Embossed white pad for polishing crystal surface and its production process

Abstract

The application discloses a kind of embossed white pad for crystal surface polishing and its production process, belong to embossed white pad technical field, including support layer, elastic layer and polishing layer, the polishing layer is bonded in the upper surface of elastic layer, the elastic layer is bonded in the upper surface of support layer.The application solves the problem that existing white pad is easy to produce high temperature in polishing process when using, its white pad poor heat dissipation performance, short service life problem, the heat generated by embossed white pad in polishing process can be dissipated to the outside world by heat dissipation through hole and heat dissipation channel, by setting water cooling layer in heat dissipation channel, make multiple groups of water cooling layer be connected by communication pipe, by water inlet interface can add cooling water in water cooling layer, by cooling water in water cooling layer can water cooling cooling to embossed white pad, in turn can to embossed white pad high-efficiency heat dissipation, improve the heat dissipation performance of embossed white pad, avoid embossed white pad damage, can improve the service life of embossed white pad.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of embossed white pad, in particular to an embossed white pad for polishing the surface of a crystal and a production process thereof. BACKGROUND

[0002] The polishing pad, also known as polishing leather, polishing cloth and polishing sheet, is an important auxiliary material for determining the surface quality in polishing the surface of a crystal. A large-size white pad for polishing a substrate and a production process thereof are disclosed in Chinese Patent No. CN114918823B, which belongs to the field of polishing pads. When polishing and grinding work is performed, the outer part of the third polishing white pad is extruded by a polishing element, and the pressure received can be buffered by three layers. The buffering capacity during high-speed grinding can be further improved by the elasticity of the first polishing pad connecting plate and the second polishing pad connecting plate, thereby improving the polishing and grinding effect and effectively improving the working quality of polishing. However, the patent has the following defects:

[0003] The existing white pad has poor heat dissipation performance during polishing, which can easily generate high temperature, and the white pad is easily damaged and has a short service life. SUMMARY

[0004] The present application provides an embossed white pad for polishing the surface of a crystal and a production process thereof, which can efficiently dissipate heat from the embossed white pad, improve the heat dissipation performance of the embossed white pad, avoid damage to the embossed white pad, and improve the service life of the embossed white pad, thereby solving the problems raised in the background art.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical solutions:

[0006] An embossed white pad for polishing the surface of a crystal, comprising a support layer, an elastic layer and a polishing layer, the polishing layer is bonded to the upper surface of the elastic layer, and the elastic layer is bonded to the upper surface of the support layer, wherein the thickness ratio of the support layer, the elastic layer and the polishing layer is 1:1:2-3.

[0007] Preferably, the support layer comprises a base layer, a surface cover layer, a transverse support rib and a longitudinal support rib, the inner side of the base layer is provided with the transverse support rib and the longitudinal support rib, the transverse support rib and the longitudinal support rib are distributed transversely and longitudinally, the top of the base layer is provided with the surface cover layer, and the surface cover layer covers the transverse support rib and the longitudinal support rib.

[0008] Preferably, the elastic layer comprises an upper buffer layer and a lower buffer layer, the upper buffer layer is bonded to the polishing layer, the lower buffer layer is bonded to the support layer, and the upper buffer layer and the lower buffer layer are connected.

[0009] Preferably, the surface of the lower buffer layer is provided with elastic protrusions, and the elastic protrusions are evenly distributed at equal intervals. The upper buffer layer is provided with buffer grooves matching the elastic protrusions, and the upper and lower buffer layers are connected by the elastic protrusions being installed in the buffer grooves.

[0010] Preferably, the polishing layer includes a heat dissipation layer and an abrasive layer, the heat dissipation layer is bonded to the upper buffer layer, and the heat dissipation layer is bonded to the lower surface of the abrasive layer.

[0011] Preferably, the heat dissipation layer is provided with heat dissipation channels and heat dissipation through-holes that are interconnected, the heat dissipation channels penetrate the heat dissipation layer transversely, and the heat dissipation through-holes are evenly distributed on the surface of the heat dissipation layer.

[0012] Preferably, a water cooling layer is further provided on the heat dissipation layer, the water cooling layer is located in the heat dissipation channel, and the water cooling layer is provided with a water inlet interface for water inlet and a drainage interface for drainage.

