Method and device for automatically cleaning a probe pin of a die bonder, computer device and storage medium

Abstract

The application provides a die bonder needle automatic cleaning method and device, computer equipment and storage medium, relates to the die bonder technical field, to improve the problem that the cleaning of die bonder needle leads to the reduction of die bonder working efficiency.The die bonder needle automatic cleaning method comprises the following steps: in response to a needle cleaning instruction, driving the needle to move towards the blue film and pierce the blue film to form a cleaning hole in the blue film; the needle is controlled to alternately perform a first motion and a second motion, the first motion is moving in the direction towards the cleaning hole, the needle tip penetrates out of the cleaning hole, and the length of the needle tip penetrating out of the cleaning hole is gradually increased, and the second motion is moving in the direction of exiting the cleaning hole.The application can control the reciprocating motion of the needle towards the cleaning hole and away from the cleaning hole, use the edge of the cleaning hole, pull the cleaning object attached to the needle tip to the needle tail of the needle, thereby completing the cleaning of the needle tip, and effectively reducing the influence of needle cleaning on the working efficiency of the die bonder.

Description

Technical Field

[0001] This application relates to the field of die bonder technology, and in particular to an automatic cleaning method, apparatus, computer equipment and storage medium for die bonder pins. Background Technology

[0002] In current die bonders, during the sorting process, the ejector pins need to continuously pierce through the blue film to eject the chip, allowing the pick-up nozzle to remove it. During this piercing process, the adhesive nature of the blue film easily attracts fine debris, which adheres to the ejector pin tip. Excessive debris buildup can prevent the pin from piercing the film properly, or it may pierce the film but hinder chip lifting, thus affecting the sorting accuracy of the equipment. Therefore, regular cleaning of the die bonder's ejector pins is necessary.

[0003] However, the cleaning of the ejector pins in existing die bonders generally relies on manual experience to determine the cleaning time, and then the pin tips are cleaned using cotton swabs or soft brushes. This method requires pausing the die bonder, removing the blue film from the platform, and then using cleaning tools such as brushes to clean the pin tips. During this cleaning period, the die bonder cannot work normally, resulting in a decrease in the die bonder's uptime. Summary of the Invention

[0004] In view of this, this application provides an automatic cleaning method, apparatus, computer equipment, and storage medium for die bonder pins to improve the problem of reduced die bonder efficiency caused by cleaning the die bonder pins.

[0005] The technical solution adopted in this application to solve the above-mentioned technical problems is as follows:

[0006] In a first aspect, embodiments of this application provide an automatic cleaning method for die bonder pins, including:

[0007] In response to the ejector cleaning command, the ejector is driven to move toward the blue film and pierce the blue film to form a cleaning hole in the blue film;

[0008] The ejector pin is controlled to alternately perform a first movement and a second movement. The first movement is to move in the direction toward the cleaning hole, so that the needle tip passes through the cleaning hole, and the length of the needle tip passing through the cleaning hole is gradually increased. The second movement is to move in the direction of exiting the cleaning hole.

[0009] In some embodiments of this application, the amount of movement of the ejector pin in performing the first movement increases with the number of times the first movement and the second movement are alternately performed.

[0010] In some embodiments of this application, the amount of movement by which the ejector pin performs the second movement is not less than the amount of movement by which the ejector pin performs the first movement.

[0011] In some embodiments of this application, the amount of movement of the ejector pin in performing the second movement is greater than the amount of movement of the ejector pin in performing the first movement, so that the tip of the ejector pin exits the cleaning hole.

[0012] In some embodiments of this application, the amount of movement by which the ejector pin performs the second movement is less than the amount of movement by which the ejector pin performs the first movement.

[0013] In some embodiments of this application, the step of driving the ejector pin toward the blue film and piercing the blue film in response to the ejector pin cleaning command, so as to form a cleaning hole in the blue film, includes:

[0014] In response to the cleaning command of the ejector pin, the adsorption vacuum component is driven to move toward the blue film and adsorb the blue film, so that the adsorbed area of ​​the blue film is in a taut state, and the ejector pin is sleeved inside the adsorption vacuum component;

[0015] When the adsorbed area of ​​the blue film is in a taut state, the push pin is driven to extend out of the adsorption vacuum element and move toward the adsorbed area, piercing the adsorbed area.

