A silicon wafer boxing machine and a boxing method thereof

Abstract

The application discloses a silicon wafer boxing machine and a boxing method thereof, and belongs to the technical field of silicon wafer boxing, which comprises a stacking part, the stacking part comprising a first buffer position, a second buffer position and a circulating line, the first buffer position buffering a plurality of specifications of silicon wafers, the second buffer position buffering a plurality of specifications of separators, and the circulating line continuously and circularly conveying the silicon wafers in the stacking process; a boxing part, the boxing part comprising a box body, a transfer module and a feeding module, the box body being provided with cavities for accommodating the silicon wafers, the transfer module moving the stacked silicon wafers into the cavities, and the feeding module compressing the thickness of the stacked silicon wafers to be equal to the silicon wafer boxing thickness of the box body; and a conveying part, the conveying part comprising a conveying line body and a turnover module. The application realizes automatic boxing processing of the stacked silicon wafers, does not need manual operation, improves the efficiency, guarantees the boxing precision of the silicon wafers, and avoids the influence of manual operation on the silicon wafers.

Description

Technical Field

[0001] This invention belongs to the field of silicon wafer packaging technology, and particularly relates to a silicon wafer packaging machine and its packaging method. Background Technology

[0002] Silicon crystal photovoltaic (PV) technology is currently the most widely used photovoltaic technology. Its cells use silicon as the main material and are made of monocrystalline or polycrystalline silicon. Silicon crystal PV offers advantages such as high efficiency, stability, and reliability, but its production cost is high. Thin-film solar cells mainly use materials such as amorphous silicon, copper indium gallium selenide (CIGS), and organic materials, and are characterized by light weight, low production cost, and high flexibility, but their efficiency is relatively lower than that of silicon crystal PV. Polycrystalline silicon PV uses high-purity silicon microcrystalline crystals, comparable to ordinary silicon crystal cells, but its manufacturing process is more advanced than that of silicon crystal PV technology. Silicon ingots are a commonly used type of silicon crystal.

[0003] After silicon ingots are sliced, silicon wafers are formed. To ensure stable transportation of the wafers, they need to be packaged, stacked, and boxed. Since silicon wafers are fragile, spacers need to be placed between adjacent wafers during the packaging and stacking process to protect them. After stacking, the wafers also need to be boxed. The above operations present the following problems:

[0004] 1. Currently, the packaging and stacking of silicon wafers is often done manually. Operators need to stack the silicon wafers and place spacers between adjacent wafers. Therefore, manual operation is prone to problems such as mixing, fragmentation, missed detection, contamination and low efficiency, which greatly affects the packaging and stacking of silicon wafers.

[0005] 2. Currently, the packaging of stacked silicon wafers is often done using robotic arms. Traditional robotic arms perform vertical packaging, meaning they grip the stacked silicon wafers and, despite their weight, insert them into the packaging box. However, in practice, due to the significant mass of the silicon wafers, the robotic arm needs to apply considerable pressure to securely pack them into the box. This pressure can easily damage the wafers, potentially causing breakage. Furthermore, since the silicon wafers to be packaged are stacked in multiple layers, adjacent wafers... Because there are separators between the wafers, when the robotic arm picks up the stacked silicon wafers, it usually only picks up one end of the wafer to ensure that the wafer is successfully boxed, and then puts the other end into the box to complete the boxing operation. When the robotic arm picks up one end of the silicon wafer, the other end of the wafer usually warps due to the presence of the separators. The size of the box is often a standard size (usually an integer multiple of the thickness of the silicon wafer), so this warping will affect the boxing process. Forcing the boxing will damage the box and cause the boxing to fail. Summary of the Invention

[0006] This invention overcomes the shortcomings of the prior art by providing a silicon wafer casing machine and its casing method to solve the problems existing in the prior art.

[0007] To achieve the above objectives, the technical solution adopted by the present invention is: a silicon wafer casing machine, comprising...

