Point pecking type micro-nano surface treatment device

Abstract

The present application relates to a point pecking type micro-nano surface processing device, comprising: a pre-measurement processing unit for rapidly detecting the surface micro-morphology of the surface of a workpiece to be processed; a central intelligent processing unit for obtaining a required point pecking frequency f after analyzing and calculating the data detected by the pre-measurement processing unit; a point pecking frequency f processing unit for generating the required point pecking frequency f; an energy conversion unit for converting the required point pecking frequency f into motion energy corresponding to a point pecking processing unit; and a point pecking processing unit for performing point pecking motion on the surface of the workpiece. The present application has high intelligence, can generate compressive stress on the surface of the workpiece, and can improve the use performance of the surface of the workpiece without affecting the surface of the workpiece.

Description

Technical Field

[0001] This invention relates to the field of surface treatment device technology, and more specifically to a dot-pecking micro / nano surface treatment device. Background Technology

[0002] Existing micro-nano precision surface processing methods suffer from the following problems due to limitations in current processing techniques:

[0003] 1. During micro-nano precision surface treatment, the heat generated during processing causes the microstructure of the workpiece to change with temperature, which is difficult to control accurately. This requires subsequent processing, increases costs, and leads to low production efficiency.

[0004] 2. When performing micro-nano precision surface treatment, the processing mechanism is limited, such as light finishing, chemical processing, or tearing or corrosion processing. This makes it difficult to achieve the required surface morphology, and the stress state appears as tensile stress, which requires subsequent processing, increases costs and leads to low production efficiency.

[0005] 3. When performing micro-nano precision surface treatment, the mechanism of material deformation, such as the elastic deformation of the material, affects the surface micro-morphology quality of the workpiece. Summary of the Invention

[0006] The purpose of this invention is to overcome the shortcomings of the prior art and provide a dot-pecking micro / nano surface treatment device.

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] The dotting-type micro / nano surface treatment device includes:

[0009] The pre-processing unit performs rapid surface micromorphology detection on the surface of the workpiece that needs to be processed;

[0010] The central intelligent processing unit analyzes and calculates the required peck frequency f based on the data detected by the pre-test processing unit.

[0011] A peck-type frequency f processing unit is used to generate the required peck frequency f;

[0012] The energy conversion unit converts the required peck frequency f into the kinetic energy corresponding to the peck processing unit;

[0013] The point-pecking machining unit performs point-pecking motions on the surface of the workpiece.

[0014] During the micro-nano precision machining of the workpiece surface, the pre-test processing unit performs rapid surface micro-morphology detection on the surface to be machined and performs three-dimensional image processing based on the detected data; the central intelligent processing unit compares the detected data with the required surface micro-nano level and outputs the corresponding parameters to the peck-type frequency f processing unit to control the peck-type frequency f processing unit to generate the required peck-type frequency f; the energy conversion unit converts the peck-type frequency f into the kinetic energy of the peck-type machining unit to control the peck-type machining unit to perform peck-type motion to achieve micro-nano precision machining of the required surface.

[0015] Furthermore, when the device performs micro-nano precision point-pecking processing on the surface of a workpiece, the point-pecking frequency f used is a pulse energy at the fs level.

[0016] Furthermore, the formula used by the central intelligent processing unit to analyze and calculate the required peck frequency f is as follows:

[0017]

[0018] f—The peck frequency required for peck-type micro / nano precision processing, in 1e. -15 Hz;

[0019] R a —Preset workpiece surface roughness value, in nm;

[0020] R a0 —The surface roughness value of the workpiece currently measured by the pre-test processing unit, in nm;

[0021] R a1 —The surface roughness value of the workpiece that needs to be achieved during micro-nano precision processing, in nm.

[0022] By adopting the above technical solution, the beneficial effects of the present invention are as follows:

[0023] 1. Intelligent. It can intelligently compare the detected surface micro-morphology of the object to be processed with the required processing requirements and output the peck frequency f required for the peck-type surface treatment of the surface;

[0024] 2. Zero surface defects. When using this device for micro-nano precision point-pecking processing of workpiece surfaces, the point-pecking frequency f used is fs(1e -15 It utilizes pulsed energy at the fs level, employing induced processing (inducing molecular vibrations and electronic excitation) at the fs level to break the chemical bonds connecting the electrons in the atomic shell of the material, thus achieving the processing objective. This process occurs within the molecules of the material and does not affect the workpiece surface.