[0016] In some embodiments of this application, prior to the step of driving the ejector pin toward the blue film and piercing the blue film in response to the ejector pin cleaning command, so that the blue film forms a cleaning hole, the method further includes:

[0017] Obtain the preset working time of the ejector pin;

[0018] When the cumulative working time of the ejector pin is determined to be greater than or equal to the preset working time, an ejector pin cleaning command is output and the cumulative working time is cleared.

[0019] Secondly, embodiments of this application provide an automatic cleaning device for die bonder ejector pins, comprising:

[0020] The drive module is used to respond to the ejector cleaning command, drive the ejector to move toward the blue film and pierce the blue film so that the blue film forms a cleaning hole;

[0021] The control module is used to control the ejector pin to alternately perform a first movement and a second movement. The first movement is to move in the direction toward the cleaning hole, so that the needle tip passes through the cleaning hole, and the length of the needle tip passing through the cleaning hole is gradually increased. The second movement is to move in the direction of exiting the cleaning hole.

[0022] Thirdly, embodiments of this application provide a computer device, including: a processor, a storage medium, and a bus, wherein the storage medium stores program instructions executable by the processor, and when the computer device is running, the processor communicates with the storage medium via the bus, and the processor executes the program instructions to perform the steps of the method described in the first aspect.

[0023] Fourthly, embodiments of this application provide a computer-readable storage medium storing a computer program that, when executed by a processor, performs the steps of the method described in the first aspect.

[0024] In summary, due to the adoption of the above technical solution, this application includes at least the following beneficial effects:

[0025] This application provides an automatic cleaning method, apparatus, computer device, and storage medium for die bonder pins. The method primarily involves controlling the pin to reciprocate towards and away from a cleaning hole. The edge of the cleaning hole, i.e., the blue film itself, pulls the object to be cleaned, attached to the pin tip, to the end of the pin, i.e., the end away from the tip, thus cleaning the pin tip. Specifically, firstly, in response to a pin cleaning command, the pin is driven to pierce the blue film, forming a cleaning hole. Then, the pin is controlled to move towards the cleaning hole. When the pin passes through the cleaning hole and moves to a certain position, it moves away from the cleaning hole. When the pin moves away from the cleaning hole to a certain position, it moves towards the cleaning hole again, repeating this process to clean the pin tip. As the ejector pin passes through the cleaning hole, the material to be cleaned at the pin tip is acted upon by the edge of the cleaning hole. Relative movement occurs between the pin tip and the edge of the cleaning hole. This relative movement pushes the material from the pin tip to the pin tail. During this movement, some of the material may detach directly from the pin, thus cleaning the pin tip. Throughout the cleaning process, the blue film does not need to be removed from the machine; instead, it is used to clean the pin. The die bonder continues operating without interruption, minimizing the impact on the die bonder's uptime while simultaneously cleaning the pin. Furthermore, the entire pin cleaning process requires no additional cleaning equipment or movement; the cleaning of the pin tip is achieved solely through the movement of the pin itself and the drive mechanism, resulting in cost savings and simplified control. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings of the embodiments will be briefly described below. Obviously, the drawings described below only relate to some embodiments of this application and are not intended to limit this application, wherein:

[0027] Figure 1This is a schematic diagram illustrating an application scenario of the automatic cleaning device for die bonder pins provided in this application embodiment;

[0028] Figure 2 This is a schematic flowchart of the automatic cleaning method for die bonder pins provided in the embodiments of this application;

[0029] Figure 3 This is a schematic diagram of the structure of the automatic cleaning device for die bonder pins provided in the embodiments of this application;

[0030] Figure 4 This is a schematic diagram of the structure of the computer device provided in the embodiments of this application.

[0031] Explanation of reference numerals in the attached figures:

[0032] 100. Drive module; 200. Control module. Detailed Implementation

[0033] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0034] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or specifying the number of technical features indicated. Therefore, features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0035] In this application, the term "exemplary" is used to mean "serving as an example, illustration, or description." Any embodiment described as "exemplary" in this application is not necessarily to be construed as being more preferred or advantageous than other embodiments. The following description is provided to enable any person skilled in the art to make and use this application. Details are set forth in the following description for purposes of explanation. It should be understood that those skilled in the art will recognize that this application can be made without using these specific details. In other instances, known structures and processes are not described in detail to avoid obscuring the description of this application with unnecessary detail. Therefore, this application is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles disclosed in this application.

