Method for manufacturing exhaust purification catalyst device

Abstract

A method for manufacturing an exhaust gas purification catalyst device, comprising: (A) holding a honeycomb substrate having a plurality of cell flow paths divided by cell walls with the flow path direction of the cell flow paths made vertical, placing a coating liquid for forming a catalyst coating layer on an upper end surface of the substrate; (B) applying the coating liquid to one or more of the cell walls of the substrate after the process (A) by suction from a lower end surface by a reduced pressure pump; and (C) transferring the substrate after the process (A) to a subsequent process, wherein the process (B) and the process (C) are simultaneously performed by a transfer suction device.

Description

Technical Field

[0001] This invention relates to a method for manufacturing an exhaust gas purification catalyst device. Background Technology

[0002] Exhaust gas emitted from internal combustion engines such as automobile engines is purified by an exhaust gas purification catalyst device installed in the exhaust system before being released into the atmosphere. This exhaust gas purification catalyst device, for example, has a structure comprising a honeycomb substrate and a catalyst coating. The honeycomb substrate has multiple unit (cell) flow paths divided by partitions, and the catalyst coating is formed on and / or within the partitions of the honeycomb substrate.

[0003] This exhaust gas purification catalyst device is manufactured, for example, by coating a honeycomb substrate with a coating liquid containing the raw material components of the catalyst coating and then firing it.

[0004] It is known to apply a coating liquid to a honeycomb substrate by placing the coating liquid on one end face and drawing it from the opposite end face. For example, Patent Document 1 describes a method in which a frame-shaped storage fixture capable of storing the coating liquid is installed on the first end face of the honeycomb substrate, and the coating liquid is stored on the first end face. Based on this, the pressure on the second end face opposite to the first end face is relatively lower than the pressure on the first end face, resulting in a flow of the coating liquid from the first end face to the second end face, thereby coating the honeycomb substrate with the coating liquid.

[0005] The industrial manufacturing of exhaust gas purification catalyst devices is typically carried out through automated processing systems. In these systems, multiple processing stations are set up from upstream to downstream, and the workpiece is conveyed from the upstream processing station to the downstream processing station while being processed sequentially.

[0006] In such an automated machining system, the processing time of each machining station may not be the same. In this case, the machining of the station that requires the longest processing time among a series of machining stations set up from the upstream side to the downstream side becomes the speed-limiting (speed limit, speed restriction) stage of the entire process.

[0007] In this case, consider setting up multiple speed-limiting processing devices, arranging them from the upstream to the downstream side of the automatic processing system, and sharing the responsibility of performing the speed-limiting process.

[0008] For example, Patent Document 2 describes a conveying device consisting of a conveying unit that conveys a workpiece (workpiece) along a conveying line and a processing unit located near the conveying line. The conveying device is provided with a pass-through auxiliary unit that holds the preceding workpiece on the conveying line and raises it so that the following workpiece passes over the preceding workpiece and is conveyed first.

[0009] Existing technical documents

[0010] Patent Document 1: Japanese Patent Application Publication No. 2018-015704

[0011] Patent Document 2: Japanese Patent Application Publication No. 2003-237940 Summary of the Invention

[0012] When the coating of the coating liquid onto the honeycomb substrate is carried out by placing the coating liquid on one end face of the honeycomb substrate and attracting it from the opposite end face, the attraction process often becomes a speed-limiting process.

[0013] Specifically, in coating methods that involve placing and attracting the coating liquid onto the end face of a honeycomb substrate, the attraction process from the opposite end face usually takes longer than the placement process of the coating liquid onto one end face of the honeycomb substrate. Therefore, the attraction process often becomes the speed-limiting process for coating liquid application.

[0014] When the coating process, which is a speed limit for the application of the coating liquid to the honeycomb substrate, is applied using the method described in Patent Document 2, the time from the application of the coating liquid to the start of the suction process varies depending on each honeycomb substrate, which raises concerns about the quality of the resulting coating fluctuating according to the honeycomb substrate.

[0015] Consider replacing the method described in Patent Document 2, for a certain processing that requires a specified processing time, one workpiece is sequentially handed over to multiple processing devices, and short processing times are performed in each processing device, thereby ensuring the specified processing time as a whole across multiple processing devices.

[0016] However, when applying the coating liquid to the honeycomb substrate, if the coating liquid is placed on the end face and the suction is divided, the coating will be unevenly distributed, and the exhaust purification capacity will be impaired.

[0017] In existing automated machining systems, the workpiece cannot be processed while it is being moved from one machining station to the next. Therefore, in addition to the processing time at each machining station, the transfer time must also be considered as part of the process time, which becomes an obstacle to shortening the overall processing time.

