Positioning device for semiconductor processing

Abstract

This invention discloses a positioning device for semiconductor processing. A positioning worktable is provided on the semiconductor processing worktable; a positioning device is provided on the positioning worktable; the positioning device is driven by a driving device; the positioning device is composed of several semiconductor positioning components attached to each other; each semiconductor positioning component includes an electrostatic chuck, and a fixed base, an elastic positioning ring block pad, and an elastic positioning ring block arranged sequentially from bottom to top on the positioning worktable; several electrostatic chucks are arranged at certain intervals on the positioning worktable; a fixed base is provided on the outer side of each electrostatic chuck. The positioning device for semiconductor processing provided by this invention achieves precise positioning of each wafer at the same position on the electrostatic chuck, and ensures that the notches of each wafer fixed on the electrostatic chuck are all located at the same position on the electrostatic chuck, achieving dual precision positioning of position and angle.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and in particular to a positioning device for semiconductor processing. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature falls between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, and high-power power conversion, among other fields. For example, diodes are devices made using semiconductors. Today, most electronic products, such as computers, mobile phones, and digital recorders, rely heavily on semiconductors as their core components. Common semiconductor materials include silicon, germanium, and gallium arsenide, with silicon being the most influential in their applications.

[0003] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single-crystal silicon. After grinding, polishing, and slicing, the silicon ingot forms a silicon wafer, or wafer. Domestic wafer production lines mainly use 8-inch and 12-inch wafers, and the main wafer processing methods are wafer fabrication and batch processing, i.e., processing one or more wafers simultaneously. As semiconductor feature sizes become smaller and processing and measurement equipment becomes more advanced, new data characteristics have emerged in wafer processing. Simultaneously, the reduction in feature size increases the impact of airborne particles on the quality and reliability of the processed wafer, and with improved cleanliness, the particle count also exhibits new data characteristics.

[0004] Currently, there are several main methods for positioning wafers:

[0005] (1) Mechanical clamping: In the early silicon wafer processing, the traditional mechanical clamping method used in the machinery industry was adopted, that is, mechanical clamps were used to position the silicon wafer. However, the clamps would damage the edges of the silicon wafer and easily warp the silicon wafer, which would greatly affect its processing accuracy. Therefore, mechanical clamping methods are rarely used now.

[0006] (2) Paraffin Wax Bonding Method: Typically, the silicon wafer is first fixed to a specific position on the fixture. Then, the adhesive is heated and melted, allowing it to penetrate between the silicon wafer and the fixture for fixation. To ensure the reliability of the adhesive and the fixing accuracy of the silicon wafer, the adhesive needs to be melted and filtered beforehand to remove impurities. The entire positioning process requires heating, bonding, peeling, and cleaning the paraffin wax, resulting in low efficiency. Furthermore, the adhesive significantly affects the cleanliness of the silicon wafer.

[0007] (3) Vacuum chuck: The working structure of the vacuum chuck mainly consists of two parts: the middle part is porous ceramic, and the edge part is a sealing ring. During operation, the air between the silicon wafer and the ceramic surface is extracted by the small holes on the porous ceramic, so that the silicon wafer and the ceramic surface are under low pressure. The silicon wafer is adsorbed on the surface of the chuck due to the air pressure, thus fixing the silicon wafer. After processing, the plasma water inside will flow out from the holes on the ceramic surface. The plasma water can prevent the silicon wafer from adhering to the ceramic surface, and at the same time, it can clean the silicon wafer and the ceramic surface. After cleaning, the chuck is dried and the next silicon wafer is clamped. The vacuum chuck has two main disadvantages: First, when the silicon wafer is adsorbed on the surface of the chuck by the vacuum chuck, the silicon wafer will be locally deformed due to the air pressure. After processing, the silicon wafer will rebound, resulting in a wavy surface after cutting, and the surface flatness will decrease. Moreover, during processing, small particles may be sucked into the space between the silicon wafer and the chuck, causing local deformation of the silicon wafer and affecting the processing accuracy. Secondly, if silicon wafers need to be processed in a vacuum environment, vacuum chucks cannot work at all in a vacuum environment.

