Balanced drive power assembly and converter

Abstract

This invention discloses a balanced drive power component and a converter. In the balanced drive power component, a first switch module and a second switch module, including drive connectors and multiple switch modules, are arranged in the switch wiring area of ​​the circuit board. A capacitor module is also arranged on one side of the switch wiring area. Each switch module includes several individual transistors, which cooperate to achieve a controllable switching function and form an input terminal, an output terminal, and a drive terminal. The individual transistors are diodes, transistors, MOSFETs, or thyristors. The drive connectors are connected to the drive terminals of each switch module in their respective switch modules via circuits on the circuit board, and the circuit lengths connecting the connectors to each switch module are consistent. This balanced drive power component can reduce the overall cost of the converter despite the high price of IGBT modules.

Description

Technical Field

[0001] This invention relates to the field of power components and converters, and more specifically to a balanced drive power component and converter. Background Technology

[0002] Converters are widely used in power systems, rail transportation, military industry, petroleum machinery, new energy vehicles, wind power generation, solar photovoltaic and other fields. They can realize unidirectional or bidirectional conversion of electrical energy and have rectification and inversion functions. Among them, the NPC (Neutral Point Clamp) or ANPC (Active Neutral Point Clamp) three-level topology can use IGBT devices with low blocking voltage to increase the DC bus voltage, thereby increasing the AC output voltage and expanding the system power level. Therefore, it has been widely used in converters.

[0003] The main component of a converter is the power module, which primarily consists of a capacitor busbar and several switching transistors, typically IGBT modules. The rapid switching of these IGBT modules enables AC-DC conversion. However, the relatively high price of existing IGBT modules increases the overall cost of the converter. Summary of the Invention

[0004] The purpose of this invention is to overcome the aforementioned defects or problems in the prior art and to provide a balanced drive power component and converter that can reduce the overall cost of the converter when the price of IGBT modules is high.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] Technical Solution 1: A balanced drive power component, comprising: a circuit board defining a plurality of switch wiring areas arranged along a first direction; each switch wiring area is provided with two first switch modules and two second switch modules, the first switch modules comprising a first number of switch modules connected in parallel, and the second switch modules comprising a second number of switch modules connected in parallel; each switch module comprises a plurality of single transistors, each single transistor cooperating with each other to realize a controllable switching function, and forming an input terminal, an output terminal, and a drive terminal of the switch module; each single transistor is a diode, a transistor, or a MOSFET; the first switch module and the second switch module further comprise a drive connector; the drive connector is connected to the drive terminal of each switch module in the switch module to which it is located through a circuit on the circuit board to transmit external control signals to control the on / off state of each switch module, and the length of the circuit connected to each switch module is consistent.

[0007] Technical solution two is based on technical solution one: the switch modules in the first switch module and the second switch module are arranged sequentially along the second direction, and the drive connector is located in the middle position of the switch module along the second direction.

[0008] Technical solution three is based on technical solution one: the switch modules in the first switch module and the second switch module are arranged in a matrix, and the drive connector is located at the center of the switch module.

[0009] Technical solution four is based on technical solution two or three: in each switch wiring area, two second switch modules are arranged adjacently along the first direction, and two first switch modules are arranged along the first direction and located on both sides of the two second switch modules respectively.

[0010] Technical solution five is based on technical solution two or three: within each switch wiring area, two first switch modules are arranged adjacent to each other along the first direction, two second switch modules are arranged adjacent to each other along the first direction, and the two first switch modules and the two second switch modules are respectively located at the two ends of the second direction.

[0011] Technical solution six is ​​based on technical solution one: within each switch wiring area, two second switch modules are arranged adjacently along the second direction, and two first switch modules are arranged along the first direction and respectively located on both sides of the two second switch modules; each switch module in the two first switch modules is arranged sequentially along the second direction, and the drive connector in the first switch module is located in the middle position of the first switch module along the second direction.

[0012] Technical solution seven is based on technical solution six: In the second switch module, some switch modules are arranged sequentially along the first direction, and the remaining switch modules are located between the two second switch modules. The drive connector located in the second switch module is located between the some switch modules arranged sequentially along the first direction and the remaining switch modules, and is located in the middle position of the some switch modules arranged sequentially along the first direction in the first direction.

[0013] Technical solution eight, which is based on technical solution one, also includes a number of capacitor modules corresponding one-to-one with each switch wiring area. Each capacitor module is located on the first side of the corresponding switch wiring area in the second direction, and each switch module in each switch wiring area is connected to the corresponding capacitor module through the circuit on the circuit board. The sum of the circuit lengths from the two first switch modules to the capacitor module is less than the sum of the circuit lengths from the two second switch modules to the capacitor module.

