Inverter brick structure, motor controller, powertrain and vehicle having the same

Abstract

The present invention discloses an inverter brick structure, a motor controller, a power assembly and a vehicle having the same, and relates to the technical field of electrical equipment. The inverter brick structure includes: a capacitor module, a first flow channel groove is provided on one side surface of the capacitor module; a first heat sink, the first heat sink is installed on one side of the capacitor module, and the first heat sink cover is provided at the opening of the first flow channel groove; a power module, the power module is provided on the side of the first heat sink away from the capacitor module and is connected to the first heat sink. The inverter brick structure according to the present invention has a simple structure, a compact layout, and a high heat dissipation efficiency, which can well reduce the use of components, reduce costs, and make the overall structure of the inverter brick structure more integrated.

Description

Technical Field

[0001] The present invention relates to the technical field of electrical equipment, and in particular to an inverter brick structure, a motor controller, a power assembly and a vehicle having the same. Background Art

[0002] In the related art, a heat dissipation structure is generally required in the inverter brick structure to dissipate heat from the power module. In the inverter brick structure with a cooling flow channel, a flow channel plate is often separately provided to cooperate with the heat dissipation plate to form a flow channel structure. This results in more components in the inverter brick structure, poor overall integration of the inverter brick structure and high cost. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes an inverter brick structure, which can reduce the number of components, making the inverter brick structure more compact, better integrated and lower cost.

[0004] The present invention also provides a motor controller having the inverter brick structure.

[0005] The present invention also provides a powertrain having the motor controller.

[0006] The present invention also provides a vehicle having the power assembly.

[0007] The inverter brick structure according to the first aspect of the present invention includes: a capacitor module, a first flow channel groove is provided on one side surface of the capacitor module; a first heat sink, the first heat sink is installed on one side of the capacitor module, and the first heat sink cover is arranged at the opening of the first flow channel groove; a power module, the power module is arranged on the side of the first heat sink away from the capacitor module and is connected to the first heat sink.

[0008] According to the inverter brick structure of the present invention, a first flow channel groove is arranged on the capacitor module, and a first heat sink covers the opening of the first flow channel groove. The power module is arranged on the side of the first heat sink away from the capacitor module and is connected to the first heat sink. The structure is simple, the layout is compact, and the heat dissipation efficiency is high. The use of components can be greatly reduced, the cost can be reduced, and the overall structure of the inverter brick structure can be more integrated.

[0009] In some embodiments of the present invention, at least one of the capacitor module and the first heat sink is provided with a first mounting groove, and the first mounting groove extends in a ring shape along the circumference of the first flow channel groove. The inverter brick structure also includes: a first seal, the first seal is provided in the first mounting groove, and the first seal is connected between the capacitor module and the first heat sink.

[0010] In some embodiments of the present invention, the capacitor module includes: a capacitor shell and a capacitor core, the capacitor core is arranged inside the capacitor shell, the first flow channel is arranged on a side surface of the capacitor shell, and the first flow channel is isolated from the capacitor core by a portion of the capacitor shell.

[0011] In one embodiment of the present invention, the capacitor housing is a plastic part.

[0012] In one embodiment of the present invention, the capacitor housing is a plastic part, and the first heat sink is a metal part.

[0013] In some embodiments of the present invention, the inverter structure further includes a second heat sink, which is connected to the power module and arranged on a side of the power module away from the first heat sink.

[0014] In one embodiment of the present invention, the first heat sink is connected to the power module by welding, or a heat conductor is filled between the first heat sink and the power module; the second heat sink is connected to the power module by welding, or a heat conductor is filled between the second heat sink and the power module.

[0015] In one embodiment of the present invention, the first heat sink is provided with a first liquid inlet hole and a first liquid outlet hole connected to the first flow channel groove, the second heat sink is provided with a second liquid inlet hole and a second liquid outlet hole penetrating the second heat sink in the thickness direction of the second heat sink, the first liquid inlet hole is connected between the second liquid inlet hole and the first flow channel groove, and the first liquid outlet hole is connected between the second liquid outlet hole and the first flow channel groove.

[0016] In some examples of the present invention, the inverter brick structure also includes: a first support platform, the first support platform is arranged between the first heat sink and the second heat sink, the first support platform extends in a ring shape along the circumference of the first liquid inlet hole, and defines a first connecting hole connecting the first liquid inlet hole and the second liquid inlet hole; a second support platform, the second support platform is arranged between the first heat sink and the second heat sink, the second support platform extends in a ring shape along the circumference of the first liquid outlet hole, and defines a second connecting hole connecting the first liquid outlet hole and the second liquid outlet hole.

[0017] In an example of the present invention, the first support platform is integrally formed with one of the first heat sink and the second heat sink; the second support platform is integrally formed with one of the first heat sink and the second heat sink.

[0018] In some examples of the present invention, the inverter brick structure also includes a substrate, a second flow channel is provided on the substrate, the second heat sink cover is provided at the opening of the second flow channel, the second liquid inlet and the second liquid outlet are both connected to the second flow channel, and a liquid inlet and a liquid outlet are formed at the bottom of the second flow channel.

[0019] In one example of the present invention, at least one of the substrate and the second heat sink is provided with a fourth mounting groove, and the fourth mounting groove extends in a ring shape along the circumference of the second flow channel groove, and the inverter brick structure also includes: a fourth seal, the fourth seal is provided in the fourth mounting groove, and the fourth seal is sealed and connected between the substrate and the second heat sink.

[0020] In some embodiments of the present invention, the inverter brick structure further includes a circuit board, which is disposed on one side of the capacitor module in the first direction and is mounted on the capacitor module.

[0021] In some embodiments of the present invention, the capacitor module includes a capacitor housing, and the inverter brick structure further includes a three-phase copper busbar, and the three-phase copper busbar is fixedly connected to the capacitor housing.

[0022] A motor controller according to a second aspect of the present invention comprises: a box and an inverter brick structure according to the first aspect of the present invention, wherein the inverter brick structure is mounted on the box.

[0023] According to the motor controller of the present invention, by setting the inverter brick structure of the first aspect mentioned above, by setting the first flow channel groove on the capacitor module, the first heat sink covers the opening of the first flow channel groove, and the power module is set on the side of the first heat sink away from the capacitor module and is connected to the first heat sink. It has a simple structure, compact layout, high heat dissipation efficiency, can greatly reduce the use of components, reduce costs, and make the overall structure of the inverter brick structure more integrated.

[0024] In some embodiments of the present invention, the inverter brick structure includes a substrate, and the substrate is constructed as a part of the box, or the substrate is arranged in the box.

[0025] A powertrain according to a third aspect of the present invention comprises a motor controller according to the second aspect of the present invention.