[0013] Preferably, the number of the water-cooling layers is 2-5 groups, and the multiple groups of water-cooling layers are connected by connecting pipes. Each group of water-cooling layers includes a water-cooling bin and a connecting pipe. The water-cooling bin is located in the heat dissipation channel, and adjacent water-cooling bins are connected by connecting pipes.

[0014] Preferably, the surface of the abrasive layer is provided with transverse grooves and longitudinal grooves, and the transverse grooves and longitudinal grooves are connected to each other. The abrasive layer includes the following raw materials in parts by mass: 20-40 parts of water-based epoxy resin glue, 10-20 parts of polyurethane rubber, 2-3 parts of titanium dioxide, 1-2 parts of zinc oxide, 1-2 parts of calcium carbonate and 3-5 parts of aluminum oxide.

[0015] According to another aspect of the present invention, there is provided a process for producing the embossed white pad for crystal surface polishing as described above, comprising the following steps:

[0016] S1, production support layer:

[0017] Process the produced transverse supporting ribs and longitudinal supporting ribs on the inner side of the base layer according to production requirements, so that the transverse supporting ribs and longitudinal supporting ribs are distributed horizontally and vertically, and adhere the surface cover layer to the top of the base layer so that the surface cover layer covers the transverse supporting ribs and longitudinal supporting ribs to form a supporting layer;

[0018] S2. Production elastic layer:

[0019] Bond the upper buffer layer to the lower buffer layer according to production requirements, so that the elastic protrusion fits exactly into the buffer groove to form an elastic layer;

[0020] S3. Production of polishing layer:

[0021] The heat dissipation layer is processed with heat dissipation channels and heat dissipation holes which are communicated with each other, and the water cooling layer is processed in the heat dissipation channels, so that the water cooling layers are communicated with each other through the communicating pipes, the horizontal grooves and vertical grooves are processed on the surface of the abrasive layer, and the abrasive layer is bonded on the heat dissipation layer to form the polishing layer.

[0022] S4, producing the embossed white pad:

[0023] The elastic layer is arranged on the supporting layer, and the polishing layer is arranged on the elastic layer, so that the supporting layer, the elastic layer and the polishing layer are bonded with each other after lamination to form the embossed white pad.

[0024] Compared with the prior art, the present application has the following advantages:

[0025] The heat dissipation layer is processed with heat dissipation channels and heat dissipation holes which are communicated with each other, and the water cooling layer is processed in the heat dissipation channels, so that the water cooling layers are communicated with each other through the communicating pipes, the horizontal grooves and vertical grooves are processed on the surface of the abrasive layer, and the abrasive layer is bonded on the heat dissipation layer to form the polishing layer. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 It is a forward schematic view of the embossed white pad for polishing the crystal surface of the present application;

[0027] Figure 2 It is a forward exploded view of the supporting layer of the present application;

[0028] Figure 3 It is a front view of the elastic layer of the present application;

[0029] Figure 4 It is an enlarged view of A in the polishing layer of the present application; Figure 3

[0030] Figure 5 It is a forward schematic view of the polishing layer of the present application;

[0031] Figure 6 It is a forward exploded view of the polishing layer of the present application;

[0032] Figure 7 It is a forward schematic view of the heat dissipation layer of the present application;

[0033] Figure 8 It is a forward sectional view of the heat dissipation layer of the first embodiment of the present application;

[0034] Figure 9 It is a forward sectional view of the heat dissipation layer of the second embodiment of the present application;​

[0035] Figure 10 A forward sectional view of the heat dissipation layer of the third embodiment of the present application;

[0036] Figure 11 A forward schematic view of the water cooling layer of the present application.