[0014] Technical solution nine is based on technical solution eight: in each switch wiring area, two clamping modules are also provided; each clamping module includes at least one clamping diode and is connected to the first switch module, the second switch module and the capacitor module.

[0015] Technical Solution 10: A converter comprising a balanced drive power component as described in any one of Technical Solutions 1 to 9.

[0016] As can be seen from the above description of the present invention, compared with the prior art, the present invention has the following beneficial effects:

[0017] In technical solution one, several switch wiring areas are defined on the circuit board. These switch wiring areas can be used to set switch modules. The switch modules include a first switch module and a second switch module. Both of them include a certain number of switch modules. The number of switch modules in the two can be the same or different. Each switch wiring area forms a commutation circuit through the cooperation of multiple switch modules and is connected to the capacitor module to realize the power conversion function of the power component. Each switching module consists of several individual transistors, functioning as an IGBT module. The combination of these semiconductor transistors enables the controllable switching function of the switching module. Each switching module forms its input, output, and drive terminals through the collector, emitter, and gate of the corresponding semiconductor transistor, facilitating external wiring. Furthermore, using individual semiconductor transistors to form the switching module is less expensive than using individual switching modules, effectively reducing the cost of the power component. The use of individual semiconductor transistors also provides a larger heat dissipation area, improving the heat dissipation efficiency of the power component. Additionally, the increased number of circuit connection points allows for easier fault location in case of a malfunction, and repairs can be completed simply by replacing the faulty semiconductor transistor, resulting in higher maintenance efficiency. Moreover, a single switching module includes multiple switching modules connected in parallel, reducing the stress on each module and its internal semiconductor transistors, making them less prone to damage.

[0018] However, because the switching modules are assembled using individual semiconductor components, and each switching module includes multiple switching modules spaced a certain distance apart, each switching module needs to be driven individually. This results in poor current balance in the switching module composed of multiple switching modules. To address this, in this technical solution, a drive connector is provided within each switching module, and the distance between the drive connector and the circuit of each switching module is consistent. After receiving an external control signal, the drive connector sends the control signal to each connected switching module. Because the circuit distance is consistent, the timing of receiving the control signal by each switching module is also consistent, and the on / off times of multiple switching modules are consistent. Therefore, the current balance of the switching module is improved, and the power component has higher reliability.

[0019] In technical solution two, each switch module in the switch module is arranged sequentially along the second direction. At this time, the drive connector can be set in the middle position of the switch module in the second direction. The circuit length between the drive connector and each switch module is determined by the circuit length between the switch module that is furthest away and the drive connector. For the other switch modules that are closer, the circuit length can be extended to make the circuit length between each switch module and the drive connector consistent.

[0020] In technical solution three, the switch modules in the switch module are arranged in a matrix. At this time, the drive connector can be set at the center of these switch modules. Since the switch modules are arranged in a matrix, their arrangement is regular. For example, when there are four switch modules, the distance from the drive connector to each switch module in space is the same. At this time, the corresponding circuit length can also be simply set to be the same. However, if there are more or fewer switch modules, the drive connector needs to determine the corresponding circuit length of other switch modules based on the circuit length of the switch module that is furthest away, so as to ensure that the circuit length from each switch module to the drive connector is consistent.

[0021] In technical solution four, two second switch modules are arranged adjacent to each other along the first direction, and two other first switch modules are located on both sides of the two second switch modules respectively. The four switch modules form a layout arranged sequentially along the first direction. This can minimize the distance between each switch module, shorten the length of the commutation loop between the four switch modules, reduce the overall stray inductance of the power component, and enable the power component to meet the stray inductance requirements during use.

[0022] In technical solution five, two first switch modules are arranged adjacent to each other along the first direction, and two second switch modules are also arranged adjacent to each other along the first direction, thereby forming a matrix-shaped layout, which makes the overall circuit components more regular and orderly, and the circuit connection more concise.

[0023] In technical solution six, the switching modules in the first switching module are arranged sequentially along the second direction, which facilitates the arrangement of the two first switching modules on the circuit board. At the same time, the two first switching modules can define a space between them, thus conveniently sandwiching the two second switching modules in the middle. Meanwhile, the two second switching modules are arranged adjacent to each other along the second direction, which reduces the distance between the two second switching modules, shortens the overall commutation circuit, and reduces stray inductance.

[0024] In technical solution seven, some switch modules in two adjacent second switch modules arranged in the second direction are arranged sequentially along the first direction, and the remaining switch modules can be located between these switch modules arranged along the first direction. Of course, the remaining switch modules should be the same number or fewer as the switch modules arranged along the first direction, so that the arrangement of each switch module in the second switch module can be balanced. With this setting, the switch modules in the second switch module can be more concentrated, shortening the commutation loop and reducing stray inductance. At the same time, placing the drive connector in the middle position in the first direction can facilitate the connection of the drive connector to each switch module.

