Solid adhesive film for MINI LED display module packaging and preparation method and application thereof
By thermally combining the first adhesive film with the second adhesive film in the MINI LED display module packaging, and packaging is completed by vacuum heat pressing, the problems of complicated processes, large energy consumption and low efficiency in the prior art are solved, and a more efficient packaging process and better optical effects are achieved.
Patent Information
- Application Number
- CN202410580796.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-11
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2044-05-11
AI Technical Summary
The solid-state adhesive film used for packaging existing MINI LED display modules has complicated processes, high energy consumption and low efficiency.
A solid adhesive film is prepared by thermal composite of the first adhesive film and the second adhesive film. The first adhesive film includes a first release film, a hardened coating and a black coating. The second adhesive film includes a second release film and a diffusion coating. The packaging is completed by vacuum heat pressing.
The packaging process is shortened, processing energy consumption is reduced, production efficiency is improved, and surface hardness, color effect and uniformity are improved through hardening coatings, black coatings and diffusion coatings.
Smart Images

Figure CN118344824B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of LED packaging, and in particular to a solid adhesive film for packaging a MINI LED display module, and a preparation method and application thereof. Background Art
[0002] The light-emitting mechanism of semiconductor materials determines that a single LED chip cannot emit white light of a continuous spectrum. Therefore, the process must mix two or more complementary colors of light to form white light. Currently, there are three main methods to realize white light LED: blue light LED + YAG yellow phosphor, RGB three-color LED, ultraviolet LED + multi-color phosphor, and the realization of white light LED is in the packaging stage.
[0003] The existing solid adhesive film used for packaging MINI LED display modules is packaged in the form of a base film and a surface film. The coating process is complicated, multiple layers of adhesive are compounded multiple times and then hot-pressed twice, pre-baked and then finally baked. The baking temperature is high and the comprehensive baking time is as long as 6-8 hours. The process is long, the energy consumption is high, and the efficiency is low. Summary of the invention
[0004] The main purpose of the present invention is to provide a solid adhesive film for MINI LED display module packaging and a preparation method and application thereof, aiming to solve the problem of how to reduce the process and energy consumption of LED packaging.
[0005] To achieve the above object, the present invention provides a solid adhesive film for packaging a MINI LED display module, comprising:
[0006] A first adhesive film includes a first release film, a hardening coating and a black coating; and
[0007] A second adhesive film, comprising a second release film and a diffusion coating;
[0008] Wherein, the first adhesive film and the second adhesive film are thermally compounded to obtain the solid adhesive film;
[0009] The first release film and the second release film are respectively located on two sides of the solid adhesive film;
[0010] The diffusion coating is used to improve the uniformity of the MINI LED display module, the hardening coating is used to improve the surface hardness and present a matte effect, and the black coating is used to present a color effect.
[0011] In one embodiment, the temperature of the thermal bonding is 80-150° C., so that the diffusion coating is in an uncured state and bonded to form a whole.
[0012] In one embodiment, the thickness of the first release film is 60-160 μm; and / or,
[0013] The thickness of the second release film is 50-100 μm; and / or,
[0014] The thickness of the hardened coating is 5 to 25 μm; and / or,
[0015] The thickness of the black coating is 10 to 100 μm; and / or,
[0016] The diffusion coating has a thickness of 30 to 180 μm; and / or,
[0017] The first release film and the second release film are PET release films.
[0018] The present invention also provides a method for preparing the solid adhesive film as described above, comprising the following steps:
[0019] Applying hardened glue on one side of the first release film to form a hardened coating after UV curing, applying black glue on the hardened coating to form a black coating after baking and curing, thereby obtaining a first adhesive film;
[0020] Applying diffusion glue on one side of the second release film to form a diffusion coating to obtain a second adhesive film;
[0021] The black coating surface of the first adhesive film and the diffusion coating surface of the second adhesive film are laminated at high temperature to obtain a solid adhesive film.
[0022] In one embodiment, the hardened glue is a light-curing glue;
[0023] In the step of forming a hardened coating after curing, ultraviolet light is used to irradiate the hardened glue to complete the curing.
[0024] In one embodiment, the curing temperature of the black glue is 60-160°C.
[0025] In one embodiment, the curing temperature of the diffusion glue is 120-160°C.