[0037] In the figure: 1, support layer; 11, base layer; 12, surface cover layer; 13, transverse support rib; 14, longitudinal support rib; 2, elastic layer; 21, upper buffer layer; 22, lower buffer layer; 221, elastic protrusion; 3, polishing layer; 31, heat dissipation layer; 311, heat dissipation channel; 312, heat dissipation through hole; 313, water cooling layer; 3131, water cooling compartment; 3132, connecting pipe; 314, communication pipe; 32, abrasive layer; 321, transverse groove; 322, longitudinal groove. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0039] In order to solve the problem that the existing white pad is easy to generate high temperature in the polishing process, has poor heat dissipation performance, is easy to be damaged, and has short service life, please refer to Figures 1-11 The technical solutions of the present embodiment are as follows:

[0040] Embodiment I

[0041] A embossed white pad for polishing the surface of a crystal includes a support layer 1, an elastic layer 2, and a polishing layer 3. The polishing layer 3 is bonded to the upper surface of the elastic layer 2, and the elastic layer 2 is bonded to the upper surface of the support layer 1. The thickness ratio of the support layer 1, the elastic layer 2, and the polishing layer 3 is 1:1:2-3.

[0042] In the present embodiment, the support layer 1 includes a base layer 11, a surface cover layer 12, a transverse support rib 13, and a longitudinal support rib 14. The inner side of the base layer 11 is provided with the transverse support rib 13 and the longitudinal support rib 14, which are distributed in a transverse and longitudinal staggered manner. The top of the base layer 11 is provided with the surface cover layer 12, which covers the transverse support rib 13 and the longitudinal support rib 14.

[0043] It should be noted that the transverse support rib 13 and the longitudinal support rib 14 distributed in a transverse and longitudinal staggered manner can improve the support force of the support layer 1, thereby improving the support strength of the embossed white pad.

[0044] In this embodiment, the elastic layer 2 includes an upper buffer layer 21 and a lower buffer layer 22 . The upper buffer layer 21 is bonded to the polishing layer 3 , and the lower buffer layer 22 is bonded to the support layer 1 . The upper buffer layer 21 and the lower buffer layer 22 are connected.

[0045] In this embodiment, elastic protrusions 221 are provided on the surface of the lower buffer layer 22, and the elastic protrusions 221 are evenly distributed at equal intervals. A buffer groove matching the elastic protrusions 221 is provided on the upper buffer layer 21, and the upper buffer layer 21 and the lower buffer layer 22 are connected by the elastic protrusions 221 being installed in the buffer groove.

[0046] It should be noted that by providing elastic protrusions 221 on the surface of the lower buffer layer 22, providing a buffer groove on the upper buffer layer 21, and inserting the elastic protrusions 221 into the buffer groove, the buffering performance of the elastic layer 2 can be improved, making the elastic layer 2 highly elastic, thereby improving the elasticity of the embossed white pad.

[0047] In this embodiment, the polishing layer 3 includes a heat dissipation layer 31 and an abrasive layer 32 . The heat dissipation layer 31 is bonded to the upper buffer layer 21 , and the heat dissipation layer 31 is bonded to the lower surface of the abrasive layer 32 .

[0048] It should be noted that the heat dissipation layer 31 can efficiently dissipate heat from the embossed white pad, thereby improving the heat dissipation performance of the embossed white pad, preventing damage to the embossed white pad, and extending the service life of the embossed white pad.

[0049] In this embodiment, the heat dissipation layer 31 is provided with interconnected heat dissipation channels 311 and heat dissipation holes 312 . The heat dissipation channels 311 penetrate the heat dissipation layer 31 laterally, and the heat dissipation holes 312 are evenly distributed on the surface of the heat dissipation layer 31 .

[0050] It should be noted that when the embossed white pad is polishing the crystal surface, the heat generated by the polishing can be dissipated to the outside through the heat dissipation holes 312 and the heat dissipation channels 311, thereby efficiently dissipating the heat of the embossed white pad.

[0051] In this embodiment, a water cooling layer 313 is further provided on the heat dissipation layer 31 . The water cooling layer 313 is located in the heat dissipation channel 311 . The water cooling layer 313 is provided with a water inlet interface for water inlet and a drainage interface for drainage.

[0052] It should be noted that cooling water can be added to the water cooling layer 313 through the water inlet interface, and the cooling water in the water cooling layer 313 can be used to cool the embossed white pad, thereby efficiently dissipating the heat of the embossed white pad.

[0053] In the embodiment, the number of water cooling layers 313 is 2 groups, and the multiple groups of water cooling layers 313 are connected through the communication pipes 314. Each group of water cooling layers 313 comprises a water cooling bin 3131 and a connecting pipe 3132. The water cooling bin 3131 is located in the heat dissipation channel 311, and adjacent water cooling bins 3131 are connected through the connecting pipes 3132.