[0008] Existing methods also use electrostatic adsorption to fix wafers. However, these methods are mainly used to fix and position a single wafer. For batch processing of multiple wafers, the efficiency of using electrostatic adsorption to fix and position wafers needs to be improved. Furthermore, it is impossible to guarantee the position of each wafer on the electrostatic chuck. If the wafer has high processing precision requirements, the position of each wafer needs to be finely adjusted when it is aligned with the processing stage. This is also a problem that needs to be solved. Summary of the Invention

[0009] In view of this, the present invention proposes a positioning device for semiconductor processing.

[0010] In order to achieve the above object, the present invention adopts the following technical solutions:

[0011] A positioning device for semiconductor processing includes a positioning worktable on a semiconductor processing workbench; a positioning device is mounted on the positioning worktable; the positioning device is driven to move by a driving device; the positioning device is composed of several semiconductor positioning components attached to each other; each semiconductor positioning component includes an electrostatic chuck, and a fixed base, an elastic positioning ring block pad, and an elastic positioning ring block arranged sequentially from bottom to top on the positioning worktable; several electrostatic chucks are arranged at certain intervals on the positioning worktable; a fixed base is provided on the outer side of each electrostatic chuck;

[0012] The lower end of the elastic positioning ring block has four evenly spaced abutment grooves; four abutment blocks are slidably disposed within each of the four abutment grooves; the upper surface of the elastic positioning ring block has four evenly spaced sliding grooves corresponding to the positions of the four abutment grooves; the corresponding sliding grooves and abutment grooves are interconnected; the upper surface of the elastic positioning ring block has limit grooves on both sides of each sliding groove; each abutment block has a sliding block and a positioning block fixedly disposed at its upper end in sequence; the sliding block is slidably disposed within the sliding groove; a first adsorption plate is fixedly disposed at the upper end of each sliding block; a second adsorption plate is embedded and fixedly disposed at the lower end of the limit grooves on both sides; the upper surfaces of the first adsorption plate and the second adsorption plate are flush with each other; the flush upper surfaces of the two adsorption plates jointly adsorb an adsorption element; the top of the positioning block extends beyond the upper end of the elastic positioning ring block to form an extension; the lower end of the elastic positioning ring block pad has a receiving groove for the extension to slide.

[0013] Several wafers are placed on several electrostatic chucks; four abutment blocks slide inward to make tangential contact with the wafers; the electrostatic chucks generate an adsorption force on the wafers.

[0014] Furthermore, a central connecting block is provided between the fixed chassis of several semiconductor positioning components; a side connecting block is provided on the outer side of the fixed chassis near the drive device.

[0015] Furthermore, the inner and outer ends of the four abutment grooves are all interconnected with the outside; the longitudinal section of the abutment groove is T-shaped.

[0016] Furthermore, each of the fixed chassis has an annular chassis groove at its upper end; the elastic positioning ring block is fitted into the annular chassis groove, and the top end of the elastic positioning ring block extends out of the annular chassis groove.

[0017] Furthermore, the height of the inner bottom wall of the limiting groove is higher than the height of the inner top wall of the abutting groove; the length of the sliding block is less than the length of the sliding groove; and the length of the positioning block is less than the length of the accommodating groove.

[0018] Furthermore, the first adsorption plate is a first glass plate; the second adsorption plate is a second glass plate;

[0019] The adsorption component is a suction cup; the suction cup is composed of an elastic disc and a connecting rod located at the middle of the upper end of the elastic disc; a longitudinally penetrating central hole is opened in the middle of the connecting rod; a sealing rod is interference-fitted into the central hole;

[0020] The upper ends of the limiting grooves on both sides are respectively fixed with elastic blocks; the distance between the elastic blocks on both sides is the width of the positioning block; the suction cup is located in the space between the limiting groove and the second suction plate.