[0026] According to the powertrain of the present invention, by setting the motor controller of the second aspect, by setting the inverter brick structure of the first aspect, by setting the first flow channel groove on the capacitor module, the first heat sink covers the opening of the first flow channel groove, and the power module is set on the side of the first heat sink away from the capacitor module and connected to the first heat sink. It has a simple structure, compact layout, high heat dissipation efficiency, can greatly reduce the use of components, reduce costs, and make the overall structure of the inverter brick structure more integrated.

[0027] A vehicle according to a fourth aspect of the present invention comprises the powertrain according to the third aspect of the present invention.

[0028] According to the vehicle of the present invention, by setting the powertrain of the third aspect mentioned above, by setting the inverter brick structure of the first aspect mentioned above, by setting the first flow channel groove on the capacitor module, the first heat sink covers the opening of the first flow channel groove, and the power module is set on the side of the first heat sink away from the capacitor module and is connected to the first heat sink. It has a simple structure, compact layout, high heat dissipation efficiency, can greatly reduce the use of parts and components, reduce costs, and make the overall structure of the inverter brick structure more integrated.

[0029] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is a schematic diagram of an inverter brick structure according to an embodiment of the present invention;

[0031] Figure 2 is a schematic diagram of a substrate and a capacitor module separated according to an embodiment of the present invention;

[0032] Figure 3 is a schematic diagram of a substrate after being separated from a capacitor module, a first heat sink, a second heat sink and a power module according to an embodiment of the present invention;

[0033] Figure 4 is a schematic diagram of assembling a capacitor module, a first heat sink, a second heat sink, a power module, a circuit board and a three-phase copper busbar according to an embodiment of the present invention;

[0034] Figure 5 is an exploded view of an inverter brick structure according to an embodiment of the present invention;

[0035] Figure 6 is a schematic diagram of a capacitor module and a three-phase copper busbar according to an embodiment of the present invention;

[0036] Figure 7 is an exploded diagram of a first heat sink, a second heat sink and a power module according to an embodiment of the present invention;

[0037] Figure 8 is a schematic diagram of a substrate and a fourth sealing member according to an embodiment of the present invention.

[0038] Reference numerals:

[0039] 10. Capacitor module; 11. First flow channel groove; 12. First mounting groove;

[0040] 21, first heat sink; 211, first support platform; 2111, second mounting groove; 212, second support platform; 22, second heat sink; 201, first liquid inlet hole; 202, first liquid outlet hole; 203, second liquid inlet hole; 204, second liquid outlet hole; 205, fin column;

[0041] 30. Power module; 40. Circuit board; 50. Three-phase copper busbar;

[0042] 60, substrate; 61, second flow channel groove; 601, liquid inlet; 602, liquid outlet;

[0043] 71, first sealing member; 72, second sealing member; 73, third sealing member; 74, fourth sealing member;

[0044] 100. Inverter brick structure. DETAILED DESCRIPTION

[0045] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0046] Reference below Figure 1-Figure 8 An inverter brick structure 100 according to an embodiment of a first aspect of the present invention is described.

[0047] like Figure 1-Figure 8 As shown, the inverter brick structure 100 according to the first embodiment of the present invention includes: a capacitor module 10 , a first heat sink 21 and a power module 30 .

[0048] Specifically, a first flow channel 11 is provided on one side surface of the capacitor module 10; a first heat sink 21 is installed on one side of the capacitor module 10, and the first heat sink 21 covers the opening of the first flow channel 11; the power module 30 is arranged on the side of the first heat sink 21 away from the capacitor module 10 and is connected to the first heat sink 21.

[0049] In this embodiment, a first flow channel groove 11 is set on the capacitor module 10, and a first heat sink 21 covers the opening of the first flow channel groove 11, so that the first heat sink 21 can cooperate with the first flow channel groove 11 of the capacitor module 10 to form a good flow channel cavity structure, and the coolant can flow stably in the first flow channel groove 11.

[0050] In this embodiment, a power module 30 is arranged on the side of the first heat sink 21 facing away from the capacitor module 10. When the inverter brick structure 100 is in operation, the heat generated by the power module 30 is transferred to the first heat sink 21, and the coolant can flow along the first flow channel to exchange heat with the first heat sink 21, so that the power module 30 can be well cooled and dissipated. At the same time, the coolant in the first flow channel groove 11 can absorb the heat generated by the capacitor module 10, so that the capacitor module 10 can be cooled and dissipated during the flow of the coolant.

[0051] It is understandable that when liquid cooling is used in the inverter brick structure 100 to dissipate heat and cool the power module 30 and the capacitor module 10, a closed flow channel structure needs to be formed so that the coolant can flow stably and perform cooling and heat dissipation operations. Therefore, in the relevant technology, it is often necessary to set flow channel plates, cover plates and other components to cooperate with the heat sink to form a flow channel, which results in a large number of parts in the inverter brick structure 100, and the overall structure volume of the capacitor module 10 and the power module 30 is large when the flow channel plate, cover plate and other components are arranged, which reduces the integrated arrangement effect of the capacitor module 10 and the power module 30, and makes the integration of the inverter brick structure 100 poor.

[0052] In this embodiment, a first flow channel groove 11 is provided in the capacitor module 10 and cooperates with the first heat sink 21 to form a flow channel structure. The structure is simple and the use of components such as a flow channel plate and a cover plate is omitted, so that the capacitor module 10 and the power module 30 are more compact when assembled and arranged, and the overall volume of the capacitor module 10, the power module 30 and the first heat sink 21 is smaller, thereby making the overall structure of the inverter brick structure 100 more compact and better integrated.

[0053] In this embodiment, the coolant in the first flow channel 11 can simultaneously dissipate heat and cool the capacitor module 10 and the power module 30, so that the heat dissipation efficiency of the inverter brick structure 100 is greatly improved. The coolant flows in the first flow channel 11 to dissipate heat from the capacitor module 10, which can eliminate the use of thermal pads, thermal conductive adhesives, etc., thereby reducing the cost of the inverter brick structure 100 and making the overall structure of the inverter brick structure 100 more compact and more integrated.

[0054] In this embodiment, a first flow channel 11 is provided on one side surface of the capacitor module 10, and the first heat sink 21 and the power module 30 are both arranged on one side of the capacitor module 10. The capacitor module 10, the first heat sink 21 and the power module 30 can be stacked, with a simple structure and convenient assembly. The first heat sink 21 is installed on the capacitor module 10, and the power module 30 is connected to the first heat sink 21, which can well meet the modular design requirements of the inverter brick structure 100.

[0055] According to the inverter brick structure 100 of the embodiment of the present invention, a first flow channel groove 11 is arranged on the capacitor module 10, and a first heat sink 21 covers the opening of the first flow channel groove 11. The power module 30 is arranged on the side of the first heat sink 21 away from the capacitor module 10 and is connected to the first heat sink 21. The structure is simple, the arrangement is compact, and the heat dissipation efficiency is high. The use of components can be greatly reduced, the cost can be reduced, and the overall structural integration of the inverter brick structure 100 can be higher.