[0026] The present invention further provides an application of a solid adhesive film in packaging a MINI LED display module, wherein the solid adhesive film includes the solid adhesive film as described above, or a solid adhesive film prepared by the preparation method as described above.
[0027] In one embodiment, the application includes the following steps: after tearing off the second release film of the solid adhesive film, vacuum hot pressing is performed on the substrate of the MINI LED display module, and cross-linking is cured at 120 to 160° C. for 60 to 120 minutes to complete the packaging of the MINI LED display module.
[0028] The technical solution of the present invention forms a solid film by compounding the first film and the second film. The finished solid film can be packaged on the substrate only by one vacuum hot pressing, which shortens the packaging process, reduces processing energy consumption, and improves production efficiency. In one embodiment of the present invention, the hardening coating is used to fix the shape of the solid film to facilitate the fitting of the MINILED display module; the black coating is used to change the base color of the solid film, which can improve the integrity and blackness of the LED display module, so as to form a better contrast with the luminous color area; the diffusion coating can convert a point light source into a surface light source, so that the light forms diffuse reflection to achieve a uniform light effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0030] Figure 1 A structural schematic diagram of an embodiment of a solid adhesive film for packaging a MINI LED display module provided by the present invention;
[0031] Figure 2 This is a physical picture of the MINI LED display module encapsulated by the solid adhesive film provided in Example 1 and Comparative Example 1 of the present invention.
[0032] Description of Figure Numbers:
[0033] 100. Solid adhesive film for MINI LED display module packaging; 1. First adhesive film; 11. First release film; 12. Hardening coating; 13. Black coating; 2. Second adhesive film; 21. Second release film; 22. Diffusion coating.
[0034] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings in conjunction with the embodiments. DETAILED DESCRIPTION
[0035] To make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them.
[0036] It should be noted that, in the embodiments, those without specifying specific conditions are carried out according to normal conditions or conditions recommended by the manufacturer. Those without specifying the manufacturer of reagents or instruments used are conventional products that can be purchased commercially. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes, and "A and / or B" is taken as an example, including schemes A, B, or A and B that meet the same time. In addition, the technical schemes between the various embodiments can be combined with each other, but must be based on the ability of ordinary technicians in the field to achieve. When the combination of the technical schemes is contradictory or cannot be achieved, it should be considered that the combination of such technical schemes does not exist, and is not within the scope of protection required by the present invention. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in the field without making creative work, all belong to the scope of protection of the present invention.
[0037] At present, the existing solid adhesive film used for packaging MINI LED display modules is packaged in the form of a base film and a surface film. The coating process is complicated, multiple layers of adhesive are compounded multiple times and then hot pressed twice, pre-baked and then finally baked. The baking temperature is high and the comprehensive baking time is as long as 6-8 hours. The process is long, the energy consumption is high, and the efficiency is low.
[0038] In view of this, if Figure 1 As shown, the present invention proposes a solid adhesive film for MINI LED display module packaging, including a first adhesive film and a second adhesive film; wherein the first adhesive film includes a first release film, a hardening coating and a black coating; the second adhesive film includes a second release film and a diffusion coating; the first adhesive film and the second adhesive film are thermally composited to obtain the solid adhesive film; the first release film and the second release film are respectively located on both sides of the solid adhesive film; the diffusion coating is used to improve the uniformity of the MINI LED display module, the hardening coating is used to improve the surface hardness and show a matte effect, and the black coating is used to present a color effect.
[0039] It should be noted that, in the technical solution of the present invention, the first release film and the second release film can be a PET film or an EVA film. The specific material is not limited here, as long as it can isolate and protect the coating in the solid adhesive film; the thermal composite step refers to composite multiple layers of adhesive film coatings together to form an integral adhesive film, which is different from hot pressing. The hot pressing step refers to bonding the adhesive film to the substrate by hot pressing to complete the packaging of the substrate.
[0040] The technical solution of the present invention forms a solid adhesive film by thermally compounding the first adhesive film and the second adhesive film. The finished solid adhesive film can be packaged on the substrate only by vacuum hot pressing once, which shortens the packaging process, reduces processing energy consumption, and improves production efficiency. In one embodiment of the present invention, the hardening coating is used to fix the shape of the solid adhesive film so as to facilitate the fitting of the MINI LED display module; the black coating is used to change the base color of the solid adhesive film, which can improve the integrity and blackness of the LED display module so as to form a better contrast with the luminous color area; the diffusion coating can convert a point light source into a surface light source, so that the light forms diffuse reflection to achieve a uniform light effect.