[0054] In the embodiment, the surface of the abrasive layer 32 is provided with transverse grooves 321 and longitudinal grooves 322, and the transverse grooves 321 and the longitudinal grooves 322 are connected. The abrasive layer 32 comprises the following raw materials in mass fraction: 20 parts of water-based epoxy resin glue, 10 parts of polyurethane rubber, 2 parts of titanium dioxide, 1 part of zinc oxide, 1 part of calcium carbonate, and 3 parts of aluminum oxide.

[0055] In order to better show the production process of the embossed white pad for polishing the crystal surface, the embodiment provides a production process of the embossed white pad for polishing the crystal surface according to the above, which comprises the following steps:

[0056] S1, producing the support layer 1:

[0057] The produced transverse support ribs 13 and longitudinal support ribs 14 are processed on the inner side of the base layer 11 according to production requirements, so that the transverse support ribs 13 and the longitudinal support ribs 14 are distributed in a transverse and longitudinal staggered manner. The face cover layer 12 is bonded on the top of the base layer 11, so that the face cover layer 12 covers the transverse support ribs 13 and the longitudinal support ribs 14, forming the support layer 1.

[0058] S2, producing the elastic layer 2:

[0059] The upper buffer layer 21 is bonded on the lower buffer layer 22 according to production requirements, so that the elastic protrusions 221 are exactly fitted into the buffer grooves, forming the elastic layer 2.

[0060] S3, producing the polishing layer 3:

[0061] The heat dissipation channels 311 and the heat dissipation through holes 312 that are connected to each other are processed on the heat dissipation layer 31, and the water cooling layers 313 are processed in the heat dissipation channels 311. The multiple groups of water cooling layers 313 are connected through the communication pipes 314. The transverse grooves 321 and the longitudinal grooves 322 are processed on the surface of the abrasive layer 32, and the abrasive layer 32 is bonded on the heat dissipation layer 31, forming the polishing layer 3.

[0062] S4, producing the embossed white pad:

[0063] The elastic layer 2 is arranged on the support layer 1, and the polishing layer 3 is arranged on the elastic layer 2. After lamination, the support layer 1, the elastic layer 2, and the polishing layer 3 are bonded to each other, forming the embossed white pad.

[0064] Embodiment two

[0065] A kind of embossed white pad for polishing the surface of crystal, including support layer 1, elastic layer 2 and polishing layer 3, polishing layer 3 is bonded on the upper surface of elastic layer 2, elastic layer 2 is bonded on the upper surface of support layer 1, wherein the thickness ratio of support layer 1, elastic layer 2 and polishing layer 3 is 1:1:2-3.

[0066] In the embodiment, support layer 1 includes base layer 11, surface cover layer 12, transverse support rib 13 and longitudinal support rib 14, the inner side of base layer 11 is provided with transverse support rib 13 and longitudinal support rib 14, transverse support rib 13 and longitudinal support rib 14 are staggered in horizontal and vertical directions, the top of base layer 11 is provided with surface cover layer 12, and surface cover layer 12 covers transverse support rib 13 and longitudinal support rib 14.

[0067] It should be noted that the support force of support layer 1 can be improved by transverse support rib 13 and longitudinal support rib 14 staggered in horizontal and vertical directions, and the support strength of the embossed white pad is further improved.

[0068] In the embodiment, elastic layer 2 includes upper buffer layer 21 and lower buffer layer 22, upper buffer layer 21 is bonded on polishing layer 3, lower buffer layer 22 is bonded on support layer 1, and upper buffer layer 21 and lower buffer layer 22 are connected.

[0069] In the embodiment, the surface of lower buffer layer 22 is provided with elastic protrusions 221, the elastic protrusions 221 are uniformly distributed at equal intervals, the upper buffer layer 21 is provided with buffer grooves matched with the elastic protrusions 221, and the upper buffer layer 21 and the lower buffer layer 22 are connected by the elastic protrusions 221 fitted into the buffer grooves.

[0070] It should be noted that the buffer performance of elastic layer 2 can be improved by providing elastic protrusions 221 on the surface of lower buffer layer 22 and buffer grooves on upper buffer layer 21, and the elastic layer 2 has high elasticity, and the elasticity of the embossed white pad is further improved.