[0056] In some embodiments of the present invention, reference Figure 5 As shown, at least one of the capacitor module 10 and the first heat sink 21 may be provided with a first mounting groove 12, and the first mounting groove 12 extends in a ring shape along the circumference of the first flow channel groove 11. The inverter brick structure 100 may also include: a first seal 71, the first seal 71 is provided in the first mounting groove 12, and the first seal 71 is sealed and connected between the capacitor module 10 and the first heat sink 21.

[0057] In the present embodiment, a first sealing member 71 is provided to be sealed and connected between the capacitor module 10 and the first heat sink 21, so as to play a good sealing role for the flow channel cavity structure formed by the first flow channel groove 11 and the first heat sink 21, and to effectively prevent leakage of the coolant, so that the inverter brick structure 100 can obtain a stable and good heat dissipation effect during operation and can operate stably and reliably.

[0058] In this embodiment, a first mounting groove 12 is provided in at least one of the capacitor module 10 and the first heat sink 21, and the first seal 71 is provided in the first mounting groove 12. The structure is simple, and the first seal 71 is conveniently assembled and fixed between the capacitor module 10 and the first heat sink 21. The first mounting groove 12 can limit and position the first seal 71 to a certain extent, so that the first seal 71 can be stably arranged around the outer periphery of the first flow channel groove 11, so that the capacitor module 10 and the first heat sink 21 and the first seal 71 are conveniently assembled and arranged, and the first seal 71 can be stably and reliably sealed and connected between the first heat sink 21 and the capacitor module 10.

[0059] For example, the capacitor module 10 may be provided with a first mounting groove 12, or the first heat sink 21 may be provided with a first mounting groove 12, or both the first heat sink 21 and the capacitor module 10 may be provided with a first mounting groove 12, and the first mounting groove 12 may be reasonably provided according to assembly and processing requirements.

[0060] In some embodiments of the present invention, reference Figure 5 As shown, the capacitor module 10 may include: a capacitor housing and a capacitor core, the capacitor core is arranged inside the capacitor housing, the first flow channel 11 is arranged on one side surface of the capacitor housing, and the first flow channel 11 and the capacitor core are isolated by a part of the capacitor housing.

[0061] In this embodiment, a first flow channel 11 is formed on the capacitor housing of the capacitor module 10, which has a simple structure and is easy to manufacture. The capacitor housing can well seal and protect the capacitor core, so that the capacitor module 10 can operate stably and well.

[0062] In one embodiment of the present invention, reference Figure 5 As shown, the capacitor housing can be a plastic part, which can reduce the material cost of the capacitor housing and make the capacitor housing have a good electrical insulation effect. The plastic part is easy to process and shape, which can facilitate the processing and manufacturing of the capacitor module 10.

[0063] In one embodiment of the present invention, the capacitor housing may be a plastic part, and the first heat sink 21 may be a metal part.

[0064] In this embodiment, the first heat sink 21 is set as a metal part, so that the first heat sink 21 has good thermal conductivity, so that the first heat sink 21 can have a good heat dissipation effect on the power module 30 and the capacitor module 10. For example, the first heat sink 21 can be an iron part or a copper part.

[0065] In this embodiment, the capacitor housing is made of plastic, which can provide good insulation and separation for the capacitor core and the first heat sink 21 , and enable the capacitor module 10 and the first heat sink 21 to be tightly assembled together, thereby meeting the assembly requirements of the inverter brick structure 100 .

[0066] In some embodiments of the present invention, Figure 5 As shown, the inverter brick structure 100 may further include a second heat sink 22 , which is connected to the power module 30 and arranged on a side of the power module 30 away from the first heat sink 21 .

[0067] In this embodiment, the inverter brick structure 100 is provided with a second heat sink 22, which is connected to the power module 30 and arranged on one side of the power module 30 separated from the first heat sink 21. The structure is simple. The second heat sink 22 can cooperate with the first heat sink 21 to perform heat dissipation operations on the power module 30 on both sides of the power module 30, so that the power module 30 can obtain a better heat dissipation effect, so that the power module 30 can operate more stably, and then the inverter brick structure 100 can operate more stably.

[0068] In this embodiment, the second heat sink 22 is arranged on a side of the power module 30 away from the first heat sink 21 , and the structure is simple and the arrangement is reasonable.

[0069] In one embodiment of the present invention, the first heat sink 21 and the power module 30 can be connected by welding, or a heat conductive member can be filled between the first heat sink 21 and the power module 30; the second heat sink 22 and the power module 30 can be connected by welding, or a heat conductive member can be filled between the second heat sink 22 and the power module 30.

[0070] In this embodiment, the first heat sink 21 is welded to the power module 30, which can make the first heat sink 21 and the power module 30 more securely assembled and make the heat transfer between the first heat sink 21 and the power module 30 more efficient, so that the first heat sink 21 can have a better heat dissipation effect on the power module 30.

[0071] In this embodiment, a heat conductive member is filled between the first heat sink 21 and the power module 30. The heat conductive member can play a certain connection role, so that the power module 30 can be assembled and connected with the first heat sink 21 more stably. The heat conductive member can improve the efficiency of heat transfer between the first heat sink 21 and the power module 30, so that the power module 30 can obtain a better heat dissipation effect. The connection method between the first heat sink 21 and the power module 30 can be reasonably set as needed.

[0072] In one embodiment of the present invention, the second heat sink 22 and the power module 30 may be connected by welding, or a heat conducting member may be filled between the second heat sink 22 and the power module 30 .

[0073] In this embodiment, the second heat sink 22 is welded to the power module 30, which can make the assembly of the second heat sink 22 and the power module 30 more secure and make the heat transfer between the second heat sink 22 and the power module 30 more efficient, so that the second heat sink 22 can have a better heat dissipation effect on the power module 30.

[0074] In this embodiment, a heat conductive member is filled between the second heat sink 22 and the power module 30. The heat conductive member can play a certain connection role, so that the power module 30 can be assembled and connected with the second heat sink 22 more stably. The heat conductive member can improve the efficiency of heat transfer between the second heat sink 22 and the power module 30, so that the power module 30 can obtain a better heat dissipation effect. The connection method between the second heat sink 22 and the power module 30 can be reasonably set as needed.

[0075] In one embodiment of the present invention, Figure 3-Figure 5 As shown, the first heat sink 21 may be provided with a first liquid inlet hole 201 and a first liquid outlet hole 202 connected to the first flow channel groove 11, and the second heat sink 22 may be provided with a second liquid inlet hole 203 and a second liquid outlet hole 204 penetrating the second heat sink 22 in the thickness direction of the second heat sink 22, the first liquid inlet hole 201 is connected between the second liquid inlet hole 203 and the first flow channel groove 11, and the first liquid outlet hole 202 is connected between the second liquid outlet hole 204 and the first flow channel groove 11.