[0018] The present invention was made in view of the above circumstances, and its object is to provide a method for manufacturing a highly efficient exhaust gas purification catalyst device, wherein the coating of the coating liquid onto the honeycomb substrate is performed by placing the coating liquid onto one end face of the honeycomb substrate and by attraction from the opposite end face, and the processing time of the entire process is shortened while ensuring the specified attraction time, and a high-quality coating is obtained.

[0019] The present invention is described below.

[0020] Scheme 1: A method for manufacturing an exhaust gas purification catalyst device, comprising:

[0021] Process (A): A honeycomb substrate having multiple unit flow paths divided by unit walls is held in such a way that the flow path direction of the unit flow paths becomes vertical, and a catalyst coating forming liquid is placed on the upper end surface of the substrate.

[0022] Step (B): The substrate from step (A) is drawn from the lower end face using a pressure reducing pump, and the coating liquid is applied to the unit walls of the substrate and to at least one unit wall; and

[0023] Process (C): Transfer the substrate from process (A) to the subsequent process.

[0024] In the manufacturing method of the exhaust gas purification catalyst device,

[0025] The process (B) and the process (C) are performed simultaneously by a transfer and suction device.

[0026] According to the manufacturing method of the exhaust gas purification catalyst device described in Scheme 1, the transfer and suction device has one or more pressure reducing channels that connect the lower end face of the substrate after step (A) to the pressure reducing pump.

[0027] Scheme 3 is based on the manufacturing method of the exhaust gas purification catalyst device described in Scheme 2.

[0028] The pressure relief channels respectively include a first pressure relief channel and a second pressure relief channel.

[0029] The first pressure-reducing channel is connected to the pressure-reducing pump and thus depressurizes the pressure.

[0030] The second pressure-reducing channel connects the lower end face of the substrate to the first pressure-reducing channel after the transfer suction device receives the substrate following step (A) and before the substrate is transferred to a predetermined position.

[0031] When the substrate is moved to a predetermined position, the second pressure relief channel disconnects the lower end face of the substrate from the first pressure relief channel.

[0032] Scheme 4 is based on the manufacturing method of the exhaust gas purification catalyst device described in Scheme 3.

[0033] The transfer and suction device comprises two layers, a first layer and a second layer, stacked together. The first layer contains the first decompression channel, and the second layer contains the second decompression channel.

[0034] The second layer is movable relative to the first layer.

[0035] After receiving the substrate from process (A), the second layer moves relative to the first layer to transfer the substrate to the subsequent process.

[0036] Scheme 5 is a method for manufacturing an exhaust gas purification catalyst device according to any one of Schemes 1 to 4, wherein the transfer and suction device is disc-shaped.

[0037] Scheme 6 is based on the manufacturing method of the exhaust gas purification catalyst device described in Scheme 4.

[0038] The transfer and suction device is a two-layer disc-shaped structure, consisting of a first disc and a second disc-shaped structure coaxially stacked together.

[0039] The relative movement of the second layer with respect to the first layer is a rotation.

[0040] Scheme 7 is based on the manufacturing method of the exhaust gas purification catalyst device described in Scheme 6.

[0041] The first decompression channel has:

[0042] A pump connection opening for connection to the pressure reducing pump is provided on the surface of the first layer opposite to that of the second layer; and

[0043] The arc-shaped opening on the surface of the second layer side is an arc-shaped opening along the circumference of the first layer.

[0044] The second decompression channel has:

[0045] A pressure-reducing channel connection opening for connection with the first pressure-reducing channel is provided on the surface of the second layer on the side of the first layer; and

[0046] A substrate connection opening is provided on the surface opposite to the first layer for connection to the lower end face of the substrate after process (A).

[0047] When the second layer rotates relative to the first layer,

[0048] After the substrate from process (A) is received in the second layer and before it is moved to a predetermined position, the pressure relief channel connecting opening of the second layer moves along the arc of the arc-shaped opening of the first layer, and...

[0049] When the substrate is moved to a predetermined position, the pressure relief channel connection opening of the second layer disconnects from the lower end face of the substrate and the first pressure relief channel by disengaging from the arc-shaped opening of the first layer.

[0050] According to the manufacturing method of the exhaust gas purification catalyst device described in Scheme 7, in Scheme 8, the central angle of the arc of the arc-shaped opening of the first pressure reducing channel is more than 90° and less than 270°.

[0051] Scheme 9 describes a manufacturing system for an exhaust gas purification catalyst device, comprising:

[0052] A coating liquid placement apparatus holds a substrate having multiple unit flow paths divided by unit walls in such a manner that the flow direction of the unit flow paths is changed to vertical, and places a catalyst coating forming coating liquid on the upper end surface of the substrate; and

[0053] The transfer suction device simultaneously performs a process of suctioning the substrate after step (A) from the lower end face and applying the coating liquid to the unit wall of the substrate and one or more unit walls, and a process of transferring the substrate after step (A) to a subsequent step.