[0071] In the embodiment, polishing layer 3 includes heat dissipation layer 31 and abrasive layer 32, heat dissipation layer 31 is bonded on upper buffer layer 21, and heat dissipation layer 31 is bonded on the lower surface of abrasive layer 32.

[0072] It should be noted that the embossed white pad can be efficiently cooled by heat dissipation layer 31, the heat dissipation performance of the embossed white pad is improved, the embossed white pad is prevented from being damaged, and the service life of the embossed white pad is improved.

[0073] In the embodiment, heat dissipation layer 31 is provided with heat dissipation channels 311 and heat dissipation through holes 312 communicating with each other, heat dissipation channels 311 transversely penetrate heat dissipation layer 31, and heat dissipation through holes 312 are uniformly distributed on the surface of heat dissipation layer 31.

[0074] It should be noted that when the embossed white pad is used to polish the surface of the crystal, the heat generated by the polishing can be dissipated to the outside through the heat dissipation through hole 312 and the heat dissipation channel 311, and the embossed white pad can be efficiently cooled.

[0075] In the embodiment, the water cooling layer 313 is further arranged on the heat dissipation layer 31, the water cooling layer 313 is located in the heat dissipation channel 311, and the water cooling layer 313 is provided with a water inlet interface for water inlet and a water outlet interface for water outlet.

[0076] It should be noted that cooling water can be added to the water cooling layer 313 through the water inlet interface, and the embossed white pad can be cooled by the cooling water in the water cooling layer 313, and the embossed white pad can be efficiently cooled.

[0077] In the embodiment, the number of water cooling layers 313 is 5 groups, and the multiple groups of water cooling layers 313 are connected in communication through the communication pipe 314, each group of water cooling layers 313 includes a water cooling bin 3131 and a connecting pipe 3132, the water cooling bin 3131 is located in the heat dissipation channel 311, and adjacent water cooling bins 3131 are connected in communication through the connecting pipe 3132.

[0078] In the embodiment, the surface of the abrasive layer 32 is provided with a horizontal groove 321 and a vertical groove 322, the horizontal groove 321 and the vertical groove 322 are connected in communication, and the abrasive layer 32 includes the following raw materials in mass fraction: 20 parts of water-based epoxy resin glue, 10 parts of polyurethane rubber, 2 parts of titanium dioxide, 1 part of zinc oxide, 1 part of calcium carbonate and 3 parts of aluminum oxide.

[0079] The embossed white pad is produced by the same production process as in Embodiment One, and the difference between Embodiment One and Embodiment Two is that the number of water cooling layers 313 is increased in Embodiment Two.

[0080] Embodiment Three

[0081] An embossed white pad for polishing the surface of a crystal includes a support layer 1, an elastic layer 2 and a polishing layer 3, the polishing layer 3 is bonded to the upper surface of the elastic layer 2, and the elastic layer 2 is bonded to the upper surface of the support layer 1, wherein the thickness ratio of the support layer 1, the elastic layer 2 and the polishing layer 3 is 1:1:2-3.

[0082] In the embodiment, the support layer 1 includes a base layer 11, a surface cover layer 12, a horizontal support rib 13 and a vertical support rib 14, the inner side of the base layer 11 is provided with the horizontal support rib 13 and the vertical support rib 14, the horizontal support rib 13 and the vertical support rib 14 are distributed in horizontal and vertical staggered manner, the top of the base layer 11 is provided with the surface cover layer 12, and the surface cover layer 12 covers the horizontal support rib 13 and the vertical support rib 14.

[0083] It should be noted that the transverse support ribs 13 and the longitudinal support ribs 14 are arranged in a transverse and longitudinal staggered manner, so that the support force of the support layer 1 is improved, and the support strength of the embossed white pad is improved.

[0084] In the embodiment, the elastic layer 2 comprises an upper buffer layer 21 and a lower buffer layer 22, the upper buffer layer 21 is bonded to the polishing layer 3, and the lower buffer layer 22 is bonded to the support layer 1, and the upper buffer layer 21 and the lower buffer layer 22 are connected.

[0085] In the embodiment, the surface of the lower buffer layer 22 is provided with elastic protrusions 221, the elastic protrusions 221 are uniformly distributed at equal intervals, the upper buffer layer 21 is provided with buffer grooves matched with the elastic protrusions 221, and the upper buffer layer 21 and the lower buffer layer 22 are connected by the elastic protrusions 221 fitted into the buffer grooves.

