Base

Abstract

The present invention discloses a base that can work durably even at low or ultra-low temperatures. The present invention provides a base, characterized in that it comprises: a base member, a ceramic plate, which is arranged on the base member and has an electrode, and an electrode connector assembly, which penetrates the base member to apply power to the electrode of the ceramic plate; the electrode connector assembly comprises: a first connector terminal as a contact end with the electrode, a second connector terminal as a power supply introduction end, and a connecting rod, which connects the first connector terminal and the second connector terminal.

Description

Technical Field

[0001] The present invention relates to a susceptor, and more particularly to a susceptor capable of operating durably even at a temperature of about -100°C or below. Background Art

[0002] Semiconductor devices or display devices are manufactured by stacking and patterning multiple thin film layers including dielectric layers and metal layers on glass substrates, flexible substrates or semiconductor wafer substrates through semiconductor processes such as chemical vapor deposition (CVD) process, physical vapor deposition (PVD) process, ion implantation process, and etching process. The chamber device used to perform these semiconductor processes is provided with a susceptor such as an electrostatic chuck (ESC), which is used to support various substrates such as glass substrates, flexible substrates and semiconductor wafer substrates, especially by using electrostatic force to fix the corresponding substrates.

[0003] Such a susceptor is generally used to support a substrate at normal or high temperature. However, recently, there is an increasing need to perform a film forming process or an etching process while cooling the substrate at an ultra-low temperature of -50°C or below or -100°C or below.

[0004] In particular, in order to manufacture ultra-fine semiconductors, the semiconductor stacking height increases, the circuit line width decreases, and the difficulty of the etching process required to manufacture semiconductor devices with a line width of less than 10nm or three-dimensional NAND flash memory increases, so process problems such as microbridges (defects caused by the thinning of the line width resulting in the connection of parts that should not be etched) and polymer bottleneck phenomena (the phenomenon that the circuit entrance becomes narrower due to polymers) frequently occur. In order to solve these process problems, ultra-low temperature etching processes are being developed to reduce the temperature inside the chamber to -100°C to minimize the gas flow required for etching without polymers, thereby improving the selectivity and achieving uniform etching even when the etching depth increases.

[0005] However, conventional susceptors do not take such ultra-low temperature use into consideration, and it is necessary to design a susceptor suitable for use at ultra-low temperatures. Summary of the invention

[0006] Technical issues to be solved

[0007] In order to solve the problems of the prior art, an object of the present invention is to provide a structure of an electrode connector assembly suitable for a low-temperature or ultra-low-temperature base.

[0008] In addition, the present invention is characterized by designing the materials of the components of the electrode connector assembly of the low-temperature or ultra-low-temperature base.

[0009] Another object of the present invention is to provide a base electrode connector assembly that can suppress material degradation or brittle failure due to deformation, shrinkage stress, etc. even when driven in a low temperature or ultra-low temperature environment, thereby enabling stable driving.

[0010] In addition, the present invention is characterized in that it provides an electrode connector assembly structure of a base, which can work stably in a low temperature or ultra-low temperature environment without thermal deformation or condensation.

[0011] Another object of the present invention is to provide a base including the electrode connector assembly.

[0012] Means used to solve problems

[0013] The present invention for solving the technical problem provides a base, characterized in that it includes: a base member, a ceramic plate, which is arranged on the base member and has an electrode, and an electrode connector assembly, which penetrates the base member to apply power to the electrode of the ceramic plate; the electrode connector assembly includes: a first connector terminal as a contact end with the electrode, a second connector terminal as a power introduction end, and a connecting rod connecting the first connector terminal and the second connector terminal.

[0014] In the present invention, a protrusion may be provided on the surface of the first connector terminal opposite to the electrode. In this case, the protrusion of the first connector terminal may have an engraved pattern. In addition, the engraved pattern may be a cross pattern, a straight pattern or a checkered pattern.

[0015] In addition, the present invention further includes a conductive elastic polymer filled between the first connector terminal and the electrode, and the first connector terminal and the electrode can be electrically connected through the conductive elastic polymer. In this case, preferably, conductive powder is dispersed in the conductive elastic polymer. In this case, it can be metal powder or carbon powder.