[0025] In technical solution eight, a capacitor module is set up so that the circuit length connecting the two first switching modules to the capacitor module is less than the circuit length connecting the two second switching modules to the capacitor module, thereby shortening the path from the converter circuit to the capacitor module and reducing the stray inductance of the power component converter circuit.

[0026] In technical solution nine, a clamping module is set up, and the clamping diodes in the clamping module realize the NPC or ANPC type three-level commutation topology of the power component.

[0027] In technical solution ten, a converter is provided. This converter, by adopting the aforementioned balanced drive power component, can effectively reduce manufacturing costs and has low stray circuit inductance, thus meeting the application requirements. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments are briefly introduced. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 A schematic diagram of an equalization drive power component provided in an embodiment of the present invention;

[0030] Figure 2 A schematic diagram of a three-level commutator circuit provided in an embodiment of the present invention. Figure 1 ;

[0031] Figure 3 A schematic diagram of a three-level commutator circuit provided in an embodiment of the present invention. Figure 2 ;

[0032] Figure 4 A schematic diagram of a three-level circulating circuit provided in an embodiment of the present invention. Figure 3 ;

[0033] Figure 5This is a schematic diagram of a switch module provided in an embodiment of the present invention;

[0034] Figure 6 Schematic diagram of the switch wiring area layout provided in the embodiment of the present invention Figure 1 ;

[0035] Figure 7 Schematic diagram of the switch wiring area layout provided in the embodiment of the present invention Figure 2 ;

[0036] Figure 8 Schematic diagram of the switch wiring area layout provided in the embodiment of the present invention Figure 3 ;

[0037] Figure 9 Schematic diagram of the switch wiring area layout provided in the embodiment of the present invention Figure 4 ;

[0038] Figure 10 Schematic diagram of the switch wiring area layout provided in the embodiment of the present invention Figure 5 .

[0039] Explanation of key figure labels:

[0040] Circuit board 1; switch wiring area 2; first switch module 3; second switch module 4; switch module 5; input terminal 6; output terminal 7; drive terminal 8; capacitor module 9; drive connector 10; clamping module 11. Detailed Implementation

[0041] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are preferred embodiments of the present invention and should not be considered as excluding other embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0042] Unless otherwise expressly defined, the use of terms such as "first," "second," or "third" in the claims, description, and accompanying drawings of this invention is for distinguishing different objects and not for describing a specific order.

[0043] Unless otherwise expressly defined, in the claims, description, and accompanying drawings of this invention, the use of directional terms such as "center," "lateral," "longitudinal," "horizontal," "vertical," "top," "bottom," "inner," "outer," "upper," "lower," "front," "rear," "left," "right," "clockwise," and "counterclockwise" to indicate orientation or positional relationships is based on the orientation and positional relationships shown in the accompanying drawings and is only for the convenience of describing the invention and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the specific scope of protection of this invention.

[0044] Unless otherwise expressly defined, the terms "fixed connection" or "fixed connection" used in the claims, description and drawings of this invention should be interpreted broadly to refer to any connection in which there is no displacement or relative rotation relationship between the two parties, including non-removable fixed connection, detachable fixed connection, integral connection and fixed connection by other means or components.

[0045] In the claims, description and accompanying drawings of this invention, the terms "comprising," "having," and variations thereof are used to mean "including but not limited to."

[0046] Example

[0047] Reference Figure 1 This embodiment provides a balanced drive power component, which includes a circuit board 1 and electrical components disposed on the circuit board 1.

[0048] Specifically, the equalization drive power component provided in this embodiment is used to achieve Figure 2 , Figure 3 or Figure 4 The circuits shown are both inverter circuits used to convert DC input to AC output. Figure 2 It is a T-type three-level topology circuit. Figure 3 It is a type I three-level topology circuit. Figure 4 This is an ANPC type three-level topology circuit. (Refer to...) Figure 2 and Figure 3 It can be seen that both inverter circuits include four switching units, each of which includes a switching transistor T and a diode D. Figure 2 and Figure 3 In this context, the serial number of the corresponding switching unit is indicated by the designation of the switching transistor or diode. For example, the serial number of the switching unit formed by T1 and D1 is 1, and so on. (Refer to...) Figure 4 ,and Figure 2 and Figure 3 The difference lies in the fact that... Figure 2 and Figure 3The two individually used diodes D are replaced with a complete switching unit. In use, the switching on and off of each switching transistor is controlled by a drive control board to achieve various forms of AC output. This application method is a conventional technique in this technical field and will not be elaborated upon here. Typically, this switching transistor can be implemented using an IGBT module; however, IGBT modules are expensive, and their large-scale use would lead to excessively high manufacturing costs for this equalization drive power component.