[0086] It should be noted that by arranging the elastic protrusions 221 on the surface of the lower buffer layer 22 and arranging the buffer grooves on the upper buffer layer 21, and fitting the elastic protrusions 221 into the buffer grooves, the buffer performance of the elastic layer 2 is improved, the elastic layer 2 has high elasticity, and the elasticity of the embossed white pad is improved.

[0087] In the embodiment, the polishing layer 3 comprises a heat dissipation layer 31 and an abrasive layer 32, the heat dissipation layer 31 is bonded to the upper buffer layer 21, and the heat dissipation layer 31 is bonded to the lower surface of the abrasive layer 32.

[0088] It should be noted that the heat dissipation layer 31 can efficiently dissipate heat from the embossed white pad, improve the heat dissipation performance of the embossed white pad, avoid damage to the embossed white pad, and improve the service life of the embossed white pad.

[0089] In the embodiment, the heat dissipation layer 31 is provided with heat dissipation channels 311 and heat dissipation through holes 312 that are in communication with each other, the heat dissipation channels 311 transversely penetrate the heat dissipation layer 31, and the heat dissipation through holes 312 are uniformly distributed on the surface of the heat dissipation layer 31.

[0090] It should be noted that when the embossed white pad is used to polish the surface of a crystal, the heat generated by polishing can be dissipated to the outside through the heat dissipation through holes 312 and the heat dissipation channels 311, so that the embossed white pad can be efficiently cooled.

[0091] In the embodiment, the surface of the abrasive layer 32 is provided with transverse grooves 321 and longitudinal grooves 322, the transverse grooves 321 and the longitudinal grooves 322 are in communication, and the abrasive layer 32 comprises the following raw materials in parts by mass: water-based epoxy resin adhesive 20 parts, polyurethane rubber 10 parts, titanium dioxide 2 parts, zinc oxide 1 part, calcium carbonate 1 part, and aluminum oxide 3 parts.

[0092] Compared with Example 1, the water cooling layer 313 structure is cancelled in Example 3, and the same production process as that of Example 1 is adopted to produce the embossed white pad, and the production step of processing the water cooling layer 313 in the heat dissipation channel 311 is cancelled accordingly.

[0093] Comparative Example

[0094] An embossed white pad for polishing a crystal surface comprises a support layer 1, an elastic layer 2 and a polishing layer 3, the polishing layer 3 is bonded to the upper surface of the elastic layer 2, and the elastic layer 2 is bonded to the upper surface of the support layer 1, wherein the thickness ratio of the support layer 1, the elastic layer 2 and the polishing layer 3 is 1:1:2-3.

[0095] In the present embodiment, the support layer 1 comprises a base layer 11, a surface cover layer 12, transverse support ribs 13 and longitudinal support ribs 14, the inner side of the base layer 11 is provided with the transverse support ribs 13 and the longitudinal support ribs 14, the transverse support ribs 13 and the longitudinal support ribs 14 are distributed in a transverse and longitudinal staggered manner, and the top of the base layer 11 is provided with the surface cover layer 12, which covers the transverse support ribs 13 and the longitudinal support ribs 14.

[0096] In the present embodiment, the elastic layer 2 comprises an upper buffer layer 21 and a lower buffer layer 22, the upper buffer layer 21 is bonded to the polishing layer 3, and the lower buffer layer 22 is bonded to the support layer 1, and the upper buffer layer 21 and the lower buffer layer 22 are connected.

[0097] In the present embodiment, the surface of the lower buffer layer 22 is provided with elastic protrusions 221, the elastic protrusions 221 are uniformly distributed at equal intervals, the upper buffer layer 21 is provided with buffer grooves matched with the elastic protrusions 221, and the upper buffer layer 21 and the lower buffer layer 22 are connected by being fitted into the buffer grooves through the elastic protrusions 221.

[0098] In the present embodiment, the polishing layer 3 comprises an abrasive layer 32.