[0054] Solution 10: A transfer and attraction device forms a substrate by placing a catalyst coating forming liquid on the upper end surface of a substrate having multiple unit flow paths divided by unit walls, and simultaneously performs one or more steps of attracting the substrate from its lower end surface and applying the coating liquid to the unit walls of the substrate and the unit walls, and transferring the substrate to a subsequent step.

[0055] According to the present invention, a method for manufacturing a high-efficiency exhaust gas purification catalyst device is provided. When the coating liquid is applied to the honeycomb substrate by placing the coating liquid on one end face of the honeycomb substrate and attracting it from the opposite end face, a predetermined attraction time can be ensured, the overall processing time of the process is shortened, and a high-quality coating can be obtained. Attached Figure Description

[0056] Figure 1 This is a perspective view illustrating an example of the transfer and suction device of the present invention.

[0057] Figure 2 This is an internal perspective perspective view showing the internal structure of the first and second layers of an example of the transfer and suction device of the present invention. Detailed Implementation

[0058] Manufacturing Method of Exhaust Gas Purification Catalyst Device

[0059] The method for manufacturing the exhaust gas purification catalyst device of the present invention includes:

[0060] Process (A): A honeycomb substrate having multiple unit flow paths divided by unit walls is held in such a way that the flow path direction of the unit flow paths becomes vertical, and a catalyst coating forming liquid is placed on the upper end surface of the substrate (coating liquid placement process).

[0061] Process (B): The substrate from process (A) is drawn from the lower end face using a pressure reducing pump, and the coating liquid is applied to the unit walls of the substrate and at least one unit wall (drawing coating process); and

[0062] Process (C): Transfer the substrate from process (A) to the next process (transfer process).

[0063] In the manufacturing method of the exhaust gas purification catalyst device

[0064] The (B) suction coating process and (C) transfer process are performed simultaneously by a transfer suction device.

[0065] In the manufacturing method of the exhaust gas purification catalyst device of the present invention, a transfer and suction device is used to simultaneously transfer and suction the substrate after it has been loaded with the coating liquid for catalyst coating formation. According to this method, no hindrance occurs while waiting for suction, thus the time from loading the coating liquid onto the honeycomb substrate to the start of suction can be easily controlled within a predetermined time. Furthermore, in the method of the present invention, the suction process for one honeycomb substrate is performed without interruption using the transfer and suction device. Therefore, the resulting coating is less prone to unevenness, and a high-quality coating can be obtained. Moreover, according to the method of the present invention, the suction coating process is performed even during the transfer time when processing of the workpiece is impossible in the prior art, thus greatly shortening the overall processing time.

[0066] As described above, the manufacturing method of the exhaust gas purification catalyst device of the present invention includes (A) a coating liquid placement step, (B) an aspiration coating step, and (C) a transfer step, wherein (B) the aspiration coating step and (C) the transfer step are performed simultaneously by a transfer aspiration device.

[0067] The elements of the method for manufacturing the exhaust gas purification catalyst device of the present invention will be described in turn below.

[0068] <Substrate>

[0069] The substrate used in the manufacturing method of the exhaust gas purification catalyst device of the present invention is a honeycomb substrate having multiple unit flow paths divided by unit walls. This honeycomb substrate can be, for example, an integral honeycomb substrate made of materials such as cordierite, SiC, stainless steel, and inorganic oxide particles, and can be either a direct-flow or wall-flow type.

[0070] <(A) Coating Solution Placement Process>

[0071] In the coating liquid placement process (A), a honeycomb substrate having multiple unit flow paths divided by unit walls is held in a manner in which the flow path direction of the unit flow paths is changed to vertical, and a coating liquid for forming a catalyst coating is placed on the upper end surface of the substrate.

[0072] The coating liquid placement process can be performed by a coating apparatus. This coating apparatus can be, for example, a coating apparatus capable of placing the coating liquid on the upper surface of a honeycomb substrate, which is held in a manner where the flow direction of the cell flow path becomes vertical.

[0073] The coating apparatus may include, for example, a frame-shaped mounting fixture and a coating liquid supply machine.

[0074] The mounting fixture may be frame-shaped, detachably mounted on the upper surface of the honeycomb substrate, and the upper surface of the substrate and the mounting fixture may be used to form a mounting portion for the coating liquid.

[0075] The application liquid supply machine may, for example, have the function of supplying and placing the application liquid into the aforementioned mounting section. This application liquid supply machine may be, for example, a spray or misting type supply machine.

[0076] <(B) Suction Coating Process>

[0077] (B) The suction coating process is a process in which a pressure reducing pump is used to draw the substrate after the (A) coating liquid placement process from the lower end face, and the coating liquid is applied to the unit wall of the substrate and one or more units in the unit wall.