[0076] In this embodiment, a first liquid inlet hole 201 and a first liquid outlet hole 202 are provided on the first heat sink 21. The first liquid inlet hole 201 and the first liquid outlet hole 202 are both connected to the first flow channel 11. When the inverter brick structure 100 is running, the coolant can enter the first flow channel 11 from the first liquid inlet hole 201, and the coolant then flows along the first flow channel 11 to exchange heat with the first heat sink 21 and the capacitor module 10. The coolant after heat exchange flows out from the first liquid outlet hole 202, so that the coolant can circulate and the power module 30 and the capacitor module 10 can obtain continuous heat dissipation and cooling.

[0077] In this embodiment, a second liquid inlet hole 203 and a second liquid outlet hole 204 are arranged on the second heat sink 22, the first liquid inlet hole 201 is connected between the second liquid inlet hole 203 and the first flow channel 11, and the first liquid outlet hole 202 is connected between the second liquid outlet hole 204 and the first flow channel 11. When the inverter brick structure 100 is in operation, the coolant can flow from the second liquid inlet hole 203 on the second heat sink 22 to the first liquid inlet hole 201 on the first heat sink 21, and the coolant then flows into the first flow channel 11. The coolant after heat exchange flows out from the first liquid outlet hole 202 to the second liquid outlet hole 204, and the coolant then flows out from the second liquid outlet hole 204.

[0078] In this embodiment, by setting the first liquid inlet hole 201 and the first liquid outlet hole 202 on the first heat sink 21, and setting the second liquid inlet hole 203 and the second liquid outlet hole 204 on the second heat sink 22, the second liquid inlet hole 203 can cooperate with the first liquid inlet hole 201 to form a flow channel structure for the coolant to flow into the first flow channel groove 11, and the second liquid outlet hole 204 can cooperate with the first liquid outlet hole 202 to form a flow channel structure for the coolant to flow out of the first flow channel groove 11, so that the coolant flow channel of the inverter brick structure 100 can be formed in the first heat sink 21 and the second heat sink 22, avoiding additional pipeline layout, greatly saving costs, and making the flow channel structure in the inverter brick structure 100 and the overall structure of the capacitor module 10, the first heat sink 21, the second heat sink 22 and the power module 30 more compact, thereby making the inverter brick structure 100 more integrated.

[0079] In some examples of the present invention, Figure 5 As shown, the inverter brick structure 100 may also include: a first support platform 211 and a second support platform 212, the first support platform 211 is arranged between the first heat dissipation plate 21 and the second heat dissipation plate 22, the first support platform 211 extends in a ring shape along the circumference of the first liquid inlet hole 201, and defines a first connecting hole connecting the first liquid inlet hole 201 and the second liquid inlet hole 203; the second support platform 212 is arranged between the first heat dissipation plate 21 and the second heat dissipation plate 22, the second support platform 212 extends in a ring shape along the circumference of the first liquid outlet hole 202, and defines a second connecting hole connecting the first liquid outlet hole 202 and the second liquid outlet hole 204.

[0080] In this embodiment, a first support platform 211 and a second support platform 212 are provided. The first support platform 211 can play a role of connecting and supporting the first heat sink 21 and the second heat sink 22, so that when the first heat sink 21 is assembled with the power module 30 and the second heat sink 22, a relatively stable gap space can be formed between the first heat sink 21 and the second heat sink 22 through the first support platform 211 and the second support platform 212, thereby avoiding the risk of excessive clamping of the power module 30 after the first heat sink 21 and the second heat sink 22 are assembled, causing damage to the power module 30, making it more convenient to assemble the power module 30 with the first heat sink 21 and the second heat sink 22.

[0081] In this embodiment, the first support platform 211 forms a first connecting hole, which is connected to the first liquid inlet hole 201 and the second liquid inlet hole 203, so that the first connecting hole can cooperate with the first liquid inlet hole 201 and the second liquid inlet hole 203 to form a good flow channel structure, so that the coolant can flow into the first flow channel groove 11 more stably.

[0082] In this embodiment, the second support platform 212 forms a second connecting hole, which is connected to the first liquid outlet hole 202 and the second liquid outlet hole 204, so that the second connecting hole can cooperate with the first liquid outlet hole 202 and the second liquid outlet hole 204 to form a good flow channel structure, so that the coolant can flow into the first flow channel groove 11 more stably.

[0083] In an example of the present invention, the first support platform 211 may be integrally formed with one of the first heat dissipation plate 21 and the second heat dissipation plate 22 .

[0084] In this embodiment, the first support platform 211 is integrally formed with one of the first heat sink 21 and the second heat sink 22, which has a simple structure and is easy to process. For example, when the first support platform 211 is integrally formed with the first heat sink 21, the first communication hole can be formed simultaneously with the first liquid inlet hole 201, and when the first support platform 211 is integrally formed with the second heat sink 22, the first communication hole can be formed simultaneously with the second liquid inlet hole 203.

[0085] In an example of the present invention, the second support platform 212 may be integrally formed with one of the first heat dissipation plate 21 and the second heat dissipation plate 22 .

[0086] In this embodiment, the second support platform 212 is integrally formed with one of the first heat sink 21 and the second heat sink 22, which has a simple structure and is easy to process. For example, when the second support platform 212 is integrally formed with the first heat sink 21, the second communication hole can be formed simultaneously with the first liquid outlet 202; when the second support platform 212 is integrally formed with the second heat sink 22, the second communication hole can be formed simultaneously with the second liquid outlet 204.

[0087] In some specific embodiments of the present invention, reference Figure 5 and Figure 7 As shown, the first support platform 211 and the second support platform 212 can both be arranged on the first heat sink 21, and the inverter brick structure 100 can also include: a second seal 72 and a third seal 73, at least one of the first support platform 211 and the second heat sink 22 is formed with a second mounting groove 2111, and the second seal 72 is arranged in the second mounting groove 2111 and is sealed between the first support platform 211 and the second heat sink 22; at least one of the second support platform 212 and the second heat sink 22 is formed with a third mounting groove, and the third seal 73 is arranged in the third mounting groove and is sealed between the second support platform 212 and the second heat sink 22.

[0088] In this embodiment, a second sealing member 72 is provided, and the second sealing member 72 is sealingly connected between the first supporting platform 211 and the second heat dissipation plate 22. Specifically, the first supporting platform 211 can be integrally formed on the first heat dissipation plate 21, and the second sealing member 72 can extend in a ring shape along the circumference of the first connecting hole. The second sealing member 72 is sealingly connected between the first supporting platform 211 and the second heat dissipation plate 22, so that when the coolant flows from the second liquid inlet hole 203 to the first liquid inlet hole 201, the second sealing member 72 can play a good sealing role, avoid leakage of the coolant, and allow the coolant to stably flow into the first flow channel groove 11.