[0008] The stacking section inserts spacers between adjacent silicon wafers. The stacking section includes a first buffer bit, a second buffer bit, and a circulation line. The first buffer bit buffers silicon wafers of several sizes, the second buffer bit buffers spacers of several sizes, and the circulation line continuously circulates the silicon wafers during the stacking process.

[0009] The packaging section includes a box body, a transfer module, and a feeding module. The box body has a cavity for accommodating silicon wafers. The transfer module moves the stacked silicon wafers into the cavity. The feeding module presses the thickness of the stacked silicon wafers to be equal to the thickness of the silicon wafer packaging in the box body, and cooperates with the transfer module to feed the stacked silicon wafers into the cavity.

[0010] The conveying unit includes a conveyor line and a flipping module. The conveyor line conveys the box. When the box is conveyed to the position of the flipping module, the flipping module flips the box so that the cavity is laterally open.

[0011] In a preferred embodiment of the present invention, a first truss module is provided between the first cache bit and the circulation line, the first truss module moves the silicon wafer from the first cache bit into the circulation line, and a second truss module is provided between the second cache bit and the circulation line, the second truss module moves the separator from the second cache bit into the circulation line.

[0012] In a preferred embodiment of the present invention, a plurality of carriers are provided on the circulation line, and the carriers move along the circulation direction of the circulation line. The first truss module and the second truss module respectively place the silicon wafers and the separators into the carriers.

[0013] In a preferred embodiment of the present invention, the feeding module includes an upper pressure roller and a lower pressure roller. The upper pressure roller is located above the cavity and squeezes the stacked silicon wafers to compress the thickness of the stacked silicon wafers to be equal to the thickness of the silicon wafers in the box. The lower pressure roller is located below the cavity and guides the packaged silicon wafers.

[0014] In a preferred embodiment of the present invention, the flipping module includes a flipping motor, a flipping frame located at the rotating shaft end of the flipping motor, a positioning cylinder disposed on the flipping frame, and a positioning block located at the piston rod end of the positioning cylinder. A fixing block is disposed on the flipping frame, and the fixing block and the positioning block are disposed opposite to each other. The positioning cylinder drives the positioning block to move closer to the fixing block to position the box located between the positioning block and the fixing block.

[0015] In a preferred embodiment of the present invention, a positioning piece is provided at the end of the fixing block, and the positioning piece, the fixing block, and the positioning block form a cavity for positioning the box body.

[0016] In a preferred embodiment of the present invention, the flipping frame is embedded in the conveyor line. When the box is conveyed into the flipping frame, the flipping motor drives the flipping frame to flip, so that the cavity opening of the box is a lateral opening.

[0017] In a preferred embodiment of the present invention, a limiting module is provided on the flipping frame. The limiting module includes a limiting cylinder, a clamping cylinder located at the piston rod end of the limiting cylinder, and a limiting block located on the clamping cylinder. The clamping cylinder drives the limiting block to limit the silicon wafer loaded into the box.

[0018] This invention also discloses a wafer casing machine method, comprising the following steps:

[0019] S1. The first truss module places the silicon wafer located in the first cache position into the carrier of the circulation line, and the second truss module places the separator located in the second cache position into the carrier of the circulation line. The placement of the silicon wafer and the placement of the separator are carried out alternately until the silicon wafer stacking is completed.

[0020] S2. The transfer module of the packaging section picks up the stacked silicon wafers and waits to package them;

[0021] S3. The conveyor line of the conveyor unit conveys the box to the flipping module, where the flipping module flips the box so that the cavity of the box is laterally open.

[0022] S4. The feeding module presses the thickness of the stacked silicon wafers to be equal to the thickness of the silicon wafers in the box, and the transfer module stably sends the stacked silicon wafers after gripping them into the cavity of the box.

[0023] S5. The flipping module is reset, causing the box to flip and fall into the conveyor line, completing the boxing and conveying process.