[0099] In the present embodiment, the surface of the abrasive layer 32 is provided with transverse grooves 321 and longitudinal grooves 322, the transverse grooves 321 and the longitudinal grooves 322 are connected, and the abrasive layer 32 comprises the following raw materials in mass fraction: 20 parts of water-based epoxy resin glue, 10 parts of polyurethane rubber, 2 parts of titanium dioxide, 1 part of zinc oxide, 1 part of calcium carbonate and 3 parts of aluminum oxide.

[0100] Compared with Example 1, the heat dissipation layer 31 structure is cancelled in the comparative example, and the same production process as that of Example 1 is adopted to produce the embossed white pad, and the production step of the heat dissipation layer 31 is cancelled accordingly.

[0101] The embossed white pads produced in Examples 1-3 and the comparative example are subjected to performance tests, and the performance test results of the embossed white pads are shown in Table 1.

[0102] Table 1: Performance test results of embossed white pad

[0103] Example 1 Example 2 Example 3 Comparative Example Heat dissipation layer / yes / no Yes Yes Yes No Heat dissipation channel / yes / no Yes Yes Yes No Heat dissipation via / yes / no Yes Yes Yes No Water cooling layer / yes / no 2 groups 5 groups No No Heat dissipation performance / 100% 97.23％ 98.16％ 93.64％ 76.35％

[0104] It can be seen from the above table that the embossed white pads produced in Examples 1 to 3 all have good heat dissipation performance.

[0105] The heat dissipation performance of the second embodiment is improved compared with the first embodiment, indicating that increasing the number of water cooling layers 313 can improve the heat dissipation performance of the embossed white pad.

[0106] The heat dissipation performance of the third embodiment is reduced compared with the first embodiment. This is because the water cooling layer 313 is not added in the third embodiment, resulting in a reduction in the heat dissipation performance of the embossed white pad. This indicates that the water cooling layer 313 can improve the heat dissipation performance of the embossed white pad.

[0107] Among them, compared with Example 1, the heat dissipation performance of the comparative example is reduced. Since the heat dissipation layer 31 is not added in the comparative example, the heat dissipation performance of the embossed white pad is reduced, which shows that the heat dissipation layer 31 can improve the porosity, modulus and wear resistance of the polishing pad.

[0108] It can be seen from this that the embossed white pad produced in Example 2 has the best heat dissipation performance.

[0109] Therefore, by arranging interconnected heat dissipation channels 311 and heat dissipation holes 312 on the heat dissipation layer 31, the heat generated by the embossed white pad during the polishing process can be dissipated to the outside through the heat dissipation holes 312 and the heat dissipation channels 311. By arranging a water cooling layer 313 in the heat dissipation channel 311, multiple groups of water cooling layers 313 are connected through the connecting pipe 314, and cooling water can be added to the water cooling layer 313 through the water inlet interface. The embossed white pad can be water-cooled by the cooling water in the water cooling layer 313, and then the embossed white pad can be efficiently dissipated, thereby improving the heat dissipation performance of the embossed white pad, avoiding damage to the embossed white pad, and increasing the service life of the embossed white pad.

[0110] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0111] While embodiments of the application have been shown and described, it is to be understood that the embodiments described are merely exemplary of the principles and application of the present application. Numerous modifications and adaptions can be effected without departing from the spirit and scope of the present application, which is not limited to the exact construction and arrangement described. It is intended, therefore, to cover all modifications and adaptions that fall within the scope of the claims and their equivalents.

Claims

1. An embossed white pad for polishing a crystal surface, comprising a support layer (1), an elastic layer (2) and a polishing layer (3), characterized in that: The polishing layer (3) is bonded to the upper surface of the elastic layer (2), and the elastic layer (2) is bonded to the upper surface of the support layer (1), wherein the thickness ratio of the support layer (1), the elastic layer (2) and the polishing layer (3) is 1:1:2-3; The polishing layer (3) comprises a heat dissipation layer (31) and an abrasive layer (32), wherein the heat dissipation layer (31) is bonded to the upper buffer layer (21), and the heat dissipation layer (31) is bonded to the lower surface of the abrasive layer (32), and the heat dissipation layer (31) is provided with heat dissipation channels (311) and heat dissipation holes (312) that are interconnected, wherein the heat dissipation channels (311) penetrate the heat dissipation layer (31) transversely, and the heat dissipation holes (312) are evenly distributed on the surface of the heat dissipation layer (31), and the heat dissipation layer (313) is further provided on the heat dissipation layer (311), wherein the water cooling layer (313) is located in the heat dissipation channels (311), and the water cooling layer (313) is provided with a water inlet interface for water inlet and a water outlet interface for water outlet; The number of the water-cooling layers (313) is 2-5 groups, and the multiple groups of water-cooling layers (313) are connected through connecting pipes (314). Each group of water-cooling layers (313) includes a water-cooling bin (3131) and a connecting pipe (3132). The water-cooling bin (3131) is located in the heat dissipation channel (311), and adjacent water-cooling bins (3131) are connected through the connecting pipe (3132).