[0089] In this embodiment, a third sealing member 73 is provided, and the third sealing member 73 is sealingly connected between the second supporting platform 212 and the second heat dissipation plate 22. Specifically, the second supporting platform 212 can be integrally formed on the first heat dissipation plate 21, and the third sealing member 73 can extend in a ring shape along the circumference of the second connecting hole. The third sealing member 73 is sealingly connected between the second supporting platform 212 and the second heat dissipation plate 22, so that in the process of the coolant flowing from the first liquid outlet 202 to the second liquid outlet 204, the third sealing member 73 can play a good sealing role, avoid leakage of the coolant, and enable the coolant to flow out of the second liquid outlet 204 stably.

[0090] In this embodiment, a second mounting groove 2111 is formed in at least one of the first support platform 211 and the second heat sink 22. The structure is simple and convenient for installing and fixing the second seal 72, so that the second seal 72 can be stably and reliably sealed and connected between the first support platform 211 and the second heat sink 22. The second mounting groove 2111 can limit and position the second seal 72 to a certain extent, so that the second seal 72 can be stably arranged between the first support platform 211 and the second heat sink 22, making it convenient and easy to assemble and arrange the second heat sink 22 and the second seal 72.

[0091] For example, the second mounting groove 2111 may be formed on the first support platform 211, or the second mounting groove 2111 may be formed on the second heat sink 22, or the second mounting groove 2111 may be provided on both the first support platform 211 and the second heat sink 22. The second mounting groove 2111 may be reasonably provided according to assembly and processing requirements.

[0092] In this embodiment, a third mounting groove is formed in at least one of the second support platform 212 and the second heat sink 22. The structure is simple and convenient for installing and fixing the third seal 73, so that the third seal 73 can be stably and reliably sealed and connected between the second support platform 212 and the second heat sink 22. The third mounting groove can limit and position the third seal 73 to a certain extent, so that the third seal 73 can be stably arranged between the second support platform 212 and the second heat sink 22, making it more convenient and easy to assemble and arrange the second heat sink 22 and the third seal 73.

[0093] For example, a third mounting groove may be formed on the second support platform 212, or a third mounting groove may be formed on the second heat sink 22, or a third mounting groove may be provided on both the second support platform 212 and the second heat sink 22. The third mounting groove may be reasonably provided according to assembly and processing requirements.

[0094] Of course, in other embodiments, when the first support platform 211 and the second support platform 212 are both arranged on the second heat dissipation plate 22, the second seal 72 can be correspondingly sealed and connected between the first support platform 211 and the first heat dissipation plate 21, and the third seal 73 can be correspondingly sealed and connected between the second support platform 212 and the first heat dissipation plate 21.

[0095] When the first support platform 211 and the second support platform 212 are respectively arranged on the first heat dissipation plate 21 and the second heat dissipation plate 22, for example, the first support platform 211 is arranged on the first heat dissipation plate 21 and the second support platform 212 is arranged on the second heat dissipation plate 22, then the second seal 72 can be sealed between the first support platform 211 and the second heat dissipation plate 22, and the third seal 73 can be sealed between the second support platform 212 and the first heat dissipation plate 21, or the first support platform 211 is arranged on the second heat dissipation plate 22 and the second support platform 212 is arranged on the first heat dissipation plate 21, then the second seal 72 can be sealed between the first support platform 211 and the first heat dissipation plate 21, and the third seal 73 can be sealed between the second support platform 212 and the second heat dissipation plate 22. The second seal 72 and the third seal 73 can be adjusted accordingly according to the arrangement of the first support platform 211 and the second support platform 212 on the first heat dissipation plate 21 and the second heat dissipation plate 22 to meet the sealing requirements.

[0096] In some examples of the present invention, Figure 3 and Figure 8 As shown, the inverter brick structure 100 can also include a substrate 60, on which a second flow channel 61 is provided, a second heat dissipation plate 22 covers the opening of the second flow channel 61, the second liquid inlet 203 and the second liquid outlet 204 are both connected to the second flow channel 61, and a liquid inlet 601 and a liquid outlet 602 are formed at the bottom of the second flow channel 61.

[0097] In this embodiment, a substrate 60 is provided, and a second flow channel groove 61 is provided on the substrate 60. The second heat sink 22 covers the opening of the second flow channel groove 61, so that the second flow channel groove 61 of the second heat sink 22 can cooperate with the second heat sink 22 to form a flow channel cavity structure. The coolant can flow in the second flow channel groove 61, so that the power module 30 can obtain better cooling and heat dissipation effect on the side with the second heat sink 22.

[0098] In this embodiment, the second flow channel groove 61 is connected with the second liquid inlet hole 203 and the second liquid outlet hole 204, and the bottom of the second flow channel groove 61 is formed with a liquid inlet 601 and a liquid outlet 602. When the inverter brick structure 100 is in operation, the coolant can flow into the second flow channel groove 61 from the liquid inlet 601, and then a part of the coolant flows along the second flow channel groove 61 and flows out from the liquid outlet 602, and the other part of the coolant flows from the second liquid inlet hole 203 through the first liquid inlet hole 201 into the first flow channel groove 11. The coolant flows in the first flow channel groove 11 and flows back to the second flow channel groove 61 from the first liquid outlet hole 202 through the second liquid outlet hole 204. The coolant flowing into the second flow channel groove 61 from the second liquid outlet hole 204 flows out from the liquid outlet 602 together with the coolant in the second flow channel groove 61, so that the coolant can perform heat dissipation and cooling operations on both sides of the power module 30.

[0099] In this embodiment, a second flow channel 61 is provided on the substrate 60, and the second heat sink 22 covers the opening of the second flow channel 61. The structure is simple and the arrangement is compact, so that the power module 30 can obtain a better heat dissipation effect, thereby making the inverter brick structure 100 operate more stably.

[0100] In this embodiment, a liquid inlet 601 and a liquid outlet 602 are arranged in the second flow channel groove 61, and the liquid inlet 601 and the liquid outlet 602 are respectively connected to the second liquid inlet hole 203 and the second liquid outlet hole 204, which can facilitate the inflow and outflow of the cooling liquid, and has a simple structure and reasonable layout.

[0101] In one example of the present invention, reference Figure 3 and Figure 8 As shown, at least one of the substrate 60 and the second heat sink 22 may be provided with a fourth mounting groove, and the fourth mounting groove extends in a ring shape along the circumference of the second flow channel groove 61. The inverter brick structure 100 may also include: a fourth seal 74, the fourth seal 74 is arranged in the fourth mounting groove, and the fourth seal 74 is sealed and connected between the substrate 60 and the second heat sink 22.

[0102] In this embodiment, a fourth sealing member 74 is provided to seal between the substrate 60 and the second heat sink 22, which can play a good sealing role on the flow channel cavity structure formed by the second flow channel groove 61 and the second heat sink 22, and effectively prevent the leakage of the coolant, so that the inverter brick structure 100 can obtain a stable and good heat dissipation effect during operation and can operate stably and reliably.