[0024] In a preferred embodiment of the present invention, the second buffer position includes a tracing paper buffer position, a pearl cotton buffer position, and a hollow board buffer position, wherein the tracing paper, pearl cotton, and hollow board are alternately placed into the carrier under the action of the second truss module.

[0025] This invention addresses the shortcomings of the prior art and has the following beneficial effects:

[0026] (1) The present invention can stack silicon wafers quickly and efficiently. In the actual stacking process, there will be no mixing, fragmentation, or contamination, which effectively reduces the labor intensity of workers and improves the efficiency of subsequent silicon wafer packaging.

[0027] (2) The cartoning machine of the present invention realizes the automated cartoning process after silicon wafer stacking, without the need for manual operation, which improves efficiency while ensuring the cartoning accuracy of silicon wafers and avoids the impact of manual operation on silicon wafers.

[0028] (3) The packaging section of the present invention uses a horizontal packaging method to package the stacked silicon wafers. Compared with the traditional vertical packaging method, the horizontal packaging method does not need to overcome the weight of the silicon wafers for packaging, which can effectively avoid the damage of the silicon wafers under the vertical packaging method and ensure the quality of the silicon wafers.

[0029] (4) The upper pressure roller of the feeding module can press down on the stacked silicon wafers so that the thickness of the stacked silicon wafers is equal to the thickness of the silicon wafers in the box. This effectively avoids the occurrence of warping, ensures that the silicon wafers can be stably boxed, improves the boxing accuracy of the silicon wafers, and also effectively avoids damage to the box. The lower pressure roller of the feeding module can guide the silicon wafers into the box, so that the silicon wafers are smoothly loaded into the box. Attached Figure Description

[0030] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0031] Figure 1 This is a schematic diagram of the overall structure of the first embodiment of the present invention;

[0032] Figure 2 This is a schematic diagram of the structure of the loop line in the first embodiment of the present invention;

[0033] Figure 3 This is a schematic diagram of the transfer module according to the first embodiment of the present invention;

[0034] Figure 4 This is a schematic diagram illustrating the cooperation between the feeding module and the flipping module in the first embodiment of the present invention;

[0035] Figure 5 This is a schematic diagram of the structure of the flip module according to the first embodiment of the present invention;

[0036] Figure 6 This is a schematic diagram of the structure of the first truss module according to the first embodiment of the present invention;

[0037] Figure 7 This is a schematic diagram of the structure of the second truss module in the first embodiment of the present invention;

[0038] Figure 8 This is a schematic diagram of the limiting module according to the first embodiment of the present invention;

[0039] Figure 9 This is a schematic diagram of the detection module according to the first embodiment of the present invention;

[0040] Figure 10 This is a schematic diagram of the material feeding module according to the first embodiment of the present invention;

[0041] Figure 11 This is a schematic diagram of the structure of the capping module according to the first embodiment of the present invention;

[0042] Figure 12 This is a schematic diagram of the labeling module according to the first embodiment of the present invention;

[0043] Figure 13 This is a schematic diagram of the structure of the sealing tape module according to the first embodiment of the present invention;

[0044] Figure 14 This is a flowchart of the second embodiment of the present invention;

[0045] In the diagram: 10. Stacking section; 11. First buffer position; 12. Second buffer position; 13. Circulation line; 131. Carrier; 20. Boxing section; 21. Box body; 22. Transfer module; 221. Transfer gripper; 23. Feeding module; 231. Upper pressure roller; 232. Lower pressure roller; 233. Upper drive cylinder; 30. Conveying section; 31. Conveying line; 32. Tilting module; 321. Tilting motor; 322. Tilting frame; 323. Positioning cylinder; 324. Positioning block; 40. First truss Frame module; 41. First gripper; 50. Second truss module; 51. Second gripper; 60. Fixing block; 61. Positioning piece; 70. Limiting module; 71. Limiting cylinder; 72. Clamping cylinder; 73. Limiting block; 80. Detection module; 81. Detection camera; 90. Unloading module; 91. Unloading gripper; 100. Sealing module; 101. Sealing gripper; 110. Labeling module; 111. Labeling machine; 112. Labeling head; 120. Sealing tape module; 121. Tape roll. Detailed Implementation

[0046] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention.