[0021] Furthermore, a second abutment groove is formed at the lower end of the elastic positioning ring block, located between two adjacent abutment grooves; the inner and outer ends of the second abutment groove are interconnected with the outside; a second abutment block is slidably disposed within the second abutment groove; a second sliding groove is formed on the upper surface of the elastic positioning ring block corresponding to the position of the second abutment groove; the corresponding second sliding grooves and second abutment grooves are interconnected; second limiting grooves are formed on both sides of the upper surface of the elastic positioning ring block located at the second sliding groove; the inner bottom wall of the second limiting groove is higher than the second abutment groove. The inner top wall height of the chute; a second sliding block and a second positioning block are fixedly fixed at the upper end of the second abutment block in sequence; the second sliding block is slidably disposed in the second sliding groove; a third glass plate is fixedly fixed at the upper end of the second sliding block; a fourth glass plate is fixedly fixed at the lower end of the limiting groove; the upper surface of the third glass plate and the upper surface of the fourth glass plate are flush with each other; a suction cup is jointly adsorbed on the flush upper surfaces of the two adsorption plates; a second chute for accommodating the protrusion of the second positioning block is opened at the lower end of the fixed base; the length of the protrusion of the second positioning block is less than the length of the accommodating second chute.

[0022] Furthermore, a notch positioning groove is provided on the outer end face of the second abutment block; the middle groove part of the notch positioning groove is connected to the outside, while the outer end faces of the two side groove parts are not connected to the outside; the middle part of the notch positioning block is slidably disposed in the middle groove of the notch positioning groove, and the two side parts are slidably disposed in the two side groove parts of the notch positioning groove respectively.

[0023] Furthermore, the driving device is mounted on a driving worktable; the driving device includes a forward and backward motion driving mechanism and a left and right motion driving mechanism;

[0024] The forward and backward motion drive assembly includes a first drive motor, a longitudinal screw, a longitudinal slide rail, and a U-shaped sliding block; the first motor is mounted on a drive worktable; the motor shaft of the first motor is connected to the longitudinal screw; the motor shaft of the first motor passes through a motor shaft limiting plate, and the motor shaft limiting plate is fixedly mounted on the drive worktable; the drive worktable is provided with a longitudinal slide rail; the longitudinal screw is externally threaded with a U-shaped sliding block; the U-shaped sliding block is slidably mounted on the longitudinal slide rail;

[0025] A cylinder is provided at the upper end of the U-shaped sliding block on the longitudinal screw; a connecting rod is provided at the upper end of the piston rod of the cylinder; the connecting rod is connected to a connecting plate; the connecting plate is connected to several side connecting parts.

[0026] The left and right motion drive assembly includes a second drive motor, a transverse screw, a transverse slide rail, and a U-shaped sliding block; the second drive motor is mounted on the drive worktable; the motor shaft of the second drive motor is connected to the transverse screw; the motor shaft of the second drive motor passes through a motor shaft limiting plate, and the motor shaft limiting plate is fixedly mounted on the drive worktable; the transverse screw is externally threaded with a U-shaped sliding block; the U-shaped sliding block is slidably mounted on the transverse slide rail;

[0027] Furthermore, the upper surface of the drive worktable is provided with two limiting slide bars in the horizontal direction; the longitudinal slide rail is provided with two limiting grooves in the horizontal direction corresponding to the positions of the two limiting slide bars; the two limiting slide bars are respectively matched and pass through the two limiting grooves.

[0028] Compared with existing technologies, the beneficial effects of this invention are:

[0029] (1) This semiconductor processing positioning device achieves the same position of each wafer fixed on the electrostatic chuck, and the notch position of each wafer fixed on the electrostatic chuck is located at the same position on the electrostatic chuck, thus achieving dual precise positioning of position and angle.

[0030] (2) This semiconductor processing positioning device achieves precise positioning of multiple wafers. Driven by the front and rear motion drive mechanism and the left and right motion drive mechanism, multiple wafers move regularly to the bottom of the processing table and are processed sequentially, orderly and precisely. There is no need to fine-tune the position of the electrostatic chuck. The positioning accuracy is high and the movement efficiency is high, which leads to the improvement of subsequent processing efficiency and processing accuracy, and has the effect of improving product quality. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the present invention;

[0032] Figure 2 This is a schematic diagram of the overall three-dimensional structure of the present invention;

[0033] Figure 3 This is an overall top view of the present invention;

[0034] Figure 4 for Figure 3 Sectional view along line AA in the middle;

[0035] Figure 5 for Figure 4 Enlarged view of part A in the image;

[0036] Figure 6 This is an exploded structural diagram of the fixed chassis, elastic positioning ring block pad, and elastic positioning ring block of the present invention.