[0078] If the substrate after the coating liquid placement process is drawn from the lower end face, an airflow is generated from the upper end to the lower end of the unit flow path of the substrate. As a result, the coating liquid placed on the upper end face of the substrate flows into the unit flow path, and the coating liquid is applied to form a coating layer.

[0079] Applying the coating liquid to the unit wall of the substrate refers to coating in which the coating liquid is formed on the surface of the unit wall facing the unit flow path. Alternatively, applying the coating liquid into the unit wall of the substrate refers to coating in which the coating liquid is formed on the surface of the pore walls of the porous unit wall.

[0080] <(C) Transfer Process>

[0081] (C) The transfer process is the process of transferring the substrate after the (A) coating liquid application process to the subsequent process.

[0082] Subsequent processes can be any process, such as firing, forming a second catalyst coating, loading catalyst components, conditioning, or shell filling.

[0083] <Transfer and Suction Device>

[0084] In the manufacturing method of the exhaust gas purification catalyst device of the present invention, the above-described (B) suction coating process and (C) transfer process are performed simultaneously by a transfer and suction device. Therefore, the transfer and suction device is a device that simultaneously has the transfer function of transferring the substrate after the (A) coating liquid placement process to the subsequent process, and the suction coating function of suctioning the substrate after the (A) coating liquid placement process from the lower end face and applying the coating liquid to the unit wall of the substrate and one or more of the unit walls.

[0085] The conveying function of a transfer and attraction device can be a linear conveying function represented by a conveyor belt, or a circular conveying function represented by a turntable.

[0086] The suction coating function of the transfer suction device can be achieved by connecting the lower end face of the substrate after the (A) coating liquid loading process to the pressure reducing channel of the pressure reducing pump. The transfer suction device may have only one pressure reducing channel or more than two pressure reducing channels.

[0087] The pressure reduction channel of the transfer suction device may include a first pressure reduction channel and a second pressure reduction channel. Here, the first pressure reduction channel may be connected to a pressure reduction pump to reduce pressure. In addition, the second pressure reduction channel can apply pressure reduction to the lower end surface of the substrate after the coating liquid application process by connecting the first pressure reduction channel in a pressure-reduced state to the lower end surface of the substrate after the coating liquid application process (A).

[0088] When performing the suction coating process using a transfer suction device, it is also a preferred embodiment of the present invention to insert a suitable mounting clamp between the substrate and the transfer suction device in order to ensure the airtightness of the connection between the lower end face of the substrate and the pressure reduction channel (especially the second pressure reduction channel).

[0089] The second decompression channel can move relative to the first decompression channel, thereby enabling the transfer of the substrate after the (A) coating liquid loading process.

[0090] Alternatively, when the second decompression channel moves, it can also be done in the following way:

[0091] When the substrate is within a predetermined range, the second decompression channel and the first decompression channel are connected, applying decompression to the lower end face of the substrate.

[0092] When the substrate reaches the predetermined position, the connection between the second decompression channel and the first decompression channel is released, the decompression of the lower end face of the substrate is removed, and the suction coating process ends.

[0093] When the transfer suction device has two or more decompression channels, each decompression channel can have a first decompression channel and a second decompression channel.

[0094] As a way to realize the above-mentioned relationship between the first decompression channel and the second decompression channel, the following example can be exemplified:

[0095] The transfer and suction device consists of two layers, a first layer and a second layer, stacked together. The first layer contains a first decompression channel, and the second layer contains a second decompression channel.

[0096] The second layer can move relative to the first layer.

[0097] In such a transfer and attraction device, after receiving the substrate from process (A), the second layer can transfer the substrate to a subsequent process by moving relative to the first layer.

[0098] The transfer and suction device used in the manufacturing method of the exhaust gas purification catalyst device of the present invention can be of any form as long as it can perform the above-mentioned functions.

[0099] The transfer and suction device in this invention can be, for example, disc-shaped. In particular, it can be a two-disc structure having a first disc-shaped layer and a second disc-shaped layer, which are coaxially stacked. In this case, by rotating the second layer relative to the first layer, the second layer can be moved relative to the first layer.

[0100] In this two-layered, disk-shaped transfer and suction device

[0101] The first decompression channel can have:

[0102] A pump connection opening for connection to a pressure reducing pump, located on the side opposite to the second layer in the first layer; and

[0103] The arc-shaped opening on the side of the second layer is an arc-shaped opening along the circumference of the first layer.

[0104] In addition, the second decompression channel may have:

[0105] A pressure-reducing channel connection opening, which is open on the surface of the first layer in the second layer, for connecting with the first pressure-reducing channel; and

[0106] A substrate connection opening that is open on the side opposite to the first layer and is used to connect to the lower end face of the substrate after process (A).