[0047] Example 1

[0048] This embodiment provides a silicon wafer casing machine that can rapidly stack silicon wafers with high stacking efficiency. During the actual stacking process, there are no issues such as mixing, fragmentation, or contamination, effectively reducing the labor intensity of workers and improving the subsequent wafer casing efficiency. Furthermore, this casing machine uses a horizontal casing method to cascade the stacked silicon wafers. Compared to the traditional vertical casing method, the horizontal casing method does not require overcoming the weight of the silicon wafers during casing, effectively avoiding damage that occurs with the vertical casing method and ensuring the quality of the silicon wafers.

[0049] like Figure 1 As shown, the silicon wafer casing machine of this embodiment includes a stacking section 10, a casing section 20, and a conveying section 30. The stacking section 10 stacks silicon wafers, placing hollow plates at both ends of the stacked silicon wafers, and placing tracing paper and pearl cotton between adjacent silicon wafers to protect them. The casing section 20 can case the stacked silicon wafers, while the conveying section 30 conveys the empty cassette 21 and the cased silicon wafers.

[0050] Combination Figure 1 and Figure 2 As shown, the stacking section 10 inserts separators between adjacent silicon wafers. In this embodiment, the separators are hollow plates, tracing paper, and pearl cotton. The stacking section 10 includes a first buffer position 11, a second buffer position 12, and a circulation line 13. The first buffer position 11 buffers silicon wafers of several specifications, and the second buffer position 12 buffers separators of several specifications. The circulation line 13 continuously circulates and transports the silicon wafers during the stacking process. Several carriers 131 are provided on the circulation line 13, and the carriers 131 move along the circulation direction of the circulation line 13. In this embodiment, the second buffer position 12 buffers hollow plates, tracing paper, and pearl cotton. During the silicon wafer stacking process, a hollow plate is first placed at the bottom of the carrier 131, and then pearl cotton, tracing paper, and silicon wafers are placed in sequence. The process is repeated until the last silicon wafer is placed. A hollow plate is then placed on top of the stacked silicon wafers, thereby completing the silicon wafer stacking process.

[0051] In this embodiment, multiple carriers 131 are provided on the circulation line 13, which can simultaneously stack silicon wafers of different specifications, thereby improving efficiency.

[0052] Combination Figure 1 , Figure 6 as well as Figure 7As shown, a first truss module 40 is provided between the first buffer position 11 and the circulation line 13. A first gripper 41 is provided on the first truss module 40. The first gripper 41 of the first truss module 40 grips the silicon wafer and moves it from the first buffer position 11 into the carrier 131 of the circulation line 13. A second truss module 50 is provided between the second buffer position 12 and the circulation line 13. A second gripper 51 is provided on the second truss module 50. The second gripper 51 of the second truss module 50 moves the separator from the second buffer position 12 into the carrier 131 of the circulation line 13. With the cooperation of the first truss module 40 and the second truss module 50, the continuous stacking of silicon wafers is realized.

[0053] Combination Figure 1 , Figure 9 as well as Figure 10 As shown, the stacking section 10 in this embodiment also includes a detection module 80 and a unloading module 90. The detection module 80 is equipped with a detection camera 81. After the silicon wafers are stacked, the detection camera 81 takes pictures of the stacked silicon wafers for inspection. If the silicon wafers are not damaged or otherwise abnormal, the next packaging operation is performed. If the silicon wafers are damaged or otherwise abnormal, the unloading module 90 unloads them. The unloading module 90 is equipped with an unloading gripper 91. Under the driving action of the unloading module 90, the unloading gripper 91 grabs the silicon wafers and sends them out.