[0103] In this embodiment, a fourth mounting groove is set in at least one of the substrate 60 and the second heat sink 22, and the fourth seal 74 is set in the fourth mounting groove. The structure is simple, which facilitates the assembly and fixation of the fourth seal 74 between the substrate 60 and the second heat sink 22. The fourth mounting groove can play a role of limiting and positioning the fourth seal 74 to a certain extent, so that the fourth seal 74 can be stably arranged around the outer periphery of the second flow channel groove 61, so that the substrate 60 and the second heat sink 22 and the fourth seal 74 are more convenient and easy to assemble and arrange, and the fourth seal 74 can be stably and reliably sealed and connected between the second heat sink 22 and the substrate 60.

[0104] For example, a fourth mounting groove may be provided on the substrate 60, or on the second heat sink 22, or on both the second heat sink 22 and the substrate 60. The fourth mounting groove may be reasonably provided according to assembly and processing requirements.

[0105] In some embodiments of the present invention, Figure 7 As shown, a plurality of fin columns 205 may be arranged in an array on a side of the first heat sink 21 facing away from the power module 30 , and the fin columns 205 extend into the first flow channel groove 11 .

[0106] In this embodiment, a plurality of fin columns 205 are arranged on the first heat sink 21, which can further improve the heat exchange efficiency of the first heat sink 21, so that the power module 30 can obtain a better heat dissipation effect. The fin columns 205 extend into the first flow channel groove 11, which can make the capacitor module 10 and the first heat sink 21 more compact during assembly, thereby making the overall integration of the inverter brick structure 100 higher.

[0107] In some embodiments of the present invention, Figure 5 As shown, a plurality of fin columns 205 may be arranged in an array on a side of the second heat sink 22 facing away from the power module 30 , and the fin columns 205 extend into the second flow channel groove 61 .

[0108] In this embodiment, a plurality of fin columns 205 are arranged on the second heat sink 22, which can further improve the heat exchange efficiency of the second heat sink 22, so that the power module 30 can obtain a better heat dissipation effect. The fin columns 205 extend into the second flow channel groove 61, which can make the base plate 60 and the second heat sink 22 more compact during assembly, thereby making the overall integration of the inverter brick structure 100 higher.

[0109] In some embodiments of the present invention, Figure 5 As shown, the inverter brick structure 100 may further include a circuit board 40, which is disposed on the capacitor module 10 in the first direction (eg Figure 5 The circuit board 40 is mounted on the capacitor module 10 (in the left-right direction as shown).

[0110] In this embodiment, the circuit board 40 is arranged on one side of the capacitor module 10 in the first direction and installed on the capacitor module 10. It has a simple structure and a compact layout, which can well meet the modular design requirements and make the inverter brick structure 100 have a better integration effect as a whole.

[0111] In one embodiment of the present invention, Figure 5 As shown, two circuit boards 40 may be provided, and the two circuit boards 40 are respectively arranged on both sides of the capacitor module 10 in the first direction, and the circuit boards 40 are firmly connected to the capacitor module 10 .

[0112] In this embodiment, two circuit boards 40 are provided to meet the needs of the operation of the inverter brick structure 100. The two circuit boards 40 are respectively arranged on both sides of the capacitor module 10 in the first direction. The structure is simple and the arrangement is convenient and reasonable. The circuit boards 40 are firmly connected to the capacitor module 10 for easy assembly and disassembly, making the processing and manufacturing of the inverter brick structure 100 more convenient and the subsequent maintenance more convenient and easy.

[0113] In some embodiments of the present invention, reference Figure 5 As shown, the capacitor module 10 may include a capacitor housing, and the inverter brick structure 100 may further include a three-phase copper busbar 50 , and the three-phase copper busbar 50 is fixedly connected to the capacitor housing.

[0114] In this embodiment, the three-phase copper bar 50 is fixedly connected to the capacitor housing, which has a simple structure and is easy to assemble. For example, the three-phase copper bar 50 can be fixed to the capacitor housing by fasteners, or the three-phase copper bar 50 can be fixedly connected to the capacitor housing by riveting, clamping, etc.

[0115] In one embodiment of the present invention, the three-phase copper busbar 50 can be integrated with the capacitor housing. This can reduce the raw materials for the three-phase copper busbar 50 to be separately injection molded, and save the cost of parts when fasteners and other connecting parts are fixed to the capacitor housing, reduce the assembly process of the three-phase copper busbar 50, and make the inverter brick structure 100 more efficient and cost-effective to produce.

[0116] In one embodiment of the present invention, both the first heat dissipation plate 21 and the second heat dissipation plate 22 may be tightly connected to the capacitor housing of the capacitor module 10 .

[0117] In this embodiment, the first heat sink 21 and the second heat sink 22 are fastened to the capacitor housing of the capacitor module 10, so that the first heat sink 21, the second heat sink 22, the capacitor module 10 and the power module 30 are more compact as a whole. The first heat sink 21, the second heat sink 22, the power module 30, the capacitor module 10 and the circuit board 40 form a compactly arranged whole after assembly, so that the inverter brick structure 100 is more compact as a whole and has a higher degree of integration. To a certain extent, the overall volume of the inverter brick structure 100 is smaller, so that the inverter brick structure 100 can be installed and fixed as a whole when assembled with other external structures, thereby reducing the number of parts required for assembly and making it more convenient to assemble the inverter brick structure 100 with the external structure.

[0118] Reference below Figure 1-Figure 8 A motor controller according to an embodiment of the second aspect of the present invention is described.

[0119] like Figure 1-Figure 8 As shown, the motor controller according to the embodiment of the present invention includes: a box and an inverter brick structure 100 according to the first embodiment of the present invention.

[0120] Other structures and operations of the motor controller according to the embodiment of the present invention are known to those skilled in the art and will not be described in detail here.

[0121] According to the motor controller of the embodiment of the present invention, by setting the inverter brick structure 100 of the first embodiment mentioned above, by setting the first flow channel 11 on the capacitor module 10, the first heat sink 21 covers the opening of the first flow channel 11, and the power module 30 is set on the side of the first heat sink 21 away from the capacitor module 10 and is connected to the first heat sink 21. It has a simple structure, compact layout, high heat dissipation efficiency, can greatly reduce the use of components, reduce costs, and make the overall structure of the inverter brick structure 100 more integrated.

[0122] In some embodiments of the present invention, reference Figure 1 As shown, the inverter brick structure 100 may include a base plate 60 , and the base plate 60 is configured as a part of a box, or the base plate 60 is disposed in the box.

[0123] In this embodiment, the base plate 60 is formed as a part of the box body, which has a simple structure and can further reduce the number of components in the inverter brick structure 100, making the overall structure of the inverter brick structure 100 more compact and more integrated.

[0124] In this embodiment, the base plate 60 is disposed in the box, which can facilitate the assembly and fixation of the inverter brick structure 100 in the box.