[0049] Therefore, the equalization drive power component provided in this embodiment adopts the following solution:

[0050] The circuit board 1 of the equalization drive power component defines a plurality of switch wiring areas 2 arranged along a first direction. Each switch wiring area 2 is provided with two first switch modules 3 and two second switch modules 4. The first switch modules 3 include a first number of switch modules 5 connected in parallel, and the second switch modules 4 include a second number of switch modules 5 connected in parallel. Each capacitor module 9 corresponds one-to-one with each switch wiring area 2 and is located on the first side of its corresponding switch wiring area 2 relative to the first direction. (Refer to...) Figure 1 In this embodiment, the first direction refers to the left-right direction of the circuit board 1, and the second direction refers to the up-down direction of the circuit board 1.

[0051] The switching module 5 includes several single transistors, which cooperate with each other to achieve a controllable switching function and form the input terminal 6, output terminal 7 and driving terminal 8 of the switching module 5; the single transistors are diodes, transistors or MOSFETs.

[0052] In addition, the first switch module 3 and the second switch module 4 also include a drive connector 10; the drive connector 10 is connected to the drive terminal 8 of each switch module 5 in the switch module it is located in through the circuit on the circuit board 1 to transmit external control signals to control the switching of each switch module 5, and the circuit length of the connector 10 is consistent with that of each switch module 5.

[0053] Specifically, refer to Figure 1 The electrical components in this power assembly include a switching module and a capacitor module 9, wherein the capacitor module 9 is... Figure 2 , Figure 3 or Figure 4 The capacitors C1, C2, C3, or C4 in the circuit shown represent the switching module. Figure 2 , Figure 3 or Figure 4 The circuit shown includes a switching unit, and according to the order of the switching units, the two first switching modules 3 correspond to switching units 1 and 4 respectively, and the two second switching modules 4 correspond to switching units 2 and 3 respectively. A switch wiring area 2 includes a set of... Figure 2 , Figure 3or Figure 4 The circuit shown in the circuit board 1 includes a total of three sets of circuits for realizing the inversion of three-phase electricity.

[0054] The circuit board 1 is a conventional printed circuit board, and its substrate material can be glass fiber reinforced epoxy resin to improve the structural strength of the circuit board 1. A metal layer is covered on the surface of the circuit board 1, and circuit patterns can be formed on the metal layer by chemical etching or other methods to connect the electrical components thereon. Through the circuit board 1, the electrical components in the equalization drive power assembly can be supported and connected through the circuit patterns on the circuit board 1. Therefore, the aforementioned switching module can be reliably installed, connected, and fixed to form a complete circuit system. In addition, the circuit board 1 can be a single-layer structure or a multi-layer structure. A multi-layer circuit board 1 can accommodate more circuits and can arrange components more efficiently.

[0055] Each switch module includes multiple switch modules 5, each independently possessing a corresponding switching and conductive function. The parallel connection of multiple switch modules 5 enhances the stress resistance of the entire switch module. (Refer to...) Figure 5 Each switching module 5 includes a transistor, a MOSFET, and a diode. The drain of the MOSFET is connected in parallel to the base of the transistor and the cathode of the diode, and the source of the MOSFET is connected to the emitter of the transistor and the anode of the diode. Diode D1 serves as a freewheeling diode, providing a path for current to continue flowing when the circuit from the transistor to the MOSFET is broken in the switching module 5, preventing backflow current from the load inductor in the circuit and thus protecting the entire switching module 5 from damage. After forming the switching module 5 using the aforementioned semiconductor components, the collector and emitter of the transistor are used as the input terminal 6 and output terminal 7 of the switching module 5, while the gate of the MOSFET serves as the driving terminal 8 of the switching module 5. Figure 6 or Figure 7Each switching module 5 has its input terminal 6, output terminal 7, and drive terminal 8 connected to corresponding wiring points via etched circuits on the circuit board 1, facilitating wiring and maintenance. Using these semiconductor components to form IGBT modules results in lower costs compared to directly using IGBT modules, effectively reducing the cost of the power component. Furthermore, using individual semiconductor components provides a larger heat dissipation area for the entire switching module 5 compared to individual IGBT modules, improving the heat dissipation efficiency of the power component. Simultaneously, the increased number of circuit connection points allows for easier identification of the fault location in case of a failure, and repairs can be completed simply by replacing the faulty semiconductor component, resulting in higher maintenance efficiency and reduced repair costs. Of course, in other embodiments, the specific types and connection methods of the individual transistors within the switching module 5 can be adjusted according to actual needs, such as using only diodes and MOSFETs.