[0054] In this embodiment, the detection module 80 can quickly and stably detect silicon wafers to determine whether the stacked silicon wafers are damaged, while the unloading module 90 can reject defective products to prevent them from affecting subsequent packaging operations.

[0055] Combination Figure 1 , Figure 3 as well as Figure 4The packaging section 20 includes a box body 21, a transfer module 22, and a feeding module 23. The box body 21 has a cavity for accommodating silicon wafers. The transfer module 22 moves the stacked silicon wafers into the cavity. The feeding module 23 presses the thickness of the stacked silicon wafers to be equal to the thickness of the silicon wafer packaging in the box body 21, and, in conjunction with the transfer module 22, feeds the stacked silicon wafers into the cavity. In this embodiment, the transfer module 22 is provided with a transfer gripper 221, which can grip the stacked silicon wafers. The feeding module 23 includes an upper pressure roller 231 and a lower pressure roller 232. The upper pressure roller 231... Located above the cavity, the upper pressure roller 231 of the feeding module 23 compresses the stacked silicon wafers, pressing their thickness to be equal to the wafer packing thickness of the box 21. The lower pressure roller 232 is located below the cavity, guiding the packed silicon wafers. When the transfer gripper 221 feeds the silicon wafer into the cavity opening of the box 21, the upper pressure roller 231 of the feeding module 23 will compress the silicon wafer, pressing its thickness to be equal to the wafer packing thickness of the box 21, so that the silicon wafer can be smoothly loaded into the box 21. The lower pressure roller 232 can guide the silicon wafer into the box 21, so that the silicon wafer can be smoothly loaded into the box 21.

[0056] In this embodiment, the feeding module 23 also includes an upper driving cylinder 233, which is mounted on the transfer module 22. The upper driving cylinder 233 drives the upper pressure roller 231 to press down the silicon wafer. In this embodiment, the boxing section 20 adopts a horizontal boxing method to box the stacked silicon wafers. Compared with the traditional vertical boxing method, the horizontal boxing method does not need to overcome the weight of the silicon wafers for boxing, which can effectively avoid the breakage of silicon wafers under the vertical boxing method and ensure the quality of silicon wafers.

[0057] Combination Figure 1 , Figure 4 as well as Figure 5 As shown, the conveying unit 30 includes a conveying line 31 and a flipping module 32. The conveying line 31 conveys the box 21. When the box 21 is conveyed to the position of the flipping module 32, the flipping module 32 flips the box 21 so that the cavity is laterally open. In this embodiment, the conveying line 31 is a roller conveying line that vertically conveys the box 21, while the flipping module 32 can flip the box 21 so that the cavity of the box 21 is laterally open, so that the subsequent horizontal boxing operation can be performed.

[0058] In this embodiment, the flipping module 32 includes a flipping motor 321, a flipping frame 322 located at the shaft end of the flipping motor 321, a positioning cylinder 323 disposed on the flipping frame 322, and a positioning block 324 located at the piston rod end of the positioning cylinder 323. A fixing block 60 is disposed on the flipping frame 322, and the fixing block 60 and the positioning block 324 are disposed opposite to each other. The positioning cylinder 323 drives the positioning block 324 to approach the fixing block 60 to position the box 21 located between the positioning block 324 and the fixing block 60. The flipping frame 322 is embedded in the conveyor line 31. When the box 21 is conveyed to the flipping frame 322, the box 21 is positioned. Inside module 22, the flipping motor 321 drives the flipping frame 322 to flip, making the cavity opening of the box 21 open to the side. In this embodiment, the flipping frame 322 of the flipping module 32 is embedded in the conveyor line 31. The box 21 stops after reaching the position of the flipping frame 322 under the conveyor line 31. The flipping motor 321 drives the flipping frame 322 to flip 90 degrees, making the cavity opening of the box 21 open to the side. After the flipping is completed, the positioning cylinder 323 drives the positioning block 324 to approach the fixing block 60. Under the cooperation of the positioning block 324 and the fixing block 60, the box 21 is positioned.