[0036] This application provides an automatic cleaning method, apparatus, computer equipment, and storage medium for die bonder pins. Please refer to [link / reference]. Figure 1 , Figure 1 This diagram illustrates an application scenario of the automatic cleaning device for die bonder pins provided in this application. The device may include a terminal and a server. The automatic cleaning method for die bonder pins provided in this application can be implemented via a terminal or a server.

[0037] like Figure 1 As shown, the terminal and server are connected via a network, such as a wired or wireless network. The terminal can include, but is not limited to, portable devices such as mobile phones and tablets with various network platform applications installed, as well as fixed terminals such as computers, kiosks, and advertising machines. The server provides users with various business services, including service push servers and user recommendation servers.

[0038] It should be noted that, Figure 1 The schematic diagram of the application scenario of the automatic cleaning device for die bonder pins shown is merely an example. The terminals, servers, and application scenarios described in this application embodiment are for the purpose of more clearly illustrating the technical solutions of this application embodiment and do not constitute a limitation on the technical solutions provided in this application embodiment. As those skilled in the art will know, with the evolution of the system and the emergence of new business scenarios, the technical solutions provided in this application embodiment are also applicable to similar technical problems.

[0039] The terminal can be used for:

[0040] In response to the ejector cleaning command, the ejector is driven to move toward the blue film and pierce the blue film to form a cleaning hole in the blue film;

[0041] The ejector pin is controlled to alternately perform a first movement and a second movement. The first movement is to move in the direction toward the cleaning hole, so that the needle tip passes through the cleaning hole, and the length of the needle tip passing through the cleaning hole is gradually increased. The second movement is to move in the direction of exiting the cleaning hole.

[0042] It should be noted that the steps of the above-mentioned terminal executing the area denial method for low-speed drones can also be executed by the server.

[0043] Figure 2 This application provides a schematic flowchart of an automatic cleaning method for die bonder pins according to an embodiment of the present application. Figure 2 As shown, an automatic cleaning method for die bonder pins includes the following steps:

[0044] S1. In response to the ejector cleaning command, drive the ejector to move toward the blue film and pierce the blue film so that the blue film forms a cleaning hole;

[0045] S2. Control the ejector pin to alternately perform the first movement and the second movement. The first movement is to move in the direction toward the cleaning hole, so that the needle tip passes through the cleaning hole, and gradually increase the length of the needle tip passing through the cleaning hole. The second movement is to move in the direction of exiting the cleaning hole.

[0046] The technical solution provided in this application mainly involves controlling the ejector pin to reciprocate towards and away from the cleaning hole. Utilizing the edge of the cleaning hole, i.e., the blue membrane itself, the object to be cleaned attached to the ejector pin tip is pulled to the end of the ejector pin, i.e., the end away from the tip, thus completing the cleaning of the ejector pin tip. Specifically, firstly, in response to the ejector pin cleaning command, the ejector pin is driven to pierce the blue membrane, forming a cleaning hole. Then, the ejector pin is controlled to move towards the cleaning hole. When the ejector pin passes through the cleaning hole and moves to a certain position, it moves away from the cleaning hole. When the ejector pin moves away from the cleaning hole to a certain position, it moves towards the cleaning hole again, repeating this process to achieve the cleaning of the ejector pin tip. As the ejector pin passes through the cleaning hole, the material to be cleaned at the pin tip is acted upon by the edge of the cleaning hole. Relative movement occurs between the pin tip and the edge of the cleaning hole. This relative movement pushes the material from the pin tip to the pin tail. During this movement, some of the material may detach directly from the pin, thus cleaning the pin tip. Throughout the cleaning process, the blue film does not need to be removed from the machine; instead, it is used to clean the pin. The die bonder continues operating without interruption, minimizing the impact on the die bonder's uptime while simultaneously cleaning the pin. Furthermore, the entire pin cleaning process requires no additional cleaning equipment or movement; the cleaning of the pin tip is achieved solely through the movement of the pin itself and the drive mechanism, resulting in cost savings and simplified control.