[0037] Figure 7This is an exploded structural diagram of the elastic positioning ring block pad and the elastic positioning ring block of the present invention;

[0038] Figure 8 This is an exploded structural diagram of the elastic positioning ring block of the present invention;

[0039] Figure 9 This is a schematic diagram of the elastic positioning ring block assembly structure of the present invention;

[0040] Figure 10 This is a schematic diagram of the elastic positioning ring block pad structure of the present invention;

[0041] Figure 11 This is a three-dimensional structural diagram of the present invention when several elastic positioning ring blocks and pads are stacked together;

[0042] Figure 12 This is a top view of the superimposed elastic positioning ring block pad and elastic positioning ring block of the present invention;

[0043] Figure 13 for Figure 12 Sectional view along direction AA.

[0044] In the diagram: 1. Electrostatic chuck; 2. Fixed base; 3. Elastic positioning ring block; 4. Elastic positioning ring block; 5. Positioning worktable; 6. Drive worktable; 7. Central connecting block; 8. Side connecting block; 9. Abutment groove; 10. Sliding groove; 11. Abutment block; 12. Sliding block; 13. Second glass plate; 14. Third glass plate; 15. Fourth glass plate; 16. Chuck; 161. Elastic disc; 162. Sealing rod; 17. Elastic stop block; 18. Accommodating groove; 19. Second abutment groove; 20. Second abutment block; 21. Second sliding groove; 23. Second limiting groove; 24. Second sliding block; 25. Second positioning block; 26. Notch positioning block; 28. First drive motor; 29. ​​Longitudinal screw; 30. Longitudinal slide rail; 31. T-shaped sliding block; 32. Cylinder; 33. Connecting rod; 34. Connecting plate; 35. Second drive motor; 36. Transverse screw; 37. Transverse slide rail; 38. Limiting slide bar; 39. First glass plate; 40. Positioning block; 41. Wafer; 42. Limiting groove. Detailed Implementation

[0045] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0046] In the description of this invention, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0047] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0048] Example:

[0049] like Figure 1-13 As shown, a positioning device for semiconductor processing includes a positioning worktable 5 on a semiconductor processing worktable; a positioning device is provided on the positioning worktable 5; the positioning device is driven to move by a driving device; the driving device is located on a driving worktable 6.

[0050] The positioning device consists of several semiconductor positioning components attached together. Each semiconductor positioning component includes an electrostatic chuck 1, and a fixed base 2, an elastic positioning ring block 3, and an elastic positioning ring block 4, which are arranged sequentially from bottom to top on the positioning worktable 5. The fixed base 2 is fixedly connected to the positioning worktable 5. Each fixed base 2 has an annular base groove at its upper end. The elastic positioning ring block 3 is fitted into the annular base groove, and the top of the elastic positioning ring block 3 extends out of the annular base groove.

[0051] The positioning worktable 5 is provided with several electrostatic chucks 1 at certain intervals; each electrostatic chuck 1 is provided with a fixed base 2 on its outer side.

[0052] A central connecting block 7 is provided between several fixed chassis 2 of semiconductor positioning components; a side connecting block 8 is provided on the outer side of the fixed chassis 2 near the drive device.

[0053] The lower end of the elastic positioning ring block 4 is evenly provided with four abutment grooves 9; the inner and outer ends of the four abutment grooves 9 are interconnected with the outside; the longitudinal section of the abutment groove 9 is T-shaped. Four abutment blocks 11 are slidably arranged in the four abutment grooves 9 respectively.

[0054] The upper end face of the elastic positioning ring block 4 has four sliding grooves 10 evenly spaced around the four abutment grooves 9; the corresponding sliding grooves 10 and abutment grooves 9 are interconnected. Limiting grooves 42 are respectively formed on both sides of each sliding groove 10 on the upper end face of the elastic positioning ring block 4; a sliding block 12 and a positioning block 40 are sequentially fixed to the upper end of each abutment block 11. The sliding block 12 is slidably disposed within the sliding groove 10.