[0107] According to this structure, when the second layer rotates relative to the first layer, after the second layer receives the substrate following process (A) and before the substrate is transferred to a predetermined position, the pressure-reducing channel connecting opening of the second layer can move along the arc of the arc-shaped opening of the first layer. Thus, the second pressure-reducing channel of the second layer is depressurized via the first pressure-reducing channel of the first layer, thereby also applying pressure to the lower end face of the substrate on the substrate connecting opening of the second layer.

[0108] Therefore, when the pressure relief channel connecting the opening of the second layer moves along the arc of the arc opening of the first layer, the (B) suction coating process and the (C) transfer process are simultaneously performed on the substrate after the (A) coating liquid placement process.

[0109] If the relative rotation of the second layer with respect to the first layer continues from the above state, the pressure relief channel connection opening of the second layer disengages from the arcuate range of the arcuate opening of the first layer. Thus, the connection between the lower end face of the substrate and the first pressure relief channel is released, the lower end face of the substrate returns to normal pressure, and the (B) suction coating process ends. Alternatively, if the point where the pressure relief channel connection opening disengages from the arcuate range of the arcuate opening is set near the destination of the transfer, the (C) transfer process can also end here.

[0110] In the disc-shaped transfer and suction device described above, by adjusting the central angle of the arc of the arc-shaped opening of the first decompression channel, an appropriate transfer distance corresponding to the positional relationship between the coating liquid carrier and the subsequent process execution position can be set, and the suction time in the (B) suction coating process can be adjusted.

[0111] In addition, the suction time in the (B) suction coating process can also be adjusted by adjusting the relative rotation speed of the second layer relative to the first layer.

[0112] In the first layer of the disc-shaped transfer and suction device as described above, the central angle of the arc of the arc-shaped opening of the first decompression channel can be, for example, 90° or more, 120° or more, 150° or more, 180° or more, or 210° or more, depending on the positional relationship between the coating liquid placement device and the subsequent process implementation position and the expected suction time. For example, it can be 270° or less, 240° or less, 210° or less, 180° or less, or 150° or less.

[0113] The central angle of the arc-shaped opening of the first decompression channel can typically be above 90° and below 270°.

[0114] Manufacturing System for Exhaust Gas Purification Catalyst Device

[0115] According to another aspect of the present invention, a manufacturing system for an exhaust gas purification catalyst device is provided.

[0116] The manufacturing system for the exhaust gas purification catalyst device of the present invention includes:

[0117] A coating liquid placement apparatus holds a substrate having multiple unit flow paths divided by unit walls in a manner where the flow path direction of the unit flow paths is changed to vertical, and places a catalyst coating forming coating liquid on the upper end surface of the substrate; and

[0118] The transfer suction device simultaneously performs a process of suctioning the substrate after process (A) from the lower end face and applying the coating liquid to the unit wall of the substrate and one or more unit walls, and a process of transferring the substrate after process (A) to the subsequent process.

[0119] Regarding the various elements of the manufacturing system for the exhaust gas purification catalyst device of the present invention, reference can be made to the corresponding portions of the description of the various elements of the manufacturing method for the exhaust gas purification catalyst device of the present invention described above.

[0120] Transfer and attraction device

[0121] According to another aspect of the present invention, a transfer and suction device is provided.

[0122] The transfer and attraction device of the present invention forms a substrate by placing a catalyst coating forming liquid on the upper end surface of a substrate having multiple unit flow paths divided by unit walls, and simultaneously performs one or more steps of attracting the substrate from its lower end surface and applying the coating liquid to the unit walls of the substrate and the unit walls, and transferring the substrate to a subsequent step.

[0123] Regarding the various elements of the transfer and suction device of the present invention, reference can be made to the corresponding portions of the description of the various elements of the manufacturing method of the exhaust gas purification catalyst device of the present invention described above.

[0124] Implementation Method

[0125] Figure 1 and Figure 2 This illustrates the structure of an example of a transfer and suction device used in the manufacturing method of the exhaust gas purification catalyst device of the present invention. Figure 1 This is a perspective view showing the outline of the transfer and suction device. Figure 2 It is an internal perspective perspective view used to illustrate the internal structure of the first and second layers that constitute the transfer and attraction device.

[0126] Figure 1 and Figure 2 The transfer and attraction device (100) has a first layer (10) and a second layer (20) in the shape of a disc, which are formed by two layers stacked coaxially.

[0127] The second layer (20) of the transfer suction device (100) can move along Figure 1 and Figure 2 The arrows, indicated by dashed lines, rotate in the direction of rotation, thereby enabling the second layer (20) to move relative to the first layer (10).

[0128] like Figure 2 As shown, the first layer (10) of the transfer suction device (100) includes a first decompression channel (11), and the second layer (20) includes a second decompression channel (21).

[0129] The first decompression channel (11) of the first layer (10) consists of three channel systems: the first decompression channel A system (11a), the first decompression channel B system (11b), and the first decompression channel C system (11c).