[0041] In one embodiment, the temperature of the thermal compounding is 80-150°C, so that the diffusion coating is in an uncured state and bonded to form a whole. The technical solution of the present invention can compound the first adhesive film and the second adhesive film into one film by using a thermal compounding method at 80-150°C.
[0042] In one embodiment, the thickness of the first release film is 60 to 160 μm; and / or, the thickness of the second release film is 50 to 100 μm; and / or, the thickness of the hardened coating is 5 to 25 μm; and / or, the thickness of the black coating is 10 to 100 μm; and / or, the thickness of the diffusion coating is 30 to 180 μm; and / or, the first release film and the second release film are PET release films.
[0043] In the technical solution of the present invention, by adopting a PET release film, the antistatic ability and sealing effect of the solid adhesive film are improved, thereby improving the stability of the MINI LED display module; by limiting the thickness of each coating and each release film in the solid adhesive film, the thickness, haze, transmittance and Lab value and other parameters are changed, thereby improving the application range of the solid adhesive film.
[0044] The present invention also provides a method for preparing the solid adhesive film as described above, comprising the following steps:
[0045] Applying hardened glue on one side of the first release film to form a hardened coating after UV curing, applying black glue on the hardened coating to form a black coating after baking and curing, thereby obtaining a first adhesive film;
[0046] Applying diffusion glue on one side of the second release film to form a diffusion coating to obtain a second adhesive film;
[0047] The black coating surface of the first adhesive film and the diffusion coating surface of the second adhesive film are laminated at high temperature to obtain a solid adhesive film.
[0048] The technical solution of the present invention adopts hardened glue, black glue and diffusion glue, wherein the hardened glue and the black glue form a hardened coating and a black coating respectively after curing, and the diffusion coating forms a diffusion coating without being cured. Therefore, when the solid adhesive film is applied to the MINI LED display module, the uncured diffusion coating can be attached to the MINI LED display module, thereby improving the adhesion to the display module.
[0049] In one embodiment, the hardened glue is a light-curing glue;
[0050] In the step of forming a hardened coating after curing, ultraviolet light is used to irradiate the hardened glue to complete the curing.
[0051] The technical solution of the present invention adopts light-curing glue as hardening glue, and after coating the hardening glue on the first release film, light-curing is performed to form a cured coating, which can quickly fix the shape of the cured coating. By coating the cured coating with black glue and then curing it to form a black coating, the phenomenon of deformation, cracking or displacement of the non-black coating can be reduced, thereby improving the integrity and blackness of the LED display module, so that the image displayed by the LED display module has a high contrast.
[0052] In one embodiment, the curing temperature of the black glue is 60-160°C.
[0053] The technical solution of the present invention can complete the curing at a temperature lower than 100° C. by using black glue with a curing temperature of 60 to 160° C. The curing conditions are mild, easy to operate, and can simplify the processing technology while shortening the process.
[0054] In one embodiment, the curing temperature of the diffusion glue is 120-160°C.
[0055] The technical solution of the present invention adopts diffusion glue with a curing temperature of 120-160°C, which needs to be cured at a temperature higher than 100°C, thereby reducing the degree of curing during thermal compounding and maintaining the fluidity of the diffusion coating to facilitate bonding with the LED display module.
[0056] The present invention further provides an application of a solid adhesive film in packaging a MINI LED display module, wherein the solid adhesive film includes the solid adhesive film as described above, or a solid adhesive film prepared by the preparation method as described above.
[0057] In one embodiment, the application includes the following steps: after tearing off the second release film of the solid adhesive film, vacuum hot pressing is performed on the substrate of the MINI LED display module, and cross-linking is cured at 120 to 160° C. for 60 to 120 minutes to complete the packaging of the MINI LED display module.
[0058] The technical solution of the present invention adopts a cured hardening coating and a cured black coating to reduce the deformation, cracking or displacement of the black coating, and adopts an uncured diffusion coating to facilitate bonding with the substrate of the MINI LED display module, and cures and cross-links at 120 to 160° C. for 60 to 120 minutes to complete the packaging of the solid adhesive film and the MINI LED display module.
