, and adjusting the arm 61 to the zero position;

[0095] S2, the arm 61 moves to the inspection table 7 to a position where the wafer 10 is ready to be placed and rotated 90°;

[0096] S3, the arm 61 moves toward the pre-vacuum chamber 3 and prepares to take the wafer 10 to be tested from the pre-vacuum chamber 3;

[0097] S4, the lifting mechanism 2 moves downward, so that the wafer 10 to be tested falls on the arm 61;

[0098] S5, the arm 61 moves toward the detection workbench 7 and rotates 180°;

[0099] S6, the Z-axis moving mechanism 9 rises to receive the wafer 10 to be tested;

[0100] S7, the arm 61 moves toward the pre-vacuum chamber 3 and rotates 180° back to the zero position;

[0101] S8, the Z-axis moving mechanism 9 moves downward to prepare for measuring the wafer 10;

[0102] S9, after the measurement is completed, the Z-axis moving mechanism 9 lifts up the wafer 10 to be measured, closes the second valve 4, opens the first valve 1, and loads the wafer 10 to be measured into the pre-vacuum chamber 3;

[0103] S10, close the first valve 1, evacuate the pre-vacuum chamber 3, open the second valve 4, move the arm 61 to the detection workbench 7 to prepare for placing the wafer 10 and rotate 180°;

[0104] S11, the arm 61 moves toward the pre-vacuum chamber 3, and is ready to take out a wafer 10 to be tested from the pre-vacuum chamber 3;

[0105] S12, the lifting mechanism 2 moves downward, and the arm 61 receives the wafer 10 to be tested;

[0106] S13, the arm 61 moves toward the inspection workbench 7, ready to take away the inspected wafer 10;

[0107] S14, the Z-axis moving mechanism 9 descends, and the arm 61 receives the measured wafer 10;

[0108] S15, the arm 61 rotates 180 degrees to exchange the wafer 10 to be tested with the wafer 10 that has been tested;

[0109] S16, the Z-axis moving mechanism 9 rises to receive the wafer 10 to be tested;

[0110] S17, the arm 61 moves toward the pre-vacuum chamber 3 to put the tested wafer 10 back into the pre-vacuum chamber 3;

[0111] S18, the lifting mechanism 2 rises to receive the wafer 10 to be measured; the Z-axis moving mechanism 9 descends to prepare for measuring the wafer 10 to be measured;

[0112] S19, the arm 61 moves out of the pre-vacuum chamber 3, closes the second valve 4, opens the first valve 1, and moves the tested wafer 10 out of the pre-vacuum chamber 3;

[0113] S20 , the arm 61 returns to the zero position and starts measuring, and the above steps are repeated until the measurement / detection of all wafers 10 is completed.

[0114] The wafer transmission and exchange method provided by the present invention can always maintain the vacuum degree of the vacuum working chamber 5 within the process requirements through the coordination and linkage between the pre-vacuum chamber 3, the vacuum working chamber 5, the first valve 1 and the second valve 4, so as to meet the vacuum degree requirements of the wafer 10 for measurement or detection, realize the continuous and uninterrupted measurement / detection of the wafer, and greatly improve the work efficiency. In addition, the method is combined with the rotating mechanical arm 6 that can rotate and move, and there is no need to make the heavy-load detection workbench 7 move back and forth repeatedly between the loading / unloading area and the detection area to complete the transmission and exchange of the wafer, which saves a lot of time and greatly improves the work efficiency. At the same time, there is no need to lengthen the high-precision grating ruler 43 corresponding to the detection workbench 7, and the accuracy of wafer detection can be guaranteed by rotating the low-precision grating ruler 43 corresponding to the mechanical arm 6, which greatly reduces the equipment cost.

[0115] Although the present invention has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the present invention. Anyone familiar with this technology can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be based on the definition of the claims.