[0016] In the present invention, the electrode connector assembly may include an insulating tube surrounding the first connector terminal, the connecting rod and the second connector terminal. In addition, an insulating elastic polymer may be filled between the first connector terminal and the second connector terminal.

[0017] In the present invention, the connecting rod may be made of flexible metal.

[0018] Alternatively, the connecting rod may be made by twisting or braiding a plurality of metal wires.

[0019] In addition, the present invention provides a base, characterized in that it includes: a base member, a ceramic plate, which is arranged on the base member and has an electrode, and an electrode connector assembly, which penetrates the base member to apply power to the electrode of the ceramic plate; the electrode connector assembly includes a first connector terminal as a contact end with the electrode and a conductive elastic polymer between the electrode, and the electrode connector assembly is electrically connected to the electrode through the conductive elastic polymer.

[0020] In the present invention, the conductive elastic polymer may be made by dispersing conductive powder in at least one polymer selected from the group consisting of silicone rubber, a copolymer of butadiene, styrene and acrylonitrile, butyl rubber and fluororubber.

[0021] In addition, in the present invention, the first connector terminal may be made of titanium or a titanium alloy.

[0022] Effects of the Invention

[0023] According to the present invention, a base electrode connector assembly and a base including the same can be provided, which can suppress material degradation or brittle failure caused by deformation, shrinkage stress, etc. even when driven in a low temperature or ultra-low temperature environment below -50°C, thereby enabling stable driving.

[0024] In addition, according to the present invention, it is possible to provide an electrode connector assembly of a base and a base including the same, which can stably operate in a low temperature or ultra-low temperature environment without thermal deformation or condensation. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a diagram for explaining the structure of a base according to an embodiment of the present invention.

[0026] Figure 2 It is a cross-sectional view of a base including an electrode connector assembly according to an embodiment of the present invention.

[0027] Figure 3 (a) and (b) are respectively a cross-sectional view and a front view of a front connector terminal according to an embodiment of the present invention. DETAILED DESCRIPTION

[0028] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. At this time, the same components in each drawing are represented by the same figure marks as much as possible. In addition, the description of known functions and / or structures will be omitted. The content disclosed below will mainly describe the parts required for understanding the operation of various embodiments, and omit the description of elements that may obscure the main purpose of the description. In addition, some of the components in the drawings may be enlarged, omitted or schematically shown. The size of each component cannot fully reflect the actual size, and therefore, the content recorded here is not limited by the relative size or spacing of the components shown in each drawing.

[0029] When describing the embodiments of the present invention, if it is judged that the specific description of the known technology related to the present invention unnecessarily obscures the main idea of ​​the present invention, its detailed description will be omitted. In addition, the terms described below are defined in consideration of the functions of the present invention and may vary according to the intention of the user or operator or precedent. Therefore, their definitions should be based on the content of the entire specification. The terms used in this specification are used only to illustrate the embodiments of the present invention and are not intended to be limiting.

[0030] Unless otherwise specified, singular expressions shall include plural expressions. Expressions such as "including" or "having" in this specification are used to refer to any feature, number, step, action, component or combination thereof, and should not be understood as excluding the existence or additional possibility of more than one other feature, number, step, action, component or combination thereof.

[0031] In addition, although the terms "first" and "second" may be used to describe various components, the components are not limited to the terms, and the terms are only used to distinguish one component from another.

[0032] Figure 1 It is a diagram for explaining the structure of a base 100 according to an embodiment of the present invention.

[0033] Reference Figure 1 According to an embodiment of the present invention, the base 100 includes a base member 110 and a ceramic plate 120. The base 100 is preferably circular, but in some cases, it can also be designed as other shapes such as an ellipse, a quadrilateral, etc.

[0034] The base member 110 may be formed as a multi-layer structure consisting of a plurality of metal layers. These metal layers may be joined by a brazing process, a welding process, a bonding process, or the like. The ceramic plate 120 is fixed to the base member 110, for which a predetermined fixing unit or a bonding unit may be used. The base member 110 and the ceramic plate 120 may be manufactured and joined separately, but depending on circumstances, the structure of the ceramic plate 120 may also be directly formed on the upper surface of the base member 110.