[0056] At the same time, refer to Figure 6 When each switch module 5 is mounted on the circuit board 1, its input terminal 6, output terminal 7, and drive terminal 8 are arranged in parallel. Specifically, the main body of the semiconductor device in each switch module 5 can be mounted on the back of the circuit board 1, and the pins of each semiconductor device are inserted into the circuit board 1, forming corresponding solder joints on the front of the circuit board 1. The collector and emitter of the transistor and the gate of the MOSFET form three solder joints for each switch module 5. These three solder joints are arranged in parallel along a specific direction, which can be the arrangement direction of the three semiconductor devices in the switch module 5. Arranging the input terminal 6, output terminal 7, and drive terminal 8 of each switch module 5 in parallel facilitates the etching and connection of the wiring circuit on the circuit board 1, makes the circuit layout of each switch module 5 more regular, and also facilitates the integrated setup of the corresponding switch modules.

[0057] Each switching module is equipped with a drive connector 10, which has a receiving end that can communicate with an external drive control board to receive control signals sent by the drive control board and then send the control signals to the individual switching modules 5 within the switching module. Typically, the control signal is a PWM duty cycle signal. When the drive terminal 8 of the switching module 5 receives a high level signal, the switching module 5 is turned on, allowing current to flow; when the drive terminal 8 of the switching module 5 receives a low level signal, the switching module 5 is turned off, preventing current from flowing. Therefore, by frequently turning on or off the individual switching modules in each switching wiring area 2, rectification or inversion of the power component can be achieved.

[0058] In the power component provided by this invention, individual semiconductor devices are used to form IGBT modules, and each switching module includes multiple switching modules 5 with a certain distance between them. Therefore, each switching module 5 needs to be driven individually, resulting in poor current balance of the switching module composed of multiple switching modules 5. To address this, in this embodiment, a driving connector 10 is provided in each switching module, and the circuit distance between the driving connector 10 and each switching module 5 is consistent. After receiving an external control signal, the driving connector 10 sends the control signal to each switching module 5 connected to it. Because the circuit distance is consistent, the switching modules 5 receive the control signal at the same time, and the on / off times of the multiple switching modules 5 are consistent. Therefore, the current balance of the switching module is improved, and the power component has higher reliability.

[0059] Furthermore, the power assembly also includes several capacitor modules 9 corresponding one-to-one with each switch wiring area 2. Each capacitor module 9 is located on the first side of its corresponding switch wiring area 2 in the second direction, and each switch module in each switch wiring area 2 is connected to its corresponding capacitor module 9 via circuitry on the circuit board 1. The sum of the circuit lengths from two first switch modules 3 to their respective capacitor modules 9 is less than the sum of the circuit lengths from two second switch modules 4 to their respective capacitor modules 9. This means that the distance between two first switch modules 3 and their corresponding capacitor modules 9 in the connection circuit is closer to the capacitor module 9 than the distance between two second switch modules 4, thereby shortening the commutation loop path and reducing stray inductance in the circuit. Each switch module 5 in the switch module is connected to the capacitor module 9 via circuitry etched onto the circuit board 1.

[0060] To further illustrate, this embodiment provides various layout methods for switch modules, the details of which are described below.

[0061] Reference Figure 6This diagram illustrates a layout of a switch module. Within a switch wiring area 2, two second switch modules 4 are arranged adjacently, with two first switch modules 3 located on either side of the two second switch modules 4. Each switch module 5 in the two first switch modules 3 is arranged sequentially along a second direction, perpendicular to the first direction. Furthermore, within each switch wiring area 2, the input terminals 6, output terminals 7, and drive terminals 8 of the switch modules 5 belonging to different first switch modules 3 are oriented opposite to each other in the first direction. Additionally, the second switch modules 4 are arranged adjacently in the second direction, and within the two second switch modules 4, some switch modules 5 are arranged sequentially along the first direction, while the remaining switch modules 5 are located between the sequentially arranged switch modules 5 in the two second switch modules 4. A drive connector 10 is positioned between the sequentially arranged switch modules 5 and the remaining switch modules 5 in the first direction, and is located in the middle of the sequentially arranged switch modules 5 in the first direction.