Claims

1. Wafer transfer and exchange system, characterized in that: include: A vacuum working chamber, the interior of which is in a vacuum state; a pre-vacuum chamber, disposed adjacent to the vacuum working chamber, the pre-vacuum chamber being connected to the vacuum working chamber via a second valve on one side and connected to the atmosphere via a first valve on the opposite side; A lifting mechanism, which carries the wafer on its top surface and is configured to drive the wafer to perform lifting movement in the pre-vacuum chamber; A detection workbench is arranged in the vacuum working chamber, which carries the wafer on its top surface and can translate along three orthogonal directions; as well as A rotating mechanical arm is movably disposed in the vacuum working chamber and has a rotatable arm; the rotating mechanical arm is configured to transfer and exchange the wafer carried by the lifting mechanism with the wafer carried by the detection workbench through the rotating arm; The vacuum working chamber is provided with a first guide rail, and the rotating mechanical arm is movably connected to the first guide rail; the detection workbench includes an XY axis moving mechanism connected to the first guide rail and a Z axis moving mechanism connected to the XY axis moving mechanism; the Z axis moving mechanism carries the wafer on the top surface and is used to drive the wafer to move up and down, and the XY axis moving mechanism is used to drive the Z axis moving mechanism to translate along two orthogonal directions; The rotary mechanical arm comprises a linear motor coil, a rotary motor and an arm drivingly connected to the rotary motor, wherein the rotary motor is used to drive the arm to rotate; a base is fixed below the first guide rail, a linear motor magnetic track connected to the linear motor coil is arranged on the base, and the linear motor coil is used to drive the rotary mechanical arm to translate; The base is also provided with a grating ruler for detecting the operation of the rotating mechanical arm and / or the detection workbench. The accuracy of the grating ruler corresponding to the detection rotating mechanical arm is less than the accuracy of the grating ruler corresponding to the detection workbench.

2. The wafer transmission and exchange system according to claim 1, characterized in that: The arm is in a straight line shape, and the middle part thereof is connected to the output end of the rotating motor.

3. The wafer transmission and exchange system according to claim 1 or 2, characterized in that: The lifting mechanism includes a lifting motor sealedly connected to the pre-vacuum chamber body of the pre-vacuum chamber and a tray connected to the output end of the lifting motor. The lifting motor is used to drive the tray to perform lifting movements. The tray is arranged in the pre-vacuum chamber and is used to carry wafers.

4. The wafer transmission and exchange system according to claim 1 or 2, characterized in that: The lifting mechanism includes a transmission shaft located outside the pre-vacuum chamber, the transmission shaft is connected to a plurality of lifting shafts via a connecting plate, the plurality of lifting shafts pass through the pre-vacuum chamber body of the pre-vacuum chamber and extend into the pre-vacuum chamber and are used to carry wafers, the lifting shaft is sealedly connected to the pre-vacuum chamber body, and the transmission shaft is externally connected to a lifting motor.

5. A wafer transfer and exchange method, characterized in that: Using the wafer transmission and exchange system according to any one of claims 1 to 4, the method comprises: Step 1: Place the wafer to be tested on the lifting mechanism in the pre-vacuum chamber, move and rotate the arm, and transfer the wafer to be tested to the detection workbench in the vacuum working chamber; Step 2: The inspection workbench measures the wafer to be tested; Step 3: Place a new wafer to be tested on the lifting mechanism in the pre-vacuum chamber, and move and rotate the arm to transfer and exchange the wafer to be tested carried by the lifting mechanism with the tested wafer carried by the inspection workbench; Step 4: Move the tested wafer out of the pre-vacuum chamber, and use the testing workbench to test a new wafer to be tested. Repeat the above steps until all wafers have been tested. The step 1 specifically includes: Place the wafer to be tested on the lifting mechanism in the pre-vacuum chamber, close the first valve, evacuate the pre-vacuum chamber, and open the second valve; One end of the arm moves into the pre-vacuum chamber and is inserted between the lifting mechanism and the wafer, and the lifting mechanism moves downward to make the wafer to be tested fall on the arm; The arm moves toward the inspection table and rotates, and the Z-axis moving mechanism of the inspection table rises to receive the wafer to be inspected; The step three specifically includes: Close the second valve, open the first valve, and place a new wafer to be tested onto the lifting mechanism in the pre-vacuum chamber; Close the first valve to evacuate the pre-vacuum chamber, open the second valve, and move and rotate the arm to transfer and exchange the wafer to be tested carried by the lifting mechanism with the tested wafer carried by the detection workbench.

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