[0055] Each sliding block 12 has a first adsorption plate fixedly installed at its upper end; a second adsorption plate is embedded and fixedly installed at the lower end of the two side limiting grooves 42; the upper surface of the first adsorption plate and the upper surface of the second adsorption plate are flush with each other; the flush upper surfaces of the two adsorption plates are jointly adsorbed with an adsorption element.

[0056] The first adsorption plate is a first glass plate 39; the second adsorption plate is a second glass plate 13;

[0057] The adsorption component is a suction cup 16; the suction cup 16 is composed of an elastic disc 161 and a connecting rod 33 located at the middle of the upper end of the elastic disc 161; a longitudinally penetrating central hole is opened in the middle of the connecting rod 33; a sealing rod 162 is interference-fitted into the central hole.

[0058] Elastic blocks 17 are fixedly provided at the upper ends of the two limiting grooves 42 respectively; the distance between the two elastic blocks 17 is the width of the positioning block 40; the suction cup 16 is located in the space between the limiting groove 42 and the second suction plate.

[0059] The top of the positioning block 40 extends beyond the upper end of the elastic positioning ring block 4 to form an extension; the lower end of the elastic positioning ring block pad 3 has a receiving groove 18 for the extension to slide.

[0060] Several wafers 41 are placed on several electrostatic chucks 1; four abutment blocks 11 slide inward to make tangential contact with the wafers 41; the electrostatic chucks 1 generate an adsorption force on the wafers 41.

[0061] The height of the inner bottom wall of the limiting groove 42 is higher than the height of the inner top wall of the abutting groove 9; the length of the sliding block 12 is less than the length of the sliding groove 10; the length of the positioning block 40 is less than the length of the accommodating groove 18.

[0062] The lower end of the elastic positioning ring block 4 is located between two adjacent abutment grooves 9 and a second abutment groove 19 is also provided; the inner and outer ends of the second abutment groove 19 are interconnected with the outside; a second abutment block 20 is slidably provided in the second abutment groove 19; a second sliding groove 21 is provided on the upper end surface of the elastic positioning ring block 4 corresponding to the position of the second abutment groove 19; the second sliding groove 21 and the second abutment groove 19 at the corresponding positions are interconnected.

[0063] The upper end face of the elastic positioning ring block 4 is provided with second limiting grooves 23 on both sides of the second sliding groove 21; the height of the inner bottom wall of the second limiting groove 23 is higher than the height of the inner top wall of the second abutting sliding groove 19; the upper end of the second abutting block 20 is sequentially provided with a second sliding block 24 and a second positioning block 25; the second sliding block 24 is slidably disposed in the second sliding groove 21.

[0064] The upper end of the second sliding block 24 is fixedly provided with a third glass plate 14; the lower end of the limiting groove 42 is fixedly provided with a fourth glass plate 15; the upper surface of the third glass plate 14 and the upper surface of the fourth glass plate 15 are flush with each other; the flush upper surfaces of the two adsorption plates are jointly adsorbed with a suction cup 16; the lower end of the fixed base 2 is provided with a second sliding groove for the extension of the second positioning block 25 to slide; the length of the extension of the second positioning block 25 is less than the length of the second sliding groove.

[0065] The outer end face of the second abutment block 20 is provided with a notch positioning groove; the middle groove part of the notch positioning groove is connected to the outside, and the outer end face of the two side groove parts is not connected to the outside; the middle part of the notch positioning block 26 is slidably disposed in the middle groove of the notch positioning groove, and the two side parts are respectively slidably disposed in the two side groove parts of the notch positioning groove.

[0066] The drive unit includes a forward and backward motion drive mechanism and a left and right motion drive mechanism;

[0067] The forward and backward motion drive assembly includes a first drive motor 28, a longitudinal screw 29, a longitudinal slide rail 30, and a U-shaped sliding block 31; the first motor is mounted on the drive worktable 6; the motor shaft of the first motor is connected to the longitudinal screw 29; the motor shaft of the first motor passes through a motor shaft limiting plate, and the motor shaft limiting plate is fixedly mounted on the drive worktable 6; the drive worktable 6 is provided with a longitudinal slide rail 30; the longitudinal screw 29 is externally threaded with a U-shaped sliding block 31; the U-shaped sliding block 31 is slidably mounted on the longitudinal slide rail 30.