[0130] Each channel of the first pressure reducing channel (11) of the first layer (10) has an arc-shaped opening on the upper surface of the first layer (10) (the side facing the second layer (20)) that is arc-shaped along the circumference of the disc-shaped first layer (10), and a pump connection opening for connecting to the pressure reducing pump on the lower surface (the side opposite to the second layer (20)).

[0131] The arc-shaped openings of each channel system of the first decompression channel (11) are formed concentrically, and the central angle of the arc of these arc-shaped openings is approximately 180°.

[0132] Each channel's pump connection opening is connected to a pressure reducing pump via a pressure reducing pump connection channel (12). In the transfer suction device (100), the three first pressure reducing channels (11a, 11b, 11c) are connected to the inherent pressure reducing pumps (P1, P2, P3) via inherent pressure reducing pump connection paths (12a, 12b, 12c).

[0133] On the lower surface of the first layer (10), the first decompression channel (11) has no opening other than the pump connection opening.

[0134] The second decompression channel (21) of the second layer (20) consists of three channel systems: the second decompression channel A system (21a), the second decompression channel B system (21b), and the second decompression channel C system (21c).

[0135] Each channel system of the second decompression channel (21) of the second layer (20) has a substrate connection opening on the upper surface of the second layer (20) (the side opposite to the first layer (10)) for connecting with the lower end face of the substrate after the coating liquid placement process (A), and a decompression channel connection opening on the lower surface (the side of the first layer (10)) for connecting with the first decompression channel (11) of the first layer (10).

[0136] In the three second pressure relief channel systems (21a, 21b, 21c) of the second layer (20), each system has two pressure relief channels. The substrate connection opening and the pressure relief channel connection opening of the pressure relief channel belonging to the same system are arranged in a point-symmetric manner (at a distance of 180° from each other) on the upper and lower surfaces of the second layer (20).

[0137] The substrate connection openings of the three second pressure relief channel systems (21a, 21b, 21c) are all located near the outer periphery of the second layer (20) at a distance equal to the axis of the second layer (20).

[0138] On the other hand, the distance from the axis of the second layer (20) to the pressure relief channel connection openings of the three second pressure relief channel systems (21a, 21b, 21c) varies depending on the system. Specifically, the pressure relief channel connection opening of the second pressure relief channel system A (21a) opens at the position corresponding to the substrate connection opening on the lower surface of the second layer (20). In addition, the second pressure relief channel system B (21b) extends radially inward from the substrate connection opening on the upper surface of the second layer (20), and its pressure relief channel connection opening opens slightly closer to the radial inward position on the lower surface of the second layer (20) from the position corresponding to the substrate connection opening. Moreover, the second pressure relief channel system C (21c) extends radially even further inward from the substrate connection opening on the upper surface of the second layer (20), and its pressure relief channel connection opening opens even closer to the radial inward position on the lower surface of the second layer (20) from the position corresponding to the substrate connection opening.

[0139] Here, when the first layer (10) and the second layer (20) are stacked coaxially, the distance from the opening of the pressure relief channel connecting part of the second pressure relief channel A system (21a) of the second layer (20) to the axis of the second layer (20) is the same as the radius of the arc of the arc-shaped opening of the first pressure relief channel A system (11a) of the first layer (10). Furthermore, the distance from the opening of the pressure relief channel connecting part of the second pressure relief channel B system (21b) to the axis is the same as the radius of the arc of the arc-shaped opening of the first pressure relief channel B system (11b). Additionally, the distance from the opening of the pressure relief channel connecting part of the second pressure relief channel C system (21c) to the axis is the same as the radius of the arc of the arc-shaped opening of the first pressure relief channel C system (11c).

[0140] With this structure, when the first layer (10) and the second layer (20) are stacked coaxially, and the second layer (20) is rotated relative to the first layer (10),

[0141] The pressure relief channel connecting opening of the second pressure relief channel A system (21a) moves along the arc-shaped opening of the first pressure relief channel A system (11a).

[0142] The pressure relief channel connecting opening of the second pressure relief channel B system (21b) moves along the arc-shaped opening of the first pressure relief channel B system (11b).

[0143] The pressure relief channel connecting opening of the second pressure relief channel C system (21c) moves along the arc-shaped opening of the first pressure relief channel C system (11c).

[0144] Furthermore, when the second layer (20) rotates relative to the first layer (10), when the pressure relief channel connecting opening of the second pressure relief channel (21) is in the opening area of ​​the arc-shaped opening of the first pressure relief channel (11), the pressure relief channel connecting opening moves along the arc-shaped opening. Although the two are connected, when the pressure relief channel connecting opening of the second pressure relief channel leaves the opening area of ​​the arc-shaped opening of the first pressure relief channel, the connection between the two is released.