[0035] In the present invention, in the base 100, in order to uniformly cool the substrate (for example, a glass substrate, a flexible substrate, a semiconductor wafer, etc.) on the ceramic plate 120, the base member 110 and the ceramic plate 120 may have a cooling structure (not shown) such as a cooling gas hole and / or a cooling gas flow path.

[0036] In the present invention, the ceramic plate 120 has at least one electrode 124. As an example, the electrode 124 can be any one of a clamping electrode and a radio frequency (RF) electrode. The electrode 124 as a clamping electrode can be a single electrode in a monopolar manner or a plurality of electrodes driven in a bipolar manner. In addition, in the present invention, the electrode 124 as an RF electrode can be composed of a single electrode or a plurality of electrodes.

[0037] In addition, in the present invention, the ceramic plate 120 may include both the clamping electrode and the RF electrode. When the susceptor is provided with a plurality of electrodes, the electrodes may exist on the same plane or on different planes within the ceramic plate.

[0038] As shown in the figure, the electrode 124 can be embedded in the ceramic board 120 or exposed on the surface. When the electrode is embedded in the board, the ceramic board 120 can be formed by a stacked structure of an insulating layer 126, an electrode 124, and a dielectric layer 122. Of course, the above three-layer stacked structure is exemplary, and of course, the ceramic board 120 can have a stacked structure of more than three layers.

[0039] In the present invention, the insulating layer 126 insulates the base member 110 from the electrode 124. The insulating layer 126 can be made of a ceramic material. As an example, the insulating layer 126 can be at least one material or a composite material of aluminum oxide (Al2O3), aluminum nitride (AlN), silicon carbide (SiC) and silicon nitride (Si3N4). In addition, the insulating layer 126 can also be formed on the upper surface of the base member 110 by thermal spraying.

[0040] The electrode 124 may be made of a conductive metal material. As an example, the electrode 124 may be formed of tungsten (W), molybdenum (Mo) or an alloy thereof. The electrode 124 may be formed by using a thermal spraying process or a screen printing process.

[0041] In the present invention, the dielectric layer 122 can be made of a ceramic material. As an embodiment, the dielectric layer 122 can be formed of the same material as the insulating layer 126, or of a different material. For example, the dielectric layer 122 can be any one material or a composite material of two or more selected from the group consisting of aluminum oxide (A12O3), silicon dioxide (SiO2), barium oxide (BaO), zinc oxide (ZnO), cobalt oxide (CoO), tin oxide (SnO2) and zirconium oxide (ZrO2). In the present invention, the dielectric layer 122 can also be formed by performing a thermal spraying process on the upper surface of the insulating layer 126 and the electrode 124.

[0042] An electrode connector assembly 130 is mounted on the electrode 124 in the board. The electrode connector assembly 130 is connected to an external power supply unit (not shown) and penetrates the base member 110 to apply power to the electrode 124 of the ceramic board 120.

[0043] Hereinafter, an example of the electrode connector assembly 130 of the present invention will be described.

[0044] Figure 2 An exemplary electrical connection mechanism for the electrode connector assembly 130 is shown.

[0045] Reference Figure 2 The electrode connector assembly 130 penetrates the base member 110 and is electrically connected to the electrode 124 of the ceramic board 120 .

[0046] As shown in the figure, at the installation position of the electrode connector assembly 130, a portion of the insulating layer 126 is removed to expose the electrode 124. It is shown that an electrode pad 124A is provided on the electrode 124 to assist in electrical connection with the connector assembly, but the present invention is not limited thereto.

[0047] The exposed portion of the plate exposed in the well shape is filled with an elastic bonding material 138A. In the electrode connector assembly 130, the front connector terminal 132A, which is a contact end with the electrode, is electrically connected to the electrode pad 124A through the elastic bonding material 138A.

[0048] Preferably, in the present invention, the elastic bonding material 138A includes a conductive elastic polymer (elastic body).