[0125] Reference below Figure 1-Figure 8A powertrain according to an embodiment of a third aspect of the present invention is described.

[0126] like Figure 1-Figure 8 As shown, the powertrain according to an embodiment of the present invention includes a motor controller according to an embodiment of the second aspect of the present invention.

[0127] Other components and operations of the powertrain according to the embodiment of the present invention are known to those skilled in the art and will not be described in detail here.

[0128] According to the powertrain of an embodiment of the present invention, by setting the motor controller of the above-mentioned second aspect embodiment, by setting the first flow channel groove 11 on the capacitor module 10, the first heat sink 21 covers the opening of the first flow channel groove 11, and the power module 30 is set on the side of the first heat sink 21 away from the capacitor module 10 and is connected to the first heat sink 21. It has a simple structure, compact layout, high heat dissipation efficiency, can greatly reduce the use of components, reduce costs, and make the overall structure of the inverter brick structure 100 more integrated.

[0129] Reference below Figure 1-Figure 8 A vehicle according to an embodiment of a fourth aspect of the present invention is described.

[0130] like Figure 1-Figure 8 As shown, a vehicle according to an embodiment of the present invention includes a powertrain according to an embodiment of the third aspect of the present invention.

[0131] Other components and operations of the vehicle according to the embodiment of the present invention are known to those skilled in the art and will not be described in detail here.

[0132] According to the vehicle of the embodiment of the present invention, by setting the powertrain of the third aspect embodiment mentioned above, by setting the first flow channel groove 11 on the capacitor module 10, the first heat sink 21 covers the opening of the first flow channel groove 11, and the power module 30 is set on the side of the first heat sink 21 away from the capacitor module 10 and is connected to the first heat sink 21. It has a simple structure, compact layout, high heat dissipation efficiency, can greatly reduce the use of parts and components, reduce costs, and make the overall structure of the inverter brick structure 100 more integrated.

[0133] The following will refer to Figure 1-Figure 8 A vehicle according to a specific embodiment of the present invention is described.

[0134] like Figure 1-Figure 8 As shown, the vehicle includes a powertrain having a motor controller, the motor controller includes a housing and an inverter brick structure 100 , and a portion of the housing is formed as a base plate 60 .

[0135] The substrate 60 is provided with a second flow channel groove 61 and a fourth mounting groove. The second flow channel groove 61 is arranged along the second direction (eg Figure 1 The second flow channel groove 61 is connected to the liquid supply pipeline of an external liquid supply device so that the second flow channel groove 61 is connected in series in the liquid supply pipeline.

[0136] The inverter brick structure 100 includes a capacitor module 10, a first heat sink 21, a second heat sink 22, a power module 30, a circuit board 40, a three-phase copper bus 50, a first seal 71, a second seal 72, a third seal 73 and a fourth seal 74. The capacitor module 10 includes a capacitor housing, on which a first flow channel groove 11 and a first mounting groove 12 are formed. The first flow channel groove 11 is arranged at the capacitor module 10 in the third direction (such as Figure 1 The capacitor module 10 further comprises a capacitor copper bar, which is electrically connected to the power module 30, a three-phase copper bar 50, and a circuit board 40. Specifically, the terminals of the power module 30 can be electrically connected to the three-phase copper bar 50 and the capacitor copper bar by screw fixing or laser welding. The three-phase copper bar 50 and the capacitor housing are formed into an integral part by injection molding.

[0137] The power module 30 can be a single-tube power module 30, a half-bridge power module 30, and a full-bridge power module 30. The first heat sink 21 and the second heat sink 22 are stacked in the third direction, the power module 30 is arranged between the first heat sink 21 and the second heat sink 22, and a heat conductor is arranged between the power module 30 and the first heat sink 21 and the second heat sink 22. The heat conductor is a thermal grease, which is coated between the first heat sink 21 and the power module 30 and between the second heat sink 22 and the power module 30.

[0138] The first heat sink 21 is provided with a first liquid inlet hole 201 and a first liquid outlet hole 202, which are arranged at two ends of the first heat sink 21 in the second direction. The second heat sink 22 is provided with a second liquid inlet hole 203 and a second liquid outlet hole 204, which are arranged at two ends of the second heat sink 22 in the second direction. A first support platform 211 is provided at the first liquid inlet hole 201, and the first support platform 211 is annular and formed on the first heat sink 2 1, the first support platform 211 is formed with a first communication hole communicating with the first liquid inlet hole 201, the end surface of the second support platform 212 faces the second heat dissipation plate 22 and is formed with a second mounting groove 2111, the second support platform 212 is arranged at the first liquid outlet hole 202, the second support platform 212 is annular and is formed on the first heat dissipation plate 21, the second support platform 212 is formed with a second communication hole communicating with the first liquid outlet hole 202, the end surface of the second support platform 212 faces the second heat dissipation plate 22 and is formed with a third mounting groove.

[0139] The second sealing member 72 is a sealing ring, which is disposed in the second mounting groove 2111 and is sealed to the second heat sink 22 . The third sealing member 73 is a sealing ring, which is disposed in the third mounting groove and is sealed to the second heat sink 22 .

[0140] The substrate 60 is provided with a fourth mounting groove, which extends in a ring shape along the periphery of the second flow channel groove 61 . The fourth sealing member 74 is a sealing ring and is disposed in the fourth mounting groove. The fourth sealing member 74 is sealed and connected between the substrate 60 and the second heat dissipation plate 22 .

[0141] The first heat sink 21 and the second heat sink 22 are both provided with fin columns 205, and the fin columns 205 are multiple and arranged in an array on the side of the first heat sink 21 away from the power module 30 and the side of the second heat sink 22 away from the power module 30. The first heat sink 21 and the second heat sink 22 are fixed to the capacitor housing of the capacitor module 10 by fasteners. For example, a mounting boss may be formed on the second heat sink 22, and the mounting boss is provided with a mounting hole. The first heat sink 21 is correspondingly provided with a matching mounting hole. The fasteners can pass through the matching mounting hole and the mounting hole to fix the first heat sink 21 and the second heat sink 22 to the capacitor module 10.

[0142] Two circuit boards 40 are provided, and the two circuit boards 40 are respectively arranged on both sides of the capacitor module 10 in the first direction and are fastened to the capacitor module 10. Exemplarily, the capacitor housing of the capacitor module 10 may be formed with a connecting boss, which protrudes away from the capacitor module 10 along the first direction, and the circuit board 40 is fastened to the connecting boss, which can facilitate the heat dissipation of the circuit board 40.