[0145] Therefore, by using Figure 1 and Figure 2 The transfer and suction device (100) shown has the positions for implementing the (A) coating liquid placement process and the positions for implementing subsequent processes located near the two ends of the arc-shaped opening of the first decompression channel (11) of the first layer (10) of the transfer and suction device (100), respectively, so that the (B) suction coating process and the (C) transfer process can be performed simultaneously on the substrate after the (A) coating liquid placement process.

[0146] That is, for example, the first layer (10) of the transfer suction device (100) is fixed, and the second layer (20) is continuously rotated relative to the first layer (10). In this state, when the substrate after the coating liquid placement process (A) is received and rotated at the substrate connection opening of the second layer (20), the substrate is transferred from the implementation position of the coating liquid placement process (A) to the implementation position of the subsequent process, and thus the transfer process (C) is performed.

[0147] In addition, during this period, the pressure relief channel connection opening of the second pressure relief channel (21) of the second layer (20) is located in the opening area of ​​the arc-shaped opening of the first pressure relief channel (11) of the first layer (10). Therefore, the pressure relief generated by the pressure relief pump is applied to the lower end surface of the substrate through the pressure relief pump connection path, the pump connection opening, the first pressure relief channel (11), the arc-shaped opening, the pressure relief channel connection opening, the second pressure relief channel (21) and the substrate connection opening, thus performing the (B) suction coating process.

[0148] Furthermore, until the substrate reaches the vicinity of the position for subsequent processes, the opening of the pressure-reducing channel of the second pressure-reducing channel (21) disengages from the arc-shaped area of ​​the arc-shaped opening of the first pressure-reducing channel (11), and the connection between the second pressure-reducing channel (21) and the first pressure-reducing channel (11) is released. As a result, the pressure reduction applied to the lower end face of the substrate is also released, and the (C) suction coating process ends. Alternatively, at this point, the (B) transfer process can also be ended.

[0149] After the substrate is handed over to the subsequent process, the rotation of the second layer (20) continues. At this time, the connection with the first decompression channel (11) is released, and the second decompression channel (21), which is out of decompression state, returns to the vicinity of the implementation position of the (A) coating liquid placement process in the state where the substrate connection opening is empty, in preparation for the (B) transfer process and (C) suction coating process of the next substrate.

[0150] The transfer and suction device (100) has a pressure reduction channel with three systems, each connected to an individual pressure reduction pump, which can maintain an individual pressure reduction state. Therefore, it is not necessary to wait for the completion of the (B) transfer process and (C) suction coating process of one substrate before starting the (B) transfer process and (C) suction coating process of the next substrate, thus achieving a highly efficient process.

[0151] In addition, by adjusting the rotation speed of the second layer (20), the time required for the (B) transfer process and the (C) suction coating process can be adjusted. Therefore, the transfer suction device (100) can also be applied to processes with different predetermined suction times after the coating liquid is placed.

[0152] Explanation of reference numerals in the attached figures

[0153] 10 First Floor

[0154] 11 First decompression channel

[0155] 11a First decompression channel A system

[0156] 11b First decompression channel B system

[0157] 11c First Decompression Channel C System

[0158] 12a pressure reducing pump connection circuit A system

[0159] 12b pressure reducing pump connection to system B

[0160] 12c pressure reducing pump connection circuit C system

[0161] 20th floor

[0162] 21 Second decompression channel

[0163] 21a Second decompression channel A system

[0164] 21b Second decompression channel B system

[0165] 21c Second Decompression Channel C System

[0166] 100 transfer suction device

[0167] P1, P2, P3 pressure reducing pumps

Claims

1. A method for manufacturing an exhaust gas purification catalyst device, comprising: Process (A): A honeycomb substrate having multiple unit flow paths divided by unit walls is held in such a way that the flow path direction of the unit flow paths becomes vertical, and a catalyst coating forming liquid is placed on the upper end surface of the substrate. Step (B): The substrate from step (A) is drawn from the lower end face using a pressure reducing pump, and the coating liquid is applied to the unit walls of the substrate and at least one unit wall within the unit walls; and Process (C): Transfer the substrate from process (A) to the subsequent process. In the manufacturing method of the exhaust gas purification catalyst device, The process (B) and the process (C) are performed simultaneously by the transfer and suction device. The transfer and suction device consists of two layers, a first layer and a second layer, stacked together. The second layer is movable relative to the first layer. After receiving the substrate from process (A), the second layer moves relative to the first layer to transfer the substrate to the subsequent process. The transfer and suction device has one or more pressure-reducing channels that connect the lower end face of the substrate after process (A) to the pressure-reducing pump. The pressure relief channels respectively include the first pressure relief channel contained in the first layer and the second pressure relief channel contained in the second layer. The first pressure-reducing channel is connected to the pressure-reducing pump and thus depressurizes the pressure. The second pressure-reducing channel connects the lower end face of the substrate to the first pressure-reducing channel after the transfer suction device receives the substrate following step (A) and before the substrate is transferred to a predetermined position. When the substrate is moved to a predetermined position, the second pressure relief channel disconnects the lower end face of the substrate from the first pressure relief channel.