[0068] A cylinder 32 is provided at the upper end of the U-shaped sliding block 31 on the longitudinal screw 29; a connecting rod 33 is provided at the upper end of the piston rod of the cylinder 32; the connecting rod 33 is connected to a connecting plate 34; the connecting plate 34 is connected to several side connecting parts.

[0069] The left and right motion drive assembly includes a second drive motor 35, a transverse screw 36, a transverse slide rail 37, and a U-shaped sliding block 31. The second drive motor 35 is mounted on the drive worktable 6. The motor shaft of the second drive motor 35 is connected to the transverse screw 36. The motor shaft of the second drive motor 35 passes through a motor shaft limiting plate, and the motor shaft limiting plate is fixedly mounted on the drive worktable 6. The transverse screw 36 is externally threaded with the U-shaped sliding block 31. The U-shaped sliding block 31 is slidably mounted on the transverse slide rail 37.

[0070] The upper surface of the drive table 6 is provided with two limiting slide bars 38 in the horizontal direction; the longitudinal slide rail 30 is provided with two limiting grooves 42 in the horizontal direction corresponding to the positions of the two limiting slide bars 38; the two limiting slide bars 38 are respectively matched and pass through the two limiting grooves 42.

[0071] The working principle of this invention is as follows:

[0072] like Figure 11-13 As shown, first, take out a combination of an overlapping elastic positioning ring block 3 and an elastic positioning ring block 4 and place it horizontally; then measure the diameter of the wafer 41, calculate the displacement that the abutment block 11 needs to draw, and move the four abutment blocks 11 precisely to an equal and appropriate distance, and then place the wafer 41 between the four abutment blocks 11 (a pad is placed under the wafer 41 to ensure that the height between the wafer 41 and the abutment blocks 11 is matched). At this time, it can be seen that the outer end faces of the four abutment blocks 11 are exactly tangentially contacted with the four directions of the wafer 41, but they do not press against each other.

[0073] Next, the second abutment block 20 is moved out until it is in tangential contact with the wafer 41; the moving distance of the second abutment block 20 is also confirmed.

[0074] Then, several combinations of elastic positioning ring pads 3 and elastic positioning ring blocks 4 are placed on the stacked elastic positioning ring pads 3 and elastic positioning ring blocks 4. Due to the positioning of the positioning block 40 in the receiving groove 18, all the elastic positioning ring pads 3 and elastic positioning ring blocks 4 can be stacked to achieve a complete matching and stacking. Then, according to the displacement of the bottommost extension, all the above abutment blocks 11 and second abutment blocks 20 can be moved out of the corresponding distance. It is not necessary to position the wafer 41 one by one and then move the abutment blocks 11 out of the corresponding distance.

[0075] After the abutting block 11 of all the elastic positioning ring block pads 3 and elastic positioning ring blocks 4 assemblies moves out of the appropriate distance, each elastic positioning ring block pad 3 and elastic positioning ring block 4 assemblies is quickly placed on each fixed chassis 2.

[0076] If there is a notch on the wafer 41, the notch positioning block 26 is moved a small distance away, so that each wafer 41 is rotated at a suitable angle and then placed in the area between the four abutment blocks 11. The notch end face is in contact with the end face of the notch positioning block 26. Thus, the wafer 41 is placed in the area between the four abutment blocks 11 that has been adjusted in position, which achieves the same position of each wafer 41 on the electrostatic chuck 16. The notch end face of the wafer 41 is in contact with the end face of the notch positioning block 26, which means that the notch position of each wafer 41 fixed on the electrostatic chuck 16 is located in the same position on the electrostatic chuck 16, achieving dual precise positioning of position and angle.

[0077] After the position of wafer 41 is fixed, cylinder 32 drives all the elastic positioning ring block pads 3 and elastic positioning ring block 4 assemblies to move upward. Since there is no pressing relationship, the position of wafer 41 will not be changed. After all the elastic positioning ring block pads 3 and elastic positioning ring block 4 assemblies leave the positioning worktable 5, the electrostatic chuck 1 is energized to attract wafer 41 onto the electrostatic chuck 1, thus achieving precise positioning of multiple wafers 41.