2. The embossed white pad for crystal surface polishing according to claim 1, characterized in that: The support layer (1) comprises a base layer (11), a surface cover layer (12), transverse support ribs (13) and longitudinal support ribs (14); the inner side of the base layer (11) is provided with transverse support ribs (13) and longitudinal support ribs (14); the transverse support ribs (13) and longitudinal support ribs (14) are distributed in a staggered manner in the transverse and longitudinal directions; the top of the base layer (11) is provided with a surface cover layer (12); the surface cover layer (12) covers the transverse support ribs (13) and longitudinal support ribs (14).

3. The embossed white pad for crystal surface polishing according to claim 2, characterized in that: The elastic layer (2) comprises an upper buffer layer (21) and a lower buffer layer (22), wherein the upper buffer layer (21) is bonded to the polishing layer (3), and the lower buffer layer (22) is bonded to the support layer (1), and the upper buffer layer (21) and the lower buffer layer (22) are connected.

4. The embossed white pad for crystal surface polishing according to claim 3, characterized in that: The surface of the lower buffer layer (22) is provided with elastic protrusions (221), and the elastic protrusions (221) are evenly distributed at equal intervals. The upper buffer layer (21) is provided with buffer grooves matching the elastic protrusions (221), and the upper buffer layer (21) and the lower buffer layer (22) are connected by the elastic protrusions (221) being inserted into the buffer grooves.

5. The embossed white pad for crystal surface polishing according to claim 4, characterized in that: The surface of the abrasive layer (32) is provided with a transverse groove (321) and a longitudinal groove (322), and the transverse groove (321) and the longitudinal groove (322) are connected. The abrasive layer (32) comprises the following raw materials in parts by mass: 20-40 parts of water-based epoxy resin glue, 10-20 parts of polyurethane rubber, 2-3 parts of titanium dioxide, 1-2 parts of zinc oxide, 1-2 parts of calcium carbonate, and 3-5 parts of aluminum oxide.

6. A production process for an embossed white pad for crystal surface polishing, for producing the embossed white pad for crystal surface polishing according to claim 5, characterized in that: The steps include: S1, production support layer (1): Processing the produced transverse supporting ribs (13) and longitudinal supporting ribs (14) on the inner side of the base layer (11) according to production requirements, so that the transverse supporting ribs (13) and longitudinal supporting ribs (14) are distributed in a staggered manner in the horizontal and vertical directions, and bonding the surface cover layer (12) to the top of the base layer (11) so that the surface cover layer (12) covers the transverse supporting ribs (13) and longitudinal supporting ribs (14), thereby forming a support layer (1); S2. Production of elastic layer (2): Adhere the upper buffer layer (21) to the lower buffer layer (22) according to production requirements, so that the elastic protrusion (221) fits exactly into the buffer groove to form an elastic layer (2); S3, production of polishing layer (3): Interconnected heat dissipation channels (311) and heat dissipation holes (312) are machined on the heat dissipation layer (31), and a water cooling layer (313) is machined in the heat dissipation channel (311), so that multiple groups of the water cooling layers (313) are connected through a connecting pipe (314), and transverse grooves (321) and longitudinal grooves (322) are machined on the surface of the abrasive layer (32), so that the abrasive layer (32) is bonded to the heat dissipation layer (31), thereby forming a polishing layer (3); S4. Production of embossed white pad: The elastic layer (2) is arranged on the supporting layer (1), and the polishing layer (3) is arranged on the elastic layer (2). After lamination, the supporting layer (1), the elastic layer (2) and the polishing layer (3) are bonded to each other to form an embossed white pad.

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