2. The method for manufacturing the exhaust gas purification catalyst device according to claim 1, wherein the transfer and suction device is disc-shaped.

3. The method for manufacturing the exhaust gas purification catalyst device according to claim 1, The transfer and suction device is a two-layer disc-shaped structure, consisting of a first disc and a second disc-shaped structure coaxially stacked together. The relative movement of the second layer with respect to the first layer is a rotation.

4. The method for manufacturing the exhaust gas purification catalyst device according to claim 3, The first decompression channel has: A pump connection opening for connection to the pressure reducing pump is provided on the surface of the first layer opposite to that of the second layer; and The arc-shaped opening on the surface of the second layer side is an arc-shaped opening along the circumference of the first layer. The second decompression channel has: A pressure-reducing channel connection opening for connection with the first pressure-reducing channel is provided on the surface of the second layer on the side of the first layer; and A substrate connection opening is provided on the surface opposite to the first layer for connection to the lower end face of the substrate after process (A). When the second layer rotates relative to the first layer, After the substrate from process (A) is received in the second layer and before it is moved to a predetermined position, the pressure relief channel connecting opening of the second layer moves along the arc of the arc-shaped opening of the first layer, and... When the substrate is moved to a predetermined position, the pressure relief channel connection opening of the second layer disconnects from the lower end face of the substrate and the first pressure relief channel by disengaging from the arc-shaped opening of the first layer.

5. In the method of manufacturing the exhaust gas purification catalyst device according to claim 4, the central angle of the arc of the arc-shaped opening of the first pressure reducing channel is 90° or more and 270° or less.

6. A manufacturing system for an exhaust gas purification catalyst device, comprising: A coating liquid placement apparatus holds a substrate having multiple unit flow paths divided by unit walls in such a manner that the flow direction of the unit flow paths is changed to vertical, and places a catalyst coating forming coating liquid on the upper end surface of the substrate; and The transfer suction device simultaneously performs one or more steps: drawing the substrate containing the catalyst coating forming liquid from its lower end face and applying the coating liquid onto and within the unit walls of the substrate; and transferring the substrate containing the catalyst coating forming liquid to a subsequent step. The transfer and suction device consists of two layers, a first layer and a second layer, stacked together. The second layer is movable relative to the first layer. After receiving the substrate containing the catalyst coating forming liquid, the second layer transfers the substrate to the subsequent process by moving relative to the first layer. The transfer and suction device has one or more pressure-reducing channels connecting the lower end face of the substrate carrying the coating liquid for forming a catalyst coating to a pressure-reducing pump. The pressure relief channels respectively include the first pressure relief channel contained in the first layer and the second pressure relief channel contained in the second layer. The first pressure-reducing channel is connected to the pressure-reducing pump and thus depressurizes the pressure. The second decompression channel connects the lower end face of the substrate to the first decompression channel after the transfer suction device receives the substrate containing the catalyst coating forming liquid and before the substrate is transferred to a predetermined position. When the substrate is moved to a predetermined position, the second pressure relief channel disconnects the lower end face of the substrate from the first pressure relief channel.

7. A transfer and attraction device, comprising forming a substrate by placing a catalyst coating forming liquid on the upper end surface of a substrate having a plurality of unit flow paths divided by unit walls, wherein the substrate is formed by placing a catalyst coating forming liquid on the upper end surface of the substrate, and simultaneously performing one or more steps of attracting the substrate from its lower end surface and applying the coating liquid to the unit walls and within the unit walls of the substrate, and transferring the substrate to a subsequent step. The transfer and suction device consists of two layers, a first layer and a second layer, stacked together. The second layer is movable relative to the first layer. After receiving the substrate containing the catalyst coating forming liquid, the second layer transfers the substrate to the subsequent process by moving relative to the first layer. The transfer and suction device has one or more pressure-reducing channels connecting the lower end face of the substrate carrying the coating liquid for forming a catalyst coating to a pressure-reducing pump. The pressure relief channels respectively include the first pressure relief channel contained in the first layer and the second pressure relief channel contained in the second layer. The first pressure-reducing channel is connected to the pressure-reducing pump and thus depressurizes the pressure. The second decompression channel connects the lower end face of the substrate to the first decompression channel after the transfer suction device receives the substrate containing the catalyst coating forming liquid and before the substrate is transferred to a predetermined position. When the substrate is moved to a predetermined position, the second pressure relief channel disconnects the lower end face of the substrate from the first pressure relief channel.

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