[0078] Subsequently, driven by the front-to-back motion drive mechanism and the left-to-right motion drive mechanism, multiple wafers 41 move regularly to the bottom of the processing worktable, and can be processed sequentially, orderly and precisely, without the need for fine-tuning of the position of the electrostatic chuck 16; the high positioning accuracy and high movement efficiency lead to improved subsequent processing efficiency and processing accuracy, which in turn improves product quality.

[0079] The electrostatic adsorption force acts uniformly on the surface of wafer 41, preventing wafer 41 from warping or deforming. The adsorption force remains stable and continuous. The electrostatic chuck 16 does not damage wafer 41, causes minimal pollution, and can be used in high vacuum environments.

[0080] The above are merely preferred embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A positioning device for semiconductor processing, wherein a positioning worktable (5) is provided on a semiconductor processing worktable; a positioning device is provided on the positioning worktable (5); the positioning device is driven to move by a driving device; characterized in that, The positioning device is composed of several semiconductor positioning components attached together; each semiconductor positioning component includes an electrostatic chuck (1), and a fixed base (2), an elastic positioning ring block pad (3), and an elastic positioning ring block (4) arranged sequentially from bottom to top on the positioning worktable (5); several electrostatic chucks (1) are arranged at a certain interval on the positioning worktable (5); a fixed base (2) is provided on the outside of each electrostatic chuck (1). The lower end of the elastic positioning ring block (4) is provided with four evenly spaced abutment grooves (9); four abutment blocks (11) are slidably arranged in the four abutment grooves (9); the upper end surface of the elastic positioning ring block (4) is provided with four evenly spaced sliding grooves (10) corresponding to the positions of the four abutment grooves (9); the corresponding sliding grooves (10) and abutment grooves (9) are interconnected; the upper end surface of the elastic positioning ring block (4) is provided with limit grooves (42) on both sides of each sliding groove (10); the upper end of each abutment block (11) is sequentially fixed with a sliding block (11). 2) Positioning block (40); The sliding block (12) is slidably disposed in the sliding groove (10); The upper end of each sliding block (12) is fixedly provided with a first adsorption plate; The lower end of the two side limiting grooves (42) is embedded and fixedly provided with a second adsorption plate; The upper surface of the first adsorption plate and the upper surface of the second adsorption plate are flush with each other; The flush upper surfaces of the two adsorption plates are jointly adsorbed with an adsorption element; The top end of the positioning block (40) extends out of the upper end of the elastic positioning ring block (4) to form an extension; The lower end of the elastic positioning ring block pad (3) is provided with a receiving groove (18) for the extension to slide. Several wafers (41) are placed on several electrostatic chucks (1); four abutment blocks (11) slide inward to make tangential contact with the wafers (41); the electrostatic chucks (1) generate an adsorption force on the wafers (41); A central connecting block (7) is provided between the fixed chassis (2) of several semiconductor positioning components; a side connecting block (8) is provided on the outer side of the fixed chassis (2) near the drive device. The inner and outer ends of the four abutting grooves (9) are all connected to the outside; the longitudinal section of the abutting grooves (9) is T-shaped; Each of the fixed base plates (2) has an annular base plate groove at its upper end; the elastic positioning ring block (3) is fitted into the annular base plate groove, and the top end of the elastic positioning ring block (3) extends out of the annular base plate groove. The height of the inner bottom wall of the limiting groove (42) is higher than the height of the inner top wall of the abutting groove (9); the length of the sliding block (12) is less than the length of the sliding groove (10); the length of the positioning block (40) is less than the length of the accommodating groove (18); The first adsorption plate is a first glass plate (39); the second adsorption plate is a second glass plate (13); The suction device is a suction cup (16); the suction cup (16) is composed of an elastic disc (161) and a connecting rod (33) located at the middle of the upper end of the elastic disc (161); a longitudinal through-hole is opened in the middle of the connecting rod (33); a sealing rod (162) is interference-fitted into the center hole. The upper ends of the limiting grooves (42) on both sides are respectively fixed with elastic blocks (17); the distance between the elastic blocks (17) on both sides is the width of the positioning block (40); the suction cup (16) is located in the space between the limiting groove (42) and the second suction plate.