[0059] The technical solution of the present invention is further described in detail below in conjunction with specific embodiments. It should be understood that the following embodiments are only used to explain the present invention, and are not used to limit the present invention.
[0060] Example 1
[0061] This embodiment provides a solid adhesive film for packaging a MINI LED display module, and its structural schematic diagram is shown in FIG. Figure 1 shown.
[0062] This embodiment also provides a method for preparing the solid adhesive film for packaging the MINI LED display module, comprising the following steps:
[0063] (1) coating a UV curing liquid on the PET release film, and forming a 10 μm hardened coating layer after UV curing, and then coating a liquid black glue on the hardened coating layer, and forming a 50 μm thick black coating layer after drying and curing, thereby forming a first adhesive film;
[0064] (2) coating another PET release film with a misty white glue having an optical diffusion function, and drying the film to form a diffusion coating with a thickness of 60 μm, thereby forming a second adhesive film;
[0065] (3) The first adhesive film in (1) and the second adhesive film in (2) are thermally laminated at 120° C. by means of a heated metal roller to bond them together to form a solid adhesive film for packaging.
[0066] Example 2
[0067] This embodiment provides a solid adhesive film for packaging a MINI LED display module, and its structural schematic diagram is shown in FIG. Figure 2 shown.
[0068] This embodiment also provides a method for preparing the solid adhesive film for packaging the MINI LED display module, comprising the following steps:
[0069] (1) coating a UV curing liquid on the PET release film, and forming a 25 μm hardened coating layer after UV curing, and then coating a liquid black glue on the hardened coating layer, and forming a 60 μm thick black coating layer after drying and curing, thereby forming a first adhesive film;
[0070] (2) coating another PET release film with a misty white glue having an optical diffusion function, and drying the film to form a diffusion coating with a thickness of 60 μm, thereby forming a second adhesive film;
[0071] (3) The first adhesive film in (1) and the second adhesive film in (2) are thermally laminated at 100° C. by means of a heated metal roller to bond them together to form a solid adhesive film for packaging.
[0072] Example 3
[0073] This embodiment provides a solid adhesive film for packaging a MINI LED display module.
[0074] This embodiment also provides a method for preparing the solid adhesive film for packaging the MINI LED display module, comprising the following steps:
[0075] (1) coating a UV curing liquid on the PET release film, and forming a 15 μm hardened coating layer after UV curing, and then coating a liquid black glue on the hardened coating layer, and forming a black coating with a thickness of 100 μm after drying and curing, thereby forming a first adhesive film;
[0076] (2) coating another PET release film with a misty white glue having an optical diffusion function, and drying the film to form a diffusion coating with a thickness of 100 μm, thereby forming a second adhesive film;
[0077] (3) The first adhesive film in (1) and the second adhesive film in (2) are thermally laminated at 120° C. by means of a heated metal roller to bond them together to form a solid adhesive film for packaging.
[0078] Example 4
[0079] This embodiment provides a solid adhesive film for packaging a MINI LED display module.
[0080] This embodiment also provides a method for preparing the solid adhesive film for packaging the MINI LED display module, comprising the following steps:
[0081] (1) coating a UV curing liquid on the PET release film, and forming a 5 μm hardened coating layer after UV curing, and then coating a liquid black glue on the hardened coating layer, and forming a black coating with a thickness of 30 μm after drying and curing, thereby forming a first adhesive film;
[0082] (2) coating another PET release film with a misty white glue having an optical diffusion function, and drying the film to form a diffusion coating with a thickness of 150 μm, thereby forming a second adhesive film;
[0083] (3) The first adhesive film in (1) and the second adhesive film in (2) are thermally laminated at 120° C. by means of a heated metal roller to bond them together to form a solid adhesive film for packaging.
[0084] Comparative Example 1
[0085] This comparative example provides a solid adhesive film for packaging a MINI LED display module.