[0047] Furthermore, because the entire cleaning process of the thimble does not require manual intervention and achieves automated cleaning, it can effectively reduce the labor intensity of workers and reduce the risk to their personal safety, such as the risk of injury when wiping the thimble tip. It can also effectively prevent the thimble from being damaged due to manual wiping of the thimble tip.

[0048] It should be noted that the blue film is kept taut by a tensioning structure on the die bonder, so that the ejector pins can pierce the blue film, allowing the chip to be lifted by the ejector pins and completing the chip sorting process. Furthermore, multiple chips and multiple ejector pins are positioned corresponding to each blue film.

[0049] In some embodiments, the tip of the ejector pin is conical, and the radius of the ejector pin gradually increases from the tip to the tail. The conical tip enhances its sharpness, making it easier to pierce the blue membrane. Furthermore, the conical tip allows the cleaning hole's radius to gradually increase with the first movement of the ejector pin. Because the blue membrane in the pierced area has tension, the edge of the cleaning hole can adhere tightly to the outer surface of the tip, thereby squeezing the object to be cleaned from the tip to the tail end, improving the cleaning effect. Since the tip is conical, by controlling the ejector pin to gradually increase the length of the tip extending through the cleaning hole, it is possible to avoid a situation where the size of the cleaning hole is larger than the size of the tip after the first movement of the ejector pin, preventing the edge of the cleaning hole from contacting the object to be cleaned at the tip.

[0050] In some embodiments, the amount of movement of the ejector pin in performing the first movement increases with the number of times the first and second movements are alternately performed; that is, as the number of times the ejector pin reciprocates alternately increases, the amount of movement of the ejector pin in performing the first movement gradually increases. The first movement performed by the ejector pin is a movement toward the cleaning hole. During the movement of the ejector pin, the cleaning hole undergoes relative movement along the axial direction of the ejector pin. The edge of the cleaning hole then squeezes the object to be cleaned on the ejector pin in the opposite direction to the first movement of the ejector pin, thereby squeezing the object to be cleaned at the tip of the ejector pin to the tail of the ejector pin, achieving the purpose of cleaning the tip of the ejector pin. Since the tip of the ejector pin is conical, in order to avoid the situation where the ejector pin moves too much during the first movement, resulting in the cleaning hole being too large and the edge of the cleaning hole not being able to contact the object to be cleaned at the tip, this embodiment controls the amount of movement of the ejector pin in performing the first movement to increase with the number of times the first and second movements are alternately performed. This ensures that the size of the cleaning hole gradually expands with the degree of cleaning of the tip, and to a large extent ensures that the cleaning hole can push the object to be cleaned remaining at the tip of the ejector pin during each alternating movement.

[0051] Furthermore, the amount of movement of the ejector pin in the second movement is not less than the amount of movement of the ejector pin in the first movement; that is, the amount of movement of the second movement is equal to or greater than the amount of movement of the first movement. It should be noted that the amount of movement in the first movement refers to the movement of the needle tip from the moment the ejector pin tip enters the cleaning hole until the ejector pin stops its first movement.

[0052] When the amount of movement of the second movement is equal to the amount of movement of the first movement, it means that when the second movement ends, the end of the needle tip away from the needle tail is located in the cleaning hole. This ensures that the needle tip can achieve the cleaning effect while minimizing the amount of movement of the second movement of the needle, thus saving energy and improving cleaning efficiency.

[0053] When the movement of the second movement is greater than that of the first movement, it means that when the second movement ends, the tip of the ejector pin exits the cleaning hole. That is, the end of the tip away from the tail of the pin is located outside the cleaning hole and is positioned opposite to the cleaning hole. This allows the cleaning hole to completely pass over the tip as the second movement of the ejector pin moves. As a result, some of the material to be cleaned that may have been brought to the tip by the edge of the cleaning hole due to the second movement of the ejector pin is squeezed by the edge of the cleaning hole and falls off the tip. This ensures that the tip is not contaminated by the second movement of the ejector pin as much as possible.

[0054] In some embodiments, the amount of movement of the ejector pin in performing the second movement is less than the amount of movement of the ejector pin in performing the first movement. In this embodiment, making the amount of movement of the second movement less than the amount of movement of the first movement helps to shorten the movement of the ejector pin, thereby improving cleaning efficiency.