[0143] When the inverter brick structure 100 is assembled, the first heat sink 21 and the second heat sink 22 are connected to the power module 30 through thermal grease, the second seal 72 and the third seal 73 are respectively arranged in the second mounting groove 2111 and the third mounting groove, the first seal 71 is assembled in the first mounting groove 12, the first heat sink 21, the second heat sink 22 and the power module 30 can be fixed as a whole to the corresponding position of the capacitor module 10 by fasteners and cooperate with the first flow channel groove 11 to form a flow channel cavity structure, the two circuit boards 40 are fixed to the capacitor module 10 by fasteners, the fourth seal 74 is arranged in the fourth mounting groove, the capacitor module 10 and the first heat sink 21, the second heat sink 22, etc. are fixed as a whole to the corresponding position of the substrate 60, thereby completing the assembly of the inverter brick structure 100.

[0144] In this embodiment, the first flow channel groove 11 is arranged on the capacitor module 10, the first heat sink 21 covers the opening of the first flow channel groove 11, and the power module 30 is arranged on the side of the first heat sink 21 away from the capacitor module 10 and connected to the first heat sink 21. The structure is simple, the layout is compact, and the heat dissipation efficiency is high. The use of parts can be well reduced, the cost can be reduced, and the overall structure of the inverter brick structure 100 can be more integrated. The first heat sink 21, the second heat sink 22, the circuit board 40, the power module 30 and the three-phase copper bus 50 in this embodiment are all assembled and fixed with the capacitor housing of the capacitor module 10, and can be packaged as a whole, with a high degree of integration, less space occupied in the motor controller, and the space utilization rate of the motor controller can be improved, so that the inverter brick structure 100 can be assembled into the motor controller more conveniently and easy to disassemble and repair, and the assembly efficiency is high.

[0145] In another embodiment of the present invention, the substrate 60 may also be provided separately and become a part of the inverter brick structure 100, so that the flow channel structure of the inverter brick structure 100 is more complete and the overall structure can better meet the modular design requirements.

[0146] In another embodiment of the present invention, the number of power modules 30 can be set to multiple, multiple power modules 30 are stacked, multiple groups of first heat sinks 21 and second heat sinks 22 are correspondingly arranged, and a flow channel plate can be arranged between adjacent first heat sinks 21 and second heat sinks 22. The flow channel plate can form a flow channel groove structure to cooperate with the first heat sink 21 or the second heat sink 22 to form a flow channel, thereby realizing water cooling of each power module 30, or a flow channel groove structure can be formed on the first heat sink 21 and the second heat sink 22, so that two adjacent first heat sinks 21 and second heat sinks 22 can cooperate to form a flow channel cavity structure to meet the cooling needs of multiple power modules 30. In this embodiment, multiple power modules 30 are arranged, so that the inverter brick structure 100 can meet the needs of more usage scenarios, thereby expanding the application scenarios of the inverter brick structure 100 of this embodiment.

[0147] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0148] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0149] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0150] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0151] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. An inverter brick structure, characterized in that: include: A capacitor module, the capacitor module comprising a capacitor housing, a first flow channel groove being formed on a side surface of the capacitor housing; A first heat sink, the first heat sink is mounted on one side of the capacitor module, and the first heat sink covers the opening of the first flow channel; A power module, the power module is disposed on a side of the first heat sink facing away from the capacitor module and connected to the first heat sink; A second heat sink, the second heat sink is connected to the power module and is arranged on a side of the power module away from the first heat sink, and the second heat sink, the power module and the first heat sink are stacked along a thickness direction of the first heat sink; The first heat sink is provided with a first liquid inlet hole and a first liquid outlet hole communicating with the first flow channel groove, the second heat sink is provided with a second liquid inlet hole and a second liquid outlet hole penetrating the second heat sink in the thickness direction of the second heat sink, the first liquid inlet hole is communicated between the second liquid inlet hole and the first flow channel groove, and the first liquid outlet hole is communicated between the second liquid outlet hole and the first flow channel groove; A substrate is provided with a second flow channel groove, the second heat dissipation plate cover is arranged at the opening of the second flow channel groove, the second liquid inlet hole and the second liquid outlet hole are both connected to the second flow channel groove, and the bottom of the second flow channel groove is formed with a liquid inlet and a liquid outlet.

2. The inverter brick structure according to claim 1, characterized in that: At least one of the capacitor module and the first heat sink is provided with a first mounting groove, and the first mounting groove extends in a ring shape along the circumference of the first flow channel groove. The inverter brick structure also includes: a first seal, which is provided in the first mounting groove and connected between the capacitor module and the first heat sink.

3. The inverter brick structure according to claim 1, characterized in that: The capacitor module further includes a capacitor core, which is disposed inside the capacitor housing, and the first flow channel groove and the capacitor core are isolated from each other by a portion of the capacitor housing.

4. The inverter brick structure according to claim 3, characterized in that: The capacitor housing is a plastic part.

5. The inverter brick structure according to claim 3, characterized in that: The capacitor housing is a plastic part, and the first heat sink is a metal part.

6. The inverter brick structure according to claim 1, characterized in that: The first heat sink is connected to the power module by welding, or a heat conducting member is filled between the first heat sink and the power module; The second heat sink is connected to the power module by welding, or a heat conducting member is filled between the second heat sink and the power module.

7. The inverter brick structure according to claim 1, characterized in that: Also includes: A first support platform, the first support platform is arranged between the first heat dissipation plate and the second heat dissipation plate, the first support platform extends in a ring shape along the periphery of the first liquid inlet hole, and defines a first connecting hole connecting the first liquid inlet hole and the second liquid inlet hole; The second support platform is arranged between the first heat dissipation plate and the second heat dissipation plate, the second support platform extends in a ring shape along the periphery of the first liquid outlet hole, and defines a second connecting hole connecting the first liquid outlet hole and the second liquid outlet hole.

8. The inverter brick structure according to claim 7, characterized in that: The first support platform is integrally formed with one of the first heat sink and the second heat sink; The second support platform is integrally formed with one of the first heat sink and the second heat sink.

9. The inverter brick structure according to claim 8, characterized in that: At least one of the substrate and the second heat sink is provided with a fourth mounting groove, and the fourth mounting groove extends in a ring shape along the circumference of the second flow channel groove. The inverter brick structure also includes: a fourth seal, which is provided in the fourth mounting groove and is sealed between the substrate and the second heat sink.

10. The inverter brick structure according to claim 1, characterized in that: It also includes a circuit board, which is arranged on one side of the capacitor module in the first direction and is mounted on the capacitor module.

11. The inverter brick structure according to claim 1, characterized in that: The capacitor module includes a capacitor housing, and the inverter brick structure also includes a three-phase copper busbar, which is fixedly connected to the capacitor housing.

12. A motor controller, characterized in that: include: A box and an inverter brick structure according to any one of claims 1 to 11, wherein the inverter brick structure is mounted on the box.

13. The motor controller according to claim 12, characterized in that: The inverter brick structure includes a substrate, and the substrate is constructed as a part of the box, or the substrate is arranged in the box.

14. A powertrain, characterized in that: Includes the motor controller as claimed in claim 12.

15. A vehicle, characterized in that: Includes the powertrain as described in claim 14.

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