[0062] Specifically, in Figure 6 In the layout shown, two first switch modules 3 are located at both ends in the first direction, and two second switch modules 4 are located at both ends in the second direction, with the two second switch modules 4 placed between the two first switch modules 3. Figure 6 Taking the direction shown as an example, the two first switch modules 3 are located on the left and right sides respectively, and the switch modules 5 within these two switch modules are arranged vertically. In the first switch module 3 on the left, the tube portion of the switch module 5 is on the right, and the wiring terminal portion is on the left. Similarly, in the second switch module 4 on the right, the tube portion of the switch module 5 is on the left, and the wiring terminal portion is on the right. This arrangement allows the wiring to the two first switch modules 3 to be placed on the left and right sides of the switch wiring area 2, without encroaching on the central space. At the same time, Figure 6 In this configuration, each of the two second switch modules 4 contains three switch modules 5 arranged in an "L" shape. Taking the upper second switch module 4 as an example, two switch modules 5 are arranged along the first direction, with another switch module 5 located below them. The other second switch module 4 located at the lower side is similar. Similar to the arrangement of the first switch module 3, in the two second switch modules 4, the corresponding terminals of the switch modules 5 arranged along the first direction are also opposite to each other, thus avoiding excessive convergence during wiring. With this arrangement, the wiring of the first switch module 3 can be arranged on the side of the switch wiring area 2, leaving the middle of the switch wiring area 2 for the second switch module 4 to wire. This results in a clearer and simpler wiring layout, while shortening the commutation loop and reducing stray inductance.

[0063] The drive connector 10 belonging to the first switch module 3 is located in the middle of the two first switch modules 3 in the second direction. Two switch modules 5 are positioned above and below it. Therefore, spatially, the drive connector 10 has two different lengths from the four switch modules 5. To address this, the circuit length from the drive connector 10 to each switch module 5 can be set to the circuit length from the drive connector 10 to the two furthest switch modules 5. In other words, the circuit length from the drive connector 10 to the two closest switch modules 5 is artificially extended, thus ensuring that the circuit length from the drive connector 10 to each switch module 5 is consistent. The drive connector 10 belonging to the second switch module 4 is located at the center of the second switch module 4, and its spatial distance from the three switch modules 5 is approximately equal. In this case, the circuit length from the drive connector 10 to the three switch modules 5 can also be kept consistent.

[0064] Meanwhile, when arranging the circuits on the circuit board 1, the first switch module 3 located on the left needs to extend its circuit from the left side to the capacitor module 9, and the first switch module 3 located on the right needs to extend its circuit from the right side to the capacitor module 9. The second switch module 4 located on the lower side can directly extend its circuit downwards to the capacitor module 9, while the second switch module 4 located on the upper side needs to extend its circuit upwards before turning left or right and then downwards to the capacitor module 9. This arrangement ensures that the total circuit length of the two first switch modules 3 is less than the total circuit length of the two second switch modules 4, thereby reducing the length of the commutation loop. This allows the two first switch modules 3, which bear more current stress, to be closer to the capacitor module 9, reducing the current stress on the two first switch modules 3 and ensuring that the switch modules can operate normally.

[0065] Reference Figure 7 This illustrates another layout for the switch modules. Within a switch wiring area 2, two second switch modules 4 are arranged adjacently, with two first switch modules 3 located on either side of the two second switch modules 4. Each switch module 5 in the two first switch modules 3 is arranged sequentially along a second direction, which is perpendicular to the first direction. Simultaneously, within each switch wiring area 2, each switch module 5 in the second switch modules 4 is arranged sequentially along the second direction, and the two second switch modules 4 within each switch wiring area 2 are arranged along the first direction.

[0066] Specifically, in Figure 7In the layout shown, four switch modules are arranged sequentially along a first direction, and the switch modules 5 within each switch module are arranged sequentially along a second direction, forming four vertical columns. Specifically, the wiring terminals of the switch modules 5 in the first switch module 3 and the second switch module 4 on the left face left, while the wiring terminals of the switch modules 5 in the first switch module 3 and the second switch module 4 on the right face right. This arrangement ensures that the switch modules 5 of the four switch modules extend vertically and are arranged horizontally during wiring, preventing mutual interference and making wiring and maintenance more convenient.

[0067] The drive connector 10 belonging to the first switch module 3 is located in the middle of the two first switch modules 3 in the second direction. Two switch modules 5 are positioned above and below it. Therefore, spatially, this drive connector 10 has two different lengths from the four switch modules 5. To address this, the circuit length from the drive connector 10 to each switch module 5 can be set to the circuit length from the drive connector 10 to the two furthest switch modules 5. That is, the circuit length from the drive connector 10 to the two closest switch modules 5 is artificially extended to ensure that the circuit length from the drive connector 10 to each switch module 5 is consistent. Similarly, the drive connector 10 belonging to the second switch module 4 can be set in the same way as the first switch module 3, which will not be elaborated further here.