[0025] 3. Construction of compressive stress. During the micro-nano precision processing of the workpiece surface using the peck-type method, the surface is processed by pressing at a frequency of fs. This processing method generates compressive stress on the workpiece surface, thereby improving the performance of the workpiece surface. Attached Figure Description

[0026] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments:

[0027] Figure 1 This is a schematic diagram of the structure of the present invention. Detailed Implementation

[0028] like Figure 1 As shown, the dotting-type micro / nano surface treatment device of the present invention includes:

[0029] Pre-test processing unit 1 performs rapid surface micromorphology detection on the surface of the object to be processed;

[0030] The central intelligent processing unit 2, based on the data detected by the pre-test processing unit 1, calculates and obtains the required peck frequency f.

[0031] The peck-type frequency f processing unit 3 is used to generate the required peck-type frequency f;

[0032] Energy conversion unit 4 converts the required peck frequency f into the kinetic energy corresponding to the peck processing unit 5;

[0033] The point-pecking machining unit 5 performs point-pecking motions on the surface of the workpiece.

[0034] During the micro-nano precision machining of the workpiece surface, the pre-test processing unit 1 performs rapid surface micro-morphology detection on the surface to be machined and performs three-dimensional image processing based on the detected data; the central intelligent processing unit 2 compares the detected data with the required surface micro-nano level and outputs the corresponding parameters to the peck-type frequency f processing unit 3 to control the peck-type frequency f processing unit 3 to generate the required peck-type frequency f; the energy conversion unit 4 converts the peck-type frequency f into the kinetic energy of the peck-type machining unit 5 to control the peck-type machining unit 5 to perform peck-type motion to achieve micro-nano precision machining of the required surface.

[0035] The formula used by the central intelligent processing unit to analyze and calculate the required peck frequency f is:

[0036]

[0037] f—The peck frequency required for peck-type micro / nano precision processing, in 1e. -15 Hz;

[0038] Ra —Preset workpiece surface roughness value, in nm;

[0039] R a0 —The surface roughness value of the workpiece currently measured by the pre-test processing unit, in nm;

[0040] R a1 —The surface roughness value of the workpiece that needs to be achieved during micro-nano precision processing, in nm.

[0041] The device of this invention employs a peck-like frequency f at the fs level for micro-nano precision peck-like processing of workpiece surfaces. The processing method utilizes fs-level induced processing (induced molecular vibration and electronic excitation) to break the chemical bonds connecting the electrons in the atomic shell of the material, achieving the processing objective. This process occurs within the molecules of the material and does not affect the workpiece surface. Furthermore, this invention utilizes fs-level frequencies to perform pressure processing on the surface, generating compressive stress on the workpiece surface, thereby improving its performance.

[0042] The specific embodiments of the present invention have been described above. However, those skilled in the art should understand that this is merely an example. Those skilled in the art can make various changes or modifications to this embodiment without departing from the principles and essence of the present invention, but all such changes and modifications fall within the protection scope of the present invention.

Claims

1. A spot-pecking type micro / nano surface treatment device, characterized in that: include: The pre-processing unit performs rapid surface micromorphology detection on the surface of the workpiece that needs to be processed; The central intelligent processing unit analyzes and calculates the required peck frequency f based on the data detected by the pre-test processing unit. A peck-type frequency f processing unit is used to generate the required peck frequency f; The energy conversion unit converts the required peck frequency f into the kinetic energy corresponding to the peck processing unit; The point-pecking machining unit performs point-pecking motions on the surface of the workpiece. During the micro-nano precision machining of the workpiece surface, the pre-test processing unit performs rapid surface micro-morphology detection on the surface to be machined and performs three-dimensional image processing based on the detected data; the central intelligent processing unit compares the detected data with the required surface micro-nano level and outputs corresponding parameters to the peck-type frequency f processing unit to control the peck-type frequency f processing unit to generate the required peck-type frequency f; the energy conversion unit converts the peck-type frequency f into the kinetic energy of the peck-type machining unit to control the peck-type machining unit to perform peck-type motion to achieve micro-nano precision machining of the required surface; The formula used by the central intelligent processing unit to analyze and calculate the required peck frequency f is: f—The peck frequency required for peck-type micro / nano precision processing, in 1e. -15 Hz; R a —Preset workpiece surface roughness value, in nm; R a0 —The surface roughness value of the workpiece currently measured by the pre-test processing unit, in nm; R a1 —The surface roughness value of the workpiece that needs to be achieved during micro-nano precision processing, in nm.

2. The dot-pecking micro / nano surface treatment device according to claim 1, characterized in that: When this device performs micro-nano precision point-pecking processing on the surface of a workpiece, the point-pecking frequency f used is a pulse energy on the order of fs.

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