[0086] This comparative example also provides a method for preparing the solid adhesive film for packaging the MINI LED display module, comprising the following steps:
[0087] (1) coating a UV curing liquid on the PET release film, and forming a 10 μm hardened coating layer after UV curing, and then coating the hardened coating with liquid black glue without performing a curing operation to form a black coating with a thickness of 50 μm, thereby forming a first adhesive film;
[0088] (2) coating another PET release film with a misty white glue having an optical diffusion function, and drying the film to form a diffusion coating with a thickness of 60 μm, thereby forming a second adhesive film;
[0089] (3) The first adhesive film in (1) and the second adhesive film in (2) are thermally laminated at 120° C. by means of a heated metal roller to bond them together to form a solid adhesive film for packaging.
[0090] Packaging performance test experiment
[0091] The solid adhesive films in Example 1 and Comparative Example 1 were respectively attached to the MINI LED display module, and then cured and cross-linked at 150° C. for 90 minutes to obtain a packaged MINI LED display module. Figure 2 shown.
[0092] from Figure 2 It can be seen that the MINI LED display module encapsulated by the solid adhesive film in Example 1 has a smooth surface and better integrity, while the MINI LED display module encapsulated by the solid adhesive film in Comparative Example 1 has obvious black coating misalignment, poor integrity, reduced overall blackness, and poor contrast performance.
[0093] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. A solid adhesive film for MINI LED display module packaging, characterized in that: include: A first adhesive film, comprising a first release film, a hardening coating and a black coating; as well as, A second adhesive film, comprising a second release film and a diffusion coating; Wherein, the first adhesive film and the second adhesive film are thermally compounded to obtain the solid adhesive film; The first release film and the second release film are respectively located on two sides of the solid adhesive film; The diffusion coating is used to improve the light uniformity of the MINI LED display module, the hardening coating is used to improve the surface hardness and present a matte effect, and the black coating is used to present a color effect; The method for preparing the solid adhesive film comprises the following steps: Applying hardened glue on one side of the first release film to form a hardened coating after UV curing, applying black glue on the hardened coating to form a black coating after baking and curing, thereby obtaining a first adhesive film; Applying diffusion glue on one side of the second release film to form a diffusion coating to obtain a second adhesive film; The black coating surface of the first adhesive film and the diffusion coating surface of the second adhesive film are bonded and then thermally compounded to obtain a solid adhesive film.
2. The solid adhesive film according to claim 1, characterized in that: The temperature of the thermal bonding is 80-150° C., so that the diffusion coating is in an uncured state and bonded to form a whole.
3. The solid adhesive film according to claim 1, characterized in that: The thickness of the first release film is 60-160 μm; and / or, The thickness of the second release film is 50-100 μm; and / or, The thickness of the hardened coating is 5 to 25 μm; and / or, The thickness of the black coating is 10-100 μm; and / or, The diffusion coating has a thickness of 30 to 180 μm; and / or, The first release film and the second release film are PET release films.
4. A method for preparing a solid adhesive film according to any one of claims 1 to 3, characterized in that: The following steps are involved: Applying hardened glue on one side of the first release film to form a hardened coating after UV curing, applying black glue on the hardened coating to form a black coating after baking and curing, thereby obtaining a first adhesive film; Applying diffusion glue on one side of the second release film to form a diffusion coating to obtain a second adhesive film; The black coating surface of the first adhesive film and the diffusion coating surface of the second adhesive film are bonded and then thermally compounded to obtain a solid adhesive film.
5. The preparation method according to claim 4, characterized in that: The hardened glue is a light-curing glue; In the step of forming a hardened coating after curing, ultraviolet light is used to irradiate the hardened glue to complete the curing.
6. The preparation method according to claim 4, characterized in that: The curing temperature of the black glue is 60-160°C.
7. The preparation method according to claim 4, characterized in that: The curing temperature of the diffusion glue is 120-160°C.
8. Application of a solid adhesive film in packaging a MINI LED display module, characterized in that: The solid adhesive film includes the solid adhesive film as described in any one of claims 1 to 3, or a solid adhesive film prepared by the preparation method as described in any one of claims 4 to 7.
9. The use according to claim 8, characterized in that The following steps are involved: After the second release film of the solid adhesive film is torn off, vacuum hot pressing is performed on the substrate of the MINI LED display module, and then cross-linking is cured at 120-160° C. for 60-120 min to complete the packaging of the MINI LED display module.
Citation Information
Patent Citations
Manufacturing and using method of adhesive film applied to MiniLED display module substrate packaging
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Multi-layer laminated optical adhesive tape for direct display packaging of Min LED and Micro LED
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