[0055] In some embodiments, the step of driving the ejector pin toward the blue membrane and piercing the blue membrane according to the ejector pin cleaning frequency includes:

[0056] In response to the cleaning command of the ejector pin, the adsorption vacuum component is driven to move toward the blue film and adsorb the blue film, so that the adsorbed area of ​​the blue film is in a taut state, and the ejector pin is sleeved inside the adsorption vacuum component;

[0057] When the adsorbed area of ​​the blue film is in a taut state, the push pin is driven to extend out of the adsorption vacuum element and move toward the adsorbed area, piercing the adsorbed area.

[0058] By fitting the ejector pin inside the vacuum adsorption component, the ejector pin can extend from the vacuum adsorption component during vacuum adsorption to pierce the film, saving space. By utilizing the vacuum adsorption component to adsorb the blue film, the area of ​​the blue film in the area pierced by the ejector pin remains taut, facilitating piercing. Due to the vacuum adsorption component, even if the tension of the blue film gradually loosens over time, the area pierced by the ejector pin remains taut, unaffected by the overall tension of the blue film. Furthermore, each vacuum adsorption component corresponds to one ejector pin; that is, multiple vacuum adsorption components and multiple ejector pins are installed on the blue film. When each ejector pin pierces the blue film in its corresponding area, the impact on the piercing of the blue film between adjacent ejector pins is minimal, causing no interference.

[0059] In some embodiments, prior to the step of driving the ejector pin toward the blue film and piercing the blue film in response to a ejector pin cleaning command, so that the blue film forms a cleaning hole, the method further includes:

[0060] Obtain the preset working time of the ejector pin;

[0061] When the cumulative working time of the ejector pin is determined to be greater than or equal to the preset working time, an ejector pin cleaning command is output and the cumulative working time is cleared.

[0062] By presetting the working time of the ejector pin, it is possible to effectively avoid the situation where too much material to be cleaned adheres to the ejector pin due to missing the cleaning time, making it impossible to puncture the blue film.

[0063] In some embodiments, the cleaning frequency of the ejector pin is positively correlated with the frequency of the ejector pin piercing the blue membrane during operation. That is, the higher the frequency of the ejector pin piercing the blue membrane, the more frequently it needs to be cleaned. This is because a higher frequency of piercing the blue membrane means that the ejector pin pierces the blue membrane more times within the same time period, increasing the probability and amount of adhesive residue on the ejector pin tip. Consequently, the ejector pin will be less likely to pierce the blue membrane quickly. Therefore, the cleaning frequency of the ejector pin needs to increase with the frequency of piercing the blue membrane to ensure that the ejector pin can complete cleaning when piercing the blue membrane. In this embodiment, the cleaning frequency of the ejector pin is specifically once per hour. In other embodiments, the cleaning frequency can also be once every two hours, once every three hours, etc., without limitation.

[0064] In some embodiments, multiple ejector pins are provided, and all ejector pins have the same cleaning frequency, facilitating unified management and control of the cleaning frequency of multiple ejector pins. Furthermore, the times at which the multiple ejector pins begin cleaning are staggered. For example, the times at which the multiple ejector pins begin piercing the blue membrane during the working phase can be arranged in a stepped manner. That is, each ejector pin has the same cleaning frequency, but the starting time for cleaning each ejector pin is different. For instance, ejector pins A and B are both cleaned once per hour, but the cleaning time interval for ejector pin A starts from a first moment, while the cleaning time interval for ejector pin B starts from a second moment. The first moment is earlier than the second moment. In this case, because both ejector pins A and B have a cleaning frequency of once per hour, ejector pin A will enter the cleaning cycle first, followed by ejector pin B, and so on, thereby achieving a stepped cleaning effect for the multiple ejector pins. By setting the cleaning of multiple ejector pins to a stepped cleaning method, it is beneficial to clean multiple ejector pins at intervals, so that ejector pins that have not entered the cleaning process can still complete the chip ejection and achieve the chip sorting function. This ensures that the die bonder can still ensure the normal operation of the chip sorting process while cleaning the ejector pins, thereby improving the uptime of the die bonder.

[0065] It should be noted that the movement of the ejector pin in any of the above embodiments, that is, the speed at which the ejector pin performs the first movement and the speed at which it performs the second movement, are both uniform. This is beneficial for controlling the shape of the cleaning hole formed by the blue membrane being pierced by the ejector pin, and avoids changes in the size of the cleaning hole or even tearing of the blue membrane due to the different speeds of the ejector pin's movement.