[0059] Furthermore, a positioning piece 61 is provided at the end of the fixing block 60. The positioning piece 61, the fixing block 60, and the positioning block 324 form a cavity for positioning the box 21. The positioning piece 61 can cooperate with the positioning block 324 and the fixing block 60 to perform more comprehensive positioning of the box 21 so as to facilitate the subsequent packaging operation of silicon wafers.

[0060] Combination Figure 4 and Figure 8 As shown, a limiting module 70 is provided on the flipping frame 322. The limiting module 70 includes a limiting cylinder 71, a clamping cylinder 72 located at the piston rod end of the limiting cylinder 71, and a limiting block 73 located on the clamping cylinder 72. The clamping cylinder 72 drives the limiting block 73 to limit the silicon wafers loaded into the box 21. The gripper cylinder drives the limiting block 73 to move and limit the silicon wafers loaded into the box 21. In the initial state, the limiting block 73 is open. At this time, the limiting block 73 and the transfer gripper 221 are misaligned and will not affect the boxing operation of the transfer gripper 221 on the silicon wafers. After the silicon wafers are boxed, the limiting cylinder 71 and the gripper cylinder drive the limiting block 73 to move, so that the limiting block 73 limits the silicon wafers.

[0061] Specifically, there are two limiting blocks 73 to limit the silicon wafer from multiple positions, and the limiting blocks 73 are provided with buffer sponges to prevent excessive limiting from damaging the silicon wafer.

[0062] Combination Figure 1 , Figure 11 , Figure 12 as well as Figure 13As shown, a capping module 100, a labeling module 110, and a sealing tape module 120 are also provided at the rear end of the conveyor line 31. The capping module 100 is provided with a capping gripper 101, which grips the lid of the box 21 and then seals the box 21 under the driving action of the capping module 100. The labeling module 110 includes a labeling machine 111 and a labeling head 112. The labeling head 112 picks up the label, and the labeling module 110 performs labeling on the surface of the box 21. The sealing tape module 120 includes a tape roll 121, which seals the box 21 under the operation of the sealing tape module 120.

[0063] In actual use, the silicon wafer casing machine of this embodiment stacks silicon wafers in the stacking section 10. With the cooperation of the first truss module 40 and the second truss module 50, the silicon wafers, hollow boards, tracing paper and pearl cotton are placed into the carrier 131 in sequence to complete the silicon wafer stacking operation. The presence of multiple carriers 131 can stack silicon wafers of various specifications at the same time, improving efficiency. After the silicon wafers are stacked, the transfer module 22 of the casing section 20 grabs the silicon wafers and sends them into the box body 21. The feeding module 23 of the casing section 20 can press down the silicon wafers so that the thickness of the stacked silicon wafers is equal to the silicon wafer casing thickness of the box body 21, ensuring that the silicon wafers can be cassetteed smoothly. After casing is completed, the flipping module 32 of the conveying section 30 flips the box body 21 so that the box body 21 flips into the conveying line 31, and the conveying line 31 sends out the cassette body 21 after casing.

[0064] Example 2

[0065] like Figure 14 As shown, this embodiment provides a wafer casing machine method, including the following steps:

[0066] S1. The first truss module 40 places the silicon wafer located in the first buffer position 11 into the carrier 131 of the circulation line 13, and the second truss module 50 places the separator located in the second buffer position 12 into the carrier 131 of the circulation line 13. The placement of the silicon wafer and the placement of the separator are carried out alternately until the silicon wafer is stacked. In this embodiment, the separators include hollow boards, sulfuric acid paper and pearl cotton. With the cooperation of the first truss module 40 and the second truss module 50, the silicon wafer and the separator can be placed into the carrier 131 in sequence to stably stack the silicon wafer.