[0068] Meanwhile, when arranging the circuits on the circuit board 1, the first switch modules 3 located on the left and right sides extend from the left and right sides to the capacitor module 9, respectively. The two second switch modules 4 located in the middle extend from the top to the left and right sides, respectively, and then extend downwards to the capacitor module 9.

[0069] Reference Figure 8 This illustrates another layout of the switch modules. Within a switch wiring area 2, two first switch modules 3 are arranged adjacent to each other along a first direction, and two second switch modules 4 are arranged adjacent to each other along the first direction, with the two first switch modules 3 being closer to the capacitor module 9 corresponding to the switch wiring area 2 than the two second switch modules 4.

[0070] Specifically, in Figure 8 In the layout shown, the four switch modules are arranged in a matrix, located at the four corners of the switch wiring area 2. Within each switch module, four switch modules 5 are also arranged in a matrix, with the drive connector 10 located at the center of each switch module. In this configuration, the spatial distance from each drive connector 10 to each switch module 5 within its respective switch module is consistent; therefore, the circuit distance from each drive connector 10 to its corresponding switch module 5 can be easily designed to be uniform.

[0071] However, if each switch module includes more switch modules 5, then it is necessary to refer to... Figure 7 In the layout shown, the drive connector 10 is configured such that the circuit length from the drive connector 10 to the farthest switch module 5 is used as a reference, and the circuit length of other switch modules 5 with shorter distances is artificially extended, thereby ensuring that the circuit length from the drive connector 10 to each switch module 5 is consistent.

[0072] In addition, when connecting the switch modules and capacitor modules 9, the two lower first switch modules 3 can directly lead out circuits downwards to connect to the capacitor module 9, and the two upper second switch modules 4 can lead out circuits to the left and right sides respectively and then turn downwards to extend to the capacitor module 9.

[0073] Meanwhile, in this power assembly, each switch wiring area 2 is also equipped with two clamping modules 11, each clamping module 11 including at least one clamping diode. The wiring relationship between the clamping diode and other components can be referred to Figures 2 to 4 In the circuit shown, the clamping diodes are diodes D5 and D6. The clamping module 11 can perform functions such as midpoint potential balancing, clamping, freewheeling protection, and harmonic reduction, thereby improving the performance and reliability of the entire system.

[0074] Reference Figure 9 It shows a layout of clamping modules 11 in each switch wiring area 2. In this embodiment, two clamping modules 11 are arranged adjacent to each other along the second direction and are located in the middle of four matrix-arranged switch modules. This can shorten the length of the circuit connected to each switch module, thereby shortening the path of the commutation loop. The layout is also compact and can shorten the size of the switch wiring area 2 in the left and right directions.

[0075] Reference Figure 10 , and Figure 9 The difference is that the two clamping modules 11 are arranged adjacent to each other along the first direction, which can also shorten the length of the circuit connecting the clamping module 11 to each switching module, thereby shortening the path of the commutation circuit.

[0076] The equalization drive power component provided in this embodiment defines several switch wiring areas 2 on the circuit board 1. These switch wiring areas 2 can be used to set switch modules. The switch modules include a first switch module 3 and a second switch module 4. Both include a certain number of switch modules 5. The number of switch modules 5 in the two modules can be the same or different. Each switch wiring area 2 forms a commutation circuit through the cooperation between multiple switch modules and is connected to the capacitor module 9 to realize the power component's conversion function. Each switching module 5 is formed by a transistor, a MOSFET, and a diode. The combination of these semiconductor components enables the function of an IGBT module. Each switching module 5 can form an input terminal 6, an output terminal 7, and a drive terminal 8 through the collector, emitter, and gate of the corresponding semiconductor component, facilitating external wiring. Furthermore, using these semiconductor components to form an IGBT module is less expensive than using a separate IGBT module, effectively reducing the cost of the power component. The use of individual semiconductor components provides a larger heat dissipation area for the entire switching module 5 compared to a single IGBT module, improving the heat dissipation efficiency of the power component. It also has more circuit connection points, making it easier to pinpoint the fault location in case of a failure, and repairs can be completed simply by replacing the faulty semiconductor component, resulting in higher inspection and repair efficiency. In addition, a switching module includes multiple switching modules 5 connected in parallel. Each switching module 5 and its internal semiconductor components experience lower stress and are less prone to damage. However, since IGBT modules are formed by combining individual semiconductor components, and each switching module includes multiple switching modules 5 with a certain distance between them, each switching module 5 needs to be driven individually. This results in poor current balance of the switching module composed of multiple switching modules 5. Therefore, in this technical solution, a drive connector 10 is provided in each switching module, and the circuit distance between the drive connector 10 and each switching module 5 is consistent. After receiving an external control signal, the drive connector 10 sends the control signal to each connected switching module 5. Because the circuit distance is consistent, the switching modules 5 receive the control signal at the same time, and the on / off times of the multiple switching modules 5 are consistent. Therefore, the current balance of the switching module is improved, and the power component has higher reliability.