[0066] To implement the above-described method embodiments, this application also provides an automatic cleaning device for die bonder pins. Figure 3 This illustration shows a structural schematic diagram of an automatic cleaning device for die bonder pins provided in an embodiment of this application. The device includes:

[0067] The drive module 100 is used to respond to the ejector cleaning command, drive the ejector to move toward the blue film and pierce the blue film so that the blue film forms a cleaning hole;

[0068] The control module 200 is used to control the ejector pin to alternately perform a first movement and a second movement. The first movement is to move in the direction toward the cleaning hole, so that the needle tip passes through the cleaning hole and the length of the needle tip passing through the cleaning hole is gradually increased. The second movement is to move in the direction of exiting the cleaning hole.

[0069] The technical solution provided in this application mainly achieves automated cleaning of the ejector pin by utilizing the cooperation between the drive module 100 and the control module 200. Specifically, the control module 200 controls the ejector pin to reciprocate towards and away from the cleaning hole. Using the edge of the cleaning hole, i.e., the blue membrane itself, the object to be cleaned attached to the ejector pin tip is pulled to the end of the ejector pin, i.e., the end away from the tip, thus completing the cleaning of the ejector pin tip. More specifically, firstly, the drive module 100 drives the ejector pin to pierce the blue membrane, forming a cleaning hole; then, the control module 200 controls the ejector pin to move towards the cleaning hole. When the ejector pin passes through the cleaning hole and moves to a certain position, it moves away from the cleaning hole. When the ejector pin moves away from the cleaning hole to a certain position, it moves towards the cleaning hole again, repeating this process to achieve cleaning of the ejector pin tip. As the ejector pin passes through the cleaning hole, the material to be cleaned at the pin tip is acted upon by the edge of the cleaning hole. Relative movement occurs between the pin tip and the edge of the cleaning hole. This relative movement pushes the material from the pin tip to the pin tail. During this movement, some of the material may detach directly from the pin, thus cleaning the pin tip. Throughout the cleaning process, the blue film does not need to be removed from the machine; instead, it is used to clean the pin. The die bonder continues operating without interruption, minimizing the impact on the die bonder's uptime while simultaneously cleaning the pin. Furthermore, the entire pin cleaning process requires no additional cleaning equipment or movement; the cleaning of the pin tip is achieved solely through the movement of the pin itself and the drive mechanism, resulting in cost savings and simplified control.

[0070] It should be noted that the actuator of the drive module 100 can specifically be a motor with forward and reverse rotation functions. Through the cooperation of the motor and gears, the rotary motion is converted into linear motion, and the forward and reverse rotation of the motor corresponds to the first and second movements of the ejector pin, respectively. The actuator of the drive module 100 can also be a telescopic device. By controlling the extension and retraction of the telescopic device, the first and second movements of the ejector pin are realized.

[0071] In some embodiments, a computer device is provided, which may be a server, and its internal structure diagram may be as follows: Figure 4 As shown, the computer device includes a processor, memory, and a network interface connected via a system bus. The processor provides computing and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system, computer programs, and a database. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The database stores relevant data from the image acquisition device. The network interface communicates with external terminals via a network connection. When executed by the processor, the computer program implements an automatic cleaning method for die bonder pins.

[0072] In some embodiments, a computer device is provided, which may be a terminal, and its internal structure diagram may be as follows: Figure 4 As shown. The computer device includes a processor, memory, communication interface, display screen, and input system connected via a system bus. The processor provides computing and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The communication interface is used for wired or wireless communication with external terminals; wireless communication can be achieved through Wi-Fi, carrier networks, NFC (Near Field Communication), or other technologies. When executed by the processor, the computer program implements an area denial method and system for low-speed unmanned aerial vehicles (UAVs). The display screen can be an LCD screen or an e-ink screen. The input system can be a touch layer covering the display screen, buttons, a trackball, or a touchpad on the computer device's casing, or an external keyboard, touchpad, or mouse.

[0073] Those skilled in the art will understand that Figure 4The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0074] In some embodiments, a computer device is also provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps in the above method embodiments.

[0075] In some embodiments, a computer-readable storage medium is provided storing a computer program that, when executed by a processor, implements the steps in the above method embodiments.