[0067] S2. The transfer module 22 of the packaging section 20 picks up the stacked silicon wafers and waits for them to be packaged. The transfer module 22 picks up a local plane of the silicon wafer. Due to the presence of the separator, the unpicked part of the silicon wafer will warp, which will affect the subsequent packaging operation.

[0068] S3. The conveyor line 31 of the conveying unit 30 conveys the box 21 to the flipping module 32. The flipping module 32 flips the box 21 so that the cavity of the box 21 is side-opening, so that the silicon wafers can be horizontally boxed. Compared with the traditional vertical boxing method, the horizontal boxing method does not need to overcome the weight of the silicon wafers for boxing, which can effectively avoid the breakage of silicon wafers under the vertical boxing method and ensure the quality of silicon wafers.

[0069] S4. The feeding module 23 presses the thickness of the stacked silicon wafers to be equal to the thickness of the silicon wafers in the box 21. The transfer module 22 stably feeds the stacked silicon wafers into the cavity of the box 21. The upper pressure roller 231 of the feeding module 23 squeezes the silicon wafers on the top, so that the thickness of the stacked silicon wafers is equal to the thickness of the silicon wafers in the box 21, which makes it easier for the transfer module 22 to feed the silicon wafers into the box 21 for the boxing operation.

[0070] S5. The flipping module 32 is reset, causing the box 21 to flip and fall into the conveyor line 31, completing the boxing and conveying. In this embodiment, the flipping module 32 is engaged with the conveyor line 31. After the flipping module 32 is reset, the box 21 will flip 90 degrees and fall onto the conveyor line 31 for boxing and conveying.

[0071] In summary, this invention enables rapid stacking of silicon wafers with high efficiency. During the actual stacking process, there are no issues such as material mixing, fragmentation, or contamination, effectively reducing the labor intensity of workers and improving the efficiency of subsequent wafer packaging. It achieves automated packaging after wafer stacking, eliminating the need for manual operation, thus improving efficiency while ensuring packaging accuracy and avoiding the impact of manual operation on the wafers. The packaging unit 20 uses a horizontal packaging method to package the stacked silicon wafers. Compared to the traditional vertical packaging method, the horizontal packaging method does not require overcoming the weight of the silicon wafers themselves. The boxing process effectively prevents breakage of silicon wafers in vertical boxing, ensuring wafer quality. The upper pressure roller 231 of the feeding module 23 presses down on the stacked silicon wafers, making the thickness of the stacked silicon wafers equal to the thickness of the silicon wafer box in the box 21. This effectively prevents warping, ensures stable boxing, improves boxing accuracy, and avoids damage to the box 21. The lower pressure roller 232 of the feeding module 23 guides the silicon wafers as they are loaded into the box 21, ensuring they are smoothly loaded.

[0072] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A silicon wafer packaging machine, characterized in that, include The stacking section (10) inserts separators between adjacent silicon wafers. The stacking section (10) includes a first buffer bit (11), a second buffer bit (12), and a circulation line (13). The first buffer bit (11) buffers silicon wafers of several sizes, the second buffer bit (12) buffers separators of several sizes, and the circulation line (13) continuously circulates the silicon wafers during the stacking process. The packaging section (20) includes a box body (21), a transfer module (22), and a feeding module (23). The box body (21) has a cavity for accommodating silicon wafers. The transfer module (22) moves the stacked silicon wafers into the cavity. The feeding module (23) presses the thickness of the stacked silicon wafers to be equal to the silicon wafer packaging thickness of the box body (21) and, together with the transfer module (22), feeds the stacked silicon wafers into the cavity. The conveying unit (30) includes a conveying line (31) and a flipping module (32). The conveying line (31) conveys the box (21). When the box (21) is conveyed to the position of the flipping module (32), the flipping module (32) flips the box (21) so that the cavity is laterally open. The feeding module (23) includes an upper pressure roller (231) and a lower pressure roller (232). The upper pressure roller (231) is located above the cavity and squeezes the stacked silicon wafers to make the thickness of the stacked silicon wafers equal to the thickness of the silicon wafers in the box (21). The lower pressure roller (232) is located below the cavity and guides the packaged silicon wafers.