[0049] In the present invention, as the elastic polymer, at least one polymer selected from the group consisting of silicone rubber, copolymers of butadiene, styrene and acrylonitrile, butyl rubber and fluororubber can be used. For example, silicone rubber containing phenyl in the side chain is suitable for ultra-low temperature.

[0050] In the present invention, the conductive elastic polymer can be made by dispersing conductive powder on an elastic polymer matrix. As the conductive powder, metal powder or carbon powder can be used. As an example, the conductive elastic polymer can be silicone rubber dispersed with carbon powder. In the present invention, the conductive elastic polymer preferably has high conductivity at room temperature and low temperature. As an example, preferably, the conductivity of the conductive elastic polymer at room temperature is in the range of 30 to 100 S / m.

[0051] The elastic polymer described above can flexibly elastically deform in response to changes in pressure applied between the front connector terminal 132A and the electrode pad 124A, thereby providing a stable electrical connection even in the presence of temperature changes.

[0052] On the other hand, the electrode connector assembly 130 may include a rear connector terminal 132B as a power supply introduction terminal, and the front connector terminal and the rear connector terminal are electrically connected via a connecting rod 134. As shown in the figure, the connection between the connector terminal and the connecting rod can be connected by pressing the connecting rod into a coupling groove formed in the connector terminal.

[0053] In the present invention, the connecting rod may preferably use at least one metal selected from the group consisting of Cu, Ag, Au, Al and Be. In addition, in the figure, the connecting rod 134 is shown in a straight line shape, but the present invention is not limited thereto, and the connecting rod 134 may be bent or wound. In addition, the connecting rod 134 may be in the form of a twisted or braided multi-strand metal wire. The connecting rod of this structure has flexibility, so that the disconnection of the rod can be suppressed.

[0054] The terminal-flexible rod-terminal structure of the electrode connector assembly 130 as described above can buffer the deformation difference caused by the difference in thermal expansion rate between the various materials of the board and the connector.

[0055] In another aspect of the present invention, the electrode connector assembly 130 may be filled with an insulating elastic polymer 138B between the front connector terminal and the rear connector terminal. The filled elastic polymer may prevent condensation inside the connector at low or ultra-low temperatures and relieve thermal shrinkage stress.

[0056] As the insulating elastic polymer, at least one selected from the group consisting of silicone rubber, copolymers of butadiene, styrene and acrylonitrile, butyl rubber and fluororubber can be used. Preferably, the elastic polymer preferably has a high elongation of 200% or more. As the elastic polymer, silicone rubber can be used.

[0057] In the present invention, as the connector terminal, a metal selected from the group consisting of Ti, Ni, Co, W and Mo or an alloy thereof can be used. Preferably, as the connector terminal, a metal having a thermal expansion coefficient similar to that of the material of the plate is preferably used. For example, when the plate is an alumina material (the thermal expansion coefficient at room temperature is 6.5 ppm / °C), Ti (the thermal expansion coefficient at room temperature is 8.5 to 9.0 ppm / °C) is preferably used.

[0058] On the other hand, in the present invention, the electrode connector assembly 130 is provided with an insulating tube 136 extending in the length direction of the connector to electrically insulate the connector terminal and the connecting rod from the base member 110. In the present invention, the insulating tube 136 is made of a material selected from the group consisting of ceramics, glass, engineering plastics and silicon dioxide. The insulating tube is most preferably a ceramic that maintains its shape at low temperatures without thermal deformation.

[0059] In the present invention, the contact end of the front connector terminal 132A that contacts the electrode pad 124A may be provided with projections and depressions. Figure 2 It is shown that one protrusion is formed at the contact end, but in the present invention, the protrusion may be implemented by a plurality of protrusions.

[0060] In the present invention, the protruding structure of the front connector can be implemented in various ways. Figure 3 , an example of the front connector terminal according to the present invention is described.

[0061] Figure 3 (a) and (b) are respectively a cross-sectional view and a front view of a front connector terminal according to an embodiment of the present invention.

[0062] Reference Figure 3 , the contact end 10 of the front connector terminal 132A is provided with a protrusion 12. As shown in the figure, the protrusion 12 is formed in the central part of the contact end 10, and a relatively low step structure is formed in the surrounding part.