[0076] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the methods described above. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, or optical storage, etc. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc.

[0077] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0078] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0079] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the present application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

[0080] For each patent, patent application, patent application publication, and other material such as articles, books, specifications, publications, and documents referenced in this application, the entire contents of that patent application are incorporated herein by reference, except for historical application documents that are inconsistent with or conflict with the content of this application, and documents that limit the broadest scope of the claims of this application (currently or subsequently appended to this application). It should be noted that if there are any inconsistencies or conflicts between the descriptions, definitions, and / or terminology used in the supplementary materials of this application and the content of this application, the descriptions, definitions, and / or terminology used in this application shall prevail.

Claims

1. An automatic cleaning method for die bonder ejector pins, characterized in that, include: In response to the ejector cleaning command, the ejector is driven to move toward the blue film and pierce the blue film to form a cleaning hole in the blue film; The ejector pin is controlled to alternately perform a first movement and a second movement. The first movement is to move in the direction toward the cleaning hole, so that the needle tip passes through the cleaning hole, and the length of the needle tip passing through the cleaning hole is gradually increased. The second movement is to move in the direction of exiting the cleaning hole. The step of driving the ejector pin toward the blue film and piercing the blue film in response to the ejector pin cleaning command, so as to form a cleaning hole in the blue film, includes: In response to the cleaning command of the ejector pin, the adsorption vacuum component is driven to move toward the blue film and adsorb the blue film, so that the adsorbed area of ​​the blue film is in a taut state, and the ejector pin is sleeved inside the adsorption vacuum component; When the adsorbed area of ​​the blue film is in a taut state, the push pin is driven to extend out of the adsorption vacuum element and move toward the adsorbed area, piercing the adsorbed area.

2. The automatic cleaning method for die bonder pins as described in claim 1, characterized in that, The amount of movement of the ejector pin in performing the first movement increases as the number of times the first and second movements are alternately performed increases.

3. The automatic cleaning method for die bonder pins as described in claim 2, characterized in that, The amount of movement by which the ejector pin performs the second movement is not less than the amount of movement by which the ejector pin performs the first movement.

4. The automatic cleaning method for die bonder pins as described in claim 3, characterized in that, The amount of movement of the ejector pin in performing the second movement is greater than the amount of movement of the ejector pin in performing the first movement, so that the tip of the ejector pin exits the cleaning hole.

5. The automatic cleaning method for die bonder pins as described in claim 2, characterized in that, The amount of movement by which the ejector pin performs the second movement is less than the amount of movement by which the ejector pin performs the first movement.

6. The automatic cleaning method for die bonder pins as described in claim 1, characterized in that, Prior to the step of driving the ejector pin toward the blue film and piercing the blue film in response to the ejector pin cleaning command, so as to form a cleaning hole in the blue film, the method further includes: Obtain the preset working time of the ejector pin; When the cumulative working time of the ejector pin is determined to be greater than or equal to the preset working time, an ejector pin cleaning command is output and the cumulative working time is cleared.

7. An automatic cleaning device for die bonder pins, performing the steps of the method as described in any one of claims 1 to 6, characterized in that, include: The drive module is used to respond to the ejector cleaning command, drive the ejector to move toward the blue film and pierce the blue film so that the blue film forms a cleaning hole; The control module is used to control the ejector pin to alternately perform a first movement and a second movement. The first movement is to move in the direction toward the cleaning hole, so that the needle tip passes through the cleaning hole, and the length of the needle tip passing through the cleaning hole is gradually increased. The second movement is to move in the direction of exiting the cleaning hole. The tensioning structure is used to maintain the tension of the blue film so that the ejector pin can pierce the blue film, thereby lifting the chip and completing the chip sorting process; multiple chips and multiple ejector pins are correspondingly arranged at the relative positions of each blue film.

8. A computer device, characterized in that, include: The computer device includes a processor, a storage medium, and a bus, wherein the storage medium stores program instructions executable by the processor, and when the computer device is running, the processor communicates with the storage medium via the bus, and the processor executes the program instructions to perform the steps of the method as described in any one of claims 1 to 6.

9. A computer-readable storage medium, characterized in that, The storage medium stores a computer program, which, when executed by a processor, performs the steps of the method as described in any one of claims 1 to 6.

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