[0077] Furthermore, this invention also provides a converter that includes the equalization drive power component described above. Typically, the converter may also include a heat sink, which is disposed on the back of the equalization drive power component and in contact with the pipe portions of each switching module 5, thereby dissipating heat from the switching modules 5, reducing their temperature, and ensuring the normal operation of the equalization drive power component.

[0078] The foregoing description of the specifications and embodiments is intended to explain the scope of protection of this invention, but does not constitute a limitation on the scope of protection of this invention. Modifications, equivalent substitutions, or other improvements to the embodiments of this invention or a portion thereof that can be obtained by those skilled in the art through logical analysis, reasoning, or limited experimentation, based on the teachings of this invention or the foregoing embodiments, in conjunction with common knowledge, general technical knowledge, and / or existing technology, should all be included within the scope of protection of this invention.

Claims

1. A balanced drive power component, characterized in that it comprises: The circuit board (1) defines a plurality of switch wiring areas (2) arranged along a first direction. Each switch wiring area (2) is provided with two first switch modules (3) and two second switch modules (4). The first switch module (3) includes a first number of switch modules (5) connected in parallel, and the second switch module (4) includes a second number of switch modules (5) connected in parallel. The switching module (5) includes several single transistors, each of which cooperates with each other to achieve a controllable switching function and forms the input terminal (6), output terminal (7) and driving terminal (8) of the switching module (5); the single transistor is a diode, a transistor or a MOSFET; The first switch module (3) and the second switch module (4) also include a drive connector (10); the drive connector (10) is connected to the drive end (8) of each switch module (5) in the switch module it is located in through the circuit on the circuit board (1) to transmit external control signals to control the switching of each switch module (5) to turn on and off, and the length of the circuit connected to each switch module (5) is consistent. In the first switch module (3) and the second switch module (4), each switch module (5) is arranged sequentially along the second direction, and the drive connector (10) is located in the middle position of the switch module along the second direction; or, in the first switch module (3) and the second switch module (4), each switch module (5) is arranged in a matrix, and the drive connector (10) is located in the center position of the switch module.

2. The equalization drive power component as described in claim 1, characterized in that, In each switch wiring area (2), two second switch modules (4) are arranged adjacent to each other along the first direction, and two first switch modules (3) are arranged along the first direction and located on both sides of the two second switch modules (4).

3. The equalization drive power component as described in claim 1, characterized in that, In each switch wiring area (2), two first switch modules (3) are arranged adjacent to each other along the first direction, and two second switch modules (4) are arranged adjacent to each other along the first direction, and the two first switch modules (3) and the two second switch modules (4) are located at the two ends of the second direction respectively.

4. The equalization drive power component as described in claim 1, characterized in that, In each switch wiring area (2), two second switch modules (4) are arranged adjacent to each other along the second direction, and two first switch modules (3) are arranged along the first direction and located on both sides of the two second switch modules (4); each switch module (5) in the two first switch modules (3) is arranged sequentially along the second direction, and the drive connector (10) located in the first switch module (3) is located in the middle position of the first switch module (3) along the second direction.

5. The equalization drive power component as described in claim 4, characterized in that, In the second switch module (4), some switch modules (5) are arranged sequentially along the first direction, and the remaining switch modules (5) are located between the two second switch modules (4). The drive connector (10) located in the second switch module (4) is located between the some switch modules (5) arranged sequentially along the first direction and the remaining switch modules (5), and is located in the middle position of the some switch modules (5) arranged sequentially along the first direction in the first direction.

6. The equalization drive power component as described in claim 1, characterized in that, It also includes a number of capacitor modules (9) that correspond one-to-one with each switch wiring area (2). Each capacitor module (9) is located on the first side of the corresponding switch wiring area (2) in the second direction. Each switch module in each switch wiring area (2) is connected to the corresponding capacitor module (9) through the circuit on the circuit board (1). The sum of the circuit lengths from the two first switch modules (3) to the capacitor module (9) is less than the sum of the circuit lengths from the two second switch modules (4) to the capacitor module (9).

7. The equalization drive power component as described in claim 6, characterized in that, Each switch wiring area (2) is also provided with two clamping modules (11); each clamping module (11) includes at least one clamping diode and is connected to the first switch module (3), the second switch module (4) and the capacitor module (9).

8. A converter, characterized in that, Includes the equalization drive power component as described in any one of claims 1-7.

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