2. The positioning device for semiconductor processing according to claim 1, characterized in that, The lower end of the elastic positioning ring block (4) is provided with a second abutment groove (19) located between two adjacent abutment grooves (9); the inner and outer ends of the second abutment groove (19) are interconnected with the outside; a second abutment block (20) is slidably provided in the second abutment groove (19); a second sliding groove (21) is provided on the upper end surface of the elastic positioning ring block (4) corresponding to the position of the second abutment groove (19); the second sliding groove (21) and the second abutment groove (19) are interconnected; a second limiting groove (23) is provided on both sides of the upper end surface of the elastic positioning ring block (4) located at the second sliding groove (21); the inner bottom wall of the second limiting groove (23) is higher than the second abutment groove (19). The height of the inner top wall; the upper end of the second abutment block (20) is sequentially fixed with a second sliding block (24) and a second positioning block (25); the second sliding block (24) is slidably disposed in the second sliding groove (21); the upper end of the second sliding block (24) is fixed with a third glass plate (14); the lower end of the limiting groove (42) is fixed with a fourth glass plate (15); the upper surface of the third glass plate (14) and the upper surface of the fourth glass plate (15) are flush with each other; the flush upper surfaces of the two adsorption plates are jointly adsorbed with a suction cup (16); the lower end of the fixed base (2) is provided with a second sliding groove for the extension of the second positioning block (25) to slide; the length of the extension of the second positioning block (25) is less than the length of the second sliding groove.

3. The positioning device for semiconductor processing according to claim 2, characterized in that, The outer end face of the second abutment block (20) is provided with a notch positioning groove; the middle groove part of the notch positioning groove is connected to the outside, and the outer end face of the two side groove parts is not connected to the outside; the middle part of the notch positioning block (26) is slidably disposed in the middle groove of the notch positioning groove, and the two sides are slidably disposed in the two side groove parts of the notch positioning groove respectively.

4. The positioning device for semiconductor processing according to claim 1, characterized in that, The driving device is mounted on the driving worktable (6); the driving device includes a front-to-back motion driving mechanism and a left-to-right motion driving mechanism; The forward and backward motion drive mechanism includes a first drive motor (28), a longitudinal screw (29), a longitudinal slide rail (30), and a U-shaped sliding block (31); the first motor is mounted on the drive worktable (6); the motor shaft of the first motor is connected to the longitudinal screw (29); the motor shaft of the first motor passes through the motor shaft limiting plate, and the motor shaft limiting plate is fixedly mounted on the drive worktable (6); the drive worktable (6) is provided with a longitudinal slide rail (30); the longitudinal screw (29) is externally threaded with a U-shaped sliding block (31); the U-shaped sliding block (31) is slidably mounted on the longitudinal slide rail (30); A cylinder (32) is provided at the upper end of the U-shaped sliding block (31) on the longitudinal screw (29); a connecting rod (33) is provided at the upper end of the piston rod of the cylinder (32); the connecting rod (33) is connected to a connecting plate (34); the connecting plate (34) is connected to several side connecting parts; The left and right motion drive mechanism includes a second drive motor (35), a transverse screw (36), a transverse slide rail (37), and a U-shaped sliding block (31); the second drive motor (35) is mounted on the drive worktable (6); the motor shaft of the second drive motor (35) is connected to the transverse screw (36); the motor shaft of the second drive motor (35) passes through the motor shaft limiting plate, and the motor shaft limiting plate is fixedly mounted on the drive worktable (6); the transverse screw (36) is externally threaded with a U-shaped sliding block (31); the U-shaped sliding block (31) is slidably mounted on the transverse slide rail (37).

5. The positioning device for semiconductor processing according to claim 4, characterized in that, The upper surface of the drive worktable (6) is provided with two limiting slide bars (38) in the horizontal direction; the longitudinal slide (30) is provided with two limiting grooves (42) in the horizontal direction corresponding to the positions of the two limiting slide bars (38); the two limiting slide bars (38) are respectively matched and pass through the two limiting grooves (42).

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