[0063] In addition, the other end of the connector terminal is provided with a connection portion 20 connected to the connecting rod. As the connection structure of the connection portion 20, a caulking type connection structure can be used.

[0064] On the other hand, in the present invention, the protrusion 12 has an engraved pattern 14. In the figure, a cross-shaped engraved pattern is shown, but of course, there can be various forms of engraved patterns such as a straight pattern and a checkered pattern.

[0065] In the present invention, since an elastic polymer is used as a bonding material, there is no chemical reaction between the elastic polymer and the connector terminal as a metal member, and thus the bonding force is relatively weak. The protrusion and / or the engraved pattern are mechanically bonded to the elastic polymer, thereby supplementing the bonding strength. At the same time, the protrusion and the engraved pattern formed on the connector terminal can play a role in reducing the contact resistance by increasing the contact area with the elastic polymer.

[0066] In the present invention, the step formed at the contact end of the connector terminal is preferably in the range of 0.1 to 0.3 mm. In addition, the depth of the engraved pattern in the protruding portion is preferably in the range of 0.1 to 0.3 mm. This is an appropriate range for uniformly coating the conductive elastic polymer without bubbles when filling the pattern portion while increasing the contact area with the elastic polymer.

[0067] As described above, in the present invention, specific matters such as specific constituent elements and limited embodiments and drawings have been described, but this is only provided to help understand the present invention as a whole, and the present invention is not limited to the embodiments, and ordinary technicians in the field to which the present invention belongs can make various modifications and changes within the scope of the essential features of the present invention. Therefore, the spirit of the present invention should not be limited to the described embodiments and determined, and all technical ideas that are equivalent to or equivalent to the claims, except for the attached claims, should be interpreted as included in the scope of the present invention.

[0068] Industrial Applicability

[0069] The present invention may be applied to a pedestal for supporting a wafer, such as an electrostatic chuck.

Claims

1. A base, characterized in that: include: Base member, a ceramic plate disposed on the base member and having electrodes, and an electrode connector assembly extending through the base member to apply power to the electrodes of the ceramic plate; The electrode connector assembly comprises: A first connector terminal as a contact end with the electrode, A second connector terminal as a power supply input terminal, and a connecting rod connecting the first connector terminal and the second connector terminal; A protrusion is provided on a surface of the first connector terminal opposite to the electrode, wherein the protrusion includes an engraved pattern. The base further includes a conductive elastic polymer filled between the first connector terminal and the electrode, The first connector terminal and the electrode are electrically connected through the conductive elastic polymer.

2. The base according to claim 1, characterized in that: The engraved patterns include cross patterns, straight patterns or checkered patterns.

3. The base according to claim 1, characterized in that: Conductive powder is dispersed in the conductive elastic polymer.

4. The base according to claim 3, characterized in that: The conductive powder includes metal powder or carbon powder.

5. The base according to claim 1, characterized in that: The electrode connector assembly includes an insulating tube surrounding the first connector terminal, the connecting rod, and the second connector terminal.

6. The base according to claim 1 or 5, characterized in that: An insulating elastic polymer is filled between the first connector terminal and the second connector terminal.

7. The base according to claim 1, characterized in that The connecting rod comprises a flexible metal.

8. The base according to claim 7, characterized in that The connecting rod is made by twisting or braiding a plurality of metal wires.

9. The base according to claim 1, characterized in that: The electrode further comprises an electrode pad, The electrode connector assembly is electrically connected to the electrode pad of the electrode.

10. The base according to claim 1, characterized in that The conductive elastic polymer is made by dispersing conductive powder in at least one polymer selected from the group consisting of silicone rubber, a copolymer of butadiene, styrene and acrylonitrile, butyl rubber and fluororubber.

11. The base according to claim 1, characterized in that The first connector terminal is titanium or a titanium alloy.

12. The base according to claim 1, characterized in that The electrode is a clamping electrode or a radio frequency electrode.

13. The base according to claim 1, characterized in that The connecting rod is made by twisting or braiding a plurality of metal wires.

14. The base according to claim 1, characterized in that The electrode further comprises an electrode pad, The electrode connector assembly is electrically connected to the electrode pad of the electrode.

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