2. The silicon wafer packaging machine according to claim 1, characterized in that, A first truss module (40) is provided between the first cache position (11) and the circulation line (13). The first truss module (40) moves the silicon wafer from the first cache position (11) into the circulation line (13). A second truss module (50) is provided between the second cache position (12) and the circulation line (13). The second truss module (50) moves the separator from the second cache position (12) into the circulation line (13).

3. A silicon wafer packaging machine according to claim 2, characterized in that, A plurality of carriers (131) are provided on the circulation line (13). The carriers (131) move along the circulation direction of the circulation line (13). The first truss module (40) and the second truss module (50) respectively place the silicon wafer and the separator into the carrier (131).

4. A silicon wafer packaging machine according to claim 1, characterized in that, The flipping module (32) includes a flipping motor (321), a flipping frame (322) located at the rotating shaft end of the flipping motor (321), a positioning cylinder (323) disposed on the flipping frame (322), and a positioning block (324) located at the piston rod end of the positioning cylinder (323). A fixing block (60) is disposed on the flipping frame (322), and the fixing block (60) and the positioning block (324) are disposed opposite to each other. The positioning cylinder (323) drives the positioning block (324) to approach the fixing block (60) to position the box (21) located between the positioning block (324) and the fixing block (60).

5. A silicon wafer packaging machine according to claim 4, characterized in that, The fixing block (60) has a positioning piece (61) at its end. The positioning piece (61), the fixing block (60), and the positioning block (324) form a cavity for positioning the box body (21).

6. A silicon wafer packaging machine according to claim 4, characterized in that, The flipping frame (322) is embedded in the conveyor line (31). When the box (21) is conveyed to the flipping frame (322), the flipping motor (321) drives the flipping frame (322) to flip, so that the cavity opening of the box (21) is a side opening.

7. A silicon wafer packaging machine according to claim 4, characterized in that, The flipping frame (322) is provided with a limiting module (70), which includes a limiting cylinder (71), a clamping cylinder (72) located at the piston rod end of the limiting cylinder (71), and a limiting block (73) located on the clamping cylinder (72). The clamping cylinder (72) drives the limiting block (73) to limit the silicon wafers installed in the box (21).

8. A wafer casing method for a silicon wafer casing machine, applied to the silicon wafer casing machine according to any one of claims 1-7, characterized in that, Includes the following steps: S1. The first truss module (40) places the silicon wafer located in the first buffer position (11) into the carrier (131) of the circulation line (13), and the second truss module (50) places the separator located in the second buffer position (12) into the carrier (131) of the circulation line (13). The placement of the silicon wafer and the placement of the separator are carried out in an intermittent manner until the silicon wafer stacking is completed. S2, The transfer module (22) of the packaging section (20) picks up the stacked silicon wafers and waits to package them; S3. The conveyor line (31) of the conveying unit (30) conveys the box (21) to the flipping module (32), and then the flipping module (32) flips the box (21) so that the cavity of the box (21) is opened to the side. S4. The feeding module (23) presses the thickness of the stacked silicon wafers to be equal to the thickness of the silicon wafers in the box (21), and the transfer module (22) stably sends the stacked silicon wafers after gripping them into the cavity of the box (21). S5. The flip module (32) is reset, causing the box (21) to flip and fall into the conveyor line (31) to complete the boxing and conveying.

9. The packaging method of a silicon wafer packaging machine according to claim 8, characterized in that, The second buffer position (12) includes a sulfuric acid paper buffer position, a pearl cotton buffer position and a hollow board buffer position. The sulfuric acid paper, pearl cotton and hollow board are alternately placed into the carrier (131) under the action of the second truss module (50).

Images